KIT
ATION
EVALU
E
L
B
AVAILA
19-3515; Rev 2; 1/07
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
Features
The MAX5875 is an advanced 16-bit, 200Msps, dual
digital-to-analog converter (DAC). This DAC meets the
demanding performance requirements of signal synthesis
applications found in wireless base stations and other
communications applications. Operating from 3.3V and
1.8V supplies, this dual DAC offers exceptional dynamic
performance such as 78dBc spurious-free dynamic range
(SFDR) at fOUT = 16MHz and supports update rates of
200Msps, with a power dissipation of only 260mW.
The MAX5875 utilizes a current-steering architecture
that supports a 2mA to 20mA full-scale output current
range, and allows a 0.1VP-P to 1VP-P differential output
voltage swing. The device features an integrated 1.2V
bandgap reference and control amplifier to ensure
high-accuracy and low-noise performance. A separate
reference input (REFIO) allows for the use of an external reference source for optimum flexibility and
improved gain accuracy.
The digital and clock inputs of the MAX5875 accept
3.3V CMOS voltage levels. The device features a flexible input data bus that allows for dual-port input or a
single-interleaved data port. The MAX5875 is available
in a 68-pin QFN package with an exposed paddle (EP)
and is specified for the extended temperature range
(-40°C to +85°C).
Refer to the MAX5873 and MAX5874 data sheets for
pin-compatible 12-bit and 14-bit versions of the
MAX5875, respectively. Refer to the MAX5878 data
sheet for an LVDS-compatible version of the MAX5875.
♦ 200Msps Output Update Rate
♦ Noise Spectral Density = -162dBFS/Hz at fOUT =
16MHz
♦ Excellent SFDR and IMD Performance
SFDR = 78dBc at fOUT = 16MHz (to Nyquist)
SFDR = 75dBc at fOUT = 80MHz (to Nyquist)
IMD = -86dBc at fOUT = 10MHz
IMD = -76dBc at fOUT = 80MHz
♦ ACLR = 75dB at fOUT = 61MHz
♦ 2mA to 20mA Full-Scale Output Current
♦ CMOS-Compatible Digital and Clock Inputs
♦ On-Chip 1.2V Bandgap Reference
♦ Low 260mW Power Dissipation
♦ Compact 68-Pin QFN-EP Package (10mm x 10mm)
♦ Evaluation Kit Available (MAX5875EVKIT)
Ordering Information
TEMP RANGE
PINPACKAGE
PKG
CODE
MAX5875EGK-D
-40°C to +85°C
68 QFN-EP*
G6800-4
MAX5875EGK+D
-40°C to +85°C
68 QFN-EP*
G6800-4
PART
*EP = Exposed pad.
+ Denotes lead-free package.
D = Dry pack.
63 62 61 60 59 58
B7
B8
B6
B5
B4
B3
B2
B1
B0
A15
67 66 65 64
A14
A13
A12
A11
A10
68
57 56 55 54 53 52
A8
1
51
B9
A7
2
50
B10
A6
3
49
B11
A5
4
48
B12
A4
5
47
B13
A3
6
46
B14
A2
7
45
B15
A1
8
44
SELIQ
A0
9
43
GND
GND
10
42
XOR
DVDD3.3
11
41
DORI
GND
12
40
PD
GND
13
39
TORB
AVDD3.3
14
38
CLKP
GND
15
37
CLKN
MAX5875
16
36
GND
MAX5876
12
250
LVDS
FSADJ
17
35
AVCLK
MAX5877
14
250
LVDS
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
MAX5878
16
250
LVDS
AVDD1.8
REFIO
GND
CMOS
AVDD3.3
200
AVDD3.3
16
GND
MAX5875
OUTIP
CMOS
OUTIN
200
GND
14
GND
MAX5874
OUTQP
CMOS
OUTQN
200
GND
12
AVDD3.3
MAX5873
PART
AVDD3.3
LOGIC
INPUTS
GND
UPDATE
RATE (Msps)
AVDD1.8
RESOLUTION
(Bits)
DACREF
Selector Guide
TOP VIEW
A9
Base Stations: Single/Multicarrier UMTS, CDMA, GSM
Communications: Fixed Broadband Wireless Access,
Point-to-Point Microwave
Direct Digital Synthesis (DDS)
Cable Modem Termination Systems (CMTS)
Automated Test Equipment (ATE)
Instrumentation
DVDD1.8
Pin Configuration
Applications
QFN
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX5875
General Description
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ABSOLUTE MAXIMUM RATINGS
Continuous Power Dissipation (TA = +70°C)
AVDD1.8, DVDD1.8 to GND, DACREF ..................-0.3V to +2.16V
AVDD3.3, DVDD3.3, AVCLK to GND, DACREF ........-0.3V to +3.9V
68-Pin QFN-EP
REFIO, FSADJ to GND, DACREF ........-0.3V to (AVDD3.3 + 0.3V)
(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW
OUTIP, OUTIN, OUTQP, OUTQN to
Thermal Resistance θJA (Note 1)...................................+24°C/W
