13th International Workshop on
Advanced Infrared
Technology & Applications
PROCEEDINGS
September 29- October 2, 2015
Area della Ricerca CNR
Pisa, Italy
ISBN: 978-88-7958-025-0
Fondazione “Giorgio Ronchi”, Firenze
CNR-ITC, Sez. di Padova
CNR-IFAC “Nello Carrara”, Firenze
CNR-ISTI “Alessandro Faedo”, Pisa
13th International Workshop on
Advanced Infrared
Technology & Applications
PROCEEDINGS
Edited by: Laura Ronchi, Paolo Bison, Mario D’Acunto, Davide Moroni, Valentina
Raimondi, Ovidio Salvetti, Xavier Maldague, Antoni Rogalski, Takahide Sakagami,
Marija Strojnik
General Chair
L. Ronchi Abbozzo
Co-Chairs
P. Bison, CNR-ITC, Padova, Italy
M. D’Acunto, CNR-ISM, Rome, Italy
X. Maldague, Laval University, Quebec, Canada
D. Moroni, CNR-ISTI, Pisa, Italy
V. Raimondi, CNR-IFAC, Firenze, Italy
A. Rogalski, Military University of Technology, Warsaw, Poland
T. Sakagami, Osaka University, Osaka, Japan
M. Strojnik, CIO, Leon Gto, Mexico
Scientific Committee
D. Balageas, ONERA, France
C. Corsi, CREO, Italy
E. Dereniak, Univ. of Arizona, USA
C.T. Elliott, Heriot-Watt Univ., Scotland.
C. Maierhofer, BAM, Germany
C. Meola, Univ. of Naples, Italy
G. Paez, CIO, Mexico
I. Pippi, CNR-IFAC, Italy
H. Rutt, Southampton University, UK
O. Salvetti, CNR-ISTI, Italy
J.L. Tissot, ULIS, Veurey Voroize, France
V.P. Vavilov, Tomsk University, Tomsk, Russia
H. Zogg, ETH, Zurich, Switzerland
Organizing &Technical Secretariat
F. Pardini, CNR-ISTI, Italy
A.M. Meriggi, Fondazione “Giorgio Ronchi”, Firenze, Italy
E. Ricciardi, C.O.C.E.S., Italy
M. Tampucci, CNR-ISTI, Italy
M. Volinia, Politecnico di Torino, Italy
Table of Contents
Session: Systems and applications in near-, mid- and far-infrared - Part I
C. Corsi
Infrared sensors' history in Italy
2
Yingjie Ma, Yonggang Zhang, Yi Gu, Xingyou Chen, Li Zhou, Suping Xi, Hsby Li
and Aizhen Li
Control the operating voltage and gain slope of InAlAs/InGaAs avalanche
photodetectors
3
Songmin Zhou, Bin Weng and Chun Lin
The PN junction width of HgCdTe conversed through ion implantation and ion beam
etching
6
Session: Systems and applications in near-, mid- and far-infrared - Part II
Michal Švantner, Zdeněk Veselý and Lukáš Muzika
Depth limits of flash-pulse IRNDT method for low- and high-diffusivity materials
11
A. G. Unil Perera, Yan-Feng Lao, L. H. Li, S. P. Khanna and E. H. Linfield
Tunable hot-carrier photodectectors
Zhizhong Bai, Chen J., Xu Zh., Zhou Y., Xu G. and Zhu H.
