CLD-AP25 Rev 18
Soldering & handling
Cree® XLamp® XP Family LEDs
Introduction
Table of Contents
This application note applies to XLamp® XP Family LEDs,
Handling XLamp® XP Family LEDs...........................................2
which have order codes in the following formats.
Circuit Board Preparation & Layouts.........................................5
Case Temperature (Ts) Measurement Point.............................5
XPxxxx-xx-xxxx-xxxxxx
Notes on Soldering XLamp® XP Family LEDs..........................6
XPLxxx-xx-xxxx-xxxxxxxxx
Moisture Sensitivity...................................................................7
Low Temperature Operation......................................................7
This application note explains how XLamp XP Family LEDs
XLamp® XP Family LED Reflow Soldering Characteristics......8
and assemblies containing these LEDs should be handled
Chemicals & Conformal Coatings.............................................9
during manufacturing. Please read the entire document to
Assembly Storage & Handling................................................ 10
understand how to properly handle XLamp XP Family LEDs.
Tape and Reel.......................................................................... 11
www.cree.com/Xlamp
Packaging & Labels................................................................ 14
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective
owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp ® XP Family LED Soldering & Handling
Handling XLamp® XP Family LEDs
Manual Handling
Use tweezers to grab XLamp XP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do
not push on the lens.
Do not apply more than 500 g of shear force directly onto the lens. Excessive force on the lens could damage the LED.
P
CORRECT
X
WRONG
Cree recommends the following at all times when handling XLamp XP Family LEDs or assemblies containing these LEDs:
•
Avoid putting mechanical stress on the LED lens.
•
Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
•
Cree recommends always handling XP Family LEDs with appropriate ESD grounding.
•
Cree recommends handling XP Family LEDs wearing clean, lint‑free gloves.
Use tweezers with wide, not pointed, tips to grab XLamp XP-L High Intensity LEDs at the base.
P
CORRECT
X
WRONG
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
2
Ø 0.5
XLamp ® XP Family LED Soldering & Handling
C5
6
4
3
2
NOTICE
REV
NFIDENTIAL. THIS PLOT AND THE INFORMATION
NED WITHIN ARE THE PROPRIETARY AND
REV
DESCRIPTI
ENTIAL INFORMATION
OF
CREE,
INC.
THIS
PLOT
Pick & REPRODUCED
Place Nozzle OR DISCLOSED TO ANY
T BE COPIED,
ORIZED PERSON
THE WRITTEN
WITHOUT
CONSENT
INC. The following diagram shows an example of a pick & place tool to remove XLamp XP-C, XP-E and XP-G LEDs from the factory tape & reel
packaging.
All dimensions in mm
Tolerance: ±0.01
Ø4
B
Ø 0.5
0.439
O.957
Ø 3.06
Top View
3.734
A
120°
Conical
O 3.230
SECTION
A-A
Side View
8
6
7
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
R1.867
3.734
THIRD AN
4
5
3
Rev.
A
2
REVISIONS
DESCRIPTION
PRINT RELEASE
DATE
10/11/20
The following diagram shows an example of a pick & place tool to remove XLamp XP-E2, XP-G2 and XP-G3 LEDs from the factory tape &
6
5
4
D in urethane.
reel packaging. The nozzle is implemented
A
All dimensions in mm
A
Tolerance: ±0.01
3.734
.957
0.439
O.957
C
Ø 3.06
3.734
O 3.230
4.734
120°
Conical
SECTION A-AB
R1.867
6
1.016
3.734
5
Top View
4
SECTION A-A
A
3.062
3.734
0.147
DRAWN
BY
DATE
UNLESS OTHERWISE
SPECIFIED
D.
Seibel10/15/09
DIMENSIONS ARE IN
INCHES
CHECK DATE
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX
±
.01
APPROVED
DATE
1.016
TITL
.XXX± .005
30.00 X
°
±
.5
°
0.040
THIRD ANGLE PROJECTION
FOR SHEET METALMATERIAL
PARTS ONLY
.X ± .06
SIZE
PEEK
.XX± .03
.XXX± .010 FINAL PROTECTIVECFI
X° ± .5°
SCAL
63
10
SURFACE FINISH:
3.230
3
3.302
Side View0.130
PART OR
IDENTIFYING NO.
