NLX3G16
Triple Non-Inverting Buffer
The NLX3G16 MiniGatet is an advanced high−speed CMOS
triple non−inverting buffer in ultra−small footprint.
The NLX3G16 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
www.onsemi.com
Features
•
•
•
•
•
•
•
•
High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
24 mA Balanced Output Source and Sink Capability
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
IN A1
1
8
VCC
OUT Y3
2
7
OUT Y1
IN A2
GND
3
6
4
5
Figure 1. Pinout (Top View)
UDFN8
1.45 x 1.0
CASE 517BZ
1
UDFN8
1.6 x 1.0
CASE 517BY
1
UDFN8
1.95 x 1.0
CASE 517CA
IN A1
1
OUT Y1
IN A2
1
OUT Y2
IN A3
1
OUT Y3
IN A3
OUT Y2
MARKING
DIAGRAMS
Figure 2. Logic Symbol
XM
XM
XM
1
J or AD = Specific Device Code
M
= Date Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
PIN ASSIGNMENT
FUNCTION TABLE
1
IN A1
A
Y
2
OUT Y3
3
IN A2
L
H
L
H
4
GND
5
OUT Y2
6
IN A3
7
OUT Y1
8
VCC
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 2
1
Publication Order Number:
NLX3G16/D
NLX3G16
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
0
0
20
20
10
5
ns/V
VCC
Positive DC Supply Voltage
VIN
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 1.8 V ± 0.18
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
www.onsemi.com
2
NLX3G16
DC ELECTRICAL CHARACTERISTICS
TA = 25 5C
VCC
(V)
Min
Low−Level
Input
Voltage
1.65 to
5.5
0.70 x
VCC
VIL
Low−Level
Input
Voltage
1.65 to
5.5
VOH
High−
Level
Output
Voltage
Symbol
Parameter
VIH
VOL
Low−Level
Output
Voltage
Conditions
VIN = VIH or VIL
IOH = −100 mA
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
VIN = VIH or VIL
IOL = 100 mA
Typ
TA = +855C
Max
Min
Max
TA = −555C to
+1255C
Min
Max
0.70 x
VCC
0.30 x
VCC
V
0.30 x
VCC
0.30 x
VCC
1.65 to .5
VCC −
0.1
VCC
VCC −
0.1
VCC −
0.1
1.65
2.3
2.7
3.0
3.0
4.5
1.4
1.9
2.2
2.4
2.3
3.8
1.50
2.1
2.4
2.7
2.5
4.0
1.4
1.9
2.2
2.4
2.3
3.8
1.4
1.9
2.2
2.4
2.3
3.8
1.65 − 5.5
Unit
V
V
0.1
0.1
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
V
VIN = VIH or VIL
IOH = 4 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
2.7
3.0
3.0
4.5
Input
Leakage
Current
0 v VIN v 5.5 V
0 to 5.5
±0.1
±1.0
±1.0
mA
IOFF
Power−Off
Output
Leakage
Current
VIN or VOUT =
5.5 V
0
1.0
10
10
mA
ICC
Quiescent
Supply
Current
0 v VIN v VCC
5.5
1.0
10
10
mA
IIN
0.2
0.2
0.22
0.28
0.38
0.42
www.onsemi.com
3
NLX3G16
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS)
Symbol
tPLH,
tPHL
Parameter
Propagation
Delay Input A to
Output
VCC
(V)
Test
Condition
1.65−1.95
TA = 25 5C
TA = +855C
TA = −555C to
+1255C
Min
Typ
Max
Min
Max
Min
Max
Unit
RL = 1 MW,
CL = 15 pF
1.8
6.0
7.9
1.8
8.8
1.8
12
ns
2.3−2.7
RL = 1 MW,
CL = 15 pF
1.0
3.0
5.2
1.0
5.8
1.0
9.1
3.0−3.6
RL = 1 MW,
CL = 15 pF
0.8
2.3
3.6
0.8
4.0
0.8
6.5
RL = 500 W,
CL = 50 pF
1.2
3.0
4.6
1.2
5.1
1.2
7.6
RL = 1 MW,
CL = 15 pF
0.5
1.8
2.9
0.5
3.2
0.5
5.5
RL = 500 W,
CL = 50 pF
0.8
2.4
3.8
0.8
4.2
0.8
6.4
4.5−5.5
CIN
Input
Capacitance
5.5
VIN = 0 V or VCC
7.0
pF
CPD
Power
Dissipation
Capacitance
(Note 6)
3.3
5.5
10 MHz
VIN = 0 V or VCC
9
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
A
50%
GND
tPLH
Y
tPHL
50% VCC
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
www.onsemi.com
4
RL
NLX3G16
ORDERING INFORMATION
Package
Shipping†
NLX3G16DMUTCG
UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX3G16EMUTCG
UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX3G16FMUTCG
UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
L
8X
0.26
4
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉ
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.48
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
8X
0.22
L
4
L1
1.18
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
1
PKG
OUTLINE
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
0.35
PITCH
NLX3G16
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
L
8X
0.30
4
1
L1
1.24
8
5
8X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
0.54
NOTE 3
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLX3G16/D