Investigation of High Quantum Efficiency Resonant Cavity Enhanced InAs/GaSb type II
Superlattice Long Wavelength Infrared Detectors
16
20
Session: Aerospace and industrial applications
Louis-Daniel Théroux, Jean Dumoulin and Erick Merliot
Automatic installation of thermoplastic CFRP monitored by infrared thermography for
pipelines
24
Eric Johnson and Yong Kim
Thermographic Testing of Microwave Circulator Adhesive Bonds
28
Donatella Guzzi, Cinzia Lastri, Vanni Nardino, Lorenzo Palombi, Ivan Pippi,
Valentina Raimondi and Alessandro Barducci
Compressive sensing and its potential for infrared applications
32
Daiki Shiozawa, Tsuyoshi Inagawa, Atsushi Akai and Takahide Sakagami (invited
lecture)
Accuracy improvement of dissipated energy measurement and fatigue limit estimation by
using phase information
36
V
Session: Environmental monitoring - Part I
Veronica Redaelli, Gaia Dominique Bariffi, Silvia Mazzola, Raffaella Rossi,
Leonardo Nanni Costa and Fabio Luzi
Infrared termography (IRT) in horses trained for endurance races
41
Alessandro Bortolin, Paolo Bison, Gianluca Cadelano, Giovanni Ferrarini, Lei Lei
and Xavier Maldague
Mapping the heat flux of an insulated small container by infrared thermography
45
Susana Lagüela, Natalia Caparrini and Luján López
Evaluation of infrared thermography as standalone technique for detection of sedimentpollution in water
49
Francesco Salamone, Ludovico Danza, Italo Meroni and Maria Cristina Pollastro
Design and optimization through thermography: nEMoS architecture
53
Matteo Ghellere, Alice Bellazzi, Lorenzo Belussi and Italo Meroni
Urban monitoring from infrared satellite images
59
Session: Environmental monitoring - Part II
M. Miguel Valero, Oriol Rios, Elsa Pastor and Eulàlia Planas
Automatic detection of wildfire active fronts from aerial thermal infrared images
63
Fabio Sansivero and Giuseppe Vilardo
Advances in automated processing of thermal infrared images from Osservatorio
Vesuviano TIR permanent surveillance network at Campi Flegrei (Pozzuoli, Italy)
68
Atsushi Hashimoto, Ken-Ichiro Suehara and Takaharu Kameoka
Applications of infrared spectroscopic techniques to quality evaluation in agriculture
and food process
72
Barbara Bukowska-Belniak, Andrzej Leśniak and Daniel Kessler
Thermographical monitoring of leak processes in embankments
Rebecca Whetton, Toby Waine and Abdul Mouazen
A practical approach to In-situ hyperspectral imaging of wheat crop canopies
76
Marc-André Gagnon, Pierre Tremblay, Simon Savary, Marc Duval, Vincent
Farley, Philippe Lagueux, Éric Guyot and Martin Chamberland
Airborne thermal infrared hyperspectral imaging for mineral mapping
83
79
Session: Advanced technology and materials - Part I
Małgorzata Kopytko and Antoni Rogalski (invited lecture)
87
HgCdTe barrier infrared detectors
Yoshifumi Ohbuchi, Nobuaki Nagatomo and Hidetoshi Sakamoto
91
Thermal image analysis of plastic deformation and fracture beaviors by thermo-video system
Hai Zhang, Wolfgang Holub, Ulf Hassler and Xavier Maldague
95
Micro-laser Line Thermography and High Resolution X-ray Tomography on Micro-porosities: A
Comparative Study of Experiments and Simulation
VI
Jianxin Chen, Zhicheng Xu, Yi Zhou, Fangfang Wang, Jiajia Xu and Li He
99
LWIR InAs/GaSb Superlattice Photodiodes with Different Barrier Structures
Session: Biomedical applications - Part I
Mario D'Acunto, Antonio Cricenti, Marco Luce, Davide Moroni and Ovidio Salvetti
103
NIR window and Near-Field detection of gold nanoshells
Steffen Frahm, Carsten Dahl Mørch, Ole Kæseler Andersen and Lars Arendt-Nielsen
107
Temperature controlled laser stimulator for pain research
Marco Gargano, Nicola Ludwig, Athos Trecroci, Damiano Formenti, Andrea Bosio,
Ermanno Rampinini and Giampietro Alberti
111
Skin temperature dynamics during an incremental maximal test in elite male cyclists
Session: Advanced technology and materials - Part II
Alessandro Tredicucci (invited lecture)
114
Graphene-based devices for Terahertz photonics
Elżbieta A Pieczyska, Maria Staszczak, Michał Maj, Katarzyna Kowalczyk-Gajewska,
Dominik Kukla, Hisaaki Tobushi and Shunichi Hayashi
115
Infrared thermography analysis of thermomechanical shape memory polymer behavior – initial
loading stage
A. Amato, A.S. Aricò, M. Lo Faro, R. Montanini, S.A. Piccolo, A. Quattrocchi, G. Squadrito,
S. Trocino and S.C. Zignani
119
Infrared thermography applied to solid oxide fuel cells at operating temperatures
Mustafa Hostut, Yuksel Ergun, Sezai Elagoz, Abidin Kilic, Tunay Tansel and Atilla Aydinli
123
Electrical Performance of N-Structure T2SL Photodetectors
Antonio Cricenti and Marco Luce
127
Infrared scanning near-field optical microscopy in material science and biology
Pawel Madejczyk, Waldemar Gawron, Piotr Martyniuk, Artur Keblowski, Wioletta Pusz,
Jaroslaw Pawluczyk, Malgorzata Kopytko, Antoni Rogalski and Jozef Piotrowski
129
The focus on engineering steps for high temperature HgCdTe photodiodes optimization.