DECIMALS
ANGLES
MATERIAL
APPROVALS
DATE
10/11/2011
RESP ENG
32
MA
SPEC
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
XX = <MOD-PM>.002
<MOD-PM>DRAWN
1/2<MOD-DEG>
XXX = <MOD-PM>.001
CHECKED
XXXX = <MOD-PM>.0002
FINISH
2
NOMENCLATURE
OR DESCRIPTION
PARTS LIST
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
3.734
Copyright © 2008-2016 Cree, Inc. All rights .957
reserved. The information in this document is subject to change without notice. Cree
ITEM
NO.
MFG ENG
HEW Led and Tip
SIZE
DWG. NO.
A
and XLamp are registered
trademarks and
the Cree logo is a trademark
QUAL ENG
DO NOT SCALE DRAWING
CAD
SCALE
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
This
3
6
5
4
8
2
7
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
®
®
FILE:
Tuesday, October 11, 2011 1:16:44
3
XLamp ® XP Family LED Soldering & Handling
3.683
[ø0.145]
0.188
[0.007]
The following diagram shows an example
of a pick & place tool to remove XLamp XP-L High Density and XP-L2 LEDs from the factory tape
A
& reel packaging. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane. The following
pick & place tool, designed in conjunction with Count On Tools, is specific to the XP-L High Density and XP-L2 LEDs.
3.175
[ø0.125]
A
A
3.683
[ø3.683
0.145]
[ø0.145]
A
3.175
[ø3.175
0.125]
All dimensions in mm [in]
118°
Tolerance: ±0.025 [0.001]
0.188
[0.007]
0.188
1.016
[0.007]
[ø0.040]
SECTION A-A
118°
118°
[ø0.125]
A
A
1.016
[ø1.016
0.040]
5
[0.197]
SECTION A-A
SECTION A-A
[ø0.040]
Top View
Side View
5
[0.197]
5
[0.197]
Side View
3.300
.300
The following diagram shows an example
of a pick & place tool to remove XLamp XP-L High Intensity LEDs from the factory tape & reel
packaging. Cree recommends using a spring‑relieved pick and place nozzle with a spring constant of 0.05 lb‑ft (0.07 N‑m). Cree has had
good success using nozzles fabricated from 95a urethane. The following pick & place tool is specific to the XP-L High Intensity LED.
2.400
All dimensions in mm
Tolerance: ±0.001
3.300
.300
.500 3.400
2.400
3.300
.300
Ø 1.000
2.400
.500
.500 3.400
3.400
Top View
Side View
Ø 1.000
.500
.500 3.400
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
3.400
of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
Ø 1.000
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please
see the data sheets available at www.cree.com.
4
.73
.73
3.45
3.45
.50
.50
XLamp ® XP Family LED Soldering & Handling
3.45
3.45
3.30
3.30
Circuit Board
Preparation & Layouts
CC
2.60
2.60
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
1.30
1.30
soldering XLamp XP Family LEDs onto the PCB.
PRIMARY
PRIMARY
The diagram below shows the recommended PCB solder pad layout for XLamp XP Family LEDs.
All dimensions in mm
.50
.50
.50
.50
.64
.64
.50
.50
BB
.25
.25
3.30
3.30
3.30
3.30
.75
.75
1.30
1.30
AA
3.30
3.30
Recommended PCB Solder Pad
RECOMMENDED
RECOMMENDEDPCB
PCBSOLDER
SOLDERPAD
PAD
1.01
1.01
ALL
ALLDIMENSIONS
DIMENSIONSARE
AR
2.30
2.30
3.30
3.30
Recommended
Stencil
Pattern
RECOMMENDED
RECOMMENDEDSTENCIL
STENCILPATTERN
PATTERN
(Hatched
Area
isOPENING)
Open)
(HATCHED
(HATCHED
AREA
AREA
ISISOPENING)
THIRD
THIRD
ANGLE
ANGLE
PROJECTION
PROJECTION
Case Temperature (Ts) Measurement Point
66
UNLESS
UNLESS
OTHERWISE
OTHERWISE
SPECIFIED
SPECIFIED
DIMENSIONS
DIMENSIONS
ARE
ARE
ININ
MILLIMETERS
MILLIMETERS
AND
AND
AFTER
AFTER
FINISH.
FINISH.
