OCTOBER2009
ALSO PUBLISHED ONLINE:
www.highfrequencyelectronics.com
FIND OUT WHAT’S NEW
IN THIS ISSUE’S EXTENDED
PRODUCT COVERAGE
INSIDE THIS ISSUE:
Precoded and Spatially Multiplexed MIMO in LTE
Selecting High Linearity Mixers for Wireless Base Stations
Tutorial—Connector Specifications for RF Applications and More
Technology Report—EDA Tools for IC Design
Featured Products —Wireless RFICs, High Power, Optical Products
Online Edition
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TABLE OF CONTENTS
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OCTOBER2009
ALSO PUBLISHED ONLINE AT:
www.highfrequencyelectronics.com
Vol. 8 No. 10
You can view this issue page-by-page, or click on any of
the articles or columns in the Table of Contents below
18
16
40
precoded mimo
high frequency applications
selecting mixers
Precoding and Spatially
Multiplexed MIMO in
3GPP Long-Term
Evolution
Optical Research News
Selecting High-Linearity
Mixers for Wireless
Basestations
Stephanie Overhoff
Randall T. Becker
34
tutorial
A Summary of
Connector Specifications for RF and
Other Applications
Gary Breed
52
product coverage
New Products
48
28
product coverage
Featured Products
technology report
EDA Tools for RFIC
Design: Business and
Product News
64
design notes
Applying Engineering
Knowledge to
Everyday Life
Regular Columns
6 Editorial
12 In the News
63 Advertiser Index
8 Meetings & Events
52 New Products
64 Design Notes
October 2009
5
EDITORIAL
Editorial Director
Gary Breed
gary@highfrequencyelectronics.com
Tel: 608-437-9800
Fax: 608-437-9801
Publisher
Scott Spencer
scott@highfrequencyelectronics.com
Tel: 603-472-8261
Fax: 603-471-0716
Technologies May
Come and Go, but
Knowledge is Forever
Associate Publisher
Tim Burkhard
tim@highfrequencyelectronics.com
Tel: 707-544-9977
Fax: 707-544-9375
Associate Editor
Katie Landmark
katie@highfrequencyelectronics.com
Tel: 608-437-9800
Fax: 608-437-9801
Business Office
High Frequency Electronics
7 Colby Court, Suite 7-436
Bedford, NH 03110
Editorial and Production Office
High Frequency Electronics
104 S. Grove Street
Mount Horeb,WI 53572
Also Published Online at
www.highfrequencyelectronics.com
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Tel: 651-292-0629
Fax: 651-292-1517
circulation@highfrequencyelectronics.com
High Frequency Electronics (USPS 024-316) is
published monthly by Summit Technical Media,
LLC, 3 Hawk Dr., Bedford, NH 03110. Vol. 8 No.
10, October 2009. Periodicals Postage Paid at
Manchester, NH and at additional mailing
offices.
POSTMASTER: Send address corrections to High
Frequency Electronics, PO Box 10621, Bedford,
NH 03110-0621.
Subscriptions are free to qualified technical and
management personnel involved in the design,
manufacture and distribution of electronic
equipment and systems at high frequencies.
Copyright © 2009, Summit Technical Media, LLC
6
High Frequency Electronics
Gary Breed
Editorial Director
I
find the highly publicized battles over competing
wireless technologies entertaining, because the socalled “winner” only has a temporary victory.
Today’s dominant technology is guaranteed to be
replaced by something else in the future—sometimes
the very near future.
For example, in historical terms, analog cellular
technology existed just for an eyeblink, even less for
most of the early digital formats. Now we have various
technologies for high data rate 4G competing for a place in the wireless
market, but even as the first LTE and WiMAX networks are being built,
there is already talk about how the next generation of wireless may merge
the technical strengths of both.
The displacement of past technologies isn’t always so fast. We just completed a transition to digital broadcast television that has been in the
works since the early 1990s. The analog NTSC technology it replaced was
developed before World War II, with color capability added in 1953. Our
AM broadcast technology goes back more than 100 years, although an
overlaid digital system is now used by some stations. FM is operating similarly, but the technology developed by Armstrong isn’t quite as old as AM,
dating to the 1930s. The slower change in radio broadcasting can be
attributed to entrenched commercial interest by the broadcasters, the
monetary and social cost of change, and by a low level of interest in those
particular frequency bands by competing wireless technologies. Still,
despite the long lifetime of radio broadcast technology, it is now changing
to digital transmission technologies.
Many technologies have been replaced quickly after failing to get the
attention of consumers and regulators, or simply made obsolete by rapid
development of something new. Over the past 50 years, music recordings
have evolved repeatedly, from vinyl discs and reel-to-reel tapes, 8-track
tapes, cassette tapes and CDs, to digital downloads and MP3 playback
devices. In a similar time frame, overall electronic technology has changed
from vacuum tubes to transistors, then to building block ICs and on to
complex multi-function ICs. During this same time, many circuit functions
have changed from analog operation to an implementation using numerically defined digital operations.
...and there are a thousand other examples.
All Lessons Learned Contribute to Our Knowledge
online search, not a trip to the company or university library.
Until those important past references are available online, try to
find and study all the available
resources. Your next engineering
assignment will benefit from a better understanding of its historical
and technical background!
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AKT18121
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33.0 31.0 28.0 +/-3.5 +/-3.5 6.0 6.5
7.0
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33.0 31.0 28.0 +/-3.5 +/-3.5 6.0 6.5
7.0
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GA
Another way to say this is that
nothing you learn is wasted.
Technical knowledge is cumulative;
old knowledge is incorporated with
new discoveries. Sure, concepts
that were incomplete or mistaken
are removed from our technical
“database” of information, but they
still play an important historical
role, revealing how we go about the
process of learning. At the very
least, they remind us of mistakes
that should not be repeated!
With these things in mind, it is
important to maintain a record of
the old information upon which
new ideas are built. One of the present frustrations of using the
Internet for research is that much
of the older, but still valuable, reference material has not yet been
archived in digital form. Hopefully,
efforts will continue to digitize
more of this “classic” material and
make it available to the current
generation of engineers—who usually begin a new project with an
TELE
Yes, change is inevitable. But
past technologies—whether obsolete or the losers in marketplace
battles—are valuable. They make a
permanent contribution to our
knowledge of how things work. For
example, the Video Disc may have
been a marketplace failure, but it
was the first attempt at mass-produced video recording. During its
development, engineers learned
many of the lessons—good and
bad—about the process of encoding
signals and manufacturing an
optics-based storage medium.
I was working in the broadcast
industry when AM stereo was
being developed. Another marketplace failure, it never achieved
much deployment, even after a system was approved by the FCC. Yet,
the development efforts and extensive debate over the various proposed methods provided an indepth analysis of radio signal
behavior, including propagation
effects, interference potential,
bandwidth occupancy, amplitudephase relationships, antenna performance and other fundamental
principles—the same set of issues
involved in today’s methods for
transmitting digital signals.
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MEETINGS & EVENTS
CONFERENCES
October 27-29, 2009
3rd IEEE International Symposium on Microwave,
Antenna, Propagation, and EMC Technologies for
Wireless Communications
Beijing, China
Information: Conference Web site
http://mape09.bjtu.edu.cn
November 1-6, 2009
AMTA 2009—Antenna Measurement
Techniques Association
Salt Lake City, UT
Information: Conference Web site
http://www.amta.org/amta2009
November 8-11, 2009
58th International Wire & Cable and
Connectivity Symposium
Charlotte, NC
Information: Conference Web site
http://www.iwcs.org
November 9-11, 2009
2nd International IEEE Conference on Microwaves,
Communications, Antennas and Electronic Systems
Tel-Aviv, Israel
Information: Conference Web site
http://www.comcas.org
November 16-17, 2009
LAPC 2009—Loughborough Antennas and
Propagation Conference
Loughborough, UK
Information: Conference Web site
http://www.lapconf.co.uk
November 23-24, 2009
ARMMS RF and Microwave Society Conference
Corby, England
Information: Conference Web site
http://www.armms.org
December 1-4, 2009
Fall 2009 ARFTG Microwave Measurement Symposium
Broomfield, CO
Information: Conference Web site
http://www.arftg.org
December 3-5, 2009
2009 IEEE International Conference on Antennas,
Propagation and Systems
Johor Bahru, Malaysia
Information: Conference Web site
http://www.fke.utm.my/INAS09/
December 7-9, 2009
2009 IEEE International Electron Devices Meeting (IEDM)
Baltimore, MD
Information: Conference Web site
http://www.ieee-iedm.org
December 7-10, 2009
2009 Asia-Pacific Microwave Conference
Singapore
Information: Conference Web site
http://www.apmc2009.org
December 9-11, 2009
2009 IEEE Radio-Frequency Integration Technology
Symposium
Singapore
Information: Conference Web site
http://www.ieee-rfit.org
December 14-16, 2009
IEEE Applied Electromagnetics Conference
Kolkata, India
Information: Conference Web site
http://ieee-aemc.org
January 10-14, 2010
Radio Wireless Week:
IEEE Radio and Wireless Symposium (RWS);
IEEE Topical Meeting on Silicon Monolithic Integrated
Circuits in RF Systems (SiRF)
New Orleans, LA
Information: Conference Web site
http://www.silicon-rf.org/sirf2010/
SHORT COURSES
Besser Associates
201 San Antonio Circle, Suite 115
Mountain View, CA 94040
Tel: 650-949-3300; Fax: 650-949-4400
E-mail: info@besserassociates.com
http://www.besserassociates.com
Applied RF Techniques II
November 16-20, 2009, Phoenix, AZ
Applied RF Techniques for Modern Radio Design
November 16-20, 2009, Phoenix, AZ
Linearization and Modeling Techniques for RF Power
Amplifiers in Modern Communication Systems
November 17-20, 2009, Phoenix, AZ
DSP Made Simple for Engineers
November 18-20, 2009, Phoenix, AZ
Frequency Synthesis and Phase-Locked Loop Design
November 18-20, 2009, Phoenix, AZ
Send announcements concerning Conferences, Calls for Papers and Short Courses via e-mail to:
editor@highfrequencyelectronics.com, or mail to the Editorial and Production Office, address on page 6
8
High Frequency Electronics
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MEETINGS & EVENTS
Kimmel Gerke Associates, Ltd.,
with Tektronix
628 LeVander Way
South St. Paul, MN 55075
Tel: 1-888-EMI-GURU (364-4878)
http://www.emiguru.com/seminartek.htm
Designing for EMC/SI: Grounding and Shielding—
EMC/SI in printed circuit boards; and EMC troubleshooting workshop
November 2-3, 2009, San Jose, CA
November 9-10, 2009, Los Angeles, CA
November 16-17, 2009, Phoenix, AZ
UCLA - WINMEC
44-116S Engr. IV
420 Westwood Plaza
Los Angeles, CA. 90095
Tel: 310-267-4979
http://www.winmec.ucla.edu/rfid/experience/Oct2009/
RFID Hands On Workshop
October 20, 2009, UCLA-WINMEC RFID Lab
AWR Corporation
Dr. John Dunn
Senior Applications Engineer
Director of Training and University Programs
Tel: 760-402-3440; Fax: 866-548-8769
E-mail: john.dunn@awrcorp.com
AWR has launched a free online training program to
help its customers become more proficient with the
company’s high-frequency design tools in the comfort
of their home or office. The training is module-based
for manageable time commitment, and each video presentation consists of three 90-minute webinars (60
minutes of content and 30 minutes of Q&A). The
schedule is flexible, with modules offered over several
weeks. Customers can view live lectures via telephone
and Web browser, or replay them at a more convenient
time. Each lecture comes with a 90-minute take-home
exercise designed to enhance understanding of the
material. Current topics include: Advanced EM concepts for Planar Simulators; Setting Up EM in
Microwave Office; AXIEM Concepts; Introduction to
Microwave Office; Controlling Layout in Microwave
Office; and Using Harmonic Balance.
CALLS
FOR
PAPERS
IEEE Transactions on Antennas and Propagaion
Announces a Special Issue on Antennas for NextGeneration Radio Telescopes
Publication Date: December 2010
Paper Submission Deadline: November 30, 2009
Topics:
Topics of interest include multi-pixel approaches
based on broadband phased array aperture antennas
and phased array feeds, broadband single-pixel feeds,
10
High Frequency Electronics
numerical modeling, design optimization, array calibration, beamforming, and experimental results. It is
anticipated that one of the main emphases will be the
connection between electrical and electromagnetic
antenna properties and the system-level performance
requirements for efficiency, sensitivity, field of view,
imaging dynamic range, and polarization purity.
Papers on these topics and others related to antenna
development for radio astronomy are solicited for the
Special Issue.
Information:
Manuscripts should conform to the requirements for
regular papers as specified on the Web site
(http://www.ict.csiro.au/aps). All papers must be submitted through the AP Transactions Manuscript
Central Web site (http://mc.manuscriptcentral.com/
tap-ieee), with a statement to the Editor-in-Chief, Dr.
Trevor S. Bird, that they are intended for this Special
Issue.
CAVMAG 2010: Origins and Evolution of the Cavity
Magnetron
Bournemouth University, UK
Conference Dates: April 19-20, 2010
Paper Submission Deadline: December 4, 2009
Topics:
Papers are invited on the following aspects: Origins of
the magnetron in the various countries involved; Its
subsequent development, both in early and later days;
The latest trends; Applications to civil and military
radar systems; and other uses, such as microwave
ovens.
Information:
Preliminary 200 word abstracts, proposals for papers,
etc. should be sent to the Conference Chair, Keith
Thrower kthrower@theiet.org as soon as possible.
Complete preliminary invited and submitted papers
are due December 4, 2009, and it is planned to
announce acceptances by January 18, 2010. Accepted
papers will be required in final form as PDF files
March 1, 2010. The papers submitted by 4 December
2009 should be not more than six sides in length, and
authors are recommended to submit them in the format required for the final accepted papers. Complete
details are available at http://cavmag2010.org.uk/
2010 International Symposium on Phased Array
Systems & Technology
Boston, MA
Conference Dates: October 12-15, 2010
Abstract Submission Deadline: December 1, 2009
Topics:
A complete list of topics is available on the Web site:
http://www.array2010.org.
Information:
Email PDF summary or complete paper to:
submit@array2010.org. Abstracts (1000 words min.)
are due by December 1, 2009.
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IN THE NEWS
Technology News
An MIT research team
led by Tomas Palacios,
assistant professor in
the
Department
of
Electrical Engineering
and Computer Science,
has succeeded in combining two semiconductor materials, silicon and
gallium nitride, that
have
different
and
potentially complementary characteristics, into
a single hybrid microchip. This is something researchers
have been attempting to do for decades. This advance
could point to a way of overcoming fundamental barriers
of size and speed facing today’s silicon chips.
Business News
TriQuint Semiconductor, Inc. announced its acquisition of TriAccess Technologies, a provider of Cable TV
(CATV) and Fiber-to-the-Premise (FTTP) integrated circuits for the amplification of high quality multimedia content. Previously, TriQuint served as TriAccess’ foundry
supplier. Terms of the acquisition were not disclosed.
TriAccess’ results are not expected to materially impact
TriQuint’s net income.
Anritsu Company announces it has been named one of
the top suppliers of 2008 by Northrop Grumman.
Anritsu was presented with a Northrop Grumman
Aerospace Systems’ Gold Award during Northrop
Grumman’s annual awards program.
Agilent Technologies Inc. announced that the China
Academy of Telecommunication Research (CATR), a
division of the Ministry of Industry and Information
Technology and a WiMAX Forum® Designated
Certification Laboratory (WFDCL), has successfully used
Agilent’s N6430A Series Mobile WiMAX™ Protocol
Conformance Test system to complete the first test of
Mobile WiMAX products in mainland China. The test was
conducted in June.
DecaWave has partnered with the Dublin Institute of
Technology’s Antenna & High Frequency Research
Group (AHFR) for antenna design research expertise for
its ground breaking ScenSor chip. The resulting antennas
are optimized, but are fully customizable to client technologies and application needs and specifications.
DecaWave’s ScenSor has a wide range of standards-based
applications for both real time location systems (RTLS)
and ultra low power wireless transceivers.
Giga-tronics announced that it has achieved AS9100
certification, an upgrade of its ISO 9001 Quality
Management System. Giga-tronics is now certified as
fully capable to be a provider of products and services
12
High Frequency Electronics
that meet more stringent aerospace industry quality system requirements.
The LXI Consortium has released six new on-demand
webcasts dealing with the fundamentals of the LXI standard, LXI Class B instrument capabilities, and the most
recent changes incorporated into Version 1.3 of the
Standard. All of these webcasts are available for online
viewing or download from the Consortium’s Web site at
http://www.lxistandard.org/press/papers/.
eubus GmbH, Munich, was just awarded a patent for its
new high frequency plastic package, and is now using this
package to deliver its RF components, such as the programmable attenuators, power divider/combiner and
switches. This patented package is completely built by
printed circuit material and can be produced very cost
effectively. The frames, the internal isolation and cover
parts are done by printed circuit layers. The individual
parts are pressed and soldered in the soldering machine
together with the connectors. With this process you get a
RF module with a very high mechanical firmness. The RF
shielding is made by connecting through the single printed circuit layers and is in accordance with the standard
full metal housings.
Skyworks Solutions, Inc. announced that Samsung is
leveraging both quad-band GSM/EDGE and next-generation WCDMA front-end solutions to power a variety of
new 3G smart phones including the Pixon12, the world’s
first 12 megapixel touchscreen camera phone. Skyworks
has also secured EDGE and WCDMA power amplifier
design wins for more than 15 additional Samsung smart
phones currently in production. These new models
include the GT-I8000 Omnia2 featuring a vast AMOLED
touchscreen; the GT-S8000, Samsung’s first Android
phone; the GT-M6710, or new Beat Disc Edition handset;
the GT-M7600 Beat DJ, which is the world’s only mobile
phone with music playback software; and the affordable
GT-S5600 touchscreen phone.
