Product Specification
PE95421
Radiation Tolerant UltraCMOS® SPDT
RF Switch Hermetically Sealed Ceramic
Package, 1–8500 MHz
Product Description
The PE95421 is an RF SPDT switch available in a
hermetically sealed ceramic package and also available
in die. It covers a broad range of applications from 1 to
8500 MHz and has been designed for use in various
high reliability (Hi-Rel) industries and applications
requiring broadband performance. The PE95421 uses
Peregrine’s UltraCMOS® process and features HaRP™
technology enhancements to deliver high linearity and
exceptional harmonics performance. HaRP technology
is an innovative feature of the UltraCMOS process
providing upgraded linearity performance.
Features
The PE95421 is an absorptive/non-reflective switch
design which is an ideal termination method for RF
elements in a system design. A single-pin 3.3V CMOS
logic control in a single chip solution reduces the
number of control lines.
 High isolation (RF1–RF2)
 HaRP™ technology enhanced


Eliminates gate and phase lag
No insertion loss or phase drift
 High linearity: 60 dBm IIP3
 Low insertion loss








0.77 dB @ 100 MHz
1.00 dB @ 3000 MHz
1.15 dB @ 6000 MHz
1.38 dB @ 8500 MHz
86.5 dB @ 100 MHz
48.2 dB @ 3000 MHz
36.6 dB @ 6000 MHz
27.8 dB @ 8500 MHz
 Fast switching time
Typical Industries
 Medical
 Automotive
 Telecom infrastructure
 Test instrumentation
 Down-hole oil/gas
 Military
 Space applications








700 ns RF ON
700 ns RF OFF
Low power consumption: 3.3 µW @ 3.3V
1dB compression point of +33 dBm
Single-pin 3.3V CMOS logic control
ESD tolerant to 1000V HBM
Absorptive/non-reflective
Offered in a 7-lead hermetic CQFP
surface-mount package and in DIE form
Figure 1. Functional Diagram
RFC
RF1
ESD
50
ESD
CMOS Control
Driver
RF2
Figure 2. Package Type
7-lead CQFP
50
71-0041
VDD LS CTRL VSS
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Page 1 of 12
PE95421
Product Specification
Table 1. Electrical Specifications @ –40 °C ≤ T ≤ +85 °C, 3.0V ≤ VDD ≤ 3.6V and –3.0V ≤ VSS ≤ –3.6V
Parameter
Condition
Operational frequency
Min
1
Insertion loss
Isolation – RFC to RF1
3000 MHz
1
1.28
dB
6000 MHz
1.15
1.42
dB
1.38
1.72
dB
100 MHz
74
75.6
dB
3000 MHz
46
47.4
dB
43.8
48
dB
Input IP3
Switching time
Notes:
2
31
38
dB
100 MHz
73.7
75.4
dB
3000 MHz
46.8
48.3
dB
45
52.1
dB
31
38
dB
100 MHz
86.5
dB
3000 MHz
48.2
dB
6000 MHz
36.6
dB
8500 MHz
27.8
dB
100 MHz
21
dB
3000 MHz
33
dB
6000 MHz
20
dB
8500 MHz
15
dB
100 MHz
20
dB
3000 MHz
18
dB
6000 MHz
15
dB
8500 MHz
8
dB
100–8500 MHz
33
dBm
100–8500 MHz, 18 dBm input power/tone
60
dBm
50% CTRL to 90% of final value when RF ON
700
ns
50% CTRL to 10% of final value when RF OFF
700
ns
8500 MHz
Return loss active port – OFF state
1
MHz
dB
6000 MHz
Return loss active port – ON state
8500
0.95
8500 MHz
Isolation – RF1 to RF2
Unit
0.77
6000 MHz
Isolation – RFC to RF2
Max
100 MHz
8500 MHz
Input 1dB compression
Typ
2
1. Please note maximum operating PIN (50Ω) of +24 dBm in Table 4.
2. Guaranteed but not tested.
©2015 Peregrine Semiconductor Corp. All rights reserved.