TOLERANCE
TOLERANCE
UNLESS
UNLESS
SPECIFIED:
SPECIFIED:
.XX
.XX ± ± .25.25
.XXX
.XXX ± ± .125
.125
X°X° ± ± .5 .5° °
FOR
FOR
SHEET
SHEET
METAL
METAL
PARTS
PARTS
ONLY
ONLY
.X.X ± ±
1.51.5
.XX
.XX ± ± .75.75
.XXX
.XXX ± ± .25.25
X°X° ± ± .5 .5° °
SURFACE
SURFACE
FINISH:
FINISH: 1.61.6
55
44
33
XLamp XP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XP Family LED itself. In testing, Cree has found
such a solder pad to have insignificant impact on the resulting Ts measurement.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
5
XLamp ® XP Family LED Soldering & Handling
Notes on Soldering XLamp XP Family LEDs
Notes on Soldering XLamp® XP Family LEDs
XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
by placing
theLEDs
PCB are
on designed
a hotplate
and
following
the
soldering
profile
listed
on the
page.
XLamp
XP Family
to be
reflow
soldered
to reflow
a PCB. Reflow
soldering
may
be done
by aprevious
reflow oven
or by placing the PCB
onDo
a hotplate
andsolder
following
the reflow
soldering
profile
on page
8. XLamp XP Family LEDs.
not wave
XLamp
XP Family
LEDs.
Dolisted
not hand
solder
P
P
CORRECT
CORRECT
P
P
X
X
WRONG
WRONG
CORRECT
CORRECT
Solder Paste Type
Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.
Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after
reflow soldering is not required. Cree uses the following solder paste internally:
Solder Paste Type
Cree
strongly
recommends
using “no clean”
paste
with XLamp XP Family LEDs so that cleaning the PCB after soldering is not
Indium
Corporation
of America®
Part solder
number
82676
®
•
Sn62/Pb36/Ag2
composition
required. Cree uses Kester R276 solder paste internally.
• Flux: NC-SMQ92J
Cree
recommends
the following
paste compositions:
SnPbAg, SnAgCu
and
SnAg.
Cree
recommends
the following
soldersolder
paste compositions:
SnAgCu (tin/silver/copper)
and
SnAg
(tin/silver).
Solder Paste Thickness
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
The choice
of solder
and the
application
method will dictate
the
specific
amount
solder.
Forthickness
the most
consistent
dispensing
system
or a solder
stencil
printer is recommended.
Cree has
seen
positive
resultsof
using
solder
that
results in aresults,
4-mil
an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder
(102-μm)
bond
line,
i.e.,
the
solder
joint
thickness
after
reflow
soldering.
thickness that results in a 3-mil (75-μm) bond line.
P
P
CORRECT
CORRECT
X
X
WRONG
WRONG
Cree, Inc.
This document
is provided
forrights
informational
purposes
only inand
not a warranty
specification.
For product
specifications,
please see
the
Copyright
© 2008-2016
Cree, Inc. All
reserved. The
information
thisisdocument
is subjectortoachange
without notice.
Cree® and
XLamp® are registered
trademarks
and the Cree logo is a trademark
SiliconThis
Drive
data Inc.
sheets
available
at www.cree.com.
For warranty
please
contact Cree
Sales
of Cree,
Other
trademarks,
product and company
names areinformation,
the property of
their respective
owners
andatdosales@cree.com.
not imply specific product and/or vendor endorsement, sponsorship or 4600
association.
Durham,
NC
27703
Copyright
©
2008-2009
Cree,
Inc.
All
rights
reserved.
The
information
in
this
document
is
subject
to
change
without
notice.
Cree,
the
Cree
logo
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
USA Tel: +1.919.313.5300
and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners
6
www.cree.com/xlamp
and do not imply specific product and/or vendor endorsement, sponsorship or association.
4
CLD-AP25 Rev 3
XLamp ® XP Family LED Soldering & Handling
Notes on Soldering XLamp® XP Family LEDs (continued)
After Soldering
After soldering, allow XLamp XP Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Bare XLamp LEDs have a storage
temperature range of -40 °C to 100 °C. However, the MBP, reel, tape and box have a more limited storage temperature range.
Once the MBP is opened, XLamp XP Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
Low Temperature Operation
The minimum operating temperature of these XLamp components is -40 °C. To maximize lifetime, Cree recommends avoiding applications
where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
7
XLamp ® XP Family LED Soldering & Handling
XLamp® XP Family LED Reflow Soldering Characteristics
In testing, Cree has found XLamp XP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
8
XLamp ® XP Family LED Soldering & Handling
Chemicals & Conformal Coatings
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Chemicals
In testing, Cree has found the following chemicals to be safe to use with XLamp XP Family LEDs.