Operating Temperature Range ...........................-40°C to +85°C
GND, DACREF....................................-1V to (AVDD3.3 + 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AVCLK + 0.3V)
Junction Temperature ......................................................+150°C
A15/B15–A0/B0, XOR, SELIQ to
Storage Temperature Range .............................-60°C to +150°C
GND, DACREF .....................................-0.3V to (DVDD3.3 + 0.3V)
Lead Temperature (soldering, 10s) .................................+300°C
TORB, DORI, PD to GND, DACREF ....-0.3V to (DVDD3.3 + 0.3V)
Note 1: Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, GND = 0, fCLK = fDAC, external reference VREFIO = 1.25V, output load
50Ω double-terminated, transformer-coupled output, IOUTFS = 20mA, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
16
Bits
Integral Nonlinearity
INL
Measured differentially
±3
LSB
Differential Nonlinearity
DNL
Measured differentially
±2
LSB
Offset Error
OS
-0.025
Full-Scale Gain Error
GEFS
Gain-Drift Tempco
Full-Scale Output Current
IOUTFS
Output Compliance
±0.001 +0.025
%FS
±10
ppm/°C
External reference
±1
%FS
Internal reference
±100
External reference
±50
Offset-Drift Tempco
(Note 3)
2
Single-ended
ppm/°C
20
-0.5
+1.1
mA
V
Output Resistance
ROUT
1
MΩ
Output Capacitance
COUT
5
pF
DYNAMIC PERFORMANCE
Clock Frequency
Output Update Rate
Noise Spectral Density
2
fCLK
fDAC
1
200
fDAC = fCLK / 2, single-port mode
1
100
fDAC = fCLK, dual-port mode
1
200
fDAC = 150MHz
fOUT = 16MHz, -12dBFS
-162
fDAC = 200MHz
fOUT = 80MHz, -12dBFS
-160
_______________________________________________________________________________________
MHz
Msps
dBFS/Hz
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, GND = 0, fCLK = fDAC, external reference VREFIO = 1.25V, output load
50Ω double-terminated, transformer-coupled output, IOUTFS = 20mA, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
fDAC = 100MHz
Spurious-Free Dynamic Range to
Nyquist
SFDR
fDAC = 200MHz
Spurious-Free Dynamic Range,
25MHz Bandwidth
Two-Tone IMD
SFDR
MIN
TYP
fOUT = 1MHz, 0dBFS
88
fOUT = 1MHz, -6dBFS
84
fOUT = 1MHz, -12dBFS
82
fOUT = 10MHz, -12dBFS
81
fOUT = 30MHz, -12dBFS
79
fOUT = 10MHz, -12dBFS
80
fOUT = 16MHz, -12dBFS,
TA ≥ +25oC
71
UNITS
dBc
78
fOUT = 16MHz, 0dBFS
87
fOUT = 50MHz, -12dBFS
78
fOUT = 80MHz, -12dBFS
75
fDAC = 150MHz
fOUT = 16MHz, -12dBFS
84
fDAC = 100MHz
fOUT1 = 9MHz, -7dBFS;
fOUT2 = 10MHz, -7dBFS
-86
fDAC = 200MHz
fOUT1 = 79MHz, -7dBFS;
fOUT2 = 80MHz, -7dBFS
-76
TTIMD
MAX
dBc
dBc
Four-Tone IMD, 1MHz
Frequency Spacing, GSM Model
FTIMD
fDAC = 150MHz
fOUT = 16MHz, -12dBFS
-86
dBc
Adjacent Channel Leakage Power
Ratio 3.84MHz Bandwidth,
W-CDMA Model
ACLR
fDAC =
184.32MHz
fOUT = 61.44MHz
75
dB
240
MHz
Output Bandwidth
BW-1dB
(Note 4)
INTER-DAC CHARACTERISTICS
∆Gain
Gain Matching
Gain-Matching Tempco
Phase-Matching Tempco
fOUT = DC
dB
+0.01
∆Gain/°C
±20
ppm/°C
fOUT = 60MHz
±0.25
∆Phase/°C fOUT = 60MHz
±0.002
Degrees
Degrees/
°C
dB
∆Phase
Phase Matching
±0.2
fOUT = DC - 80MHz
Channel-to-Channel Crosstalk
fCLK = 200MHz, fOUT = 50MHz, 0dBFS
-70
REFERENCE
Internal Reference Voltage Range
Reference Input Compliance
Range
VREFIO
1.14
VREFIOCR
0.125
1.2
1.26
V
1.250
V
Reference Input Resistance
RREFIO
10
kΩ
Reference Voltage Drift
TCOREF
±25
ppm/°C
_______________________________________________________________________________________
3
MAX5875
ELECTRICAL CHARACTERISTICS (continued)
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS (continued)
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, GND = 0, fCLK = fDAC, external reference VREFIO = 1.25V, output load
50Ω double-terminated, transformer-coupled output, IOUTFS = 20mA, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG OUTPUT TIMING (See Figure 4)
Output Fall Time
tFALL
90% to 10% (Note 5)
0.7
ns
Output Rise Time
tRISE
10% to 90% (Note 5)
0.7
ns
Output-Voltage Settling Time
Output Propagation Delay
