Shenzhen Kaifa Technology Co.,Ltd
Technology Development & Central Lab
Technology Development & Central Lab (LAB) is the professional laboratory in Shenzhen Kaifa Technology Co.,Ltd.. LAB
was founded in 1992, and it consists of six sub laboratories and two engineering technology teams, which are operated by an
experienced technology team. Keeping the advanced technology & innovation in industry is LAB's objective. Lots of precise
instruments & equipment are invested for technology & test engineering development, which help to provide the professional
services for internal & external customers sufficiently.
WeChat of Kaifa
Seek for Truth
Sina Microblog of LAB
Strive for Excellence
GreatWall Kaifa Analysis & Test Center (CNAS certificated)
Guangdong Engineering Technology Center
Shenzhen Enterprise Technology Center
Shenzhen Kaifa Technology Co.,Ltd. Technology Development & Central Lab
7006 Caitian Road, Futian District, Shenzhen, China
Tel: 0755-83032277
0755-83032276
Fax: 0755-83032277
Website: http://www.kaifa.cn/kfgyy/server.asp
Stock: Greatwall Changcheng Kaifa
Stock Code: 000021SZ
WeChat: changchengkaifa
Sina Microblog: http://weibo.com/u/5065561540
Suzhou Lab
Tel: 0512-62585000-60100
Fax: 0512-62580738
Huizhou Lab
Tel: 0752-2278000-78450
Shenzhen Precision Electromechanical & Hard Disk Components Public Technology Service Platform
Malaysia Lab
Tel: +60 78622204
Technology Development & Central Lab
Professional Efficient Practical Innovative
Contents
Technology Development & Central Lab
01
Advanced Mechanical Lab
03
Reliability Lab
05
Advanced SMT Lab
09
Material Science Lab
13
ESD Lab
17
Calibration Lab
19
Technology Research & Development
21
Failure Analysis Engineering
25
Technology Development & Central Lab
Technology Development & Central Lab (LAB for short) is the professional laboratory in Shenzhen Kaifa Technology Co.,Ltd..
LAB was founded in 1992, and it consists of six sub laboratories and two engineering technology teams after twenty years
development. The service covers mechanical analysis, material analysis, simulation analysis, reliability analysis, faliure analysis,
contamination & ESD control. Up to now, five branch laboratories in Suzhou, Huizhou, Dongguan, Malaysia & Thailand have
been established, and more branches will be established in mainland and oversea with business extended continually.
LAB is staffed with a group of competent and experienced pfofessionals: 21% with Doctor or Master degree, 29% with
Bachelor degree, and the other 50% are professional technician.
Keeping the advanced & innovation in industry is LAB's objective. Lots of precise instruments & equipment are invested for
technology and test engineering development, which help to provide the professional services for internal & external customers
sufficiently.
Technology Development & Central Lab
Professional Labs
Advanced Mechanical Lab
Reliability Lab
Advanced SMT Lab
Material Science Lab
ESD Lab
Calibration Lab
Service & Communication
Analysis & Test (electrical, mechanical, material,
chemical, optothermal)
Simulation Analysis (mechanical, fluid, optothermal,
electromagnetic & multi-physical coupling)
Engineering Solution
Product mannufacturing process design & optimization
Failure analysis & reliability
Multi-subject engineering technology R&D
Training & Communication
Course design
Training service
Technology exchange & experience sharing
Website: http://www.kaifa.cn/kfgyy/server.asp
Engineering Technology Team
Technology Research & Development
Failure Analysis Engineering
Technology Achievements
Suzhou
Standards: 1 National standard, 2 Industry standard
Patents:
3 invention patents, 10 innovation patents,
several appearance patents
Papers: more than 80 papers
Dongguan (在建)
Huizhou
Shenzhen
GreatWall Kaifa Analysis & Test Center (CNAS certificated)
Qualifications
01
Guangdong Engineering Technology Center
Shenzhen Enterprise Technology Center
Thailand
Shenzhen Technology Center for Information Memory Industry Park
Shenzhen Precision Electromechanical and Hard Disk Components
Public Technology Service Platform
Malaysia
Website：http://www.kaifa.cn/kfgyy/server.asp
Advanced Mechanical Lab
Advanced Mechanical Lab - Engineering Services
The engineering service of the Advanced Mechanical Lab includes: Vibration mode identification of the electrical-mechanical
products; Resonance analysis of the HDD components; Material strength test; Residue stress evaluation of medical device;
CAE simulation; Production line vibration monitoring, and etc..
