Clamps
DEVICE CLAMPS
Power Assemblies
DS5405-1.0 November 2000
DEVICE CLAMPS
To achieve optimum performance and ensure safe operation,
disc semiconductor devices require the correct clamping
force to be applied. ( Refer to page 56 or to our application
note on device clamping AN4839 ).
The correct clamping force for a given device can be obtained
from device datasheets and this publication. Dynex
Semiconductor also now offers an even wider range of
clamping devices.
CLAMP NOMENCLATURE
Examples
30504A2-0220-165
165mm tie rods/bolt length required
22kN pre-set load
Drawing size
Drawing number
(100mm centres double side cooled)
31081A3-0027-050
50mm tie rods/bolt length required
2.75kN pre-set load
Drawing size
Drawing number
(175mm centres double side cooled)
The clamp outlines shown on the following pages are
intended to give an overall impression of size and shape,
and they should not be scaled for more detailed design
purposes. Full engineering drawings may be obtain from
the factory.
Telephone the customer service desk on + 44 (0)1522
502901.
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Clamps
CLAMPS - DOUBLE SIDE COOLED
All dimensions shown in mm unless stated otherwise.
When determining the length of tie rods / bolts required, the following can be used as an approximation:
45 + Dim X + 2(heatsink web thickness) + device thickness
Bolts can be supplied in increments of 5mm.
Load (kN)
Dim ‘X’
2.75/3.5/4.5/5.0/5.5
42.6
8.0/9.0
45.5
9.5/10.0/11.0/12.0/12.5/15.0
51.5
31053A3-XXXX-XXX : 75mm centres
Load (kN)
20
30/32/35/43
Dim ‘X’
72
92
Low profile
32/35/43
72
17331A2-XXXX-XXX : 145mm centres
Load (kN)
10/12.5
19.5/22
Dim ‘X’
68
72
30504A2-XXXX-XXX : 100mm centres
Load (kN)
83
Dim ‘X’
110
32101A2-XXXX-XXX : 178mm centres
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Clamps
CLAMPS - SINGLE SIDE COOLED
All dimensions shown in mm unless stated otherwise.
When determining the length of tie rods / bolts required, the following can be used as an approximation:
(1.5 x bolt diameter) + device thickness = Dim X
Bolts can be supplied in increments of 5mm.
Load (kN)
3.0/4.5
5.0/5.5/6.5
7.0/8.0
M6 bolts
Dim ‘X’
24.0
27.0
25.0
Dim ‘Y’
34.0
39.0
39.0
31045A3-XXXX-XXX : 49mm centres
M8 bolts
Load (kN)
Dim ‘X’ Dim ‘Y’
9.0
37.0
50.0
10.0/11.0/12.0/12.5/15.0 43.0
55.0
31051A3-XXXX-XXX : 75mm centres
(G disc package)
M8 bolts
Load (kN)
2.75/3.0/4.5/5.5
8.0
Dim ‘X’ Dim ‘Y’
35.0
50.5
37.0
52.5
31081A3-XXXX-XXX : 75mm centres
(T and E disc packages)
M10 bolts
Load (kN)
Dim ‘X’ Dim ‘Y’
9.0/12.0
70.0
87.0
18.0/19.5/22.0/23.5
74.0
91.0
30502A2-XXXX-XXX : 100mm centres
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Clamps
CUBE CLAMPS
35.3
35.3
27.0
35.3
47.0 square
27.0
20.0
35.3
47.0 square
27.0
35.3
47.0 square
27.0
35.3
47.0 square
All dimensions shown in mm unless stated otherwise.
35.3
35.3
51293A3
BSA
39 max
34 max
60 max
34 max
60 max
34 max
47 ± 1
54 ± 1
47 ± 1
54 ± 1
200 ± 10
200 ± 10
M8
M10
34 max
Ø12.5 ± 0.5
47 ± 1
54 ± 1
47 ± 1
80 max
BSR
BST
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Heatsink requirements for IGBT modules
AN4505
Calculating the junction temperature of power semiconductors
AN4506
Guidance notes for formulating technical enquiries
AN4869
Recommendations for clamping power semiconductors
AN4839
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Clamps
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device
voltages and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use
today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to
satisfy the growing needs of our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly
Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied
selection of pre-loaded clamps to suit all of our manufactured devices. Types available include cube clamps for single
side cooling of ‘T’ 23mm and ‘E’ 30mm discs, and bar clamps right up to 83kN for our ‘Z’ 100mm thyristors and diodes.
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with
flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
customer service office.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Central Europe Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33.
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020.
SALES OFFICES
Central Europe Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33.
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No.DS5405-1 Issue No. 1.0 November 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has
been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor
to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product
or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide
only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability
of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose
failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
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