MC13851
Document Number: MC13851
Rev. 2.0, 12/2010
MC13851
Package Information
Plastic Package:
2.0
MLPD-8
×
2.0
×
0.6 mm
Case: 2128-01
Device
MC13851EP
Ordering Information
Device Marking
851
Package
MLPD-8
The MC13851 is a cost-effective, high IP3 LNA with low noise figure. This is the smaller leadless package version of the MC13821 device. The MC13851 includes an integrated bypass switch to preserve high input intercept performance in variable signal strength environments and boosts dynamic range. On-chip bias circuitry offers low system cost. The input and output match are external to allow maximum design flexibility. An external resistor is used to set device current which allows balancing required linearity with low current consumption. Gain is optimized for applications greater than 1000 MHz. The
MC13851 is fabricated with the advanced RF BiCMOS process using the eSiGe:C module and is available in the
2
×
2 mm MLPD-8 leadless package, offering a small, low height, easy-to-solder solution for applications with tight printed circuit board placement requirements.
Contents:
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Electrical Specifications . . . . . . . . . . . . . . . . . . .3
3 Application Information . . . . . . . . . . . . . . . . . . . . 9
4 Printed Circuit and Bill of Materials . . . . . . . . . 20
5 Scattering and Noise Parameters . . . . . . . . . . . 22
6 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7 Product Documentation . . . . . . . . . . . . . . . . . . . 33
8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . 33
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006–2010. All rights reserved.
2
Introduction
1.1
Features
The MC13851 is intended for applications from 1000 MHz to 2500 MHz and the MC13852 is for applications less than 1000 MHz.
• Gain: 18.7 dB (typical) at 1960 MHz and 17.7 dB (typical) at 2140 MHz
• Output third order intercept point (OIP3): 16 dBm at 1960 MHz and 17 dBm (typical) dBm at
2140 MHz
• Noise Figure (NF): 1.37 dB (typical) at 1960 MHz and 1.46 dB at 2140 MHz
• Output 1 dB compression point (P1dB): 8 dBm (typical) at 1960 MHz and 8 dBm (typical) at
2140 MHz
• IP3 Boost Circuitry from Freescale
• Bypass mode has return losses comparable to active mode, for use in systems with filters and duplexers
• Bypass mode improves dynamic range in variable signal strength environments
• Integrated logic-controlled standby mode with current drain < 1uA
• Total supply current variable from 2.5 mA–5 mA using an external bias resistor
• In a receiver system with 20% active mode and 80% bypass mode, the average current drain is < 0.6 mA
• On-chip bias sets the bias point
• Bias stabilized for device and temperature variations
• MLPD-8 leadless package with low parasitics
• 1575 MHz, 1960 MHz, 2140 MHz and 2500 MHz application circuit evaluation boards with characterization data are available
• Available in tape and reel packaging
1.2
Applications
Ideal for use in any RF product that operates between 1000 MHz and 2.5 GHz, and may be applied in:
• Buffer amplifiers
• Mixers
• IF amplifiers
• Voltage controlled oscillators (VCOs)
• Use with transceivers requiring external LNAs
• Smart metering
• Mobile—Cellular front end LNA, GPS, two-way radios
• Consumer—WLAN, 802.11 b/g
• Auto—GPS, active antenna, wireless security
• Low current drain/long standby time for extended battery life applications
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Electrical Specifications
shows a simplified block diagram of the MC13851 with the pinouts and location of the Pin 1 designator on the package.
Pin 1 Identifier
Figure 1. Functional Block Diagram
. lists the maximum ratings for the device.
Table 1. Maximum Ratings (TA=25°C, unless otherwise noted)
Supply voltage
Storage temperature range
Operating ambient temperature range
RF input power
Power dissipation
Rating
Thermal resistance, junction to case
Thermal resistance, junction to ambient, 4 layer board
Symbol
Vcc
T stg
T
A
P
RF
Pdis
R thetaJC
R thetaJA
Value
3.3
-65–150
-30–85
10
100
24
90
°
°
Unit
Vdc
°
°
C
C dBm mW
C/W
C/W
Note: Maximum ratings
1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the recommended Operating Conditions and Electrical Characteristics tables.
2. ESD (electrostatic discharge) immunity meets Human Body Model (HBM)
≤
200V. Charge Device Model (CDM)
≤
450V, and
Machine Model (MM)
≤
50V
lists the recommended operating conditions.
Table 2. Recommended Operating Conditions
RF frequency range
Supply voltage
Characteristic Symbol f
RF
V
CC
Min
1000
2.3
Typ
—
2.75
Max
2500
3
Unit
MHz
V
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
3
Electrical Specifications
Table 2. Recommended Operating Conditions (continued)
Characteristic Symbol Min Typ Max Unit
Logic voltage
Input high voltage
Input low voltage
— 1.25
0
1.8
0
V
CC
0.80
Vdc
Vdc
shows the use of the Gain and Enable pins to select Active mode (High Gain), Bypass mode (Low
Gain) or Standby mode (Disable) operation.
Table 3. Truth Table
Enable Disable
Pin Function Pin Name
Logic Circuit Bias Vcc
Toggles Gain Mode (Active or Bypass)
Toggles LNA On/Off
Vcc
Gain
Enable
Notes:
1. Logic state 1 equals Vcc voltage. Logic state of 0 equals ground potential.
2. Vcc is inductively coupled to LNA Out pin and Vcc pin
3. Minimum logic state 1 for enable and gain pins is 1.25V
4. Maximum logic state 0 for enable and gain pins is 0.8V
Low Gain High Gain Low Gain High Gain
1
0
1
1
1
1
1
0
0
1
1
0
lists the electrical characteristics associated with noise performance measured in a 50
Ω
system.
