From Technologies to Market
New technologies
& architectures
for efficient
Data Centers
Sample
© 2015
TABLE OF CONTENTS
Report objectives
5
Who should be interested in this report?
6
Traditional
Glossary
8
Modular & containers
Executive summary
10
• Data Centers
28
Drivers
41
Power consumption – Energy efficiency issues
DC grid
• Technical solutions & breakthroughs
128
Server
UPS
Silicon Photonics
Cooling systems
Data & storage challenges
• Supply Chain
69
Memories
Big metrics
• Limitation & Challenges
• Architectures
Wide Band Gap
62
• Conclusion
170
2
COMPANIES CITED IN THE REPORT
Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya, Toshiba, EPC, Samsung, SanDisk,
Micron, Sony, SK Hynix,Violin memory, STEC, Tms, Fusion-io, Eaton Corp., Emerson Electric, Schneider Electric, General Electric,
Belkin Industries, Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data, Airedale, RC Group,
Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz, Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really,
QTS Data Centers, Sabey Data Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!
3
MAIN 4 CHARACTERISTICS
• Huge amounts of data
• Requirements on extremely high (24/7) data availability
and security
•
Increasing need for bandwidth
•
Solutions implemented to ensure “ALWAYS-ON state” - uninterrupted
power supply, redundancy - System resilient to failure and enabling rapid
recovery after failure
•
Interconnexions between servers are done
thanks to being at the same physical site
•
System protected against human and natural detrimental influence
•
Data Centers need to be close to big
urban areas
• Very high electricity consumption
•
•
•
•
A proximity of a point access to very high
electrical power is required
Multi-sourcing is obligatory for safety reasons
Strong trends towards the use of renewable
electricity sources (hydro, PV, wind…)
Ways to reduce the consumption are actively
researched
• High concentration of heat
•
All the concentrated electronics generate huge
amount of heat in a closed space
•
Large cooling systems have to be installed
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
4
POWER REQUIREMENTS
Power needed by the IT equipment
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
5
POWER REQUIREMENTS OF A DATA CENTER
In order to feed the IT equipment, more than double of power is needed
• In a traditional Data Center, about
50% of the power consumption is
used for something else than the IT
loads.
Traditional
Data Centers
are
considered
extremely
inefficient, as
in many cases
less than half
of the power
is used for IT
loads
• This means that to supply the IT
equipment with a power of 60 kW, at
least 150 kW are required. (For a PUE
of 2.5)
PUE = 2.5
• Virtually, every watt expended in a
server room in terms of processing
power, power supplies, lighting, etc. is
turned into heat.
• Thereby, huge amounts of heat have to
be dissipated in a relatively small and
close environment.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
6
RENEWABLE ENERGY SOURCES
Different alternative power sources
• Several projects have been presented using renewable energies to power their data centers:
In order to
reduce the
electricity bill,
Data Centers
are
incorporating
additional
alternative
power
sources
Wind-Powered Data Centers: Only a handful of
companies have implemented wind turbines in
working data centers, but new players have some
ambitious plans in this area.
Solar-Powered Data Centers: Emerson Network
Power, i/o Data Centers and AISO are among the
companies that have implemented on-site solar
solutions.
Waste Heat Reclamation: Most data centers are
already generating an energy source: the heat
emerging from the back of their server racks.
Here’s a look at some facilities that are reusing
this waste heat.
Waste heat from servers at the new Telecity Paris data center (left) is
being used to heat an on-site arboretum (right).
Geothermal Data Centers: A number of data
centers in the Midwest (US) are using geothermal
cooling in their data centers.Then there’s Iceland
and its plentiful supply of geothermal energy.
In the US, there is a potential of >2,000 GW on
geothermal energy
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
7
GLOBAL ENERGY CONSUMPTION
Evolution with a decreasing average PUE
-24%
In the case that
by 2019 PUEs
would decrease
considerably, with
averages
between 1.3-1.5,
the global energy
consumption will
stay stable
(below 400TWh)
until 2020
•
Each hypothesis fix new PUEs by region from the mentioned years on.
•
Each new hypothesis also takes into account the previous hypothesis.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
8
ENTERPRISE STORAGE SUPPLY CHAIN
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
9
F3 & F4 CLASSES
Multi-sourcing and circuit redundancy are the key features of the safest Data Centers
The two safest topologies – class 3 & class
4 – provides different power source
access connections from the grid (multisourcing).
There are (at least) two completely
independent power circuits, with
component redundancy.
•
•
The F3 class does not have a
complete circuit redundancy as
UPSs are used just in one of the two
independent circuits.