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Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions
PE95421
Product Specification
Figure 3. Pin Layout (Top View)
Table 3. Operating Ranges
RFC
Pin 1
Symbol
Parameter/Condition
Min
Typ
Max
Unit
VDD
Positive supply voltage
3.0
3.3
3.6
V
VSS
Negative supply voltage
–3.6
–3.3
–3.0
V
IDD
Supply current
(VDD = 3.3V, LS or
CTRL = 3.3V)
1
μA
ISS
Supply current
(VSS = –3.3V)
1
μA
exposed solder pad
RF1
Pin 2
Pin 7
RF2
Control voltage high
V
0.7xVDD
0.3xVDD
V
+85
°C
24
dBm
Min
Max
Unit
Control voltage low
TOP
Pin 3
VDD
4
5
6
LS CTRL VSS
1
Pin Name
RF power in (50Ω):
1 MHz ≤ 8.5 GHz
Description
Symbol
Parameter/Condition
1
RF common
VDD
Positive supply voltage
–0.3
4.0
V
1
RF port
VSS
Negative supply voltage
–4.0
0.3
V
VC1
Voltage on LS input
–0.3
VDD+0.3
V
VC2
Voltage on CTRL input
–0.3
VDD+0.3
V
PIN
RF input power (50Ω)
1 MHz ≤ 8.5 GHz
27
dBm
ΘJC
Theta JC
24
°C/W
TST
Storage temperature range
+150
°C
VESD
ESD voltage HBM*, all pins
1000
V
RFC
2
RF1
3
VDD
Supply voltage (nominal 3.3V)
4
LS
Selects the RF1 to RFC path or RF2 to RFC
(See Table 6)
5
CTRL
Unused (See Table 6)
Negative power supply. Apply nominal – 3.3V
supply
6
VSS
7
RF21
RF port
Pad
GND2
Exposed pad: Grounded for proper operation
Notes:
–40
Table 4. Absolute Maximum Ratings
Table 2. Pin Descriptions
Pin #
PIN
Operating temperature
range
1. All RF pins must be DC blocked with an external series capacitor or
held at 0 VDC.
2. Must be soldered to PCB RF ground for proper operation.
–65
Note: * Human Body Model (MIL-STD-883 Method 3015)
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be
restricted to the limits in the Operating Ranges
table. Operation between operating range
maximum and absolute maximum for extended
periods may reduce reliability.
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Page 3 of 12
PE95421
Product Specification
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS device, observe the
same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rate specified.
Latch-Up Immunity
Table 6. Post Radiation Table
Total Dose
Post 100 kRad
LS
CTRL
RFC–RF1
RFC–RF2
Logic State
0
X
off
on
RF2 active
1
X
on
off
RF1 active
©2015 Peregrine Semiconductor Corp. All rights reserved.
Page 4 of 12
Min
Max
Unit
10
µA
IDD Positive supply current
ISS Negative supply current
–10
µA
Table 7. Single Event Effects
SEE Mode
Effective linear energy transfer (LET)
SEL/SEB/SEGR
90 MeVmg/cm2
SEFI
90 MeVmg/cm2
SEU
90 MeVmg/cm2
SET
90 MeVmg/cm2
Unlike conventional CMOS devices, UltraCMOS
devices are immune to latch-up.
Table 5. Truth Table
Parameter
SEL, SEB, SEGR, SEFI, SEU: None observed, Au/60 degrees.
SET: No events exceeding ±10 mV transient observed.
ELDRS
UltraCMOS devices do not include bipolar minority
carrier elements and; therefore, do not exhibit
enhanced low-dose-rate sensitivity.
Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions
PE95421
Product Specification
Typical Performance Data
Figure 4. Insertion Loss: RF1 @ VDD = –VSS = 3.3V
Figure 5. Insertion Loss: RF1 @ 25 °C
Figure 6. Insertion Loss: RF2 @ VDD = –VSS = 3.3V
Figure 7. Insertion Loss: RF2 @ 25 °C
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Page 5 of 12
PE95421
Product Specification
Typical Performance Data (continued)
Figure 8. Isolation: RF1–RF2, RF1 Active
@ VDD = –VSS = 3.3V
Figure 9. Isolation: RF2–RF1, RF2 Active
@ VDD = –VSS = 3.3V
Figure 10. Isolation: RF1–RF2, RF1 Active
@ 25 °C
Figure 11. Isolation: RF2–RF1, RF2 Active
@ 25 °C
Figure 12. Isolation: RFC–RF1, RF2 Active
@ VDD = –VSS = 3.3V
Figure 13. Isolation: RFC–RF2, RF1 Active
@ VDD = –VSS = 3.3V
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Page 6 of 12
Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions
PE95421
Product Specification
Typical Performance Data (continued)
Figure 14. Isolation: RFC–RF1, RF2 Active
@ 25 °C
Figure 15. Isolation: RFC–RF2, RF1 Active
@ 25 °C
Figure 16. Isolation: RFC–RF1, OFF state
@ VDD = –VSS = 3.3V
Figure 17. Isolation: RFC–RF2, OFF state
@ VDD = –VSS = 3.3V
Figure 18. Isolation: RFC–RF1, OFF state
@ 25 °C
Figure 19. Isolation: RFC–RF2, OFF state
@ 25 °C
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PE95421
Product Specification
Typical Performance Data (continued)
Figure 20. Return Loss: RF1 @ VDD = –VSS = 3.3V
Figure 21. Return Loss: RF2 @ VDD = –VSS = 3.3V
Figure 22. Return Loss: RF1 @ 25 °C
Figure 23. Return Loss: RF2 @ 25 °C
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Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions
PE95421
Product Specification
Evaluation Board
Figure 24. Evaluation Board Layout
The SPDT switch EK Board was designed to
ease customer evaluation of Peregrine’s
PE95421. The RF common port is connected
through a 50Ω transmission line via the top SMA
connector, J1. RF1 and RF2 are connected
through 50Ω transmission lines via SMA
connectors J2 and J3, respectively. A through
50Ω transmission is available via SMA
connectors J5 and J6. This transmission line can
be used to estimate the loss of the PCB over the
environmental conditions being evaluated.
The evaluation kit board is constructed of four
metal layers. The dual clad top RF layer is
Rogers RO4003 material with an 8 mil RF core
and r = 3.55. The other two dielectric layers are
FR4 for DC control and overall board strength
with an cumulative board thickness of 62 mils.
The RF transmission lines were designed using a
Grounded co-planar waveguide with a linewidth
of 15 mils and gap of 7 mils.
PRT-51554
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PE95421
Product Specification
1
2
RFC 1
RFC
J1
142 -0761 -881 /891
Figure 25. Evaluation Kit Schematic
U1
RF1
2 RF1
RF2 7
PE9542 1
1
6 VSS
5 CTRL
4 LS
3 VDD
RF2
THERMAL SLUG
GND 8
2
1
J3
142 -0761 -881 /891
2
J2
142 -0761 -881 /891
9 SOCKETMOUNTINGHOLE
10 SOCKETMOUNTINGHOLE
11 SOCKETMOUNTINGHOLE
12 SOCKETMOUNTINGHOLE
J4
HEADER14
1
3
5
7
9
11
13
1
3
5
7
9
11
13
VSS
CTRL
VDD
LS
VDD
J5
142 -0761 -881 /891
1
R1
DNI
C4
22pF
C3
22pF
C2
22pF
C1
22pF
J6
142 -0761 -881 /891
ThroughLine
1
2
2
4
6
8
10
12
14
2
2
4
6
8
10
12
14
DOC-28927
Notes: 1. Use PRT-51554 PCB.
2. Caution: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD).
3. All transmission lines are 15 mil width, 7 mil gaps, 8 mil core dielectric.
NOTES:
1. USE 101-0811 -01 PCB.
2. CAUTION:
CONTAINS PARTS AND ASSEMBLIES SUSCEPTIBLE
TO DAMAGE BY ELECTROSTATIC DISCHARGE (ESD)
3. ALL TRANSMISION LINES ARE:
15MIL WIDTH, 7MIL GAPS, 8MIL CORE DIELECTRIC
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Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions
PE95421
Product Specification
Figure 26. Package Drawing
7-lead CQFP
4.699±0.127
0.572±0.127
5.461±0.127
3.556
2
2
3
3
1.143 (x3)
6.604±0.127
4.826
1
3.429
1
11.790±0.178
5.842±0.127
0.381±0.050
(x7)
6
6
7
7
.381 R
(x4)
0.572±0.127
10.647±0.178
0.254
(x7)
Bottom View
10.647±0.178
Top View
0.307
0.614
0.127
1.450
1.143 0.762
100°±20°
0.381
1.386
0.901
Side View
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DOC-50612
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Page 11 of 12
PE95421
Product Specification
Figure 27. Top Marking Specification
= Pin 1 indicator
95421-XX = Part number (XX will be specified by the
PO and/or the assembly instructions)
YYWW = Date code, last two digits of the year
and work week
XXXXX = Lot code (up to seven digits)
ZZZZ = Serial number (up to six digits)
PRT-24929
Table 8. Ordering Information
Order Code
Description
Package
Shipping Method
95421-01*
Engineering samples
7-lead CQFP
18 Units / tray
95421-99
Flight die
Die
400 Units / waffle pack
95421-00
Evaluation kit
Evaluation board
1 / Box
Note: * The PE95421-01 devices are ES (engineering sample) prototype units intended for use as initial evaluation units for customers of the PE95421-11 flight units. The
PE95421-01 device provides the same functionality and footprint as the PE95421-11 space qualified device, and intended for engineering evaluation only. They are
tested at +25 °C only and processed to a non-compliant flow (e.g. No burn-in, non-hermetic, etc). These units are non-hermetic and are not suitable for
qualification, production, radiation testing or flight use.