Advanced Mechanical Lab organized by engineering team with experience, aimed to provide the technical solution and
engineering service on mechanics, dynamics, simulation and test service. Advanced Mechanical Lab insists on the attitude of
Profession, Commitment and Cordiality, and provides the technology support for the precision assembly process, product
development and other projects.
Modal Identification & Dynamical Analysis
Vibration mode test & identification for mechatronic product design and equipment development
High-speed motion analysis for structure
Vibration optimization and diagnosis for dynamical structure
Vibration mode identification & dynamical analysis for HDD
Stress & Strain Analysis
Over-stress evaluation for SMT process
Residue stress analysis & elimination
for transparent components
Stress monitoring in transportation
On-line test (Dynamic strain gauge)
Strain vs. Strain-rate
High-Speed Motion Analysis
Visualization of transient motion
RTL evaluation for equipment & process
FPS:1000fps@1280x1024; 65000fps@1280x16
Birefringence test
Stress
Material Mechanical Properties Analysis
Metal & plastic material
properties test includes:
pulling, compression,
bending, shear & peering
strenght, etc.
Mechanical strength test
under varied loading
Material evaluation and
selection.
Mechanical Properties Test
CAE for Precision Process
High-Speed Motion Analysis
03
Website：http://www.kaifa.cn/kfgyy/server.asp
Project Engagement
Engineering
Services
Service Model
Stress & Strain Analysis
Engineering Capability
Dynamical Analysis
Technology Development
Equipment Development
High speed camera
CAE Analysis for Precision Process
Technical Consultant and Training
Precision assembly process simulation
Basic knowledge training on CAE
Structure static analysis
Structural vibration test technology consultation
Fixture optimization
Product drop and packaging cushion optimization
Test & Failure Analysis
Material universal test machine
Dynamical component mode analysis
Reliability Lab - Engineering Services
Product design verification
Reliability Lab
Stress profile analysis of product life cycle / product verification plan design / environmental adaptability, regulatory
compliance (EMC & safety ) verification
Reliability lab was established in 2000. It is managed in conformity with ISO17025 and passed the accreditation of CNAS (China
National Accreditation Service). Reliability lab has advanced test and analysis capability in quality and reliability of electronic product,
electronic material and components. With years of development, reliability lab has professional test engineers and experienced
technical experts, and can provide one-stop service of rectification.
Reliability index verification
Design stage: MTBF prediction according to related standard / prototype stage: MTBF demonstration test,
accelerated life test.
PCBA process reliability analysis and evaluation
Process reliability qualification / solder joints reliability verification / solder paste & flux evaluation
EMC design and corrective
EMC design / EMC rectification / EMC pre-certification
Reliability test
MTBF
Screen with fixes
Verify reliability
with fixes
Verification stage：
When the new product is finalized, demonstration test is
adapted to check if the product meets the reliability index
according to designing specification.
Find and
fix failure mode
Design stage
HALT
Verification
stage
ALT
Design verification
Demonstration test
Design stage：
To find the potential problems in raw material / structure,
process and environment adaptability through HALT, and
improve the original design to reach reliability growth.
Mass production
stage
Mass production stage：
Monitoring the stability of product quality through ongoing
ORT
Screening test
Reliability consultant & training
PCBA reliability design & verification / component selection & reliability analysis / EMC design & rectification
Reliability Lab - Environment Test
Environment Test is to determine the ability of the specimens to be used, transported or stored in natural or specific
artificial environment.
Main Test Items
Reliability Index Verification
EMC Design & Improvement
05
Website：http://www.kaifa.cn/kfgyy/server.asp
Damp heat cyclic test
Vibration test
Dry heat test
Composite temperature/humidity cyclic test
Free fall test
Damp heat test
Temperature cycle test
Salt spray test
Shock test
Bump test
Dust & water proof test
Temp. & humidity test Chamber
Walk-in temp. & humidity test chamber
Thermal shock test chamber
Temperature rapid change test chamber
Shock & bump tester
Vibration test system
PCBA Process Reliability
Analysis & Evaluation
Product Design Verification
Main
Services
Cold test
Reliability
Engineering
Service Platform
Reliability Test
Reliability
Consultant & Training
Reliability Lab - EMC Test
Reliability Lab - Safety Test
The purpose of Safety Test is to protect users from
the risk of electric shock or other danger when the
products are operated under normal conditions or
possible failure modes.
