Product Specification PE95421 Radiation Tolerant UltraCMOS® SPDT RF Switch Hermetically Sealed Ceramic Package, 1–8500 MHz Product Description The PE95421 is an RF SPDT switch available in a hermetically sealed ceramic package and also available in die. It covers a broad range of applications from 1 to 8500 MHz and has been designed for use in various high reliability (Hi-Rel) industries and applications requiring broadband performance. The PE95421 uses Peregrine’s UltraCMOS® process and features HaRP™ technology enhancements to deliver high linearity and exceptional harmonics performance. HaRP technology is an innovative feature of the UltraCMOS process providing upgraded linearity performance. Features The PE95421 is an absorptive/non-reflective switch design which is an ideal termination method for RF elements in a system design. A single-pin 3.3V CMOS logic control in a single chip solution reduces the number of control lines. High isolation (RF1–RF2) HaRP™ technology enhanced Eliminates gate and phase lag No insertion loss or phase drift High linearity: 60 dBm IIP3 Low insertion loss 0.77 dB @ 100 MHz 1.00 dB @ 3000 MHz 1.15 dB @ 6000 MHz 1.38 dB @ 8500 MHz 86.5 dB @ 100 MHz 48.2 dB @ 3000 MHz 36.6 dB @ 6000 MHz 27.8 dB @ 8500 MHz Fast switching time Typical Industries Medical Automotive Telecom infrastructure Test instrumentation Down-hole oil/gas Military Space applications 700 ns RF ON 700 ns RF OFF Low power consumption: 3.3 µW @ 3.3V 1dB compression point of +33 dBm Single-pin 3.3V CMOS logic control ESD tolerant to 1000V HBM Absorptive/non-reflective Offered in a 7-lead hermetic CQFP surface-mount package and in DIE form Figure 1. Functional Diagram RFC RF1 ESD 50 ESD CMOS Control Driver RF2 Figure 2. Package Type 7-lead CQFP 50 71-0041 VDD LS CTRL VSS Document No. DOC-03767-6 │ www.e2v-us.com ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 12 PE95421 Product Specification Table 1. Electrical Specifications @ –40 °C ≤ T ≤ +85 °C, 3.0V ≤ VDD ≤ 3.6V and –3.0V ≤ VSS ≤ –3.6V Parameter Condition Operational frequency Min 1 Insertion loss Isolation – RFC to RF1 3000 MHz 1 1.28 dB 6000 MHz 1.15 1.42 dB 1.38 1.72 dB 100 MHz 74 75.6 dB 3000 MHz 46 47.4 dB 43.8 48 dB Input IP3 Switching time Notes: 2 31 38 dB 100 MHz 73.7 75.4 dB 3000 MHz 46.8 48.3 dB 45 52.1 dB 31 38 dB 100 MHz 86.5 dB 3000 MHz 48.2 dB 6000 MHz 36.6 dB 8500 MHz 27.8 dB 100 MHz 21 dB 3000 MHz 33 dB 6000 MHz 20 dB 8500 MHz 15 dB 100 MHz 20 dB 3000 MHz 18 dB 6000 MHz 15 dB 8500 MHz 8 dB 100–8500 MHz 33 dBm 100–8500 MHz, 18 dBm input power/tone 60 dBm 50% CTRL to 90% of final value when RF ON 700 ns 50% CTRL to 10% of final value when RF OFF 700 ns 8500 MHz Return loss active port – OFF state 1 MHz dB 6000 MHz Return loss active port – ON state 8500 0.95 8500 MHz Isolation – RF1 to RF2 Unit 0.77 6000 MHz Isolation – RFC to RF2 Max 100 MHz 8500 MHz Input 1dB compression Typ 2 1. Please note maximum operating PIN (50Ω) of +24 dBm in Table 4. 2. Guaranteed but not tested. ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 12 Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions PE95421 Product Specification Figure 3. Pin Layout (Top View) Table 3. Operating Ranges RFC Pin 1 Symbol Parameter/Condition Min Typ Max Unit VDD Positive supply voltage 3.0 3.3 3.6 V VSS Negative supply voltage –3.6 –3.3 –3.0 V IDD Supply current (VDD = 3.3V, LS or CTRL = 3.3V) 1 μA ISS Supply current (VSS = –3.3V) 1 μA exposed solder pad RF1 Pin 2 Pin 7 RF2 Control voltage high V 0.7xVDD 0.3xVDD V +85 °C 24 dBm Min Max Unit Control voltage low TOP Pin 3 VDD 4 5 6 LS CTRL VSS 1 Pin Name RF power in (50Ω): 1 MHz ≤ 8.5 GHz Description Symbol Parameter/Condition 1 RF common VDD Positive supply voltage –0.3 4.0 V 1 RF port VSS Negative supply voltage –4.0 0.3 V VC1 Voltage on LS input –0.3 VDD+0.3 V VC2 Voltage on CTRL input –0.3 VDD+0.3 V PIN RF input power (50Ω) 1 MHz ≤ 8.5 GHz 27 dBm ΘJC Theta JC 24 °C/W TST Storage temperature range +150 °C VESD ESD voltage HBM*, all pins 1000 V RFC 2 RF1 3 VDD Supply voltage (nominal 3.3V) 4 LS Selects the RF1 to RFC path or RF2 to RFC (See Table 6) 5 CTRL Unused (See Table 6) Negative power supply. Apply nominal – 3.3V supply 6 VSS 7 RF21 RF port Pad GND2 Exposed pad: Grounded for proper operation Notes: –40 Table 4. Absolute Maximum Ratings Table 2. Pin Descriptions Pin # PIN Operating temperature range 1. All RF pins must be DC blocked with an external series capacitor or held at 0 VDC. 2. Must be soldered to PCB RF ground for proper operation. –65 Note: * Human Body Model (MIL-STD-883 Method 3015) Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Document No. DOC-03767-6 │ www.e2v-us.com ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 12 PE95421 Product Specification Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rate specified. Latch-Up Immunity Table 6. Post Radiation Table Total Dose Post 100 kRad LS CTRL RFC–RF1 RFC–RF2 Logic State 0 X off on RF2 active 1 X on off RF1 active ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 12 Min Max Unit 10 µA IDD Positive supply current ISS Negative supply current –10 µA Table 7. Single Event Effects SEE Mode Effective linear energy transfer (LET) SEL/SEB/SEGR 90 MeVmg/cm2 SEFI 90 MeVmg/cm2 SEU 90 MeVmg/cm2 SET 90 MeVmg/cm2 Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Table 5. Truth Table Parameter SEL, SEB, SEGR, SEFI, SEU: None observed, Au/60 degrees. SET: No events exceeding ±10 mV transient observed. ELDRS UltraCMOS devices do not include bipolar minority carrier elements and; therefore, do not exhibit enhanced low-dose-rate sensitivity. Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions PE95421 Product Specification Typical Performance Data Figure 4. Insertion Loss: RF1 @ VDD = –VSS = 3.3V Figure 5. Insertion Loss: RF1 @ 25 °C Figure 6. Insertion Loss: RF2 @ VDD = –VSS = 3.3V Figure 7. Insertion Loss: RF2 @ 25 °C Document No. DOC-03767-6 │ www.e2v-us.com ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 12 PE95421 Product Specification Typical Performance Data (continued) Figure 8. Isolation: RF1–RF2, RF1 Active @ VDD = –VSS = 3.3V Figure 9. Isolation: RF2–RF1, RF2 Active @ VDD = –VSS = 3.3V Figure 10. Isolation: RF1–RF2, RF1 Active @ 25 °C Figure 11. Isolation: RF2–RF1, RF2 Active @ 25 °C Figure 12. Isolation: RFC–RF1, RF2 Active @ VDD = –VSS = 3.3V Figure 13. Isolation: RFC–RF2, RF1 Active @ VDD = –VSS = 3.3V ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 12 Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions PE95421 Product Specification Typical Performance Data (continued) Figure 14. Isolation: RFC–RF1, RF2 Active @ 25 °C Figure 15. Isolation: RFC–RF2, RF1 Active @ 25 °C Figure 16. Isolation: RFC–RF1, OFF state @ VDD = –VSS = 3.3V Figure 17. Isolation: RFC–RF2, OFF state @ VDD = –VSS = 3.3V Figure 18. Isolation: RFC–RF1, OFF state @ 25 °C Figure 19. Isolation: RFC–RF2, OFF state @ 25 °C Document No. DOC-03767-6 │ www.e2v-us.com ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 12 PE95421 Product Specification Typical Performance Data (continued) Figure 20. Return Loss: RF1 @ VDD = –VSS = 3.3V Figure 21. Return Loss: RF2 @ VDD = –VSS = 3.3V Figure 22. Return Loss: RF1 @ 25 °C Figure 23. Return Loss: RF2 @ 25 °C ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 12 Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions PE95421 Product Specification Evaluation Board Figure 24. Evaluation Board Layout The SPDT switch EK Board was designed to ease customer evaluation of Peregrine’s PE95421. The RF common port is connected through a 50Ω transmission line via the top SMA connector, J1. RF1 and RF2 are connected through 50Ω transmission lines via SMA connectors J2 and J3, respectively. A through 50Ω transmission is available via SMA connectors J5 and J6. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. The evaluation kit board is constructed of four metal layers. The dual clad top RF layer is Rogers RO4003 material with an 8 mil RF core and r = 3.55. The other two dielectric layers are FR4 for DC control and overall board strength with an cumulative board thickness of 62 mils. The RF transmission lines were designed using a Grounded co-planar waveguide with a linewidth of 15 mils and gap of 7 mils. PRT-51554 Document No. DOC-03767-6 │ www.e2v-us.com ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 12 PE95421 Product Specification 1 2 RFC 1 RFC J1 142 -0761 -881 /891 Figure 25. Evaluation Kit Schematic U1 RF1 2 RF1 RF2 7 PE9542 1 1 6 VSS 5 CTRL 4 LS 3 VDD RF2 THERMAL SLUG GND 8 2 1 J3 142 -0761 -881 /891 2 J2 142 -0761 -881 /891 9 SOCKETMOUNTINGHOLE 10 SOCKETMOUNTINGHOLE 11 SOCKETMOUNTINGHOLE 12 SOCKETMOUNTINGHOLE J4 HEADER14 1 3 5 7 9 11 13 1 3 5 7 9 11 13 VSS CTRL VDD LS VDD J5 142 -0761 -881 /891 1 R1 DNI C4 22pF C3 22pF C2 22pF C1 22pF J6 142 -0761 -881 /891 ThroughLine 1 2 2 4 6 8 10 12 14 2 2 4 6 8 10 12 14 DOC-28927 Notes: 1. Use PRT-51554 PCB. 2. Caution: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD). 3. All transmission lines are 15 mil width, 7 mil gaps, 8 mil core dielectric. NOTES: 1. USE 101-0811 -01 PCB. 2. CAUTION: CONTAINS PARTS AND ASSEMBLIES SUSCEPTIBLE TO DAMAGE BY ELECTROSTATIC DISCHARGE (ESD) 3. ALL TRANSMISION LINES ARE: 15MIL WIDTH, 7MIL GAPS, 8MIL CORE DIELECTRIC ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 12 Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions PE95421 Product Specification Figure 26. Package Drawing 7-lead CQFP 4.699±0.127 0.572±0.127 5.461±0.127 3.556 2 2 3 3 1.143 (x3) 6.604±0.127 4.826 1 3.429 1 11.790±0.178 5.842±0.127 0.381±0.050 (x7) 6 6 7 7 .381 R (x4) 0.572±0.127 10.647±0.178 0.254 (x7) Bottom View 10.647±0.178 Top View 0.307 0.614 0.127 1.450 1.143 0.762 100°±20° 0.381 1.386 0.901 Side View Document No. DOC-03767-6 │ www.e2v-us.com DOC-50612 ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 12 PE95421 Product Specification Figure 27. Top Marking Specification = Pin 1 indicator 95421-XX = Part number (XX will be specified by the PO and/or the assembly instructions) YYWW = Date code, last two digits of the year and work week XXXXX = Lot code (up to seven digits) ZZZZ = Serial number (up to six digits) PRT-24929 Table 8. Ordering Information Order Code Description Package Shipping Method 95421-01* Engineering samples 