Additional noise parameters are listed in Table 15
and
. Also listed are the typical Icc and RF turn
Table 4. Electrical Characteristics (Vcc = 2.75 V, Ta = 25°C)
Characteristic
Insertion Gain
R1=1.2 k
Ω
, Freq=1.575 GHz
R1=1.2 k
Ω
, Freq=2.14 GHz
R1=1.5 k
Ω
, Freq=1.575 GHz
R1=1.5 k
Ω
, Freq=2.14 GHz
Maximum Stable Gain and/or Maximum Available Gain [Note1]
R1=1.2 k
Ω
, Freq=1.575 GHz
R1=1.2 k
Ω
, Freq=2.14 GHz
R1=1.5 k
Ω
, Freq=1.575 GHz
R1=1.5 k
Ω
, Freq=2.14 GHz
Minimum Noise Figure
R1=1.2 k
Ω
, Freq=1.575 GHz
R1=1.2 k
Ω
, Freq=2.14 GHz
R1=1.5 k
Ω
, Freq=1.575 GHz
R1=1.5 k
Ω
, Freq=2.14 GHz
Symbol
|S21|
2
MSG, MAG
NFmin
Min
—
—
—
—
17.4
14.5
16.4
14.9
21.1
19.6
19
18.1
Typ
18.9
16
17.9
16.4
22.6
21.1
20.5
19.6
0.97
1.07
0.98
1.1
Max
1.3
1.4
1.3
1.4
—
—
—
—
—
—
—
—
Unit dB dB dB
4
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Electrical Specifications
Table 4. Electrical Characteristics (Vcc = 2.75 V, Ta = 25°C)
Characteristic Symbol Min
Associated Gain at Minimum Noise Figure
R1=1.2 k
Ω
, Freq=1.575 GHz
R1=1.2 k
Ω
, Freq=2.14 GHz
R1=1.5 k
Ω
, Freq=1.575 GHz
R1=1.5 k
Ω
, Freq=2.14 GHz
Icc and RF Turn On Time
Enable trigger total time of 1.8
μ second from 0 to 2.75 V
Icc rise time from 0 to 76% of final current level
Icc rise time from 0 to 87% of final current level
RF on time from leading edge of enable trigger to RF turn-on
Gnf
Note:
Maximum Available Gain and Maximum Stable Gain are defined by the K factor as follows:
MAG = |S21/S12(K
± sqrt(K2-1)) |, if K>1, MSG = |S21/S12|, if K<1
20.5
17
20.5
17.5
—
—
—
Typ
22
18.6
22
19
6.4
9.6
1.37
Max
—
—
—
—
—
—
—
Unit dB
μ s
lists the electrical characteristics measured on evaluation boards tuned for typical application frequencies when Rbias is 1.2 k
Ω
. Further details on the application circuits are shown in
Table 5. Electrical Characteristics Measured in Frequency Specific Tuned Circuits
(Vcc = 2.75V, TA = 25°C, Rbias =1.2k
Ω unless otherwise noted)
Characteristic
)
Frequency
Active RF Gain
Active Noise Figure
Active Input Third Order Intercept Point
Active Input 1dB Compression Point
Active Current @ 2.75V, Rbias=1.2k
Ω
Active Current @ 2.75V, Rbias=1.5k
Ω
Active Gain
Bypass RF Gain
Bypass Noise Figure
Bypass Input Third Order Intercept Point
Bypass Current
Bypass Gain
)
Frequency
Active RF Gain
Active Noise Figure
Active Input Third Order Intercept Point
Active Input 1dB Compression Point
Symbol f
G
NF
IIP3
P1dBoutput
Icc
Icc
S21
G
NF
IIP3
—
S21 f
G
NF
IIP3
P1dBoutput
Min
18
-6.5
—
24
—
-7
—
18.4
—
-6.5
6.3
—
—
—
17.7
—
-4
6
Typ
19
-5.5
6
25.5
4
-5.5
1575
19.4
1.28
-5
7.4
4.8
3.8
1960
18.7
1.37
-2.7
8
Max
—
—
1.65
—
—
Unit
MHz dB dB dBm dBm
MHz dB dB dBm dBm mA mA dB dB dB dBm
μ
A dB
—
—
7
—
20
—
—
—
1.6
—
—
5.8
4.8
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
5
Electrical Specifications
Table 5. Electrical Characteristics Measured in Frequency Specific Tuned Circuits (continued)
(Vcc = 2.75V, TA = 25°C, Rbias =1.2k
Ω unless otherwise noted)
Characteristic
Active Current @ 2.75V, Rbias=1.2k
Ω
Active Current @ 2.75V, Rbias=1.5k
Ω
Active Gain
Bypass RF Gain
Bypass Noise Figure
Bypass Input Third Order Intercept Point
Bypass Current
Bypass Gain
)
Frequency
Active RF Gain
Active Noise Figure
Active Input Third Order Intercept Point
Active Input 1dB Compression Point
Active Current @ 2.75V, Rbias=1.2k
Ω
Active Current @ 2.75V, Rbias=1.5k
Ω
Active Gain
Bypass RF Gain
Bypass Noise Figure
Bypass Input Third Order Intercept Point
Bypass Current
Bypass Gain
)
Frequency
Active RF Gain
Active Noise Figure
Active Input Third Order Intercept Point
Active Input 1dB Compression Point
Active Current @ 2.75V, Rbias=1.2k
Ω
Active Current @ 2.75V, Rbias=1.5k
Ω
Active Gain
Bypass RF Gain
Bypass Noise Figure
Bypass Input Third Order Intercept Point
Bypass Current
Bypass Gain
Symbol
Icc
Icc
S21
G
NF
IIP3
—
S21 f
G
NF
IIP3
P1dBoutput
Icc
Icc
S21
G
NF
IIP3
—
S21 f
G
NF
IIP3
P1dBoutput
Icc
Icc
S21
G
NF
IIP3
—
S21
Min
—
—
17.4
-6.5
—
24.5
—
-6.5
14.7
-6
—
24
—
-5.4
—
15
—
-0.2
7
—
—
16.5
-5.8
—
24.5
—
-5.7
—
16.7
—
-3
6.7
—
—
Typ
4.8
26
4
-5
4.8
3.8
18.4
-4.9
15.7
-5
5.2
25.3
4
-5
2400
16
1.52
2
8.1
4.8
3.8
17.6
-4.8
4.9
25.7
4
-4.7
2140
17.7
1.46
-0.5
8
4.8
3.8
—
—
5.8
—
20
—
—
—
1.8
—
—
5.8
4.8
—
—
5.9
—
20
—
—
—
1.75
—
—
5.8
4.8
Max
6.2
—
20
—
5.8
4.8
—
—
MHz dB dB dBm dBm mA mA dB dB dB dBm
μ
A dB
MHz dB dB dBm dBm mA mA dB dB dB dBm
μ
A dB
Unit mA mA dB dB dB dBm
μ
A dB
6
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Electrical Specifications
Figure 2 and Figure 3 show maximum stable and maximum available gain and forward insertion gain
versus frequency for the packaged device in a 50
Ω
system using bias resistors of 1.5 k
Ω
and 1.2 k
Ω
.
