AIC1660
Switched-Capacitor Voltage Converter
FEATURES
Lowest Output Impedance (Typical 35Ω at
VIN=5V).
Improved Direct Replacement for 7660.
1.5V to 6V Operation.
No External Diode Required.
Simple Conversion of +5V to -5V.
Low Quiescent Current (Typical 36µA at VIN=5V).
High Power Efficiency (Typical 98%)
Boost Pin for Higher Switching Frequency.
Improved SCR Latch-up Protection.
improved direct replacement for the popular 7660
and LTC1044, the main function of the AIC1660
is to convert a positive input voltage in the range
of 1.5V to 6V to the corresponding negative
output voltage in the range of -1.5V to -6V. The
input voltage can also be doubled (VOUT = 2VIN),
divided (VOUT = VIN /2), or multiplied (VOUT =
±nVIN), as shown in application examples.
APPLICATIONS
The chip contains a series DC power supply
regulator, oscillator, control circuitry and four
RS-232 Power Supplies.
Handheld Instruments.
Data Acquisition Systems.
Supply Splitter, VOUT= ±VIN /2.
Operational Amplifier Supplies.
Panel Meter.
The AIC1660 is a monolithic CMOS switched
capacitor voltage converter. Designed to be an
DESCRIPTION
output power MOS switches. The frequency of
oscillator can be lowered by the addition of an
external capacitor to the OSC pin, or the
oscillator may be over-driven by an external
clock.
The boost function is available to raise the
TYPICAL APPLICATION CIRCUIT
oscillator frequency to optimize performance in
specific applications. The “LV” terminal may be
VIN (1.5V to 6V)
1 BOOST
2
10µF
C1
+
3
4
VIN
CAP+
OSC
≤4.5V) operation, or be left floating for input
8
7
+
6
GND
LV
CAP-
5
VOUT
tied to GND to improve low input voltage (VIN
CBYPASS
0.1µF
Required for
VIN ≤4.5V
VOUT=-VIN
voltage larger than 4.5V to improve power
dissipation.
The AIC1660 provides performance superior to
previous designs by combining low output
10µF
C2
impedance, low quiescent current with high
Negative Voltage Converter
losses. The only required external components
AIC1660
+
efficiency, and by eliminating diode drop voltage
are two low cost electrolytic capacitors.
Analog Integrations Corporation
Si-Soft Research Center
3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
DS-1660G-01
122608
1
AIC1660
ORDERING INFORMATION
AIC1660XXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
DIP-8
SOP-8
TOP VIEW
PACKAGE TYPE
N: DIP-8
S: SOP-8
C: COMMERCIAL
P: LEAD FREE COMMERCIAL
G: GREEN PACKAGE
BOOST
1
8
VIN
CAP+
2
7
OSC
GND
3
6
LV
CAP-
4
5
VOUT
Example: AIC1660CSTR
in SOP-8 Package & Tape & Reel Packing Type
(DIP is not available in TR packing type.)