Rohde & Schwarz America announced that it has
received a contract from the U.S. Naval Inventory
Control Point (NAVICP) in Mechanicsburg, VA, for the
purchase of 800 R&S SMB100N analog signal generators
over a five-year period. The instruments will replace
existing instruments throughout the Navy, and will also
be available for purchase by other government agencies
as well as defense contractors through NAVICP along
with various options if desired.
The U.S. Department of Defense announced late last
month that Aeroflex won a five-year, $40.5 million contract with the U.S. Marine Corps to supply Ground Radio
Maintenance Automatic Test Systems (GRMATS). For
this contract Aeroflex will supply its newly developed test
platform, the 7200 Configurable Automated Test Set
(CATS). The 7200 is a commercial off-the-shelf (COTS)
platform for testing software-defined radios, including
military tactical radios and other high technology devices.
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IN THE NEWS
Azimuth Systems, Inc., announced that the company
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numerous conformance, performance and interoperability
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TriQuint Semiconductor announced it has signed a
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provider of next-generation telecommunications network
solutions for operators around the world, to supply driver
amplifiers and related products for new optical transport
systems. As a strategic partner, TriQuint will work closely with Huawei to develop higher-speed and wider-bandwidth networks solutions with lower power consumption
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California RF, LLC, based in Lake Forest, CA, is a new
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Laird Technologies, Inc. announced it accomplished
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and 100 million metals products from their Indian facility, including board-level shielding and combination products, to its customers in India's handset market. Laird
Technologies’ manufacturing facility, located in Chennai,
made the first shipment for handset antennas in
February 2008 and made the first shipment for handset
metals in August 2008.
Tektronix, Inc. announced it has won a contract award
from the U.S. Navy to supply Digital Phosphor
Oscilloscopes (DPOs). The $10.75 million contract has a
Best Estimated Quantity (BEQ) of 5,000 units over a fiveyear period.
ANSYS, Inc. announced that it is the exclusive provider
of multiphysics engineering simulation software at—and
the namesake of—a new research and educational facility
at the University of Wisconsin–Milwaukee (UWM)
College of Engineering and Applied Science. The
ANSYS Institute for Industrial Innovation (AI3) will serve
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College of Engineering and Applied Science on specific
engineering projects. Just as important, AI3 will provide
14
High Frequency Electronics
students with state-of-the-art engineering simulation software tools, enabling hands-on experience along with the
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Curtis-Straus, LLC, announced that is providing testing and test reports for marine electronics as required by
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Products Services) as an A2LA accredited Nationally
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Massachusetts laboratory.
Agilent Technologies Inc. announced an expansion of
its Integrated Circuit Characterization and Analysis
Program (IC-CAP) software platform at X-FAB. The
expansion is the result of a joint effort to train X-FAB’s
IC-CAP users on the Agilent software’s measurement and
extraction capabilities, including new functionality in ICCAP 2009, as well as its application to specific X-FAB
modeling needs. With the completion of this training, XFAB has now adopted IC-CAP device modeling software
at all of its locations worldwide.
Raltron Electronics Corp. is proud to announce the
appointment of Future Electronics, Inc., Montreal,
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People in the News
Valpey Fisher Corporation announces that the Board
of Directors elected Gary Ambrosino and Steven
Schaefer to its Board of Directors, and appointed Mario
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2004, was named Secretary of the Corporation. From
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Mainstay, Mr. Alosco was responsible for executive
staffing and leadership training at Acterna Corporation.
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Optical Research News
Nobel Prize in Physics Goes to Three “Masters of Light”
On October 6, The Royal Swedish Academy of Sciences
announced the winners of the Nobel Prize in Physics for 2009 with
one half to Charles K. Kao, Standard Telecommunication
Laboratories, Harlow, UK, and Chinese University of Hong Kong,
“for groundbreaking achievements concerning the transmission of
light in fibers for optical communication,” and the other half jointly to Willard S. Boyle and George E. Smith, Bell Laboratories,
Murray Hill, NJ, “for the invention of an imaging semiconductor
circuit—the CCD sensor.” As reported by the Academy,
“This year’s Nobel Prize in Physics is awarded for two scientifPhoto credit: AP and Reuters
ic achievements that have helped to shape the foundations of
today’s networked societies. They have created many practical innovations for everyday life and provided new tools for
scientific exploration. In 1966, Charles K. Kao made a discovery that led to a breakthrough in fiber optics. He carefully calculated how to transmit light over long distances via optical glass fibers. With a fiber of purest glass it would
be possible to transmit light signals over 100 kilometers, compared to only 20 meters for the fibers available in the
1960s. Kao’s enthusiasm inspired other researchers to share his vision of the future potential of fiber optics. The first
ultrapure fiber was successfully fabricated just four years later, in 1970.
“Today optical fibers make up the circulatory system that nourishes our communication society. These low-loss
glass fibers facilitate global broadband communication such as the Internet. Light flows in thin threads of glass, and
it carries almost all of the telephony and data traffic in each and every direction. Text, music, images and video can
be transferred around the globe in a split second.
“A large share of the traffic is made up of digital images, which constitute the second part of the award. In 1969
Willard S. Boyle and George E. Smith invented the first successful imaging technology using a digital sensor, a CCD
(Charge-Coupled Device). The CCD technology makes use of the photoelectric effect, as theorized by Albert Einstein
and for which he was awarded the 1921 year’s Nobel Prize. By this effect, light is transformed into electric signals. The
challenge when designing an image sensor was to gather and read out the signals in a large number of image points,
pixels, in a short time.
“The CCD is the digital camera’s electronic eye. It revolutionized photography, as light could now be captured electronically instead of on film. The digital form facilitates the processing and distribution of these images. CCD technology is also used in many medical applications, e.g. imaging the inside of the human body, both for diagnostics and
for microsurgery.
“Digital photography has become an irreplaceable tool in many fields of research. The CCD has provided new possibilities to visualize the previously unseen. It has given us crystal clear images of distant places in our universe as
well as the depths of the oceans.”
Improved Digital Photon Detector is Developed
Royal Philips Electronics announced that its scientists have developed a highly innovative digital silicon photomultiplier technology that will allow faster and more accurate photon (the basic quantum unit of light) counting in a
wide range of applications where ultra-low light levels need to be measured.
Areas where the new technology could have a major impact include medical imaging, in particular positron emission tomography (PET), and in-vitro
diagnostic tests such as DNA sequencing and protein/DNA microarrays.
Other relevant areas include high-energy physics, night-vision systems and
other applications that currently use light detectors that are based on photomultiplier tubes.
As with virtually all solid-state alternatives, this new digital silicon photomultiplier technology should enable the production of smaller and lighter
battery-powered equipment for use in areas such as medical diagnostics and
surveillance. The performance of Philips’ prototype detector, in terms of its
speed and dark count level (background noise), will be presented at the IEEE
Photo credit: Philips
Nuclear Science Symposium and Medical Imaging Conference, which will
take place on October 25-31 in Orlando, FL. Other important features of this new light detection technology include
its robustness, low power consumption, light detection efficiency, and very high level of integration of the optical detection and associated electronic components. The key to Philips’ breakthrough lies in its ability to combine high quality
single-photon detectors (silicon avalanche photodiodes) with low-voltage CMOS logic on the same silicon substrate.
Moreover, these new silicon photomultipliers can be manufactured using a conventional CMOS process technology.
16
High Frequency Electronics
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High Frequency Design
PRECODED MIMO
Precoding and Spatially
Multiplexed MIMO in 3GPP
Long-Term Evolution
By Randall T. Becker
Agilent Technologies
M
ultiple
Input
Multiple Output
(MIMO) technology has been shown to
provide higher data rates
with increased spectral
efficiency [1, 2]. The performance of a MIMO system is directly related to
the received signal-to-interference-and-noise
ratio (SINR) and the correlation properties
that are characteristic of the multipath channel and antenna configuration [3]. Although
the wireless channel can deliver low SINR at
some of the MIMO receive antennas, it is possible to improve system performance with the
application of beamforming at the transmitter. Though often used together, it is important
to differentiate here that beamforming is a
signal processing technique, which is very different from beam steering where the direction
of the main lobe of radiation is changed.
Beamforming lends itself well to MIMO applications.The 3GPP Long Term Evolution (LTE)
specification [4] includes several transmit
This article examines the
basic theory of precoding
in a MIMO system, compares this with non-precoded MIMO, and describes
methods for measuring
system performance
beamforming techniques that may optimize
system performance under various channel
conditions. One technique, referred to as precoding, is designed to increase and/or equalize
the received SINR across the multiple receive
antennas.
MIMO and Precoding
A standard 2 × 2 MIMO spatial multiplexing scheme, shown in Figure 1a, assumes the
wireless channel will provide four separate
connections between transmit and receive
antennas. Each channel connection, shown as
an arrow in the figure, represents a unique
combination of all transmission paths including the direct Line of Sight (LOS) path, should
one exist, and the numerous multipaths created by reflection, scattering and diffraction
from
the
surrounding
environment.
Depending on the resulting channel conditions, the MIMO system may not be able to
properly recover the transmitted data streams
(layers) if the SINR is too low at any of the
receive antennas. With the addition of precoding, as shown in Figure 1b, the transmitter,
Figure 1 · Simplified block diagram showing the difference between (a) MIMO without precoding and (b) MIMO with precoding.
18
High Frequency Electronics
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High Frequency Design
PRECODED MIMO
having knowledge of the current
channel conditions, can effectively
combine the layers before transmission with the goal of equalizing the
signal reception across the multiple
receive antennas. Precoding schemes
have been specified for spatially-multiplexed and transmit-diversity
applications [4]. This paper will
examine precoding in spatially-multiplexed MIMO systems.
Precoding is based on transmit
beamforming concepts with the provision of allowing multiple beams to
be simultaneously transmitted in the
MIMO system. The LTE specification
defines a set of complex weighting
matrices for combining the layers
before transmission using up to 4 × 4
antenna configurations [4]. For a
2 × 2 configuration, the weighting
matrix, W, is multiplied by the input
layers to generate the precoded signals to be transmitted.
⎡ y(0) ( i)⎤
⎡ x(0) ( i)⎤
⎢ (1) ⎥ = W ( i) ⎢ (1) ⎥
⎢⎣ y ( i)⎥⎦
⎢⎣ x ( i)⎥⎦
Here, x(q)(i) are the input layers
prior to precoding (q = 0, 1) and y(q)(i)
are the precoded signals applied to
each transmit antenna. The simplest
precoding matrix maps each layer to
a single antenna dedicated to transmitting that layer, without any coupling to other antennas. In this case,
the weighting matrix, defined with
codebook index 0, becomes
W ( i) =
1 ⎡1 0 ⎤
⎢
⎥
2 ⎣0 1 ⎦
resulting in the following transmitted data as
1 (0)
x ( i)
2
1 (1)
y(1) ( i) =
x ( i)
2
y(0) ( i) =
A second precoding matrix,
defined with codebook index 1, provides a linear combination of the
20
High Frequency Electronics
sums and differences of the two input
layers respectively. The weighting
matrix for codebook 1 is
W ( i) =
1 ⎡1 1 ⎤
2 ⎢⎣1 −1⎥⎦
resulting in the following transmitted data
1 (0)
1
x ( i) + x(1) ( i)
2
2
1 (0)
1 (1)
(1)
y ( i) = x ( i) − x ( i)
2
2
y(0) ( i) =
This codebook selection allows a
portion of each signal layer to be
transmitted through each antenna,
and depending on the channel conditions, providing some flexibility when
attempting to improve and equalize
the SINR at each MIMO receiver.
The LTE specification for precoding spatially multiplexed transmissions includes a total of four codebook
matrices for two transmit antenna
configurations and 16 codebook
matrices for four transmit antenna
systems. Proper selection of the optimal precoding matrix requires knowledge of the current channel conditions
at the transmitter. The channel conditions are provided through feedback
from the MIMO receiver creating a
closed-loop system. For an LTE precoded downlink transmission, the
mobile terminal or user equipment
(UE) will measure the channel characteristics and determine the precoding matrix index (PMI), channel quality indicator (CQI) and/or Rank Index
(RI). This information will be sent to
the base station (eNB) which would
modify the precoding codebook selection to improve overall system performance. As channel conditions may
change rapidly over time, it is important for the system to avoid excessive
delays when closing the feedback
loop. Reduction of the signaling overhead and associated feedback delay is
accomplished by restricting the number of codebook selections. Unfortunately, reducing the number of selec-
tions may also limit the number of
possible adjustments thus reducing
the effectiveness of precoding.
An LTE system design requires a
thorough understanding of the tradeoffs between performance, precoding
options and feedback constraints. A
flexible measurement system can
provide unique insight into the capability of precoding under a variety of
simulated channel conditions including noise, interference and antenna/
channel correlation.
Precoding Measurement
Examples
There are a variety of measurement tools that are necessary when
examining the performance of precoding and MIMO operating under
diverse channel conditions. Figure 2
shows a typical 2 × 2 MIMO measurement setup consisting of a wireless channel emulator, signal sources
and signal analyzers. The channel
emulator, such as the Agilent N5106
PXB Receiver Tester, is used to create
realistic multi-channel, multipath
environments including the effects of
antenna and spatial correlations [3].
Some commercial emulators have
built-in baseband generators for generating complex waveforms using
standards based or custom models
developed in software tools such as
Agilent Signal Studio, Agilent ADS
and Agilent SystemVue. The outputs
of the channel emulator are complex
baseband waveforms representing
the precoded MIMO signals modified
by multipath, noise and/or interference. These baseband waveforms are
then modulated onto RF carriers
using the analog in-phase (I) and
quadrature-phase (Q) inputs available on many RF vector signal generators. The baseband data can also be
modulated onto RF carriers using
digital I and Q inputs on signal generators such as the Agilent MXG
series. This is the preferred method
since it gives the best performance
and also enables automatic power
calibration of the system to be per-
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High Frequency Design
PRECODED MIMO
Figure 2 · Measurement setup for characterizing the performance of LTE precoding under various multipath and
channel conditions as demonstrated using the N5106A PXB MIMO Receiver Tester, theN5182A MXG Vector Signal
Generator and the N9020A MXA Signal Analyzer.
formed In the measurement system
shown in Figure 2, the two RF signal
generators are the inputs to a twochannel MIMO receiver. It is important to note that when using multiple
signal generators to simulate a
MIMO system, the generators
require a stable phase relationship
during test though the equipment is
not required to be phase-locked. The
term phase-locked is often referred to
as "phase coherence" and describes a
fixed phase condition between the RF
outputs of two or more signal generators operating at a specified carrier
frequency. A proper phase relationship is important for the precoding
operation as signals from separate
data layers are vectorially added
before transmission based on known
channel conditions. If the signal generators used to simulate multiple
transmitters have an unknown
and/or time-varying phase relationship, the received signals may
include undesired phase offsets
resulting in reduced performance in
one or more of the recovered data
streams. An example will be provided
later in this article showing the relationship between signal generator
phase offset and system performance.
In a test system using two modern
22
High Frequency Electronics
RF signal sources, such as the Agilent
MXG signal generators, phase coherence is maintained by sharing the
un-modulated local oscillator (LO)
from one generator with the other as
shown in Figure 2. In some test systems with multiple RF signal generators, such as in 4 × 4 and 2 × 4 configurations, a separate RF signal generator is recommended as a master
local oscillator in order to provide
enough drive level to the local oscillator inputs of the signal generators.
In the measurement example
shown in Figure 2, the two-channel
MIMO receiver is configured using
two vector signal analyzers (VSA),
such as Agilent MXA signal analyzers configured with Agilent 89600
VSA software. A similar configuration can be used to test the performance of an actual 2 × 2 MIMO
receiver system by direct cable connection from the two signal generators to the inputs of the MIMO
receiver. In this case, the channel
emulator introduces multipath and
channel impairments that would be
found in a real-world environment.
When testing a MIMO transmitter or
eNB, the transmitter can be directly
connected to the signal analyzer(s).
Depending on the total number of
measurement ports available on the
test equipment, there are several possible configurations for connecting a
MIMO transmitter to the signal analyzer(s). For, example, limited MIMO
testing can be done with a singleinput analyzer by using, a power
combiner to add the multiple signals
from the MIMO transmitters to the
common port on the analyzer. In this
case, since the transmitted downlink
reference signals are orthogonal in
frequency and/or time, the individual
reference signals from each transmission antenna port can be analyzed for
EVM characteristics and timing
errors using the single-input analyzer. When two single-input analyzers
are available for test, a two-channel
MIMO transmitter can be directly
cabled to the analyzers. In this case,
the analyzers can recover the independent data from each codeword
even for cases when precoding is
applied such that each layer contains
some combination of each independent codeword. This configuration is
also useful for evaluating the effects
of the propagation channel where
cross talk and cross coupling of the
channels will occur.
A measurement example of the
potential system improvements that
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High Frequency Design
PRECODED MIMO
Figure 4 · Impact of phase offset on
precoding accuracy.
Figure 3 · Measured constellation with and without precoding made using
the 89600 Series Vector Signal Analysis Software [6].
can be achieved using LTE precoding
will now be shown using the basic
2 × 2 MIMO system described above.
The channel emulator is configured
to create a "static" multipath channel
resulting in a high SINR for one
received signal and a low SINR for
the other. Figure 3 shows the measured constellations for the recovered
two-channel MIMO signal without
precoding (upper plots) and with precoding (lower plots). For the measurement without precoding, referenced
with codebook index 0 in the LTE
specification, the data layers are
directly mapped to the two transmit
antennas and transmitted through
the emulated multipath channel
resulting in one signal, rx0, being
received with a relatively high SINR
while the second received signal, rx1,
is severely attenuated resulting in a
very low SINR. The quality of the second signal and the large differences
in SINR between the two make it difficult to properly decode this twochannel MIMO signal. With the
application of precoding, using codebook index 1 for this example, the
negative effects of the poor channel
conditions may be partially removed
as precoding attempts to equalize the
measured SINR at each receiver. The
24
High Frequency Electronics
results found in this measurement
example, show an improvement in
SINR for the poorer quality signal,
rx1, and an acceptable reduction in
SINR for the other, rx0. With the two
receive channels properly equalized,
the MIMO receiver can easily recover
the original transmitted signals.