26
24
22
20
18
16
14
12
|S21|
2
MSG/MAG
MSG/MAG (dB)
|s21|^2 (dB)
10
1 1.2
1.4
1.6
1.8
2 2.2
2.4
2.6
Frequency (GHz)
Figure 2. Maximum Stable/Available Gain and Forward Insertion Gain vs. Frequency (Rbias = 1.5k
Ω)
26
24
22
20
18
16
14
12
MSG
|S21|
2
MAG
MSG/MAG (dB)
|s21|^2 (dB)
10
1 1.2
1.4
1.6
1.8
2 2.2
2.4
2.6
Figure 3. Maximum Stable/Available Gain and Forward Insertion Gain vs. Frequency (Rbias = 1.2 k
Ω)
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
7
Electrical Specifications
and
show minimum noise figure and associated gain versus frequency for the packaged device in a 50
Ω
system using bias resistors of 1.5 k
Ω
and 1.2 k
Ω
.
1.3
30
1.2
1.1
1
0.9
Gnf
NFmin 15
10
5
25
20
NFmin
Gnf
0.8
1 1.2
1.4
1.6
1.8
2 2.2
2.4
2.6
0
Frequency (GHz)
Figure 4. Minimum Noise Figure and Associated Gain vs. Frequency (Rbias = 1.5
k
Ω
)
1.3
1.2
1.1
Gnf
30
25
20
15
10
1
NFmin
Gnf
NFmin
0.9
5
0.8
1 1.2
1.4
1.6
1.8
2 2.2
2.4
2.6
0
Frequency (GHz)
Figure 5. Minimum Noise Figure and Associated Gain vs. Frequency (Rbias = 1.2
k
Ω
)
8
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
shows the Icc current drain for a range of values for the external bias resistor Rbias.
5
4.5
4
3.5
y = 1.5497x
2 ‐ 7.6446x
+ 11.822
R² = 0.981
3
2.5
Icc mA
Poly.
(Icc mA)
2
1.1
1.3
1.5
1.7
1.9
2.1
Rbias value (kohm)
Figure 6. Icc vs. Bias Resistor R1 Value
The MC13851 LNA is designed for applications in the 1000 MHz to 2.5 GHz range. It has three different modes: High Gain, Low Gain (bypass) and standby. The LNA is programmable through the Gain and
Enable pins. The logic truth table is given in
Table 3 . The internal bypass switch is designed for broadband
applications. One of the advantages of the MC13851 is the simplification of the matching network in both bypass and amplifier modes. The bypass switch is designed so that changes of input and output return losses between bypass mode and active mode are minimized and the matching network design is simplified. In these application examples a balance is made between the competing RF performance characteristics of Icc, NF, gain, IP3 and return losses with unconditional stability. Conjugate matching is not used for the input or output. Instead, matching which achieves a trade-off in RF performance qualities is used. For a particular application or specification requirement, the matching can be changed to achieve enhanced performance of one parameter. Measurements are made at a bias of Vcc=2.75 V. Frequency spacing for IP3 measurements is 200 kHz. Non-linear measurements are made at Pin = -30 dBm. Typical application circuits are provided for 1575 MHz, 1960 MHz, 2140 MHz and 2.4 GHz applications. Typical
RF performance is shown for two values of bias resistor R1: 1.2 k
Ω
and 1.5 k
Ω
. These two current drain levels offer variations in intercept point, gain and noise figure. Included with each application are the
schematics and electrical performance. Section 4, “Printed Circuit and Bill of Materials
” provides the
” provides Smith charts with gain and noise circles for each application frequency.
3.1
1575 MHz Application
This application was designed to provide typical NF = 1.28 dB, S21 gain = 19 dB, OIP3 =14.5 dBm with return losses better than -10 dB at 1575 MHz. Typical performance that can be expected from this circuit at 2.75V is listed in
Table 6 . The component values can be changed to enhance the performance of a
particular parameter, but usually at the expense of another. Two values of bias resistor R1 are shown to
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
9
Application Information demonstrate performance for different IP3 and Icc requirements. Inductor L3 provides bias to the logic circuit.
is the 1575 MHz application schematic with package pinouts and the circuit component topology.
C1
22 pF
L1
4.7 nH
RF IN
5 4
Gnd
Enable
Gain
6
7
8
Logic
3
2
1
L2
R1
1.2 k
R2
10
Rbias
C2
1 pF
R3
150
RF
OUT
5.1 nH
Gnd
L3
270 nH
C3
33 pF
Figure 7. 1575 MHz Application Schematic
shows the electrical characteristics for the 1575 MHz evaluation board.
Table 6. Typical 1575 MHz Evaluation Board Performance
(Vcc = 2.75V, T
A
= 25° C )
R1=1.2 K
Ω
Frequency
Characteristic
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Symbol f
G
OIP3
IIP3
P1dBout
P1dBin
NF
Icc
—
Min
—
18.4
-6.5
13.2
19
-6.5
24
6.3
-13.3
—
—
—
—
—
Typ
1575
19.4
-5.5
14.5
20.3
-5
25.5
7.4
-12
1.28
6
4.8
4
1.2
Max
—
—
—
—
—
—
—
—
—
1.6
7
5.8
20
—
C4
.01 uF
Vcc
Unit
MHz dB dBm dBm dBm dBm dB mA
μ
A k
Ω
10
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
Table 6. Typical 1575 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, T
A
= 25° C )
Symbol Min Typ Max Unit Characteristic
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
R1=1.5 k
Ω
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
S11
S21
S12
S22 f
G
OIP3
IIP3
P1dBout
P1dBin
NF
Icc
—
S11
S21
S12
—
—
18
-7
—
—
—
—
—
18
-6.5
13.9
19
-5.5
24
6.6
-13.5
—
—
—
—
—
—
—
17.9
-6.5
—
—
-11
-11
19
-5.5
-27
-5.7
-14.9
-18
1575
19
-5.5
15.9
20.3
-3.2
26
7.6
-11.5
1.27
5.9
3.8
4
1.5
-10.6
-11.5
18.9
-5.5
-25.9
-5.6
-8
-8
—
—
-25
-4.4
-9
-9
—
—
—
—
—
—
—
—
—
1.6
6.9
4.8
20
—
-8.6
-10
—
—
-24.5
-4.6
dB dB dB dB
MHz dB dBm dBm dBm dBm dB mA
μ
A k
Ω dB dB dB
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
11
Application Information
Table 6. Typical 1575 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, T
A
= 25° C )
Symbol Min Typ Max Unit Characteristic
Output Return Loss
High Gain
Bypass
S22 —
—
-13
-18
-9
-12 dB
3.2
1960 MHz Application
These application circuits are designed to demonstrate performance at 1960 MHz. Typical results of
NF = 1.4 dB, S21 gain > 18 dB and OIP3 of 16 dBm. Two values of bias resistor R1 are shown to demonstrate performance for different IP3 and Icc requirements. Resistor R3 is used to de-Q output inductor L2 and adjust gain and return losses. Inductor L3 provides bias to the logic circuit. Reducing R3 lowers gain and improves return losses. Typical performance that can be expected from this circuit at 2.75
V is listed in
is the 1960 MHz application schematic with package pinouts and the circuit component topology.
