SUM70N04-07L
Vishay Siliconix
N-Channel 40-V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
40
rDS(on) (Ω)
ID (A)
0.0074 at VGS = 10 V
70a
0.011 at VGS = 4.5 V
67
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
• Low Threshold
Available
RoHS*
COMPLIANT
APPLICATIONS
• Motor Control
D
TO-263
G
G
D S
S
Top View
N-Channel MOSFET
Ordering Information: SUM70N04-07L-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energyb
Maximum Power Dissipationb
L = 0.1 mH
TC = 25 °C
TA = 25 °C
d
Operating Junction and Storage Temperature Range
ID
Unit
V
70a
47
IDM
120
IAR
40
EAR
80
A
mJ
c
PD
100
3.75
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
PCB
Mountd
Junction-to-Case
RthJA
40
RthJC
1.4
°C/W
Notes:
a. Package limited.
b. Duty cycle ≤ 1 %.
c. See SOA curve for voltage derating.
d. When Mounted on 1" square PCB (FR-4 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72345
S-80274-Rev. B, 11-Feb-08
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1
SUM70N04-07L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VDS = 0 V, ID = 250 µA
40
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
100
VDS = 32 V, VGS = 0 V
1
VDS = 32 V, VGS = 0 V, TJ = 125 °C
50
VDS = 32 V, VGS = 0 V, TJ = 175 °C
250
VDS ≥ 5 V, VGS = 10 V
ID(on)
Drain-Source On-State Resistancea
3
rDS(on)
100
0.006
0.0074
VGS = 4.5 V, ID = 10 A
0.0085
0.011
VGS = 10 V, ID = 30 A, TJ = 125 °C
Forward Transconductance
gfs
VDS = 15 V, ID = 30 A
nA
µA
A
VGS = 10 V, ID = 30 A
0.012
VGS = 10 V, ID = 30 A, TJ = 175 °C
a
V
Ω
0.015
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
c
2800
VGS = 0 V, VDS = 25 V, f = 1 MHz
190
50
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
10
RG
2.0
Gate Resistance
Turn-On Delay Time
c
Rise Timec
Turn-Off Delay Timec
Fall Timec
VDS = 20 V, VGS = 10 V, ID = 50 A
td(on)
tr
td(off)
pF
320
VDD = 20 V, RL = 0.4 Ω
ID ≅ 50 A, VGEN = 10 V, RG = 2.5 Ω
tf
75
nC
10
Ω
11
20
20
30
40
60
15
25
ns
Source-Drain Diode Ratings and Characteristics TC = 25 °Cb
IS
66
Pulsed Current
ISM
100
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 50 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 50 A, di/dt = 100 A/µs
A
1.0
1.5
V
30
50
ns
1.6
2.4
A
0.024
0.06
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72345
S-80274-Rev. B, 11-Feb-08
SUM70N04-07L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
100
VGS = 10 thru 5 V
80
4V
I D - Drain Current (A)
I D - Drain Current (A)
80
60
40
20
60
40
TC = 125 °C
20
25 °C
3V
0
0
1
2
3
4
5
0
0.0
6
0.5
1.0
1.5
2.0
- 55 °C
2.5
3.0
3.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
150
4.0
4.5
0.016
TC = - 55 °C
25 °C
r DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
120
125 °C
90
60
VGS = 4.5 V
0.008
VGS = 10 V
0.004
30
0.000
0
0
10
20
30
40
50
0
60
20
40
60
80
I D - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
100
10
VGS - Gate-to-Source Voltage (V)
4000
3200
C - Capacitance (pF)
0.012
Ciss
2400
1600
800
Coss
Crss
0
0
VDS = 20 V
ID = 50 A
8
6
4
2
0
8
16
24
32
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 72345
S-80274-Rev. B, 11-Feb-08
40
0
10
20
30
40
50
Qg - Total Gate Charge (nC)
Gate Charge
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SUM70N04-07L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.0
100
VGS = 10 V
ID = 20 A
I S - Source Current (A)
(Normalized)
r DS(on) - On-Resistance
1.7
1.4
1.1
TJ = 150 °C
TJ = 25 °C
10
0.8
0.5
- 50
1
- 25
0
25
50
75
100
125
150
175
0.3
0
0.6
0.9
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.2
54
52
ID = 10 mA
V(BR)DSS (V)
50
48
46
44
42
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown
vs. Junction Temperature
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Document Number: 72345
S-80274-Rev. B, 11-Feb-08
SUM70N04-07L
Vishay Siliconix
THERMAL RATINGS
1000
100
80
I D - Drain Current (A)
I D - Drain Current (A)
100
60
Limited by Package
40
10 µs
100 µs
Limited
by rDS(on)*
10
10 ms
DC, 100 ms
1
20
0
0
25
50
75
100
125
150
TC = 25 °C
Single Pulse
0.1
0.1
175
TC - Case Temperature (°C)
1
* VGS
Maximum Avalanche and Drain Current
vs. Case Temperature
1 ms
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?72345.