It was previously mentioned that
phase coherence between RF signal
generators is important for proper
demodulation of the separate data
layers. When a precoding index is
selected to equalize receiver performance, it is assumed that the signal
generators have a known phase offset. If the phase relationship between
the generators changes, the performance in one data layer may degrade
while the other may improve. As an
example, continuing with the precoded measurement shown in Figure 3,
the precoding index 1 was selected in
order to equalize the performance
between the two receivers and their
associated constellations. In this
case, the RF signal generators were
phase coherent with a zero-degree
offset. A figure-of-merit of the quality
of the constellation is the Error
Vector Magnitude (EVM). The EVM
is a number, typically given as a percentage, quantifying how the
received signal deviates from an ideal
constellation. Low EVM values represent higher quality signals. For the
precoded measurements shown in
Figure 3, the EVM was approximately 13.5% at both receivers. If a phase
offset is now introduced between the
signal generators, the EVM will be
reduced at one receiver and improved
at the other. Figure 4 shows the EVM
as a function of phase offset for each
data stream in the 2 × 2 system
described above. As shown in the figure, when the phase offset is zerodegrees, the codebook selection was
properly chosen for the simulated
wireless channel. As the phase offset
increases, the EVM degrades for
Stream 1 and improves for Stream 2.
The opposite effect is observed when
the phase offset is negative. The
degradation in EVM between the two
receivers results in a mismatch
between selected codebook and the
expected channel characteristics. If
the phase offset is fixed, a different
codebook selection may once again
equalize the receiver performance.
Unfortunately when using non-coherent signal generators, the time varying phase relationship will greatly
affect the measured EVM results and
system performance. To overcome
this issue, phase coherent signal generators, as described in the measurement setup shown in Figure 2, will
eliminate the time varying phase offset between the multiple generators.
System Implications when using
Precoding—A second measurement
example shows the effects of precod-
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WP SCN, QCN
RoHS compliant
®
ANNIVERSARY
1969-2009
BP
ISO 9001 ISO 14001 AS 9100 CERTIFIED
minicircuits.com
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 For detailed performance specs & shopping online see Mini-Circuits web site
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IF/RF MICROWAVE COMPONENTS
459 Rev. C
High Frequency Design
PRECODED MIMO
ing when non-linear distortion is present in one of the transmitter channels. This measurement is made with
the analyzers connected directly to
the two outputs of a MIMO transmitter. It can be shown that distortion in
one transmit channel or one receive
channel will effect both recovered signals in a 2 × 2 precoded MIMO system. As shown in Figure 5, the 2 × 2
MIMO transmitter has non-linear
distortion in the power amplifier of
the upper channel, referenced here as
Tx0. The upper transmit amplifier is
deliberately set to saturate on the
incoming waveform, y0. With precoding applied, a portion of each signal
layer is combined and passed
through the saturated amplifier.
Examining both transmitter outputs
using the VSA software, the undistorted channel, Tx1, shows a relatively clean frequency spectrum (lower
left) while in comparison, the upper
channel, Tx0, shows excessive spectral re-growth resulting from the
power amplifier saturation (upper
left). Another useful VSA measurement for examining the effects of
amplifier compression is the complementary cumulative density function
(CCDF). The CCDF displays the
instantaneous power relative to the
average power as a percentage of
time [5]. If an amplifier is in compression, the measured output will
have a lower peak value in comparison to an uncompressed signal. In
this example, the CCDF shows a
lower than expected peak-to-average
ratio measurement (upper middle
plot in Figure 5). As a reference, the
CCDF curve for Gaussian noise is
also plotted on the same graph and
has a higher peak-to-average ratio.
Figure 5 also shows the measured
constellations of the recovered 2 × 2
precoded MIMO signal (right column). Here the upper right plot
shows the measured 16QAM constellation for the Tx0 signal. The lower
right plot shows the measured QPSK
constellation for Tx1. With precoding
applied, distortion is present in both
26
High Frequency Electronics
Figure 5 · Measured constellation of a precoded 2 × 2 MIMO signal with
distortion in one transmit channel.
constellations as a portion of each
data layer is passed through the saturated amplifier. Without precoding,
the measured constellation (middle
lower plot) for Tx1 displays a relatively clean constellation as this layer
is directly mapped to the output and
does not pass through the saturated
amplifier. As these measurements
have shown, the key to optimizing
and troubleshooting LTE components
and systems relies on a flexible set of
measurement tools capable of generating and analyzing realistic signals
and multipath channels.
Conclusion
Precoding technologies in 3GPP
LTE can greatly improve system performance when the multipath channel does not provide adequate SINR
at one or more of the MIMO
receivers. It was shown that a variety
of measurements can provide very
useful insight into the operation and
performance of a precoded system
under multipath and channel distortion.
References
1. Agilent Application Note:
“3GPP Long Term Evolution: System
Overview, Product Development, and
Test Challenges,” Literature Number
5989-8139EN, May 2008.
2. Agilent Application Note 1509:
“MIMO Wireless LAN PHY Layer
(RF) Operation & Measurement,”
Literature number 5989-3443EN,
April, 2008.
3. Agilent Application Note:
“MIMO Channel Modeling and
Emulation
Test
Challenges,
“Literature Number 5989-8973EN,
Oct. 2008.
4. 3rd Generation Partnership
Project; Technical Specification
Group Radio Access Network;
Evolved Universal Terrestrial Radio
Access (E-UTRA); Physical Channels
and Modulation (Release 8), 3GPP TS
36.211 V8.4.0 (2008-09), 2008
5. Agilent Application Note:
“Improving Methods for Measuring
Distortion in Broadband Devices,”
5989-9880EN, Dec. 2008
6. Moray Rumney, editor, LTE and
the Evolution of 4G Wireless: Design
and
Measurement
Challenges,
Agilent Technologies, 2009
Author Information
Randy Becker obtained his BSE in
Electrical Engineering from Walla
Walla College in 1997 and an MSEE
from the University of Nebraska in
1999. At Hewlett-Packard/Agilent
Technologies he has worked in a variety of technical marketing roles, starting as a marketing engineer in the
Spectrum Analysis Division, then moving to the Signal Sources Division
where he worked for 8 years. He is currently a senior application engineer in
the Microwave and Communications
Division supporting various cellular
technologies with a focus in W-CDMA
and LTE.
SELECTION
SUPPORT
SERVICE
When you need it most
All are key when purchasing high performance microwave transmission
lines. Currently a SELECTION of IW products are employed on the
Navy’s latest platforms in a variety of systems including the AIMS
ATC/IFF radar, PHALANX close in defense system, HDR and MILSTAR.
IW’s SUPPORT for these systems includes a wide range of flexible
microwave cable assemblies. Extremely low loss cables are optimized
for operation up to 11 GHz, 18 GHz, 26.5 GHz, 40 GHz, 50 GHz, and
65 GHz. These cables are available with
optional internal and external ruggedization
and a selection of jacket materials to meet
specific environmental requirements. IW
supports these cables with a wide selection
of connectors including SMA, TNC, N, SC,
1.65mm, 2.4mm, 3.5mm, and 7mm.
IW’s SERVICE is second to none. Most
quotes are provided within 24 hours.
Additionally, your calls are handled
personally, not through voice mail!
ISO 9001:2000 CERTIFIED
20 East Franklin Street • Danbury, CT 06810 • T: 203-791-1999 • F: 203-748-5217 • E: sales@iw-microwave.com • W: iw-microwave.com
Get info at www.HFeLink.com
High Frequency Products
FEATURED PRODUCTS
Wireless RFICs
Front End Module
SiGe Semiconductor has expanded
its Wireless LAN and Bluetooth®
product range by introducing the
high performance; highly integrated SE2579U Front End Module
(FEM) that is specifically targeted
at the rapidly growing embedded
and module applications markets,
including WLAN enabled Cellular
Handsets, Digital Cameras and
Personal Media Players (PMPs).
The SE2579U is a complete 802.11
b/g/n 2.4 GHz WLAN RF FEM with
a Bluetooth port in an ultra compact form factor (3 × 3 × 0.5 mm). It
is capable of simultaneous operation in both WLAN and Bluetooth
receive mode without
signal
degradation found in current solutions. The device provides all the
functionality of the power amplifier, power detector, filter, switch,
low noise amplifier, 2170 MHz
notch filtering and associated
matching. The SE2579U is priced
at US$0.95 in 100k quantities it is
sampling now and is offered with
applications documentation and
evaluation boards.
SiGe Semiconductor
www.sige.com
High Power RF Module
Radiocrafts AS now expands their
RC232 product line family with a
completely new high power module, the RC1180HP-RC232. The
module is pin compatible with the
28
High Frequency Electronics
Wireless Radio Frequency ICs
Analog Devices, Inc.
introduces a series of
highly
integrated
RFICs designed for
LTE and 4th generation (4G) cellular
base stations. LTE is
a set of enhancements to the UMTS
(universal
mobile
telecommunications system) standard and is considered to be the last step
toward the 4th generation cellular networks. The new ADRF660x and
ADRF670x series each debut with four pin-compatible devices that cover
the commonly used cellular 2G, 3G and LTE frequency bands and ease
system design through integration allowing for a common footprint PCB
(printed circuit board) design for all cellular frequency bands and air
interface standards. The four ADRF670x products integrate a high
dynamic range analog I/Q modulator, RF output switch and PLL (phase
locked loop) with integrated VCO (voltage controlled oscillator) in one
compact RFIC. The four ADRF660x products integrate a high-linearity
active RF mixer; RF input balun for single- ended 50 ohm input; and a
PLL synthesizer with integrated VCO in one compact RF circuit. The
active mixer provides a voltage conversion gain of 6 dB, alleviating the
need for additional IF amplification. The ADRF660x integrated mixers
are priced at $8.98 per unit in 10,000-unit quantities. The ADRF670x integrated modulators are priced at $9.98 per unit in 10,000-unit quantities.
Analog Devices, Inc.
www.analog.com
existing
RC11xx-series,
and
enables extended range using the
same lowcost design philosophy
applicable for the whole RC11xx
product family. The RC1180HPRC232 (868 MHz) module is certified for operation up to 500 mW
under the European radio regulations for license-free use. When
used with quarter-wave antennas
a line-of-sight range of over 3 km
can be achieved. The compact
RC1180HP-RC232 module, measuring only 12.7 × 25.4 × 3.3 mm.
No external components are
required, except an antenna. The
modules are delivered on tape and
reel for efficient volume production. The module is a complete RF
system solution running on the
existing industry proven RC232™
protocol, with an easy-to-use
UART interface for both configuration and communication. The
embedded RC232™ protocol provides a point-to-multipoint solution with individual addressing or
broadcast, and CRC check for sig-
nal integrity. The module can also
be used as a wireless RS232 /
RS485 cable replacement. Modules
and Demo Kits are available now.
Radiocrafts AS
www.radiocrafts.com
GPS Low Noise Amplifiers
Avago Technologies introduced a
new miniature compact highly
integrated GPS low noise amplifier
(LNA). Avago’s ALM-1812 integrates a LNA and pre- and post
high-rejection filters in a miniature compact package to provide a
complete, compact and high-performance GPS RF front-end module
that will help simplify the design
0.5 to2000 MHz MIXERS
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Mini-Circuits...Your partners for success since 1969
*Typical Specifications:
ADE-1
ADE-2
Frequency LO/RF (MHz)
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5-1000
Frequency LO/IF (MHz)
DC-500 DC-1000
LO Level (dBm)
7
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15
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Conv. Loss (dB)
5.0
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®
ANNIVERSARY
1969-2009
ADE-11X
10-2000
5-1000
7
9
7.1
36
37
.112”
ISO 9001 ISO 14001 AS 9100 CERTIFIED
minicircuits.com
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 For detailed performance specs & shopping online see Mini-Circuits web site
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IF/RF MICROWAVE COMPONENTS
348 Rev C
High Frequency Products
FEATURED PRODUCTS
of a wide range of GPS handset
applications. Avago’s highly integrated ALM-1812 is designed for
the 1.575 GHz frequency band and
is housed in a miniature 4.5 × 2.2 ×
1.0 mm MCOB package, reducing
printed circuit board (PCB) space
by more than 50% when compared
to discreet-only solutions. The integration of FBAR filtering enables
the ALM-1812 to reach more than
90 dBc of Cell/PCS-band rejection.
Additionally, this GPS LNA effectively leverages Avago’s 0.25 um
GaAs enhancement-mode pHEMT
process to deliver a 1.66 dB noise
figure, 18.5 dB gain, and +2 dBm
input third order intercept point
(IIP3) at typical operating conditions of 2.7V and 6 mA. Avago’s
ALM-1812 high rejection GPS
high-gain LNA is priced at $1.81
each in 10,000 piece quantities.
Samples and production quantities
are available now through Avago’s
direct sales channel and worldwide
distribution partners.
Avago Technologies
www.avagotech.com
High Power Products
the RF devices inside the amplifier
with typical 2000 ns turn on and
5000 ns turn off times. Standard
features include reverse polarity
protection, output short and open
circuit protection, and over/under
voltage protection. There is a temperature sensor internal to the
unit. The power amplifier operates
from a +28 Vdc power supply.
Standby current is ~30 mA and the
quiescent current is 1.13 amps
without RF drive. Operation is
from –40C to +85C base plate temperature. Noise figure is 7.0 dB
typically across the band.
Aethercomm
www.aethercomm.com
LDMOS RF Transistor Line-Up
Freescale Semiconductor introduces a 50V laterally diffused
Components, Subsystems
RF / Microwave components
• Rotary joints, phase shifters, couplers, mixers,
power dividers and switches
Filters
• High / low pass, notched, switched
• Multiplexers
Multi-function assemblies
• Frequency translation with compact
filters and associated integrated
technologies
IFM receivers
• Low power consumption
• High frequency accuracy
• High resolution
• Lightweight
High Power GaN Amplifier
Aethercomm model number SSPA
0.869-0960-56 is a high power,
GaN amplifier that operates from
869 to 960 MHz minimum and is
packaged in a very compact, high
performance package. This amplifier is designed for operation in
harsh environments. Typical output power is 50 watts across the
band at P3dB. Small signal gain is
55 to 56 dB across the band typically. Power added efficiency in saturation is typically 40% to 50%
across the band. Input and output
VSWR is 2.0:1 maximum. This unit
is equipped with DC switching circuitry that enables and disables
30
High Frequency Electronics
®
A Ceralta Technologies Company
www.sagelabs.com
603-459-1600
Get info at www.HFeLink.com
MOS (LDMOS) RF power transistor designed to streamline UHF
transmitter equipment designs.
The latest addition to Freescale’s
growing family of RF power
LDMOS transistors for broadcast
applications, the MRF6V3090N is
designed for TV transmitters
employing both analog and digital
modulation
formats.
The
MRF6V3090N delivers 90 W peak
power at P1dB with greater than 40
percent efficiency through the
UHF broadcast frequency band. As
a linear driver, the MRF6V3090N
achieves 21 dB power gain and
drain efficiency of 12 percent with
an average output power of 4.5 W,
based on a DVB-T OFDM signal.
The adjacent-channel power ratio
(ACPR) at a 4 MHz offset is –68
dBc over a 4 kHz integration band-
width. As an analog or digital TV
final for low power repeaters, the
device has typical UHF broadband
performance of greater than 40
percent efficiency, 21 dB gain and
an IM3 of less than –30 dBc. The
MRF6V3090N is sampling now,
and full production is expected in
Q4 2009.
Freescale Semiconductor
www.freescale.com
and Interconnects…
for Today’s World
Cable assemblies
• Flex, conformable, semi-rigid
Multi-port systems
• RF / DC / fiber bundled in
industry circular shells
Test cables
• Phase stable, repeatable
Custom designs
• Quick disconnect
• High power / voltage
Precision test adapters
• Phase matched, repeatable
• Broadband to 50 GHz
®
A Ceralta Technologies Company
www.trucorporation.com
800-262-9878
Get info at www.HFeLink.com
CW Transmitter Power
Supplies
A line of compact, solid-state high
voltage DC power supplies for CW
transmitters in broadcasting, communications, and satcom applications is available from Diversified
Technologies, Inc. of Bedford,
Massachusetts. HVPS Series
Power Supplies are fully integrated solid-state units that can run
CW tubes without the need for a
crowbar such as magnetrons, IOTs,
klystrons, and TWTs. Featuring
>0.1% ripple and regulation with
<<10 joules stored energy, depending upon configuration, they can be
supplied with output voltages from
8 to 120 kV and up to 200 kW
power in one 24"W × 36"D × 74"H
cabinet. HVPS Series Power
Supplies
are
priced
from
$100,000.00, depending upon configuration. Price quotations and
literature are available upon
request.
Diversified Technologies, Inc.
www.divtecs.com
October 2009
31
High Frequency Products
FEATURED PRODUCTS
High Power Surface Mount
PIN Diode Switches
Aeroflex/Metelics announces the
introduction of a family of RoHS
compliant, silicon PIN diode surface mount high power switches,
ideal for high volume, high performance manufacturing in the military and commercial-industrial
markets. These switches are ideal
for higher power, higher linearity
RF and microwave applications for
military radio, IED, MRI, and
WiMAX markets. The SP2T
switches are designed in both
asymmetrical and symmetrical
topologies. The asymmetrical
SP2Ts are available with the Tx
RF port on either the left side of
the device (CS200: case style 200),
or the right side (CS201: case style
201), for design versatility. The
symmetrical configuration consists
of a series and shunt PIN diode in
both RF ports for improved RF iso-
Laboratory
(RF)MicroProbe
Station
Extremely Low Cost
< $10,000 US
DC/RF/Microwave Test
A ultra compact, manually operated probe station for engineers,
scientists and students. Measure Microwave, RF and IV parameters of
Semiconductor Devices. Characterize MEMS, wireless, photonic and
nanoelectronic components and assemblies.