Main Test Items
Glow-wire test
Withstand voltage test
Insulation resistance test
EMC (Electromagnetic Compatibility) Test is to
determine the ability of an equipment or system to function
satisfactorily in its electromagnetic environment without
introducing intolerable electromagnetic disturbances to
anything in that environment. EMC test includes EMS
(Electromagnetic Susceptibility) test and EMI
(Electromagnetic Interference) test.
Lightning surge test
Pulse current test
Pulse current tester
Glow-wire tester
Reliability Lab - Durability Test
Durability Test is a kind of life test for materials and products in use or service, which may predict and verify the
weak or dangerous parts of the materials and products.
Test Items
Alcohol friction test
Button life test
Wire bending test
Tape friction test
Cards insert-plug test
Pencil hardness test
Main Test Items
Electrostatic discharges immunity test (ESD)
Conducted disturbance, induced by RF fields test (CS)
Oscillatory waves immunity test (OSC)
Radiated, radio-frequency electromagnetic field immunity test (RS)
Conducted emission test (CE)
Radiated emission test (RE)
Surge immunity test (Surge)
Tape friction tester
Power frequency magnetic field immunity test (PFMF)
Button life tester
Cards insert & plug tester
Reliability Lab - Radio Frequency (RF) Test
Electrical fast transient / burst immunity test (EFT)
Voltage dips, short interruptions and voltage variation immunity test (DIPs)
The purpose of RF Test is to prepare, approve and maintain technical specifications for wireless communication
devices. The test should ensure the measurement to meet the requirement of the FTA, CTA, etc..
Test Modes
WCDMA
TD-SCDMA
CDMA 2000 1X/EVDO
LTE
EDGE
GSM/GPRS
Test Items
07
ESD immunity test
EFT immunity test
RS test
CE test
CS test
DIPs immunity test
Transmit power
Inner loop power control
Frequency error
EVM
ACLR
Occupied bandwidth
RF tester
UHF TEM cell
BLER
RF analysis
Advanced SMT Lab
Advanced SMT Lab - Test Services
Advanced SMT lab provides technical supports for advanced electronic assembly business. It offers effective testing and
engineering analysis service. Main service includes non-destructive & destructive test, micro structure analysis for soldering
structure, device destructive physical analysis (DPA) and quality evaluation for soldering process & incoming material.
Non-destructive Test
The main equipments for non-destructive analysis include High magnification optical microscope, X-Ray, Scanning
Acoustic Microscope (C-SAM), and etc.. Main test items:
External defect analysis
X-Ray inspection
Hidden solder joint inspection
C-SAM inspection
3D+BGA microscope inspection
X-Ray inspection
C-SAM inspection
Destructive Test
In order to meet the requirement of the miniaturization, intelligent, high speed and low power of electronic product,
component structure and manufacture process are more and more complex and microscopic. Defect location and sample
preparation difficulties are greatly increased. Destructive experiment is an 'anatomic method' for sample micro-structure
analysis. We can effectively locate defect and do failure mechanism study through it.
Cross section
Dye & pry test
Solderability test
Solder joint strength test
Cross section
Quality Evaluation
09
Website：http://www.kaifa.cn/kfgyy/server.asp
Test Services
Device DPA
Advanced SMT Lab
Main Services
Engineering Analysis
Solder Joint Analysis
Solder paste performance test
De-cap
I-V curve trace test (with Micro probe)
Die de-layer
Dye & pry test
Solderability test
IC de-cap
I-V curve trace test
(with Mirco probe)
Non-destructive Test
Destructive Test
Solder joint strength test
Advanced SMT Lab - Engineering Services
Advanced SMT Lab - Engineering Services
Solder Joint Micro-structure Analysis
Quality Evaluation for Soldering Process & Incoming Material
Based on the soldering interconnection structure analysis, soldering failure mechanism is studied to help customer on
failure root cause verification, and provide the effective corrective action.
SMT Lab also offers following services to analyze the effects of material and process parameterts on the SMT process
quality, stability and the reliability in the whole electronic product life cycle.
Fracture analysis
Failure mechanism study for solder joint
Solder joint micro-structure analysis
Defect location for soldering joint
Crack
Base material 2
Base material 1
Soldering process evaluation (Solder joint external inspection, soldering interface and strength analysis).
