TRF3722 Quadrature Modulator with Integrated

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TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
TRF3722 具有集成 PLL 和 VCO 的正交调制器
1 特性
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1
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3 说明
具有集成 PLL 和 VCO 的 IQ 调制器
整数 N/分数 N PLL
调制器支持 400MHz 至 4200MHz 频率范围
PLL 和 VCO 支持 256MHz 至 4100MHz 频率范围
900MHz 时的 OIP3 为 31 dBm
1800MHz 时的 OIP3 为 30 dBm
VCO 1800MHz 开环相位噪声:1MHz 偏移时为 141 dBc/Hz
独立式 LO 输出支持 1/2/4/8 分频
调制器低功耗和高增益模式
多种断电模式
TRF3722 是一款高性能直接转换正交调制器,具有优
异的线性和低噪声性能。 基带共模电压典型值为
0.25V,支持与电流源 DAC 无缝连接。 此器件集成了
PLL 和 VCO,能够为调制器提供本地振荡器 (LO)。
PLL 和 VCO 可实现卓越的相位噪声性能,能够满足最
为严格的传输通信要求。 此器件还提供了额外的 LO
输出,用于驱动其它调制器或降频混频器。 调制器的
高增益模式可实现典型的 3dB 增益提升,低功耗模式
适合需要优化功耗的应用。
器件信息 (1)
2 应用
•
•
•
•
部件号
封装
封装尺寸(标称值)
TRF3722
VQFN (48)
7.00mm x 7.00mm
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
无线基础设施
– CDMA:IS95,UMTS,CDMA2000,TDSCDMA
– LTE,TD-LTE,LTE Advanced
– TDMA:GSM,EDGE,MC-GSM
点对点微波,点对多点微波
软件定义的无线电
射频中继器,分布式天线系统
4 方框图
BBI_P
27
29
34
36
28
25
24
13
12
6
31
VTUNE EXT_VCO BBI_N
NC
LO_OUTN 38
LO Div
LO_OUTP 39
44
PLL Div
Charge
Pump
PFD
R Div
TX Div
N Div
90O
18 RFOUT
6
45
43
40
GND
37
30
26
48
BBQ_N BBQ_P
22
20
19
17
15
11
7
5
PD RDBK LD
10
CLK
Serial Interface
8
47
3
DATA
1
46
VCC
4
0O
Pre
Scaler
SDM
LE
2
REFIN
41
VCC_TK
9
CP_OUT
32
35
33
42
23
21
16
14
GND
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLWS245
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性 ..........................................................................
应用 ..........................................................................
说明 ..........................................................................
方框图 ......................................................................
修订历史记录 ...........................................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
1
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
Handling Ratings....................................................... 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Electrical Characteristics........................................... 5
Typical Characteristics .............................................. 9
Typical Characteristics - Output Power................... 10
Typical Characteristics - Gain ................................. 11
Typical Characteristics - OIP3 ................................ 12
Typical Characteristics - OIP2 .............................. 13
Typical Characteristics - OP1dB ........................... 14
Typical Characteristics - Noise ............................. 15
Typical Characteristics - Unadjusted CF............... 16
Typical Characteristics - Unadjusted SBS ............ 17
Typical Characteristics - LO Harmonic ................. 18
Typical Characteristics - BB Harmonic ................. 20
7.17
7.18
7.19
7.20
Typical
Typical
Typical
Typical
Characteristics
Characteristics
Characteristics
Characteristics
- RF Output Return Loss . 22
- PLL/VCO ....................... 23
- Current Consumption .... 29
- Power Dissipation.......... 31
8
Parameter Measurement Information ................ 33
9
Detailed Description ............................................ 35
8.1 Serial Interface Timing Diagram ............................. 33
9.1
9.2
9.3
9.4
9.5
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Register Maps ........................................................
35
35
36
39
42
10 Applications and Implementation...................... 55
10.1 Application Information.......................................... 55
11 Power Supply Recommendations ..................... 57
12 Layout................................................................... 58
12.1 Layout Guidelines ................................................. 58
12.2 Layout Example .................................................... 58
13 器件和文档支持 ..................................................... 59
13.1 Trademarks ........................................................... 59
13.2 Electrostatic Discharge Caution ............................ 59
13.3 术语表 ................................................................... 59
14 机械封装和可订购信息 .......................................... 59
5 修订历史记录
Changes from Original (May 2014) to Revision A
Page
•
从单页产品预览更改为生产..................................................................................................................................................... 1
2
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
6 Pin Configuration and Functions
CLK
DATA
LE
GND
REFIN
GND
VCC_PLL
CP_OUT
GND
LO_OUTP
LO_OUTN
GND
VQFN PACKAGE
(Top View)
48
47
46
45
44
43
42
41
40
39
38
37
PD
1
36 NC
RDBK
2
35 VCC_LO2
LD
3
34 VTUNE
VCC_DIG
4
33 VCC_VCO
GND
5
32 VCC_TK
VCC_LO1
6
GND
7
BBQ_N
8
29 BBI_N
NC
9
28 NC
TRF3722
31 EXT_VCO
30 GND
BBQ_P 10
27 BBI_P
GND 11
26 GND
NC 12
NC 24
VCC_MOD4 23
GND 22
VCC_MOD3 21
GND 20
GND 19
RFOUT 18
GND 17
VCC_MOD2 16
GND 15
VCC_MOD1 14
NC 13
25 NC
Pin Functions
Pin
I/O
DESCRIPTION
NAME
NO.
BBI_N
29
I
BB in-phase input: negative
BBI_P
27
I
BB in-phase input: positive
BBQ_N
8
I
BB quadrature input: negative
BBQ_P
10
I
BB quadrature input: positive
CLK
48
I
Serial interface clock input; digital input
CP_OUT
41
O
Charge pump output
DATA
47
I
Serial interface data input; digital input
EXT_VCO
31
I
External local oscillator input
GND
5, 7, 11, 15, 17, 19, 20,
22, 26, 30, 37, 40, 43,
45
LD
3
LE
LO_OUTN
LO_OUTP
Ground
O
PLL lock detect output
46
I
Serial interface latch enable; digital input
38
O
Local oscillator output: negative
39
O
Local oscillator output: positive
NC
9, 12, 13, 24, 25, 36
NC
28
PD
1
Copyright © 2014, Texas Instruments Incorporated
No connect
No connect; N/C or ground to paddle
I
LO Div, TX Div, modulator power down (High = PD)
3
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Pin Functions (continued)
Pin
NAME
NO.
I/O
DESCRIPTION
RDBK
2
O
Serial interface internal registers readback output
REFIN
44
I
Reference clock input
RFOUT
18
O
RF output
VCC_DIG
4
3.3 V digital power supply
VCC_LO1
6
3.3 V TX Div power supply
VCC_LO2
35
3.3 V LO Div power supply
VCC_MOD1
14
3.3 V modulator power supply
VCC_MOD2
16
3.3 V modulator power supply
VCC_MOD3
21
3.3 V modulator power supply
VCC_MOD4
23
3.3 V modulator power supply
VCC_PLL
42
3.3 V PLL power supply
VCC_TK
32
3.3 V or 5 V VCO tank power supply
VCC_VCO
33
3.3 V VCO power supply
VTUNE
34
I
VCO control voltage input
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
All VCC except VCC_TK
–0.3
+3.6
V
VCC_TK
–0.3
+5.5
V
Digital I/O voltage range
–0.3
3.6
V
Operating junction temperature range
–40
150
°C
Supply voltage range
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
TSTG
VESD
(1)
(2)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001, all pins (1)
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins (2)
MIN
MAX
UNIT
–40
150
°C
–2
2
kV
–750
750
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
VCC
MIN
NOM
MAX
3.3 V power-supply voltage
3
3.3
3.6
UNIT
5 V or 3.3 V power-supply voltage, VCC _TK
3
3.3/5
5.5
V
V
TJ
Operating junction temperature range
–40
125
°C
TA
Ambient temperature range
–40
85
°C
4
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.4 Thermal Information
OFN
THERMAL METRIC (1)
RθJA
Junction-to-ambient thermal resistance
27.5
RθJC(top)
Junction-to-case (top) thermal resistance
12.8
RθJB
Junction-to-board thermal resistance
4.3
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
4.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.8
(1)
UNIT
48 PINS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
Over recommended operating conditions: VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C. Optimized bias settings as per Table 16
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC Parameters
ICC
3.3 V Supply Current
ICC_TK
5 V Supply Current
PDISS
IPD
Total Power Dissipation
Power Down Current
Typical Operating Mode; LO out = Off
328 (1)
mA
Typical Operating Mode; LO out = On
374
mA
21
mA
Typical Operating Mode; LO out = Off
1.18
W
Typical Operating Mode; LO out = On
1.34
W
Low Power Mode (Mod); LO out = Off
0.91
W
76
mA
2
mA
Hardware Power Down
Serial interface Power Down
RFOUT Frequency
Frequency
400
4200
MHz
IQ Modulator ƒLO = 750 MHz
Gain
G
Gain Flatness
Typical Operating Mode
0.8
High Gain Mode
3.6
In 300MHz bandwidth
–0.5
dB
dB
0.5
dB
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
OIP2
Output 2nd Order Intercept Point
SBS
Unadj. SideBand Suppression
–42
dBc
CF
Unadj. Carrier Feedthrough
–50
dBm
NSDO
Output Noise Spectral Density
BB inputs terminated on 50 Ω
–159
dBm/Hz
HD2LO
LO Second Harmonic
Measured at 2 x fLO
–49
dBc
HD3LO
LO Third Harmonic
Measured at 3 x fLO
–47
dBc
HD2BB
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–72
dBc
HD3BB
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–70
dBc
(1)
10.2
dBm
FBB = 4.5, 5.5 MHz
31
dBm
FBB = 4.5, 5.5 MHz
62
dBm
Powered down output buffer and LO divider.