• Benchtop Size(1ft2) • 2” Vacuum chuck with pump• 1” X-Y-Ø stage with z-lift•
•2 ea. 0.5” X-Y-Z probe positioners, includes 2 ea. 18 GHz probes & DC needles•
•10X/30X Stereo Zoom Trinocular Microscope • Flourescent Illuminator •
•Compatible with additional Magnetic Mount Positioners(optional)•
•Compatible with industry standard microwave probes(optional)•
•Cost effective for research projects•
J micro Technology
lation in both ports. These SP2T
Switches are optimized in design
to function in two frequency bands
of interest—band 1: 10-1,000 MHz
and band 2: 400-4,000 MHz. The
SP2T switches are capable of operating from positive voltage only:
+5V, +28 V, and +50V DC. Design
work is in progress to complete a
similar SP2T for the 2-6 GHz band.
These switch products are available in high volume tape-reel and
tube packaging and can be
obtained directly through Aeroflex/
Metelics or its distribution networks.
Aeroflex / Metelics
www.aeroflex.com/metelics
TWT Amplifiers
AR RF/Microwave Instrumentation has introduced the “TR”
Family of traveling wave tube
amplifiers. Designed for 19” rack
mounting, these new TWTAs are
ProbePoint™ CPW-µStrip
Adapter Substrates
Adapt
er S
ubst
rates
Probe Tip
FET
•Precision CPW to µStrip Adapter Substrates•
•Companion Calibration Substrates and Standards•
•Standard & custom Carriers•
•Accurate Electrical Data to Frequencies >50 GHz•
• 5,10,& 15 mil thickness•
•Compatible with 40GHz+ probes•
•Standard and Custom Calibration Standards•
J microTechnology
3744 NW Bluegrass Pl
Portland, OR 97229
(503) 614-9509
(503) 531-9325 [FAX]
www.jmicrotechnology.com
3744 NW Bluegrass Pl
Portland, OR 97229
(503) 614-9509
(503) 531-9325 [FAX]
www.jmicrotechnology.com
J micro Technology
Test Tooling for the Untestable
Get info at www.HFeLink.com
32
High Frequency Electronics
Broadband High Power Solid
State RF Amplifier
J microTechnology
Research Performance / Student Price
priced less than AR’s full-featured
TWTAs. The “TR” Family includes
six models that cover the following
frequency
ranges:
Model
250TR1G2z5: 1-2.5 GHz (250
watts); Model 300TR2z5G7z5: 2.57.5 GHz (300 watts); Model
250TR7z5G18: 7.5-18 GHz (250
watts); Model 300TR7z5G18: 7.518 GHz (300 watts); Model
200TR4G8: 4-8 GHz (200 watts).
Each model comes with 4 sidemounted carry handles and nonslip feet for benchtop use.
AR RF/Microwave Instrumentation
www.ar-worldwide.com
OPHIR RF’s solution for the 2-6
GHz, 50 watts RF power requirement of EN 61000-4-3:2006 is now
available. The 5193 is a 50 watts
multi-octave broadband 2-6 GHz
amplifier system. This 5.25” compact and lightweight amplifier utilizes the industry’s most advanced
technology GaN RF power transistors. The GaN RF transistors linear power amplifier provides excellent 3rd order intercept point, high
gain with a wide dynamic range
and high efficiency. An optional
digital controller is available to
display the amplifier operating
status and remote interface with
Ethernet, IEEE488 and RS232.
OPHIR RF
www.ophirrf.com
Optical Products
Optical Multichannel
Attenuators
Agilent
Technologies
Inc.
announced the addition of five new
integrated optical multichannel
attenuators and power meters to
its high-density 77xx-family. The
instruments are designed for testing optical transceiver modules
and their subcomponents and for
optical network integration tests.
These new attenuators and power
meters provide high-speed attenuation and power setting, very fast
power measurement, and USB,
LAN and GPIB interfaces. All
instruments can be controlled via
LAN and USB, as well as GPIB for
compatibility with existing equipment. Prices for the Agilent
N775xA and N776xA Series range
from $6,700 to $14,800. All models
are available now.
Agilent Technologies
www.agilent.com
low level supply lines to minimize
interference between drivers
caused by shared current paths.
The ISL55112 is available in 24 Ld
exposed pad TQFN package and is
specified for operation over the full
–40°C to +85°C temperature
range.
Intersil
www.intersil.com
Handheld Test Set for
DSn/PDH and Ethernet
EXFO Electro-Optical Engineering
Inc. announced the release of the
AXS-200/855 DSn/PDH/Ethernet
Test Set, a handheld multiservice
test solution that increases technician efficiency by seamlessly
transitioning from E1/DS1, DS3
or PRI circuit testing to comprehensive Ethernet/IP performance
testing without swapping modules or test units. Housed in the
AXS-200 SharpTESTER platform, the AXS-200/855 is a
lightweight, rugged, handheld
unit optimized for rapid, simple
testing. The AXS-200/855 offers
field technicians a single unit to
perform comprehensive dual
DSn/PDH and ISDN PRI testing,
including real-time insertion of
voice traffic and one-time setup of
tests to be run across all ISDN
channels simultaneously, as well
as turnkey Ethernet testing,
including RFC 2544, multistream
traffic generation and monitoring,
BERT and IP connectivity tools.
EXFO Electro-Optical Engineering Inc.
www.EXFO.com
RF & Microwave
Design Software
Applied Computational Sciences
www.appliedmicrowave.com
Dual Precision CCD Array
Driver IC
The ISL55112 is a high-speed CCD
array driver comprising 2 horizontal drivers with high current output drive and 2 ancillary signal
drivers with lower current output
drive. The devices can be used in
pairs to drive and control two
halves of a high pixel count CCD
array as used in high end digital
cameras or camcorders. The
ISL55112 can accommodate split
asymmetric voltage supplies up to
8V total for each of the 4 drivers
and has significant flexibility in
the selection of these supply voltages within this range. All 4
drivers have their own high and
• Exact Circuit Synthesis
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October 2009
33
High Frequency Design
CONNECTOR SPECS
A Summary of Connector
Specifications for RF and
Other Applications
By Gary Breed
Editorial Director
W
hen selecting a
connector for a
new
product,
the first step is to decide
which connector style
provides the proper form
and function. The second
step is to make sure that
the connector’s performance meets both your requirements and
those specified by your customer. This is especially important with products intended for
military and aerospace, automotive, and other
high reliability applications.
Many other applications also have specific
electrical requirements, such as passive intermodulation distortion in wireless base station
systems, non-magnetic properties in magnetic
resonance imaging (MRI) systems, plus safety
requirements, electrostatic discharge (ESD)
protection and electromagnetic interference
(EMI) filtering. These specifications may be
referenced to national or international standards, or may be proprietary requirements for
a specific customer, such as wireless carrier in
the case of a passive IMD specification.
Environmental performance may also be
specified by a standard or customer requirement. Resistance to moisture, corrosion, electrolytic effects and temperature extremes may
be required. Mechanical properties may be
specified as well, including mating/unmating
force, axial and radial forces, and vibration.
Also, the actual physical construction
should not be overlooked. Specific connector
types are well-defined in their interface
dimensions, but customers may require tight
manufacturing tolerances, or may have special mounting requirements.
This article provides a listing
of major technical standards for RF and RFI/EMI
shielded connectors, drawn
from various standards
organizations and industry
reference sources
34
High Frequency Electronics
Standards Listing
Beginning on the following page is a list of
many published standards and specifications
for RF connectors, and for a number of
RFI/EMI shielded electrical connectors. It is
not intended to be a complete listing of all
standards, but provides an initial set of standards to begin your research.
Among the most important of these are the
IEC 169-xx standards, including IEC 60169-2
through -28 (not all numbers are presently in
use). Of equal importance in defense applications is MIL-STD-348A and the additional
documents it references. These standards
cover all major RF connectors.
Various industry groups—broadcasting,
CATV, RF heating, and others—may have
additional standards information specific to
their requirements. Readers are encouraged
to search out additional information from professional societies or other standards organizations serving their industry.
References
Many references were used to prepare the
accompanying list of connector standards and
specifications. Some key sources include:
1. http://en.wikipedia.org/wiki/Military_
connector_specifications
2. International Electrotechnical Commission (IEC): www.iec.ch
3. Defense Supply Center Columbus,
Document Standardization Division: www.
dscc.dla.mil
4. “RF Connector Guide,” available at
www.hubersuhner.com
5. “Glossary of active military specifications for connectors,” Connector Specifier, July
2009.
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IF/RF MICROWAVE COMPONENTS
460 rev E
High Frequency Design
CONNECTOR SPECS
Military, Commercial, Automotive and Other Specifications for Connectors
This list is not intended to be comprehensive; it represents information collected using various references for RF connector
and RFI/EMI shielded electrical connectors. Readers are encouraged to research additional standards as necessary
IEC 60169-1: Radio-frequency connectors. Part 1: General requirements and measuring methods, with amendments and followon documents for reflection factor measurements and shielding
effectiveness.
IEC 60169-(2 - 28): Detail specifications for various specific connector types
IEC 60966-2-3: Detail specification for flexible coaxial cable assemblies using IEC 61169-8 connectors
IEC 61169-8: Sectional specification - 50 ohm BNC RF coaxial connectors
IEEE STD 287: 7 mm Amphenol APC-7®, 2.92 mm Ansitsu K
Connector®, 2.4 mm & 1.8 mm Anritsu V Connector®, 1.0 mm
Anritsu W1 Connector®
MIL-STD-348A: Military Standard, Radio Frequency Connector
Interfaces for MIL-C-3643, MIL-C-3650, MIL-C-3655, MIL-C25516, MIL-C-26637, MIL-PRF-31031, MIL-PRF-39012, MILPRF-39030, MIL-PRF-49142, MIL-PRF-55339, and MIL-C83517
MIL-C-3643: Connectors, Coaxial, Radio Frequency, Series HN, and
Associated Fittings
MIL-C-3650: Connectors, Coaxial, Radio Frequency, Series LC
MIL-C-3655: Connectors, Plug and Receptacle, Electrical (Coaxial,
Series Twin), and Associated Fittings
MIL-C-25516: Connectors, Electrical, Miniature, Coaxial,
Environment Resistant Type
MIL-C-26637:
MIL-PRF-31031: Connectors, Electrical, Plugs and Receptacles,
Coaxial, Radio Frequency, High Reliability, For Flexible and
Semirigid Cables,
MIL-PRF-39012: General Specifications for Connectors, Coaxial,
Radio Frequency
MIL-PRF-49142: Connector, Triaxial, Radio Frequency
MIL-PRF-55339: Adapters, Connectors, Coaxial, Radio Frequency,
(Between Series and Within Series)
MIL-DTL-83517: Connector, Coaxial, Radio Frequency For Coaxial,
Strip or Microstrip Transmission Line
MIL-DTL-83723: Connectors, Electrical (Circular, Environment
Resisting)
MIL-DTL-83723F(1) SUP1A: Connectors, electrical (Circular, environment resisting), receptacles and plugs, general specification
MIL-DTL-83723/61E: Connectors, electrical (Circular, environment
resisting), dummy connector, receptacles (for MIL-C-26500 and
MIL-C-83723, Series III, Classes A, R, and W)
MIL-DTL-83723/65E: Connector, electric (Circular, environment
resisting), receptacle, (Single-hole mount, bayonet coupling, pin
contact), (Series III, Class H)
MIL-DTL-83723/72D: Connector, electric (Circular, environment
resisting), receptacle, (Single-hole mount, bayonet coupling, pin
contact), (Series III, Class H)
MIL-DTL-83723/73E: Connector, electric (Circular, environment
resisting), receptacle, (Single-hole mount, bayonet coupling,
36
High Frequency Electronics
crimp socket contact), (Series III, Class A, G, R, and W)
MIL-DTL-83723/74E(1): Connectors, electric (Circular, environment resisting), receptacle, (Single-hole mount, bayonet coupling, crimp pin contact), (Series III, Classes A, G, R, and W)
MIL-DTL-83723/75D: Connectors, electrical (Circular, environment
resisting), plug, (bayonet coupling, crimp socket contact),
(Series III, Classes A, G, K, R, and W)
MIL-DTL-83723-76D: Connectors, electrical (Circular, environment
resisting), Plug, (bayonet coupling, crimp pin contact), (Series
III, Classes A, G, R, and W)
MIL-DTL-83723/77C(1): Connectors, electrical (Circular, environment resisting), Plug, (RFI, bayonet coupling, crimp socket contact), (Series III, Classes G, R, and W)
MIL-DTL-83723/78D: Connectors, electrical (Circular, environment
resisting), Plug, (RFI, bayonet coupling, crimp pin contact),
(Series III, Classes G, R, and W)
MIL-DTL-83723/79D: Connectors, electrical (Circular, environment
resisting), receptacle, (flange-mount, bayonet coupling, solder
pin contact), (Series III, Classes H and Y)
MIL-DTL-83723/80C: Connectors, electrical (Circular, environment
resisting), receptacle (solder flange-mount, bayonet coupling,
solder pin contact), (Series III, Classes H and Y)
MIL-DTL-83723/81E: Connectors, electrical (Circular, environment
resisting), receptacle (single hole-mount, bayonet coupling, solder pin contact), (Series III, Classes H and Y)
MIL-DTL-83723/85F: Connectors, electrical (Circular, environment
resisting), receptacle (single hole-mount, threaded coupling,
crimp pin contact), (Series III, Classes A, G, K, N, R, S, and W)
MIL-DTL-83723/88D: Connectors, electrical, (Circular, environment
resisting), receptacle (flange-mount, threaded coupling, solder
pin contact), (Series III, Classes H, N, and Y)
MIL-DTL-83723/89E: Connectors, electrical, (Circular, environment
resisting), receptacle (single hole-mount, threaded coupling, solder pin contact), (Series III, Classes H, N, and Y)
MIL-DTL-83723/90E: Connectors, electrical (Circular, environment
resisting), receptacle, (solder flange-mount, threaded coupling,
solder pin contact), (Series III< Classes H, N, and Y)
MIL-DTL-83723/93C: Connectors, electrical (Circular, environment
resisting), receptacle (solder flange-mount, bayonet coupling,
straight pin contact), (Series III, Class H and Y)
MIL-DTL-83723/94E: Connectors, electrical (Circular, environment
resisting), receptacle (single hole-mount, bayonet coupling,
straight pin contact), (Series III, Classes H and Y)
MIL-DTL-83723/95F: Connectors, electrical (Circular, environment
resisting), plug (threaded coupling, self-locking, crimp socket
contact), (Series III, Classes A, G, K, R, and W)
MIL-DTL-83723/96F: Connectors, electrical (Circular, environment
resisting), plug (threaded coupling, self-locking, crimp pin contact), (Series III, Classes A, G, K, R, and W)
MIL-DTL-28731/38A: Connector, electrical, rectangular shield, for
use with MIL-C-28731/32
MIL-DTL-38999/91 NOT 1: Connectors, electrical, circular, receptacle, dummy stowage, bayonet coupling (MIL-C-27599 Series I
and MIL-DTL-38999 Series I)
MIL-DTL-38999/10A NOT 1: Connectors, electrical, circular, receptacle, dummy stowage, bayonet coupling (MIL-C-27599 Series II
and MIL-DTL-38999 Series II)
MIL-C-83723/59C NOT 1: Connectors, electrical (Circular, environment resisting), protective covers, plug (for MIL-C-26500 and
MIL-C-83723, Series III, Classes A, R, and W)
MIL-C-83723/60D NOT 1: Connectors, electrical (Circular, environment resisting), protective covers, receptacles (for MIL-C-26500
and MIL-C-83723, Series III, Class A, R, and W)
MIL-DTL-83723/61E: Connectors, electrical (Circular, environment
resisting), dummy connector, receptacles (for MIL-C-26500 and
Mil-C-83723, Series III, Classes A, R, and W)
SAE-AS854049/103: Connectors, Accessories, Composite, RFI/EMI,
Electrical, Strain Relief, Straight, Self-Locking, Category
RELIEF, 3C (for MIL-DTL-38999 Series III and IV Connectors)
SAE-AS854049/104: Connectors, Accessories, Composite, RFI/EMI,
Electrical Strain Relief, 45, Self-Locking, Category 3C (for MILDTL-38999 Series III and IV Connectors)
SAE-AS85049/105: Connectors, Accessories, Composite, RFI/EMI,
Electrical Strain Relief, 90, Self-Locking, Category 3C (for MILDTL-38999 Series III an IV Connectors)
SAE-AS85049/109: Connector Accessories, Electrical Backshell,
Straight, Non-Self Locking and Self Locking, Pre-Attached
Shield Termination (RFI/EMI), Boot Accommodation, Category
3B (for MIL-DTL-83723 Series III, MIL-DTL-5015 [Series I and
II], AS81703 Series III, and MIL-C-26482 Series II Connectors)
SAE-AS85049/111: Connector Accessories, Electrical Backshell, 90
Degree, Self-Locking and Non-Self-Locking, Pre-Attached
Shield Termination (RFI/EMI), Boot Accommodation, Category
3B (for MIL-DTL-83723 Series III, MIL-DTL-5015 [Series I and
II], AS81703 Series III, and MIL-C-26482 Series II Connectors)
SAE-AS85049/112: Connector Accessories, Electrical Backshell,
Straight, Self-Locking and Non-Self-Locking, Pre-Attached
Shield Termination (RFI/EMI), Boot Accommodation, Category
3B (for MIL-DTL-38999 Series I and II Connectors)
SAE-AS85049/114: Connector Accessories, Electrical Backshell, 90
Degree, Self-Locking and Non-Self-Locking, Pre-Attached
Shield Termination (RFI/EMI), Boot Accommodation, Category
3B (For MIL-DTL-38999 Series I and II Connectors)
SAE-AS85049/115: Connector Accessories, Electrical Backshell,
Straight Self-Locking and Non-Self-Locking, Pre-Attached
Shield Termination (RFI/EMI), Boot Accommodation, Category
3B (for MIL-DTL-38999 Series III and IV Connectors)
SAE-AS85049/117: Connector Accessories, Electrical Backshell, 90
Degree, Self-Locking, Pre-Attached Shield Termination
(RFI/EMI), Booth Accommodation, Category 3B (for MIL-DTL38999 Series III and IV Connectors)
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IF/RF MICROWAVE COMPONENTS
402 Rev I
High Frequency Design
MIXER SELECTION
Selecting High-Linearity
Mixers for Wireless
Base Stations
By Stephanie Overhoff
Maxim Integrated Products, Inc.
