Footprint naming convention as used
by the IPC-7351C and the PCB Library
Expert, the industry’s first footprint
and 3D model automation tool to
adopt this new guideline.
Library
Expert
Footprint
Naming
Convention
PCB Libraries, Inc.
April 7, 2015
© 2015 PCB Libraries, Inc.
Library Expert Naming Convention for Standard SMD Land Patterns
Note: The component manufacturer’s abbreviated name followed by a hyphen can be used as a prefix for the elimination of
duplicate footprint names. When the package tolerances deviate from one manufacturer to the next, the resulting footprint pad size
and courtyard will be different but the footprint name will be the same. So in order to discriminate between various manufacturer’s
package tolerances, we recommend that you use the component manufacturer’s abbreviated name followed by a hyphen as the
footprint name prefix. Example: TI-QFN50P350X350X100-19_15T205X205 = Texas Instruments QFN for the RHL Case code.
See Appendix I for at the end of this document for the full list of all component manufacturer name abbreviations.
Component, Category
Footprint Name
Ball Grid Array’s ................................................ BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment
BGA w/Dual Pitch .................... BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment
BGA w/Staggered Pins .....................................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment
BGA Note: The C or N = Collapsing or Non-collapsing Balls
Capacitors, Chip, Array, Concave .......................................................................... CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Capacitors, Chip, Array, Flat ................................................................................. CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Capacitors, Chip ...................................................................................................................................... CAPC + Body Length + Body Width X Height + Environment
Capacitors, Chip, Polarized ................................................................................................................... CAPPC + Body Length + Body Width X Height + Environment
Capacitors, Dual Flat No-lead ............................................................................................................ CAPDFN + Body Length + Body Width X Height + Environment
Capacitors, Dual Flat No-lead, Polarized .......................................................................................... CAPDFNP + Body Length + Body Width X Height + Environment
Capacitors, Molded, Non-polarized ....................................................................................................... CAPM + Body Length + Body Width X Height + Environment
Capacitors, Molded, Polarized ............................................................................................................. CAPPM + Body Length + Body Width X Height + Environment
Capacitors, Aluminum Electrolytic ..........................................................................................................................CAPAE + Base Body Size X Height + Environment
Ceramic Flat Packages .................................................................................................................... CFP127P + Lead Span Nominal X Height - Pin Qty + Environment
Column Grid Array, Circular Lead ............................... CGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment
Pillar Column Grid Array ........................................... PCGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment
Crystals (2 leads) .................................................................................................................................... XTAL + Body Length X Body Width X Height + Environment
Crystals, Dual Flat No-lead............................................................................................................... XTALDFN + Body Length X Body Width X Height + Environment
Crystals, Side Concave ........................................................................................................................ XTALSC + Body Length X Body Width X Height + Environment
Diodes, Chip ........................................................................................................................................... DIOC + Body Length + Body Width X Height + Environment
Diodes, Dual Flat No-lead ................................................................................................... DIODFN + Body Length X Body Width X Height – Pin Qty + Environment
Diodes, Molded ..................................................................................................................................... DIOM + Body Length + Body Width X Height + Environment
Diodes, Non-polarized Chip .................................................................................................................. DIONC + Body Length + Body Width X Height + Environment
Diodes, Non-polarized Molded ........................................................................................................... DIONM + Body Length + Body Width X Height + Environment
Diodes, MELF ............................................................................................................................................. DIOMELF + Body Length + Body Diameter + Environment
Diodes, Side Concave, 2 Pin .................................................................................................... DIOSC + Body Length X Body Width X Height - Pin Qty + Environment
Diodes, Side Concave, 4 Pin ...................................................................................... DIOSC+ Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Ferrite Bead, Chip ................................................................................................................................. BEADC + Body Length + Body Width X Height + Environment
Fuses, Chip ............................................................................................................................................. FUSC + Body Length + Body Width X Height + Environment
Fuses, Dual Flat No-Lead ....................................................................................................................FUSDFN + Body Length + Body Width X Height + Environment
Fuses, Molded ....................................................................................................................................... FUSM + Body Length + Body Width X Height + Environment
Fuses, Side Concave...............................................................................................................................FUSSC + Body Length + Body Width X Height + Environment
Inductors, Chip ....................................................................................................................................... INDC + Body Length + Body Width X Height + Environment
Inductors, Chip, Array, Concave ........................................................................... INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Inductors, Chip, Array, Flat .................................................................................... INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Inductors, Dual Flat No-lead ............................................................................................................... INDDFN + Body Length + Body Width X Height + Environment
Inductors, Molded ................................................................................................................................. INDM + Body Length + Body Width X Height + Environment
Inductors, Precision, Molded ............................................................................................................... INDPM + Body Length + Body Width X Height + Environment
Inductors, Side Concave ........................................................................................................................ INDSC + Body Length + Body Width X Height + Environment
Land Grid Array, Circular Lead .................................... LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment
Land Grid Array, Square Lead ......................................LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment
LED’s, Chip ...............................................................................................................................................LEDC + Body Length + Body Width X Height + Environment
LED’s, Dual Flat No-lead ..................................................................................................................... LEDDFN + Body Length + Body Width X Height + Environment
LED’s, Molded........................................................................................................................................ LEDM + Body Length + Body Width X Height + Environment
LED’s, Side Concave, 2 Pin ...................................................................................................... LEDSC + Body Length X Body Width X Height - Pin Qty + Environment
LED’s, Side Concave, 4 Pin ....................................................................................... LEDSC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, Dual Flat No-lead ............................................................................... OSCDFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, Side Concave ......................................................................................... OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, Side Flat ................................................................................................ OSCSF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, J-Lead ...................................................................................................... OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, L-Bend Lead ............................................................................................ OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Oscillators, Corner Concave.................................................................................................................. OSCCC + Body Length X Body Width X Height + Environment
Plastic Leaded Chip Carriers ..................................................................... PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment
Plastic Leaded Chip Carrier Sockets Square ............................................ PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment
Quad Flat Packages ................................................................................... QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment
Ceramic Quad Flat Packages.................................................................... CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment
Quad Flat No-lead .............................................................................. QFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment
Pull-back Quad Flat No-lead ............................................................. PQFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment
Quad Leadless Ceramic Chip Carriers .......................................................................... LCC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
© 2015 PCB Libraries, Inc.
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side) .................................................LCCS + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Resistors, Chip ......................................................................................................................................... RESC + Body Length + Body Width X Height + Environment
Resistors, Chip, Array, Concave .............................................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Resistors, Chip, Array, Convex, E-Version (Even Pin Size) .................................... RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Resistors, Chip, Array, Convex, S-Version (Side Pins Diff) .................................... RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Resistors, Chip, Array, Flat ..................................................................................... RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment
Resistors, Dual Flat No-lead ................................................................................................ RESDFN + Body Length X Body Width X Height – Pin Qty + Environment
Resistors, MELF ......................................................................................................................................... RESMELF + Body Length + Body Diameter + Environment
Resistors, Molded .................................................................................................................................. RESM + Body Length + Body Width X Height + Environment
Resistors, Side Concave ......................................................................................................................... RESSC + Body Length + Body Width X Height + Environment
Small Outline Diodes, Flat Lead ................................................................................................. SODFL + Lead Span Nominal + Body Width X Height + Environment
Small Outline IC, J-Leaded ....................................................................................................... SOJ + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
Small Outline IC, L-Leaded ....................................................................................................... SOL + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
Small Outline Integrated Circuit, (50 mil Pitch SOIC) .................................................................... SOIC127P + Lead Span Nominal X Height - Pin Qty + Environment
Small Outline Packages ............................................................................................................SOP + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
Small Outline No-lead......................................................................... SON + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment
Thermistors, Chip ................................................................................................................................THRMC + Body Length + Body Width X Height + Environment
Pull-back Small Outline No-lead ....................................................... PSON + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment
Small Outline Transistors, Flat Lead..................................................................................... SOTFL + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
SOD (Example: SOD3717X135 = JEDEC SOD123) .......................................................................... SOD + Lead Span Nominal + Body Width X Height + Environment
SOT143 & SOT343 (JEDEC Standard Package) ......................................................................... SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
SOT143 & SOT343 Reverse (JEDEC Standard Package) ...................................................... SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + R + Environment
SOT23 & SOT223 Packages (Example: SOT230P700X180-4) ................................................... SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + Environment
TO (Generic DPAK - Example: TO228P970X238-3) .................................................................................. TO + Pitch P + Lead Span X Height - Pin Qty + Environment
Transistors, Dual Flat No-lead............................................................................................. TRXDFN + Body Length X Body Width X Height – Pin Qty + Environment
Varistors, Chip ........................................................................................................................................ VARC + Body Length + Body Width X Height + Environment
Land Pattern Naming Convention Notes
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All dimensions are in Metric Units
All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros
All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros
All Chip Component Body Sizes are one place to each side of the decimal point
Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
Naming Convention Special Character Use for Footprints
The _ (underscore) is the separator between pin qty. in Hidden & Deleted pin components and to append modifiers at the end
The – (dash) is used to separate the pin qty.
The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.