Copyright © 2014, Texas Instruments Incorporated
5
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Electrical Characteristics (continued)
Over recommended operating conditions: VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C. Optimized bias settings as per Table 16
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IQ Modulator ƒLO = 900 MHz
G
Gain
Gain Flatness
Typical Operating Mode
0.8
High Gain Mode
3.6
In 300MHz bandwidth
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
OIP2
Output 2nd Order Intercept Point
SBS
Unadj. Side Band Suppression
CF
Unadj. Carrier Feed through
NSDO
Output Noise Spectral Density
BB inputs terminated on 50 Ω
HD2LO
LO Second Harmonic
HD3LO
LO Third Harmonic
HD2BB
HD3BB
–0.5
dB
dB
0.5
dB
10
dBm
FBB = 4.5, 5.5 MHz
31
dBm
FBB = 4.5, 5.5 MHz
62.5
dBm
–42.5
dBc
–50
dBm
–159
dBm/Hz
Measured at 2 x fLO
–47
dBc
Measured at 3 x fLO
–54.5
dBc
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–65.5
dBc
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–71.5
dBc
0.3
dB
IQ Modulator ƒLO = 1800 MHz
G
Gain
Gain Flatness
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
OIP2
Output 2nd Order Intercept Point
SBS
Unadj. Side Band Suppression
CF
Unadj. Carrier Feed through
NSDO
Output Noise Spectral Density
HD2LO
LO Second Harmonic
HD3LO
Typical Operating Mode
High Gain Mode
In 300 MHz bandwidth
3
–0.5
dB
0.5
dB
13
dBm
fBB = 4.5, 5.5 MHz
29.5
dBm
fBB = 4.5, 5.5 MHz
57
dBm
–54.5
dBc
–57
dBm
BB inputs terminated on 50 Ω
–158
dBm/Hz
Measured at 2 x fLO
–36.5
dBc
LO Third Harmonic
Measured at 3 x fLO
–33.5
dBc
HD2BB
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–65.5
dBc
HD3BB
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–73
dBc
RLO
RF Output Return Loss
6
dB
0.2
dB
IQ Modulator ƒLO = 2150 MHz
G
Gain
Gain Flatness
Typical Operating Mode
High Gain Mode
In 300 MHz bandwidth
3
–0.5
dB
0.5
dB
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
OIP2
Output 2nd Order Intercept Point
SBS
Unadj. Side Band Suppression
–43
dBc
CF
Unadj. Carrier Feedt hrough
–42
dBm
NSDO
Output Noise Spectral Density
BB inputs terminated on 50 Ω
–157
dBm/Hz
HD2LO
LO Second Harmonic
Measured at 2 x fLO
–40
dBc
HD3LO
LO Third Harmonic
Measured at 3 x fLO
–31
dBc
HD2BB
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–51
dBc
HD3BB
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–69
dBc
6
11.6
dBm
FBB = 4.5, 5.5 MHz
30
dBm
FBB = 4.5, 5.5 MHz
43
dBm
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Electrical Characteristics (continued)
Over recommended operating conditions: VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C. Optimized bias settings as per Table 16
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IQ Modulator ƒLO = 2700 MHz
G
Gain
Gain Flatness
Typical Operating Mode
0
High Gain Mode
In 300MHz bandwidth
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
OIP2
Output 2nd Order Intercept Point
SBS
Unadj. Side Band Suppression
CF
Unadj. Carrier Feed through
NSDO
Output Noise Spectral Density
BB inputs terminated on 50 Ω
HD2LO
LO Second Harmonic
HD3LO
LO Third Harmonic
HD2BB
HD3BB
dB
2.4
–0.5
dB
0.5
dB
10.4
dBm
FBB = 4.5, 5.5 MHz
29.5
dBm
FBB = 4.5, 5.5 MHz
45.5
dBm
–33
dBc
–39.6
dBm
–156
dBm/Hz
Measured at 2 x fLO
–29
dBc
Measured at 3 x fLO
–37
dBc
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–53
dBc
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–68
dBc
Typical Operating Mode
–2
dB
High Gain Mode
0.4
dB
8.7
dBm
IQ Modulator ƒLO = 3600 MHz
G
Gain
OP1dB
Output Compression Point
OIP3
Output 3rd Order Intercept Point
FBB = 4.5, 5.5 MHz
24.5
dBm
OIP2
Output 2nd Order Intercept Point
FBB = 4.5, 5.5 MHz
45.5
dBm
SBS
Unadj. Side Band Suppression
–31.5
dBc
CF
Unadj. Carrier Feed through
–39.5
dBm
HD2LO
LO Second Harmonic
Measured at 2 x fLO
–28.4
dBc
HD3LO
LO Third Harmonic
Measured at 3 x fLO
–31.5
dBc
HD2BB
Baseband Second Harmonic
Measured at fLO ± 2 x fBB
–55
dBc
HD3BB
Baseband Third Harmonic
Measured at fLO ± 3 x fBB
–65
dBc
Baseband Inputs
VCM
Common Mode Voltage
Baseband I/Q input
BWBB
Baseband Bandwidth
1 dB Bandwidth
ZinBB
Baseband Input Impedance
0
0.25
0.5
900
V
MHz
Resistance
5
kΩ
Capacitance
4
pF
Reference Oscillator Parameters
Fref
Zinref
Reference Frequency
Max
Reference Input Sensitivity
Reference Input Impedance
350
0.2
Parallel capacitance
Parallel resistance
MHz
3.3
VPP
2
pF
2.2
kΩ
PFD, CP
FPFD
PFD Frequency
Max, refer to the Application Information
ICP_OUT
Charge Pump Current
Max
1.94
mA
In-band Normalized PN Floor
Integer Mode
–221
dBc/Hz
Copyright © 2014, Texas Instruments Incorporated
65
MHz
7
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Electrical Characteristics (continued)
Over recommended operating conditions: VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C. Optimized bias settings as per Table 16
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCO
fVCO
VCO Frequency range
KV
VCO gain
VTUNE = 1.1 V
VCO Open Loop Phase Noise;
fVCO = 3600 MHz;
TX Div = Div-by-1;
fOUT = 3600 MHz
VTUNE = 1.1 V
10 kHz
–74
100 kHz
–109
1 MHz
–135
10 MHz
–152
40 MHz
–156
PN
VCO Open Loop Phase Noise;
fVCO = 3600 MHz;
TX Div = Div-by-2;
fOUT = 1800 MHz;
VTUNE = 1.1 V
2050
4100
30
10 kHz
–80
100 kHz
–115
1 MHz
–141
10 MHz
–156
40 MHz
–158
MHz
MHz/V
dBc/Hz
dBc/Hz
LO Output
fOUT
Output frequency range
PLO
Output power
Divide by 1
2050
4100
Divide by 2
1025
2050
Divide by 4
512.5
1025
Divide by 8
256.25
SE at 1800 MHz, OUTBUF_BIAS = 2
512.5
1
External VCO input Frequency Range
250
External VCO Input Level
–10
MHz
0
dBm
4200
MHz
10
dBm
Close Loop PLL or VCO
Integrated Phase Noise
VCO Close Loop Phase Noise;
fVCO = 3600 MHz;
TX DIV = Div-by-2;
fOUT = 1800 MHz;
Integer Mode, PFD = 2.56MHz
Frac-N; PFD = 15.36 MHz; fOUT =
3532.89 MHz;
Integration BW =1 kHz to 10 MHz; SSB
-45.2
dB
Int-N; PFD = 2.56 MHz; fOUT = 1799.68
MHz;
Integration BW = 500 Hz to 20 MHz; SSB
-49.8
dB
10 kHz
–96
100 kHz
–114
1 MHz
–140
10 MHz
–156
40 MHz
–158
dBc/Hz
Digital Interface
VIH
High Level Input Voltage
2
VIL
Low Level Input Voltage
0
VOH
High Level Output Voltage
Referenced to VCC_DIG
VOL
Low Level Output Voltage
Referenced to VCC_DIG
8
3.3
V
0.8
0.8 x VCC
V
V
0.2 x VCC
V
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.6 Typical Characteristics
7.6.1 Modulator Output Spectrum
BB
HD
3
d
Sig
M
De
sir
e
er
I
M
Un
w
an
te
d
Sid
eb
a
nd
2
3
nd
rd
Or
d
Or
d
er
I
BB
HD
2
na
l
Graphical illustration of the modulator output spectrum with two tones is shown in Figure 1.
=
(F
B2
±
B2
1
BB
FB
-F
2
BB
LO
LO
B
3F
+
1
LO F BB
3
+
LO
LO
2
)+
BB
B1
FB
2F
+
+
2
LO (F BB
=
1
H
BB
nd
F 2 2F
+
LO
F1
22F O
=
L
H
+
rd
F3
B2
F B LO
=
+
F2
B1
FB 2
=
-F
F1
F1
2
LO
)+
1
BB
-F
L
=
nd
L
rd
F2
F3
LO
=
B1
B2
FB
B1
B2
FB
FB
FB
=
-2
-3
-3
-2
B1
B2
LS
LS
LO
LO
LO
LO
FBBn =
Fn =
F3rdH/L
F2ndH/L
LO =
LSBn
HD2BB
HD3BB
Freq.
Baseband Frequency
RF Frequency
=
3rd Order Intermodulation Product Frequency (High Side / Low Side)
=
2nd Order Intermodulation Product Frequency (High Side / Low Side)
Local Oscillator Frequency
=
Lower Sideband Frequency
=
Baseband second harmonic (High Side / Low Side)
=
Baseband thrid harmonic (High Side / Low Side)
Figure 1. Graphical Illustration of Modulator Output Spectrum
Copyright © 2014, Texas Instruments Incorporated
9
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.7 Typical Characteristics - Output Power
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, I/Q frequency (fBB) 4.5
MHz and 5.5 MHz,500 mVPP, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
Total Pout is two tones combined power.
6
6
TA = -40qC
TA = 25qC
TA = 85qC
2
2
0
0
-2
-4
-2
-4
-6
-6
-8
-8
-10
-10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D015
0
Figure 2. Total POUT vs Temperature, Typical operating
mode.
6
6
4
4
2
2
0
0
-2
-4
TA = -40qC
TA = 25qC
TA = 85qC
-8
-2
-4
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-8
-10
-10
0
500
0
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D017
Figure 4. Total POUT vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D219
Figure 5. Total POUT vs Supply, High Gain Mode
6
6
TA = -40qC
TA = 25qC
TA = 85qC
4
2
2
0
0
-2
-4
-2
-4
-6
-6
-8
-8
-10
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
4
POUT (dBm)
POUT (dBm)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D218
-6
-6
-10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D019
Figure 6. Total POUT vs Temperature, Low Power Mode
10
500
Figure 3. Total POUT vs Supply, Typical Operating Mode
POUT (dBm)
POUT (dBm)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
4
POUT (dBm)
POUT (dBm)
4
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D220
Figure 7. Total POUT vs Supply, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.8 Typical Characteristics - Gain
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, I/Q frequency (fBB) 4.5
MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
6
6
TA = -40qC
TA = 25qC
TA = 85qC
2
2
0
0
-2
-4
-6
-6
-8
-8
-10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D003
0
Figure 8. Voltage Gain vs Temperature, Typical Operating
Mode
6
6
4
4
2
2
0
0
-2
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D004
Figure 9. Voltage Gain vs Supply, Typical Operating Mode
G (dB)
G (dB)
-2
-4
-10
-4
-2
-4
-6
-6
TA = -40qC
TA = 25qC
TA = 85qC
-8
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-8
-10
-10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D005
0
Figure 10. Voltage Gain vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D006
Figure 11. Voltage Gain vs Supply, High Gain Mode
6
6
TA = -40qC
TA = 25qC
TA = 85qC
4
2
2
0
0
-2
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
4
G (dB)
G (dB)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
4
G (dB)
G (dB)
4
-2
-4
-4
-6
-6
-8
-8
-10
-10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D007
Figure 12. Voltage Gain vs Temperature, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D008
Figure 13. Voltage Gain vs Supply, Low Power Mode
11
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.9 Typical Characteristics - OIP3
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, I/Q frequency (fBB) 4.5
MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16. Reported
OIP3 is minimum of low side and high side.
34
34
TA = -40qC
TA = 25qC
TA = 85qC
32
30
32
30
28
OIP3 (dBm)
OIP3 (dBm)
28
26
24
26
24
22
22
20
20
18
18
16
16
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D009
0
Figure 14. OIP3 vs Temperature, Typical Operating Mode
30
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
32
30
28
OIP3 (dBm)
28
26
24
26
24
22
22
20
20
18
18
16
16
0
500
0
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D011
Figure 16. OIP3 vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D012
Figure 17. OIP3 vs Supply, High Gain Mode
34
34
TA = -40qC
TA = 25qC
TA = 85qC
32
30
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
32
30
28
OIP3 (dBm)
28
OIP3 (dBm)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D010
34
TA = -40qC
TA = 25qC
TA = 85qC
32
26
24
26
24
22
22
20
20
18
18
16
16
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D013
Figure 18. OIP3 vs Temperature, Low Power Mode
12
500
Figure 15. OIP3 vs Supply, Typical Operating Mode
34
OIP3 (dBm)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D014
Figure 19. OIP3 vs Supply, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.10 Typical Characteristics - OIP2
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, I/Q frequency (fBB) 4.5
MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16. Reported
OIP2 is minimum of low side and high side.
70
70
TA = -40qC
TA = 25qC
TA = 85qC
60
60
55
55
50
45
50
45
40
40
35
35
30
30
0
500
0
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D021
Figure 20. OIP2 vs Temperature, Typical Operating Mode
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D022
70
TA = -40qC
TA = 25qC
TA = 85qC
65
60
55
55
OIP2 (dBm)
60
50
45
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
65
50
45
40
40
35
35
30
30
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D023
0
Figure 22. OIP2 vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D024
Figure 23. OIP2 vs Supply, High Gain Mode
70
70
TA = -40qC
TA = 25qC
TA = 85qC
65
60
60
55
55
50
45
50
45
40
40
35
35
30
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
65
OIP2 (dBm)
OIP2 (dBm)
500
Figure 21. OIP2 vs Supply, Typical Operating Mode
70
OIP2 (dBm)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
65
OIP2 (dBm)
OIP2 (dBm)
65
30
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D025
Figure 24. OIP2 vs Temperature, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D026
Figure 25. OIP2 vs Supply, Low Power Mode
13
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.11 Typical Characteristics - OP1dB
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, I/Q frequency (fBB) 5
MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
16
16
TA = -40qC
TA = 25qC
TA = 85qC
14
12
12
OP1dB (dBm)
OP1dB (dBm)
10
14
8
6
4
8
6
4
2
2
0
0
-2
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-2
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D027
0
Figure 26. OP1dB vs Temperature, Typical Operating Mode
TA = -40qC
TA = 25qC
TA = 85qC
12
12
OP1dB (dBm)
10
14
8
6
4
10
8
6
4
2
2
0
0
-2
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-2
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D029
0
Figure 28. OP1dB vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D030
Figure 29. OP1dB vs Supply, High Gain Mod
16
16
TA = -40qC
TA = 25qC
TA = 85qC
14
12
10
8
6
4
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
14
12
OP1dB (dBm)
OP1dB (dBm)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D028
16
14
10
8
6
4
2
2
0
0
-2
-2
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D031
Figure 30. OP1dB vs Temperature, Low Power Mode
14
500
Figure 27. OP1dB vs Supply, Typical Operating Mode
16
OP1dB (dBm)
10
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D032
Figure 31. OP1dB vs Supply, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.12 Typical Characteristics - Noise
-150
-150
-152
-152
-154
-154
-156
-156
NSD (dBm/Hz)
NSD (dBm/Hz)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, TA = 25°C, BB inputs terminated to
50 ohms and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
-158
-160
-162
-164
-160
-162
-164
-166
-166
TA = -40qC
TA = 25qC
TA = 85qC
-168
-170
200
600
1000
1400
1800
Frequency (MHz)
2200
-170
200
2600
600
1000
D045
-152
-152
-154
-154
-156
-156
NSD (dBm/Hz)
-150
-158
-160
-162
1400
1800
Frequency (MHz)
2200
2600
D046
Figure 33. Noise vs Supply, Typical Operating Mode
-150
-164
-158
-160
-162
-164
-166
-166
TA = -40qC
TA = 25qC
TA = 85qC
-168
-170
200
600
1000
1400
1800
Frequency (MHz)
2200
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-168
-170
200
2600
600
1000
D047
Figure 34. Noise vs Temperature, High Gain Mode
-150
-152
-152
-154
-154
-156
-156
-158
-160
-162
-164
1400
1800
Frequency (MHz)
2200
2600
D048
Figure 35. Noise vs Supply, High Gain Mode
-150
NSD (dBm/Hz)
NSD (dBm/Hz)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-168
Figure 32. Noise vs Temperature, Typical Operating Mode
NSD (dBm/Hz)
-158
-158
-160
-162
-164
-166
-166
TA = -40qC
TA = 25qC
TA = 85qC
-168
-170
200
600
1000
1400
1800
Frequency (MHz)
2200
-170
200
2600
D049
Figure 36. Noise vs Temperature, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-168
600
1000
1400
1800
Frequency (MHz)
2200
2600
D050
Figure 37. Noise vs Supply, Low Power Mode
15
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.13 Typical Characteristics - Unadjusted CF
-30
-30
-35
-35
-40
-40
Unadj. CF (dBm)
Unadj. CF (dBm)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, TA = 25°C, I/Q frequency (fBB) 4.5
MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT.Optimized bias settings as per Table 16.