AIC1660PSTR
in Lead Free SOP-8 Package & Tape & Reel Packing Type
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN to GND, or GND to VOUT)
6.0V
Input Voltage on Pin 1, 6 and 7
-0.3V ~ VIN + 0.3V
Operating Temperature Range
-40°C ~ 85°C
125°C
Junction Temperature
Storage Temperature Range
-65°C ~ 150°C
Lead Temperature (Soldering, 10sec)
Thermal Resistance Junction to Case, RθJC
260°C
DIP-8
60°C /W
SOP-8
40°C /W
Thermal Resistance Junction to Ambient, RθJA DIP-8
100°C /W
(Assume no ambient airflow, no heatsink)
160°C /W
SOP-8
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
2
AIC1660
TEST CIRCUIT
1 BOOST
2
10µF
+
C1
VIN
IS
8
+
7
CAP+
VIN
CBYPASS
0.1µF
IL
OSC
6
3 GND
LV
4 CAP-
VOUT 5
COSC
RL
VOUT
C2
10µF
+
ELECTRICAL CHARACTERISTICS
(VIN=5.0V, TA=25°°C, OSC=OPEN, unless otherwise specified.) (Note 1)
PARAMETER
TEST CONDITIONS
SYMBOL
Supply Current
RL = ∞
IS
Minimum Supply Voltage
RL = ∞
VINL
Maximum Supply Voltage
RL = ∞
VINH
IL =20mA,
ROUT
Output Resistance
MIN
TYP
MAX
UNIT
36
70
µA
1.5
V
35
6
V
70
Ω
FOSC =10KHz
COSC=0
Oscillator Frequency
FOSC
Pin 1 Floating or GND
10
Pin 1=VIN
50
Power Efficiency
RL= 5K, FOSC=10KHz
Voltage Conversion Efficiency
RL = ∞
KHz
η
96
98
%
VOUTEFF
98
99.9
%
Note 1: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
3
AIC1660
TYPICAL PERFORMANCE CHARACTERISTICS
100
Power Efficiency (%)
Supply Current (µA)
50
40
30
20
10
90
80
70
60
0
1
2
3
4
5
50
6
Supply Voltage (V)
Fig. 1 Supply Current vs. Supply Voltage
10
20
30
40
50
60
70
80
Fig. 2 Power Efficiency vs. Load Current
2
Output Voltage (V)
Output Voltage (V)
0
Load Current (mA)
-5
-4
-3
1
0
-1
-2
-2
-10
0
10
20
30
40
50
60
70
0
80
Oscillator Frequency, FOSC (KHz)
60
BOOST=VIN
50
40
30
20
BOOST=OPEN
10
5
1
2
3
4
5
6
Supply Voltage, VIN (V)
Fig. 5 Oscillator Frequency vs. Supply Voltage
2
4
6
8
10
12
14
16
Load Current (mA)
Fig. 4 Output Voltage vs. Load Current (VIN=2V)
Load Current (mA)
Fig. 3 Output Voltage vs. Load Current (Vin=5V)
Oscillator Frequency, FOSC (KHz)
35
30
PIN 1=VIN
25
20
15
10
PIN 1=OPEN
5
0
10
100
1000
10000
External Capacitor (Pin 7 to GND), COSC (pF)
Fig. 6 Oscillator Frequency vs. Value of COSC
4
AIC1660
TYPICAL PERFORMANCE CHARACTERISTICS
(Continued)
450
Output Resistance ROUT (Ω)
400
C1=C2=100µF
C1=C2=10µF
C1=C2=1µF
300
200
100
0
0.1
1
100
10
Oscillation Frequency, FOSC (KHz)
Fig. 7
Output Resistance vs. Oscillation Frequency
BLOCK DIAGRAM
6
1
BOOST
7
Oscillator
OSC
÷2
Voltage
Level
Converter
2
6
VIN
CAP+
5
LV
4
Voltage
Regulator
VOUT
CAP-
Substrate
Logic
Network
3
GND
5
AIC1660
PIN DESCRIPTIONS
PIN 1: BOOST - The frequency of oscillator will
be 5 times if boost pin is
connected to VIN.
PIN 6: LV
- If VIN is below 4.5V, LV should
be tied to GND. For VIN greater
than 4.5V, LV can be floating.
PIN 2: CAP+ - To be connected to the positive
side of the flying capacitor.
PIN 7: OSC
- The frequency of oscillator can
be lowered by the addition of an
external capacitor to the OSC
pin. Or the oscillator may be
over-driven by an external clock.
PIN 8: VIN
- Input supply.
PIN 3: GND
- Ground
PIN 4: CAP-
- To be connected to the negative
side of flying capacitor.
PIN 5: VOUT - Negative
output
voltage,
typically connected to a 10µF
capacitor.
APPLICATION EXAMPLES
8
2
VIN
3
3
C1
C2
5
4
Fig. 8 shows the idealized negative voltage
converter.