tSETTLE
tPD
Glitch Impulse
Output Noise
nOUT
Output settles to 0.025% FS (Note 5)
14
ns
Excluding data latency (Note 5)
1.1
ns
Measured differentially
1
pV•s
IOUTFS = 2mA
30
IOUTFS = 20mA
30
pA/√Hz
TIMING CHARACTERISTICS
Data to Clock Setup Time
tSETUP
Referenced to rising edge of clock (Note 6)
-0.6
-1.2
ns
Data to Clock Hold Time
tHOLD
Referenced to rising edge of clock (Note 6)
2.1
1.5
ns
Latency to I output
9
Latency to Q output
8
Clock
Cycles
Single-Port (Interleaved Mode)
Data Latency
Dual-Port (Parallel Mode) Data
Latency
5.5
Clock
Cycles
Minimum Clock Pulse-Width High
tCH
CLKP, CLKN
2.4
ns
Minimum Clock Pulse-Width Low
tCL
CLKP, CLKN
2.4
ns
CMOS LOGIC INPUTS (A15/B15–A0/B0, XOR, SELIQ, PD, TORB, DORI)
Input-Logic High
VIH
Input-Logic Low
VIL
Input Leakage Current
IIN
PD, TORB, DORI Internal
Pulldown Resistance
Input Capacitance
0.7 x
DVDD3.3
V
1
VPD = VTORB = VDORI = 3.3V
CIN
0.3 x
DVDD3.3
V
20
µA
1.5
MΩ
2.5
pF
CLOCK INPUTS (CLKP, CLKN)
Differential Input
Voltage Swing
Differential Input Slew Rate
> 1.5
Square wave
> 0.5
(Note 7)
VP-P
> 100
V/µs
VCOM
AVCLK / 2
±0.3
V
Input Resistance
RCLK
5
kΩ
Input Capacitance
CCLK
2.5
pF
External Common-Mode Voltage
Range
SRCLK
Sine wave
POWER SUPPLIES
Analog Supply Voltage Range
Digital Supply Voltage Range
Clock Supply Voltage Range
4
AVDD3.3
3.135
3.3
3.465
AVDD1.8
1.710
1.8
1.890
DVDD3.3
3.135
3.3
3.465
DVDD1.8
1.710
1.8
1.890
AVCLK
3.135
3.3
3.465
_______________________________________________________________________________________
V
V
V
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, GND = 0, fCLK = fDAC, external reference VREFIO = 1.25V, output load
50Ω double-terminated, transformer-coupled output, IOUTFS = 20mA, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
IAVDD3.3 + fDAC = 200Msps, fOUT = 1MHz
IAVCLK
Power-down
Analog Supply Current
Digital Supply Current
IDVDD1.8
Power Dissipation
PDISS
Power-Supply Rejection Ratio
PSRR
58
25
Power-down
IDVDD3.3
MAX
53
UNITS
0.002
fDAC = 200Msps, fOUT = 1MHz
IAVDD1.8
TYP
mA
32
0.001
fDAC = 200Msps, fOUT = 1MHz
0.5
Power-down
3
0.001
fDAC = 200Msps, fOUT = 1MHz
22
Power-down
mA
25
0.001
fDAC = 200Msps, fOUT = 1MHz
260
Power-down
14
AVDD3.3 = AVCLK = DVDD3.3 = +3.3V ±5%
(Notes 7, 8)
-0.1
300
mW
µW
+0.1
%FS/V
Note 2: Specifications at TA ≥ +25°C are guaranteed by production testing. Specifications at TA < +25°C are guaranteed by design
and characterization data.
Note 3: Nominal full-scale current IOUTFS = 32 x IREF.
Note 4: This parameter does not include update-rate-dependent effects of sin(x)/x filtering inherent in the MAX5875.
Note 5: Parameter measured single-ended into a 50Ω termination resistor.
Note 6: Not production tested. Guaranteed by design and characterization data.
Note 7: A differential clock input slew rate of > 100V/µs is required to achieve the specified dynamic performance.
Note 8: Parameter defined as the change in midscale output caused by a ±5% variation in the nominal supply voltage.
Typical Operating Characteristics
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference, VREFIO = 1.25V, RL = 50Ω double-terminated,
IOUTFS = 20mA, TA = +25°C, unless otherwise noted.)
0dBFS
80
0dBFS
80
-12dBFS
40
20
60
40
20
0
10
15
fOUT (MHz)
80
20
25
-12dBFS
-6dBFS
15
30
60
40
20
0
5
0dBFS
SFDR (dBc)
SFDR (dBc)
60
0
100
-12dBFS -6dBFS
-6dBFS
SFDR (dBc)
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (fCLK = 150Msps)
MAX5875 toc02
100
MAX5875 toc01
100
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (fCLK = 100Msps)
MAX5875 toc03
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (fCLK = 50Msps)
0
0
10
20
30
fOUT (MHz)
40
50
0
45
60
75
fOUT (MHz)
_______________________________________________________________________________________
5
MAX5875
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference, VREFIO = 1.25V, RL = 50Ω double-terminated,
IOUTFS = 20mA, TA = +25°C, unless otherwise noted.)