-45
-50
-55
-60
-45
-50
-55
-60
TA = -40qC
TA = 25qC
TA = 85qC
-65
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-65
-70
-70
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D033
0
-30
-30
-35
-35
-40
-40
-45
-50
-55
-60
-50
-55
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-65
-70
-70
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D035
0
Figure 40. Unadjustable CF vs Temperature,
High Gain Mode
-30
-30
-35
-35
-40
-40
-45
-45
-50
-55
-60
-65
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D036
Figure 41. Unadjustable CF vs Supply, High Gain Mode
Unadj. CF (dBm)
Unadj. CF (dBm)
-45
-60
TA = -40qC
TA = 25qC
TA = 85qC
-65
-50
-55
-60
-65
-70
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D037
Figure 42. Unadjustable CF vs Temperature,
Low Power Mode
16
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D034
Figure 39. Unadjustable CF vs Supply,
Typical Operating Mode
Unadj. CF (dBm)
Unadj. CF (dBm)
Figure 38. Unadjustable CF vs Temperature,
Typical Operating Mode
500
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D038
Figure 43. Unadjustable CF vs Supply, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.14 Typical Characteristics - Unadjusted SBS
-25
-25
-30
-30
-35
-35
Unadj. SBS (dBc)
Unadj. SBS (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, I/Q frequency (fBB)
4.5 MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT.Optimized bias settings as per Table 16.
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
-40
-45
-50
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D221
0
-25
-25
-30
-30
-35
-35
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
-40
-45
-50
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D223
0
Figure 46. Unadjustable SBS vs
Temperature, High Gain Mode
-25
-25
-30
-30
-35
-35
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
-60
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D224
Figure 47. Unadjustable SBS vs Supply,
High Gain Mode
Unadj. SBS (dBc)
Unadj. SBS (dBc)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D222
Figure 45. Unadjustable SBS vs Supply,
Typical Operating Mode
Unadj. SBS (dBc)
Unadj. SBS (dBc)
Figure 44. Unadjustable SBS vs Temperature,
Typical Operating Mode
500
-40
-45
-50
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D225
Figure 48. Unadjustable SBS vs Temperature,
Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D226
Figure 49. Unadjustable SBS vs Supply, Low Power Mode
17
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.15 Typical Characteristics - LO Harmonic
-20
-20
-25
-25
-30
-30
HD2LO (dBc)
HD2LO (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C, I/Q frequency (fBB)
4.5 MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
-35
-40
-45
-50
-35
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D051
0
-20
-20
-25
-25
-30
-30
-35
-40
-45
-50
-35
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D053
0
-20
-20
-25
-25
-30
-30
-35
-40
-45
-50
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D202
Figure 53. LO Second Harmonic vs Supply,
High Gain Mode
HD2LO (dBc)
HD2LO (dBc)
Figure 52. LO Second Harmonic vs Temperature,
High Gain Mode
-35
-40
-45
-50
TA = -40qC
TA = 25qC
TA = 85qC
-55
-60
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-55
-60
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D055
Figure 54. LO Second Harmonic vs Temperature,
Low Power Mode
18
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D201
Figure 51. LO Second Harmonic vs Supply,
Typical Operating Mode
HD2LO (dBc)
HD2LO (dBc)
Figure 50. LO Second Harmonic vs Temperature,
Typical Operating Mode
500
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D203
Figure 55. LO Second Harmonic vs Supply,
Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Typical Characteristics - LO Harmonic (continued)
-25
-25
-30
-30
-35
-35
-40
-40
-45
-45
HD3LO (dBc)
HD3LO (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C, I/Q frequency (fBB)
4.5 MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
-50
-55
-60
-65
-50
-55
-60
-65
-70
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D057
0
-25
-25
-30
-30
-35
-35
-40
-40
-45
-45
-50
-55
-60
-65
-50
-55
-60
-65
-70
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D059
0
Figure 58. LO Third Harmonic vs Temperature,
High Gain Mode
-25
-25
-30
-30
-35
-35
-40
-40
-45
-45
-50
-55
-60
-65
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D205
Figure 59. LO Third Harmonic vs Supply,
High Gain Mode
HD3LO (dBc)
HD3LO (dBc)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D204
Figure 57. LO Third Harmonic vs Supply,
Typical Operating Mode
HD3LO (dBc)
HD3LO (dBc)
Figure 56. LO Third Harmonic vs Temperature,
Typical Operating Mode
500
-50
-55
-60
-65
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
-80
-70
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D061
Figure 60. LO Third Harmonic vs Temperature,
Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D206
Figure 61. LO Third Harmonic vs Supply,
Low Power Mode
19
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.16 Typical Characteristics - BB Harmonic
-40
-40
-45
-45
-50
-50
HD2BB (dBc)
HD2BB (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, I/Q frequency (fBB)
4.5 MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
Reported BB harmonic is from (fBB) 4.5MHz.
-55
-60
-65
-70
-60
-65
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D063
0
Figure 62. BB-HD2 vs Temperature, Typical Operating Mode
-40
-40
-45
-45
-50
-50
-55
-60
-65
-70
-55
-60
-65
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D065
0
Figure 64. BB-HD2 vs Temperature, High Gain Mode
-40
-40
-45
-45
-50
-50
-55
-60
-65
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D208
Figure 65. BB-HD2 vs Supply, High Gain Mode
HD2BB (dBc)
HD2BB (dBc)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D207
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
-55
-60
-65
-70
-70
TA = -40qC
TA = 25qC
TA = 85qC
-75
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-75
-80
-80
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D067
Figure 66. BB-HD2 vs Temperature, Low Power Mode
20
500
Figure 63. BB-HD2 vs Supply, Typical Operating Mode
HD2BB (dBc)
HD2BB (dBc)
-55
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D209
Figure 67. BB-HD2 vs Supply, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Typical Characteristics - BB Harmonic (continued)
-50
-50
-55
-55
-60
-60
HD3BB (dBc)
HD3BB (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, I/Q frequency (fBB)
4.5 MHz and 5.5 MHz, VCM = 0.25 V, and 4.7 pF series capacitor at RFOUT. Optimized bias settings as per Table 16.
Reported BB harmonic is from (fBB) 4.5MHz.
-65
-70
-75
-80
-70
-75
-80
TA = -40qC
TA = 25qC
TA = 85qC
-85
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-85
-90
-90
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D069
0
Figure 68. BB-HD3 vs Temperature, Typical Operating Mode
-50
-55
-55
-60
-60
-65
-70
-75
-80
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D210
-65
-70
-75
-80
TA = -40qC
TA = 25qC
TA = 85qC
-85
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-85
-90
-90
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D071
0
Figure 70. BB-HD3 vs Temperature, High Gain Mode
-50
-55
-55
-60
-60
-65
-70
-75
-80
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D211
Figure 71. BB-HD3 vs Supply, High Gain Mode
-50
HD3BB (dBc)
HD3BB (dBc)
500
Figure 69. BB-HD3 vs Supply, Typical Operating Mode
-50
HD3BB (dBc)
HD3BB (dBc)
-65
-65
-70
-75
-80
TA = -40qC
TA = 25qC
TA = 85qC
-85
-90
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-85
-90
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D073
Figure 72. BB-HD3 vs Temperature, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D212
Figure 73. BB-HD3 vs Supply, Low Power Mode
21
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
7.17 Typical Characteristics - RF Output Return Loss
Unless specified all plots were created at RFOUT pin using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C
5
2.5
S22
RFOUT S22 (dB)
0
-2.5
-5
-7.5
-10
-12.5
-15
-17.5
-20
400
Frequency (400 MHz to 4200 MHz)
800 1200 1600 2000 2400 2800 3200 3600 4000
Frequency (MHz)
D120
Figure 75. RFOUT S22 vs Frequency
Figure 74. Smith Chart
22
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.18 Typical Characteristics - PLL/VCO
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
-25
-25
TA = -40qC
TA = 25qC
TA = 85qC
-75
-100
-125
-150
10k
100k
1M
Offset Frequency (Hz)
10M
-100
-125
-175
500 1k
40M
10k
D087
Figure 76. Open Loop Phase Noise at 450 MHz vs
Temperature
100k
1M
Offset Frequency (Hz)
10M
40M
D088
Figure 77. Open Loop Phase Noise at 450 MHz vs Supply
-25
-25
TA = -40qC
TA = 25qC
TA = 85qC
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-50
Phase Noise (dBc/Hz)
-50
Phase Noise (dBc/Hz)
-75
-150
-175
500 1k
-75
-100
-125
-150
-75
-100
-125
-150
-175
500 1k
10k
100k
1M
Offset Frequency (Hz)
10M
-175
500 1k
40M
100k
1M
Offset Frequency (Hz)
10M
40M
D090
Figure 79. Open Loop Phase Noise at 900 MHz vs Supply
-25
-25
TA = -40qC
TA = 25qC
TA = 85qC
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-50
Phase Noise (dBc/Hz)
-50
-75
-100
-125
-75
-100
-125
-150
-150
-175
500 1k
10k
D089
Figure 78. Open Loop Phase Noise at 900 MHz vs
Temperature
Phase Noise (dBc/Hz)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-50
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
-50
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D091
Figure 80. Open Loop Phase Noise at 1800 MHz vs
Temperature
Copyright © 2014, Texas Instruments Incorporated
-175
500 1k
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D092
Figure 81. Open Loop Phase Noise at 1800 MHz vs Supply
23
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Typical Characteristics - PLL/VCO (continued)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
-25
Phase Noise (dBc/Hz)
-50
-75
Phase Noise (dBc/Hz)
450 MHz
900 MHz
1800 MHz
2150 MHz
2700 MHz
3600 MHz
4000 MHz
-100
-125
-150
-175
500 1k
10k
100k
1M
Offset Frequency (Hz)
10M
40M
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
100k
1M
Offset Frequency (Hz)
10M
40M
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
100k
1M
Offset Frequency (Hz)
10M
40M
D098
Figure 86. 1800 MHz Frac-N (Closed Loop Phase Noise) vs
Supply
24
100k
1M
Offset Frequency (Hz)
10M
40M
D095
TA = -40qC
TA = 25qC
TA = 85qC
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D097
Figure 85. 1800 MHz Frac-N (Closed Loop Phase Noise) vs
Temperature
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
10k
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
D096
Figure 84. 450 MHz Frac-N (Closed Loop Phase Noise) vs
Supply
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
10k
Figure 83. 450 MHz Frac-N (Closed Loop Phase Noise) vs
Temperature
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
10k
TA = -40qC
TA = 25qC
TA = 85qC
D215
Figure 82. Open Loop Phase Noise vs Frequency
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
TA = -40qC
TA = 25qC
TA = 85qC
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D099
Figure 87. 2150 MHz Frac-N (Closed Loop Phase Noise) vs
Temperature
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Typical Characteristics - PLL/VCO (continued)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
Phase Noise (dBc/Hz)
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
10k
100k
1M
Offset Frequency (Hz)
10M
40M
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
TA = -40qC
TA = 25qC
TA = 85qC
10k
D100
100k
1M
Offset Frequency (Hz)
10M
40M
D101
Figure 88. 2150 MHz Frac-N (Closed Loop Phase Noise) vs
Supply
Figure 89. 2700 MHz Frac-N (Closed Loop Phase Noise) vs
Temperature
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
Phase Noise (dBc/Hz)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
10k
100k
1M
Offset Frequency (Hz)
10M
40M
TA = -40qC
TA = 25qC
TA = 85qC
10k
D102
100k
1M
Offset Frequency (Hz)
10M
40M
D103
Figure 90. 2700 MHz Frac-N (Closed Loop Phase Noise) vs
Supply
Figure 91. 3600 MHz Frac-N (Closed Loop Phase Noise) vs
Temperature
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
500 1k
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
Phase Noise (dBc/Hz)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D104