The F4 topology guarantees that
every critical load is at least supplied
by two independent and equal
distribution circuits.
Class F3
Not UPSs in every
distribution channel –
Not a complete
redundancy
Class F4 Fault Tolerant
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
10
MARKET SPLIT OF ARCHITECTURES
Which topology is the most widespread?
• F0 and F1 architectures are the most
expanded ones: >95%
Architecture class split by number of sites
• However, they represent server closet
and small rooms which we do not
consider as a Data Center.
• The real Data Center split is here below:
• Multi power sourcing,
circuit redundancy
• Double power source,
UPS redundancy, but
not circuit redundancy
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
11
REDUNDANCY
Redundancy increases the problem of overrating
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
12
CONTAINERS
Modular “Plug & Play” solutions
• Rugged, portable and energy efficient containerized datacenters that provide plug & play datacenter
capacity inside an ISO container in a fast and cost effective way.
Huawei:
-
All-in-one
compact
units
providing a
fully
functional
data center
-
Up to 8x45 servers
Up to 60 kW in IT
Row-level air conditioner
horizontal air supply
120kVA UPS
320sqft (29.7 m2)
IDS1000A-40 container
AST Modular containers:
-
Up to 12x42 servers
Up to 96 kW in power and cooling
N+1 redundancy (power & cooling)
100kVA UPS
320sqft (29.7 m2)
Schneider Electric acquired
AST Modular in 2014
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
13
CONTAINER DATA CENTER MANUFACTURERS
2014 market share
AST
Modular was
bought by
Schneider
Electric in
the
beginning of
2014
-
Other players are:
Sun Microsystems
Verari Forest
Lampertz
Bull
ActivePower
Cisco
etc.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
14
CONTAINER DATA CENTER MARKET
Market estimation in M$ for the period 2010-2020
• From 2014 on, this market will significantly
increase as many Data Center manufacturers
have seen the interest of using these modular
containers.
• Container based Data Centers
had an stable growth in the last
five years.
CAGR 15-20
+23.2%
CAGR 10-14
+11.7%
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
15
DC ARCHITECTURE
From AC to DC power distribution in Data Center
A 10% to 20% energy saving on
the overall Data center is
expected by moving to DC
distribution
Redundant
AC distribution: at least 3 sequential power
conversion stages involving a change from AC to
DC or vice versa
DC distribution removes 2 of the 3
sequential AC-DC/DC-AC power
conversion stages.
Redundant
AC is 400 Vrms in Europe and 120 Vrms or 240 Vrms in the US
DC can be 48V, 326V or 380V depending on the region and the power load
POL: point-of-load
VRM: voltage regulation modules
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
16
ARCHITECTURE COMPARISON
Design
Innovations
AC solutions
DC solutions
Next coming
architectures
Traditional
architectures
Most
innovative
concept are
used in
installations
for outdoor
installations
(higher
power and
less
controlled
environment)
Row level DC
distribution
Increasing
environmental
constraints
Modular AC
systems
In the short-mid
time future
Facility level DC
distribution
Facility level DC
demonstrators
Traditional AC
systems
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
17
DC EQUIPMENT PLAYERS
• Several Data Center equipment suppliers are working on DC voltage solution, even though there is not a market for it yet.
• Special efforts are done at a reliable 400 V DC breaker that would suit with Data Center safety & reliability requirements.
•
So far, 48 VDC and 60VDC breakers are commercially available.
Players involved in the development of DC solutions:
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
18
FOCUS ON MEMORIES
Introduction of the typical memory types in data centers
Working memory
Non-volatile
memories
stock data even
if they are not
supplied by
electricity.
Volatile
memories are
erase without
electricity
supply.
DRAM
Speed
> $1/Gb
Gb capacity
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
19
RRAM CHIP MAXIMUM DENSITY ROADMAP
Stand-alone devices
RRAM
High density
for
enterprise
storage
Chip Maximum
density
10 T b
1T b
RRAM will
start being
used in data
centers from
2015 on as
Storage Class
Memory
(SCM)
100 Gb
Yole Développement © January 2015
3D NAND
Transition
NAND
NAND
substitution in
data centers
Micron/sony
16 Gb
10 Gb
1 Gb
100 Mb
10 Mb
Memory SCM
enterprise storage
applications
Adesto
64 Mb
Attacking the
data storage RRAM
Low
application density for
wearable &
industrial
Year of
commercial
sample
availability
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
20
EMERGING NVM MARKET FORECAST
By application from 2014–2020 (in $M)
CAGR 2014-2020
118%
CAGR 2014-2020
CAGR 2014-2020
118%
118%
85%
154%
85%
35%
85%
154%
21
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
154%
35%
UPS MARKET
>200kVA UPS market dedicated to data centers
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
22
DATA CENTRE NETWORKING
Where optics is cool!