-12dBFS -6dBFS
60
40
20
0
-60
-70
-12dBFS
-80
BW = 12MHz
fOUT1 = 29.8706MHz
fOUT2 = 30.9937MHz
fOUT1
-20
OUTPUT POWER (dBFS)
-50
TWO-TONE IMD (dBc)
80
TWO-TONE IMD
(fCLK = 100Msps)
MAX5875 toc05
0dBFS
SFDR (dBc)
-40
MAX5875 toc04
100
TWO-TONE IMD vs. OUTPUT FREQUENCY
(1MHz CARRIER SPACING, fCLK = 100Msps)
MAX5875 toc06
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (fCLK = 200Msps)
fOUT2
-40
-60
2 x fOUT1 - fOUT2
2 x fOUT2 - fOUT1
-80
-90
-6dBFS
0
-100
20
0
40
60
80
100
-100
5
10
15
20
25
30
35
40
24
26
28
30
32
34
fOUT (MHz)
fOUT (MHz)
TWO-TONE IMD vs. OUTPUT FREQUENCY
(1MHz CARRIER SPACING, fCLK = 200Msps)
SFDR vs. FULL-SCALE OUTPUT CURRENT
(fCLK = 200MHz)
SFDR vs. TEMPERATURE
(fCLK = 200MHz)
-50
AOUT = -6dBFS
20mA
80
95
MAX5875 toc08
MAX5875 toc07
100
AOUT = -6dBFS
90
TA = +25°C
85
-12dBFS
10mA
60
SFDR (dBc)
-70
SFDR (dBc)
-60
5mA
40
-80
36
MAX5875 toc09
fOUT (MHz)
-40
TWO-TONE IMD (dBc)
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
TA = +85°C
80
75
TA = -40°C
70
20
-90
65
-6dBFS
0
-100
0
10
20
30
40
50
fOUT (MHz)
6
60
70
80
60
0
20
40
60
fOUT (MHz)
80
100
0
20
40
60
fOUT (MHz)
_______________________________________________________________________________________
80
100
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
+1
0
0
-1
-1
-2
-2
-3
-3
-4
260
240
220
200
180
-4
6000 18,000 30,000 42,000
AOUT = 0dBFS
6000 18,000 30,000 42,000
54,000 66,000
30
54,000 66,000
50
70
90
110 130 150 170 190
DIGITAL INPUT CODE
fCLK (MHz)
POWER DISSIPATION vs. SUPPLY VOLTAGE
(fCLK = 100MHz, fOUT = 10MHz)
FOUR-TONE POWER RATIO PLOT
(fCLK = 150MHz, fCENTER = 31.6040MHz)
ACLR FOR WCDMA MODULATION,
TWO CARRIERS
EXTERNAL REFERENCE
210
200
INTERNAL REFERENCE
fOUT2
fOUT1 = 29.9997MHz
fOUT3 f
= 31.0251MHz
OUT2
fOUT3 = 32.0640MHz
fOUT4 = 32.9829MHz
-20
OUTPUT POWER (dBFS)
230
BW = 12MHz
fOUT1
fOUT4
-40
-60
-80
-30
ANALOG OUTPUT POWER (dBm)
AOUT = 0dBFS
220
0
MAX5875 toc13
240
MAX5875 toc14
DIGITAL INPUT CODE
fCLK = 184.32MHz
fCENTER = 30.72MHz
ACLR = 76dB
-40
MAX5875 toc15
+1
DNL (LSB)
+2
POWER DISSIPATION (mW)
+3
+2
280
MAX5875 toc11
+3
INL (LSB)
+4
MAX5875 toc10
+4
POWER DISSIPATION (mW)
POWER DISSIPATION vs. CLOCK
FREQUENCY (fOUT = 10MHz)
DIFFERENTIAL NONLINEARITY
vs. DIGITAL INPUT CODE
MAX5875 toc12
INTEGRAL NONLINEARITY
vs. DIGITAL INPUT CODE
-50
-60
-70
-80
-90
-100
-110
190
3.135
-120
-100
3.235
3.335
SUPPLY VOLTAGE (V)
3.435
26
28
30
32
34
36
38
3.05MHz/div
fOUT (MHz)
_______________________________________________________________________________________
7
MAX5875
Typical Operating Characteristics (continued)
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference, VREFIO = 1.25V, RL = 50Ω double-terminated,
IOUTFS = 20mA, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference, VREFIO = 1.25V, RL = 50Ω double-terminated,
IOUTFS = 20mA, TA = +25°C, unless otherwise noted.)
ACLR FOR WCDMA MODULATION,
SINGLE CARRIER
-40
fCARRIER = 61.44MHz
fCLK = 184.32MHz
ACLR = 75dB
ADJACENT
84
84.0
ALTERNATE
83
-50
82.5
82
ACLR (dB)
-60
-70
-80
81
80
-90
79
-100
78
-110
77
-120
MAX5875 toc17
-30
WCDMA BASEBAND ACLR
85
MAX5875 toc16
-20
ANALOG OUTPUT POWER (dBm)
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
80.4
80.5
80.1
79.4
79.0
78.8
76
DC
92.16MHz
1
9.2MHz/div
2
3
4
NUMBER OF CARRIERS
Pin Description
PIN
NAME
1–9
A8, A7, A6,
A5, A4, A3,
A2, A1, A0
10, 12, 13, 15,
20, 23, 26, 27,
30, 33, 36, 43
GND
11
DVDD3.3
Digital Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
14, 21, 22, 31,
32
AVDD3.3
Analog Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass each pin with
a 0.1µF capacitor to GND.
16
REFIO
Reference I/O. Output of the internal 1.2V precision bandgap reference. Bypass with a 1µF
capacitor to GND. REFIO can be driven with an external reference source. See Table 1.
17
FSADJ
Full-Scale Adjust Input. This input sets the full-scale output current of the DAC. For a 20mA fullscale output current, connect a 2kΩ resistor between FSADJ and DACREF. See Table 1.
18
DACREF
Current-Set Resistor Return Path. Internally connected to GND. Do not use an external ground
connection.
19, 34
AVDD1.8
Analog Supply Voltage. Accepts a 1.71V to 1.89V supply voltage range. Bypass each pin with a
0.1µF capacitor to GND.