Figure 92. 3600 MHz Frac-N (Closed Loop Phase Noise) vs
Supply
Copyright © 2014, Texas Instruments Incorporated
450MHz, Div8
900MHz, Div4
1800MHz, Div2
3600MHz, Div1
10k
100k
1M
Offset Frequency (Hz)
10M
40M
D105
Figure 93. 450, 900, 1800, 3600 MHz Closed Loop Phase
Noise vs Offset Frequency
25
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Typical Characteristics - PLL/VCO (continued)
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
TA = -40qC
TA = 25qC
TA = 85qC
PFD Spur (dBc)
PFD Spur (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
0
500
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D106
VCC = 3.15,4.75
VCC = 3.30,5.00
VCC = 3.45,5.25
0
500
Figure 95. PFD Spur vs Supply
1 x PFD
2 x PFD
3 x PFD
PFD Spur (dBc)
PFD Spur (dBc)
Figure 94. PFD Spur vs Temperature
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
0
500
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D108
PFD = 0.68MHz
PFD = 1.28MHz
PFD = 2.56MHz
0
500
TA = -40qC
TA = 25qC
TA = 85qC
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D213
Figure 98. 1 x Reference Spur vs Temperature
26
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D227
Figure 97. PFD Spur vs Frequency
REF Spur (dBc)
REF Spur (dBc)
Figure 96. PFD Spur vs PFD Multiples
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D107
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
VCC = 3.15,4.75
VCC = 3.30,5.00
VCC = 3.45,5.25
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D214
Figure 99. Reference Spur vs Supply
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Typical Characteristics - PLL/VCO (continued)
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
Frac Spur (dBc)
REF Spur (dBc)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
1 x REF
2 x REF
3 x REF
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz) - 61.44MHz
D111
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
0.0001
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
0.0001
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
0.001
0.01
0.1 0.2 0.5 1 2 3 5 10 20
Frequency (MHz) - 3609.6MHz
D113
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
0.0001
0.01
0.1 0.2 0.5 1 2 3 5 10 20
Frequency (MHz) - 3609.6MHz
D112
TA = -40qC
TA = 25qC
TA = 85qC
0.001
0.01
0.1 0.2 0.5 1 2 3 5 10 20
Frequency (MHz) - 1843.2MHz
D114
Figure 103. 1843.2 MHz Integer Boundary Spur vs
Temperature
-18
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-20
-22
-24
Kv (MHz/V)
Frac Spur (dBc)
Figure 102. 3609.6 MHz Integer Boundary Spur vs Supply
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
0.0001
0.001
Figure 101. 3609.6 MHz Integer Boundary Spur vs
Temperature
Frac Spur (dBc)
Frac Spur (dBc)
Figure 100. Reference Spur vs Reference Multiples
TA = -40qC
TA = 25qC
TA = 85qC
-26
-28
-30
-32
VCO_SEL 0
VCO_SEL 1
-34
VCO_SEL 2
VCO_SEL 3
-36
0.001
0.01
0.1 0.2 0.5 1 2 3 5 10 20
Frequency (MHz) - 1843.2MHz
D115
0
5
10 15 20 25 30 35 40 45 50 55 60 65
VCO_TRIM
D217
V(tune) = 1.1 V
Figure 104. 1842.2 MHz Integer Boundary Spur vs Supply
Copyright © 2014, Texas Instruments Incorporated
Figure 105. KVCO vs VCO Trim
27
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Typical Characteristics - PLL/VCO (continued)
8
4600
4400
4200
4000
3800
3600
3400
3200
3000
2800
2600
2400
2200
2000
1800
VCO_SEL 0
VCO_SEL 1
VCO_SEL 2
VCO_SEL 3
7
6
LO POUT (dBm)
Frequency (MHz)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK = 5 V, and TA = 25°C. Measured at
LO_OUTP with 50 Ω bias resistor and 47 pF series capacitor. Modulator section powered down. Reference frequency is set
to 61.44 MHz. Optimized bias settings as per Table 16.
5
4
3
2
1
0
TA = -40qC
TA = 25qC
TA = 85qC
-1
-2
0
5
0
10 15 20 25 30 35 40 45 50 55 60 65
VCO_TRIM
D216
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D116
V(tune) = 1.1 V
Figure 106. Frequency vs VCO_TRIM
Figure 107. LO Output Power at LO_OUTP vs Temperature
8
7
LO Harmonics (dBc)
LO POUT (dBm)
6
5
4
3
2
1
0
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
-1
-2
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D117
Figure 108. LO Output Power at LO_OUTP vs Supply
28
10
5
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
2nd Harmonic
3rd Harmonic
5th Harmonic
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D118
Figure 109. LO Harmonics at LO_OUTP vs Frequency
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TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
7.19 Typical Characteristics - Current Consumption
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, . Optimized bias
settings as per Table 16
420
420
TA = -40qC
TA = 25qC
TA = 85qC
412
404
396
396
388
388
ICC (mA)
ICC (mA)
404
380
372
372
364
356
356
348
348
340
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D228
0
Figure 110. 3.3V Supply Current vs Temperature, Typical
Operating Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D229
Figure 111. 3.3V Supply Current vs Supply, Typical
Operating Mode
420
420
TA = -40qC
TA = 25qC
TA = 85qC
412
404
404
396
396
388
388
380
372
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
412
ICC (mA)
ICC (mA)
380
364
340
380
372
364
364
356
356
348
348
340
340
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D230
Figure 112. 3.3V Supply Current vs Temperature, High Gain
Mode
256
254
252
250
248
246
244
242
240
238
236
234
232
230
0
TA = -40qC
TA = 25qC
TA = 85qC
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D232
Figure 114. 3.3V Supply Current vs Temperature, Low Power
Mode
Copyright © 2014, Texas Instruments Incorporated
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D231
Figure 113. 3.3V Supply Current vs Supply, High Gain Mode
ICC (mA)
ICC (mA)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
412
256
254
252
250
248
246
244
242
240
238
236
234
232
230
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D233
Figure 115. 5V Supply Current vs Supply, Low Power Mode
29
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Typical Characteristics - Current Consumption (continued)
28
28
TA = -40qC
TA = 25qC
TA = 85qC
27.8
27.6
27.6
27.4
ICC_TK (mA)
ICC_TK (mA)
27.4
27.2
27
26.8
27.2
27
26.8
26.6
26.6
26.4
26.4
26.2
26.2
26
26
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D234
Figure 116. 5V Supply Current vs Temperature, Typical
Operating Mode
30
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
27.8
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D235
Figure 117. 5V Supply Current vs Temperature, Typical
Operating Mode
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7.20 Typical Characteristics - Power Dissipation
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, . Optimized bias
settings as per Table 16.
1.8
1.8
TA = -40qC
TA = 25qC
TA = 85qC
1.7
1.6
1.6
1.5
3.3V PDISS (W)
1.5
3.3V PDISS (W)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.7
1.4
1.3
1.2
1.4
1.3
1.2
1.1
1.1
1
1
0.9
0.9
0.8
0.8
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D075
0
500
Figure 118. 3.3 V PDISS vs Temperature,
Typical Operating Mode
Figure 119. 3.3 V PDISS vs Supply,
Typical Operating Mode
1.8
1.8
TA = -40qC
TA = 25qC
TA = 85qC
1.7
1.6
1.6
1.5
3.3V PDISS (W)
3.3V PDISS (W)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.7
1.5
1.4
1.3
1.2
1.1
1.4
1.3
1.2
1.1
1
1
0.9
0.9
0.8
0.8
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D077
0
500
Figure 120. 3.3 V PDISS vs Temperature,
High Gain Mode
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D078
Figure 121. 3.3 V PDISS vs Supply,
High Gain Mode
1.4
1.4
TA = -40qC
TA = 25qC
TA = 85qC
1.3
1.2
1.1
1
0.9
0.8
1.2
1.1
1
0.9
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D079
Figure 122. 3.3 V PDISS vs Temperature, Low Power Mode
Copyright © 2014, Texas Instruments Incorporated
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.3
3.3V PDISS (W)
3.3V PDISS (W)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D076
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D080
Figure 123. 3.3 V PDISS vs Supply, Low Power Mode
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Typical Characteristics - Power Dissipation (continued)
Unless specified all plots were created using TRF3722EVM, VCC = 3.3 V, VCC_TK= 5 V, and TA = 25°C, . Optimized bias
settings as per Table 16.
1.8
1.8
TA = -40qC
TA = 25qC
TA = 85qC
1.7
1.6
1.5
1.5
1.4
1.4
PDISS (W)
PDISS (W)
1.6
1.3
1.2
1.3
1.2
1.1
1.1
1
1
0.9
0.9
0.8
0.8
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D081
0
Figure 124. Total PDISS vs Temperature,
Typical Operating Mode
1.6
1.6
1.5
1.4
1.4
PDISS (W)
1.5
1.3
1.2
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.7
1.1
1.3
1.2
1.1
1
1
0.9
0.9
0.8
0.8
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D083
0
Figure 126. Total PDISS vs Temperature, High Gain Mode
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D084
Figure 127. Total PDISS vs Supply, High Gain Mode
1.4
1.4
TA = -40qC
TA = 25qC
TA = 85qC
1.3
1.2
1.2
1.1
1.1
1
1
0.9
0.8
0.9
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D085
Figure 128. Total PDISS vs Temperature, Low Power Mode
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.3
PDISS (W)
PDISS (W)
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D082
1.8
TA = -40qC
TA = 25qC
TA = 85qC
1.7
32
500
Figure 125. Total PDISS vs Supply, Typical Operating Mode
1.8
PDISS (W)
VCC = 3.15V, 4.75V
VCC = 3.30V, 5.00V
VCC = 3.45V, 5.25V
1.7
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
D086
Figure 129. Total PDISS vs Supply, Low Power Mode
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8 Parameter Measurement Information
8.1 Serial Interface Timing Diagram
The TRF3722 features a four-wire serial programming interface (4WI) that controls an internal 32-bit shift
register with seven parallel registers. There are total of three signals that must be applied: the clock (CLK),
the serial data (DATA), and the latch enable (LE). The fouth signal is the read back (RDBK) signal. The
serial data (DB0-DB31) are loaded least significant bit (LSB) first, and read on the rising edge of the CLK. LE
is asynchronous to the CLK signal; at its rising edge, the data in the shift register are loaded into the selected
internal register. Figure 130 shows the timing diagram the 4WI. Table 1 lists the 4WI timing for the write
operation.
tsu1
REGISTER WRITE
t(CLK)
t(CH)
32nd
Write
clock
pulse
1st Write
clock
pulse
CLOCK
DB0 (LSB)
Address Bit0
DATA
t(CL)
th
DB1
Address Bit1
DB2
Address Bit2
DB3
Address Bit3
DB29
DB30
tsu3
DB31 (MSB)
tsu2
tw
End of Write
Cycle pulse
LATCH
ENABLE
Figure 130. 4WI Writing Timing Diagram
Table 1. 4WI Timing for Write Operation
Parameter
Symbol
Min
Typ
Max
Units
Hold time, data to clock
th
20
ns
Setup time, data to clock
tSU1
20
ns
Clock low duration
tCH
20
ns
Clock High duration
tCL
20
ns
Setup time, clock to enable
tSU2
20
ns
Clock period
tCLK
50
ns
Enable Time
tW
50
ns
Setup time, Latch to Data
tSU3
70
ns
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TRF3722 integrates 7 registers: Register 0 (000) to Register 6 (110). Registers 1 through 6 are used to set-up
and control the TRF3722 functionalities, while register 0 is used for the read-back function. Each read-back is
composed by two phases: writing followed by the actual reading of the internal data. This is shown in the timing
diagram in Figure 131.
tsu1
th
t( CLK)
T(CL)
nd
32
Write
clock
pulse
st
REG ISTER WR ITE
1
CLOCK
Write
clock
pulse
T(CH)
DB0 (LSB)
Address Bit0
DB1
Address Bit1
DB3
Address Bit3
DB2
Address Bit2
DB29
DB30
DB 31 (MSB)
DATA
tsu2
tw
³(QGRI:ULWH&\FOH´
pulse
LATCH ENABLE
nd
CLOCK
32
Write
clock
pulse
st
1 Read
clock pulse
READBACK
nd
rd
32 Read
clock pulse
33 Read
clock pulse
tw
tsu2
LATCH
ENABLE
nd
2 Read
clock pulse
³(QGRI:ULWH&\FOH´
pulse
td
ReadBack
Data Bit0
READBACK DATA
Read
Back
Data
Bit29
Read
Back
Data
Bit1
ReadBack
Data Bit31
ReadBack
Data Bit30
Figure 131. 4WI Read-Back Timing Diagram
During the writing phase a command is sent to TRF3722 register 0 to set it in read-back mode and to specify
which register is to be read. In the proper reading phase, at each rising clock edge, the internal data is
transferred into the RDBK pin and can be read at the following falling edge (LSB first). The first clock after the LE
goes high (end of writing cycle) is idle and the following 32 clocks pulses will transfer the internal register content
to the RDBK pin. Table 2 shows the Readback timing.