T
oday’s communication systems make
strong demands on
both receiver sensitivity
and large-signal performance (dynamic range).
When selecting components for a new design,
therefore, it behooves the designer to focus on
the performance of each one with regard to
these requirements. In particular, this article
deals with mixers and the basic parameters
specified in their data sheets.
The communication standards for wireless
base stations—e.g., GSM, UMTS, and (now)
LTE, define minimum specifications for various parameters, including receiver sensitivity
and performance in the presence of large signals. These key requirements make heavy
demands on every functional block of the radio
in a wireless base station, and are affected by
every single component. In the receive signal
path, the mixer performance has a major
impact on the receiver’s overall sensitivity and
large signal performance, so by understanding
This article discusses the
key parameters of mixer
performance to assist in
the selection of an appropriate device for wireless
base station design
mixer performance issues and parameters,
you can select the best mixer for your receive
channel.
To start, we first analyze the block diagram of a typical receiver used in wireless
base stations (Figure 1). Such receivers are
referred to as dual-conversion superheterodyne receivers, because the received signal
undergoes two consecutive down-conversions
from the operating frequency to lower IF frequencies. As shown, the signal is received by
the antenna and then filtered by RF filter #1,
which is normally used to reject out-of-band
“trash” signals that can cause overload or
interference. This filter output is then amplified by a low-noise amplifier (LNA), which
normally has a very low noise figure.
The amplified signal is again filtered, this
time by RF filter #2, which limits the frequency range while removing any remaining
unwanted out-of-band signals that can limit
the mixer’s performance. The amplified and
band-limited signal is then fed to the first
mixer, where it is down-converted to an IF frequency by mixing with a local oscillator signal.
Figure 1 · Block diagram of a typical wireless-basestation receiver.
40
High Frequency Electronics
Electrical Specifications (1 Meter of Fiber)
Noise Input Power Spurious Free
Phase Group
Available Wavelengths
Gain Figure @ P1dB Dynamic Range Noise Delay VSWR Standard
Optional
Series
Frequency
(dB) (dB) (dBm, Min.) (dB/Hz, Typ.) (dBc, Typ.) (ns) (In/Out)
(nm)
Wavelengths
Transmitters and Receivers
SLL
5 kHz - 2.5 GHz
12
18
-14
103
>100
0.2
2:1
1550/1310
18 CWDM Ch
100 MHz - 2.5 GHz
12
18
-14
103
>100
0.2
2:1
1550/1310
18 CWDM Ch
LBL
50 KHz - 3 GHz
15
11
-14
106
>100
0.2
2:1
1550/1310 18 CWDM Ch, 45 DWDM Ch
50 KHz - 4.5 GHz
15
11
-14
106
>100
0.2
2:1
1550/1310 18 CWDM Ch, 45 DWDM Ch
10 MHz - 3 GHz
15
11
-14
106
>100
0.2
2:1
1550/1310 18 CWDM Ch, 45 DWDM Ch
10 MHz - 4.5 GHz
15
11
-14
106
>100
0.2
2:1
1550/1310 18 CWDM Ch, 45 DWDM Ch
LBL-HD
950 MHz - 2.5 GHz
0
22
7
114
>100
0.2
2:1
1550/1310
18 CWDM Ch
SCML
50 kHz - 6 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz - 6 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz -11 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz -13 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz -15 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz - 18 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
10 MHz - 18 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
HRL
50 kHz - 6 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
100 MHz - 6 GHz
15
15
-14
103
>100
0.2
2:1
1550
1310/1490 nm
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30 KHz -12.5 GHz35 O/E (or TIG = 2800 ohms)
2:1
1280-1580
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2:1
1280-1580
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High Frequency Design
MIXER SELECTION
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Depending on the receiver’s architecture, this IF signal
may be further down-converted to a second, lower IF frequency, and then demodulated to obtain a baseband signal ready for processing.
We now take a closer look at the mixers in this receiver chain. The parameters of the mixers should be investigated, because they have a major effect on the receiver’s
sensitivity and large-signal performance.
Mixer Performance Parameters
The noise figure of a mixer describes the degradation
in signal-to-noise ratio from input to output. That ratio is
normally expressed in the logarithmic measure of decibels (dB), as shown in equation 1:
NF = 10 log
SNRRF
[ dB]
SNRIF
(1)
A second important parameter is the so-called conversion gain (conversion loss, if negative). This parameter
gives an important hint as to whether the mixer configuration is active or passive. Passive mixers have insertion
loss (conversion loss), because they include no components for amplifying the signal. Active mixers, with their
active components, typically provide conversion gain.
An active mixer can be realized either as an integrated mixer based on a balanced design (Gilbert Cell), or as
a passive mixer that is combined with a following IF
amplifier stage that overcomes the mixer’s loss, providing
a net gain. Because the integrated mixer has gain, it
requires no external IF amplifier stage to make up for
insertion loss.
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Conversiongain
/ loss = G =
Conversion
gain/loss
PRF
[ dB]
PIF
(2)
Conversion gain (or loss) is a logarithmic measure
expressed in decibels. It is frequency dependent, and
should be specified over the mixer’s entire operating frequency range. To ensure optimal receiver performance,
the variation of conversion gain/loss over the user’s specified frequency range should be as small as possible.
Because wireless base stations usually operate in a
variable temperature environment, the conversion
gain/loss should also be specified over the operating temperature range, again with as small a variation as possible. This is important, because under normal conditions a
small variation with temperature allows the designer to
include a smaller amount of headroom, which is useful in
system planning.
The large-signal behavior of a mixer is described by a
mixer parameter called the 1 dB signal compression
point, also simply called compression
point (P1dB), and the second- and
third-order intercept points (IP2 and
IP3). The P1dB compression point predicts the level of input power at which
mixer gain is reduced by 1 dB, with
respect to the linear expression in
equation (3):
Pout = G · Pin
(3)
Thus, P1dB is a figure of merit representing the point above which the
mixer is subject to an overload condition and no longer maintains its specified conversion gain.
A mixer should also have the ability to convert a weak signal when
large signals of nearly the same frequency are applied to the mixer’s
input. This behavior is normally
described by the third-order intercept
point (IP3), which together with the
noise figure describes the dynamic
range of the mixer. IP3 is is the signal
level at which third-order distortion
products would be equal to the
desired signal. In reality, it cannot be
reached because an overload condition would occur at a much lower signal level, but it is a valuable figure of
merit, derived from measurements
made using signal levels below P1dB.
A large IP3 is the indicator for a highlinearity mixer.
The mixer data sheet should also
specify intercept points for the
mixer’s input and output. Using equation (4), you can calculate the output
intercept point from the input intercept point, and vice versa:
OIP3 = IIP3 + G
(4)
where OIP3 is the intercept point at
the mixer output, IIP3 at the input,
and G is the conversion gain, or loss,
if negative. The OIP3 for a passive
mixer is therefore reduced by the
mixer’s conversion loss. This insertion
loss requires compensation in either
the RF or IF gain stages, to establish
the receiver’s desired overall noise
figure (an additional parameter that
must be accounted for in the receiver
design).
Passive vs. Active Mixers
A big advantage of passive mixers
is that they can also be used as frequency up-converters—i.e., their
input signals can be converted to a
higher frequency. That capability is
normally employed in a transmitter
chain, to convert an IF signal to the
final transmit frequency. Because a
passive mixer can be used in the
transmit chain as well as the receiver
chain, you need to order and stock
only one component.
Some receivers employ a direct
down-conversion architecture that
directly down-converts input signals
to the baseband, without recourse to
an IF signal. For such receivers, the
mixer data sheet should specify
another important parameter called
port-to-port isolation. This parameter
specifies the amount of isolation
between the local oscillator (LO) signal and the mixer input signal. If
port-to-port isolation is not large
enough, the LO can mix with itself,
producing a DC offset at the mixer
output that affects the interface to following stages and degrades the
receiver performance.
Because a mixer converts frequencies, it generates “new” frequencies
called mixer spurs, which are unwanted spurious signals. Spurs should be
investigated thoroughly, especially
those at (2*RF – 2*LO), (3*RF –
3*LO), and higher orders that affect
the receiver by creating spurious signals that are near its IF frequency,
where they cannot be effectively filtered. This behavior is usually
described in a mixer data sheet by the
“2 × 2” and “3 × 3” parameters.
Besides these various parameters,
you must also consider the level of
integration. Some applications can
benefit by integrating the mixer core
with an LO amplifier, baluns, and LO
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High Frequency Design
MIXER SELECTION
Figure 2 · Block diagram of the MAX2029 passive
mixer, showing the major RF functions.
ent frequency ranges. A receiver designed for a 900 MHz
GSM system can then be used for an 1800 MHz GSM system, just by changing some key components.
A family of pin-compatible mixers covering the different bands, therefore, would be ideally suited for applications in which a common PC-board layout accommodates
multiple frequency bands used for the wireless infrastructure. The ultimate goal is development of a single layout for a multi-standard wireless base station that handles the current set of transmission formats: GSM,
UMTS, WiMAX, and LTE.
For example, a passive mixer (MAX2029) in the receiver chain can down-convert the receiver signal, and another identical mixer in the transmitter can up-convert the
IF signal to the final transmit frequency. As shown in the
block diagram for this chip (Figure 2), it integrates all the
typical external components: LO buffer amplifier, baluns,
and LO switch.
When used as a down converter, the MAX2029 has an
IIP3 of +36.5 dBm, with P1dB of +27 dBm, 6.5 dB of conversion loss, and a 6.7 dB noise figure. It is well suited for
base-station applications in which high linearity and a
low noise figure are critical, because its SiGe process technology enables impressive performance.
The 2RF–2LO rejection performance (72 dBc with a
–10 dBm RF input signal), enables simpler and more costeffective filters by easing the requirements for filtering
the close-in harmonics. The MAX2029, which is pin-compatible with MAX2039 and MAX2041 mixers, expands
44
High Frequency Electronics
Figure 3 · This new Web tool provides a parametric
search that reveals the number of products matching
the data filter settings, updating immediately as the
user makes selections.
the frequency range at the lower end from 815 MHz to
1000 MHz. As one member of a family of pin-compatible
mixers, it allows the creation of a single p.c. board layout
for receivers that handle different frequency ranges and
different communication standards.
As noted before, active mixers can take the form of
either a balanced Gilbert Cell design or a passive mixer
combined with an IF-amplifier stage. The MAX9986, for
instance, represents the second configuration. Its noise
figure performance requires less RF gain ahead of the
mixer stage, which in turn makes possible a better overall linearity for the receiver. Otherwise, if more gain is
required in front of the mixer to minimize the cascaded
noise figure, the mixer’s linearity must be higher to maintain overall receiver linearity.
Choose the Right Mixer
When searching the Internet for a mixer, the challenge
is to sift through all the specifications listed for the various mixers available from a manufacturer and make an
optimum choice. Fortunately, a Web-based “parametric
search tool” has recently been introduced by Maxim to do
just that. It enables design engineers to quickly find the
right IC for an application. A single page shows all the
criteria available for filtering information from the web,
and the corresponding parts. Changing any of these crite-
I
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Check these features!
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Extremely low conversion loss, from 6.3 dB
U.S. Patent Number 6,807,407
With a wide selection of models, you’ll
find a Lavi mixer optimized for your
requirements. Visit the Mini-Circuits website
at www.minicircuits.com for comprehensive
performance data, circuit layouts, and
environmental specifications. Price &
availability for on-line ordering provided.
Mini-Circuits...Your partners for success since 1969
RoHS compliant
40TH
®
ANNIVERSARY
Get info at www.HFeLink.com
1969-2009
ISO 9001 ISO 14001 AS 9100 CERTIFIED
minicircuits.com
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 For detailed performance specs & shopping online see Mini-Circuits web site
TM
The Design Engineers Search Engine Provides ACTUAL Data Instantly From MINI-CIRCUITS At: www.minicircuits.com
IF/RF MICROWAVE COMPONENTS
451 Rev A
High Frequency Design
MIXER SELECTION
ria updates the parts list immediately. Features include
single-click filtering, sliding filter controls, multilevel
sorting, and abundant “tool tips.” There is no easier way
to find the right part for an application.
Figure 3 shows the search results for an active mixer
with 10 dB gain, designed especially for base stations. The
part proposed is a MAX9986. An additional click on that
component leads the user directly to the component’s
homepage, where the associated data sheet, application
notes, and other information can be found.
A parametric search by this new Web tool from Maxim
reveals the number of products matching a particular
combination of filter settings—before the user makes the
first click. The “smart” search algorithm shows only valid
criteria. The user cannot make selections that eliminate
all parts. Built using the latest Web 2.0 technologies, the
tool requires no plug-ins on the user’s system. It is available now at para.maxim-ic.com.
Author Information
Stephanie Overhoff joined
Maxim in 2006 as a field applications engineer. She studied
Electrical Engineering at Stuttgart
University
(Germany)
and
received a master’s degree in 1995.
She then worked for one year at
Bosch Telecom, in the development
department for DECT telephones
(the Digital European Cordless
Telephone standard). In 1996 she
joined Siemens AG and worked in the RF development
department, responsible for developing crystal oscillators,
synthesizers, and PLLs for mobile phones based on the
GSM standard. She also worked on Siemens projects that
were integrating GPS receivers with mobile phones for
GSM and UMTS.
Visit the
Archives!
Remember, all past technical articles,
columns and reports are available
online in PDF form — just click on the
“Archives” tab at our Web site:
www.
highfrequencyelectronics
.com
Get info at www.HFeLink.com
46
High Frequency Electronics
Phoenix
ered include power amplifiers and the critical receiver
elements: oscillators and mixers. Receiver architecture
and synthesizer design to meet critical requirements
will be presented. Techniques to successfully integrate
circuit functions for the transceiver will be presented.
Courses coming this November
DSP Made Simple for Engineers
Dates
Instructor
Price
188-4214
Applied RF Techniques for Modern Radio Design
Nov 16-20
Rick Fornes
003-4216
Applied RF Techniques II
Nov 16-20
Ed Niehenke
027-4215
DSP Made Simple for Engineers
Nov 18-20
Rick Lyons
052-4213
Frequency Synthesis and Phase-Locked Loop Design
Nov 18-20
Eric Drucker
212-4251
Linearization and Modeling Techniques
Nov 17-20
Cripps/Wood
205-4217
Wireless Systems Operations
Nov 16-20
Bob Morrow
$2,195.00
$2,195.00
$1,495.00
$1,495.00
$2,195.00
$2,195.00
Applied RF Techniques for Modern Radio Design
This 5-day course provides technical professionals
with the design concepts required to optimize the RF
performance of the latest RF communication networks.
This includes Cellular and Mobile RF (WCDMA) and
fixed Wireless RF (802.1, HF, UHF, microwave, radar
, GPS and satellites). This course will include a brief
introduction to RF system performance for WCDMA
handsets, and then it will transition into RF modeling
techniques used to maximize RF performance. The RF
aspects of Software Defined Radios will be emphasized
with a focus on military applications and developments
This three-day course is the beginner’s best opportunity to efficiently learn DSP. Intuitive, nonmathematical explanations and well-chosen examples develop the
student’s fundamental understanding of DSP theory.
The practical aspects of signal processing techniques
are stressed over discrete system theory. Participants
will leave with a collection of tricks-of-the-trade used
by DSP professionals to make their processing algorithms more efficient.
Frequency Synthesis and Phase-Locked Loop Design
This three-day course provides both the theoretical
and practical knowledge necessary to design frequency
synthesis circuits and systems using phase-locked loops
and related technologies.
Linearization and Modeling Techniques
This course takes a “”system-level”” approach to the
linearization and behavioural modeling of RF Power
Amplifiers. Special emphasis is given to a detailed
treatment of PA modeling, both as a means of allowing more meaningful system level simulations, and also
as a necessary starting point to the development of
advanced predistortion algorithms for PA linearization.
Wireless Systems Operations
Applied RF Techniques II
This five-day course is a follow up course to Applied
RF Techniques I and provides participants with the
critical tools to design, analyze, test, and integrate
nonlinear transmitter and receiver circuits and subsystems. Circuit level engineers will master the latest
nonlinear design techniques to both analyze and design transceiver circuits. System engineers will examine commercially available integrated circuit functions;
learn the performance limits and how to establish
specifications. Test engineers will learn how to test
and evaluate circuits. Transceiver circuits to be cov-
This five-day course covers the fundamentals of wireless system design, deployment, and operation. Participants will study indoor and outdoor signal propagation
characteristics, advanced modulation and coding techniques, and network connectivity options. Next, the
IEEE 802.11a/b/g/n WLAN, IEEE 802.15.1 Bluetooth,
and IEEE 802.15.4 ZigBee low-rate WPAN specifications
are examined in detail, and their operations compared.
Interference between various wireless networks is analyzed and methods for improving their coexistence are
presented. Finally, the operation of GSM/CDMA cellular
systems and IEEE 802.16 WiMAX is discussed.
Visit our website for more information,
or to register online with a credit card.
Phone: 1-650-949-3300 Fax: 1-650-949-4400 www.besserassociates.com
Get info at www.HFeLink.com
TECHNOLOGY REPORT
EDA Tools for RFIC Design:
Business and Product News
Helic, Inc.—VeloceRF™ Qualified by TSMC
Helic, Inc. (www.helic.com) has announced that TSMC
has qualified its VeloceRF tool as part of TSMC’s
Electromagnetic (EM) Tool Qualification Program.