Router ASIC with integrated optics
(Compass-EOS)
Just a few
examples of
photonic
solutions
that will
reduce
power.
AOC (Finisar)
OOO routers (Calient)
Active Optic interconnect
(TE Connectivity)
Hybrid optical/electrical switching (UCSD)
Si photonics and closer integration
(Luxtera)
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
23
WHY SiC & GaN ADDED VALUE?
Intrinsic
properties
High electron
mobility and
high junction
temperature
are the key
intrinsic
characteristics.
High Junction
Temperature
High electron mobility
No recovery time
during switching
Impact on
operation
Impact on
power module
Impact on
power system
less energy to dissipate
High switching
frequency
Fewer cooling
needs
Smaller filters
and passives
Low losses
System size and
weight
reduction
©2015 | www.yole.fr | New technologies & architectures for efficient data centers
24
Market & Technology Report
Data Center Technologies
New Technologies and Architectures for Efficient
Data Centers
An analysis of the trends, market, and opportunities for the next
generation of data centers, including new architectures and technologies.
KEY FEATURES OF THE REPORT
•D
escription of data centers’
global energy consumption
from 2010 - 2020
•The impact of data center
challenges on power
electronics equipment, UPS,
and cooling systems
•Analyses of new architectures
such as Alternative Current
(AC) modular, containers,
and DC grid
•Description of new data center
technologies, i.e. photonic,
emerging NVM, and WBG
•Market metrics by technology,
including regional split, 2010 2020 forecast, market share,
and more
•Supply chain overview,
including players’ market share
by market
REPORT OUTLINE
•N
ew Technologies and
Architectures for Efficient Data
Centers
•P
DF & Excel file
•€
5,990 – Multi user license
(170+ slides)
•€
4,990 – One user license
(170+ slides)
• J uly 2015
•1
70+ slides
Related reports
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Industry
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Grid, Cities and Buildings
•Technologies & Sensors for the
Internet of Things: Businesses
& Market Trends 2014 - 2024
Ever-increasing internet traffic and the video streaming
boom will encourage large data center investments in the
coming years
Last year, around $143B was invested worldwide
for new data center projects. Large internet
companies like Amazon, Facebook, and Google
are leading the investment in next-generation
“green” data centers. There is a trend towards
building larger data centers, consolidating
and densifying server concentration for the
sites which require more efficient buildings.
Consequently, the blade server market for
data centers will display a 2015 - 2020 CAGR
of +10.8%, while the entire server market will
increase by 2.3%. Global server market share
for data centers will increase from slightly lower
than 20% in 2014 to almost 35% by 2020.
Our regional split shows that North America
(particularly the US) has the biggest share of
the server market, at 34%/$3.5B. Europe,
however, leads the UPS equipment and cooling
systems markets for data centers. In fact,
Europe’s large UPS (>100kVA) market was
estimated at $931M in 2014. In this report, Yole
Développement presents market forecasts for
2010 - 2020, regional splits, and players’ market
share for servers, UPS, and cooling systems.
Also, each technology’s technical evolution will
be presented.
Optimizing modern data centers’ energy consumption is a key
challenge. Also, technical solutions are required for
storage aspects and data flow limitations
Data centers are huge electricity users,
representing around 1.62% of the world’s
consumed energy in 2014. Yole Développement
analyses several possible scenarios for the
evolution of data centers’ energy consumption.
In the actual scenario, with an average Power
Usage Efficiency (PUE) of 1.8, worldwide data
center energy consumption will reach 507.9 TWh
by 2020. In our hypothetical scenarios, there’s
a possibility for achieving a 12.4% decrease
of this number by implementing some new
technologies. Examples from Google, Microsoft,
and Facebook show that it is possible to build
highly-efficient data centers, with PUEs close
to 1.1. In order to address the urgency for
reduced energy consumption, manufacturers
are emphasizing improved efficiency of the
architectural design, the equipment, the
cooling system, and more. Yole Développement
report describes some of the more efficient
modern data center architectures (modular
Alternative Current (AC) and Direct Current
(DC) grid), as well as some upcoming
technologies, i.e. silicon photonics and WBG
materials that could reduce energy
consumption.