C1
2.4 pF
L1
5.1 nH
Enable
5
8
4
RF IN
Gain
6
7 Logic
3
2
1
Gnd
R1
1.2 k
R2
10
Rbias
C2
0.9 pF
L2
3.3 nH
R3
620
RF
OUT
Gnd
L3
2 70 nH
C3
33 pF
Figure 8. 1960 MHz Application Schematic
shows the electrical characteristics for the 1960 MHz evaluation board.
Table 7. Typical 1960 MHz Evaluation Board Performance
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
R1=1.2 K
Ω
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass f
G
OIP3
—
17.7
-6.5
14
19.2
1960
18.7
-4.9
16
20.9
—
—
—
—
—
C4
.01 uF
Vcc
Unit
MHz dB dBm
12
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
Table 7. Typical 1960 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
R1=1.5 k
Ω
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
IIP3
P1dBout
P1dBin
NF
Icc
—
S11
S21
S12
S22 f
G
OIP3
IIP3
-4
24.5
6
-13
—
—
—
—
—
—
—
17.4
-6.5
—
—
—
—
—
17.5
-6.8
16.1
19.1
-3
24.5
-2.7
26
8
-10.5
1.37
4.8
4.8
4
1.2
-10
-11
18.4
-5
-25
-4.8
-14
-14.8
1960
18.5
-5
17.1
20.9
-1.5
26
—
—
—
—
1.65
6.2
5.8
20
—
-7
-8
—
—
-23.5
-3
-8
-10
—
—
—
—
—
—
—
Unit dBm dBm dBm dB mA
μ
A k
Ω dB dB dB dB
MHz dB dBm dBm
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
13
Application Information
Table 7. Typical 1960 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
P1dBout
P1dBin
NF
Icc
—
S11
S21
S12
S22
5.6
-13
—
—
—
—
—
—
—
17
-6.5
—
—
—
—
8
-10.5
1.35
4.9
3.8
4
1.5
-9
-11
18
-5
-24.5
-4.5
-12.5
-15
—
—
1.65
6.2
4.8
20
—
-6.5
-8
—
—
-22.5
-4
-7
-10
Unit dBm dBm dB mA
μ
A k
Ω dB dB dB dB
3.3
2140 MHz Application
These application circuits demonstrate performance at 2140 MHz. Matching component values can be changed to enhance a particular parameter. Typical performance expected from this circuit at 2.75V Vcc is listed in
Table 8 . Two values of bias resistor R1 are shown to demonstrate performance for different IP3
and Icc requirements. The same matching topology is used on each of the application circuits, with a highpass match on the output and a simple inductor-capacitor network on the LNA input. Resistor R3 is used to de-Q output inductor L2 and adjust gain and return losses. Lowering the value of R3 lowers gain and improves return losses.
14
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
is the 2140 MHz application schematic with package pinouts and the circuit component topology.
RF IN
C1
2.4 pF
L1
4.7 nH
5 4
Gnd
Enable
Gain
6
7
8
Logic
3
2
1
R1
1.2 k
R2
10
Rbias
C2
0.9 pF
L2
2.7 nH
R3
620
RF
OUT
Gnd
L3
270 nH
C3
33 pF
Figure 9. 2140 MHz Application Schematic
C4
.01 uF
Vcc
shows the electrical characteristics for the 2140 MHz evaluation board.
Table 8. Typical 2140 MHz Evaluation Board Performance
(Vcc = 2.75V, Ta = 25°C)
Characteristic
R1=1.2 K
Ω (
Refer to
)
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Symbol f
G
OIP3
IIP3
P1dB
P1dB
NF
Icc
—
Min
—
16.7
-5.8
15.5
20
-3
24.5
6.7
-11
—
—
—
—
—
Typ
2140
17.7
-4.8
17.1
21
-0.5
25.7
8
-9.6
1.46
4.9
4.8
4
1.2
Max
—
—
—
—
—
—
—
—
—
1.75
5.9
5.8
20
—
Unit
MHz dB dBm dBm dBm dBm dB mA
μ
A k
Ω
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
15
Application Information
Table 8. Typical 2140 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
R1=1.5 K
Ω
(Refer to
)
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
S11
S21
S12
S22 f
G
OIP3
IIP3
P1dB
P1dB
NF
Icc
—
S11
—
—
16.5
-5.7
—
—
—
—
—
16.4
-5.8
16
19.5
-2
24.7
7
-10.3
—
—
—
—
—
—
—
-10.5
-13.5
17.6
-4.7
-24.7
-4.5
-11
-20.8
2140
17.4
-4.8
18
21
0.9
25.7
8
-9.3
1.46
4.7
3.8
4
1.5
-9.6
-13
-7
-10
—
—
-23.7
-4
-8
-10
—
—
—
—
—
—
—
—
—
1.75
5.3
4.8
20
—
-8
-9
Unit dB dB dB dB
MHz dB dBm dBm dBm dBm dB mA
μ
A k
Ω dB
16
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
Table 8. Typical 2140 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
S21
S12
S22
16.5
-5.4
—
—
—
—
17.4
-4.7
-24
-4.6
-10.6
-21
—
—
21.6
4.1
-8
-10
Unit dB dB dB
3.4
2400 MHz Application
This application was designed to provide NF =1.5 dB, S21 gain > 16 dB, OIP3 of 17.5 dBm with return losses better than -9 dB at 2400 MHz. Typical performance that can be expected from this circuit at 2.7V is listed in
Table 9 . Two values of bias resistor R1 are shown to demonstrate performance for different IP3
and Icc requirements. Resistor R3 is used to de-Q output inductor L2 and adjust gain and return losses.