Solder joint structure analysis
Soldering defect location
Fracture analysis
PCB evaluation (Manufacture process, PCB base material, curing system and pad finish analysis).
Solder paste performance evaluation (Alloy system and flux system analysis).
Underfill analysis (Filling type exploring, liquidity analysis and underfill bonding strength improvement).
Material change authentication.
Device DPA & Defect Location
Soldering process evaluation
PCB curing system comparison
Solder paste performance evaluation
Die design revision authentication
According to the device failure background, DPA analysis scheme can be worked out for failure mechanism study and root
cause verification, to avoid economic losses.
Device electrical characteristic defect location
Die defect location
Device electrical characteristic defect location
11
Device package defect location
Device failure mechanism study
Device package defect location
Die defect location
Material Science Lab
Material Science Lab- Test Services
Material Science Lab(MSL for short) was founded in 1992, with huge investment to provide technical support for enterprise
technology innovation, quality control, and integrated capabilities of material test, analysis, assessment and consultation.
Material Science Lab possesses a variety of advantage surface analysis equipment, regular physical & chemical test
instruments. It is operated by a group of competent & experienced professionals. Technology analysis service scope including
material surface & profile analysis, electronic products cleanliness tests & chemical analysis, micro contaminant analysis, and
products failure analysis so as to accumulate a lot of practices with high honor in international EMS industry.
Material Science Lab had passed the CNAS certification in Dec, 2007.
Material Surface Analysis
Material Science Lab is equipped with lots of advanced surface analysis instruments, which provide the
comprehensive surface analysis service to adapt to the most of the requirements of sub-micron resolution, trace
amount surface sensitivity, and cross section analysis in data storage industry and other advanced production fields.
Materials surface analysis and characterization
Surface micro-contaminant analysis
Soldering failure analysis for electronic products
Surface element analysis
Field Emission Scanning Electron Microscope/
Energy Dispersive Spectroscopy
( FE-SEM / EDX )
Plating layer and dopants depth profile analysis
Accurate fixed-point cross section & micro-line Analysis
High-resolution characterization of nanoscale surface topography
Material crystalline analysis
Focused Ion Beam Microscope
(FIB)
Atomic Force Microscope
(AFM)
Cleanliness Analysis
In fields of HDD, semiconductor industries and microelectronic devices, MSL has the capabilities and rich
experiences to perform cleanliness test. In order to ensure that we meet the stringent cleanliness specification
required by electronic industries, we have established a systematic quality control system to achieve high accuracy
and precision.
The services include: cleanliness test and evaluation for incoming materials and products; completed
analysis solution for micro contaminant control.
Ions Contaminant analysis
Liquid Particle Counting
Non-volatile Residue analysis
Silicon oil\DOP\Amide Quantitative analysis
Dynamic Headspace Outgassing analysis
Condensable Volatile Residue analysis
Ion Chromatography
( IC )
Environment Monitoring
Engineering Analysis
Inorganic Material Analysis
Material Science Lab
Organic Material Analysis
Main Services
Test Services
Material Surface Analysis
Website：http://www.kaifa.cn/kfgyy/server.asp
Liquid Particle Counter
( LPC )
Auto Thermal Desorption/ Gas
Chromatography/Mass Spectrometry
( ATD-GC/MS )
Cleanroom Performance Assessment
Micro Contaminant Analysis & Control
Cleaning Process Evaluation & Optimization
Material Failure Analysis
Field Emission Scanning Electron Microscope/
Energy Dispersive Spectroscopy
( FE-SEM / EDX )
13
Surface Organic Contaminant analysis
Material Corrosion Resistant test
Micro Contaminants identification
Bacterial Count
C/R Consumable Material Cleanliness test
Ultrapure Water & Electronic Component Cleanliness test
Gas Chromatography
/Mass Spectrometry
( GC/MS )
Fourier Transform Infrared
Spectroscopy
( FTIR )
Material Science Lab- Test Services
Material Science Lab- Engineering Services
Environmental Monitoring
With the increasing importance of environmental protection, environmental monitoring is the technical basis of the
environmental control. MSL can provide the service to determine harmful substance contents in soil and water for
environmental control.
