SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
Renaissance Columbus Downtown
50 North 3rd Street
Columbus, OH 43215
Tel:
614.228.5050
SSTC G11 Members that may be able to; are invited and encouraged to come early and participate in the JC13/SSTC G12 committee meetings. These other committees will be meeting starting Monday, 28 September 2015.
Coffee, Tea and Water – Breaks as needed until adjournment time.
1
STEERING COMMITTEE MEETING – M. Cozzolino
~6:00 PM – 7:00 PM, Tuesday, 29 September, 2015 (meet in hotel lobby)
2
CALL TO ORDER – M. Cozzolino
8:00 AM – 5:00 PM, Wednesday, September 29, 2015. (WE MAY EXTEND THE MEETING LATER).
8:00 AM – 12:00PM, Thursday, October 1, 2015 (meeting may close early pending topics to be discussed)
Self introductions, review agenda, past minutes & correspondence – M. Cozzolino
Secretary report – L Panashchenko
3
PARTS – TECHNOLOGY / EVALUATION – TASK SPONSOR REPORTS,
GIDEPs, Problem Description, Meeting Assignments
Capacitors
Circuit Breakers
Coils, Transformers
Connectors
Filters & Networks
Fuse & Lighting Arrestors
Hardware
Insulators & Insulating Materials
Oscillators & Crystals
Relays
Resistors & RC Networks
Switches
Terminals, Lugs
Wire & Cable
4
FSC 5910
FSC 5925
FSC 5950
FSC 5935
FSC 5915
FSC 5920
FSC 53XX
FSC 5970
FSC 5955
FSC 5945
FSC 5905
FSC 5930
FSC 5940
FSC 6145
Jay Brusse
Caleb Santiago
Maria Ptak
TBD
Jay Brusse
Caleb Santiago
Mary Lombard
Maria Ptak
Shana Kelly
Lyudmyla Panashchenko
Mike Cozzolino
Mary Lombard
Mary Lombard
TBD
LIAISON REPORTS (AS RELATED TO THIS COMMITTEE ONLY)
SSTC G-12 Solid State Devices
SAE
GIDEP
JAXA
Monitor Industry activity for Pb elimination
MIL-STD-1580
TBD
M. Cozzolino
W. Pumford
K. Toda & T. Matsuoka
J. Brusse
S. Kelly, M. Cozzolino
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
5
GOVERNMENT REPORTS
Air Force Parts Activity
Army Parts Activity
DLA Parts Activity
Space Parts Activity
NAVY Parts Activity
6
Technical Presentations
Topic
Presenters:
7
B. Steiner
M. Moore
M. Radecki
J. Siplon
R. Olofintuyi
Polymer Tantalum Capacitors
Yuri Freeman and Erik Reed/Kemet Electronics Corporation
SPECIAL TASK REPORTS
Task 07-307
Track query to the supply base to try to find out which parts may not meet or have conflicts
with the restricted materials and finishes used for internal and external construction of tantalum, plastic and
leaded ceramic capacitors and filters.
Latest Update as of May 2015: Work continues to revise affected specifications. MIL-PRF-39022J was dated 26
March 2015 with the wording to allow lead free high temperature solder.
Tracking. Open -- M. Radecki
Task 08-101
Develop guidelines for optical microscopy techniques (illumination angle of inspection) for
Passives
Latest Update as of May 2015: Keep open for 1 more meeting to allow C. Pollock opportunity to provide
status of efforts to incorporate guidelines for vicinal illumination into EIA 469 for ceramic capacitors.
Tracking. Open -- J. Brusse, M. Cozzolino, C. Pollock
Task 08-106
Track the implementation of the proposed changes to MIL-PRF-39010, MIL-PRF-83446 and
MIL-PRF-15305.