Lowering the value of R3 lowers gain and improves return losses.
is the 2400 MHz application schematic with package pinouts and the circuit component topology.
Figure 10. 2400 MHz Application Schematic
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
17
Application Information
shows the electrical characteristics for the 2400 MHz evaluation board.
Table 9. Typical 2400 MHz Evaluation Board Performance
(Vcc = 2.75V, Ta = 25°C)
Characteristic
R1=1.2 K
Ω
)
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass
Symbol f
G
OIP3
IIP3
P1dB
P1dB
NF
Icc
—
S11
S21
S12
S22
Min
15
-5.5
16
18.5
-0.2
24
7
-9
—
—
—
—
—
—
—
14.7
-5.4
—
—
—
—
Typ
2400
16
-5
17.5
20
1.3
25.3
8.1
-8
1.51
5.2
4.8
4
1.2
-12.5
-14
15.7
-5
-23.6
-5.5
-12
-22.5
Max
—
—
—
—
—
—
—
—
1.8
5.8
5.8
20
—
-9
-10
—
—
-22.6
-4.5
-9
-20 dBm dBm dBm dBm dB mA
μ
A k
Ω dB dB dB dB
Unit
MHz dB
18
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Application Information
Table 9. Typical 2400 MHz Evaluation Board Performance (continued)
(Vcc = 2.75V, Ta = 25°C)
Symbol Min Typ Max Characteristic
R1=1.5 K
Ω
)
Frequency
RF Gain
High Gain
Bypass
Output Third Order Intercept Point
High Gain
Bypass
Input Third Order Intercept Point
High Gain
Bypass
Out Ref P1dB
High Gain
In Ref P1dB
High Gain
Noise Figure
High Gain
Bypass
Current Draw
High Gain
Bypass
Rbias R1 Value
Input Return Loss
High Gain
Bypass
Gain
High Gain
Bypass
Reverse Isolation
High Gain
Bypass
Output Return Loss
High Gain
Bypass f
G
OIP3
IIP3
P1dB
P1dB
NF
Icc
—
S11
S21
S12
S22
—
14.9
-6
16
19.2
-0.2
24.3
7
-8.8
—
—
—
—
—
—
—
14.4
-6
—
—
—
—
2400
15.9
-5
18
20.4
2
25.3
7.9
-7.8
1.52
5.2
3.8
4
1.5
-10.7
-14.5
15.4
-5.1
-23.3
-5.5
-11.3
-21.9
—
—
—
—
—
—
—
—
—
1.8
6
4.8
20
—
-9
-12
—
—
-22
-4.5
-8.5
-15
Unit
MHz dB dBm dBm dBm dBm dB mA
μ
A k
Ω dB dB dB dB
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
19
Printed Circuit and Bill of Materials
is the drawing of the printed circuit board. Figure 13 is the drawing of the evaluation board used
for each of the application frequency designs described in
Section 3, “Application Information
.” These drawings show the boards with the circuit matching components placed and identified.
Note: Dimensions are in inches and [mm].
Soldering Note: The center flag under the part must be soldered to board.
Figure 11. Printed Circuit Board
is a picture of a typical assembled evaluation board similar to the ones in the evaluation kits.
Figure 12. Typical Assembled Evaluation Board with SMA Connectors
20
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Printed Circuit and Bill of Materials
Figure 13. 1575-, 1960-, 2140-, 2400 MHz Application Board
The bill of materials for each of the application frequency circuit boards is listed in
case size, manufacturer and circuit function of each component are shown.
Table 10. Bill of Materials for the Application Circuit Boards
Component Value Case Manufacturer
1575 MHz Application Circuit (see Figure 7
C4
L1
L2
L3
C1
C2
C3
R1
R2
R3
L1
L2
L3
R1
C1
C2
C3
C4
R2
R3
22 pF
1 pF
33 pF
0.1
μ
F
4.7 nH
5.1 nH
270 nH
1.2 k
Ω
10
Ω
150
Ω
402
402
402
402
402
402
402
402
402
402
1900 MHz Application Circuit (see Figure 8 )
Murata
Murata
Murata
Murata
Murata
Murata
Murata
KOA
KOA
KOA
2.4pF
0.9 pF
33 pF
.01
μ
F
5.1 nH
3.3 nH
270 nH
1.2 k
Ω
15
Ω
620
402
402
402
805
402
402
402
402
402
402
Murata
Murata
Murata
Murata
Murata
Murata
Murata
KOA
KOA
KOA
Comments
DC block, input match
DC block, output match
RF bypass
Low frequency bypass
Input match
Output match, bias decouple
Bias couple to logic
Bias set point
Stability
L2 de-Q, gain adjust
Input match
Output match
RF bypass
Low frequency bypass
Input match
Output match
Bias couple to logic
LNA bias
Stability
De-Q L2, adjust gain, RLs
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
21
Scattering and Noise Parameters
Table 10. Bill of Materials for the Application Circuit Boards (continued)
Component Value Case Manufacturer
2140 MHz Application Circuit (see Figure 9 )
L1
L2
L3
R1
C1
C2
C3
C4
R2
R3
2.4pF
0.9 pF
33 pF
.01
μ
F
4.7 nH
2.7
270 nH
1.2 k
Ω
10
Ω
620
402
402
402
402
402
402
402
805
402
402
Murata
Murata
Murata
Murata
Murata
Murata
Murata
KOA
KOA
KOA
Comments
Input match
Output match
RF bypass
Low frequency bypass
Input match
Output match
Bias couple to logic
LNA bias
Stability
De-Q L2, adjust gain, RLs
2400 MHz Application Circuit (see Figure 10 )
C4
L1
L2
L3
C1
C2
C3
R1
R2
R3
2.4pF
0.9 pF
33 pF
.01
μ
F
3.6 nH
2
270 nH
1.2 k
Ω
10
Ω
620
402
402
402
805
402
402
402
402
402
402
Murata
Murata
Murata
Murata
Murata
Murata
Murata
KOA
KOA
KOA
Input match
Output match
RF bypass
Low frequency bypass
Input match
Output match
Bias couple to logic
LNA bias
Stability
De-Q L2, adjust gain, RLs
through
list the S parameters for the packaged part in a 50
Ω
system for each of the modes of operation and for two values of the external bias resistor.