24
OUTQN
Complementary Q-DAC Output. Negative terminal for current output.
25
OUTQP
Q-DAC Output. Positive terminal for current output.
28
OUTIN
Complementary I-DAC Output. Negative terminal for current output.
29
OUTIP
I-DAC Output. Positive terminal for current output.
35
AVCLK
Clock Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
8
FUNCTION
Data Bits A8–A0. In dual-port mode, data is directed to the Q-DAC. In single-port mode, data bits
are not used. Connect bits A8–A0 to GND in single-port mode.
Converter Ground
_______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
PIN
NAME
37
CLKN
Complementary Converter Clock Input. Negative input terminal for differential converter clock.
Internally biased to AVCLK / 2.
38
CLKP
Converter Clock Input. Positive input terminal for differential converter clock. Internally biased to
AVCLK / 2.
39
TORB
Two’s-Complement/Binary Select Input. Set TORB to a CMOS-logic-high level to indicate a two’scomplement input format. Set TORB to a CMOS-logic-low level to indicate a binary input format.
TORB has an internal pulldown resistor.
40
PD
41
DORI
Dual-(Parallel)/Single-(Interleaved) Port Select Input. Set DORI high to configure as a dual-port
DAC. Set DORI low to configure as a single-port interleaved DAC. DORI has an internal pulldown
resistor.
42
XOR
DAC Exclusive-OR Select Input. Set XOR low to allow the data stream to pass unchanged to the
DAC input. Set XOR high to invert the input data into the DAC. If unused, connect XOR to GND.
44
SELIQ
DAC Select Input. Set SELIQ low to direct data into the Q-DAC inputs. Set SELIQ high to direct
data into the I-DAC inputs. If unused, connect SELIQ to GND. SELIQ’s logic state is only valid in
single-port (interleaved) mode.
45–60
FUNCTION
Power-Down Input. Set PD high to force the DAC into power-down mode. Set PD low for normal
operation. PD has an internal pulldown resistor.
B15, B14, B13,
B12, B11, B10,
Data Bits B15–B0. In dual-port mode, data is directed to the I-DAC. In single-port mode, the state
B9, B8, B7, B6,
of SELIQ determines where the data bits are directed.
B5, B4, B3, B2,
B1, B0
61
DVDD1.8
62–68
A15, A14,
A13, A12,
A11, A10, A9
—
EP
Digital Supply Voltage. Accepts a 1.71V to 1.89V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
Data Bits A15–A9. In dual-port mode, data is directed to the Q-DAC. In single-port mode, data
bits are not used. Connect bits A15–A9 to GND in single-port mode.
Exposed Pad. Must be connected to GND through a low-impedance path.
Detailed Description
Architecture
The MAX5875 high-performance, 16-bit, dual currentsteering DAC (Figure 1) operates with DAC update rates
up to 200Msps. The converter consists of input registers
and a demultiplexer for single-port (interleaved) mode,
followed by a current-steering array. During operation in
interleaved mode, the input data registers demultiplex
the single-port data bus. The current-steering array generates differential full-scale currents in the 2mA to 20mA
range. An internal current-switching network, in combination with external 50Ω termination resistors, converts the
differential output currents into dual differential output
voltages with a 0.1V to 1V peak-to-peak output voltage
range. An integrated 1.2V bandgap reference, control
amplifier, and user-selectable external resistor determine
the data converter’s full-scale output range.
Reference Architecture and Operation
The MAX5875 supports operation with the internal 1.2V
bandgap reference or an external reference voltage
source. REFIO serves as the input for an external, lowimpedance reference source. REFIO also serves as a
reference output when the DAC operates in internal reference mode. For stable operation with the internal reference, decouple REFIO to GND with a 1µF capacitor. Due
to its limited output-drive capability, buffer REFIO with an
external amplifier when driving large external loads.
_______________________________________________________________________________________
9
MAX5875
Pin Description (continued)
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
DVDD3.3
GND
DVDD1.8
AVDD1.8
AVDD3.3
OUTIP
TORB
LATCH
DORI
XOR/
DECODE
LATCH
LATCH
DAC
OUTIN
SELIQ
CMOS
RECEIVER
DATA15–
DATA0
LATCH
XOR
OUTQP
LATCH
XOR/
DECODE
LATCH
LATCH
DAC
OUTQN
AVCLK
CLKP
CLKN
DACREF
CLK
INTERFACE
REFIO
1.2V
REFERENCE
GND
FSADJ
MAX5875
POWER-DOWN
BLOCK
PD
GND
Figure 1. MAX5875 High-Performance, 16-Bit, Dual Current-Steering DAC
The MAX5875’s reference circuit (Figure 2) employs a
control amplifier to regulate the full-scale current
IOUTFS for the differential current outputs of the DAC.
Calculate the full-scale output current as follows:
IOUTFS = 32 ×

VREFIO
1 
× 1 −

16
RSET

2 
where I OUTFS is the full-scale output current of the
DAC. R SET (located between FSADJ and DACREF)
determines the amplifier’s full-scale output current for
the DAC. See Table 1 for a matrix of different IOUTFS
and RSET selections.