•
Water
•
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XLamp XP Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XP Family LEDs.
The fumes from even small amounts of the chemicals may damage the LEDs.
•
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
•
Methyl acetate or ethyl acetate (i.e., nail polish remover)
•
Cyanoacrylates (i.e., “Superglue”)
•
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
•
Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
9
XLamp ® XP Family LED Soldering & Handling
Assembly Storage & Handling
Do not stack PCBs or assemblies containing XLamp XP Family LEDs so that anything rests on the LED lens. Force applied to the LED lens
may result in the lens being knocked off. PCBs or assemblies containing XLamp XP Family LEDs should be stacked in a way to allow at
least 1-cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XP Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
CORRECT
P
CORRECT
X
WRONG
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
10
+.3
12.0
.0
Anode Side
(denoted by + and circle)
XLamp ® XP Family LED Soldering & Handling
User Feed Direction
END
START
Tape and Reel
Loaded Pockets
All Cree carrier tapes conform to EIA-481D,
Trailer Automated Component Handling Systems Standard.
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
(1,000 Lamps)
XP-C, XP-E, XP-E High Efficiency White, XP-G, XP-L High Density, XP-L High
Leader
400mm
(min) ofall dimensions in mm.
Except
as noted,
empty pockets with
at least 100mm
sealed by tape
Intensity,(50
XP-L2
empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
6
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE, INC.
5
4
3
2
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13mm
7"
D
XP-E2, XP-E2 Torch, XP-G2, XP-G3
16.40
Ø190
C
Ø61 ± 0.5
OD
7.5
12.40 +2.00
0
MEASURED AT HUB
''
B
Ø13
12.40
MEASURED AT INSIDE EDGE
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
A
THIRD ANGLE PROJECTION
X°
± 1°
FOR SHEET METAL PARTS ONLY
.X ± .25
.XX ± .10
X°
6
5
4
3
DRAWN BY
DATE
2012/5/25
LIUDEZHI
CHECK
DATE
APPROVED
DATE
TITLE
Reel,
MATERIAL
PS
SIZE
FINAL PROTECTIVE FINISH
SCALE
± 2°
2
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
11
C
1:2
7" x
DRAWING NO.
24
REV
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT
OF CREE INC.
A
C
D
BY
DATE
Released
J.L.
6/30/09
DDS
Match supplier drawing
Zone A6, 2.15 was 2.1, tolerance was ±
Zone C2, Added pocket dimensions.
E
D
DESCRIPTION
.10 .
Zone A6, 2.10 was 2.15
DDS
10/21/10
F
Zone B5, Added tolerance
G
ADDED CATHODE AND ANODE NOTE
DC
Y.Gan
12/2/10 Y.Gan
1/3/11
J.M.
8/26/11
J.M.
DDS
DDS
to 4.39 and 3.75.
XLamp ® XP Family LED Soldering
& Handling
APP'D
2/27/12
Tape and Reel - Continued
XP-C, XP-E, XP-G
1.50 +.10/-00
1.50 +.10/-.00
C
4.39 +.10/.00
1.75 ±.10
4.00 ±.10
2.00 ±.10
B
3.75 +.10/-.00
B
CATHODE SIDE
12.00 Nominal
12.30 Max
10.25 ±.10
Do
B
1.5
5
±
P2
2.0 ±0.05 (I)
0.0
8.00 ±.10
Po
4.0 ±0.1 (II)
ANODE SIDE
Y
5
1.50 +.10/-.00
P2
2.0 ±0.05 (I)
E1
1.75 ±0.1
T 0.30 ±0.05
1.5
5
Do± .10 ±0.
.30
05
T 0.30 ±0.05
5.50 ±.10
Y
4.39 +.10/-.00
3.75 +.10/-.00
REF
4.375
Bo
SECTION B-B
A
Y
THIRD ANGLE PROJECTION
R
0.2mm
P1
1.5 MIN.
SECTION Y-Y
T 0.30 ±0.05
Do
1.5
5
4
6
2.2
D1 Torch, XP-G2, XP-G3
XP-E High Efficiency White, XP-E2, XP-E2
5
4
P2
2.0 ±0.05 (I)
±0.