Table 11. Scattering Parameters, Active Mode, Rbias=1.2k
Ω
(Vcc = 2.75V, 25°C, 50
Ω
system) f (MHz)
1000
1050
1100
1150
1200
1250
1300
S11
Mag
0.712
0.696
0.679
0.663
0.651
0.634
0.619
Ang
-19.7
-20.3
-21.2
-21.7
-21.9
-22.2
-22.4
S21
Mag
10.508
10.318
10.132
9.947
9.742
9.552
9.413
Ang
145.3
144.3
143.1
142.2
141.0
140.2
139.3
S12
Mag
0.027
0.029
0.030
0.031
0.033
0.034
0.035
Ang
94.1
94.3
94.8
94.8
95.1
95.6
96.4
S22
Mag
0.913
0.904
0.896
0.886
0.875
0.870
0.861
Ang
9.6
10.0
10.5
10.7
10.8
11.0
11.2
22
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
1000
1050
1100
1150
1200
1250
Scattering and Noise Parameters
2100
2150
2200
2250
2300
2350
2400
2450
2500
2550
2600
1700
1750
1800
1850
1900
1950
2000
2050
1350
1400
1450
1500
1550
1600
1650 f (MHz)
Table 11. Scattering Parameters, Active Mode, Rbias=1.2k
Ω (continued)
(Vcc = 2.75V, 25°C, 50
Ω
system)
S11
Mag
0.313
0.28
0.251
0.309
0.367
0.364
0.351
0.338
0.323
0.319
0.308
0.538
0.519
0.505
0.486
0.448
0.435
0.415
0.376
0.607
0.597
0.587
0.576
0.571
0.571
0.556
Ang
-44.8
-37.0
-29.5
-16.2
-24.7
-30.5
-35.0
-37.9
-40.5
-41.4
-43.6
-29.7
-31.3
-33.5
-35.7
-37.5
-37.8
-41.7
-45.4
-22.9
-23.3
-23.6
-23.9
-24.4
-26.2
-28.2
S21
Mag
6.708
6.321
5.956
6.073
6.554
6.756
6.542
6.459
6.304
6.168
6.047
8.420
8.284
8.129
8.009
7.735
7.564
7.421
7.155
9.242
9.069
8.977
8.813
8.806
8.693
8.583
Ang
121.6
121.8
125.2
130.1
129.3
126.9
124.4
122.8
121.6
120.6
119.6
131.8
130.8
129.5
128.3
126.4
126.2
124.4
122.5
138.3
138.0
137.0
136.2
135.9
134.7
133.0
S12
Mag
0.059
0.052
0.044
0.037
0.050
0.058
0.062
0.065
0.066
0.067
0.068
0.051
0.052
0.054
0.057
0.058
0.058
0.061
0.063
0.036
0.038
0.040
0.042
0.044
0.049
0.050
Ang
80.1
79.7
78.1
100.5
110.1
108.1
104.0
102.4
100.3
100.7
99.4
96.5
96.4
96.1
95.2
91.7
92.2
90.4
86.6
97.3
98.5
99.3
100.3
101.5
100.1
97.4
S22
Mag
0.569
0.541
0.561
0.648
0.694
0.678
0.648
0.627
0.613
0.608
0.606
0.779
0.764
0.751
0.737
0.700
0.688
0.662
0.618
0.854
0.851
0.847
0.845
0.846
0.840
0.802
Ang
6.2
11.7
18.1
20.3
14.8
9.3
8.3
7.8
8.1
8.1
7.1
5.2
5.5
4.1
3.7
7.4
7.2
6.8
5.6
11.5
11.6
11.4
11.1
10.2
8.2
7.2
f (MHz)
Table 12. Scattering Parameters, Active Mode, Rbias=1.5k
Ω
(Vcc = 2.75V, 25°C, 50
Ω
system)
S11
Mag
0.754
0.739
0.721
0.709
0.698
0.682
Ang
-17.9
-18.6
-19.4
-19.9
-20.3
-20.6
S21
Mag
9.171
9.055
8.902
8.774
8.629
8.517
Ang
150.9
149.8
148.7
147.9
146.8
146.2
S12
Mag
0.028
0.029
0.031
0.032
0.033
0.035
Ang
94.9
95.2
95.0
95.4
95.6
96.3
S22
Mag
0.941
0.933
0.927
0.918
0.910
0.907
Ang
10.7
11.1
11.7
11.8
12.0
12.2
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
23
Scattering and Noise Parameters
2050
2100
2150
2200
2250
2300
2350
2400
2450
2500
2550
2600
1650
1700
1750
1800
1850
1900
1950
2000
1300
1350
1400
1450
1500
1550
1600 f (MHz)
Table 12. Scattering Parameters, Active Mode, Rbias=1.5k
Ω (continued)
(Vcc = 2.75V, 25°C, 50
Ω
system)
S11
Mag
0.489
0.475
0.467
0.454
0.436
0.409
0.390
0.378
0.369
0.359
0.356
0.348
0.586
0.577
0.560
0.548
0.528
0.513
0.509
0.500
0.667
0.654
0.640
0.625
0.611
0.595
0.591
Ang
-32.4
-33.9
-34.2
-37.8
-39.4
-41.7
-40.9
-41.5
-42.2
-43.2
-44.0
-44.7
-24.0
-25.1
-26.7
-28.0
-28.8
-28.8
-29.0
-31.2
-21.2
-21.9
-22.5
-22.8
-23.0
-23.1
-23.1
S21
Mag
6.832
6.707
6.660
6.588
6.538
6.508
6.467
6.181
6.079
5.945
5.825
5.680
7.619
7.505
7.410
7.283
7.154
7.006
6.929
6.861
8.444
8.318
8.150
8.093
7.908
7.910
7.668
Ang
134.8
134.5
133.1
133.3
132.1
130.5
129.7
128.3
127.5
126.8
126.3
125.7
139.9
139.2
138.5
137.6
136.9
136.3
136.3
135.6
145.1
144.0
143.8
142.6
141.9
141.3
140.8
S12
Mag
0.058
0.060
0.062
0.063
0.065
0.066
0.067
0.067
0.068
0.068
0.069
0.069
0.046
0.048
0.049
0.050
0.052
0.053
0.054
0.056
0.036
0.037
0.039
0.040
0.041
0.043
0.044
Ang
101.1
100.5
101.1
99.6
100.1
98.0
98.2
97.2
97.5
97.6
97.8
98.1
99.0
99.0
99.1
99.4
99.6
98.7
99.8
100.1
96.3
96.4