Document Number: 72345
S-80274-Rev. B, 11-Feb-08
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Package Information
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Vishay Siliconix
TO-263 (D2PAK): 3-LEAD
-B-
L2
6
E1
K
D4
-A-
c2
D2
D3
A
E
L3
L
D
D1
E3
A
A
b2
b
e
c
Detail “A”
E2
0.010 M A M
2 PL
0°
L4
-5
°
INCHES
L1
DETAIL A (ROTATED 90°)
c*
c
c1
c1
M
b
b1
SECTION A-A
MIN.
MAX.
MIN.
MAX.
A
0.160
0.190
4.064
4.826
b
0.020
0.039
0.508
0.990
b1
0.020
0.035
0.508
0.889
1.397
b2
0.045
0.055
1.143
Thin lead
0.013
0.018
0.330
0.457
Thick lead
0.023
0.028
0.584
0.711
Thin lead
0.013
0.017
0.330
0.431
Thick lead
0.023
0.027
0.584
0.685
c2
0.045
0.055
1.143
1.397
D
0.340
0.380
8.636
9.652
D1
0.220
0.240
5.588
6.096
D2
0.038
0.042
0.965
1.067
D3
0.045
0.055
1.143
1.397
D4
0.044
0.052
1.118
1.321
E
0.380
0.410
9.652
10.414
E1
0.245
-
6.223
-
E2
0.355
0.375
9.017
9.525
E3
0.072
0.078
1.829
1.981
e
Notes
1. Plane B includes maximum features of heat sink tab and plastic.
2. No more than 25 % of L1 can fall above seating plane by
max. 8 mils.
3. Pin-to-pin coplanarity max. 4 mils.
4. *: Thin lead is for SUB, SYB.
Thick lead is for SUM, SYM, SQM.
5. Use inches as the primary measurement.
6. This feature is for thick lead.
Revison: 30-Sep-13
MILLIMETERS
DIM.
0.100 BSC
2.54 BSC
K
0.045
0.055
1.143
1.397
L
0.575
0.625
14.605
15.875
L1
0.090
0.110
2.286
2.794
L2
0.040
0.055
1.016
1.397
L3
0.050
0.070
1.270
1.778
L4
M
0.010 BSC
-
0.254 BSC
0.002
-
0.050
ECN: T13-0707-Rev. K, 30-Sep-13
DWG: 5843
1
Document Number: 71198
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AN826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
0.420
0.355
0.635
(16.129)
(9.017)
(10.668)
0.145
(3.683)
0.135
(3.429)
0.200
0.050
(5.080)
(1.257)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Document Number: 73397
11-Apr-05
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Legal Disclaimer Notice
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Disclaimer

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including but not limited to the warranty expressed therein.
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Revision: 13-Jun-16
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Document Number: 91000