Analog Outputs (OUTIP, OUTIN,
OUTQP, OUTQN)
Each MAX5875 DAC outputs two complementary currents (OUTIP/N, OUTQP/N) that operate in a singleended or differential configuration. A load resistor
converts these two output currents into complementary
10
single-ended output voltages. A transformer or a differential amplifier configuration converts the differential
voltage existing between OUTIP (OUTQP) and OUTIN
(OUTQN) to a single-ended voltage. If not using a
transformer, the recommended termination from the
output is a 25Ω termination resistor to ground and a
50Ω resistor between the outputs.
Table 1. IOUTFS and RSET Selection
Matrix Based on a Typical 1.200V
Reference Voltage
RSET (Ω)
FULL-SCALE
CURRENT IOUTFS (mA)
CALCULATED
1% EIA STD
2
19.2k
19.1k
5
7.68k
7.5k
10
3.84k
3.83k
15
2.56k
2.55k
20
1.92k
1.91k
______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
MAX5875
1.2V
REFERENCE
AVDD
CURRENT
SOURCES
10kΩ
CURRENT
SWITCHES
REFIO
1µF
OUTIP
FSADJ
CURRENT-SOURCE
ARRAY DAC
IREF
RSET
IOUT
OUTIN
IOUT
DACREF
OUTIN OUTIP
IREF = VREFIO / RSET
Figure 2. Reference Architecture, Internal Reference
Configuration
Figure 3. Simplified Analog Output Structure
To generate a single-ended output, select OUTIP (or
OUTQP) as the output and connect OUTIN (or OUTQN)
to GND. SFDR degrades with single-ended operation.
Figure 3 displays a simplified diagram of the internal
output structure of the MAX5875.
Table 2. DAC Output Code Table
Clock Inputs (CLKP, CLKN)
The MAX5875 features flexible differential clock inputs
(CLKP, CLKN) operating from a separate supply
(AV CLK) to achieve the optimum jitter performance.
Drive the differential clock inputs from a single-ended
or a differential clock source. For single-ended operation, drive CLKP with a logic source and bypass CLKN
to GND with a 0.1µF capacitor.
CLKP and CLKN are internally biased to AVCLK / 2. This
facilitates the AC-coupling of clock sources directly to
the device without external resistors to define the DC
level. The dynamic input resistance from CLKP and
CLKN to ground is > 5kΩ.
Data Timing Relationship
Figure 4 displays the timing relationship between digital
CMOS data, clock, and output signals. The MAX5875
features a 1.5ns hold, a -1.2ns setup, and a 1.1ns propagation delay time. A nine (eight)-clock-cycle latency
exists between CLKP/CLKN and OUTIP/OUTIN
(OUTQP/OUTQN) when operating in single-port (interleaved) mode. In dual-port (parallel) mode, the clock
latency is 5.5 clock cycles for both channels. Table 2
shows the DAC output codes.
DIGITAL INPUT CODE
OFFSET BINARY
TWO’S
COMPLEMENT
0000 0000 0000 0000 1000 0000 0000 0000
OUT_P
OUT_N
0
IOUTFS
0111 1111 1111 1111 0000 0000 0000 0000 IOUTFS / 2 IOUTFS / 2
1111 1111 1111 1111 0111 1111 1111 1111
IOUTFS
0
CMOS-Compatible Digital Inputs
Input Data Format Select (TORB, DORI)
The TORB input selects between two’s-complement or
binary digital input data. Set TORB to a CMOS-logichigh level to indicate a two’s-complement input format.
Set TORB to a CMOS-logic-low level to indicate a binary
input format.
The DORI input selects between a dual-port (parallel) or
single-port (interleaved) DAC. Set DORI high to configure
the MAX5875 as a dual-port DAC. Set DORI low to configure the MAX5875 as a single-port DAC. In dual-port
mode, connect SELIQ to ground.
CMOS DAC Inputs (A15/B15–A0/B0, XOR, SELIQ)
The MAX5875 latches input data on the rising edge of the
clock in a user-selectable two’s-complement or binary
format. A logic-high voltage on TORB selects two’scomplement and a logic-low selects offset binary format.
______________________________________________________________________________________
11
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
DATA15–DATA0, XOR
N0 - 1
N
N0 + 1
N0 + 2
tH
tS
CLK
tPD
DAC OUTPUT
N0 - 2
N0 - 4
N0 - 5
N0 - 6
N0 - 3
(a) DUAL-PORT (PARALLEL) TIMING DIAGRAM
CLK
I0
DATAIN
Q0
I1
Q1
I2
Q2
I3
Q3
SELIQ
tS
tH
I0 - 4
I0 - 5
I OUT
Q OUT
I0 - 3
I0 - 2
I0 - 6
Q0 - 6
Q0 - 5
Q0 - 4
Q0 - 3
tPD
Q0 - 2
(b) SINGLE-PORT (INTERLEAVED) TIMING DIAGRAM
Figure 4. Timing Relationships Between Clock and Input Data for (a) Dual-Port (Parallel) Mode and (b) Single-Port (Interleaved) Mode
The MAX5875 includes a single-ended, CMOS-compatible XOR input. Input data (all bits) are compared with the
bit applied to XOR through exclusive-OR gates. Pulling
XOR high inverts the input data. Pulling XOR low leaves
the input data noninverted. By applying a previously
encoded pseudo-random bit stream to the data input and
applying decoding to XOR, the digital input data can be
decorrelated from the DAC output, allowing for the troubleshooting of possible spurious or harmonic distortion
degradation due to digital feedthrough on the printed circuit board (PCB).