Recommendation is 500 thermal cycles for Qualification, 25 to 50 thermal cycles for group A, and 250 thermal
cycles for group C all monitored for continuity during the last 5 cycle’s minimum. Initial draft planned by the end of
2010. Draft was reviewed by the suppliers and initially rejected. Request more detailed information from suppliers
and justification for the objections. Are all suppliers objecting or only some? Please include Steve Hammond and
Maria Ptak in planning and discussions with the suppliers. T Level being added to MIL-PRF-83446 second draft is
being sent out by DLA. The other specification will be sent out for review after the issues in MIL-PRF-83446 are
resolved. A second draft is not ready for distribution; industry may not want to keep some tests. Some tests added to
T level. MIL-PRF-15305 has been dated. MIL-PRF-83446 second initial draft should be out by the end of this
month for review concerning number of thermal cycles or temperature cycling. Submit comments to K. Beymer by
1/31/14. New wording in 83446 for T level see DLA report Why was 15 cycles chosen. Waiting to date document,
ECD October 2014.
Latest Update as of May 2015:
•
MIL-PRF-15305 dated 6 May 2013.
•
MIL-PRF-83446 dated 2 Feb 2015.
•
MIL-PRF-39010 Expected to be dated by June 2015
Tracking. Open --M. Radecki. Maria Ptak
Task 11-107
Track the progress with SAE to cover the new high speed data contacts (QUADRAX).
A new draft for the Quadrax is being generated at SAE committee 8C1. High speed specification for wire is being
broken up into two specifications, AS39029/119 and AS39029/120. New document expected to be published in
2014.
Latest Update as of May 2015 --No changes
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
Tracking Open-- M. Radecki.
Task 11-206
Track progress of standardization efforts for a new specification to cover micro (mighty
mouse type) MIL- PRF-38999 connectors.
DLA needs a request from 3 OEMs to justify and get permission to generate a new specification. M. Radecki is
trying to get the permission. Connector group and DLA working on issue. Glenair is not receptive to having a mil
equivalent at this time. Are other companies going to have similar types of connectors? Two DLA projects are in
work. See DLA report.
Latest Update as of May 2015: No changes
Tracking .Open - M. Lombard, M. Radecki
Task 11-302
Make recommendations to resolve any conflicts or compatibility issues in MIL-PRF-55310
associated with MEMS oscillators.
There may not be a lot of changes needed. Steve had given some information from his engineering to DLA. S.
Hammond to review DLA comments from B. Sindelear and comment. S. Hammond agreed that minor changes to
MIL-PRF-55310 may be all that are required to add MEMS device coverage to the specification. Likely changes
include: (a) Adding generic name such as micromechanical resonator to the title of the spec. (b) adding Type 9 to
cover MEMS, (c) Adding more stringent environmental testing for Mechanical Shock, Vibration, Thermal Shock,
etc. Steve stated he would discuss these possible changes with Rockwell/Collins device engineers and present his
findings at the September G11 meeting. NOTE: Bill Sindelar expressed DLAs interest in adding MEMS to MILPRF-55310 to our QPL suppliers, but has only received one response so far. Vectron International stated that their
design and product management groups all agreed that the MIL-PRF-55310 specification would not be suited for
governing manufacturing, screening, or qualification of a MEM’s device due to the differences in expected
performance and construction methods. In their opinion, there should be a standalone procurement specification for
a MEMs device. It was requested that Vectron International delineate why they feel a stand-alone specification
would be preferable over modifying the present MIL-PRF-55310 document, but has received no further comment to
date. Steve Hammond gave a partial markup. Fred Lester is DLA crystal rep. Still need update.
Latest Updated as of May 2015: In January 2015 DLA provided Rockwell/Collins electronic version of MIL spec
for MEMS related markups. No reply has been received
Tracking Open. - M.Radecki, S. Hammond.
Task 11-305
Members to provide comments to the element evaluation tables out to the committee for
review for final disposition.
G-11 has given input and all the inputs need to be compiled for Space Level requirements. Currently MIL- PRF55310 has more stringent requirements than the hybrid spec, MIL-PRF-38534. Tables are being revised. A
discussion is needed between all Space Level part users to provide a recommendation.
Latest Update as of May 2015:
•
G11 appointed J. Siplon/The Aerospace Corp. as primary liaison to the M38534 task group for amendment
of element evaluation criteria. Backups will be H. Perkins/Kemet, C. Pollock/Presidio and M.
