Edwards Thermal Evaporator
Standard Operating Procedure
NOTE: These instructions are intended for reference only, and will not replace the thorough training required for proper
system operation. Contact an experienced user or clean room staff member with questions or to report a system problem.
1. VERIFY SYSTEM STATUS
You should find the system at high vacuum; the pressure reading on the LCD
display should read “Fine Pumping.”
2. VENT
To vent, first release the bell jar’s latching mechanism located on the hoist to the
left of the bell jar. Press the “Vent” button on the system’s control panel to fill
the chamber with nitrogen. When the system reaches atmospheric pressure, the
seal at the bottom of the bell jar will break and you will hear the nitrogen gas
leaking from the bell jar. Press the “Seal” button to stop the flow of nitrogen gas.
3. CLEAN SYSTEM
Carefully raise the bell jar and rotate it away from the work area. Use a dedicated
vacuum to clean up any debris that has been loosened on the very bottom of the
chamber. Be careful to not touch any lose or small parts and the thickness
monitor.
4. LOAD SAMPLE
Mount your substrate on the adapter plate, as close to the center as possible.
5. LOAD SOURCE MATERIAL
Place your source material in a turret slot. Rotate the dial on the front of the tool
to move the deposition source into the proper evaporation position directly
beneath the closed shutter. To avoid damaging the rotating turret mount, be
careful to only turn the dial in the clockwise direction.
6. CLOSE CHAMBER
Dampen a clean room cloth with IPA and wipe debris from the bell jar’s rubber
seal and from the stainless steel base plate. Also, use this cloth to wipe the face
of the tool’s ammeter to release any static charge build-up. Carefully rotate the
bell jar back into position and lower it to the base plate, then re-clamp the
latching mechanism.
7. EVACUATE CHAMBER
Press the “Cycle” button on the control panel to begin the pumping process. To
assure that the system is evacuating properly, remain with the tool at least until
the control panel display changes from “Roughing” to “Fine Pumping”. As a
courtesy to other users, set the attached “status” flag to indicate that the system is
in use.
After the system has reached fine pumping, you may fill the LN2 trap; it is best
to wait till the system reaches a pressure below 9x10-6 Torr.
8. SET DEPOSITION PARAMETERS
If you haven’t yet done so, you must now swipe into the card reader to activate
the tool’s power supply. Assure that the correct material data (layer, density, and
tooling factor) have been entered into the rate monitor control panel and that the
source turret is correctly positioned. Use the “Data” button to scroll through
menu items and the up and down arrows to adjust values.
9. TURN ON POWER
Turn on the power supply by turning the voltage selector switch to “LT”; the
green light will turn on. The “LT Selector” switch should not be touched and
always remains at the “10V B” position.
10. DEPOSIT
Slowly increase the current by rotating the power supply dial until the desired
deposition rate is reached. Be sure to rotate the dial slowly; increase the power at
a rate no faster than an increment of 0.5 every 30 seconds.
When the desired deposition rate is reached, begin deposition. Simultaneously
open the shutter and zero the rate monitor by pressing the “Run” button on the
rate monitor control panel.
Monitor the deposition rate and pressure during the deposition. Adjust the current
as necessary to maintain the desired deposition rate and reduce pressure spikes.
11. POWER DOWN SYSTEM
When the desired film thickness has been reached, close the shutter. Slowly
reduce the source current to zero at a rate no faster than an increment of 0.5
every 30 seconds. Turn the voltage supply off by returning the voltage switch
from the “LT” to “O” position.
12. RETRIEVE SAMPLE
Allow the tool’s internal electrodes to cool for at least 5 minutes. Vent the system
as before, by releasing the latching clamp and pressing the “Vent” button.
Carefully raise the bell jar and rotate it away from the work area.
Use caution – and perhaps a pair of pliers – when removing your source material
as the electrodes may still be hot. Remove your coated sample and replace the
sample mounting plate in the holder.
13. CLEAN AND PUMP DOWN SYSTEM
LEAVE THE SYSTEM AS YOU FOUND IT. Clean the system of loose metal
flakes with the vacuum cleaner as you did prior to deposition. Wipe the bell jar’s
rubber seal with an IPA-dampened cloth. Carefully return the bell jar to its
operational position, set the latching clamp, and evacuate the chamber by
pressing the “Cycle” button on the control panel.
Before leaving the tool, assure that it is in “Fine Pumping” mode, set the status
flag to “Not in Use,” and punch out of the system’s card reader. Complete your
entry in the tool’s log sheet.