12
A15/B15–A0/B0, XOR, and SELIQ are latched on the rising edge of the clock. In single-port mode (DORI pulled
low) a logic-high signal on SELIQ directs the B15–B0
data onto the I-DAC inputs. A logic-low signal at SELIQ
directs data to the Q-DAC inputs. In dual-port (parallel)
mode (DORI pulled high), data on pins A15–A0 are
directed onto the Q-DAC inputs and B15–B0 are directed
onto the I-DAC inputs.
Power-Down Operation (PD)
The MAX5875 also features an active-high powerdown mode that reduces the DAC’s digital current
______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
0.1µF
CLKP
25Ω
SINGLE-ENDED
CLOCK SOURCE
TO DAC
1:1
25Ω
0.1µF
CLKN
GND
Figure 5. Differential Clock-Signal Generation
consumption from 22.5mA to less than 2µA and the
analog current consumption from 78mA to less than
3µA. Set PD high to power down the MAX5875. Set PD
low for normal operation.
When powered down, the power consumption of the
MAX5875 is reduced to less than 14µW. The MAX5875
requires 10ms to wake up from power-down and enter a
fully operational state. The PD integrated pulldown resistor
activates the MAX5875 if PD is left floating.
Applications Information
CLK Interface
The MAX5875 features a flexible differential clock input
(CLKP, CLKN) with a separate supply (AV CLK ) to
achieve optimum jitter performance. Use an ultra-low
jitter clock to achieve the required noise density. Clock
Differential-to-Single-Ended Conversion
Using a Wideband RF Transformer
Use a pair of transformers (Figure 6) or a differential
amplifier configuration to convert the differential voltage
existing between OUTIP/OUTQP and OUTIN/OUTQN to
a single-ended voltage. Optimize the dynamic performance by using a differential transformer-coupled output to limit the output power to < 0dBm full scale. Pay
close attention to the transformer core saturation characteristics when selecting a transformer for the
MAX5875. Transformer core saturation can introduce
strong 2nd-order harmonic distortion, especially at low
output frequencies and high signal amplitudes. For best
results, center tap the transformer to ground. When not
using a transformer, terminate each DAC output to
ground with a 25Ω resistor. Additionally, place a 50Ω
resistor between the outputs (Figure 7).
50Ω
T2, 1:1
OUTIP/OUTQP
DATA15–DATA0
100Ω
MAX5875
16
VOUT, SINGLE-ENDED
T1, 1:1
OUTIN/OUTQN
50Ω
GND
WIDEBAND RF TRANSFORMER T2 PERFORMS THE
DIFFERENTIAL-TO-SINGLE-ENDED CONVERSION
Figure 6. Differential to Single-Ended Conversion Using a Wideband RF Transformer
______________________________________________________________________________________
13
MAX5875
WIDEBAND RF TRANSFORMER
PERFORMS SINGLE-ENDED-TODIFFERENTIAL CONVERSION
jitter must be less than 0.5psRMS for meeting the specified noise density. For that reason, the CLKP/CLKN
input source must be designed carefully. The differential clock (CLKN and CLKP) input can be driven from a
single-ended or a differential clock source. Differential
clock drive is required to achieve the best dynamic
performance from the DAC. For single-ended operation, drive CLKP with a low noise source and bypass
CLKN to GND with a 0.1µF capacitor.
Figure 5 shows a convenient and quick way to apply a
differential signal created from a single-ended source
(e.g., HP/Agilent 8644B signal generator) and a wideband transformer. Alternatively, these inputs may be driven from a CMOS-compatible clock source; however, it
is recommended to use sinewave or AC-coupled differential ECL/PECL drive for best dynamic performance.
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
25Ω
OUTIP/OUTQP
DATA15–DATA0
50Ω
MAX5875
16
OUTP
OUTN
OUTIN/OUTQN
25Ω
GND
Figure 7. Differential Output Configuration
For a single-ended unipolar output, select OUTIP
(OUTQP) as the output and ground OUTIN (OUTQN) to
GND. Driving the MAX5875 single-ended is not recommended since additional noise and distortion will
be added.
The distortion performance of the DAC depends on the
load impedance. The MAX5875 is optimized for 50Ω
differential double termination. It can be used with a
transformer output as shown in Figure 6 or just one 25Ω
resistor from each output to ground and one 50Ω resistor between the outputs (Figure 7). This produces a fullscale output power of up to -2dBm, depending on the
output current setting. Higher termination impedance
can be used at the cost of degraded distortion performance and increased output noise voltage.
short and run lengths matched to avoid propagation
delay and data skew mismatches.
The MAX5875 requires five separate power-supply inputs
for analog (AVDD1.8 and AVDD3.3), digital (DVDD1.8 and
DVDD3.3), and clock (AVCLK) circuitry. Decouple each
AVDD, DVDD, and AVCLK input pin with a separate 0.1µF
capacitor as close to the device as possible with the
shortest possible connection to the ground plane (Figure
8). Minimize the analog and digital load capacitances for
optimized operation. Decouple all three power-supply
voltages at the point they enter the PCB with tantalum or
electrolytic capacitors. Ferrite beads with additional
decoupling capacitors forming a pi-network could also
improve performance.
The analog and digital power-supply inputs AV DD3.3,
AVCLK, and DVDD3.3 allow a 3.135V to 3.465V supply
voltage range. The analog and digital power-supply
inputs AVDD1.8 and DVDD1.8 allow a 1.71V to 1.89V
supply voltage range.