Cozzolino/Raytheon
•
Stacy Irwin/Crane Interpoint is collecting final inputs and is supposed to distribute to G11 chair for final
review
•
Element evaluation task group is debating whether to add criteria for a new class “TOR” to accommodate
the highest level criteria presently being covered via SCDs for USAF space programs.
•
Uncertainty regarding need to include element evaluation criteria for Crystals since M55310 covers the
preponderance of crystal oscillator products. However, MSK and Natel include “Crystals” in their QML
38534 listings
•
Element evaluation criteria for magnetics is in need of support from magnetics commodity experts familiar
with MIL-STD-981
•
Task group is considering whether unique criteria may be needed for products based on the draft MILPRF-THIN for “thin dielectric” ceramic capacitors
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
•
G11 will offer to have a joint meeting with the JEDEC hybrids task group on element evaluation if deemed
necessary
Tracking – Open, M. Garcia, Space Level Users.
Task 12-203
Generate new mil spec for foil chip resistors.
DLA is generating new drawings. The spec will be sole source from Vishay. Alpha Japanese Co (a Vishay
company) also can supply foil resistors primarily for Asian market. DLA has reviewed MIL-PRF-55342 to see if
parts can be covered within this specification. Vishay believes that a separate specification would be the best option.
Steve Philips of Vishay is POC. Jay Brusse will contact Steve Philips. It is G11’s opinion and recommendation that
there is a need to separate Vishay (VSM/VSMP types) from standard chip resistors. Maria Ptak to contact DLA on
what needs to be done to do this. Specification is expected by the end of June 2014. Specification date revised to
December 2014. Delay due to staffing issues from Vishay. New date for spec change in draft in March 2015.
Latest Update as of May 2015:
DLA continues collaboration with Vishay Precision Group (prospective supplier) to develop this specification. Draft
expected by end of 3rd quarter 2015
Tracking - Open M. Cozzolino / M. Radecki / J. Brusse/ M. Ptak
Task 12-206
Provide coplanarity input and pin alignment tolerances to DLA for MIL-PRF-49470.
Pin alignment has been addressed. KEMET stated that they have not seen any issues on surface mounting for these
devices. There is a need to look at not only coplanarity from pin to pin, but from one end of the chip to the other.
DLA will send out something to the manufacturers for recommendations on tolerances. DLA sent out for comments.
KEMET to send comments to DLA. EPC Study 8/26/14 sent. Draft Started for new requirements. DLA still needs
technical information for the S leaded parts and limits for side-to-side pin alignment.
Latest Update as of May 2015: Continue Tracking
Tracking – Open -- H. Perkins, C. Pollock, M. Radecki
Task 12-301
Revise MIL-PRF-123 and MIL-PRF-55681 to replace terminal strength test with board flex
test on AEC-Q200-005 and shear test similar to shear test on MIL-STD-883.
EP study performed and project is in work. An initial draft of MIL-PRF-55681G was distributed 26 November 2013.
Comments were due 10 January 2014. As a result of the MIL-PRF-THIN coordination, the flexure test and shear
stress will be written into MIL-PRF-55681 and MIL-PRF-123. The requirements of AEC-Q200 will not be used. A
2nd draft of MIL-PRF-55681 will be distributed based on this new information.
Latest Update as of May 2015:
Once these same methods have been approved via coordination for the new MIL-PRF-THIN, then they will be
adapted for M123 and M55681
Tracking -- Open – M. Radecki, J. Siplon
Task 12-304
G11 will revisit the leakage inductance on 1553 M21038 Bus Transformer.
Noise in system was eliminated when a different transformer was installed in the application with the problem.
There is currently no specification on the transformer and the issue is on one application. DLA is reluctant to change
the MIL spec based on one application. Boeing states it has a problem with the Mil spec; need value of leakage
inductance. The manufacturer can produce different values of leakage. There is need for a specified limit. There is a
G-11 report. See DLA report, Boeing to provide values to DLA for spec revision. Test method to be used
Latest Update as of May 2015:
New GIDEP GB4-P-15-02 has been released
Issues may now include an imbalance of leakage inductance that can cause issues
DLA plans to pull together a task group (Boeing, suppliers, Aeroflex and DLA VQ)
Tracking -- Open - S. Kelly, M. Radecki
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
Task 13-104
DLA to issue an industry survey on what should be the minimum wall thickness for
conformal coated and molded tantalum chip capacitors.