Soil / Sludge Analysis
Water Analysis
Organic Volatile Compounds (VOC)
Water content
Colority
Metal content
PH
PH
Total nitrogen/ phosphorus/organic carbon
Organic matter
Bacteria
Anions/ Cations content
Total water-soluble salt
Organic Volatile Compounds (VOC)
Heavy metal content
Cleanroom Performance Assessment
Cleanroom performance test and assessment at as-built phase according to the standards and practices; Regular
Monitor for Cleanroom at operational phase; Cleanroom Air Quailty Test: including ionic content, organic volatile and
deposition tests.
Airflow velocity & uniformity
HEPA or ULPA filter leakage
Air Particle Count (APC)
Water content determination by
Karl-Fisher Titration
VOC analysis by GC-MS
Trace metal analysis by ICP-MS
Room pressurization
Airflow parallelism
Organic & Inorganic Materials Analysis
Air particle fallout count
Material Science Lab has many advanced elements & components test equipments and analytical characterization
techniques, which can apply on polymeric materials, metal and electronic components for chemical composition
analysis, RoHS and other tests. Test subjects cover plastics, rubber, composites, adhesives, coatings, paints, medical
diagnostic components and a variety of electronic devices.
Light intensity & uniformity
Main compositions of plastic & rubber
RoHS screening test
Solvent components analysis
Trace metal content determination
Water content in organic solvent
Qualitative & quantitative analysis for Organic Compounds
Main compositions of paint & ink
Conductivity
Sound pressure
Floor vibration
Ionic content in air
Organic volatile compounds in air
Air deposition
APC test
Cleaning Process Evaluation & Optimization
Material Science Lab has experienced engineers in the field of high-precision electronic product cleaning. Cleaning
process, parameter optimization & cleaning efficiency can be evaluated according to the product characteristics and
technical requirements.
Detergent property assessment
High Performance
Liquid Chromatography
( HPLC )
Inductively Coupled Plasma
Mass Spectrometry
( ICP-MS )
X-Ray Fluorescence
Spectrometer
( XRF )
Cleaning process monitoring & control
Product test and evaluation for cleaning effects
Cleaning process to environmental
Impact monitor and assessment
Establish standards for assessing
Material and cleaning process quality
PCB cleaning / free-cleaning quality monitor
Process qualification and failure analysis
Cleaning process studies and optimization
Temperature / Acid / Alkyline monitor
Ultrasonic power and frequency evaluation
Cleaner setting optimization
15
ESD Lab
ESD Lab - ESD Test
ESD Lab provides the overall technology engineering solution for the ESD control system setup, including:
Fundamental ESD technology study
4M1E certification
Multiple ESD audit system
ESD control standard study
Professional solution for online ESD issues
ESD facilities monitoring & maintenance guidance
Multiple ESD audit system
Man
Material ESD characteristic analysis: provide the test, qualification & analysis for ESD material physical
characteristic, and the issue solution for the online materials.It includes:
Resistance characteristics:
Point to point resistance
Volume resistance
Voltage characteristics:
Static voltage
Tribocharge voltage
Shielding characteristics:
Penetration voltage
Charge retention
Dissipation characteristics:
Decay time
Surface resistance(resistivity)
Machine
Workshop
Material
Certify
Control
Method
Monitor
Maintain
Improve
Perfect
ESD
system
Environment
Fundamental study
Requirements,
Specs,Method
Preventive study
Surface Resistance (resistivity) Tester
Model: ME 272 / test range: 1.0E+3 ~ 1.0E+12 Ohms
Charge Plate Monitor
Model: ME 288 / test range: 0 ~ ±1 kV
Electrostatic Voltmeter
Model: Trek 520 / test range: 0 ~ ±2 kV
ESD Simulator
Model: EST883B / test range: HBM: 0.01kV ~ 20kV, MM / CDM: 1V ~ 2kV
ESD Monitor System
Kaifa developed ESD real time monitor system, which can improve the online ESD management. The system realized the critical
ESD parameters monitoring & the real-time alarming for all equipments in the whole workshop.
Main system functions:
±3V auto adjusting ionizer
Three levels alarming
Real time monitoring for wrist strap, grounding & offset voltage of lonizer
Daily & weekly report auto-generation
One person for whole workshop ESD monitoring
Control Center
ESD monitoring terminal
Ionizer performance chart
ESD/ EOS sensitivity evaluation: HBM, MM, CDM
Components: HGA/HSA ,IC, MOS, MOSFET, Diode, etc.