97.1
97.3
97.6
98.2
98.5
S22
Mag
0.773
0.770
0.750
0.745
0.730
0.714
0.693
0.671
0.659
0.651
0.652
0.652
0.841
0.829
0.821
0.813
0.807
0.794
0.789
0.781
0.897
0.888
0.884
0.876
0.871
0.863
0.861
Ang
10.7
10.2
9.6
9.2
8.6
8.4
7.3
8.6
9.7
10.7
11.4
11.9
11.5
11.8
11.9
11.7
11.5
11.4
11.5
11.1
12.2
12.4
12.6
12.6
12.6
12.2
11.8
f (MHz)
1000
1050
1100
1150
1200
Table 13. Scattering Parameters, Bypass Mode, Rbias=1.2k
Ω and 1.5k
Ω
(Vcc = 2.75V, 25°C, 50 Ω system)
S11
Mag
0.356
0.340
0.327
0.312
0.298
Ang
-25.9
-24.6
-23.0
-21.4
-20.3
S21
Mag
0.658
0.663
0.667
0.671
0.674
Ang
25.8
24.9
24.0
23.3
22.6
S12
Mag
0.646
0.651
0.655
0.659
0.662
Ang
25.2
24.3
23.5
22.7
22.0
S22
Mag
0.402
0.387
0.373
0.359
0.347
Ang
-12.4
-11.3
-9.9
-8.2
-6.5
24
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Scattering and Noise Parameters
Table 13. Scattering Parameters, Bypass Mode, Rbias=1.2k
Ω and 1.5k
Ω (continued)
(Vcc = 2.75V, 25°C, 50 Ω system) f (MHz)
2000
2050
2100
2150
2200
2250
2300
2350
2400
2450
2500
2550
2600
1600
1650
1700
1750
1800
1850
1900
1950
1250
1300
1350
1400
1450
1500
1550
S11
Mag
0.186
0.182
0.180
0.185
0.185
0.187
0.186
0.185
0.181
0.178
0.177
0.174
0.171
0.235
0.226
0.220
0.211
0.197
0.199
0.202
0.194
0.288
0.275
0.263
0.253
0.248
0.250
0.244
Ang
-4.4
-3.6
-4.2
-4.3
-5.5
-8.3
-10.1
-12.0
-14.1
-16.8
-19.8
-23.6
-27.4
-10.0
-10.2
-9.5
-8.5
-6.2
-1.7
-3.2
-5.0
-18.7
-16.7
-14.8
-12.6
-10.0
-9.6
-10.4
S21
Mag
0.687
0.682
0.686
0.689
0.695
0.695
0.697
0.694
0.696
0.695
0.694
0.691
0.686
0.689
0.690
0.690
0.689
0.685
0.682
0.688
0.688
0.677
0.678
0.679
0.678
0.675
0.680
0.687
Ang
16.1
16.2
16.3
16.2
15.7
15.2
14.6
14.2
13.7
13.1
12.5
11.8
11.2
18.9
18.5
17.8
17.4
16.9
17.3
17.0
16.5
21.8
21.2
20.6
20.0
19.9
20.0
19.5
S12
Mag
0.677
0.673
0.676
0.680
0.685
0.685
0.688
0.685
0.686
0.681
0.680
0.677
0.673
0.678
0.680
0.680
0.679
0.675
0.673
0.679
0.678
0.665
0.667
0.668
0.667
0.664
0.669
0.676
Ang
15.8
15.8
15.9
15.9
15.4
14.9
14.3
13.8
13.4
12.5
11.9
11.2
10.6
18.5
18.0
17.3
17.0
16.4
16.9
16.6
16.1
21.4
20.7
20.1
19.6
19.5
19.6
19.1
S22
Mag
0.213
0.204
0.198
0.192
0.186
0.185
0.178
0.173
0.168
0.159
0.155
0.150
0.143
0.272
0.267
0.260
0.253
0.245
0.235
0.229
0.223
0.336
0.326
0.318
0.311
0.306
0.289
0.279
Ang
8.4
8.1
9.5
11.2
10.4
9.3
7.5
7.0
4.1
2.0
-1.7
-5.6
-9.1
6.8
7.3
8.5
9.4
3.7
4.9
6.3
6.9
-4.7
-3.4
-1.9
-0.7
-0.3
0.9
2.1
f (MHz)
1000
1050
1100
1150
Table 14. Scattering Parameters, Standby Mode, Rbias=1.2k
Ω and 1.5k
Ω
(Vcc = 2.75V, 25°C, 50 Ω system)
S11
Mag
0.939
0.935
0.934
0.931
Ang
2.1
2.2
2.5
2.7
S21
Mag
0.031
0.033
0.035
0.037
Ang
104.0
104.4
104.8
105.2
S12
Mag
0.031
0.033
0.034
0.036
Ang
103.1
103.8
104.2
104.4
S22
Mag
0.991
0.990
0.988
0.986
Ang
12.9
13.3
13.5
14.0
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
25
Scattering and Noise Parameters
Table 14. Scattering Parameters, Standby Mode, Rbias=1.2k
Ω and 1.5k
Ω (continued)
(Vcc = 2.75V, 25°C, 50 Ω system) f (MHz)
S11
Mag
0.844
0.838
0.829
0.820
0.807
0.791
0.866
0.855
0.843
0.844
0.848
0.853
0.853
0.850
0.907
0.904
0.900
0.896
0.886
0.871
0.859
0.871
0.926
0.924
0.920
0.914
0.906
0.896
0.901
Ang
-3.9
-5.1
-6.5
-7.9
-9.4
-11.2
-0.2
-0.9
-2.1
-3.1
1.0
0.4
0.5
0.3
1.3
1.1
2.3
2.1
3.3
2.9
2.4
1.7
2.7
2.6
2.8
2.9
2.9
3.3
3.7
2350
2400
2450
2500
2550
2600
1950
2000
2050
2100
2150
2200
2250
2300
1550
1600
1650
1700
1750
1800
1850
1900
1200
1250
1300
1350
1400
1450
1500
S21
Mag
0.110
0.113
0.116
0.119
0.122
0.125
0.078
0.081
0.086
0.093
0.100
0.103
0.105
0.106
0.054
0.056
0.059
0.061
0.064
0.068
0.074
0.075
0.039
0.041
0.043
0.045
0.047
0.048
0.051
Ang
99.2
97.0
96.2
93.5
91.3
88.1
109.2
109.1
110.1
108.8
106.5
103.2
101.6
99.8
108.6
108.4
108.8
109.2
109.7
111.0
109.8
108.1
105.4
105.8
105.8
106.1
106.4
106.9
108.4
provides the active mode noise parameters when the bias resistor is 1.2 k
Ω
.