Suffix Naming Convention for Footprints
Common SMD Land Pattern to Describe Environment Use (This is the last character in every name)
Note: This excludes the BGA component family as they only come in the Nominal Environment Condition
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M ................. Most Material Condition (Density Level A)
N.................. Nominal Material Condition (Density Level B)
L .................. Least Material Condition (Density Level C)
SON, QFN, SOP and QFP components that have different Thermal Tab sizes
Thermal Tab Examples for QFN w/Thermal Tabs:
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QFN50P600X600X100-41T365 = Thermal Tab size is 3.65 mm square
QFN50P600X600X100-41T365X200 = Thermal Tab size is 3.65 mm X 2.00 mm rectangular
Gull Wing components that have different Lead Tolerances
Lead Tolerance Example for Gull Wing Lead SOP package:

SOP65P490X110-8L20 = Lead Terminal has a 0.20 mm Tolerance
Ball Grid Array component that have different Ball Diameters
BGA Ball Size Example to add an additional differentiator to eliminate duplication:

BGA100C80P10X10_900X900X150B43 = Ball size is 0.43 mm nominal
© 2015 PCB Libraries, Inc.
Components with Hidden, Deleted or Reversed pins
Reverse Pin Order (or Mirrored Part)
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-20RN .......... 20 pin part, Reverse Pin Order, Nominal Environment
Hidden Pins
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-20_24N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic
symbol displays up to 24 pins.
Deleted Pins
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-24_20N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins.
© 2015 PCB Libraries, Inc.
Library Expert Naming Convention for Standard PTH* Land Patterns
Component, Category
Footprint Name
Capacitors, Non Polarized Axial Diameter Horizontal Mounting ........ CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: CAPAD800W52L600D150
Capacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Capacitors, Non Polarized Axial Rectangular ......... CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Example: CAPAR800W52L600T50H70
Capacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70
Capacitors, Non Polarized Axial Diameter Vertical Mounting ......... CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: CAPADV300W52L600D150
Capacitors, Non Polarized Axial; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50mm
Capacitors, Non Polarized Axial Rect. Vert. Mtg. CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height
Example: CAPARV300W52L600T50H70
Capacitors, Non Polarized Axial Rect. Vertical; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70
Capacitors, Non Polarized Radial Diameter .......................................CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Example: CAPRD200W52D300H550
Capacitors, Non Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50
Capacitors, Non Polarized Radial Rectangular ....... CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Example: CAPRR200W52L50T70H550
Capacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50
Capacitors, Non Polarized Radial Disk Button ........ CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Example: CAPRB200W52L50T70H550
Capacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50
Capacitors, Polarized Axial Diameter Horizontal Mounting ................CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: CAPPAD800W52L600D150
Capacitors, Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Capacitor, Polarized Radial Diameter ................................................ CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Example: CAPPRD200W52D300H550
Capacitors, Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50
Diodes, Axial Diameter Horizontal Mounting .......................................DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: DIOAD800W52L600D150
Diodes, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Diodes, Axial Diameter Vertical Mounting ....................................... DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: DIOADV300W52L600D150
Diodes, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Dual-In-Line Packages .................................. DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example: DIP762W52P254L1905H508Q14
Dual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Ceramic Dual-In-Line Packages ..................CDIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example: CDIP762W52P254L1905H508Q14
Ceramic Dual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Dual-In-Line Packages with Cavity ..............DIPC + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example: DIPC762W52P254L1905H508Q14
Dual-In-Line Package with Cavity: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Dual-In-Line Sockets ................................... DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example: DIPS762W52P254L1905H508Q14
Dual-In-Line Package Socket: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Transistor Outline, Flange Mount, Horizontal ................................................ TO + Pin Pitch P + Body Length X Body Width X Height Max – Pin Qty
Example: TO170P2207X1028X470-5
Transistor Outline, Flange Mount: 1.70 Pin Pitch; 22.07 Body Length; 10.28 Body Width; 4.70 Height; 5 pins
Transistor Outline, Flange Mount, Vertical .................................................... TO + Pin Pitch P + Body Length X Body Width X Height Max – Pin Qty
Example: TO127P817X1028X2084-5
Transistor Outline, Flange Mount: 1.27 Pin Pitch; 8.17 Body Length; 10.28 Body Width; 20.84 Height; 5 pins
Transistor Outline, Cylindrical .......................................................................................... TO + Pin Pitch P + Body Diameter X Height Max – Pin Qty
Example: TO508R895X660-4
Transistor Outline, Cylindrical: 5.08 Pin Radius; 8.95 Body Diameter; 6.60 Height; 5 pins
© 2015 PCB Libraries, Inc.