Equipment & facilities ESD evaluation & improvement solutions:
Equipment:
Online ESD monitor (man, tool, and ionizer offset voltage)
17
Website：http://www.kaifa.cn/kfgyy/server.asp
Components ESD sensitivity evaluation: Components ESD sensitivity study and ESD control level setup.
Ionizer :
Impendance
Leakage voltage
Conductive & Radiative EMI
Magnetic field
Offset voltage
Decay time
Calibration Lab
Calibration Lab
Calibration capability covers four major regions: length, temperature, mechanics & electricity.
Staff & Environment
Calibration engineers have several years of experience on the calibration area. All of them passed the metrological
certificates. Calibration Lab has a separate space to meet voltage, temperature and moisture environmental
requirements.
Measurement Standards
Calibration Lab possesses the leading standard measurement instruments in the world, including FLUKE 5500A
Calibrator, LCN-A-2KN Standard Pressure Sensor, Weights of Class E2&F1, Temperature & Humidity Meter of
Rotronic HP22/HC2-HK40, IET 1409/SCA Standard Capacitance, Mitutoyo Gage Block of Grade I, etc.. All
measurement standards are traceable to the National Measurement Standards.
Voltage, Current & Multimeter calibration device
LCR meter calibration device
Universal counter calibration device
Calibration Items
Calibration Lab is mainly engaged in the calibrating Multi-meter, Power Meter, Resistance Tester, Oscilloscope,
Signal Generator, Torque Meter, Push-pull Gauge, Electronic Balance, Thermometer, Temperature & Humidity
Recorder, Calipers, Micrometer, and Dial Gauge etc.. The calibration capability covers four major professional
regions: length, temperature, mechanics & electricity.
Calibrating electronic balance
19
Website：http://www.kaifa.cn/kfgyy/server.asp
Micrometer gauge block
Micrometer
Technology Research & Development
Multi-Physics Simulation
Multidisciplinary
Engineering Support
Technology Research & Development - Multi-Physics Simulation
We have various kinds of engineering softwares, which can provide professional multi-physics simulation sevices and
joint engineering projects. And more than 10 experienced engneers with Ph.D and Master degree major in mechanical,
thermal, fluid and materials, who can solve kinds of engeering and technology issues.
Test Technology Development
ANSYS - Multiphysics
ICEPAK
MATLAB
Structure / thermal / fluid / EM
Thermal management
Heat sinks, fan & flow channel
Engineering mathematics
System modeling
Parametric modeling & Design optimization
Application Scope
Products and process optimization: Identify and optimize the key control parameters
Failure analysis: Identify the root cause of failure issue and provide correct action suggestions
Pre-test analysis: Predict products’ performance before testing, to guide the test scheme and parameter setting
Simulation Capability
Customized Services
Finite element analysis
Software tools development
Precise metrology system development
21
Website：http://www.kaifa.cn/kfgyy/server.asp
Joint Engineering Project
Define projects' scope and targets
Devote into and provide professional advices
Design selection, optimization, verification
Drop and shock analysis
3D flow analysis
Two phase flow analysis
Airborne noise analysis
Thermal simulation
FSI coupling analysis
SI/PI/EMI simulation
EM simulation
Static structure analysis
Rotating machinery
Composite material analysis
Modal analysis
Eletronic thermal simulation
Drop analysis for 3C products
Residue stress analysis for plastic shell
Modal analysis
3D flow field simulation
Flow field, noise & structural analysis
Flow field, thermal & stress analysis
Electromagnetics simulation
EMC simulation
Consulting & Rental
CAE and testing technology
Equipment and software rental
Technology Research & Development - Multidiscilinary Engineering Analysis
Technology Research & Development - Test Technology Development
Coupling Analysis of Mechanical / Electrical / Control System
Optical & Thermal Test / Design
Evaluate the key dimension of mechanical components influence on the system
performance, reduce electromagnetic radiation and servo noise of the electrical driving
signal by integrated finite element simulation of mechanical components, structure
dynamics vibration measurement technology, electronic signal processing technology
and system control analysis methods. Apply to high speed, high precision motion
systems' analysis and optimization such as hard disk drive and automation machine.
Kinds of testing equpment, test items and aided design software with proprietary rights. R&D achievements were
transfered into useful tools for engineering.