Session: Biomedical applications - Part II
Chi-En Lee and Chung-Ming Chen
133
The automated marker-free longitudinal IR breast image registration algorithm
Cuc Stanca, Prodan Doina, Sarosi Codruta, Saplontai Aniela, Silaghi-Dumitrescu Laura,
Prejmerean Vasile and Moldovan Marioara
138
Degradation of some experimental dental composite materials
Mihaela Streza, Dorin Dadarlat, Doina Prodan, Ioana Hodisan, Cristina Prejmerean and
Stanca Boboia
142
Adhesion studies of dental sealants to enamel by using optical microscopy and lock-in infrared
thermography
VII
Cristina Prejmerean, Doina Prodan, Mihaela Vlassa, Tinca Buruiana, Loredana Colceriu
and Marioara Moldovan
147
Influence of composition and light curing modes upon the degree of conversion of dental giomers
evaluated by FTIR spectroscopy
Bardia Yousefi, Julien Fleuret, Seyed Alireza Ghaffari, Simon Fréchet, Félix Labrie
Larrivée, Marcelo Sung Ma Jo, Xavier Maldague and Raymon Watts
152
Unsupervised Automatic tracking of Thermal changes in Human Body
Session: Advanced technology and materials - Part III
Marija Strojnik and Gonzalo Paez (invited lecture)
157
Propagation of thermal pulse in tissue
Rosa De Finis, Davide Palumbo, Francesco Ancona and Umberto Galietti
162
New thermal method to assess endurance limit of stainless steels
Changzhi Shi, Chun Lin, Yanfeng Wei, Lu Chen, Mingxing Zhu and Quanzhi Sun
167
Barrier Layer Induced Channeling Effect of As Ion-implantation in HgCdTe and Its Influences on
Electrical Properties of p-n Junctions
Konstantin Petrosyants and Igor Kharitonov
171
Analysis of temperature-current rise in modern pcb traces by means of thermography
Valeri Kotelnikov and Elena Ryazanova
175
Method of 3d solar energy conversion
Changzhi Shi, Chun Lin, Yanfeng Wei, Lu Chen, Mingxing Zhu and Quanzhi Sun
179
Influences of Ion Beam Current on Dopant Profiles and Barrier Layer Induced Channeling Effect
in Arsenic Implanted HgCdTe Epilayer
Session: Biomedical applications - Part III
Trabelsi Hedi, Elkadri Noomene and Sediki Ezeddine
183
Detection of abnormalities under skin tissue by thermography
Maryam Asrar and Amin Al-Habaibeh
186
A comparison between Visual, Near-infrared and Infrared Images for the Detection of Veins
Renée Lampe, Blumenstein Tobias, Varvara Turova and Ana Alves Pinto
190
Sensomotor waistcoat – a helpful tool for blind people and children with cerebral palsy to support
space perception and improve body scheme
Slokom Nesrine, Zghal Imen and Trabelsi Hedi
194
Detection and Quantification of Macular Edema from Optical Coherence Tomography Images
Bushra Jalil, Ovidio Salvetti, Valentina Hartwig , L. Potì and A. L’Abbate
201
Infrared imaging to study hand skin microcirculation in healthy and systemic sclerosis volunteer
Session: Image processing and data analysis - Part I
Simone Boccardi, Carosena Meola and Giovanni Maria Carlomagno
206
Measurements with a QWIP infrared camera: signal treatment and noise correction
VIII
Piotr Hellstein and Mariusz Szwedo
210
IR3D Analysis - three-dimensional imaging in active thermography and non-destructive testing
Gerhard Traxler and Amirreza Baghbanpourasl
214
Monitoring of the cross wedge rolling process by thermographY
Olivier Janssens, Lothar Verledens, Raiko Schulz, Veerle Ongenae, Kurt Stockman, Mia
220
Loccufier, Rik Van de Walle and Sofie Van Hoecke
Infrared and Vibration Based Bearing Fault Detection Using Neural Networks
Session: Non destructive test and evaluation - Part I
Kwang-Hee Im, Je-Woung Park, In-Young Yang, Jeong-An Jung, David K. Hsu and Sun-
224
Kyu Kim