Header, vertical,2.54mm pitch;0.635mm lead width,20 pins,2 rows,10 pins per row,25.40mm L X 2.54mm W X 8.38mm H body
HDRV20W64P254_2X10_2540X254X838 – Example: vertical header, 2 rows by 20 pins:
Headers, Right Angle ... HDRV + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body
Length + X Body Thickness + X Component Height + Proportional Pad Stacks
Header, right angle, 2.54mm pitch; 0.635mm lead width, 20 pins, 2 rows, 10 pins per row, 25.40mm L X 2.54mm W X 5.08mm H body
HDRRA20W64P254_2X10_2540X254X508 – Example: right angle header, 2 rows by 20 pins:
Headers, Right Angle HDRRA + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body
Length + X Body Thickness + X Component Height + Proportional Pad Stacks
Header, vertical, 2.54mm pitch; 0.635mm lead width, 50 pins, 3 rows, 25 pins per row, 63.50mm L X 2.54mm W X 8.38mm H body
HDRV50W64P254_3X25_6350X254X838 – Example: vertical header, 3 rows by 25 pins with 25 missing ping pins:
Headers, Vertical HDRV + Total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length
+ X Body Thickness + X Component Height + Proportional Pad Stacks
Inductors, Axial Diameter Horizontal Mounting ................................... INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: INDAD800W52L600D150
Inductors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Inductors, Axial Diameter Vertical Mounting ................................... INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: INDADV300W52L600D150
Inductors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Jumpers, Wire ............................................................................................................................................... JUMP + Lead Spacing + W Lead Width
Example: JUMP500W52
Jumper; Lead Spacing 5.00; Lead Width 0.52
Mounting hole for ANSI size 6 with flat washer, tight fitting, non-plated; 3.85mm dia. hole, 8.7mm land, with 6 vias
Example: MTGNP870H385V6
Mounting hole,............................................................................................... MTG + NP (non-plated) + Land Size + H + Hole Size + V + No. of vias
Mounting hole for Metric size M3.5 pan head, tight fitting, plated; 3.85mm dia. hole, 7.35mm land
Example: MTGP735H385Z735
Mounting hole,..................................................................................................... MTG + P (plated) + Land Size + H + Hole Size + Z + Anti-pad size
Mounting hole for size 2.75 mm, loose fitting, plated; 2.9mm dia. hole, 4mm land
Example: MTGP400H290Z400
Mounting hole,................................................................................................... MTG + NP (plated) + Land Size + H + Hole Size + Z + Anti-pad size
Example – clearance hole:
Mounting hole for size 2.25 mm, tight fitting, non-plated; 2.6mm dia. hole, 1.3mm land
Example: MTGNP130H260Z130
Mounting hole,............................................................................................ MTG + NP (non-plated) + Land Size + H + Hole Size + Z + Anti-pad size
Oscillators .............................................. OSC + Lead Span + W Lead Diameter + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example for 8 pin Oscillator: OSC762W46P762L1320H600Q8
Oscillator: Lead Span 7.62; Lead Diameter 0.46; Pin Pitch 762; Body Length 13.20; Body Height 6.00; Pin Qty 8
Example for 14 pin Oscillator: OSC762W53P1524L2080H508Q14
Oscillator: Lead Span 7.62; Lead Diameter 0.53; Pin Pitch 762; Body Length 20.80; Body Height 508; Pin Qty 14
Pin Grid Array’s ............................ PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height
Example: PGA84P254C10R10L2500X2500H300
Pin Grid Array: Pin Qty 84; Pin Pitch 2.54; Columns 10; Rows 10; Body Length 25.00 X 25.00; Component Height 3.00
Resistors, Axial Diameter Horizontal Mounting ..................................RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: RESAD800W52L600D150
Resistors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Resistors, Axial Diameter Vertical Mounting .................................. RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: RESADV300W52L600D150
Resistors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Resistors, Axial Rectangular Horizontal Mounting .. RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Example: RESAR800W52L600T50H70
Resistors, Axial Rectangular; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70
Single-In-Line Packages............................... SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Example: SIP150W52P254L1905H508Q8
Single-In-Line Package: Body Width 1.5; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 8
Test Point; 0.635mm lead width, round, 2.54mm Diameter X 5.84mm H body height.
TPCW64D254H584 – Example: round test point with round or square lead:
Test Points, ................................................................................................................. TP + C + W + Lead Width + D + Body Diameter + H + Height
Test Point; 0.635mm lead width, square, 2.54mm W X 5.84mm H body.
TPRW64L254H584 – Example: square test point with round or square lead:
Test Points, ......................................................................................................................... TP + R + W + Lead Width + L + Body Size + H + Height
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The land pattern naming convention uses component dimensions to derive the land pattern name.
The first 3 – 6 characters in the land pattern name describe the component family.
The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.
All numbers that follow the Lead Spacing are component dimensions.
These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –
P = Pitch for components with more than two leads
W = Maximum Lead Width (or Component Lead Diameter)
L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body
H = Height for vertically mounted components
Q = Pin Quantity for components with more than two leads
R = Number of Rows for connectors
Note: All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
*PTH – Plated Through Hole
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Library Expert Naming Convention for Connectors and Unique Land Patterns
Manufacturer Name
Footprint Name
Manufacturer Name ................................................................................................................ MfrNameAbbreviation_MfrPartNumber
Note: See Appendix I for at the end of this document for the full list of all component manufacturer name abbreviations.
© 2015 PCB Libraries, Inc.