VeloceRF has been accuracy-certified against TSMC’s
65nm silicon-verified spiral inductor set.
TSMC’s EM Tool Qualification Program assists IC
designers by providing certified process technology files,
layout and measurements for 65 nm and 90 nm process
technologies. The program ensures greater accuracy of
EM simulators and extractors used in applications such
as high-speed digital clock circuits and high-frequency
mixed-signal RF designs. Certified process files eliminate
several error sources in the design process and enable
designers to use Helic’s VeloceRF platform on TSMC 65
nm processes with confidence.
Helic’s VeloceRF features a rapid and high-capacity,
vector-based RLCK modeling engine that can generate
very accurate models for any kind of integrated inductive
component, and also includes a spiral inductor synthesizer. It eliminates the need for custom layout and eases
adoption by foundries and design teams. Features such as
conductor track slotting to mitigate metal stress, geometry resizing under current density constraints and the
use of dummy fill patterns are pre-programmed in
VeloceRF and are consistently supported by the layout
and LVS modules.
AWR Corporation—PDK for WIN Semiconductors
GaAs Foundry Process
AWR (www.awrcorp.com) and WIN Semiconductors
Corporation (www.winfoundry.com) have announced the
release of the WIN/AWR H2W PH50-00 process design kit
(PDK). The PDK for the WIN PH50-00 GaAs enhancement/depletion-mode pseudomorphic high electron mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT) foundry process is the latest in AWR’s series
of PDKs available for monolithic microwave integrated
circuit (MMIC) designers.
WIN PH50-00 is a high-frequency, high-power MMIC
process that has been in production since 2007. The new
WIN/AWR PDK announced today fully exploits the process along with the unique technologies in the latest version of Microwave Office software (v2009), as well as
AWR’s ACE™ automatic circuit extraction technology,
AXIEM™ 3D planar electromagnetic simulator, and
APLAC® multi-rate harmonic balance simulator. The
48
High Frequency Electronics
AWR’s AXIEM was able to electromagnetically solve this
mm-wave converter MMIC for Mimix Broadband.
WIN/AWR PP50-00 PDK can be resident in Microwave
Office software simultaneously with packaging and other
foundry PDKs to provide a complete module co-design
environment. The AWR/WIN PH50-00 PDK is available
for immediate use within AWR’s Microwave Office v2009
software. All AWR/WIN PDKs are distributed by WIN
and available free of charge to qualifying customers.
A recent “AWR Success Story” has been published,
describing how Mimix Broadband (www.mimixbroadband.com) solved an entire MMIC chip using AWR’s
AXIEM 3D Planar EM Software. Mimix Broadband, Inc.
supplies high performance gallium arsenide (GaAs) semiconductors from DC to 50 GHz for RF, microwave and millimeter-wave applications. Mimix was designing a mmwave converter using an innovative design in the passive
circuitry. If the design technique works the way Mimix
believes, they can achieve very aggressive specs for system performance without having to use larger, conventional mm-wave structures. Only by solving the entire
structure can Mimix designers verify their design ideas.
Using other solvers, Mimix was unable to electromagnetically (EM) simulate the entire monolithic microwave
integrated circuit (MMIC) circuit, which includes more
than 100 ports and 100k unknowns (see photo above),
using other EM solvers and turned to AWR. As a result,
AXIEM solved the entire structure on a desktop PC. With
an electromagnetic solution for the full chip, Mimix could
explore the circuit’s physics and evaluate new mm-wave
design methods.
DC to 8GHz
MMIC Amplifiers
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Check out our web site, over 24 models available with performance
data, curves, environmental specs and easy downloading
of S parameters from the web to your simulation software.
Models are available to provide the performance you need
from high gain, low noise, high IP3 or low DC current.
Don’t wait; choose the MMIC model that meets your
performance/price requirements, Available from Stock.
Mini-Circuits...Your partners for success since 1969
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All models protected under U.S. patent # 6,943,629.
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40TH
®
ANNIVERSARY
Get info at www.HFeLink.com
1969-2009
ISO 9001 ISO 14001 AS 9100 CERTIFIED
minicircuits.com
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 For detailed performance specs & shopping online see Mini-Circuits web site
TM
The Design Engineers Search Engine Provides ACTUAL Data Instantly From MINI-CIRCUITS At: www.minicircuits.com
IF/RF MICROWAVE COMPONENTS
346 rev O
TECHNOLOGY REPORT
for the demands of today’s complex RFICs, and its capacity enables full characterization of complete
transceivers, including parasitics, prior to tape-out.
Cadence Design Systems—Linear Technology
Adopts Cadence for Integrated Design Flow
Agilent’s GoldenGate RFIC simulator provides features
such as the process variation analysis depicted here
Agilent Technologies—PDKs for ADS 2009 and
Jazz Semiconductor’s 0.18 µm BiCMOS process
Agilent Technologies Inc. (www.agilent.com) recently
announced the availability of two process design kits
(PDKs) for Jazz Semiconductors (www.jazzsemi.com)
0.18-micron SiGe BiCMOS process offerings that are
used with Agilent’s Advanced Design System 2009 EDA
software. The PDKs accelerate customers’ time-to-market for IC development in automotive collision avoidance, high-data-rate networks, emerging HDTV wireless
standards and other high-speed applications.
The Jazz SBC18HA and SBC18H2 PDKs are the
result of collaboration between Jazz and Agilent to offer
an accurate and productive work environment for the
industry’s latest SiGe MMIC design solutions. The
SBC18HA and SBC18H2 have been widely accepted in
many high-frequency applications, including 24 GHz
and 77 GHz collision avoidance radar, 60 GHz WLAN
HDTV, wireless base-station back haul, and a host of
optical applications, including TIA, laser drivers,
SERDES and CDRs.
Agilent also announced validation of its GoldenGate
RFIC simulation, analysis and verification tool for
STMicroelectronics’ (www.st.com) 32 nm RF CMOS
technology. The qualification of GoldenGate for ST’s 32
nm RF technology is the result of a long-term collaboration between the two companies that includes 65 nm and
other market-critical processes. Agilent’s GoldenGate
software (see figure above) is an advanced simulation
and analysis solution for integrated mixed-signal RFIC
designs. Its unique simulation algorithms are optimized
50
High Frequency Electronics
Cadence Design Systems, Inc. (www.cadence.com),
announces that Linear Technology Corporation
(www.linear.com), a supplier of high performance analog
integrated circuits for communications, computer, automotive, and industrial companies worldwide, has adopted a broad range of Cadence Design Systems technologies as an integrated design flow. The new flow is
expected to provide improved analog and mixed signal
simulation and layout capabilities for faster design time
and higher accuracy.
Key components of the integrated flow include
Cadence’s Virtuoso® Analog Design Environment,
Virtuoso AMS Designer Simulator, Virtuoso Multi-Mode
Simulation, Assura® Design Rule Checker, Assura
Layout vs. Schematic Verifier, and QRC Extraction.
Cadence also announced that it has developed a protocol testing solution using instrumentation from Rohde
& Schwarz (www.rohde-schwarz.com) that enables early
validation of next-generation 4G/LTE wireless SoC/
ASIC designs. The solution integrates the Cadence
Incisive® Palladium® accelerator/emulator and the R&S
CMW500 LTE network emulator, allowing wireless/
mobile companies to test their complex designs much
earlier than when silicon becomes available.
PSP Models Help NXP and TSMC Deliver 45 nm
Single-Chip Digital TV Platform
With the newly introduced DTV platform allowing
TV viewers to enjoy HD digital content and Internet
access with unparalleled picture quality, NXP
Semiconductors (www.nxp.com) and Taiwan Semiconductor Manufacturing Company, Ltd. (www.tsmc.com)
have announced their cooperation in the development of
the industry’s first single-chip 45 nm global LCD TV
platform, TV550. NXP and TSMC have reached a major
milestone in enabling the next generation of mainstream digital TV sets for TV manufacturers. NXP is
now delivering engineering samples to key customers.
Featuring NXP’s PNX85500 processor, built on
TSMC’s 45 nm low power process technology, the NXP
TV550 digital TV platform is a production-ready reference design that reduces time-to-market and reduces
costs with its high level of functional integration. The
long-term partnership and collaboration between NXP
and TSMC was the key to this first-to-market achievement, with early access to silicon test results from
TSMC resulting in accurate transistor characterization
using state-of-the art PSP (Pennsylvania State
University-Philips) models.
Next month’s Technology Report will focus on technology
developments that target military applications—communications, navigation, sensors, radar, countermeasures.
TIMES MICROWAVE SYSTEMS
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LMR® TFlex® and StripFlex®
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E-mail: admin@microwavecomponentsinc.com
Web Site: www.microwavecomponentsinc.com
Get info at www.HFeLink.com
AS 9120
ISO 9001:2000
CERTIFIED
High Frequency Products
NEW PRODUCTS
3 GHz Spectrum Analyzers
30 MHz to 3 GHz Limiter
The RLM-33+ is packaged in a
miniature size (0.25 × 0.3 in.) and
protects against ESD and input
power surges over a frequency
range
30
to
3000
MHz.
Construction is on a microstrip low
loss dielectric material and cased
into Mini-Circuits high volume,
low cost “R” package for cost efficiencies.The RLM-33+ limiter provides excellent protection of low
noise amplifiers in hostile environments where unwanted signals
prevail such as in manufacturing
sites, train tunnels, etc.
Mini-Circuits, Inc.
www.minicircuits.com
Trilithic presents their new 8853
series of 3 GHz spectrum analyzers
for broadcast, wireless, CATV and
general purpose applications. This
new series has a wireless option package that includes channel power, adjacent channel power (ACP) and complimentary cumulative distribution
function
(CCDF)
for
testing
CDMA2000, WCDMA, TD-SCDMA,
1x EV-DO and WiMAX. The new 8853 Series from Trilithic allows wireless
operators to put sophisticated analysis and troubleshooting capability in the
hands of a wider range of technicians.
Trilithic, Inc.
www.trilithic.com
down to –70 dBm. The unit has a
logging slope of 50 mV/dB at center
frequency at 25°C. The DC offset
drift is ±50 mV typical over the
operating temperature of –40 to
+85°C. Power is +8 VDC at 100 mA
typical, –8 VDC at 30 mA typical.
The DLVA offers a broad operational frequency range, excellent
temperature stability and exceptional log conformance. The SMA
connectors are removable on the RF
input and video output connectors.
MITEQ, Inc.
www.miteq.com
non-standard designs are available
on request. Aeroflex/Inmet is a
manufacturer of RF, microwave
and wireless components including
attenuators, terminations, cable
adapters, bias tees, DC blocks, and
gain equalizers.
Aeroflex / Inmet
www.aeroflex.com/inmet
SMA Power Dividers
Detector Log Video Amplifier
MITEQ, Inc. introduces a new addition to its family of Detector Log
Video Amplifiers (DLVA). The
FBLA-2/6-50 ultra-broadband unit,
which operates in the 2 to 6 GHz
range is a low noise, high dynamic
range amplifier that utilizes
improved sensitivity. The Kovar
housing is hermetically sealed and
also fully EMI shielded. Total
weight is approximately 20 grams
and dimensions are 1.63" × 1.25" ×
1.5" without SMA connectors.
Featuring fast rise time and a logarithmic linearity of ±1 dB maximum at center frequency at 25°C.
Dynamic range is 50 dB and with
the addition of a MITEQ LNA, the
input power level can be extended
52
High Frequency Electronics
2-Watt, 40 GHz Attenuator
Aeroflex/Inmet releases the next
generation of 40 GHz, 2.92 mm
attenuators with extended power
handling capability of a minimum
of 2 watts average power. The new
offering compliments the current
0.5 watt attenuator family providing an excellent cost-to-performance ratio. Designed for use in
both the Test and Measurement
market as well as OEM systems,
these high quality attenuators
offer an alternative to other “scientific grade” products on the market. Standard dB values include 3,
6, 10, 20 and 30 dB while many
Microlab/FXR announces an addition to its range of power splitters/dividers. The new low cost, 2,
3, 4 and 8 way power dividers, Dx63FF series, cover from 1700 to
4,200 MHz to include the PCS and
UMTS bands, the new 2.5-2.7 MHz
WiMAX/LTE expansion band, and
3.5 GHz WiMAX bands. These
Wilkinson style power dividers
have been designed for low power
applications where output isolation is preferable over lowest possible loss. The wide frequency range
allows use with multi-band antennas and leaky cable systems.
Lower loss dividers are available
from in the Dx-82FN and Dx-86FN
series.
Microlab/FXR
www.microlab.fxr.com
GVA
-81
+
GVA
-83
+
10 d
B
GVA
-82
+
20 d
B
15 d
B
GVA
-84
+
24 d
B
+20 dBm Power Amplifiers with a choice of gain!
PLIFIERS
DC to 7 GHz
Mini-Circuits’ monolithic, surface-mount GVA amplifiers are
extremely broadband, with wide dynamic range and the
right gain to fit your application. Based on high-performance
InGaP HBT technology, patented GVA amplifiers cover DC* to
7 GHz, with a selection of gain choices 10, 15, 20 or 24dB,
(measured at 1 GHz). They provide better than +20 dBm
typical output power, with typical IP3 performance as high
US patent 6,943,629
*Low frequency determined by coupling cap.
40TH
1969-2009
ea. (qty.25)
as +41 dBm at1GHz. Supplied in RoHS-compliant, SOT-89
housings, low-cost GVA amplifiers feature excellent
input/output return loss and high reverse isolation. With
built-in ESD protection, GVA amplifiers are unconditionally
stable and designed for a single 5-V supply. For more on
broadband GVA amplifiers, visit the Mini-Circuits’ web site
at www.minicircuits.com.
Mini-Circuits...Your partners for success since 1969
®
ANNIVERSARY
Get info at www.HFeLink.com
182
$
from
ISO 9001 ISO 14001 AS 9100 CERTIFIED
minicircuits.com
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 For detailed performance specs & shopping online see Mini-Circuits web site
TM
The Design Engineers Search Engine Provides ACTUAL Data Instantly From MINI-CIRCUITS At: www.minicircuits.com
IF/RF MICROWAVE COMPONENTS
458 Rev. A
High Frequency Products
NEW PRODUCTS
Base Station Data Converter includes On-Chip NCO
3D Planar EM Analysis Software
AWR announced enhancements to
its AXIEM 3D planar electromagnetic analysis software that greatly increase the software’s speed,
accuracy, and capacity. AXIEM’s
proprietary solver and meshing
algorithms have made it possible
for the first time to migrate EM
analysis from a back-end, post-verification tool to an upfront design
diagnostic solution. Key enhancements within this second major
release of AXIEM include: new
support for 64-bit PC platforms
that makes it possible to solve
designs with over a 100,000
unknowns far faster than with 32bit operating systems; expanded
support for multi-core configurations that further reduces simulation time; loss model improvements that deliver more robust
data at low frequencies; and extensive sources/ports and de-embedding options that provide greater
flexibility and accuracy. The prerelease version 2009 of the AXIEM
3D planar EM simulator is available to qualified customers.
AWR
www.awrcorp.com
Wideband LNAs
Hittite Microwave Corporation has
introduced
four
new
GaAs
pHEMT/HEMT MMIC low noise
amplifiers (LNAs) that are ideal for
54
High Frequency Electronics
Analog Devices, Inc. introduced a dualchannel, 1.2-GSPS, 16-bit DAC (digitalto-analog converter) that supports the
high data rates and complex modulation
schemes required for advanced multicarrier wireless and broadband communications equipment throughout the
world. Featuring an on-chip 32-bit NCO
(numerically controlled oscillator) that
allows flexible placement of the IF (intermediate frequency) to help optimize system performance, ADI’s AD9122 DAC
satisfies requirements for multi-standard cellular base stations and other
applications that use sophisticated DPD (digital pre-distortion) techniques
demanding broad signal bandwidths. The AD9122 LVDS (low-voltage differential signaling) interface with an eight-word-deep FIFO (first-in, firstout) memory supports a maximum sample-data-input-rate of 1.2 GSPS
and 600 MSPS (mega samples per second) per DAC to support signal
bandwidths up to 400 MHz in advanced DPD transmitter architectures.
The data interface supports word, byte, and nibble load allowing customers to reduce input pins on lower data rates to save board space, power
and cost. The AD9122 includes an improved on-chip PLL (phased-locked
loop) with lower jitter and phase noise. Operating with the on-chip PLL at
a DAC output frequency of 150 MHz, the AD9122 delivers a 76 dB ACLR
(adjacent-channel leakage ratio) for single-carrier WCDMA applications.
For the most demanding wireless communications applications, the
AD9122 can achieve 83 dBc ACLR using an external PLL. The AD9122
includes integrated interpolation filters with selectable interpolation factors of 2, 4, and 8. The dual DAC also integrates 32-bit NCOs and is available in a space-saving 72-pin LFCSP (lead-frame chip-scale package) that
is 50 percent smaller than previous generation DACs. Available now.
Analog Devices
www.analog.com
microwave and millimeterwave
radio, VSAT, military & space, test
instrumentation and sensor applications from 1 to 36 GHz. The
HMC263LP4E
and
the
HMC566LP4E are GaAs pHEMT
MMIC LNAs that are rated from 24
to 36 GHz, and 28 to 36 GHz
respectively. These LNAs have been
designed to provide noise figure as
low as 2.2 dB with up to 21 dB of
small signal gain, and +24 dBm
output IP3 from a single supply of
+3/+5V. The HMC263LP4E and the
HMC566LP4E also exhibit high
dynamic range and excellent input
and output return losses, making
them ideal for millimeterwave system receivers. Samples and evaluation PC boards for all SMT packaged products are available from
stock and can be ordered on-line.
