ERRATUM FOR: SELF-ASSEMBLED
SILICON-BASED CLUSTERS TO DESIGN
EFFICIENT, FAST, AND CONTROLLABLE
FANO SWITCHES
Arash Ahmadivand,1 Saeed Golmohammadi,2
Mustafa Karabiyik,1 and Nezih Pala1
1
Department of Electrical and Computer Engineering, Florida
International University, Miami, FL 33174; Corresponding author:
aahma011@fiu.edu
2
School of Engineering-Emerging Technologies, University of Tabriz,
Tabriz 5166614761, Iran
Received 10 October 2014
2
Department of Electrical and Electronic Engineering, Yonsei
University, 50 Yousei-ro, Seodaemun-ku, Seoul 120-749, Korea
3
Sensor System Research Center, Korea Institute of Science and
Technology, Hwarang-ro-14-gil, Seongbuk-Gu, Seoul 139-791,
South Korea
Received 2 March 2015
In the above-mentioned article, which appeared in Microwave and
Optical Technology Letters, Volume 57#9, DOI 29261, the first
author’s name was listed incorrectly as Junge G. Liang. The correct name is Junge Liang. We regret any confusion that was
caused by our error.
C 2016 Wiley Periodicals, Inc.
V
In the above-mentioned article, which appeared in Microwave
and Optical Technology Letters, Volume 57#5, DOI 29061,
there was an omission of some information in the Acknowledgments section for this article. The corrected Acknowledgments
are shown below:
This work is supported by NSF CAREER program with the
Award number: 0955013, and by Army Research Laboratory
(ARL) Multiscale Multidisciplinary Modeling of Electronic Materials (MSME) Collaborative Research Alliance (CRA) (Grant No.
W911NF-12-2-0023, Program Manager: Dr. Meredith L. Reed).”
We regret any confusion that was caused by this error.
ERRATUM FOR: ON FRACTAL FSS
SUITABLE FOR WLAN AND WIMAX
COMMUNICATION
Arup Ray,1,2 Manisha Kahar,3 Debashree Sarkar,1 and
P. P. Sarkar1
1
Department of Engineering and Technological Studies, University of
Kalyani, Kalyani, West Bengal, India; Corresponding author:
iamarupray@gmail.com
2
Department of Electronics and Communication Engineering, Birbhum
Institute of Engineering and Technology, Suri, West Bengal, India
3
Department of Electronics and Electrical Communication
Engineering, IIT Kharagpur, Kharagpur, West Bengal, India
C 2016 Wiley Periodicals, Inc.
V
Received 30 December 2014
ERRATUM FOR: AN ON-WAFER
EMBEDDED PASSIVE DEVICE USING
CHIP-IN-SUBSTRATE PACKAGING
TECHNOLOGY
Junge Liang,1 Eun Seong Kim,1 Cong Wang,1 Je-Hyun Youn,2
Min Chul Park,3 and Nam Young Kim1
1
RFIC Center, Kwangwoon University, 447-1 Wolgye-dong,
Nowon-ku, Seoul 139-701, Korea; Corresponding author:
nykim@kw.ac.kr
DOI 10.1002/mop
In the above-mentioned article, which appeared in Microwave and
Optical Technology Letters, Volume 57#7, DOI 29132, there was
an omission of some of the figures. The corrected article, in its
entirety, begins on the next page.
We regret any confusion that was caused by this error.
C 2016 Wiley Periodicals, Inc.
V
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS / Vol. 58, No. 1, January 2016
249