HD structure & control analysis
Optical / Thermal Design of Electronic Products
Enhance the electronic products performance and reliability by optical and thermal
analysis plus the structure design. We are capable of optical lens and reflector bow
design for room and road lamps, illumination luminance and uniformity and
chrominance optimization, and also capable of thermal design, thermal management
and material evaluation for high power LED and other electronic products.
Thermal resistance tester
High-precision data logger
(Patent)
Thermal resistance /
conductivity test
20 channels (voltage /
current / temperature test)
LED thermoelectric analyzer Light intensity distribution tester
Light intensity distribution
Thermal resistance,
Junction temperature,
electric properties
LED optical thermal design
Equipment Performance Analysis & Improvement
Combine electric, thermal and fluidic analysis and testing technology into the
equipment development, find out the key factors and improve design, e.g. ultrasonic
cleaner, reflow oven and temperature chamber optimization for media circulation path
and efficiency, field homogeneity and stability. Identify critical components' key
parameters for robust design by Monte Carlo simulation and statistical analysis.
Improve the accuracy grade by theoretical calculations, software simulations and nonlinear coefficient calibration for measurement and control system.
Optical integral sphere
Parts parametric design
Light distribution photometer
Luminous flux, color and
color calculation
Light intensity distribution,
iuminance, glare
LED thermal assistant®
C.E. thermal assistant®
Calculate LED number &
system thermal resistance
Substrate / heat sink design
Case thermal design, heat sink
and fan selection
Components temperature
estimation, layout design
Process Optimization of Thermal Bonding / Soldering / Riveting
Computer Aided Testing
Synthesis the material characteristic analysis and electro-thermo-mechanical multiphysics simulation to optimize the assembly process and reduce defects such as over
stress and deformation during manufacturing.
Integrated utilize of computer, optical, machinery and electrical technologies, we provide customized testing
equipment development services. Professional in high precision positioning platform, precise temperature controlled
chamber and various laboratory test equipment. Helped with the powerful computer analysis capability, data mining
of massive experimental result is possible, and has better understanding and demonstration of the testing by
theoretical analysis and data processing.
Thermo bonding simulation
Y
X
LDV
DSA / DAQ
Slider
P
ZT
SMT & Component Package Optimization
Industrial PC
Signal Generator &
Driver
(PDE)
HSA
B
a
rc
o
d
e
C
a
m
er
a
Fixture
RX, RZ, Z
Platform
Driver and
Motors
Comprehensive considering of materials science, SMT technology and reliability
engeering, design optimal reflow profile and choose the package material according to
viscoelasticity, creep of material. Evaluate thermal fatigue and shock resistance
reliability of solder joint, under the conditions of high tempreture, high stress cycle,
based on Industry standardized reliability testing meathods.
Reflow profile analysis for Flip-chip
23
P
ZT
Auto LDV calibration R&D
Test systems multi-channels expansion
Optical electromechanical integration
testing machine R&D
Failure Analysis Engineering
Failure Analysis (FA) is based on the analysis of product failure which probably happens on design, manufacturing or
application phases. The purpose of FA is to find out & confirm the failure root cause, and then put forward related corrective
actions (including product design optimization, manufacturing process improving & incoming quality monitoring) to improve the
quality of products.
With professional FA engineering team, completed FA database and advanced FA equipment, we can provide following three
levels FA services: System level, PCBA level and Component level.
Advantages
Comprehensive and advanced analytical equipment
Rich FA experience for multi-products & multiple failure modes
Fast & efficient FA response
Professional engineers with multi-disciplinary background
Failure Analysis Engineering - System Level Analysis
System Level FA focuses on the functional failure of electronic products. Supported by industry-leading failure
analysis database and advanced FA equipment, we can provide a comprehensive system failure analysis service,
which includes feasibility evaluation, specific FA procedure draft, failure root cause analysis, failure mechanism
verification plan, risk evaluation plan, corrective actions and preventive actions.
Analysis Objective
Consumer electronic products:
Medical electronic products:
Comercial electronic products:
Industrial electronic products:
Cellphone, Dongle, MID, HD player, Computer storage device, etc.
Respirator, E-thermomter, Blood presure monitor, etc.
Projector, POS,Telecomunication network, Fiscal cash register, etc.
Power meter, Water meter,DC-AC inverter, Controller, etc.
Analysis Scopes
Product functional failure.
Unreasonable design related failure.