Table 2. 4WI Timing for Readback Timing
Parameter
Symbol
Min
Hold time, data to clock
th
20
Typ
Max
Units
ns
Setup time, data to clock
tSU1
20
ns
Clock low duration
tCH
20
ns
Clock High duration
tCL
20
ns
Setup time, clock to enable
tSU2
20
ns
Setup time, enable to Readback
clock
tSU3
20
ns
Delay time, clock to Readback
data output
td
10
Enable Time
tW
50
ns
Clock period
t(CLK)
50
ns
34
Comments
Equals Clock period
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TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
9 Detailed Description
9.1 Overview
TRF3722 integrates a high performance direct conversion quadrature modulator with exceptional linearity and
low noise performance. The modulator which upconverts low frequency baseband signal to high frequency RF
typically operates at 0.25 V common mode. It supports seamless interface with current source DACs. It also
features high gain and low power operating modes. Additionally, TRF3722 integrates PLL and VCO to provide
the local oscillator (LO) to the integrated modulator. The PLL and VCO provides excellent phase noise and
extremely low spurious performance. The device also provides an LO output for driving another modulator or
mixer. TRF3722 supports the use of an external VCO or LO signal.
9.2 Functional Block Diagram
BBI_P
27
29
34
36
28
25
24
13
12
6
31
VTUNE EXT_VCO BBI_N
NC
LO_OUTN 38
LO Div
LO_OUTP 39
44
PLL Div
Charge
Pump
PFD
R Div
TX Div
N Div
90O
45
43
40
GND
37
30
26
48
Serial Interface
Copyright © 2014, Texas Instruments Incorporated
BBQ_N BBQ_P
22
20
19
17
15
11
7
5
PD RDBK LD
10
CLK
VCC
18 RFOUT
6
8
47
3
DATA
1
46
35
33
42
23
21
16
14
4
0O
Pre
Scaler
SDM
LE
2
REFIN
41
VCC_TK
9
CP_OUT
32
GND
35
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www.ti.com.cn
9.3 Feature Description
9.3.1 RF Output
The RF output is single ended and can drive a 50-Ω load. It can be tuned with the use of an output matching
network to optimize the linearity and return loss performance within a selected band.
9.3.2 Baseband Inputs
The baseband inputs consist of the in-phase signal (I) and the quadrature-phase signals (Q). These I and Q
signals are differential. The baseband lines are nominally biased at 0.25-V common-mode voltage (VCM);
however, the device can operate with a VCM in the range of 0 V to 0.5 V. The baseband input lines are normally
terminated externally 50 Ω on TRF3722 evaluation board, though it is possible to modify this value if necessary
to match to an external filter load impedance requirement.
9.3.3 LO Output
The LO outputs are open collector differential outputs and are biased externally. These differential outputs can
be tuned to optimized output power along with OUTBUF_BIAS register settings. It also is possible to use LO
outputs in single ended mode.
9.3.4 PLL Architecture
Figure 132 shows a block diagram of the PLL architecture.
The VCO output frequency (fVCO) is given by Equation 1:
f
f VCO = REF x PLL DIV x
RDIV
æ
ö
ççNINT + NFRAC ÷÷
÷
ççè
25
ø÷
2
(1)
f
fPFD = REF
RDIV
(2)
PLL DIV = 2PLL_DIV_SEL
(3)
æ
NFRAC ö÷
÷÷
f VCO = fPFD x PLL DIV x çççNINT +
çè
225 ø÷
(4)
Where fREF is the reference input frequency, RDIV is the reference divider division ratio and the phase frequency detector frequency is fPFD. PLL_DIV_SEL controls the division ratio of the programmable divider (PLL
DIV) before the dual-modulus prescaler (DMP). NINT and NFRAC/225 is the integer and fractional part of the
fractional divider (N.f), respectively. In Integer mode, the fractional setting is ignored and Equation 5 is applied.
f VCO = fPFD x PLL DIV x NINT
(5)
The complete feedback divider block consists of a PLL DIV, DMP, and N.f. The prescaler can be programmed as
either a 4/5 or an 8/9. N.f includes an A and M digital counters.
36
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Feature Description (continued)
Ext VCO/
Ext LO
Ext
Loop
Filter
LO_DIV_SEL
CP_OUT
LO Div
fREF
RDIV
fPFD
PFD
Charge
Pump
TX
Quad
Div
fVCO
VTUNE
fLO
O°
fTX
9O°
TX_DIV_SEL
NINT
N Div
SDM
DMP
4/5 8/9
PLL DIV
PRSC_SEL
PLL_DIV_SEL
NFRAC_DIV
Figure 132. PLL Architecture
9.3.5 External VCO
An external LO or VCO signal may be applied. If an external LO is used the internal PLL can be powered down.
Alternatively, dividers, phase-frequency detector, and charge pump can remain enabled and may be used to
control the VTUNE of an external VCO. EN_EXTVCO is used to select the internal or external VCO.
9.3.6 Loop Filter
Loop filter design is critical for achieving low closed loop phase noise. Complete modulator performance data has
been measured using integer mode loop filter. The integer mode loop filter was designed considering loop
bandwidth 40 kHz and fPFD 2.56 MHz. Phase margin of 60 degrees was considered. Refer to TRF3722EVM
User’s Guide to obtain the details on TRF3722 loop component calculations. Figure 133, shows integer loop
filter.
VTUNE
CP_OUT
C2
2.2nF
C1
150pF
R3
1.5K
C3
150pF
R4
0R
C4
NS
R2
6.49K
Figure 133. Integer Loop Filter
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Feature Description (continued)
Frac-N performance data is obtained using the fractional loop filter shown in Figure 134. 40 kHz loop bandwidth
and 15.36 MHz PFD was considered.
VTUNE
CP_OUT
C2
10nF
C1
1nF
R3
1.1K
C3
330pF
R4
1.1K
C4
330pF
R2
1.1K
Figure 134. Fractional Loop Filter
9.3.7 Lock Detect
The lock detect signal is generated in the phase frequency detector by comparing the two input signals. When
the two compared phase signals remain aligned for several clock cycles, an internal signal goes high. The
precision of this comparison is controlled through the LD_ANA_PREC bits. This internal signal is then averaged
and compared against a reference voltage to generate the lock detect (LD) signal. The number of averages used
is controlled through LD_DIG_PREC. Therefore, when the VCO is frequency locked, LD is high. When the VCO
frequency is not locked, LD may pulse high or exhibit periodic behavior.
By default, the internal lock detect signal is made available on the LD terminal. Register bits MUX_CTRL can be
used to control a multiplexer to output other diagnostic signals on the LD output.
38
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
9.4 Device Functional Modes
9.4.1 Selecting PLL Divider Values
With reference to the PLL architecture shown in Figure 132, operation of the PLL requires TX_DIV_SEL /
LO_DIV_SEL, PLL_DIV_SEL, RDIV, NINT, NFRAC and PRSC_SEL bits to be calculated.
a. TX_DIV_SEL / LO_DIV_SEL
The LO to the integrated modulator (ƒTX) and additional LO output (ƒLO) frequency is related to fVCO
according to the following:
ƒTX = fVCO / TX DIV
ƒLO = fVCO / LO DIV
Where TX DIV and LO DIV are related to TX_DIV_SEL and LO_DIV_SEL as:
TX_DIV_SEL / LO_DIV_SEL
TX_DIV / LO_DIV
Frequency Range
TX_DIV_SEL = 0
TX DIV = 1
2050 MHz ≤ ƒTX ≤ 4100 MHz
TX_DIV_SEL = 1
TX DIV = 2
1025 MHz ≤ ƒTX ≤ 2050 MHz
TX_DIV_SEL = 2
TX DIV = 4
512.5 MHz ≤ ƒTX ≤ 1025 MHz
TX_DIV_SEL = 3
TX DIV = 8
256.25 MHz ≤ ƒTX ≤ 512.5 MHz
LO_DIV_SEL = 0
LO DIV = 1
2050 MHz ≤ ƒLO ≤ 4100 MHz
LO_DIV_SEL = 1
LO DIV = 2
1025 MHz ≤ ƒLO ≤ 2050 MHz
LO_DIV_SEL = 2
LO DIV = 4
512.5 MHz ≤ ƒLO ≤ 1025 MHz
LO_DIV_SEL = 3
LO DIV = 8
256.25 MHz ≤ ƒLO ≤ 512.5 MHz
b. PLL_DIV_SEL
Given fVCO, select PLL_DIV_SEL so that the division ratio PLL DIV limits the input frequency to the
prescaler , fDMP, is limited to a maximum of 3000 MHz.
PLL DIV = min(1, 2, 4) such that fDMP ≤ 3000 MHz
PLL DIV is related to PLL_DIV_SEL according to the following equation:
PLL_DIV = 2PLL_DIV_SEL
This calculation can be restated as Equation 6.
æ LO DIV x fLO ÷ö
÷ = Ceiling
PLL DIV = Ceiling çç
çè 3000 MHz ÷ø
çæ TX DIV x fTX ÷÷ö
ççè 3000 MHz ÷ø
(6)
For both integer and fractional mode it is preferable to operate the fPFD at the highest possible frequency
determined by the required frequency step of the RFOUT or LO_OUT. In Integer mode, select the maximum
fPFD according to Equation 7.
fPFD =
f VCO, Stepsize
PLL DIV
=
fTX, Stepsize x TX DIV
PLL DIV
(7)
In Fractional mode, small RF stepsize can be obtained through the fractional divider. In this case, the highest
fPFD frequency should be selected according to the reference clock and system requirements.
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c. RDIV, NINT, NFRAC, PRSC_SEL
The remaing PLL parameters are calculated according to the following equations:
RDIV =
fREF
fPFD
æ f
ö
NINT = floor ççç VCO x RDIV ÷÷÷
çè fREF x PLL DIV ÷ø
éææ f
ù
ö
÷ö
NFRAC = floor êêçççççç VCO x RDIV ÷÷÷ - NINT÷÷÷ x 225 úú
÷
ç
ç
÷
f
x
PLL
DIV
è
ø
ø
ëêè REF
ûú
The DMP division ratio (P/P+1) can be set to 4/5 or 8/9 through the PRSC_SEL bit. To allow proper
fractional operation, set PRSC_SEL according to:
PRSC_SEL = 0, (P/P+1) = 4/5 for 20 ≤ NINT < 72 in integer mode or 23 ≤ NINT < 75 in fractional mode.
PRSC_SEL = 1, (P/P+1) = 8/9 for NINT ≥ 72 in integer mode or NINT ≥ 75 in fractional mode.
The PRSC_SEL limit at NINT < 75 applies to Fractional mode with third-order modulation. In Integer mode,
the PRSC_SEL = 8/9 should be used with NINT as low as 72. The divider block accounts for either value of
PRSC_SEL without requiring NINT or NFRAC to be adjusted. Then, calculate the maximum input frequency
(fN) to the digital divider. Use the lower of the possible prescaler divide settings, P = (4,8), as shown by
Equation 8.
fN =
f VCO
PLL DIV x P
(8)
Verify that the frequency into the digital divider, fN, is less than or equal to 375 MHz. If fN exceeds 375 MHz,
choose a larger value for PLL_DIV_SEL and recalculate fPFD, RDIV, NINT, NFRAC, and PRSC_SEL.