Appendix I - Library Expert Manufacturer Names
for updates, visit www.PCBLibraries.com/downloads
3M ...................................................................................... 3M
4D ....................................................................................... 4D
ABRACON ..................................................................Abracon
ADVANCED............................................................. Advanced
ALD ................................................ Advanced Linear Devices
AMD .................................................Advanced Micro Devices
APT .......................................... Advanced Power Technology
AEL ..................................................................... AEL Crystals
AEROFLEX ................................................................ Aeroflex
AIRBORN .................................................................... AirBorn
AKM................................................................................. AKM
AKMSEMI ............................................... AKM Semiconductor
AKROS ............................................................... Akros Silicon
ALCATEL................................................. Alcatel Components
ALLEGRO........................................................... Allegro Micro
ALLIANCE .................................................... Alliance Memory
ALPHA ............................................................Alpha & Omega
ALPHANOVA..................................................Alpha Novatech
ALPS ................................................................................ Alps
ALTECH ........................................................................ Altech
ALTERA ........................................................................ Altera
AMELECTRICAL ...................................... American Electrical
AMTECHCER .......................... American Technical Ceramics
AMGIS .............................................................. Amgis Toroids
AMP ..................................................... AMP (TE Connectivity)
AMPHENOL ............................................................ Amphenol
AMPHENOLAS ......................... Amphenol Advanced Sensors
AMPHENOLAE ................... Amphenol Aerospace Operations
AMPHENOLAOMIL ... Amphenol Aerospace Operations [MIL]
AMPHENOLCP ....................Amphenol Commercial Products
AMPHENOLCX ......................................... Amphenol Connex
AMPHENOLIO....................... Amphenol Industrial Operations
AMPHENOLIOMIL ........ Amphenol Industrial Operations [MIL]
AMPHENOLIS ............................ Amphenol Intercon Systems
AMPHENOLPCD ............................................ Amphenol PCD
AMPHENOLSS ................................. Amphenol Sine Systems
AMPHENOLTCS .............................................Amphenol TCS
AMPHENOLRF .................................... Amphenol-RF Division
AMPHENOLTE ......................... Amphenol-Tuchel Electronics
AMSAG ...................................................................... ams AG
AMST ......................................................... ams Technologies
ANALOG ........................................................ Analog Devices
ANAREN ..................................................................... Anaren
ANDON ........................................................................ Andon
APEM ............................................................................ Apem
APEXMICRO ........................................ Apex Microtechnology
APIDEV ............................................................... API Delevan
APITECH ..................................................... API Technologies
ARCHELEC ................................................... Arch Electronics
ARCOL ............................................................................ Arcol
ARIES .............................................................................. Aries
ARTESYN........................... Artesyn Embedded Technologies
AKMMICRO .................................... Asahi Kasei Microdevices
ASSMANN ................................................................ Assmann
ATMEL ........................................................................... Atmel
AUK .................................................AUK Contractors Co., Ltd
AUSTRIA ............................................. Austria Micro Systems
AVAGO ................................................... Avago Technologies
AVED ............................................................................... Aved
AVX .................................................................................. AVX
AXSEM ......................................................................... Axsem
BELPS ..................................................... Bel Power Solutions
BELFUSE ................................................................... BelFuse
BIVAR .............................................................................. Bivar
BLOCKMASTER ............................... Blockmaster Electronics
BLUEGIGA .......................................... Bluegiga Technologies
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BLUETECHNIX ......................................... Bluetechnix GmbH
BOCA ..................................................................... Boca Semi
BOSCH ........................................................ Bosch-Sensortec
BOURNS ...................................................................... Bourns
BROADCOM ........................................................... Broadcom
BULGIN ......................................................................... Bulgin
BURNDY ...................................................................... Burndy
CK .................................................................................... C&K
C3 ...............................................................................C3Semi
CADDOCK ................................................................ Caddock
CALCHIP .................................................................. Cal-Chip
CEL ........................................ California Eastern Laboratories
CAMBION ................................................................. Cambion
CAMDEN .......................................................... Camden Boss
CANTHERM .............................................................Cantherm
CARDINAL ................................................................. Cardinal
CARLI ........................................................... Carli Electronics
CARLING ............................................... Carling Technologies
CENTRAL .................................................................... Central
CHICAGO .................................................. Chicago Miniature
CINCH ............................................................................ Cinch
CIRRUS ......................................................................... Cirrus
CIT .................................................................................... CIT
CITIZENFM ........................................ Citizen Finetech Miyota
CLARE ............................................................................ Clare
CLIFF .......................................... Cliff Electronic Components
CNCTECH .............................................................. CnC Tech
COGNIMEM ..................................... CogniMem Technologies
COILCRAFT ............................................................... Coilcraft
COMCHIP ................................................................. Comchip
COMFORTABLE ................................. Comfortable Electronic
CONEC ...................................................................... CONEC
CONEXANT ............................................................. Conexant
CONNWIN .....................................................Connor-Winfield
COPPER .................................................... Cooper Bussmann
COPAL ........................................................................... Copal
COPELAND ................................... Copland Communications
CDE ............................................. Cornell Dubilier Electronics
COSEL ........................................................................... Cosel
COTO ............................................................................... Coto