Tracking - DLA proposed 5 mils. Industry has comments. Not allow to x-ray unless they are “T” level. May need a
telecom with interested parties. Survey was not sent to industry.
Latest Update as of May 2015:
Draft of M55365 was issued in January 2015 containing proposed minimum wall thickness. Suppliers did not
support the proposed minimum wall thickness criteria. A 2nd draft will be prepared that addresses
concerns/feedback from 1st draft. Discussions will continue pending release of 2nd draft. DLA is considering having
a face to face discussion in Columbus on the day before G11 begins
Tracking -- M. Radecki
Task 13-206
Investigate the possible inclusion of surface mount (SMT) solid body fuses into MIL-PRF23419 Fuse Cartridge.
Latest Update as of May 2015:
A new slash sheet /13 was released in February 2014
A new slash sheet /14 is still pending awaiting data from AEM (supplier).
Tracking Open –M. Radecki.
Task 14-101
Look into developing a more efficient notification system to document shipment holds of
QPL/QML product.
No progress, Need to establish process for prolonged shipping holds. May need to be something that would go into
GIDEP. Need to send recommendation to Alan Will at DLA. Alan Will stated that the DLA Land and Maritime
Sourcing and Qualifications Division does not want to make all of these public because most are not "quality"
related. . He is looking for suggestions from G11 for an easy way to notify the community of long holds. His contact
info is Alan.Will@dla.mil (614) 692-0619. As of January Alan had not received any suggestions.
Latest Update as of May 2015:
Alan Will/DLA has agreed to utilize GIDEP Agency Action Notices (AAN) to identify future holds that are more than
30 days old. GIDEP (W. Pumford) shared details of existing examples of the use of AANs for similar purposes.
Tacking - J. Brusse, W. Pumford, A. Will
Task 14-103
Request DLA look into language on M83513 micro- miniature connector specification
allowing for tests to be performed in-process.
Send detailed description to M. Radecki. Garcia Looked at wording and is consistent. Inserting language for
assurance that the Dielectric Withstanding Voltage (DWV) and Insulation Resistance (IR) tests are performed with
the insulation filler material already applied. DLA coming up with draft
Latest Update as of May 2015:
DLA is amending specification to clarify the test sequence for the Dielectric Withstanding Voltage (DWV) and
Insulation Resistance (IR) tests to ensure these tests are performed after the product has completed manufacturing
steps that can impact performance.
Open. A. Sens/M. Radecki/M
Task 14-105Create detail ultrasonic requirements for M123, M49470 and MIL-PRF-THIN.
M123 and MIL-THIN proposal are done; still need M49470 proposal. Will be put in MIL STD 202 eventually.
Latest Update as of May 2015:
A test method is presently being incorporated into the draft of MIL-PRF-THIN for “thin dielectric” ceramic chip
capacitors. Once approved via DLA coordination, then other ceramic MIL specs that require ultrasonic inspection
will be amended
Tracking Open. C. Pollock/J. Siplon/M.Radecki/R. Schmitt/H. Perkins.
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
Task 14-201
Work on 2nd revision of 13030. DLA Land and Maritime drawing 13030 (Capacitors, Fixed,
Polymer Tantalum, Axial Leaded, Hermetically Sealed).
Fine leak requirements will be added in an upcoming revision. Hal gave update. New Leak tester ordered (ECD
10/14), thermal shock ok.
Latest Update as of May 2015:
Kemet has drafted an amendment that is completing Kemet internal review. Once review is completed, Kemet will
provide the draft to DLA for review and coordination
Open. H. Perkins, M. Radecki, J. Siplon.
Task 14-301
Generate EP study to determine side-to-side alignment tolerance for MIL-PRF-49470 parts.
Latest Update as of May 2015:
Draft is still in process
Open - J. Siplon / J. Bonitatibus / M. Radecki.