Characterization of terahertz penetration and applications for composite materials
Takahide Sakagami, Daiki Shiozawa, Yoshitaka Tamaki, Hiroki Ito, Akihisa Moriguchi,
Tatsuya Iwama, Kazuyoshi Sekine and Teruya Shiomi
229
Nondestructive detection of corrosion damage under corrosion protection coating using infrared
thermography and terahertz imaging
Henrique Fernandes, Clemente Ibarra-Castanedo and Xavier Maldague
234
Carbon fiber composites inspection and defect characterization using active infrared
thermography
Eva Barreira, Elton Bauer, Niubis Mustelier and Vasco P. Freitas
242
Measurement of materials emissivity – Influence of the procedure
Session: Non destructive test and evaluation - Part II
Fariba Khodayar, Saeed Sojasi and Xavier Maldague
Infrared Thermography and NDT: 2050 Horizon
246
Rachael Tighe, Janice Dulieu-Barton and Simon Quinn
247
Stress based NDE using infrared thermography
Hirotaka Tanabe, Yui Izumi, Takayuki Hibino, Tohru Takamatsu and Takahide Sakagami
251
Study on heat generation behaviors in Sonic-IR method
Giovanni Ferrarini, Alessandro Bortolin, Gianluca Cadelano and Paolo Bison
255
Thermal response measurement of building insulating materials by infrared thermography
Session: Systems and applications for the cultural heritage - Part I
Stefano Sfarra, Paolo Bison, Alessandro Bortolin, Gianluca Cadelano, Giovanni Ferrarini,
Domenica Paoletti, Clemente Ibarra-Castanedo, Xavier Maldague and Fabio Peron
259
Solar loading thermography for architectural heritage surveys: plumb the depth by looking at the
façade
Iole Nardi, Stefano Sfarra, Dario Ambrosini, Donatella Dominici and Elisa Rosciano
263
Complementarity of terrestrial laser scanning and IR thermography for the diagnosis of cultural
heritage: the case of Pacentro castle
IX
Fabrizio Clarelli, Gabriele Inglese and Paolo Bison
267
Thermography for depth profiling in cultural heritage
Session: Non destructive test and evaluation - Part III
Paul Toasa and Thomas Ummenhofer
270
Lock-in thermography applied to real time crack detection in constructional steelwork
Yui Izumi, Hirotaka Tanabe, Takayuki Hibino, Tohru Takamatsu and Takahide Sakagami
275
Development of new sonic-ir method using ultrasonic wave inputted through water
Patrizia Aversa, Umberto Galietti, Vincenza Luprano, Davide Palumbo, Cristina Racioppo
and Rosanna Tamborrino
279
Comparison between thermographic and heat flux meter technique: a case study
Mohamed El Afi and Sougrati Belattar
283
Infrared thermography applied to characterization of a pipe internally and externally corroded
Waldemar Swiderski
288
Detecting Defects in Marine Structures by Using Eddy Current Infrared Thermography
Sofie Van Hoecke, Olivier Janssens, Raiko Schulz, Kurt Stockman, Mia Loccufier and Rik
Van de Walle
291
Towards thermal imaging based condition monitoring in offshore wind turbines
Session: Systems and applications for the cultural heritage - Part II
Stefano Sfarra, Eleni Cheilakou, Panagiotis Theodorakeas, Domenica Paoletti and Maria
Koui
296
An eye to the future, an eye to the past, thinking to a full-scale restoration process: physical and
chemical ndt analysis in cooperation
Anna De Falco, Tiziana Santini and Maurizio Sguazzino
300
Applications of the infrared thermography to the assessment of historic buildings: a case study in
Pisa
Marco Gargano, Nicola Ludwig and Elisabetta Rosina
304
Non destructive characterization of thermal and optical properties on high performances textiles
Francesca Pietrarca, Mauro Mameli, Sauro Filippeschi and Fabio Fantozzi
308
Non intrusive wall material recognition through active thermography and numerical modeling