CRYSTEK ................................................................... Crystek
CTS .................................................................................. CTS
CUI .................................................................................... CUI
CW .................................................................................... CW
CYPRESS ......................................... Cypress Semiconductor
CYROD .......................................................................... Cyrod
DATADELAY ............................................ Data Delay Devices
DSC ................................. Defense Supply Center, Columbus
DELEVAN .................................................................. Delevan
DIALIGHT ................................................................... Dialight
DIALOG ........................................................................ Dialog
DIELECTRIC .............................................................Dielectric
DIGITRON ....................................... Digitron Semiconductors
DIODES ....................................................................... Diodes
DIONICS ......................................................................Dionics
DIPTRONICS .................................................... DIPTRONICS
DYNAMAX .............................................................DYNAMAX
ECLIPTEK ................................................................... Ecliptek
ECS............................................................. ECS International
EECO ............................................................................ EECO
ELCTROCUBE..................................................... Electrocube
ELEKTRON ............................................. Elektron Technology
ELNA................................................................................ Elna
ELPIDA ......................................................................... Elpida
EMCTECH ................................................... EMC Technology
EMERSON ................................................................ Emerson
ENERGY ........................................................ ENERGY Micro
EPCOS ....................................................................... EPCOS
EPSON .......................................................................... Epson
ERNI ............................................................................... ERNI
ESWITCH .................................................................. E-Switch
EVERLIGHT .............................................................. Everlight
EXCELSYS................................................................ Excelsys
FAIRCHILD....................................... Fairchild Semiconductor
FAIRRITE .................................................................. Fair-Rite
FAIRVIEW ............................................... Fairview Microwave
FASTRON ................................................................... Fastron
FCI...................................................................FCI Electronics
FINDER ......................................................................... Finder
FOX ................................................................ Fox Electronics
FOXCONN............................................... Foxconn Electronics
FREESCALE ........................................................... Freescale
FRESCO ............................................................ Fresco Logic
FRONTIER ..................................................................Frontier
FTDI ........................................................................FTDI Chip
FUJI ................................................................................... Fuji
FUJITSU ....................................................................... Fujitsu
GE ................................................................. General Electric
GENESIC ................................................................. GeneSiC
GLENAIR ..................................................................... Glenair
GOWANDA...............................................................Gowanda
GRAYHILL ................................................................... Grayhill
GREENLIANT......................................................... Greenliant
GSI .................................................................................... GSI
HANRUN .................................................................... HanRun
HARTING .................................................................... Harting
HARVATEK ...............................................................Harvatek
HARWIN ....................................................................... Harwin
HENDON .................................................................... Hendon
HIROSE ........................................................................ Hirose
HITACHI ....................................................................... Hitachi
HITTITE .......................................................................... Hittite
HMICRO ...................................................................... HMicro
HOLT ................................................................................ Holt
HTK ...................................................... Honda Tsushin Kogyo
HONEYWELL ......................................................... Honeywell
HUBER ...................................................... HUBER+SUHNER
ICE .................................................................................... ICE
IEH .................................................................................... IEH
ILLINOIS ........................................................................ Illinois
INFINEON .................................................................. Infineon
INFINITE ...................................................................... Infinite
IDT........................................... Integrated Device Technology
ISSI.............................................................. Integrated Silicon
INTEL ............................................................................... Intel
IRF......................................................... International Rectifier
INTERSIL ..................................................................... Intersil
IOXUS ............................................................................ Ioxus
IPEX .............................................................................. I-PEX
IQD ...................................................IQD Frequency Products
ITT ........................................................................ ITT Cannon
IXYS ................................................................................ IXYS
JALCO ............................................................ JALCO Co., Ltd
JAE ................................................ Japan Aviation Electronics
JOHANSON............................................................. Johanson
JST ................................................................................... JST
JUDCO .......................................................................... Judco
KDS ................................................................................. KDS
KEMET ......................................................................... Kemet
KEYENCE ................................................................. Keyence
KEYSTONE ........................................... Keystone Electronics
KINGBRIGHT .......................................................... Kingbright
KIONIX .......................................................................... Kionix
KNITTER ........................................................... Knitter-Switch
KNOWLES............................................... Knowles Electronics
KOA .................................................... KOA Speer Electronics
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KYCON ................................................................ KYCON, Inc
KYOCERA ................................................................. Kyocera
LAIRD ............................................................................. Laird
LATTICE .............................................. Lattice Semiconductor
LEACH ...........................................................................Leach