Task 14-302
Replaces CLOSED task 14-104.Create new style for /9 of MIL 39003 reflecting /10
requirements.
A new slash sheet (/11, style CSS21) has been created and an initial draft was distributed 12 November 2014. The
coordination period ended 12 December 2014. There were no significant comments. DLA will continue to work
with QPL manufacturers to complete the project. An initial draft of MIL-PRF-39003N and Supplement 1 was also
distributed. These documents are being revised to add references to the new style.
Latest Update as of May 2015:
DLA has prepared an initial draft. Kemet (sole source) is reviewing the draft prior to DLA release for formal
coordination
Open – J. Siplon / M. Radecki / H. Perkins
15-101
Provide MIL-STD-1580 input for proposed changes on resistors, capacitors, magnetics, and
prohibited materials analysis (section 9).
Latest Update as of May 2015:
Task group meeting was held Tuesday, 12 May 2015.
See MIL-STD-1580 notes in the liaison report section. Continue tracking
Open – S. Kelly, M. Radecki
Task 15-102
Track MIL-PRF-55365 moisture sensitivity level note.
Latest Update as of May 2015:
DLA hopes to receive information regarding this issue from affected manufacturers. Once details are received, DLA
will propose new wording in the upcoming 2nd draft of MIL-PRF-55365J.
Open- M. Radecki, J. Siplon
Task 15-103
DLA to track progress on T level substitutability and other changes to M55342.
Latest Update as of May 2015:
MIL-PRF-55342H Am 3 is out for coordination with a comment period over on 9 May 2015. Expect to be dated in
early June.
Open - M. Radecki
Task 15-104
Report on apparent conflict in MIL-STD-981 regarding cracked core acceptance criteria.
Latest update as of May 2015: No update
Open - R. Olofintuyi, K. Beymer
SSTC G-11 – Columbus, OH
Sept 28 – Oct 1, 2015 – Agenda
Task 15-105
On substitutability of various surge current/Weibull test options (MIL-PRF-55365)
Mike Radecki has data from Aerospace on their work. Mike will send the data back to Jocelyn. Aerospace will try to
sanitize and send it to Mike Cozzolino/Adam S. If totally clean – send it to manufacturers. Arrange telecon for
vetting data between DLA, Aerospace and Cozzolino to discuss action plan.
Latest Update as of May 2015:
EP study may be initiated once manufacturers agree to test plan
Open – M. Radecki, J. Siplon
Task 15-201
Generate an Engineering Practices (EP) Study to survey community regarding impacts (if
any) if Termination “W” (i.e., supplier option for pure tin or tin-lead surface finish) is removed from
M55681”
Open – J. Bonitatibus, J. Brusse
Task 15-202
Contact Cornell Dubilier (QPL supplier of mica capacitors) to ask if they would agree to
qualify mica capacitors per MIL-PRF-39001 using a construction with metallurgically bonded interconnects
between the electrodes and terminals.
Open – J. Siplon, M. Radecki
Task 15-203
Generate an Engineering Practices (EP) Study to determine which MIL passive component
specs are candidates for the incorporation of Board Flex Test & Shear Test (e.g. AEC Q200)
Open – M. Radecki, A. Sens
Task 15-204
Draft a letter from G11 to the qualifying activity for SAE AS22759 fluoropolymer insulated
electrical wire to express the G11 committee’s desire to have qualified sources for the newly established slash
sheets for “low fluoride” emitting insulation materials (e.g. AS22759 slash sheets 47 through 54)
Open – J. Brusse
8
PROBLEM DISCUSSIONS
These problem discussions are held typically the last day of the meeting before adjournment.
Manufacturers are typically requested to not be present for this portion of the meeting. No records are kept
for this portion of the meeting
9
NEW BUSINESS
Review of current assignments of Tasks and Liaisons reports.
Review of Special Tasks from last meeting.
Technical Presentation committee
10
ADJOURNMENT (around 12:00PM or earlier on Thursday Oct. 1, 2015)
NOTE: Everyone giving a report - PLEASE provide the Secretary with a BRIEF SUMMARY
Brief summaries are for use AS-IS in the minutes. Handouts to attendees can have all the detail you want.