Hittite Microwave Corporation
www.hittite.com
Active Differential Probes
Agilent Technologies Inc. introduced two active differential
probes for RF and Microwave
instruments—the U1818A/B—that
feature high differential input
impedance from 100 kHz to 7 or 12
GHz. The new probes are designed
to be directly compatible with
Agilent’s network, spectrum and
signal source analyzers. The
U1818A/B probes provide a highfrequency probing solution for
R&D and quality assurance engi-
2010 EDITORIAL CALENDAR
Issue
Product Coverage
Technology Report
Tutorial Topic
Ad Close
Industry Events
DesignCon 2010
January
Connectors
High Speed Digital
Microwave Subsystems
Portable Instrument
Applications
Noise in RF
Circuits
December 16
(Materials Dec. 21)
February
Discrete Semiconductors
EMI/EMC Products
Test Accessories
ASIC Development
and Foundry Services
Reducing Power
Amplifier Distortion
January 15
(Materials Jan. 21)
March
Capacitors & Inductors
Space & Hi-Rel
Mixers & Modulators
Interconnection
Technology Advances
Military and
Space Specifications
February 15
(Materials Feb. 19)
April
Substrates & Laminates
EDA Tools
Component Test Products
Recent Work on Standards
and Regulations
L-Network Impedance
Matching Basics
March 16
(Materials Mar. 22)
May
Wireless RFICs
Antennas
New Literature
3G/4G Deployment
Status Update
A Comparison of
Switch Technologies
April 16
(Materials Apr. 21)
MTT-S IMS 2010
DAC 2010
June
Cables & Assemblies
EM EDA Tools
Signal Analyzers
Military Market
Review
Getting Started with
EM Simulation
May 17
(Materials May 21)
AP-S/URSI Symposium
July
Oscillators & Synthesizers
Materials
Products for R&D
Electronically-Tunable
Technologies
Digital Signals on
Transmission Lines
June 16
(Materials Jun. 21)
IEEE EMC Symposium
August
ADCs & DACs
Wireless Test Eqpt.
Manufacturing Services
University and Government
R&D Update
Design Issues for
Tower-Top Electronics
July 16
(Materials Jul. 21)
September
Military Products
Filters
Packaging
Signal Integrity
Theory and Practice
Using Coaxial Cable
Correctly
August 16
(Materials Aug. 20)
European Microwave Week
AOC Symposium
October
RFICs/MMICs
Microwave Components
Optical Products
New Ideas for Design
of Very Large Systems
Thermal Design
Considerations
September 16
(Materials Sep. 21)
Int’l Wire & Cable Symposium
November
Switches
Power Amplifiers
New Literature
The Importance of
Vendor Technical Support
Time-Window and
Pulsed Measurements
October 15
(Materials Oct. 21)
December
Resistive Products
Test Instruments
mm-Wave Products
Nano-Scale
Technology Update
Inside the Microwave
Connector
November 16
(Materials Nov. 19)
11th WAMICON
CTIA Wireless
NAB 2010
IEEE RWS 2011
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High Frequency Applications
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High Frequency Products
NEW PRODUCTS
neers performing RF/Microwave
and high-speed digital design and
validation in the wireline, wireless
communications and aerospace/
defense
industries.
Agilent’s
U1818A/B active differential
probes are available with a variety
of probe head options. Additional
probe accessories include extreme
temperature extension cables, an
inline attenuator kit, minimum
loss attenuator pad and probe positioners for the most accurate measurements. Both active differential probes are available now and
are priced at $5,500 and $9,500,
respectively.
Agilent Technologies
www.agilent.com
RF Vector Signal Generator
Keithley Instruments, Inc. announced
that it has upgraded its RF Vector
Signal Generator line for RF engineers with new capabilities that
reduce signal generation times and
enhance signal quality. The Model
2920A, which provides signal generation bandwidth options up to 80 MHz
with a frequency range of either
10 MHz-4 GHz or 10 MHz-6 GHz,
builds on the capabilities of Keithley’s Series 2900 signal generator line. It
expands the Series 2900 line’s applications for testing wireless devices to
today’s high throughput, complex modulation, and wide bandwidth wireless telecom standards, including GSM/EDGE, cdmaOne, cdma2000, WCDMA, HSPA, HSPA+, LTE, WLAN, WiMAX, WiBro, TD-SCDMA, DVB
(Digital Video Broadcast), and GPS (Global Positioning System). The
Model 2920A is optimized for calibrating and testing components such as
amplifiers, filters, and wireless receivers thoroughly over their full range
of performance at exceptional speed. The Model 2920A RF Vector Signal
Generator is priced at $17,850 USD (4 GHz version) or $23,460 USD
(6 GHz version). Orders are being taken now for delivery in six weeks.
Keithley Instruments, Inc.
www.keithley.com
ramps, exponential, and an ISO
7637-2 pulse 2b type transient.
AR/RF Microwave Instrumentation
ar-worldwide.com
New Software Release
ACS has recently released a new
version of its LINC2 filter synthesis software. LINC2 Filter Pro version 1.18 adds new capabilities for
exporting design and analysis data
to other programs. This new version can send filter analysis data,
including frequency response data,
to Excel and other programs for
creating user designed charts and
custom documentation of filter performance. CSV files can be automatically created that capture the
filter’s s-parameters or other performance data (such as group delay
and attenuation characteristics).
Distributed filters implemented in
microstrip and stripline can automatically be rendered in both
schematic and layout windows.
They can be analyzed with the
built-in circuit simulator or automatically exported to Sonnet’s EM
simulation program for precision
electromagnetic
simulation
(Sonnet Lite is included free).
Applied Computational Sciences
www.appliedmicrowave.com
56
High Frequency Electronics
New Tool Helps Build
Custom Pulses
AR’s TGAR is a transient generator test system for performing
transient tests on automotive
parts and components. Now AR
has created the ARTool, which is
used in conjunction with TGAR to
produce nearly any custom battery
pulse, thereby enhancing the flexibility of the TGAR system. The
new custom pulse editing tool
enables a user to build custom
pulses simply by piecing together
individual function segments.
Once the pulse is designed and
saved, the pulse is output to the
device under test (DUT) with a
press of a button. The ARTool has
many useful waveform segments
in its toolbox to select from, including sinusoids, triangles, drop-outs,
positive pulses, rising and falling
Chip Ferrite Beads
Murata Electronics North America
introduced the BLM15AX_SN
series, an advanced ferrite bead
that lowers DC resistance by up to
60 percent compared to previous
models. As part of Murata’s
expanding electromagnetic interference filter (EMIFIL™) line, the
chip ferrite bead was developed
with new ceramic materials and
processing
technologies
that
improve performance and reduce
size in order to provide power and
space savings in portable electronics. The series’ low DC resistance
helps reduce power consumption
for battery-powered applications.
Developed in a compact 0402-size
6.15 DK Laminates for High Frequency Amplifiers
The Advanced Circuit Materials
(ACM) Division of Rogers Corporation
has introduced RO4360™ laminates,
developed for the special requirements
of high-frequency amplifier designers.
RO4360 laminates feature a dielectric
constant of 6.15 and loss of 0.003 at
2.5 GHz. The laminates are based on a
ceramic-filled, thermoset resin system
reinforced by glass fiber for excellent mechanical stability compared to
PTFE woven glass. RO4360 laminates feature low dissipation factor, generous power-handling capability, and improved thermal conductivity.
Environmentally friendly RO4360 laminate materials are RoHS compliant and compatible with standard printed circuit board processing methods. The copper-clad laminates exhibit a high glass transition temperature
(Tg) of greater than 280ºC and a low coefficient of thermal expansion
(CTE) in the z-axis (30 PPM/ºC) needed for reliable plated through holes
(PTHs) in multilayer circuits. RO4360 laminates allow designers to reduce
circuit dimensions in applications where size and cost are critical.
Rogers Corporation
www.rogerscorp.com
RoHS compliant. Mercurywave
9350 is well suited to RF and
Microwave applications such as
broadband
communications,
WiFi/WiMax and RFID, as well as
power amplifier, filter, combiner,
radar and guidance devices.
Park Electrochemical Corp.
www.parkelectro.com
GPS Timing Receiver
package (1.0 × 0.5 × 0.5 mm), it is
ideal for designers seeking to
reduce board space without performance degradation in portable
equipment. The BLM15AX_SN
series is available for 0.016 cents
and lead times are approximately
six to eight weeks.
Murata Electronics North America
www.murata.com
tors, terminations, and other
devices, along with custom components such as high-power dividers,
Butler matrices, and power sensors. The catalog also describes the
company’s expanding family of
fiber optic modulator drivers for
lightwave systems operating up to
100 Gb/s, as well as its RF safety
products. A detailed section also
illustrates Narda’s capabilities in
highly-integrated Ultimate MIC
and Ultimate SMT multifunction
assemblies. The short-form catalog
is available from Narda by visiting
the company’s Web site.
Narda Microwave-East
www.nardamicrowave.com/east
RF and Microwave Materials
New Short-Form Catalog
Narda, an L-3 Communications
company, announced that it has
released its latest short-form catalog, which includes updated
descriptions about all of the company’s RF and microwave products. The 12-page catalog covers
Narda’s broad passive component
family, including couplers, power
dividers and hybrids, PIN-diode
and mechanical switches, attenua-
Park
Electrochemical
Corp.
announced the introduction of
Mercurywave™ 9350, Park’s new
RF and Microwave material product. Mercurywave 9350 is available
globally. Mercurywave 9350, which
has a controlled dielectric constant
of 3.5, is available in both copperclad laminate and prepreg product
forms. Park offers Mercurywave
9350 copperclad laminates in a
wide array of thicknesses, including thin core and industry standard thicknesses of .020 and .030
inches. Mercurywave 9350 is leadfree assembly compatible and
Connor-Winfield’s TiMax Wi125 is
a small OEM surface mount GPS
module specifically designed for
use in synchronization and timing
in WiMax applications. This compact, WiMax compatible module
has an on-board programmable
NCO oscillator that outputs a synthesized frequency up to 30 MHz
that is steered by a GPS receiver.
The self-survey mode of operation
allows the receiver to enter a position hold mode allowing accurate
timing to be continued with only
one satellite being tracked.
Additionally, the TiMax Wi125 has
phase alignment of 1 pps/10 MHz
with a very stable holdover. The 1
pps/10 MHz outputs maintain
phase alignment with holdover
being base only on the local oscillator, dismissing spurious GPS measurements during reacquisition.
When the receiver regains GPS
lock after a period of holdover, the
1 pps and 10 MHz outputs maintain phase alignment and are offset in frequency at the maximum
rate of 100 ppb until the 1 pps
aligns with that of the GPS solution. The Wi125 is an exceptionally
small surface mount package
allowing easy integration into host
systems. Price: $40.00 in volume.
Connor-Winfield Corp.
www.conwin.com
October 2009
57
High Frequency Products
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Sage Laboratories introduces its
newest addition to the IFM / DFD
family
of
products.
The
FDFD7409-4 is a broadband (2-18
GHz) digital frequency discriminator incorporating a pulse detector /
processor. Processing pulse widths
as narrow as 80ns up to CW, the
DFD provides fast and accurate
identification of threats. With
ultra-low power consumption and
small, lightweight packaging, this
cost-effective model adds to Sage’s
line of instantaneous frequency
measurement receivers. This
model is available with an optional
VME interface as well as 50ns
pulse capability.
Sage Laboratories
www.sagelabs.com
Power Dividers and
Directional Couplers
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Krytar announced three new products today to expand its directional
coupler and power divider product
groups. Model 100404010 &
100404020 Directional Couplers:
frequency: 0.4-4.0 GHz; coupling
(with respect to output): 10 ± 0.5
dB, 20 ± 0.8 dB and frequency sensitivity ± 0.5 dB; directivity: >16
dB, >25 dB; Max VSWR (any port):
1.2; insertion loss: <1.1 dB, <0.75
dB; max. power rating (input): 20
W average, 3 kW peak; standard
connectors: SMA female; operating
temp: –54 to +85 deg C. Model
101004006 Directional Coupler:
frequency: 1-4 GHz; coupling (with
respect to output): 6 ±0.5 dB and
frequency sensitivity ±0.5 dB;
directivity: >20 dB; max VSWR
(any port): 1.2; insertion loss: <1.3
dB; max. power rating (input): 20
W average, 3 kW peak; standard
connectors: SMA female; operating
temperature: –54 to +85 deg C.
Model 6020080 Wilkinson 2-Way
Power Divider: frequency: 2-8 GHz;
max VSWR (any port): 1.45; insertion loss: <0.8 dB; isolation: 19.5
dB; amplitude tracking: ±0.25 dB;
phase tracking: ± 5°; standard connectors: SMA female. All delivered
stock to 30 days.
Krytar
www.krytar.com
Switch Chassis
Giga-tronics announced the introduction of Model 8300 and Model
8400 switching chassis’ for its
ASCOR switch products optimized
for integration into automated test
equipment (ATE). The Model 8300
switch chassis and Model 8400
switch chassis are 3U (5.25” high)
rackmountable units with a LAN
and IEEE-488 interface and a
built-in resource manager. The
Model 8300 has four card slots that
will support any of Giga-tronics’
ASCOR line of 3000 Series switch
modules. The Model 8400 has 8
card slots that will support any of
Giga-tronics’ ASCOR line of 4000
Series high-density switch modules. With the Model 8400, switch
modules can be internally interconnected through a 32 singlechannel or 16 differential-channel
analog bus with > 500 MHz bandwidth. This feature allows the creation of large switch systems without the need for external cabling.
The result is a switching solution
with the ultimate signal integrity.
Giga-tronics
www.gigatronics.com
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Resistive Power Splitter
International
Manufacturing
Services, Inc. (IMS) announces the
release of their 3 W four-way resistive power splitter. The IPS2522 is
surface mountable and is suitable
for RF and microwave applications
to 7 GHz. These devices are
designed for solder or epoxy implementation in 50-ohm impedance
environments. The IMS four-way
resistive splitters have 12 dB attenuation each output, with ± 0.7 dB
amplitude balance and a nominal
VSWR of 1.3:1 max. Samples of the
IPS2522 four-way resistive power
splitters can be obtained by visiting
www.ims-resistors.com or contacting the factory.
International Manufacturing
Services, Inc.
www.ims-resistors.com
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help you develop an advertising program that fits today’s
marketing climate. (We understand your budget, too!)
Voltage-Controlled Oscillator
Z-Communications, Inc. announces
a new RoHS compliant VCO in Cband. The V950ME22-LF operates
at 4400-5000 MHz with a tuning
voltage range of 0-9.5 Vdc. This
VCO features a typical phase noise
of –89 dBc/Hz at 10 kHz offset and
a typical tuning sensitivity of 120
MHz/V. It is designed to deliver a
typical output power of 3 dBm at 10
Vdc supply while drawing 25 mA
(typical) over the temperature
range of –40º to 85º C. It comes in ZComm’s standard MINI-14S package measuring 0.5 × 0.5 × 0.22 in. It
is available in tape and reel packaging for production requirements
and is also ideal for automated surface mount assembly and reflow.
Z-Communications, Inc.
www.zcomm.com
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High Frequency Products
NEW PRODUCTS
Ceramic Duplexer
Anatech Electronics introduced
the Model AM1880-1960D268, a
surface-mount monoblock ceramic
duplexer that is designed for use in
base station transceivers serving
wireless communication applications operating in the 1850 to 1960
MHz band. The transmit-to-receive
response of the duplexer includes
insertion loss from 1850 to 1910
MHz of 3.4 dB or less and return
loss of at least 11 dB. Attenuation
ranges from 45 dB from DC to 1000
MHz to 38 dB from 2040 to 2100
MHz. Antenna-to-receiver performance includes insertion loss of 3.7
dB or less from 1930 to 1990 MHz
and attenuation ranging from 51
dB from 1850 to 1910 MHz to 30
dB from 2150 to 2210 MHz.
Rejection in the transmit band is
at least 54 dB and 49 dB in the
receive band. The 50-ohm duplexer
will handle RF input power of 2 W
and measures 4.6 × 23 × 6.5 mm.
Anatech Electronics
www.anatechelectronics.com
Miniature 0.25-Watt Analog
Variable Gain Amplifiers
Avago Technologies announced the
addition of two miniature 0.25watt analog variable gain amplifiers to its broad portfolio of amplifier products for use in cellular
infrastructure
applications.
Housed in a compact 5 × 5 × 1.1
mm, 10-lead module package,
60
High Frequency Electronics
Avago’s ALM-80110/80210 variable gain amplifiers feature a common footprint for easy integration
into most base station designs.
The ALM-80110 operates from 0.4
to 1.6 GHz, while the ALM-80210
operates from 1.6 to 2.7 GHz and
are ideal for use in WLL, WLAN,
transmitter receiver gain control,
and temperature compensation circuitry applications. Both amplifiers provide an exceptionally high
OIP3 level of 40 dBm, which is
maintained over a wide attenuation range. Additionally, these
devices feature a wide gain control
range, low power consumption, as
well as excellent input and output
return
loss.
Avago’s
ALM80110/80210 analog VGAs are
priced at $2.93 each in 10,000 piece
quantities.
Avago Technologies
www.avagotech.com
aged in small drop-in packages ideally suited for high volume manufacturing. These new products
were realized using the in-depth
design and manufacturing knowledge developed with more than 30
years of supplying the military and
commercial industries. Please contact
M/A-COM
Technology
Solutions’ domestic and international sales channels for price and
delivery quotes.
M/A-COM Technology Solutions
www.macomtech.com
New Catalog Showcases
Board-Level Components
Absorptive SPDT Solid State
RF Switch
The ZFSWA2-63DR+ is a great
general purpose SPDT solid state
absorptive RF switch. With its
broad frequency range, fast 35 ns
switching time and excellent RF
performance, the ZFSWA2-63DR+
is an excellent choice for many
applications. In addition to it’s versatility within system block diagrams, the ZFSWA2-63DR+ is
designed for easy integration into
your prototype design applications.
Pricing: $69.95 (QTY 1-9).
Mini-Circuits, Inc.
www.minicircuits.com
Circulators and Isolators
M/A-COM Technology Solutions
Inc. is introducing a family of circulators and isolators for L- and Sband radar and avionics applications. The product family is pack-
Newark, part of the global Premier
Farnell Group, announces that it
has released its new Catalog 127.