Environmental stress (electrical stress, mechanical, thermal, EMC and etc.) related failure.
Incoming material related failure.
Manufacture process related failure.
Signal Integrity & Power Integrity related failure.
Main Instruments
Spectrum analyzer
Data acquisition set
Protocol analyzer
LCR meter
Curve tracer
VNA
Oscilloscope
Multi-meter
Spurious signals
Our FA procedure can be customized for different products & failure modes. The general one as bellow:
Failure Mechanism Analysis & Verification
Failure Loation
End
FA Report Release
CA & PA
Simulation & EV Verification
Physical & Chemical Analysis
Destructive Analysis
Non-destructive Analysis
Electrical Character Test
Visual Inspection
Failure Verification
Background Investigation
Start
Procedure
Failure Mode Identification
Cellphone sensitivity test
USB1.1 Difference signal measurement
25
Website：http://www.kaifa.cn/kfgyy/server.asp
PZT capacitance measurement
2-port S-parameter measurement
Failure Analysis Engineering - PCBA Level Analysis
Failure Analysis Engineering - Component Level Analysis
Analysis Purpose
Analysis Purpose & Procedure
PCBA level analysis is an activity to find out the root cause of PCBA solder joint failure and PCB defect. In
general, the non-destructive analysis are performed first rather than destructive analysis. The analytical
methods commonly include: Microscope inspection, X-Ray inspection, Thermal analysis, FTIR analysis, Cross
section analysis, SEM/EDX analysis, etc..
The failure analysis for electronic components and Hard Disk Driver parts is a process to find out the root cause &
determine failure mechanism by various analysis methods (include electrical, physical & chemical method).
(ESD/EOS simulation
Reliability evaluation)
Component Analysis
(FTIR, EDX)
Morphology Analysis
(High-multiple microscope, SEM)
End
Stress
Simulation & Verification
Stress Analysis
(Micro-probe, LC, EMMI)
FA Rroprt Release
Microscope Inspection
(Microscope, X-Ray)
Failure Mechanism Analysis
and Verification
Start
Soldering process issue (Head in pillow, Poor soldering, Cold welding, Bridging, Voids, Wicking, etc.)
Component pins issue (Coating structure analysis, Contamination, Oxidation, Coplanarity)
Soldering joint strength issue
ECM issue
Corrosion issue (Creep / Sulfide corrosion, etc.)
Electrical Test
(Mutil-meter, I-V, Oscilloscope)
Failure Location
PCBA solder joint failure analysis
Background Investigation
Mainly Analysis & Evaluation Items
Structure Analysis
(Cross section, De-layer, FIB)
PCB defect analysis and quality evaluation
Open & Short issue
Delamination, Bulge, Solder marsk peel off and Pad cratering issue
Pad surface finish related issue
PTH & Blind via issue
Corrosion migration issue
Leakage issue
Physical & chemical properties related issue (Size, Wear resistance, Bending strength, etc.)
Analysis Scopes & Methods
Structural parts：Keys & Switch, Connector, Card socket, Electric relay, etc.
Electrical components：Resistor, Capacitor, Inductor, Crystal oscillator, etc.
Electrical devices：Diode,LED, Transistor, MOSFET, etc.
Integrated circuit：Memory,MCU, PMIC, Audio IC, etc.
HDD parts：HSA, Disk, Micro-motor, Preamp,VCM, FPC, etc.
Typical Cases
Crack
Mud cracks
head in pillow
Head in pillow (X-Ray inspection)
Black pad of ENIG PCB (Cross section & SEM)
2000X-SEM
200X
Bridging
PTH quality evaluation (Cross section)
X-Ray inspection
C-SAM inspection
Chemical de-cap
FPC defect location
Lead frame, bonding wire &
inner welding inspection
IC package delamination, voids,
micro-crack, underfill voids
Detaching plastic package, die
defect & bonding wire inspection
FPC defect loaction &
root cause analysis
350X-SEM
Void
Abnormal via
1500X-SEM
100X
Basis material
I-V characteristic analysis
Via copper missing
PCB blind / buried via defect
27
QFP IC pin sulfide caused poor soldering
Poor soldering due to coating missing
Basic electrical parameter test,
IC pins static characteristic test
Die electrical test by Micro-probe
Mechanical de-cap
Disk defect analysis
Pad / die level electrical test
Detaching metallic package
for destructive analysis
Surface scratch observation
and analysis