9.4.2 Setup Example for Integer Mode
Suppose the following operating characteristics fractional example are desired for Integer mode operation:
• fREF = 61.44 MHz (reference input frequency)
• Step at RF = 2.56 MHz (RF channel spacing)
• fRF = 1799.68 MHz (RF frequency)
The VCO range is 2050 MHz to 4100 MHz. Therefore:
• LO DIV = 2 (LO_DIV_SEL = 1)
• fVCO = LO DIV × 1799.68 MHz = 3599.36 MHz
In order to keep the frequency of the prescaler below 3000 MHz:
• PLL_DIV = 2 (PLL_DIV_SEL = 1)
The desired stepsize at RF is 2.56 MHz, so:
• fPFD = 2.56 MHz
• fVCO, stepsize = PLL_DIV × fPFD = 5.12 MHz
Using the reference frequency along with the required fPFD gives:
• RDIV = 24
• NINT = 703
NINT ≥ 75; therefore, select the 8/9 prescaler.
fN = 3599.36 MHz/(2 × 8) = 224.96 MHz < 375 MHz
This example shows that Integer mode operation gives sufficient resolution for the required stepsize.
9.4.3 Integer and Fractional Mode Selection
The PLL is designed to operate in either Integer mode or Fractional mode. If the desired local oscillator (LO)
frequency is an integer multiple of fPFD, then select integer mode otherwise select fractional mode. In Integer
mode, the feedback divider ratio is an integer, and the fraction is zero. Thus, bits corresponding to the fractional
control in integer mode are don’t care and fractional divider functionality is disabled.
40
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
In Fractional mode, the accuracy of the final frequency is set by 25-bit resolution. The RF stepsize is fPFD/225
which is less than 1 Hz for fPFD up to 33 MHz. The appropriate fractional control bits in the serial register must be
programmed. Optimal performance may require tuning the MOD_ORD, ISOURCE_SINK, and ISOURCE_TRIM
values according to the chosen frequency band.
9.4.4 Selecting the VCO and VCO Frequency Control
To achieve a broad frequency tuning range, the TRF3722 integrates multiple VCOs. Each VCO tank uses a bank
of coarse tuning capacitor to bring VCO frequency within a few MHz of the desired value. For a given LO
frequency an appropriate VCO and capacitor array must be selected. The device integrates logic that
automatically selects an appropriate VCO and capacitor array, such that in closed loop V(TUNE) is approximately
equal to the open loop calibration reference voltage set by VCO_CAL_REF. An on-chip temperature sensor
automatically adjusts this reference voltage so that proper lock can be maintained over the temperature range.
The calibration logic is driven by a CAL_CLK signal which is scaled version of the reference frequency according
to CAL_CLK_SEL. For optimum accuracy It is recommended to limit the CAL_CLK frequency to 600 kHz.
When VCO_SEL_MODE is '0', the device automatically selects the VCO and the capacitor array. When
VCO_SEL_MODE is '1', the VCO selected by VCO_SEL is used and the logic automatically selects the capacitor
array. The VCO and capacitor array settings resulting from the calibration can be read from Register 0 - read
back register.
Automatic calibration can be disabled by setting CAL_BYPASS to '1'. In this manual calibration mode, the VCO is
selected through register bits VCO_SEL, while the capacitor array is selected through register bits VCO_TRIM.
Calibration modes are summarized in Table 3.
Table 3. VCO Calibration Modes
CAL_BYPASS
VCO_SEL_MODE
MAX CYCLES
CAL_CLK
0
0
46
0
1
34
VCO_SEL
Automatic
1
don't care
N/A
VCO_SEL
VCO_TRIM
Copyright © 2014, Texas Instruments Incorporated
VCO
CAPACITOR
ARRAY
Automatic
41
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
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9.5 Register Maps
Table 4. Serial interface Register Summary
Bit
Register 1
Register 2
Register 3
Register 4
Register 5
Register 6
Register Address
Register Address
Register Address
Register Address
Register Address
Register Address
Bit5
PWD_PLL
RSV
Bit6
PWD_CP
Bit0
Bit1
Bit2
Bit3
Bit4
RSV
IB_MOD_GM
Bit7
PWD_VCO
Bit8
PWD_VCO_MUX
Bit9
PWD _DIV124
Bit10
PWD_PRESC
IB_MOD_LO
VCO_TRIM
Bit11
RDIV
RSV
VCO_BIAS
Bit12
PWD_OUTBUF
NINT
Bit13
PWD_LO_DIV
EN_LOCKDET
Bit14
PWD_TX_DIV
VCO_TEST_MODE
Bit15
PWD_MOD
Bit16
EN_EXTVCO
VCOBUF_BIAS
CAL_BYPASS
VCOMUX_BIAS
Bit17
NFRAC
Bit18
RSV
Bit19
REF_INV
RSV
MUX_CTRL
EN_ISOURCE
OUTBUF_BIAS
ISOURCE_SINKB
LD_ANA_PREC
Bit20
NEG_VCO
RSV
Bit21
ISOURCE_TRIM
PLL_DIV_SEL
CP_TRISTATE
Bit22
Bit23
VCO_CAL_IB
ICP
PRSC_SEL
SPEEDUP
LO_DIV_SEL
Bit24
LD_DIG_PREC
VCO_CAL_REF
RSV
Bit25
LO_DIV_BIAS
Bit26
ICPDOUBLE
MOD_ORD
VCO_SEL
VCO_AMPL_CTRL
Bit27
TX_DIV_SEL
Bit28
VCO_SEL_MODE
DITH_SEL
CAL_CLK_SEL
VCO_VB_CTRL
Bit29
CAL_ACC
DEL_SD_CLK
Bit30
TX_DIV_BIAS
RSV
RSV
Bit31
42
RSV
EN_CAL
EN_FRAC_MODE
EN_LD_ISOURCE
GAIN_CTRL
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
9.5.1 Serial interface Register Definition
Table 5. Register 1
Register 1
Bit Name
Reset Value
Bit0
ADDR<0>
1
Bit1
ADDR<1>
0
Bit2
ADDR<2>
0
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
RDIV<0>
1
Bit6
RDIV<1>
0
Bit7
RDIV<2>
0
Bit8
RDIV<3>
0
Bit9
RDIV<4>
0
Bit10
RDIV<5>
0
Bit11
RDIV<6>
0
Bit12
RDIV<7>
0
Bit13
RDIV<8>
0
Bit14
RDIV<9>
0
Bit15
RDIV<10>
0
Bit16
RDIV<11>
0
Bit17
RDIV<12>
0
Bit18
RSV
0
Reserved
Bit19
REF_INV
0
Invert Reference Clock Polarity; 1 = use falling edge
Bit20
NEG_VCO
1
VCO polarity control; 1 = negative slope (negative Kv)
Bit21
ICP<0>
0
Bit22
ICP<1>
1
Bit23
ICP<2>
0
Bit24
ICP<3>
1
Bit25
ICP<4>
0
Bit26
ICPDOUBLE
0
Bit27
CAL_CLK_SEL<0>
0
Bit28
CAL_CLK_SEL<1>
0
Bit29
CAL_CLK_SEL<2>
0
Bit30
CAL_CLK_SEL<3>
1
Bit31
RSV
0
Copyright © 2014, Texas Instruments Incorporated
Description
Register Address Bits
13-bit Reference Divider Value
(Rmin = 1, Rmax = 8191)
Program charge pump DC current:
[00000] = 1.94 mA
[11111] = 0.47 mA
[01010] = 0.97 mA
1 = Set ICP to double the current
Multiplication or division factor to create VCO calibration clock from
the PFD frequency:
[0000] = Fastest ( Rdiv / 128)
[1111] = Slowest (Rdiv x 128), [1000] = Default (1x Rdiv)
Reserved
43
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
CAL_CLK_SEL[3..0]: Set the frequency divider value used to derive the VCO calibration clock from the reference
frequency.
Table 6. CAL_CLK_SEL Scaling Factor Setting
CAL_CLK_SEL
Scaling Factor
CAL_CLK_SEL
Scaling Factor
1111
1/128
0111
NA
1110
1/64
0110
2
1101
1/32
0101
4
1100
1/16
0100
8
1011
1/8
0011
16
1010
1/4
0010
32
1001
1/2
0001
64
1000
1
0000
128
ICP[4..0]: Set the charge pump current.
Table 7. Charge Pump Current Set-Point
44
ICP[4..0]
Current (mA)
ICP[4..0]
Current (mA)
00 000
1.94
10 000
0.75
00 001
1.76
10 001
0.72
00 010
1.62
10 010
0.69
00 011
1.49
10 011
0.67
00 100
1.38
10 100
0.65
00 101
1.29
10 101
0.63
00 110
1.21
10 110
0.61
00 111
1.14
10 111
0.59
01 000
1.08
11 000
0.57
01 001
1.02
11 001
0.55
01 010
0.97
11 010
0.54
01 011
0.92
11 011
0.52
01 100
0.88
11 100
0.51
01 101
0.84
11 101
0.50
01 110
0.81
11 110
0.48
01 111
0.78
11 111
0.47
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Table 8. Register 2
Register 2
Bit Name
Reset Value
Bit0
ADDR<0>
0
Bit1
ADDR<1>
1
Bit2
ADDR<2>
0
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
NINT<0>
0
Bit6
NINT<1>
0
Bit7
NINT<2>
0
Bit8
NINT<3>
0
Bit9
NINT<4>
0
Bit10
NINT<5>
0
Bit11
NINT<6>
0
Bit12
NINT<7>
1
Bit13
NINT<8>
0
Bit14
NINT<9>
0
Bit15
NINT<10>
0
Bit16
NINT<11>
0
Bit17
NINT<12>
0
Bit18
NINT<13>
0
Bit19
NINT<14>
0
Bit20
NINT<15>
0
Bit21
PLL_DIV_SEL<0>
1
Bit22
PLL_DIV_SEL<1>
0
Select division ratio of divider in front of prescaler
[00] = 1X, [01] = div2, [10] = div4
Bit23
PRSC_SEL
1
Select precaler modulus: [0] = 4/5, [1] =8/9
Bit24
RSV
0
Bit25
RSV
0
Bit26
VCO_SEL<0>
0
Bit27
VCO_SEL<1>
1
Selects between the four integrated VCOs
[00] = lowest frequency, [11] = highest frequency
Bit28
VCO_SEL_MODE
0
Single VCO auto-calibration mode: [1] = active
Bit29
CAL_ACC<0>
0
Bit30
CAL_ACC<1>
0
Error count during the cap array calibration
[00] = 0, [01] = 1/32, [10] = 1/64, [11] =1/128)
Bit31
EN_CAL
0
Initiate VCO auto-calibration, resets automatically
Copyright © 2014, Texas Instruments Incorporated
Description
Register Address Bits
PLL N-Divider Value
Reserved
45
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www.ti.com.cn
Table 9. Register 3
46
Register 3
Bit Name
Reset Value
Bit0
ADDR<0>
1
Bit1
ADDR<1>
1
Bit2
ADDR<2>
0
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
NFRAC<0>
0
Bit6
NFRAC<1>
0
Bit7
NFRAC<2>
0
Bit8
NFRAC<3>
0
Bit9
NFRAC<4>
0
Bit10
NFRAC<5>
0
Bit11
NFRAC<6>
0
Bit12
NFRAC<7>
0
Bit13
NFRAC<8>
0
Bit14
NFRAC<9>
0
Bit15
NFRAC<10>
0
Bit16
NFRAC<11>
0
Bit17
NFRAC<12>
0
Bit18
NFRAC<13>
0
Bit19
NFRAC<14>
0
Bit20
NFRAC<15>
0
Bit21
NFRAC<16>
0
Bit22
NFRAC<17>
0
Bit23
NFRAC<18>
0
Bit24
NFRAC<19>
0
Bit25
NFRAC<20>
0
Bit26
NFRAC<21>
0
Bit27
NFRAC<22>
0
Bit28
NFRAC<23>
0
Bit29
NFRAC<24>
0
Bit30
RSV
0
Bit31
RSV
0
Description
Register Address Bits
Fractional PLL N-Divider
0 to 0.99999 in fractional mode
Reserved
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Table 10. Register 4
Register 4
Bit Name
Reset Value
Bit0
ADDR<0>
0
Bit1
ADDR<1>
0
Bit2
ADDR<2>
1
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
PWD_PLL
0
Power -down all PLL blocks: (1 = off)
Bit6
PWD_CP
0
Power-down Charge Pump: (1=off)
Bit7
PWD_VCO
0
Power-down VCO: (1=off)
Bit8
PWD_VCO_MUX
0
Power-down VCO Mux blocks: (1=off)
Bit9
PWD _DIV124
0
Power-down the div 1,2,4 in the PLL f/b path: (1=off)
Bit10
PWD_PRESC
0
Power-down Prescaler: (1=off)
Bit11
RSV
1
Reserved
Bit12
PWD_OUTBUF
1
Power-down Ouptut Buffer: (1=off)
Bit13
PWD_LO_DIV
1
Power-down LO divider block: (1=off)
Bit14
PWD_TX_DIV
1
Power-down TX divider block: (1=off)
Bit15
PWD_MOD
1
Power-down modulator block: (1=off)
Bit16
EN_EXTVCO
0
Enable external VCO input buffer: (1 = enabled)
Bit17
RSV
0
Reserved
Bit18
EN_ISOURCE
0
Enable offset current at CP output (frac-n mode only).