Table 15. Active Mode Noise Parameters, Rbias=1.2k
Ω
(Vcc = 2.75V, 25 0C, 50
Ω
system, Icc=4.6 mA)
S12
Mag
0.109
0.111
0.114
0.117
0.120
0.122
0.076
0.080
0.085
0.092
0.099
0.101
0.104
0.105
0.053
0.056
0.058
0.061
0.063
0.067
0.073
0.074
0.038
0.040
0.042
0.044
0.046
0.048
0.050
Ang
98.7
96.4
95.2
92.6
90.6
87.4
108.7
108.9
109.8
108.4
106.0
102.8
101.0
99.4
107.9
108.0
108.3
108.6
109.2
110.4
109.4
107.5
104.7
105.2
105.3
105.5
105.9
106.2
107.8
S22
Mag
0.891
0.887
0.877
0.867
0.858
0.840
0.935
0.929
0.923
0.920
0.916
0.911
0.907
0.901
0.965
0.964
0.959
0.957
0.954
0.948
0.946
0.941
0.985
0.982
0.978
0.977
0.974
0.973
0.969
Ang
10.8
9.9
8.9
7.6
6.1
4.9
15.3
15.0
14.3
14.2
14.0
13.2
12.4
11.6
15.9
15.9
16.1
16.2
16.1
15.7
15.7
15.4
14.5
15.0
15.0
15.2
15.5
15.7
16.0
Freq
(MHz)
1000
1200
Fmin
(dB)
0.91
0.92
Gamma Opt
Mag
0.329
7.000
Angle
-8.8
-7.3
Rn
14.0
13.5
Ga
(dB)
27.42
25.09
26
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Scattering and Noise Parameters
Table 15. Active Mode Noise Parameters, Rbias=1.2k
Ω (continued)
(Vcc = 2.75V, 25 0C, 50
Ω
system, Icc=4.6 mA)
Freq
(MHz)
1500
1700
1900
2000
2100
2400
2500
2600
Fmin
(dB)
0.96
0.99
1.02
1.04
1.06
1.13
1.15
1.18
Gamma Opt
Mag
0.279
0.244
0.206
0.186
0.167
0.114
0.100
0.087
Angle
-12.3
-17.2
-20.8
-21.5
-20.9
-9.6
-1.6
8.8
Rn
12.5
12
11.5
11.5
11.0
11.0
10.5
10.5
Ga
(dB)
22.83
21.43
20.15
19.57
19.04
17.74
17.43
17.18
provides the active mode noise parameters when the bias resistor is 1.5 k
Ω
.
Table 16. Active Mode Noise Parameters, Rbias=1.5k
Ω
(Vcc = 2.75V, 25°C, 50 Ω system, Icc=3.3 mA)
Freq
(MHz)
1000
1200
1500
1700
1900
2000
2100
2400
2500
2600
Fmin
(dB)
0.92
0.93
0.97
1.00
1.04
1.06
1.08
1.16
1.19
1.23
Gamma Opt
Mag Angle
0.358
0.344
0.306
0.273
0.237
0.218
0.199
0.143
0.127
0.111
-8.3
-8.7
-12.5
-15.2
-16.6
-16.4
-15.4
-5.5
0.6
8.3
Rn
14.5
14.0
13.5
13.0
12.0
12.0
12.0
11.5
11.5
11.5
Ga
(dB)
26.42
24.84
22.78
21.59
20.53
20.03
19.57
18.30
17.91
17.53
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
27
Scattering and Noise Parameters
through Figure 21 are the constant noise figure and gain circles with input and output stability
regions shown on Smith charts. Gamma opt, noise resistance and stability at the frequency are shown for two values of the external bias resistor at 1600-, 1950-, 2150- and 2400 MHz.
Figure 14. Constant Noise Figure and Gain Circles, 1600 MHz, Rbias=1.2 k Ω
28
Figure 15. Constant Noise Figure and Gain Circles, 1600 MHz, Rbias=1.5k
Ω
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Scattering and Noise Parameters
Figure 16. Constant Noise Figure and Gain Circles, 1960 MHz, Rbias=1.2 k Ω
Figure 17. Constant Noise Figure and Gain Circles, 1960 MHz, Rbias=1.5k
Ω
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
29
Scattering and Noise Parameters
Figure 18. Constant Noise Figure and Gain Circles, 2140 MHz, Rbias=1.2 k Ω
30
Figure 19. Constant Noise Figure and Gain Circles, 2140 MHz, Rbias=1.5k
Ω
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Scattering and Noise Parameters
Figure 20. Constant Noise Figure and Gain Circles, 2400 MHz, Rbias=1.2 k Ω
Figure 21. Constant Noise Figure and Gain Circles, 2400 MHz, Rbias=1.5k
Ω
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
31
Packaging
Figure 22 and Figure 22 are the package drawings with dimensions for the MLPD-8, 2
×
2
×
0.6 mm, package.
DETAIL G
(See
)
Figure 22. Outline Dimensions for MLPD-8
32
MC13851 Advance Information, Rev. 2.0
Freescale Semiconductor
Product Documentation
Figure 23. Package Details
This data sheet is labeled as a particular type: Product Preview, Advance Information, or Technical Data.
Definitions of these types are available at: http://www.freescale.com.
summarizes revisions to this document since the previous release (Rev. 1).
Table 17. Revision History
Location
Throughout document
Section 2, “Electrical Specifications
Section 3, “Application Information
Section 3.4, “2400 MHz Application
Section 4, “Printed Circuit and Bill of Materials
Section 5, “Scattering and Noise Parameters
Revision
Changed package from MLF8 to MLPD-8
Complete revision
Complete update to Application Information
New 2400 MHz content.
Complete update to MLPD-8 package.
Added section and all content.
Freescale Semiconductor
MC13851 Advance Information, Rev. 2.0
33
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Document Number: MC13851
Rev. 2.0
12/2010