With no slowdown in new facility construction, data centers worldwide
will have an increasing need for power
70
60
50
Find all our reports
on www.i-micronews.com
CAGR 2015-2020
GW
40
30
20
MEA
10.6%
Latin America
11.2%
Asia Pacific
6.8%
Europe
4.2%
North America
5.8%
10
0
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
(Yole Développement, July 2015)
New Technologies and Architectures for Efficient Data Centers
TRADITIONALLy RIGID AC ARChITECTURES ARE EVOLVING TOwARDS
FLEXIbLE, mODULAR SOLUTIONS. wILL DC GRID bE A SOLUTION FOR
DATA CENTERS?
Tr a d i t i o n a l d a t a c e n t e r s a r e n’ t a b l e t o
enlarge their IT equipment, since the power
architecture and the centralized cooling system
were designed for rated power. such designs
can’t be modified either, and more importantly,
they present many inefficiencies when servers
work in “low load” mode. Modularity brings a
fresh approach to data center design, enabling
the incorporation of additional servers when
needed. Also, the power and cooling systems
are better optimized, since equipment modules
Over the next few years, the container data center market
will enjoy impressive growth
2010
2011
2012
2013
CAGR 2015-2020
+23.2%
2014
2015
2016
2017
2018
2019
Yole Développement has also identified a smaller,
high-potential parallel market consisting of
“container data centers”. These containers are
rugged, portable, energy-efficient plug & play
solutions that have enjoyed rising sales over the
last few years. HP leads this new market, which
will enjoy a 23.2% CAGR from 2015 – 2020,
with Huawei following closely behind.
Other solutions exist to minimize distribution
chain power loss, such as DC grid data centers.
Thanks to a simplified architecture and fewer
conversion steps, losses can be reduced by
20%. Players like ABB, NTT, and Huawei have
several DC grid data center demonstrators
that use a 380VDC distribution voltage. The
main barrier for this new architecture is the
lack of appropriate DC components, especially
400VDC safety breakers. This report contains
a detailed analysis of who is doing what, and
how DC architecture helps reduce energy
consumption.
From 2014 on, this market will significantly
increase as many Data Center
manufacturers have seen the interest of
using these modular containers.
Container based Data Centers
had an stable growth in the
last five years.
and distribution sub-networks can be activated/
deactivated for improved efficiency. Moreover,
virtualization and server resource management
systems eliminate unnecessary power waste.
2020
(Yole Développement, July 2015)
NEw TEChNOLOGIES LIkE SILICON phOTONICS ARE EmERGING TO
RELIEVE TRAFFIC CONGESTION ON DATA TRANSmISSION LINES
Roadmap of the data center technologies and architectures
DC safety breakers
• 400 VFC
• xxx
• xxx
SiC based UPS
SSD memory widely
deployed
• xxx
• xxx
• xxx
20xx
• xxx
• xxx
20xx
2015
gies
nolo volution
e
Tech
ment
Equip
2018
Silicon Photonics
GaN / SiC equipment
• xxx
• xxx
• xxx
• xxx
• xxx
2010
Architectures
20xx
2006
Containerized
data centers
DC grid demonstrator
facilities
• xxx
• xxx
• xxx
• xxx
• xxx
xxx: All details in the report
(Yole Développement, July 2015)
2025
Design evolution
2014
• xxx
• xxx
DC grid data
centers
• xxx
• xxx
• xxx
In future data centers, photonics is generally
perceived as a technical solution that will
handle the increasing bandwidth up to 100Gb/s
and beyond. But one of photonics’ intrinsic
advantages is power-saving, which is a huge plus
for interconnects that account for a significant
part of power consumption. For example, with a
10Gb/s link, a copper interconnect will consume
10W, while silicon photonics or VCsELs solutions
will consume 0.2W. This equates to a cost
reduction from $3500/year for copper to $70/
year for photonics. In our report we review the
status of the emerging silicon photonics solution
for data centers, and also cite other “cool” optical
solutions like all-optical switches, direct photonic
links, and active optic interconnect. All of these
solutions contribute to lower power consumption.
Other technologies such as emerging NVM (nonvolatile memory) and WBG (wide-band gap)
devices are analyzed too.
Market & Technology Report
OBJECTIVES OF THE REPORT
• Understand the current challenges and limitations of data centers
•Provide a clear overview of data centers’ related market values
•Reveal the next generation of data center architecture
• Understand the main technology and market trends
• Explain some of the key technologies with a deeper analysis
• Identify players’ supply chain position
COMPANIES CITED IN THE REPORT (non exhaustive list)
Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya,
Toshiba, EPC, Samsung, SanDisk, Micron, Sony, SK Hynix, Violin memory, STEC, Tms, Fusion-io,
Eaton Corp., Emerson Electric, Schneider Electric, General Electric, Belkin Industries,
Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data,
Airedale, RC Group, Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz,
Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really, QTS Data Centers, Sabey Data
Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!