0
CATHODE SIDE
SECTION X-X
REF
4.375
X
+/- 0.1
+/- 0.1
+0.0/-0.1
+/- 0.05
DATE
APPROVED
DATE
P1
ANODE SIDE
Ao
REF 0.59
Ao
SIZE
FINAL PROTECTIVE FINISH
SCALE
1.6
+/- 0.1
F(III)
SHEET
4.000
1
Ao
3.70
+/- 0.1
Bo
Ko
F
3.70
2.40
5.50
8.00
12.00
+/- 0.1
+0.0/-0.1
+/- 0.05
P1
W
(III)
Bo
Ko
F
3.70
2.40
5.50
8.00
12.00
+/- 0.1
+0.0/-0.1
+/- 0.05
P1
W
(III)
(IV)
REV.
2402-00003
2
(IV)
(II)
Fax (919) 313-5558
DRAWING NO.
C
+/- 0.1
+0.3/-0.1
Measured from centerline of sprocket hole
to centerline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20.
Measured from centerline of sprocket
hole to centerline of pocket.
Other material available.
+/- 0.1
+0.3/-0.1
(I)
3.70
Phone (919) 313-5300
Carrier Tape, XPE
MATERIAL
SECTION X-X
Ao
4600 Silicon Drive
Durham, N.C 27703
TITLE
(II)
4
2.2
3.70
D1
2.40
1.5 MIN.
5.50
8.00
12.00
Y
R
3.70
Bo
Ko
F
P1
W
CHECK
(I)
REF
SECTION Y-Y
Ao
D1
1.5 MIN.
6/30/09
W
Bo
X
R0.2
TYPICAL
Ko
D. Seibel
REF 0.59
SURFACE FINISH:
3
Po
4.0 ±0.1 (II)
Y
5
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
Y
DATE
DRAWN BY
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
SECTION Y-Y
REF
R0.2
TYPICAL
Notes:
Ko tolerance ±
1. 10 sprocket hole pitch cumulative
X
X
Note:
1. 10 sprocket hole pitch cumulative tolerance ±0.2 mm
R0.2
TYPICAL
Ko
R
2.10 +.10/-.00
F(III)
Bo
E1
1.75 ±0.1
REF
8.7°
4.375
Measured from centerline of sprocket hole
to centerline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20.
Measured from centerline of sprocket
hole to centerline of pocket.
Other material available.
+/- 0.1
+0.3/-0.1
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
12
G
OF
1 /1
XLamp ® XP Family LED Soldering & Handling
6
5
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
OF CREE INC.
66
Tape and Reel - Continued
55
NOTICE
NOTICE
CREE
CONFIDENTIAL.
THIS
PLOT
AND
THE
INFORMATION
CREE
CONFIDENTIAL.
THIS
PLOT
AND
THE
INFORMATION
CONTAINED
WITHIN
ARE
THE
PROPRIETARY
AND
6
CONTAINED
WITHIN
ARE
THE
PROPRIETARY
AND
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS
PLOT
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS
PLOT
NOTICE
MAY
NOT
BE
COPIED,
REPRODUCED
OR
DISCLOSED
TO
ANY
MAY NOT BE COPIED, REPRODUCED OR
DISCLOSED
TO
ANY
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
D UNAUTHORIZED
UNAUTHORIZED
PERSONWITHOUT
WITHOUT THE
THE
WRITTEN
CONSENT
PERSON
WRITTEN
CONSENT
CONTAINED WITHIN ARE THE PROPRIETARY AND
OF
CREE
INC.
OF
CREE
INC.