7-lead CQFP 18 Units / tray 95421-99 Flight die Die 400 Units / waffle pack 95421-00 Evaluation kit Evaluation board 1 / Box Note: * The PE95421-01 devices are ES (engineering sample) prototype units intended for use as initial evaluation units for customers of the PE95421-11 flight units. The PE95421-01 device provides the same functionality and footprint as the PE95421-11 space qualified device, and intended for engineering evaluation only. They are tested at +25 °C only and processed to a non-compliant flow (e.g. No burn-in, non-hermetic, etc). These units are non-hermetic and are not suitable for qualification, production, radiation testing or flight use. Sales Contact and Information Cont act Information: e 2v ~ ht t p: // w w w . e 2 v -us .c o m ~ i n q ui ri es @ e 2 v -us .c o m Advance Inf ormat ion: Th e p ro d u c t i s i n a f o rm a ti v e o r d e si g n st a g e . Th e d at a s h e et c o n t ai ns d e si g n t a rg et sp e cifi c ati o n s f o r p ro d uc t d ev el o p m e n t . S p eci fic a ti o ns a n d f e at u re s m a y c h a n g e i n a n y m a n n e r w it h o u t n oti c e. Preliminary Specif ication: Th e d at a s h e et c o n tai n s p reli m i n a ry d a t a. A d di ti o n al d at a m a y b e a d d e d at a l at e r d at e . P e re g ri n e re s e rv e s t h e ri g h t t o c h a n g e s p e cifi c ati o n s a t a ny ti m e w it h o u t n o tic e i n o rd e r t o s u p ply t h e b e st p os si bl e p ro d uc t. Product Specificat ion: Th e d a t as h e et c o nt ai n s fi n al d at a . I n t h e e v e nt P e re g ri n e d eci d e s t o ch a n g e t h e s p eci fic a ti o ns , P e re g ri n e w ill n o tif y c us t o m e rs of t h e i nt e n d e d c h a n g e s by is s ui n g a C N F (C u s t o m e r N o tifi c ati o n Fo rm ). ©2015 Peregrine Semiconductor Corp. All rights reserved. Page 12 of 12 Th e i n f o rm a ti o n i n t his d a t as h e e t is b eli ev e d t o b e reli a ble . H o w e v e r, P e re g ri n e a ss u m e s n o li a bili ty f o r t h e us e of t hi s i n f o rm a ti o n. U s e s h all b e e nti rel y a t t h e u s e r’s o w n ris k. N o p at e n t ri g h ts o r li c e ns e s t o a n y ci rc ui ts d es c ri b e d i n t hi s d a t as h e e t a re i m pli e d o r g ra n t e d t o a n y t hi rd p a rty . P e re g ri n e’s p ro d uc ts a re n o t d esi g n e d o r i nt e n d e d f o r us e i n d evi c es o r sy st e m s i n t e n d e d f o r s u rgi c al i m pl a n t, o r i n o t h e r a p pli c ati o n s i nt e n d e d t o s u p p o rt o r s u st ai n li f e, o r i n a n y a p plic a ti o n i n w h ic h t h e f ail u re of t h e P e re g ri n e p ro d uc t c o ul d c re a t e a si t u ati o n i n w hi c h p e rs o n al i nj u ry o r d e at h mi g h t oc c u r. P e re g ri n e a ss u m e s n o lia bilit y f o r d a m a g e s, i n cl u di n g c o ns e q u e n ti al o r i nci d e n tal d a m a g e s , a risi n g o ut o f t h e us e of i ts p ro d uc ts i n su c h a p pli c ati o n s. Th e P e re g ri n e n a m e , l o g o , Ul t ra C M OS a n d U TS i a re re gis t e re d t ra d e m a rks a n d H a R P , M u l ti S wi tc h a n d D u N E a re t ra d e m a rks o f P e re g ri n e S e m ic o n d u ct o r C o rp. P e re g ri n e p ro d uc ts a re p rot e ct e d u n d e r o n e o r m o re of t h e foll o w i n g U . S . P a t e nt s: h tt p :/ / p at e n ts . ps e m i. c o m . Document No. DOC-03767-6│ UltraCMOS® RFIC Solutions