Bit19
LD_ANA_PREC<0>
0
Bit20
LD_ANA_PREC<1>
0
Control precision of Analog Lock Detector:
[00] = H/H (High), [01] = L/L (Low), [10] = H/L , [11] = L/L
Bit21
CP_TRISTATE<0>
0
Bit22
CP_TRISTATE<1>
0
Set the charge pump output in Tristate mode:
[00] = Off, [01] = Down, [10] = Up, [11] = Tristate
Bit23
SPEEDUP
0
Enable fast turn on/off time of bias blocks.
Bit24
LD_DIG_PREC
0
Lock detector precision (increases sampling time if set to 1)
Bit25
MOD_ORD<0>
1
Bit26
MOD_ORD<1>
0
Bit27
MOD_ORD<2>
1
Bit28
DITH_SEL
0
Dither Mode: [0] = pseudo-random, [1] = constant
Bit29
DEL_SD_CLK<0>
0
Bit30
DEL_SD_CLK<1>
1
DS modulator clock delay. Frac-n mode only.
[00] = Min delay, [11] = max delay
Bit31
EN_FRAC_MODE
0
Enable Frac-n mode when set to 1
Copyright © 2014, Texas Instruments Incorporated
Description
Register Address Bits
Modulator order (1-4). Not used in integer mode
(defaul 3rd order + dither)
47
TRF3722
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www.ti.com.cn
Table 11. Register 5
48
Register 5
Bit Name
Reset Value
Bit0
ADDR<0>
1
Description
Bit1
ADDR<1>
0
Bit2
ADDR<2>
1
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
RSV
0
Bit6
IB_MOD_GM<0>
0
Bit7
IB_MOD_GM<1>
1
Bit8
IB_MOD_LO<0>
0
Bit9
IB_MOD_LO<1>
1
Bit10
VCO_BIAS<0>
0
Bit11
VCO_BIAS<1>
0
Bit12
VCO_BIAS<2>
0
Bit13
VCO_BIAS<3>
1
Bit14
VCOBUF_BIAS<0>
0
Bit15
VCOBUF_BIAS<1>
1
Bit16
VCOMUX_BIAS<0>
0
Bit17
VCOMUX_BIAS<1>
1
Bit18
OUTBUF_BIAS<0>
0
Bit19
OUTBUF_BIAS<1>
1
Bit20
RSV
0
Bit21
RSV
1
Bit22
VCO_CAL_IB
0
Bit23
VCO_CAL_REF<0>
0
Bit24
VCO_CAL_REF<1>
0
Bit25
VCO_CAL_REF<2>
1
Bit26
VCO_AMPL_CTRL<0>
0
Bit27
VCO_AMPL_CTRL<1>
1
Bit28
VCO_VB_CTRL<0>
0
Bit29
VCO_VB_CTRL<1>
1
Adjusts the VCO core bias voltage:
[00] = 1.2 V, [01] = 1.35 V, [10] = 1.5 V, [11] = 1.65 V
Bit30
RSV
0
Reserved
Bit31
EN_LD_MON_ISOURCE
1
Enable monitoring of LD to turn on Isource; recommend [0] =
Isource ctrl
Register Address Bits
Reserved
Adjust modulator bias current gm
Adjust modulator BB and LO bias current
Adjust VCO bias reference current
Adjust VCO buffer reference current
Adjust VCO Mux reference current
Adjust output buffer current
Reserved
Bias current for CAL reference voltage: [0] = PTAT, [1] = Constant
VCO calibration reference voltage adjustment
[000] = 0.9 V, [111] = 1.4 V
[011] = recommended = 1.11 V
Adjusts the signal level at the VCO_MUX input:
[00] =max, [11] = min
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Table 12. Register 6
Register 6
Bit Name
Reset Value
Bit0
ADDR<0>
0
Bit1
ADDR<1>
1
Bit2
ADDR<2>
1
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
RSV
0
Bit6
RSV
0
Bit7
VCO_TRIM<0>
0
Bit8
VCO_TRIM<1>
0
Bit9
VCO_TRIM<2>
0
Bit10
VCO_TRIM<3>
0
Bit11
VCO_TRIM<4>
0
Bit12
VCO_TRIM<5>
1
Bit13
EN_LOCKDET
0
Enable monitor of lock detector output for autocal mode
Bit14
VCO_TEST_MODE
0
Counter mode, measure max and min freq for each VCO
Bit15
CAL_BYPASS
0
Bypass auto-cal; sets VCO_SEL and VCO_TRIM from Serial
interface
Bit16
MUX_CTRL<0>
1
Bit17
MUX_CTRL<1>
0
Bit18
MUX_CTRL<2>
0
Bit19
ISOURCE_SINKB
0
Bit20
ISOURCE_TRIM<0>
0
Bit21
ISOURCE_TRIM<1>
0
Bit22
ISOURCE_TRIM<2>
1
Bit23
LO_DIV_SEL<0>
0
Bit24
LO_DIV_SEL<1>
0
Bit25
LO_DIV_BIAS<0>
0
Bit26
LO_DIV_BIAS<1>
1
Adjust LO divider bias current:
[00] = 25 uA, [01] = 37.5 uA, [10] = 50 uA, [11] = 62.5 uA
Bit27
TX_DIV_SEL<0>
0
Adjust TX path divider.
Bit28
TX_DIV_SEL<1>
1
[00] = Div/1, [01] = Div/2, [10] = Div/4. [11] = Div/8
Bit29
TX_DIV_BIAS<0>
0
Bit30
TX_DIV_BIAS<1>
1
Adjust TX divider bias current:
[00] = 25 uA, [01] = 37.5 uA, [10] = 50 uA, [11] = 62.5 uA
Bit31
GAIN_CTRL
0
Modulator gain control: [0] = Default, [1] = High Gain
Copyright © 2014, Texas Instruments Incorporated
Description
Register Address Bits
Reserved
VCO capacitor array control bits;
used in manual cal mode
Select signal for test output:
[001] = LD, [010] = NDIV, [100] = RDIV, [110] = A_counter
Offset current polarity
Adjust Isource bias current in frac-n mode.
Adjust LO path divider:
[00] = Div/1, [01] = Div/2, [10] = Div/4. [11] = Div/8
49
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www.ti.com.cn
Table 13. READBACK Mode Summary Serial interface Map
Bit
Register 0
RDBK
Register Address
Register Address
Bit0
Bit1
Bit2
Bit3
Bit4
Bit5
CHIP_ID
Bit6
Bit7
Bit8
Bit9
NU
Bit10
Bit11
Bit12
R_SAT_ERR
Bit13
Bit14
Bit15
N/C
Bit16
VCO_TRIM
Bit17
Bit18
Bit19
Bit20
Bit21
Bit22
COUNT
VCO_SEL
Bit23
Bit24
Bit25
Bit26
Bit27
MUX_COUNT
Bit28
Bit29
RB_REG
Bit30
Bit31
50
MUX_COUNT
RB_ENABLE
Copyright © 2014, Texas Instruments Incorporated
TRF3722
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ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
Table 14. Register 0 (Readback Only)
Register 0
Bit Name
Reset Value
Bit0
ADDR<0>
0
Bit1
ADDR<1>
0
Bit2
ADDR<2>
0
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
CHIP_ID<0>
1
Bit6
CHIP_ID<1>
0
Bit7
NU
x
Bit8
NU
x
Bit9
NU
x
Bit10
NU
x
Bit11
NU
x
Bit12
R_SAT_ERR
x
Bit13
COUNT<0>/NU
x
Bit14
COUNT<1>/NU
x
Bit15
COUNT<2>/VCO_TRIM<0>
x
Bit16
COUNT<3>/VCO_TRIM<1>
x
Bit17
COUNT<4>/VCO_TRIM<2>
x
Bit18
COUNT<5>/VCO_TRIM<3>
x
Bit19
COUNT<6>/VCO_TRIM<4>
x
Bit20
COUNT<7>/VCO_TRIM<5>
x
Bit21
COUNT<8>/VCO_SEL<0>
x
Bit22
COUNT<9>/VCO_SEL<1>
x
Bit23
COUNT<10>/VCO_SEL<2>
x
Bit24
COUNT<11>
x
Bit25
COUNT<12>
x
Bit26
COUNT<13>
x
Bit27
COUNT<14>
x
Bit28
COUNT<15>
x
Bit29
COUNT<16>
x
Bit30
COUNT<17>
x
Bit31
MUX_COUNT
x
Copyright © 2014, Texas Instruments Incorporated
Description
Register Address Bits
Chip ID
Not Used
R-div saturation error for cal
VCO frequency counter high when
MUX_COUNT = 0 and VCO_TEST_MODE = 1
VCO frequency counter low when
MUX_COUNT = 1 and VCO_TEST_MODE = 1
Autocal results for VCO_TRIM and VCO_SEL when
VCO_TEST_MODE = 0
[0] = max freq count, [1] = min freq count
51
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www.ti.com.cn
Table 15. Register RDBK (Write Register for Readback)
52
RDBK
Bit Name
Reset Value
Bit0
ADDR<0>
0
Bit1
ADDR<1>
0
Bit2
ADDR<2>
0
Bit3
ADDR<3>
1
Bit4
ADDR<4>
0
Bit5
N/C
0
Bit6
N/C
0
Bit7
N/C
0
Bit8
N/C
0
Bit9
N/C
0
Bit10
N/C
0
Bit11
N/C
0
Bit12
N/C
0
Bit13
N/C
0
Bit14
N/C
0
Bit15
N/C
0
Bit16
N/C
0
Bit17
N/C
0
Bit18
N/C
0
Bit19
N/C
0
Bit20
N/C
0
Bit21
N/C
0
Bit22
N/C
0
Bit23
N/C
0
Bit24
N/C
0
Bit25
N/C
0
Bit26
N/C
0
Bit27
MUX_COUNT
0
Bit28
RB_REG<0>
x
Bit29
RB_REG<1>
x
Bit30
RB_REG<2>
x
Bit31
RB_ENABLE
1
Description
Register Address Bits
[0] = max freq count, [1] = min freq count
Three LSBs of the address for the register that is being read:
[001] = Register 1
[110] = Register 6
Puts device in Readback mode
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
9.5.1.1 BIAS SETTINGS
Optimum TRF7322 bias settings used in the performance measurements are shown in Table 16.
Table 16. Register Settings With Optimized Bias Set Used in the Performance Measurement.