Lorenzo Palombi, Monica Galeotti, Emanuela Massa, Roberto Olmi, Marcello Picollo,
313
Alessia Andreotti, Giovanni Bartolozzi, Marco Bini, Ilaria Bonaduce, Emma Cantisani,
Massimo Chimenti, Maria Perla Colombini, Costanza Cucci, Ute Dercks, Laura Fenelli,
Irene Malesci, Alessandra Malquori, Marco Montanelli, Annalisa Morelli, Sara Penoni,
Louis David Pierelli, Cristiano Riminesi, Sara Rutigliano, Barbara Sacchi, Sergio Stella,
Gabriella Tonini and Valentina Raimondi
The use of IR-based techniques in the PRIMARTE project: an integrated approach to the
diagnostics of the cultural heritage
X
Session: Astronomy and Earth observation
Roberto Bonsignori (invited lecture)
317
Satellite remote sensing of Earth thermal emission for weather, climate and ocean operational
applications
Marija Strojnik and Gonzalo Paez
318
Telescope array for extra-solar planet detection from far side of Moon
Anum R. Barki, Kory J. Priestley and J. Robert Mahan
322
An Initiative to Include Coherence and Polarization in Earth Scene Identification
Graham Ferrier
326
The Potential and Challenges in the use of field-based Fourier Transform InfraRed Spectroscopy
for geological applications
Session: Image processing and data analysis - Part II
Jonathan Gaspar, Michael Houry and Jean-Laurent Gardarein
330
Wide & accurate thermal control of plasma facing component in fusion facility
Qiong Zhang, Frank Ferrie and Xavier Maldague
334
A NSCT-based infrared-visible image fusion approach using fast iterativeshrinking compressed
sensing
Gian Marco Revel, Paolo Chiariotti, Edoardo Copertaro and Giuseppe Pandarese
340
Stationary Wavelet Transform denoising in Pulsed Thermography: influence of camera resolution
on defect detection
Session: Non destructive test and evaluation - Part IV
Paolo Bison, Alessandro Bortolin, Gianluca Cadelano, Giovanni Ferrarini, Lorenzo Finesso
and Ravibabu Mulaveesala
344
Frequency modulated heating source in IR thermography
Nobuhiro Shimoi and Carlos Cuadra
346
Comparison of natural frequencies of vibration for a bridge obtained from measurements with
accelerometers and piezoelectric sensor
Session: Image processing and data analysis - Part III
Gabriele Inglese
350
Perturbations of the heat transfer coefficient due to surface damages
Nebi Gül and Ali Berkol
354
Improvement of predefined electooptical system performance by a mathematical model for image
intensifier tube
Kai He, X. Wang, Chun Lin, Qinyao Zhang and Ruijun Ding
358
Numerical method for the capacitance of HgCdTe MIS structure and band-to-band tunneling
effect on the low frequency behavior in high frequency C-V characteristics
Author Index
363
XI
ANALYSIS OF TEMPERATURE-CURRENT RISE IN MODERN PCB
TRACES BY MEANS OF THERMOGRAPHY
K. Petrosyants1,2, I. Kharitonov1, A.A. Popov1
1
Moscow Institute of Electronics and Mathematics of National Research University
“Higher School of Economics”, eande@miem.edu.ru
2
Institute for Design Problems in Microelectronics, Russian Academy of Sciences
Higher functionality of today’s electronic products demands high density integration of
electronic components. In this field, printed-circuit-board (PCB) are the perspective
technology to build a variety of electronic systems for different applications. Two types of
boards were investigated: high current for power applications and high density boards for
modern electronic equipment. The set of IR images and temperature-current diagrams for
different substrate materials were investigated. Current and temperature limits for all test
boards were defined to provide high level of board reliability.