LEDTRONICS ......................................................... Ledtronics
LELON ........................................................................... Lelon
LEM.................................................................................. LEM
LEMO ............................................................................ LEMO
LINEAR ...................................................... Linear Technology
LINX .................................................................................. Linx
LITEON .............................................. Lite-On Optoelectronics
LITTELFUSE ............................................................. Littelfuse
LSR .................................................................................. LSR
LMX...............................................................................Lumex
LUMINUS ................................................................... Luminus
LYNTRON .......................................................... Lyn-Tron, Inc
MACOM .....................................................................MACOM
MACRONIX ............................................................... Macronix
MARKI .......................................................... Marki Microwave
MARKTECH ..............................................................Marktech
MAXIM ......................................................... Maxim Integrated
MAXWELL ................................................................. Maxwell
MEDER ......................................................................... Meder
METZ .............................................................. METZ Connect
MICREL ......................................................................... Micrel
MICRO ....................................................... Micro Commercial
MICROCHIP............................................................. Microchip
MICROCRYSTAL ................................................ MicroCrystal
MICRON .......................................................................Micron
MICRONAS ............................................................... Micronas
MICROPAC ............................................................... Micropac
MICROSEMI ........................................................... Microsemi
MILLMAX ............................................................... MILL-MAX
MINDSPEED .......................................................... Mindspeed
MINICIRCUITS.....................................................Mini-Circuits
MITSUMI ..................................................................... Mitsumi
MMD ............................................................................... MMD
MOLEX .......................................................................... Molex
MSK .................................................................... MS Kennedy
MURATA ...................................................................... Murata
NATIONAL ........................................ National Semiconductor
NEUTRIK ....................................................... Neutrik USA Inc
NIC ............................................................... NIC Components
NICHICON .................................................................Nichicon
NIPPON .................................................... Nippon Chemi-Con
NKK.................................................................................. NKK
NORDIC ........................................................................ Nordic
NXP ....................................................... NXP Semiconductors
OHMITE ....................................................................... Ohmite
OMNI ......................................................................Omnivision
OMRON .....................................................................OMRON
ONSEMI .................................................... ON Semiconductor
OST...................................................... On Shore Technology
ONSHORE ............................................................... On-Shore
OPTEK ....................................................... Optek Technology
OCP .................................. Optical Communications Products
OPTODIO ............................................................. Opto Diode
OSRAM .........................................................................Osram
PANASONIC ...........................................................Panasonic
PANCON .................................................................. PANCON
PANDUIT .................................................................... Panduit
PARALLAX ................................................................ Parallax
PEM ............................................................ Penn Engineering
PEREGRINE ................................... Peregrine Semiconductor
PERICOM ......................................... Pericom Semiconductor
PHILIPS ........................................................................ Philips
PHILIPSLUM ................................................. Philips Lumileds
PHOENIX ...................................................... Phoenix Contact
PICO ................................................................................ Pico
PLESSEY ................................................................... Plessey
PLETRONICS.......................................................... Pletronics
PMC ................................................................................ PMC
PAMONA ................................................. Pomona Electronics
POSITRONIC .......................................................... Positronic
POWERINT ............................................... Power Integrations
POWEREX ....................................... Powerex Semiconductor
PRECIDIP................................................................. Preci-Dip
PUIAUDIO ............................................................... PUI Audio
PULSE ......................................................... Pulse Electronics
PURDY .......................................................................... Purdy
BRIGHTEK ........................................................... QT Brightek
QTECH ...................................................................... Q-TECH
QUALCOMM ..........................................................Qualcomm
QUALTEK ................................................. Qualtek Electronics
QUICKFILTER ................................... Quickfilter Technologies
QUICKLOGIC ........................................................ QuickLogic
RABBIT ................................................ Rabbit Semiconductor
RAF .................................................RAF Electronic Hardware
RALTRON ................................................................... Raltron
RAMTRON ................................................................ Ramtron
RCD ................................................................................. RCD
RCDCOMP ................................................. RCD Components
RDI .................................................................................... RDI
RECOM ..................................................... RECOM Electronic
RECTRON .................................................................. Rectron
RENCO ...................................................... Renco Electronics
RENESAS .............................................. Renesas Electronics
RFSOL ............................................................... RF Solutions
RFHIC .......................................................................... RFHIC
RFMD ........................................................................... RFMD
RICHTEK ................................................. Richtek Technology
RIEDON ...................................................................... Riedon
RLCELEC ...................................................... RLC Electronics
ROHM ................................................. ROHM Semiconductor
RUBYCON................................................................. Rubycon
SAMSUNGEM ........................... Samsung Electro-Mechanics
SAMSUNGSEMI .............................. Samsung Semiconductor
SAMTEC ..................................................................... Samtec