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
2.00 [.079]
P2
4.00 [.157]
2.00 [.079]
[.079]
2.00
Po
P2
P2
33
4
Ø1.50
Ø1.50
+.10
+.10
-.00
-.00
2.00 [.079]
CATHODE
P2 SIDE
4.00 [.157]
[.157]
4.00
Po
Po
44
4.00 [.157]
Po
1.75 [.069]
E1
Ø1.50
+.10
-.00
1.75 [.069]
E1
CATHODE SIDE
Ø1.50
5.50
[.217]F
5.50
[.217]F
[.059]
D1
MIN
Ø1.50
Ø1.50
[.059]
[.059]
D1
D1
MIN
MIN
C
CC
ANODE SIDE
8.00 [.315]
P
ANODESIDE
SIDE
ANODE
B
Bo Ao-Ao
Ko Bo-Bo
3.60mm
mm[.142"]
[.142"]
3.60
3.00 mm
Ao - [.118"]
3.60 mm [.142"]
3.60mm
mm[.142"]
[.142"]
3.60
Ko-Ko
[.142]
3.00
mm
[.118"]
3.00
mm
Ko3.60
-[.118"]
3.00 mm [.118"]
3.0
°
POCKET SIZE
Bo -
10.25
[.404]
E2
12.30 [.484]
12.00
[.472]
12.00
[.472]
MAX
5.50
[.217]F
NOMINAL
NOMINAL
W
10.25
10.25
[.404]
[.404]
E2
E2
12.30[.484]
[.484]
12.30
Ø1.50
MAX
MAX
[.059]
D1 WW
3.60 [.142]
[.142]
3.60
3.0 °
Bo
Bo
3.0° °
3.0
12.00 [.472]
NOMINAL
10.25
[.404]
E2
8.00 [.315]
P
3.0 °
3.60 mm [.142"]
Bo
XP-L High Density,
C
3.60 [.142]
Bo
MIN
.30 [.012]
T
3.00 [.118]
Ko
.30 [.012]
T
.30 [.012]
[.012]
.30
TT
3.00 [.118]
Ko
Anode Side
B
B
3.00 [.118]
[.118]
3.00
3.0 °
Ko
Ko
BB
C
CC
12.30 [.484]
MAX
W
ANODE SIDE
8.00 [.315]
[.315]
8.00
PP
B
3.60 mm [.142"]
POCKET
SIZE
POCKET
3.60
mmSIZE
[.142"]
12.00 [.472]
NOMINAL
5.50 [.217]F
C
All dimensions in mm [in]
Ao -
1.75 [.069]
[.069]
1.75
E1
E1
CATHODESIDE
SIDE
CATHODE
POCKET SIZE
3
Ø1.50
+.10
-.00
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
OF CREE INC.
D
3
5
XP-L High Density, XP-L2
DD
4
BB
3.0° °
3.0
3.60 [.142]
Ao
A
POCKET SIZE
3.60 [.142]
Ao
Ao -
A
XP-L High Intensity
AA
4.00 [.157]
Po
6
4.00 [.157]
[.157]
4.00
Po
Po
66
3.60 [.142]
[.142]
3.60
Ao
Ao
2.00 [.079]
P2
2.006[.079]
[.079]
2.00
5
P2
P2
CATHODE SIDE
Ø 1.50
+.10 +.0039
THIRD ANGLE PROJECTION
-.00[.0591-.0000]Do
5
4
1.75 [.069]
+.10 +.0039
3
THIRD
ANGLE
PROJECTION
THIRD
ANGLE
PROJECTION
1.504+.10 +.0039
-.00[.0591-.0000]Do
ØØ1.50
E1 -.00[.0591-.0000]Do
3.70 mm [.146"]
POCKET SIZE
SIZE
POCKET
Bo - 3.70 mm [.146"]
Ao -- 3.70
3.70 mm
mm [.146"]
[.146"]
Ao
Carrier Tape, XPL
Carrier Tape, XPL
Ko - 1.20 mm [.047"]
2402-00040
C SIZE
Bo -- 3.70
3.70 mm
mm [.146"]
[.146"] POCKET
Bo
2402-00040
C
A
Ko -- 1.20
1.20 mm
mm [.047"]
[.047"]
Ko
Ao Carrier
-CarrierTape,
3.70
mm [.146"]
Tape,XPL
XPL
FOR SHEET METAL PARTS ONLY
UNLESS
OTHERWISE
SPECIFIED
UNLESS
OTHERWISE
SPECIFIED
.X
± ARE IN
1.5
DIMENSIONS
DIMENSIONS
ARE
IN
.XX ±
.75
MILLIMETERS
AND AFTER
FINISH.
MILLIMETERS
AND
.XXXAFTER
± FINISH.
.25
TOLERANCE
SPECIFIED:
TOLERANCE
UNLESS
X°UNLESS
± SPECIFIED:
.5 °
.25
.XX.XX ± ± .25
1.6
SURFACE
FINISH:
.XXX
.125
.XXX
± ± .125
X°X° ± ± .5 .5
° °
FOR
SHEET
METAL
PARTS
ONLY
FOR
SHEET
METAL
PARTS
ONLY
.X .X ± ± 1.51.5
.XX.XX ± ± .75.75
.XXX ± ± .25.25
.XXX
X°X° ± ± .5 .5
° °
4.00 [.157]
Po
ANODE SIDE
8.00 [.315]
ANODE
SIDE
P SIDE
ANODE
8.00 [.315]
[.315]
8.00
PP
ANODE SIDE
8.00
3.0° [.315]
P
3.70 [.146]