Introduction
The global trend in the electronic industry
driven by automotive, aerospace, computer,
telecommunication, hand held equipment and
other products is showing up in improved
performance and better human interface. So the
electronic
equipment
is
demanding
miniaturization and function integration. In this
field, printed-circuit-board (PCB) embedding
technology has the potential to play the
important role with the possibility to build a
variety of electronic modules and systems for
different
applications.
However,
miniaturization and function integration
increase the equipment power density and as a
result - increase the operating temperatures of
electronic components and current caring
traces. These factors decrease the reliability and
life time of electronic equipment. So the very
important problem of PCB design is the thermal
analysis to provide the optimal technology
solution.
The thermal effects in active and passive
electronic components were completely
investigated and analyzed [1,2]. But the
physical and technological limitations in
modern PCB copper traces in the context of
their thermal stability are still under
consideration.
A
few
works
where
thermographic technique was used for control
and monitoring of PCB systems were published
[3,4]. The purpose of this work was investigation
and analysis of modern PCB current currying
capacity of traces (CCCT) in dependence of
board materials and trace sizes (thickness, width,
length) to provide high levels of electro-thermal
stability and operating reliability of electronic
systems realized on new boards.
Test boards for thermographic analysis of
temperature-current rise in traces
Two types of test boards [5,6] have been
fabricated and investigated:
1) Test board for high current application (power
supply units, electromechanical, automotive and
other power equipment). The boards (Fig. 1) were
manufactured using FR-4 substrate (of 1.5mm
thickness) with dimensions 100x200 mm2. The
board was manufactured in two versions: with
nominal copper layer thicknesses of 18 and 35 μm
and traces with the different shapes, widths and
lengths.
2) High density boards for modern equipment
(Fig. 2). The boards were manufactured using
perspective substrates: Al2O3 ceramic substrate
(of 500 μm thickness) and aluminium/polymide
(240 μm / 4,0 μm) substrate with dimensions
60x48 mm2. Trace parameters: material Ti-CuNi-Au (0,05-2-0.3-0.2 μm), length L = 1,5 – 28
mm, widths W = 150 - 530 μm.
171
Thermographic analysis of temperaturecurrent rise in test PCB traces
Thermographic analysis of temperature-current
rise in PCB traces was conducted using Flir
A40 IR camera with macro (17 μm resolution)
lens, precise micro positioning system and
specially developed software tool (IRDataProc)
for object emissivity coefficients map
generation and object temperatures correction
[7,8].
Thermal images of all conducting traces of test
boards were investigated in dependence of
electric current. Maximal temperatures of the
traces were defined and plotted as a function of
electric current.
Results for high current test board.
The measured I-T characteristics and IR images
of traces with different shapes, widths and
lengths (see Fig. 1) and Cu layer thickness of 18
and 35 μm values are presented in Fig. 3 – Fig.
4.
It is seen from Fig. 4 that (for the same current
values) trace “G“ has much more higher
temperature values in comparison with the
other traces.
Results for high density test boards (Fig.2).
The measured I-T characteristics and IR images
are presented for different trace widths (Fig. 5),
ceramic and aluminium/polymide substrates
(Fig. 6), trace lengths (Fig. 7).
It is seen from Fig. 6 that ceramic substrate
provides much more better heat removing for
traces in comparison with aluminium/
polyimide substrate.
Analyzing the temperature measurement results
for traces with different lengths in Fig. 7 it is
seen that the maximal length 27.5 mm is limited
by the temperature value of 122.4oC.