Sales Contact and Information
Cont act Information:
e 2v ~ ht t p: // w w w . e 2 v -us .c o m ~ i n q ui ri es @ e 2 v -us .c o m
Advance Inf ormat ion: Th e p ro d u c t i s i n a f o rm a ti v e o r d e si g n st a g e . Th e d at a s h e et c o n t ai ns d e si g n t a rg et
sp e cifi c ati o n s f o r p ro d uc t d ev el o p m e n t . S p eci fic a ti o ns a n d f e at u re s m a y c h a n g e i n a n y m a n n e r w it h o u t n oti c e.
Preliminary Specif ication: Th e d at a s h e et c o n tai n s p reli m i n a ry d a t a. A d di ti o n al d at a m a y b e a d d e d at a l at e r
d at e . P e re g ri n e re s e rv e s t h e ri g h t t o c h a n g e s p e cifi c ati o n s a t a ny ti m e w it h o u t n o tic e i n o rd e r t o s u p ply t h e b e st
p os si bl e p ro d uc t. Product Specificat ion: Th e d a t as h e et c o nt ai n s fi n al d at a . I n t h e e v e nt P e re g ri n e d eci d e s t o
ch a n g e t h e s p eci fic a ti o ns , P e re g ri n e w ill n o tif y c us t o m e rs of t h e i nt e n d e d c h a n g e s by is s ui n g a C N F (C u s t o m e r
N o tifi c ati o n Fo rm ).
©2015 Peregrine Semiconductor Corp. All rights reserved.
Page 12 of 12
Th e i n f o rm a ti o n i n t his d a t as h e e t is b eli ev e d t o b e reli a ble . H o w e v e r, P e re g ri n e a ss u m e s n o li a bili ty f o r t h e us e
of t hi s i n f o rm a ti o n. U s e s h all b e e nti rel y a t t h e u s e r’s o w n ris k.
N o p at e n t ri g h ts o r li c e ns e s t o a n y ci rc ui ts d es c ri b e d i n t hi s d a t as h e e t a re i m pli e d o r g ra n t e d t o a n y t hi rd p a rty .
P e re g ri n e’s p ro d uc ts a re n o t d esi g n e d o r i nt e n d e d f o r us e i n d evi c es o r sy st e m s i n t e n d e d f o r s u rgi c al i m pl a n t,
o r i n o t h e r a p pli c ati o n s i nt e n d e d t o s u p p o rt o r s u st ai n li f e, o r i n a n y a p plic a ti o n i n w h ic h t h e f ail u re of t h e
P e re g ri n e p ro d uc t c o ul d c re a t e a si t u ati o n i n w hi c h p e rs o n al i nj u ry o r d e at h mi g h t oc c u r. P e re g ri n e a ss u m e s n o
lia bilit y f o r d a m a g e s, i n cl u di n g c o ns e q u e n ti al o r i nci d e n tal d a m a g e s , a risi n g o ut o f t h e us e of i ts p ro d uc ts i n
su c h a p pli c ati o n s.
Th e P e re g ri n e n a m e , l o g o , Ul t ra C M OS a n d U TS i a re re gis t e re d t ra d e m a rks a n d H a R P , M u l ti S wi tc h a n d D u N E
a re t ra d e m a rks o f P e re g ri n e S e m ic o n d u ct o r C o rp. P e re g ri n e p ro d uc ts a re p rot e ct e d u n d e r o n e o r m o re of t h e
foll o w i n g U . S . P a t e nt s: h tt p :/ / p at e n ts . ps e m i. c o m .
Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions