EMI / EMC / Product Safety
Requirements and Design
Seminar
Learn how to reduce the time and cost of
product compliance
Get in-depth training on:
Wireless device approvals process
Current and future regulatory trends
Designing right for faster EMC compliance
Grounding techniques for reducing emissions
Solving EMI, EMC, and product safety problems
Planning and designing for safety agency approvals
Back by popular demand
May 9th through the 12th, 2006
Seating is limited and our last seminar sold out fast, so reserve you place soon!
Presented by
®
EMC / SAFETY / TELECOM TESTING
GLOBAL COMPLIANCE SERVICES
Day 1 - EMC Regulatory Requirements, an Introduction
1. Regulatory Requirements
Intro. to regulatory requirements
Agencies in North America
Agencies in Europe
Structure of regulatory agencies
Participation in standards making
2. North America
US requirements-digital devices
Changes in FCC's policies
PCs and peripherals - special case
Class A or class B limits?
US req. - intentional radiator
Introduction to TCBs
Future trends for TCBs
Canadian requirements
3. European Union (EU)
EMC directive 89/336/EEC
Scope and exclusions
Compliance path to CE mark
Declaration of Conformity
Generic/product specific stds.
ITE standards for EMC
Immunity and emissions testing
FCC vs EC (CE) emission limits
What is a "CAB"?
What is a competent body?
Technical Construction File (TCF)
When to use the TCF route
Future trends for EC
R&TTE directive
4. FCC Part 15 Transmitters
Introduction to FCC Part 15 Transmitters
Overview of Part 15 Transmitter Rules
O
O
O
O
Antenna Requirements
Restricted Bands
Conducted Emissions
Radiated Emissions
O
O
O
O
Remote Controls
FM Audio Transmitters
DTS / Frequency Hoppers
Low Power Communication Devices
Classification of devices
Summary of Subpart C Rule Sections
Detailed Information for Commonly Used
Rule Sections
5. Radio devices for Europe
Example of R&TTE process
Short range devices (SRD)
Technical requirements
®
EMC / SAFETY / TELECOM TESTING
UL
®
GLOBAL COMPLIANCE SERVICES
C
US
Day 2 - Design, Part 1
1. Introduction
Terms & definitions
EMI situations
Modes of noise propagation
Noise transmission paths
Units of EMI measurement
Radiated and conducted noise
Electric & magnetic field sources
Wave impedance and plane waves
Common-mode vs differential
Near-field vs far-field
Narrowband and broadband noise
Freq. vs wavelength relationship
Transmission of signal energy
Chassis as noise source, or sink?
2. Noise Emission Evaluation
Purpose of EMC analysis
Analysis as a design tool
Basis for RFI generation
Application of fourier transforms
Signal transition time and bandwidth
Conducted emission levels
Setup for conducted emissions test
Radiated emission levels
Noise suppression computation
3. Grounding Techniques
Considerations for grounding
Grounding definitions
Personnel safety objectives
EMC grounding objectives
Ground loop problems
Single-point grounding -When?
Multi-point grounding - Why?
Audio-frequency grounding
Digital / RF grounding
Grounding according to noise level
Ground as a return path
Mutual inductance of ground path
Common-mode coupling
Ground reference for RF
4. Case Shielding
Basics of shielding process
Reflection and multiple reflection
Absorption loss computation
Wave and characteristic impedance
Computing reflection loss
Total shielding effectiveness
Effectiveness of Faraday Cage
5. Cable Shielding and Filtering
Induced noise and return path
Shielding effectiveness of cables
Capacitive coupling on cables
Cable as a transmission line
Reflections on a transmission line
Ribbon vs round cable
Isolation techniques for cables
O
O
O
O
O
Isolation transformers
Differential drivers/receivers
Fiber optics
Coaxial or triaxial cables
Common mode chokes
Powerline filtering
Day 3 - Design, Part 2
6. System Packaging and PWB
System design considerations
Suppression at the source
Compartmentalized shielding
Power distribution on PWB
Selection of decoupling capacitors
Effect of trace inductance
Power distribution for 2 layer system
Signal layout for high frequencies
Optimizing Multilayer Boards
O
O
O
Ground near IC pins
Ground through connectors
Ground near PWB edge
O
O
O
O
O
O
O
Ground as shield
Feed-throughs and layers
Pin escape length
Use of decoupling capacitors
Signal routing, best practices
Buried clock layout
Guard band for clocks
O
O
O
Maintain trans-line form
Correct order of layers
Thickness of dielectric
Four-layer PWB
Six-layer PWB
Routing of high frequencies
Preferred layer groups
Eight-layer Plus
Transmission line
Too many layers?
Demonstration
A word from some of our past students...
“I wanted to thank you and your company for the EMI/EMC/
Product Safety seminar in San Diego. I honestly was not
expecting to learn so much during the four days when so many
of these types of company-sponsored seminars are little more
than a sales pitch with some info thrown in for good measure”. “On the contrast, the Compatible Electronics seminar was
chock full of information, good design techniques, lessons in
how not to do things, and how to apply the current and
forth-coming standards. Upon my return to work I
immediately found problems with a PC board we are having
made for us - a ground plane directly under a common
mode choke. These types of things used to not concern
me, but now I understand why you shouldn’t do that”. Thanks again for a job well done! Best regards,
7. ESD & RF Susceptibility
ESD as RF noise
ESD test setup
ESD characteristics
Direct and indirect ESD
ESD through cables
RF Susceptibility
O
O
O
Noise paths for RF
Conducted susceptibility
Powerline transients
8. Diagnostic Procedures & Tools
Spectrum energy
Near field probes
Wire antennas
Cable antennas
Shielding materials
Filtering materials
9. Special Topics
Telephone line
Local area networks
Medical devices
Transmitters & Receivers
10. Demonstrations
EMC testing and debugging
“This 4-day seminar was very well outlined. The
knowledge and experience of the course instructors
along with their practical examples were a valuable
part of the lecture. The written course material will
also be a valuable reference”.
Best Regards,
Kevin
(SIEMENS)
“I have attended many seminars over the past years and I
must say this one with Compatible Electronics has been the
best. I must say that Jeff and Shirish were both outstanding. Both of them gave answers to real world problems. If
someone asked a question, both Jeff and Shirish would take
the time to think about their answer and equate the answer
to a real world problem that each of them has had to deal
with in solving problems. In the most part I would
recommend this seminar to my colleagues. I am using
examples from the seminar to enhance the design of our
product”. Regards -RobertRobert Morgan
Sr. Hardware Engineer
Cubic
Tom Grotkin
Pulmonetic Systems Inc
Day 4 - Product Safety
1. Terms and Definitions
Enclosures
Hazards
Equipment types and classes
Power systems
Environment
2. Standards and Laws
North America
South America
Europe
Nordic Countries
Russia
Japan, China, Korea
Australia, New Zealand
3. Basic Product Safety Principle
Concepts of safety
Design for foreseeable misuse
Approaches to product safety
O
O
Prevention of hazards
Containment of hazard
4. Design Characteristics
Thermal Hazards
Shock Hazards
Mechanical hazards
Chemical hazards
Radiation hazards
Ergonomics
5. Qualification (Type) Testing
Input ratings, touch current
Ground impedance, temperature rise
dielectric withstand, impact
stability, abnormal testing
7. Regulatory Agency Options
North America NRTLs
European Community
CB certification
8. Product Safety Management
What is the role of product safety in your
organization?
O
O
Placement in your organization
Responsibility in your organization
9. Interfacing with Agencies
Selecting an engineering team
Opening a project
Corresponding with project engineer
Can a project be expedited?
Approval of labels
Scheduling your Initial Product Inspection
10. Factory Audits
Initial Product Inspection (IPI)
What to expect during a factory audit
How to handle a variation notice
11. Coming Standards Changes
IEC 60950-1 2 nd Edition
New safety standard
O
O
Hazard based safety standard
ITE, telecom & household electronics
O
O
O
Voltage limits dropped to 0 Volts
Incorporates EMC requirements
Requires a hazard analysis
New Low Voltage Directive
6. Production Line Testing
Dielectric withstand
Ground impedance
Ground continuity
Seminar Objectives
i Aquire a comprehensive and detailed knowledge of EMC, EMI, and product safety design techniques
i Learn terms used for test, measurement, and design related to EMC, EMI, and product safety requirements
i Understand how to control noise at the source, and thereby control costs of suppression components
i Utilize circuit design requirements to complement compliance goals
i Learn requirements for domestic and international regulatory agencies, and new trends in the industry
content may be modified to address attendee interests
C
ompatible Electronics is a commercial EMC test laboratory in Southern
California with four divisions. The divisions combined operate 10 open area test
sites(OATS) and 7 semi-anechoic chambers. In the last 20 years, Compatible
Electronics has assisted many manufacturers, worldwide, in getting their products
to market quickly.
These manufacturers have relied on Compatible Electronics for accurate testing
andcost-effective solutions to make their products EMC compliant. By popular
demand, Compatible Electronics has put together this seminar on proven design
techniques.