VOUT=-VIN
7
Fig. 8
Idealized Negative Voltage Converter
VIN (1.5V to 6V)
1 BOOST
2
10µF
C1
+
3
4
CAP+
VIN
OSC
GND
LV
CAP-
VOUT
8
7
+
6
CBYPASS
0.1µF
Required for
VIN ≤4.5V
VOUT=-VIN
5
AIC1660
+
Fig. 9 shows a typical connection, which will
provide a negative supply from an available
positive supply without the need of any
external diodes. The LV pin should be
connect to ground for VIN≤4.5V, or may be
“floated“ for VIN>4.5V.
10µF
C2
VOUT=VIN/2 ± 0.002%
TMIN≤TA≤TMAX
IL<100nA
Fig. 9
Negative Voltage Converter
6
AIC1660
APPLICATION EXAMPLES
1
2
3
4
(Continued)
VIN (1.5V~6V)
BOOS
VIN 8
CAP+
OSC 7
GND
LV 6
CAP-
VOUT 5
Required for
VIN ≤4.5V
CBYPASS
0.1µF
D2
C1
10µF
Fig. 10
VOUT
1N4148 +
+
AIC1660
U1
D1
+
1N4148
Fig. 10 shows a method of voltage doubling.
VOUT=2VIN-2VD. To reduce the voltage
drops across diodes, use Schottky diodes.
C2
10µF
Voltage Doubling
(3 to 12V)
+
C1
10µF
1 BOOST
VIN 8
2 CAP+
OSC 7
3 GND
LV 6
4 CAP-
VOUT 5
An ultra precision voltage divider is shown in
CBYPASS
0.1µF
+
Fig. 11. To achieve the 0.002% accuracy as
Required for
VIN≤4.5V
+
below 100nA. However, with a slight loss in
C2
10µF
Fig. 11
Ultra Precision Voltage Divider
1 BOOST
2 CAP+
+
+
C1
10µF
indicated, the load current should be kept
accuracy, the load current can be increased.
AIC1660
VOUT
VBAT
VIN
VIN 8
OSC 7
3 GND
LV 6
4 CAP-
VOUT 5
VOUT1= VBAT/2
+
AIC1660
A common need in many systems is to
CBYPASS
0.1µF
obtain (+) and ( - ) supplies from a single
Required for
VBAT≤4.5V
VOUT2= -VBAT/2
+
battery or power supply system. Where
current requirements are low, the circuit
shown in Fig. 12 is a simple solution.
C2
10µF
Output
Common
Fig. 12
Battery Splitter
7
AIC1660
PHYSICAL DIMENSIONS (unit: mm)
SOP-8
D
A
h X 45°
E
H
S
Y
M
B
O
L
A
e
SEE VIEW B
SOP-8
MILLIMETERS
MIN.
MAX.
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
A
e
A1
B
4.00
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
0°
8°
θ
C
WITH PLATING
0.25
BASE METAL
GAUGE PLANE
SEATING PLANE
θ
L
VIEW B
Note:
1.Refer to JEDEC MS-012AA.
2.Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 6
mil per side.
3.Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash or protrusion shall not exceed 10 mil per side.
4.Controlling dimension is millimeter, converted inch dimensions
are not necessarily exact.
8
AIC1660
DIP-8
E
D
S
Y
M
B
O
L
GAUGE PLANE
E1
0.38
A1
A
A2
eB
b
D1
b2
e
c
L
A1
WITH PLATING
A
MIN.
MAX.
A
eA
A
DIP-8
MILLIMETERS
BASE METAL
SECTION A-A
5.33
0.38
A2
2.92
4.95
b
0.36
0.56
b2
1.14
1.78
c
0.20
0.35
D
9.01
10.16
D1
0.13
E
7.62
8.26
E1
6.10
7.11
e
2.54 BSC
eA
7.62 BSC
eB
L
10.92
2.92
3.81
Note:
1.Refer to JEDEC MS-001BA.
2.Dimension D, D1 and E1 do not include mold flash or
protrusions. Mold flash or protrusion shall not exceed 10 mil.
3.Controlling dimension is millimeter, converted inch dimensions
are not necessarily exact.
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its
use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems
are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform,
when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant
injury to the user.
9