Conclusion
Temperature- current characteristics of PCB
conducting traces were measured and analyzed
by means of thermography techniques for two
types of boards: high current for power
applications and high density for modern
electronic equipment.
- Current and temperature limits for traces with
different layer thickness, substrate materials,
trace widths and lengths were defined based on
board reliability.
The
results
allowed
to
provide
recommendations on design of reliable boards for
modern electronic equipment. These results were
used by PCB designers in their projects.
This work was carried out within the
framework of the National Research University
Higher School of Economics’ Academic Fund
Program under grant 15-01-0165 and the Russian
Foundation for Basic Research under grant 1429-09145.
References
1. D. Wolpert, P. Ampadu. Managing temperature effects
in
nanoscale
adaptive
systems,
Springer
Science+Business Media ,2012.
2. A. D. Kraus, A. Bar-Cohen. Thermal Analysis and
Control of Electronic Equipment, Hemisphere
Publishing Corporation, 1983.
3. F. Lehtiniemi, A. Hynninen. Applications of infrared
thermography in electronics research, Nokia Research
Center, 2000.
4. C. R. Wagh, V. B. Baru. Detection of Faulty Region on
Printed Circuit Board With IR Thermography,
International Journal of Scientific & Engineering
Research, Vol. 4, Issue 11, pp. 1-4, 2013.
5. Dr. Johannes Adam, ADAM Research. Thermal
Management of Boards and Current Carrying Capacity
of Trac, Bodo´s Power Systems. Germany, 2011,
http://www.bodospower.com/
6. A. Lese, U. Scheuermann. High Load Current on FR4 Printed Circuit Board – Design Considerations and
Limits, Proceedings of PCIM 2004, pp. 42-47, 2004.
7. K. O. Petrosyants, I. A. Kharitonov, P. A. Kozynko
A.A. Popov. Electronic components thermal regimes
investigation by IR thermography, Proceedings of the
12-the International Workshop on Advanced Infrared
Technology and Applications. Torino : Politecnico di
Torino, pp. 185-189, 2013.
8. K. O. Petrosyants, I. A. Kharitonov, P. A. Kozynko, N.
I. Rjabov. The Multilevel System for Thermal Control
of Electronic Components, Proceedings of the
International Conference on Advances in Computer
Science and Electronics Engineering (CSEE 2014), 0809 March, 2014, Kuala Lumpur, Malaysia. Institute of
Research engineers and Doctors, pp. 150-155, 2014.
172
(a)
(b)
Fig. 2 Structures of modern high density test board: with
ceramic Al2O3 (500 μm) substrate (a) , with aluminium /
polymide (240 / 4,0 μm) substrate (b).
(a)
(b)
Fig. 1 Layouts of high current test board [6] with
different trace structures: top layer (a), bottom layer (b).
(a)
(b)
(c)
(d)
(e)
Fig. 3. I-T characteristics for traces A-D (Fig. 1) with 18 μm (a), 35 μm (b) layer thickness. IR images of the mentioned
traces for 7.5A current and 18 μm thickness (c) –(e).
(a)
(b)
(c)
(d)
(e)
Fig. 4. I-T characteristics for traces E- G (Fig. 1) with 18 μm (a), 35 μm (b) layer thickness ; IR images of traces with the
mentioned structures for 7.5A current and 18 μm thickness (c) –(e).
173
(a)
(b)
(c)
Fig. 5. I-T characteristics (a) for high density traces (see Fig 2) with different widths and IR images (for 2A current) for
trace placed on a polyimide board for the different trace widths of traces (b) – (c ).
(a)
(b)
(c )
Fig.6. I-T characteristics (a) for high density traces (Fig 2) for different substrates; IR trace images (for current of 1.1A) for
trace placed on a ceramic (b) and Al/polyimide (c) substrates .
(a)
(b)
(c )
(d)
Fig. 7. I-T characteristics (a) for high density traces (Fig 2) with different lengths; IR images (for current of 1.2 A) for trace
placed on Al/polyimide substrate for different trace lengths (c)-(d).
174