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HMC292LM3C
v01.0505
MIXERS - SINGLE & DOUBLE BALANCED - SMT
10
10 - 1
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
Typical Applications
Features
The HMC292LM3C is ideal for:
Input IP3: +19 dBm
• Microwave Point-to-Point Radios
LO / RF Isolation: 25 to 40 dB
• Multi-Point/LMDS Radios
Passive: No DC Bias Required
• SATCOM
Leadless SMT Package, 25 mm2
Functional Diagram
General Description
The HMC292LM3C is a 17 - 31 GHz surface mount
passive GaAs MMIC double-balanced mixer in
a SMT leadless chip carrier package. The mixer
can be used as a downconverter or upconverter.
Excellent isolations are provided by on-chip baluns,
which require no external components and no DC
bias. All data is with the non-hermetic, epoxy sealed
LM3C packaged device mounted in a 50 Ohm test
fixture. Utilizing the HMC292LM3C eliminates the
need for wirebonding, thereby providing a consistent
connection interface for the customer.
Electrical Specifications, TA = +25° C
Parameter
LO= +13 dBm, IF= 1 GHz
Min.
Typ.
Max.
LO= +13 dBm, IF= 1 GHz
Min.
Typ.
Frequency Range, RF & LO
18 - 28
17 - 31
Frequency Range, IF
DC - 6
DC - 6
Conversion Loss
Noise Figure (SSB)
7.5
9.5
7.5
9.5
Max.
Units
GHz
GHz
8
11
dB
8
11
dB
LO to RF Isolation
26
35
21
32
dB
LO to IF Isolation
20
25
20
25
dB
RF to IF Isolation
22
33
20
30
dB
IP3 (Input)
17
19
15
19
dBm
IP2 (Input)
45
50
42
50
dBm
1 dB Gain Compression (Input)
8
12
8
12
dBm
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
HMC292LM3C
v01.0505
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
Conversion Gain vs.
Temperature @ LO = +13 dBm
Isolation @ LO = +13 dBm
0
RF/IF
LO/RF
LO/IF
-10
-10
+25 C
-40 C
+85 C
-15
-30
-40
-50
-20
15
20
25
30
15
35
20
30
35
RF & LO
Return Loss @ LO = +13 dBm
Conversion Gain vs. LO Drive
0
0
LO
RF
-4
-5
RETURN LOSS (dB)
CONVERSION GAIN (dB)
25
FREQUENCY (GHz)
FREQUENCY (GHz)
-10
LO = + 9 dBm
LO = + 11 dBm
LO = + 13 dBm
LO = + 15 dBm
-15
-8
-12
-16
-20
-20
15
20
25
30
15
35
19
23
27
31
35
FREQUENCY (GHz)
FREQUENCY (GHz)
Upconverter Performance
Conversion Gain @ LO = +13 dBm
IF Bandwidth @ LO = +13 dBm
0
CONVERSION GAIN (dB)
0
-5
RESPONSE (dB)
10
-20
-10
RETURN LOSS
CONVERSION GAIN
-15
-20
0
2
4
6
IF FREQUENCY (GHz)
8
10
-5
-10
MIXERS - SINGLE & DOUBLE BALANCED - SMT
-5
ISOLATION (dB)
CONVERSION GAIN (dB)
0
-15
-20
15
20
25
30
35
FREQUENCY (GHz)
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
10 - 2
HMC292LM3C
v01.0505
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
Input IP3 vs.
Temperature @ LO = +13 dBm
25
20
20
15
15
IP3 (dBm)
25
10
5
10
-40 C
+25 C
+85 C
5
LO= 8 dBm
LO= 10 dBm
LO= 13 dBm
0
0
-5
-5
15
20
25
30
35
15
20
FREQUENCY (GHz)
70
70
60
60
50
50
IP2 (dBm)
IP2 (dBm)
80
40
30
35
40
30
-40 C
+25 C
+85 C
20
LO= 8 dBm
LO= 10 dBm
LO= 13 dBm
10
30
Input IP2 vs.