The MAX5875 is packaged in a 68-pin QFN-EP package,
providing greater design flexibility and optimized DAC
AC performance. The EP enables the use of necessary
grounding techniques to ensure highest performance
operation. Thermal efficiency is not the key factor, since
the MAX5875 features low-power operation. The exposed
pad ensures a solid ground connection between the DAC
and the PCB’s ground layer.
BYPASSING—DAC LEVEL
AVDD1.8
Grounding, Bypassing, and PowerSupply Considerations
Grounding and power-supply decoupling can strongly
influence the MAX5875 performance. Unwanted digital
crosstalk couples through the input, reference, power
supply, and ground connections, and affects dynamic
performance. High-speed, high-frequency applications
require closely followed proper grounding and powersupply decoupling. These techniques reduce EMI and
internal crosstalk that can significantly affect the
MAX5875 dynamic performance.
Use a multilayer PCB with separate ground and powersupply planes. Run high-speed signals on lines directly
above the ground plane. Keep digital signals as far
away from sensitive analog inputs and outputs, reference inputs sense lines, and clock inputs as practical.
Use a controlled-impedance symmetric design of clock
input and the analog output lines to minimize 2nd-order
harmonic-distortion components, thus optimizing the
DAC’s dynamic performance. Keep digital signal paths
14
AVDD3.3
0.1µF
AVCLK
0.1µF
0.1µF
OUTIP/OUTQP
DATA15–DATA0
MAX5875
16
OUTIN/OUTQN
0.1µF
DVDD1.8
0.1µF
DVDD3.3
*BYPASS EACH POWER-SUPPLY PIN INDIVIDUALLY.
Figure 8. Recommended Power-Supply Decoupling and
Bypassing Circuitry
______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
Static Performance Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best straight-line fit
(closest approximation to the actual transfer curve) or a
line drawn between the end points of the transfer function, once offset and gain errors have been nullified.
For a DAC, the deviations are measured at every individual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees a
monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and
the actual offset current. For a DAC, the offset point is
the average value at the output for the two midscale
digital input codes with respect to the full scale of the
DAC. This error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the
actual full-scale output voltage on the transfer curve,
after nullifying the offset error. This error alters the slope
of the transfer function and corresponds to the same
percentage error in each step.
error (residual error). The ideal, theoretical minimum can
be derived from the DAC’s resolution (N bits):
SNR = 6.02 x N + 1.76
However, noise sources such as thermal noise, reference
noise, clock jitter, etc., affect the ideal reading; therefore,
SNR is computed by taking the ratio of the RMS signal to
the RMS noise, which includes all spectral components
minus the fundamental, the first four harmonics, and the
DC offset.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of RMS amplitude of the carrier frequency (maximum signal components) to the RMS value
of their next-largest distortion component. SFDR is usually measured in dBc and with respect to the carrier frequency amplitude or in dBFS with respect to the DAC’s
full-scale range. Depending on its test condition, SFDR is
observed within a predefined window or to Nyquist.
Two-Tone Intermodulation Distortion (IMD)
The two-tone IMD is the ratio expressed in dBc (or dBFS)
of the worst 3rd-order (or higher) IMD product(s) to either
output tone.
Adjacent Channel Leakage Power Ratio (ACLR)
Commonly used in combination with wideband codedivision multiple-access (W-CDMA), ACLR reflects the
leakage power ratio in dB between the measured
power within a channel relative to its adjacent channel.
ACLR provides a quantifiable method of determining
out-of-band spectral energy and its influence on an
adjacent channel when a bandwidth-limited RF signal
passes through a nonlinear device.
Settling Time
The settling time is the amount of time required from the
start of a transition until the DAC output settles its new
output value to within the converter’s specified accuracy.
Glitch Impulse
A glitch is generated when a DAC switches between two
codes. The largest glitch is usually generated around the
midscale transition, when the input pattern transitions from
011...111 to 100...000. The glitch impulse is found by integrating the voltage of the glitch at the midscale transition
over time. The glitch impulse is usually specified in pV•s.
Dynamic Performance Parameter Definitions
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital samples, the theoretical maximum SNR is the ratio of the fullscale analog output (RMS value) to the RMS quantization
______________________________________________________________________________________
15
MAX5875
The data converter die attaches to an EP lead frame with
the back of this frame exposed at the package bottom
surface, facing the PCB side of the package. This allows
for a solid attachment of the package to the PCB with
standard infrared reflow (IR) soldering techniques. A specially created land pattern on the PCB, matching the size
of the EP (6mm x 6mm), ensures the proper attachment
and grounding of the DAC. Refer to the MAX5875 EV kit
data sheet. Designing vias into the land area and implementing large ground planes in the PCB design allow for
the highest performance operation of the DAC. Use an
array of at least 4 x 4 vias (≤ 0.3mm diameter per via hole
and 1.2mm pitch between via holes) for this 68-pin QFNEP package. Connect the MAX5875 exposed paddle to
GND. Vias connect the land pattern to internal or external
copper planes. Use as many vias as possible to the
ground plane to minimize inductance.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
68L QFN.EPS
MAX5875
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
PACKAGE OUTLINE, 68L QFN, 10x10x0.9 MM
1
C
21-0122
2
PACKAGE OUTLINE, 68L QFN, 10x10x0.9 MM
1
C
21-0122
2
Revision History
Pages changed at Rev 2: 1–16
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products, Inc.