SANDISK ....................................................................SanDisk
SANGSHIN ............................................................... Sangshin
SANKEN ......................................................... Sanken Electric
SANYO .......................................................................... Sanyo
SCHAFFNER............................................................Schaffner
SCHOTT ........................................................................ Schott
SCHURTER............................................................... Schurter
SEIKO ........................................................ Seiko Instruments
SEMTECH ................................................................. Semtech
SENSATA ................................. Sensata Technologies/Airpax
SENSIRION .............................................................. Sensirion
SENSITRON............................................................. Sensitron
SEOULSEMI.................................... Seoul Semiconductor Inc
SHARP ............................................... Sharp Microelectronics
SIBA ................................................................................ SIBA
SIGMA ....................................................... Sigma Designs Inc
SIGNAL .................................................... Signal Transformer
SIGNETICS .............................................................. Signetics
SILICONLABS ......................................................Silicon Labs
SILVERTEL ................................................................ Silvertel
SINGATRON ........................................ Singatron Enterprises
SITIME ........................................................................ SiTIME
SKYWORKS ............................................. Skyworks Solutions
SLPOWER........................................... SL Ppower Electronics
SMITHFAST ............................................. SMITH FASTENER
SOBERTON ............................................................. Soberton
SOURIAU ............................. Souriau Connection Technology
SOUTHWEST....................................... Southwest Microwave
SPANSION ............................................................... Spansion
SPEEDTECH.........................................................SpeedTech
SPRAGUE ................................................ Sprague-Goodman
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ST ............................................................ ST Microelectronics
STACKPOLE......................................... Stackpole Electronics
STANDEX .................................... Standex-Meder Electronics
STANLEY ........................................................Stanley Electric
STAR ....................................................... STAR MICRONICS
STATE ............................................................ State of the Art
SA ............................................................. State of the Art, Inc
STEWART ................................................. Stewart Connector
SULLINS ......................................Sullins Connector Solutions
SUMIDA ...................................................................... Sumida
SUSUMA .................................................................... Susumu
SWITCHCRAFT ..................................................... Switchcraft
SWITCHCRAFTC ..................................... Switchcraft-Conxall
TAG ..................................................................... Tag Connect
TAIYO ................................................................. Taiyo Yuden
TALEMA ........................................................... Talema Group
TAMURA ..................................................................... Tamura
TAOGLAS ...................................................................Taoglas
TDK .................................................................................. TDK
TE .................................................................. TE Connectivity
TELIT ............................................................................... Telit
TENSILITY ............................................ Tensility International
TI ................................................................ Texas Instruments
THOMAS ........................................................ Thomas & Betts
TOKOAM .......................................................... Toko America
TOREX ........................................................................ TOREX
TOSHIBA ....................................................................Toshiba
TOUCHSTONE ............................ Touchstone Semiconductor
TRACO .......................................................................... Traco
TRANSWITCH ....................................................... Transwitch
TRIADMAGNETICS ....................................... Triad Magnetics
TRIADSEMI............................................ Triad Semiconductor
TRIMAG ...................................................................... Tri-Mag
TRINAMIC .............................. Trinamic Motion Control GmbH
TRIQUINT ...................................................................TriQuint
TRPCONN ......................................................TRP Connector
TT..................................................................... TT Electronics
TUCSONIX ................................................................. Tusonix
TXC .......................................................TXC CORPORATION
TYCO ............................................................ Tyco Electronics
UBLOX ..........................................................................U-Blox
UNITEDCC ................................................ United Chemi-Con
VECTOR .................................................... Vector Electronics
VECTRON .................................................................. Vectron
VENKEL ........................................................................ venkel
VERO ........................................................ Vero Technologies
VICOR ............................................................................. Vicor
VISHAY .........................................................................Vishay
VISUAL .............................................. Visual Communications
VSC................................. Vitesse Semiconductor Corporation
VOLGEN .......................................... Volgen/Kaga Electronics
VOLTRONICS ..........................................................Voltronics
VTI ..................................................................................... VTI
WAKEFIELD ............................................ Wakefield Solutions
WALSIN .................................................... Walsin Technology
WASHERUSA .......................................WASHERSUSA.COM
WECO ............................................................................ Weco
WEIDMULLER ...................................................... Weidmuller
WIMA .............................................................................WIMA
WINBOND ............................................... Winbond Electronics
WINCHESTERELEC........................... Winchester Electronics
WINTEC ....................................................... Wintec Industries
WIZNET ....................................................................... WIZnet
WOLFSON ................................................................. Wolfson
WURTH .......................................................................... Wurth
xfmrs ........................................................................... XFMRS
XICON .......................................................................... XICON
XILINX............................................................................. Xilinx
XMOS ........................................................................... XMOS
XPPOWER .............................................................. XP Power
YAGEO ......................................................................... Yageo
YAMAICHI .............................................. Yamaichi Electronics
YDS ................................................................................. YDS
ZILOG .............................................................................. Zilog
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