Temperature @ LO = +13 dBm
80
20
25
FREQUENCY (GHz)
Input IP2 vs. LO Drive
10
0
0
15
20
25
30
35
15
20
FREQUENCY (GHz)
25
30
35
FREQUENCY (GHz)
Input P1dB vs.
Temperature @ LO = +13 dBm
MxN Spurious Outputs
15
nLO
mRF
13
P1dB (dBm)
MIXERS - SINGLE & DOUBLE BALANCED - SMT
10
IP3 (dBm)
Input IP3 vs. LO Drive
11
0
1
0
xx
11
1
17
2
9
-40 C
+25 C
+85 C
7
20
25
0
39
70
77
3
4
76
3
93
69
86
4
>110
>110
>110
RF= 21 GHz @ -10 dBm
LO= 22 GHz @ +13 dBm
All values in dBc below the IF power level.
5
15
2
30
35
FREQUENCY (GHz)
10 - 3
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
HMC292LM3C
v01.0505
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
Absolute Maximum Ratings
RF / IF Input
+13 dBm
LO Drive
+27 dBm
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
ESD Sensitivity (HBM)
Class 1C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. ALL TOLERANCES ARE ± 0.005 [± 0.13].
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.
6.
Pin Descriptions
Pin Number
• INDICATES PIN 1
Function
Description
1, 2, 3
N/C
This pin may be connected to the housing
ground or left unconnected.
4
RF
This pin is DC coupled and matched to
50 Ohm from 18 - 31 GHz
5
IF
This pin is DC coupled. For applications not requiring operation to DC,
this port should be DC blocked externally using a series capacitor whose
value has been chosen to pass the necessary IF frequency range. For
operation to DC, this pin must not source/sink more than 2 mA of current
or die non-function and possible die failure will result.
6
LO
This pin is DC coupled and matched to
50 Ohm from 18 - 31 GHz.
GND
Package base must be soldered to PCB RF ground.
Interface Schematic
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
MIXERS - SINGLE & DOUBLE BALANCED - SMT
10
10 - 4
HMC292LM3C
v01.0505
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
Evaluation PCB
The grounded Co-Planar Wave Guide (CPWG) PCB input/
output transitions allow use of Ground-Signal-Ground (GSG)
probes for testing. Suggested probe pitch is 400 mm (16 mils).
Alternatively, the board can be mounted in a metal housing with
2.4 mm coaxial connectors.
MIXERS - SINGLE & DOUBLE BALANCED - SMT
10
10 - 5
LM3 package mounted to evaluation PCB
Evaluation Circuit Board Layout Design Details
Layout Technique
Micro Strip to CPWG
Material
Rogers 4003 with 1/2 oz. Cu
Dielectric Thickness
0.008” (0.20 mm)
Microstrip Line Width
0.018” (0.46 mm)
CPWG Line Width
0.016” (0.41 mm)
CPWG Line to GND Gap
0.005” (0.13 mm)
Ground Via Hole Diameter
0.008” (0.20 mm)
Suggested LM3-C PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm)
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
HMC292LM3C
v01.0505
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 17 - 31 GHz
HMC292LM3C Recommended SMT Attachment Technique
Preparation & Handling of the LM3-C Millimeterwave Package for Surface Mounting
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3-C devices should remain in
their original packaging until component placement to ensure
no contamination or damage to RF, DC & ground contact
areas.
10
200
0
175
150
125
100
75
50
25
0
1
2
3
4
5
TIME (min)
6
7
8
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3-C package on the top with a vacuum collet or along the edges with a sharp pair
of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess
pressure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM3-C data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
MIXERS - SINGLE & DOUBLE BALANCED - SMT
Follow these precautions to avoid permanent damage:
225
TEMPERATURE ( C)
The HMC LM3-C package was designed to be compatible
with high volume surface mount PCB assembly processes.
The LM3-C package requires a specific mounting pattern to
allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB
layout pattern can be found on each LM3-C product data
sheet. It can also be provided as an electronic drawing upon
request from Hittite Sales & Application Engineering.
Cleaning
A water-based flux wash may be used.
For price, delivery and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application support: Phone: 978-250-3343 or RFMG-apps@analog.com
10 - 6