REGISTER
BITS
TYPICAL OPERATING
MODE [256MHz-2GHz],
INT MODE
TYPICAL OPERATING
MODE [2GHz - 3GHz],
INT MODE
TYPICAL OPERATING
MODE [3GHz 4.1GHz], INT MODE
LOW POWER MODE,
INT MODE
FRACTIONAL MODE
REGISTER 1
RDIV
x
x
x
x
x
REGISTER 1
REF_INV
0
0
0
0
0
REGISTER 1
NEG_VCO
1
1
1
1
1
REGISTER 1
ICP
0
0
0
0
0
REGISTER 1
ICPDOUBLE
0
0
0
0
0
REGISTER 1
CAL_CLK_SEL
13
13
13
13
15
REGISTER 2
NINT
x
x
x
x
x
REGISTER 2
PLL_DIV_SEL
x
x
x
x
x
REGISTER 2
PRSC_SEL
x
x
x
x
x
REGISTER 2
VCO_SEL
x
x
x
x
x
REGISTER 2
VCO_SEL_MODE
x
x
x
x
x
REGISTER 2
CAL_ACC
0
0
0
0
0
REGISTER 2
EN_CAL
1
1
1
1
1
REGISTER 3
NFRAC
0
0
0
0
x
REGISTER 4
PWD_PLL
0
0
0
0
0
REGISTER 4
PWD_CP
0
0
0
0
0
REGISTER 4
PWD_VCO
0
0
0
0
0
REGISTER 4
PWD_VCO_MUX
0
0
0
0
0
REGISTER 4
PWD _DIV124
0
0
0
0
0
REGISTER 4
PWD_PRESC
0
0
0
0
0
REGISTER 4
PWD_OUTBUF
0
0
0
1
0
REGISTER 4
PWD_LO_DIV
0
0
0
1
0
REGISTER 4
PWD_TX_DIV
0
0
0
0
0
REGISTER 4
PWD_MOD
0
0
0
0
0
REGISTER 4
EN_EXTVCO
0
0
0
0
0
REGISTER 4
EN_ISOURCE
0
0
0
0
1
REGISTER 4
LD_ANA_PREC
0
0
0
0
3
REGISTER 4
CP_TRISTATE
0
0
0
0
0
REGISTER 4
SPEEDUP
0
0
0
0
0
REGISTER 4
LD_DIG_PREC
0
0
0
0
0
REGISTER 4
MOD_ORD
5
5
5
5
4
REGISTER 4
DITH_SEL
0
0
0
0
0
REGISTER 4
DEL_SD_CLK
2
2
2
2
0
REGISTER 4
EN_FRAC_MODE
0
0
0
0
1
REGISTER 5
IB_MOD_GM
3
3
2
0
3
REGISTER 5
IB_MOD_LO
0
1
0
0
0
REGISTER 5
VCO_BIAS
15
15
15
15
15
REGISTER 5
VCOBUF_BIAS
2
2
2
2
2
REGISTER 5
OUTBUF_BIAS
2
2
2
0
2
REGISTER 5
VCOMUX_BIAS
2
2
2
2
2
REGISTER 5
VCO_CAL_IB
0
0
0
0
0
REGISTER 5
VCO_CAL_REF
3
3
3
3
3
REGISTER 5
VCO_AMPL_CTRL
0
0
0
0
0
REGISTER 5
VCO_VB_CTRL
3
3
3
3
3
REGISTER 5
EN_LD_ISOURCE
0
0
0
0
0
Copyright © 2014, Texas Instruments Incorporated
53
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
Table 16. Register Settings With Optimized Bias Set Used in the Performance Measurement. (continued)
REGISTER
54
BITS
TYPICAL OPERATING
MODE [256MHz-2GHz],
INT MODE
TYPICAL OPERATING
MODE [2GHz - 3GHz],
INT MODE
TYPICAL OPERATING
MODE [3GHz 4.1GHz], INT MODE
LOW POWER MODE,
INT MODE
FRACTIONAL MODE
REGISTER 6
VCO_TRIM
x
x
x
x
x
REGISTER 6
EN_LOCKDET
0
0
0
0
0
REGISTER 6
VCO_TEST_MODE
0
0
0
0
0
REGISTER 6
CAL_BYPASS
0
0
0
0
0
REGISTER 6
MUX_CTRL
1
1
1
1
5
REGISTER 6
ISOURCE_SINKB
0
0
0
0
0
REGISTER 6
ISOURCE_TRIM
4
4
4
4
7
REGISTER 6
LO_DIV_SEL
x
x
x
x
x
REGISTER 6
LO_DIV_BIAS
2
2
2
0
2
REGISTER 6
TX_DIV_SEL
x
x
x
x
x
REGISTER 6
TX_DIV_BIAS
1
1
1
0
1
REGISTER 6
GAIN_CTRL
0
0
0
0
0
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
10 Applications and Implementation
10.1 Application Information
Figure 135 illustrates a typical application schematic for the TRF3722.
EXT VCO
BBI N IN
C11
R15
4.7pF
5V or 3.3V
Supply VCC_TNK
VCC_PLL
FB19
BBI P IN
VCC_VCO
R16
49.9
49.9
FB11
1K
1K
VCC_DIG
FB20
C40
1.0uF
C31
4.7pF
C47
0.1nF
C41
1.0uF
C32
4.7pF
C48
0.1nF
1K
VCC_MOD4
VCC_LO1
FB18
VCC_LO2
1
VTUNE
R41
200
1K
C62
1.0uF
LO OUTN
C39
1.0uF
C12
1K
C29
4.7pF
C46
0.1nF
47pF
VCC_MOD2
R22
49.9
1K
VCC_MOD3
VCC_PLL
CP OUT
FB23
VCC_LO_OUT
C27
10uF
1K
C42
1.0uF
C55
4.7pF
C56
0.1nF
1K
LE
DATA
CLOCK
READ BACK
R26
49.9
VCC_MOD4
FB24
C7
1K
47pF
LO OUTP
VCC_VCO
FB10
REFERENCE
GND
LO_OUTN
LO_OUTP
GND
CP_OUT
VCC_PLL
GND
REFIN
GND
LE
DATA
CLK
PWRPAD
U1
TRF3722
NC4
VCC_MOD4
GND
VCC_MOD3
GND
GND
RFOUT
GND
VCC_MOD2
GND
VCC_MOD1
NC3
24
23
22
21
20
19
18
17
16
15
14
13
C64
0.1nF
C63
4.7pF
C52
1.0uF
RF OUT
C18
4.7pF
VCC_MOD2
C54
0.1nF
C53
4.7pF
C38
1.0uF
1
2
3
4
5
6
7
8
9
10
11
12
VCC_MOD1
FB17
C44
1.0uF
37
38
39
40
41
42
43
44
45
46
47
48
49
VCC_MOD3
PD
RDBK
LD
VCC_DIG
GND
VCC_LO1
GND
BBQ_N
NC1
BBQ_P
GND
NC2
FB22
NC7
VCC_LO2
VTUNE
VCC_VCO
VCC_TK
EXT_VCO
GND
BBI_N
NC6
BBI_P
GND
NC5
36
35
34
33
32
31
30
29
28
27
26
25
VCC_LO2
FB21
3.3V
Supply
2
PD
VCC_MOD1
1K
VCC_LO_OUT
FB16
LD
C60
1.0uF
VCC_DIG
1K
VCC_LO1
C25
10uF
C43
1.0uF
C37
1.0uF
C28
4.7pF
C45
0.1nF
R13
49.9
BBQ N IN
R12
49.9
BBQ P IN
Figure 135. TRF3722 Application Schematic
10.1.1 Design Requirements
Table 17 lists the pin termination requirements and interfacing for the circuit.
Table 17. Termination Requirements and Interfacing
PIN
NAME
47
DATA
4WI data input: digital input, high impedance
DESCRIPTION
2
RDBK
Readback output; digital output pins can source or sink up to 8 mA of current
3
LD
8,10,27,29
BBI_P, BBI_N, BBQ_P,
BBQ_N
Lock detector digital output, as configured by MUX_CTRL
In-phase and quadrature baseband differential baseband signals. Typical 0.25V common mode is
needed
Modulator RF output: must be ac-coupled and can drive 50 Ω load
18
RFOUT
31
EXT_VCO
External local oscillator input: high impedance, normally ac-coupled. If unused terminate to 50 ohms load
38,39
LO_OUTP, LO_OUTN
Local oscillator output: open-collector output. A pull-up resistor is LO_OUT required, normally ac-coupled.
44
REFIN
46
LE
48
CLK
Serial interface clock input: digital input, high impedance
47
DATA
Serial interface data input: digital input, high impedance
Copyright © 2014, Texas Instruments Incorporated
Reference clock input: high impedance, normally ac-coupled
Serial interface latch enable: digital input, high impedance
55
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
10.1.2 Detailed Design Procedures, DAC to Modulator Interface Network
Digital-to-analog converter (DAC) can interface directly with the TRF3722 modulator. The common-mode voltage
of the DAC and the modulator baseband inputs should be properly maintained. With the proper interface
network, the common-mode voltage of the DAC can be translated to the proper common-mode voltage of the
modulator. The TRF3722 common-mode voltage is typically 0.25 V, and is ideally suited to interface with the
DAC3482/3484 (DAC348x) and DAC38J8x family. The interface network is shown in Figure 136.
50 W
50 W
DAC348x / DAC38J8X
50 W
50 W
50 W
50 W
50 W
~
0/90
50 W
S
TRF3722
Figure 136. DAC348x Interface with the TRF3722 Modulator
The DAC348x requires a load resistance of 25 Ω per branch to maintain its optimum voltage swing of 1-VPP
differential with a 20-mA max current setting. The load of the DAC is separated into two parallel 50-Ω resistors
placed on the input and output side of the low-pass filter. This configuration provides the proper resistive load to
the DAC while also providing a convenient 50-Ω source and load termination for the filter.
56
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
10.1.3 Application Curves, DAC34H84 with TRF3722 Modulator Performance
The cascaded combination of the DAC34H84 and TRF3722 modulator yields excellent system parameters
suitable for high-performance applications. Figure 137 and Figure 138 shows 152.9 MHz IF adjacent channel
power ratio (ACPR) performance.
• Mode integer
• PFD: 3.2 MHz
• Reference: 153.6 MHz
• LO = 1689.6 MHz
• IF = 152.9 MHz
• RF= 1842.5 MHz
Figure 137. 152.9 MHz IF, DAC34H84 + TRF3722 20 MHz
LTE ACPR
Figure 138. 152.9 MHz IF, 6 Carrier MC-GSM DAC34H84 +
TRF3722 ACPR Performance
11 Power Supply Recommendations
The TRF3722 is powered by supplying a nominal 3.3 V and 5 V. It can also be powered using only 3.3V supply.
Proper RF bypassing should be placed close to each power supply pin. Ground pin connections should have at
least one ground via close to each ground pin to minimize ground inductance. The PowerPAD™ must be tied to
ground, preferably with the recommended ground via pattern to provide a good thermal conduction path to the
alternate side of the board and to provide a good RF ground for the device. (Refer to Layout Guidelines section
for additional information.)
Copyright © 2014, Texas Instruments Incorporated
57
TRF3722
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
www.ti.com.cn
12 Layout
12.1 Layout Guidelines
Layout of the application board significantly impacts the analog performance of the TRF3722 device. Noise and
high-speed signals should be prevented from leaking onto power-supply terminals or analog signals. The
TRF3722 device is fitted with a ground slug on the back of the package that must be soldered to the printed
circuit board (PCB) ground with adequate ground vias to ensure a good thermal and electrical connection. The
ground pins of the device can be directly tied to the ground slug pad for a low-inductance path to ground.
Additional ground vias may be added if space allows. Follow these recommendations:
• Place supply decoupling capacitors physically close to the device, on the same side of the board. Isolate
supply terminals with a ferrite bead.
• Maintain a continuous ground plane in the vicinity of the device and as return paths for all high-speed signal
lines. Place reference plane vias or decoupling capacitors near any signal line reference transition.
• Power planes should not overlap each other or high-speed signal lines.
• Isolate REFIN routing from loop filter lines, control lines, and other high-speed lines.
12.2 Layout Example
RF &DC
Bypass
VCC
Capacitors
Baseband
Terminations
VCC
25 NC
26 GND
27 BBI_P
28 NC
29 BBI_N
30 GND
31 EXT_VCO
32 VCC_TK
33 VCC_VCO
34 VTUNE
35 VCC_LO2
36 NC
PLL Loop
Filter
24 NC
GND 37
LO Out
LO_OUTN 38
23
LO_OUTP 39
22 GND
VCC_MOD4
VCC
21 VCC_MOD3
GND 40
VCC
CP_OUT 41
20 GND
VCC_PLL 42
19 GND
17 GND
REFIN 44
DC Blocking
Capacitor
RF Out
RF Out
Capacitor
VCC
16 VCC_MOD2
GND 45
15 GND
LE 46
14 VCC_MOD1
DATA 47
RF &DC
Bypass
Capacitors
25 NC
13
NC 12
GND 11
BBQ_P 10
9
6
VCC_LO1
NC
5
GND
8
4
VCC_DIG
BBQ_N
3
LD
7
2
GND
1
PD
RDBK
CLK 48
Notes:
1.Ensure all components are connected to a
common RF/DC ground plane with plenty of vias
2. Ensure a low impedance VCC plane is
connected to all VCC terminals
Note: Ensure good RF microstrip or stripline
traces are used to connect the external
components to the REFIN, RF and LO output pins
18 RFOUT
GND 43
REFIN
RF &DC
Bypass
Capacitors
VCC
RF &DC
Bypass
Capacitors
Baseband
Terminations
Figure 139. Layout
58
Copyright © 2014, Texas Instruments Incorporated
TRF3722
www.ti.com.cn
ZHCSCN0A – MAY 2014 – REVISED JUNE 2014
13 器件和文档支持
13.1 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
14 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
Copyright © 2014, Texas Instruments Incorporated
59
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IMPORTANT NOTICE
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Copyright © 2014, 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TRF3722IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TRF3722
IRGZ
TRF3722IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TRF3722
IRGZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TRF3722IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
TRF3722IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRF3722IRGZR
VQFN
RGZ
48
2500
336.6
336.6
28.6
TRF3722IRGZT
VQFN
RGZ
48
250
213.0
191.0
55.0
Pack Materials-Page 2
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