Course Instructors
Your principal course instructor will be Mr. Shirish Shah. He is the President of
Compatible Electronics. He has a BSEE from the Indian Institute of Technology(IIT),
Bombay, and a MSEE degree from the University of Hawaii. Mr. Shah is a NARTE
certified EMC Engineer, and has over 30 years of experience designing equipment and
systems, including 25 years of design and consulting in the field of electromagnetic
compatibility. Mr. Shah’s extensive design experience includes analog, digital, RF, power
circuits, and systems in commercial, military, and avionics productdevelopment.
Mr. Jeff Klinger is Compatible Electronics’ Director of Engineering. He has over 10 years
experience in the field of EMI / EMC testing, and specializes in domestic and international
regulatory issues and product approvals. Mr. Klinger holds a degree in Electronics
Engineering technology, and is the IEEE Orange County EMC society chapter Vice-Chair,
as well as a NARTE certified EMC ATL Engineer.
Mr. Ercell Bryant is Compatible Electronics’ product safety services specialist. He has
over 25 years of experience in dealing with safety agencies such as UL, CSA, TUV,
NEMKO, etc. Mr. Bryant has published several articles related to IEC 60950 and
European agency approvals. He has a BS in Business Management.
Cost:
$1095 for all four days.
$995 for day one through three
(EMI/EMC Regulations & Design Seminar)
$395 for day one only
(EMI/EMC Regulations Seminar)
$395 for day four only
(Product safety seminar)
continental breakfast, lunch and seminar handbook included.
10% DISCOUNT ON PAYMENT RECEIVED 30 DAYS IN ADVANCE
Group discounts are also available. Please call.
Accommodation:
Contact the hotel directly to reserve your room. Information on following page.
Cancellation:
Minimum 14 days notice before the starting date of the seminar is required for
cancellation. Cancellation received after this date is subject to a 20% cancellation fee.
Substitution:
Substitutions are welcome and can be done at anytime.
Who should attend?
This seminar is intended for design engineers and technical project managers
involved in FCC and international compliance of digital equipment, Information
Technology equipment, and radio frequency devices. Design fundamentals related
to EMC, and digital circuit design, will be explained thoroughly.
i Digital design engineers & project managers
i EMI test engineers & technicians
i PWB layout persons
i Marketing managers
i Those who think EMC compliance is difficult
True
or
False?
A brief test to help determine if this course is useful for you.
1. A 115V, 60 Hz power cable cannot radiate 30 MHz noise.
2. Metallic enclosures will always lower radiated emissions.
3. Powerline filters can’t increase the noise emissions.
4. Five 0.02 uF capacitors are equivalent to one 0.1 uF capacitor for a power bus bypass.
5. Signal ground should be totally isolated from the chassis ground to prevent chassis noise from getting onto the signal.
All of the statements are “false”; if you answered “true” to any of the above, you should consider attending the seminar.
Seminar schedule and registration information
Days:
May 9, 10, 11 & 12, 2006
Time:
8:30am to 5:00pm
(Breakfast 7:45am-8:30am, Lunch 12:00pm)
Location:
102 Olinda Dr.
Brea, CA 92823
Telephone: (714) 579-0500
Fax:
(714) 528-1992
Area Hotels
4 miles
Woodfin Suites Hotel
3100 E. Imperial Hwy
Brea, CA 92821
-
(714) 579-3200
5.4 miles
Embassy Suites Hotel
900 E. Birch Street
Brea, CA 92821
-
(714) 990-6000
13 miles
Country Suites by Ayres
22677 Oakcrest Circle
Yorba Linda, CA 92887
-
(714) 921-8688
114 Olinda Drive, Brea, CA 92823
RETURN SERVICE REQUESTED
If addressee is unavailable, please forward to Engineering Manager
To enroll, please call: (714) 579-0500 or fax this form to (714) 528-1992
or if you prefer, register online at http://www.Compatible-Electronics.com/seminar
Registration Form
Please enroll me for the seminar
I am unable to attend on these dates, but please include me in future mailings
I am not interested, please remove me from the mailing list
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1. EMI / EMC / Product safety (All four days) Fee $1095
x______(Number of registrants) Total__________
2. EMI / EMC Seminar (Days one - three)
Fee $995
x______(Number of registrants) Total__________
3. Regulatory requirements (Day one only)
Fee $395
x______(Number of registrants) Total__________
4. Product safety (Day four only)
Fee $395
x______(Number of registrants) Total__________
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