High Frequency, High Current Miniature Power Inductors MPI4040 Series HALOGEN HF Pb FREE Applications • • • • • • • • • • SMD Device Handheld/mobile devices Portable media players GPS/PDAs MP3 Players Battery operated devices Notebook/netbook Tablets/smartbooks LCD Displays LED Drivers POL Converters Environmental Data Description • • • • • • • • • • Storage temperature range: -40°C to +125 °C • Operating temperature range: -40°C to +125°C (Range is application specific) • Solder reflow temperature: J-STD-020D compliant Halogen free 125°C maximum total temperature operation 4.7x4.31x1.2, 1.5mm maximum surface mount package Magnetically shielded Handles high transient inrush current spikes Inductance range from 0.09μH to 4.7μH Current range from 0.78A to 32.0A Frequency range 20kHz to 10MHz RoHS compliant Packaging • Supplied in tape and reel packaging: - MPI4040R1= 5500 parts per 13” diameter reel - MPI4040R2= 4500 parts per13” diameter reel Product Specifications Part Number5 OCL1 ± 15% (μH) Part Marking Designator MPI4040R1-R10-R MPI4040R1-R15-R MPI4040R1-R22-R MPI4040R1-R33-R MPI4040R1-R47-R MPI4040R1-R68-R 0.09 0.15 0.23 0.33 0.47 0.68 A B C D E F MPI4040R2-R47-R MPI4040R2-1R0-R MPI4040R2-1R5-R MPI4040R2-2R2-R MPI4040R2-3R3-R MPI4040R2-4R7-R 0.47 1.0 1.5 2.2 3.3 4.7 G H I J K L Irms2 (Amps) R1 Version 7.40 6.50 5.10 4.08 3.75 3.10 R2 Version 4.30 3.80 2.75 2.30 1.96 1.60 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end use application. 3 Isat: Peak current for approximately 30% rolloff at +25°C. 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p : (Gauss), 0310 BU-SB10213 Page 1 of 6 Isat3 (Amps) DCR (mΩ) @ 20°C ± 15% K-factor4 32† 26† 21 17 11 9.0 8.5 11.0 18.0 28.0 35.0 51.0 2372 1694 1318 1130 912 790 13 2.25 1.80 1.50 1.25 1.10 28.0 38.0 60.0 82.0 113 175 912 760 600 506 430 368 K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 5 Part Number Definition: MPI4040RX-xxx-R • MPI4040Rx = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then 3rd digit equals number of zeros. • “-R” suffix = RoHS compliant † Transient pulse not to exceed 1 millisecond. Data Sheet: 4086 Dimensions - mm T o p V ie w B o tto m V ie w 2 .0 + 0 .2 , -0 .1 S id e V ie w 4 .0 6 ± 0 .2 5 A R e co m m e n d e d P a d L a yo u t S ch e m a tic 1 .3 ± 0 .1 1 1 xyz 1 1 .8 5 + /-0 .1 4 .4 5 ± 0 .2 5 4 .9 5 1 .6 5 2 2 2 A D im ension M P I4 0 4 0 R 1 M P I4 0 4 0 R 2 2 .3 1 .2 m m m a x 1 .5 m m m a x P a rt m a rkin g : x= In d u cta n ce a n d size p e r p a rt m a rkin g d e sig n a to r ta b le , y= Y e a r o f m a n u fa ctu re (i.e . A = 2 0 0 9 , B = 2 0 1 0 e tc.), z= R e visio n L e ve l S o ld e rin g su rfa ce s to b e co p la n a r w ith in 0 .1 0 1 6 m illim e te rs Packaging Information - mm 1.75 1.5 dia 4.0 2.0 1 12.0 ±0.30 xyz 5.5 1.5 dia. 4.8 2 Supplied in tape and reel packaging: - MPI4040R1= 5500 parts per 13” diameter reel - MPI4040R2= 4500 parts per13” diameter reel 8.0 SECTION A-A 4.45 User Direction of feed 0310 BU-SB10213 MPI4040R1= 1.30 MPI4040R2=1.60 Page 2 of 6 Data Sheet: 4086 Temperature Rise vs.Total Loss 70 R2 60 Temperature Rise (°C) R1 50 40 30 20 10 0 0 0 .1 0 .2 0 .3 0 .4 0 .5 0 .6 0 .7 0 .8 0 .9 Total Loss (W) Core Loss Core Loss vs. B p-p 1 Core Loss (W) 0.1 0 .01 0.001 0.0001 0.00001 100 1MHz 500KHz 300KHz 200KHz 100KHz 1 000 10000 Bp-p (Gauss) 0310 BU-SB10213 Page 3 of 6 Data Sheet: 4086 Inductance Characteristics - % of OCL vs. IDC MPI4040R1-R15-R MPI4040R1-R10-R 110 110 100 100 90 % of OCL % of OCL 90 80 70 60 80 70 60 50 50 40 40 0 4 8 12 16 20 24 28 32 36 0 4 8 12 20 24 28 MPI4040R1-R33-R MPI4040R1-R22-R 110 110 100 100 90 90 % of OCL % of OCL 16 IDC (Amps) IDC (Amps) 80 70 80 70 60 60 50 50 40 40 0 4 8 12 16 20 0 24 2 4 6 8 10 12 14 16 18 20 IDC (Amps) IDC (Amps) MPI4040R1-R47-R MPI4040R1-R68-R 105 105 100 100 95 90 % of OCL % of OCL 95 85 80 90 85 75 80 70 75 65 60 70 0 2 4 6 8 10 12 14 0 BU-SB10213 4 6 IDC (Amps) IDC (Amps) 0310 2 Page 4 of 6 Data Sheet: 4086 8 10 12 Inductance Characteristics - % of OCL vs. IDC MPI4040R2-R47-R MPI4040R2-1R0-R 105 110 100 100 90 % of OCL % of OCL 95 90 85 80 70 60 50 80 40 75 30 70 20 0 2 4 6 8 10 12 14 16 18 0 0.5 1 1.5 110 100 100 90 90 80 80 70 60 3 3.5 70 60 50 50 40 40 30 30 20 20 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 2 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 IDC (Amps) IDC (Amps) MPI4040R2-4R7-R MPI4040R2-3R3-R 110 110 100 100 90 90 80 80 % of OCL % of OCL 2.5 MPI4040R2-2R2-R 110 % of OCL % of OCL MPI4040R2-1R5-R 70 60 70 60 50 50 40 40 30 30 20 20 0 0.15 0.3 0.45 0.6 0.75 0.9 1.05 1.2 1.35 1.5 0 0.2 IDC (Amps) 0310 2 IDC (Amps) IDC (Amps) BU-SB10213 0.4 0.6 IDC (Amps) Page 5 of 6 Data Sheet: 4086 0.8 1 1.2 1.4 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T c) TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts 25°C Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2010 Cooper Bussmann S t . L o u i s, M O 6 3 1 7 8 w w w. c o o p e r bu s s m a n n . c o m 0310 BU-SB10213 Page 6 of 6 Data Sheet: 4086