New for 2010, the catalog offers
150,000 best-in-class and new
technology electronic products
from 440+ top suppliers, supporting a wide range of board-level,
bench and industrial applications.
More than 20,000 products in the
catalog are new additions or new to
the marketplace. Newark has
made the greatest product expansions in these categories: semiconductors and optoelectronics; passives; electromechanical, industrial controls, power; connectors,
wiring, wire management; and production supplies, tools and test
equipment. Among the 19 new suppliers added to Catalog 127 are
Austria Microsystems (semiconductors), Cree (LEDs), Bridgelux
(LED arrays), NXP (semiconductors), Samtec (connectors) and
Vynckier (enclosures).
Newark
www.newark.com
100 W, Low PIM Loads
Microlab/FXR, a wholly owned
subsidiary of Wireless Telecom
Group, Inc., announces the addition of a new low passive intermodulation, (PIM), 100 W terminations to its line of low PIM products. These terminations have typical PIM performance of <–165
dBc, and are guaranteed <–160
dBc, using two 20W test tones, to
meet the demanding needs of the
wireless market where PIM performance is so critical to optimizing
cellular system operation. The TK27MN (male N connector) and the
TK-27FN (female N connector)
have been designed using mechanically stable connections and
achieve a typical VSWR better
than 1.05:1 across the 700-2700
MHz frequency band, and achieve
better than 1.15:1 down to 380
MHz. These new terminations are
available for immediate evaluation.
Microlab/FXR
www.microlab.fxr.com
4-Port Analysis Solutions
Anritsu Company announces it has
extended the low-end frequency of
its MN469xB VectorStar 4-port
test sets, making the instruments
the first microwave multiport
Vector Network Analyzer (VNA)
solutions to measure down to 70
kHz. The MN469xB series now
combines DC coverage and the
wide dynamic range time domain
capability of a VNA. Two models
are available in the MN469xB
series. The MN4694B covers up to
40 GHz while the MN4697B has a
frequency range up to 70 GHz.
Both include bias tees for active
measurement applications. The
VectorStar multiport solution provides 4-port capability using an
external test set driven by the base
VNA. The MN469xB series test set
has a starting U.S. price of $49,500.
Delivery is 10 weeks ARO.
Anritsu Company
www.us.anritsu.com
dle up to 165 Watts of power at 3
GHz. Radiall's IMP-Spring, SMPSpring and MMBX-Spring are
ideal spring-loaded solutions for
both increased board-to-board distance misalignment tolerances of
up to .078" (2 mm) and a tilt (radial travel) of up to 4.5 degrees. In
addition, these spring-loaded solutions have a consistent low VSWR,
down to 1.15 at 3 GHz, and low RF
leakage.
Radiall USA, Inc.
www.radiall.com
Cable, Radio & Optical
Network Products
Board-to-Board RF Coaxial
Interconnect Solutions
Radiall USA, Inc., introduces its
new extensive range of cost effective board-to-board, module-tomodule and panel-to-panel RF
coaxial interconnect solutions
developed for the telecommunications industry. Radiall offers four
different product groups and ten
connector series including the new
SMP-MAX, SMP-Spring, IMPSpring as well as other misalignment solutions. New SMP-MAX
large misalignment solution has a
patented impedance matching
insulator that is optimized for a
larger operating gap between connectors making it easier for engineers to handle a maximum boardto-board distance tolerance of up to
.078" (2 mm) gap without a spring,
which is 300 percent more than the
standard SMP. It also features a 3
degree tilt (radial travel) and it has
an operating frequency range of
DC-6 GHz, a 1.2 max VSWR guaranteed up to 3 GHz and it can han-
TriQuint
Semiconductor
is
enabling network operators to
more efficiently and economically
meet the growing demand for
broadband services with new solutions for cable systems, microwave
radio and optical networks.
TriQuint devices enable smaller,
more efficient amplifiers, radios
and other key network infrastructure that help operators lower
overall system costs. TriQuint also
helps operators and manufacturers
through an ever-expanding product portfolio of high frequency and
broadband
devices. TriQuint
recently acquired cable TV and
fiber-to-the-home (FTTH) RFIC
expert TriAccess Technologies.
TriAccess offers a “triple-play”
line-up of highly linear amplifiers
with low power consumption for
internet-video-voice services. New
TriQuint RFIC products developed
by TriAccess Technologies specifically meet the requirements of
DOCSIS® 3.0 based cable TV systems. These “greener” products can
reduce power consumption up to
50% and can cut overall PC board
areas up to 30%. The TAT7464,
TAT7466, TAT7467 and TAT7472
provide a complete set of options
for
power-efficient
designs.
October 2009
61
High Frequency Products
NEW PRODUCTS
TriQuint is advancing 3G/4G wireless network infrastructure with
microwave radio backhaul amplifiers including its TGA4531. The
new amplifier does the work of two
narrowband devices, covering the
critical 17-24 GHz frequency range
with a single device. Highly linear,
the TGA4531 enables manufacturers to meet complex modulation
requirements while reducing their
overall bill of materials. For more
information about TriQuint products for optical networks, wireless
handsets, defense, aerospace and
other networks applications, visit
the company Web site.
TriQuint Semiconductor
www.triquint.com
compact 0.582 × 0.8 × 0.15 in. SMD
package. Typical phase noise is –95
dBc/Hz at 10 kHz offset with minimum output power of 3 dBm. VCO
voltage is 5 Vdc; PLL voltage is 3
Vdc. Second harmonic suppression
is –15 dBc typical. The CPLL584240-4240 is ideal for use in
telecommunications, computers,
radio equipment, base stations and
other electronic applications.
Crystek Corporation
www.crystek.com
Frequency Synthesizer
PLL/Synthesizer
Crystek’s
CPLL58-4240-4240
PLL/Synthesizer operates at 4240
MHz with a typical step size of
2500 kHz. Engineered and manufactured in the USA, the model
CPLL58-4240-4240 is housed in a
Personal
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High Function
A compact full featured, modestly priced, manually operated probe
station developed for engineers and scientists.
Measure Microwave, RF and DC parameters of Semiconductor Devices,
Packages and Assemblies with NIST traceability .
• Benchtop Size(<1ft2) • Vacuum chuck • X-Y-Ø stage•
•X-Y-Z probe positioners •Top Plate Z-lift •Vacuum Accessory Manifold•
•6.5X-112.5X Stereo Zoom Microscope • Adjustable Halogen Illuminator •
•Vacuum Accessories • Compatible with 40GHz+ probes•
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62
High Frequency Electronics
EM Research introduces the SLS2100, a frequency synthesizer optimized for telemetry applications
with extremely low phase noise
(<–127 dBc/Hz at 100 kHz, typical). The serially programmable
synthesizer performs over the frequency range of 1900-2100 MHz
with a step size of 100 kHz and fast
switching speed (750 µs), and can
be custom-designed to operate,
fixed or programmable, at any Lor S-band frequency. The unit features an optional internal reference, operating temperature range
of –30°C to +70°C, output power of
+8 dBm, low spurs (<–95 dBc) and
operates on a supply voltage of
+12V at 155 mA, typ. The SLS2100 is designed to improve interoperability of telemetry applications and is housed in a ruggedized, aluminum package of 1.5" ×
1.5" × 0.6", with female SMA connectors. The SLS synthesizer is
ideal for use in satcom receivers,
test and measurement solutions.
EM Research
www.emresearch.com
Easy Access to Model Libraries
AWR Corporation and Modelithics,
Inc., announced that a one-click
option enabled on the AWR Web site
for trial evaluation requests for
AWR’s Microwave Office® software
now also includes Modelithics’ highly accurate active and passive
model libraries. This cooperative
partnering gives microwave designers the opportunity to use
Modelithics’ active and passive simulation models on a trial basis and
see how they can impact their
designs from within AWR’s
Microwave Office design environment. The Modelithics libraries are
available for a growing number of
components and ICs from various
manufacturers, ranging from passive components to non-linear diode
and transistor models, and shortly,
system-level components. Trial versions of Microwave Office software
and the Modelithics’ library are
available on AWR’s web site.
AWR Corporation
www.awrcorp.com/download
Modelithics, Inc.
www.modelithics.com
Bias-Tee/Diplexer Satellite
Power Inserter
The ZABT-2R15G+ is a combination
bias tee and diplexer designed
specifically for satellite communications and wireless infrastructure
applications. The ZABT-2R15G combines solid Mini-Circuits bias tee
performance with additional functionality to inject 10 MHz reference
clock without additional components. Built in a rugged shielded
case, the ZABT-2R15G+ is equipped
with SMA connectors for the LBand ports and BNC connectors for
DC and 10 MHz.The ZABT-2R15G+
is ideally suited for powering
Satellite upconverters and LNBs
where IF, DC and 10 MHz clock reference are all injected on a single
coax cable. Pricing: $44.95 (qty. 10).
Mini-Circuits, Inc.
www.minicircuits.com
Advertiser Index
Company.......................................................................Page
Company.......................................................................Page
ACS ......................................................................................33
Agilent Technologies ...........................................................17
Anaren .................................................................................13
Anatech Microwave Company ............................................37
AWR .....................................................................................21
Besser Associates ................................................................55
C.W. Swift & Associates .............................................Cover 2
Dielectric Laboratories .......................................................15
Dynawave ............................................................................11
Emerson Network Power ......................................................4
IW Microwave......................................................................27
J microTechnology...............................................................32
J microTechnology...............................................................62
M/A-COM Technology Solutions................................Cover 3
Micro Lambda Wireless ......................................................19
Microwave Components ......................................................51
Mini-Circuits ......................................................................2-3
Mini-Circuits .......................................................................25
Mini-Circuits .......................................................................29
Mini-Circuits .......................................................................35
Mini-Circuits ..................................................................38-39
Mini-Circuits .......................................................................45
Mini-Circuits .......................................................................49
Mini-Circuits .......................................................................53
MITEQ ...................................................................................1
MITEQ .................................................................................41
MITEQ ........................................................................Cover 4
Radiall..................................................................................42
Renaissance Electronics .....................................................42
Sage Laboratories ...............................................................30
Samtec ...................................................................................9
SGMC Microwave................................................................46
SV Microwave......................................................................23
Teledyne Cougar....................................................................7
Tru Corporation ..................................................................31
T-Tech...................................................................................43
■ FIND OUR ADVERTISERS’ WEB SITES
USING
HFELINK™
1. Go to our company information Web site: www.HFeLink.com
(from www.highfrequencyelectronics.com, just click on the HFeLink reminder on home page)
2. Companies in our current issue are listed, or you can choose one of our recent issues
3. Find the company you want to know more about ... and just click!
4. The Web site of each company you choose will open in a new browser window
■ OR... YOU CAN BROWSE THROUGH OUR ONLINE EDITION
■ ADVERTISERS — REACH
OUR
ACTIVE
AND INTERESTED
AND
SIMPLY CLICK
ON THEIR
AD!
READERSHIP
Contact one of our advertising professionals today:
ADVERTISING SALES — EAST COAST
ADVERTISING SALES — WEST
Gary Rhodes
Tim Burkhard
Tel: 631-274-9530
Fax: 631-667-2871
E-mail: grhodes@highfrequencyelectronics.com
Tel: 707-544-9977
Fax: 707-544-9375
E-mail: tim@highfrequencyelectronics.com
ADVERTISING SALES — CENTRAL
PUBLISHER — OTHER REGIONS & INTERNATIONAL
Keith Neighbour
Scott Spencer
Tel: 773-275-4020
Fax: 773-275-3438
E-mail: keith@highfrequencyelectronics.com
Tel: 603-472-8261
Fax: 603-471-0716
E-mail: scott@highfrequencyelectronics.com
Advertising and media information is available online at www.highfrequencyelectronics.com
October 2009
63
DESIGN NOTES
Applying Engineering Knowledge
to Everyday Life
Most engineers get questions from family and
friends about technology—how it works, which one
works best, is it really as good as they say, etc. Often,
our technical knowledge provides useful information
that is greatly appreciated. Most of us have been asked
questions about digital TV transition, cell phone coverage problems and cable or satellite TV trouble. We
hear about about computer and Internet problems,
too—even if we are RF/microwave engineers.
Here is one example currently in the news: the savings achieved with compact fluorescent lamps (CFLs)
and LED lighting instead of incandescent bulbs. There
are a number of different light bulb sizes, and equivalent CFL or LED products, but for this exercise, let’s
compare a 60 watt incandescent bulb, a 15 watt CFL
and an 8 watt LED light.
There are many published cost comparison tables,
so we did our own calculation using an average of various published values for device cost, operating lifetime and electricity cost. The bottom line is:
Lifetime Cost (per 1000 hours)
Incandescent
——————
$4.25
CFL
—–—
$0.70
LED
—–—
$0.76
The comparison shows a strong benefit for both
CFL and LED technologies. LEDs are quite new and
have not yet experienced much of the price reduction
that comes from mass production. Assuming that LED
cost will be lower in the future, it appears to be the
eventual “winner” of this comparison.
There is More to the Story...
Let’s make another comparison, one that is rarely
seen in the general media—the effect of reduced heat
output, which is the real difference between incandescent lighting and the alternatives of CFLs and LEDs.
We’ll do two estimates, one for northern U.S. climate and one for southern U.S., since the heating and
air conditioning needs are quite different. These two
examples are sufficient to make a general comparison.
The premise is that the excess heat of lighting contributes to the heating, and must be replaced by other
energy sources. During cooling, the excess heat is an
additional load on air conditioning and adds to power
consumption.
To simplify comparison, we’ll assume that the cost
of other heat sources is the same as electricity, and
that air conditioning, as a more efficient heat pump
64
High Frequency Electronics
technology, costs about half as much per watt. We’ll
also assume that 100% of the electricity consumed by
the incandescent lamp is released as heat, either
directly or when the light is absorbed.
Here are the usage assumptions:
· Northern U.S.: 6 months heating, 2 months cooling
· Southern U.S.: 4 months heating, 4 months cooling
(other times equal heating/cooling, or neither)
· Lighting used 8 hours/day during heating season
· Lighting used 4 hours/day during cooling season
In the northern, U.S., 66.6% of the lighting’s heat
must be replaced by other sources:
[6 mo × 8 hr] – [2 mo × 4 hr × 2 A/C eff]
= 0.667
[6 mo × 8 hr] + [2 mo × 4 hr × 2 A/C eff]
Using the numbers for the southern U.S., the factor is
zero, an equal balance between replacement during
heating, and removal during cooling. Thus, our first
conclusion is that published comparisons of lighting
costs are valid for this climate.
Although simplified, our calculation illustrates
that the advantage to alternative lighting is less in
areas where heating dominates cooling. Using our
result for the northern U.S., two-thirds of the energy
saved in lighting must be replaced during heating season. Thus, alternative lighting still has a cost advantage, but it is closer to 4:1 rather than the nearly 6:1
ratio of our lifetime cost comparison.
Lighting Quality: A Major Subjective Factor
Incandescent lighting looks best to nearly everyone
because it is similar to sunlight—a wide range of
wavelengths with a broad peak in the yellow.
The mercury vapor in CFLs creates a “blue” light
that must be converted by secondary phospors, which
are not yet able to match incandescents. In addition,
poor cold weather performance and a slow warm-up
time are considered negative attributes. CFLs’ mercury content is major environmental concern as well.
LEDs are different in that they emit light in narrow wavelength bands. Various combinations of
devices at different wavelengths can mimic typical
“warm” to “cool” color temperatures, but the result is
still considered unnatural by most people. Also, LED
emission is in narrow beams, so their most common
use is in spotlights until better methods are developed
to provide more diffuse radiation.
Fortunately, development efforts to address the
spectral and directional shortcomings of CFLs and
LEDs are making good progress.
Delivering performance and value...
in a wider range of standard platforms
M/A-COM Technology Solutions’ Isolator & Circulator
devices are the smart choice for commercial Infrastructure
applications requiring either surface mount or drop-in
configurations.
• Low insertion loss, high Isolation and low
intermodulation distortion
• Clockwise and counter-clockwise orientation
• Operational across a wide temperature range up to 125°C
• Beryllium oxide(BeO)-free and Neodymium(Nd)-free
• Available in a variety of robust, high reliability platforms
including machined and stamped housing formats
For details, contact your local M/A-COM Technology Solutions
sales office or visit www.macomtech.com
M/A-COM Technology Solutions Inc.
Lowell, Massachusetts 01851
North America 800.366.2266 • Europe +353.21.244.6400
India +91.80.43537383 • China +86.21.2407.1588
www.macomtech.com
Get info at www.HFeLink.com
Frequency
(MHz)
IL
Isol
IMD Application
(dB)
(dB)
(dBc)
869-894
925-960
1850-1910
1805-1880
0.15
0.15
0.2
0.2
23
23
25
25
-80
-80
-80
-80
GSM
GSM
GSM
GSM
728-768
1475.9-1500.9
2605-2705
0.3
0.2
0.15
23
23
25
-70
-80
-75
LTE
LTE
LTE
2010-2025
0.15
25
-75
TD-SCDMA
2110-2170
0.15
25
-75
WCDMA
2500-2700
3400-3600
0.15
0.15
25
25
-75
-75
WiMAX
WiMAX
Single Junction Ferrite performance table
medium power
SSPA
solid state power amplifier and transmitter
available in
C-, X-, and Ku-Bands
power levels up to 100W
earth stations
news gathering
flyaway terminals
VSAT network hubs
The New MITEQ Solid State Power Amplifier (SSPA) Systems
features include
are designed for satellite uplink applications. Designed using a
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modular approach to provide quick and flexible solutions to meet
a variety of applications.
SSPA systems incorporate amplifier modules engineered using
state-of-the-art GaAs FET technology, high efficiency power supply
and a microprocessor-based monitor and control system.
The systems provide for over-temperature, over-current and high
output VSWR safety protection.
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For additional information, please contact MITEQ’s SATCOM Sales Team at (631) 439-9108.
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7(/)$;‡'DYLGV'ULYH+DXSSDXJH1<
Get info at www.HFeLink.com