Ao
FOR SHEET METAL PARTS ONLY
MATERIAL
DATE
DRAWN
DATE
DRAWN
BY BY
.X
±
1.5
.XX ±
.75
CRONIN
5/16/14
D. D.
CRONIN
5/16/14
.XXX ± SIZE
.25
CHECK
DATE
CHECK
DATE
X°
±
.5 °
FINAL PROTECTIVE FINISH
SURFACE FINISH:
DATE
DATE
APPROVED
APPROVED
3
MATERIAL
MATERIAL
1.20 [.047]
Ko
D. CRONIN
5/16/14
DATE
APPROVED
DATE
4600 Silicon Drive
Durham, N.C 27703
Phone (919) 313-5300
Phone (919) 313-5300
Fax (919) 313-5558
Fax (919) 313-5558
4600
Silicon
Drive
4600
Silicon
Drive
Durham,
27703 REV.
Durham,
N.CN.C
27703
Phone
(919)
313-5300
Phone
(919)
313-5300
1.000
(919)
313-5558
FaxFax
(919)
313-5558
2
1.000
REV.
DRAWING NO.
SIZE
DRAWING
NO.
FINAL PROTECTIVE
FINISH
SCALE
SCALE
TITLE
TITLE
A
A
MATERIAL
1.6
SHEET
OF
SHEET
A
1 /1A
A
OF
1 /1
1
1
C
CBo
SIZE
SIZE
FINAL
PROTECTIVE
FINISH
FINAL
PROTECTIVE
FINISH
4600 Silicon Drive
Durham, N.C 27703
TITLE
SCALE
SCALE
-
3.70 mm [.146"]
AA
REV.
REV.
DRAWING
DRAWING
NO.NO.
Ko -
1.000
1.000
2402-00040
2402-00040
1.20 mm [.047"]
SHEET
SHEET
OF OF
1 /11 /1
11
3.70 [.146]
Bo
3.70 [.146]
[.146]
3.0°
3.70
Bo
Bo
.30 [.012]
T
.30 [.012]
[.012]
.30
TT
3.70 [.146]
Bo
Anode Side
.30 [.012]
T
1.20 [.047]
[.047]
1.20
Ko
Ko
3.0°
3.0°
DATE
DRAWN BY
CHECK
2
1.75 [.069]
[.069]
1.75
SURFACE
FINISH:
SURFACE
FINISH:
2.00
[.079] E1
E1
44
3 3 +.0039
22
+.10
Ø 1.50
-.00[.0591-.0000]Do
P2
3.0°
12.00 [.472]
5.50 [.217]F
NOMINAL
1.75 [.069]
E1
3.0°
3.0°
CATHODE SIDE
10.25
12.30[.472]
[.484]
12.00
[.472]
12.00
[.404]
MAX
5.50
[.217]F
5.50
[.217]F
NOMINAL
NOMINAL
Ø 1.50
E2
W
[.059]
10.25
10.25
12.30[.484]
[.484]
12.30
D1
[.404]
[.404]
MAX
MAX
12.00 [.472]
1.50
ØØMIN
1.50
E2 5.50 [.217]F
E2
W
W
NOMINAL
[.059]
[.059]
D1
D1
10.25
12.30
[.484]
MIN
MIN
[.404]
MAX
Ø 1.50
E2
W
[.059]
D1
MIN
1.61.6
55
CATHODESIDE
SIDE
CATHODE
DATE
DRAWN BY
UNLESS OTHERWISE SPECIFIED
UNLESS OTHERWISE SPECIFIED
D. CRONIN
5/16/14 ARE IN
DIMENSIONS
DIMENSIONS ARE IN
MILLIMETERS
CHECK
DATE AND AFTER FINISH.
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XX ±
.25
DATE
APPROVED
.XXX ±
.125
TITLE
.XXX ±
.125
X°
±
.5
°
ANGLE
X° THIRD
±
.5 ° PROJECTION
1.20 [.047]
Ko
3.0°
3.70 [.146]
[.146]
3.70
Ao
Ao
3.70 [.146]
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
Ao
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
13
XLamp ® XP Family LED Soldering & Handling
Packaging & Labels
The diagrams below show the packaging and labels Cree uses to ship XLamp XP Family LEDs. XLamp XP Family LEDs are shipped in tape
loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
14