TABLE OF CONTENTS
• Report objectives 5
• Who should be interested in this report?
6
• Glossary 8
• Executive summary
•Data centers
10
28
> Drivers
> Big metrics
• Limitation & challenges
41
> Power consumption – Energy efficiency issues
> Data & storage challenges
• Supply chain
62
• Architectures
69
> Traditional
> Modular & containers
> DC grid
•T
echnical solutions & breakthroughs
>
>
>
>
>
>
128
Server
Memory
UPS
Photonics
Cooling systems
Wide Band Gaps
• Conclusion
170
AUTHORS
Mattin Grao Txapartegi is a Power
Electronics Analyst at Yole Développement.
He graduated from Grenoble INP with
an Engineering degree in Electrical
Systems, followed by a specialization in
embedded systems for transportation.
He then earned an advanced master’s
degree in Aeronautics Engineering from
Arts et Métiers ParisTech. During this
time, he oversaw managerial, financial,
and marketing fields within the
aeronautics industry.
Dr. Eric Mounier, MEMS & Sensors Senior Analyst. With almost 20 years of experience in
MEMS & Sensors applications, markets and technologies analysis, Dr Eric Mounier provides
a very deep insight to the industry about the current and future trends for MEMS. At Yole
Développement, Dr. Eric Mounier is in charge of MEMS & Sensors, but also covers printed
electronics and future disruptive technologies such as photonics. He has contributed
to more than 150 marketing & technological analysis and 60 reports in these topics,
contributing the MEMS industry moving forward. He has created and has been editor-inchief
of numerous media dedicated to the MEMS and Sensors industry. He is a co-founder of Yole
and previously worked at CEA LETI R&D lab in Grenoble, France in marketing dept. Eric is
also an expert at the OMNT (˝Observatoire des Micro & Nanotechnologies˝) for Materials
and devices for photonics. Eric has a PhD in microelectronics from the INPG in Grenoble,
after studying at Brighton University and MacGill in Montreal.
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eport Business: David Jourdan (jourdan@yole.fr)
• Press relations: Sandrine Leroy (leroy@yole.fr)
TERMS AND CONDITIONS OF SALES Definitions: “Acceptance”: Action by which the Buyer accepts the
terms and conditions of sale in their entirety. It is done by signing
the purchase order which mentions “I hereby accept Yole’s Terms
and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course
of its business activities, for its business needs) entering into the
following general conditions to the exclusion of consumers acting
in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand
and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held
by the Seller in its Products, including any patents, trademarks,
registered models, designs, copyrights, inventions, commercial
secrets and know-how, technical information, company or trading
names and any other intellectual property rights or similar in any
part of the world, notwithstanding the fact that they have been
registered or not and including any pending registration of one of
the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are
proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users
within the company. Subsidiaries and Joint-Ventures are not
included.
• Corporate license: purchased under “Annual Subscription”
program, the report can be used by unlimited users within the
company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or
database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought
either on a unit basis or as an annual subscription. (i.e. subscription
for a period of 12 calendar months). The annual subscription to a
package (i.e. a global discount based on the number of reports
that the Buyer orders or accesses via the service, a global search
service on line on I-micronews and a consulting approach), is
defined in the order. Reports are established in PowerPoint and
delivered on a PDF format and the database may include Excel
files.
“Seller”: Based in Lyon (France headquarters), Yole
Développement is a market research and business development
consultancy company, facilitating market access for advanced
technology industrial projects. With more than 20 market
analysts, Yole works worldwide with the key industrial companies,
R&D institutes and investors to help them understand the markets
and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS
AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY
THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE
SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE
MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY
ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent
by any duly authorized person representing the Buyer. For
these purposes, the Buyer accepts these conditions of sales
when signing the purchase order which mentions “I hereby
accept Yole’s Terms and Conditions of Sale”. This results in
acceptance by the Buyer.
1.3 O
rders are deemed to be accepted only upon written
acceptance and confirmation by the Seller, within [7 days]
from the date of order, to be sent either by email or to the
Buyer’s address. In the absence of any confirmation in writing,
orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 P
roducts are sent by email to the Buyer:
• within [1] month from the order for Products already released;
or
• within a reasonable time for Products ordered prior to their
effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a
pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in
respect of article 2.2 above, and including incases where a
new event or access to new contradictory information would
require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality
Products.
2.3 The mailing of the Product will occur only upon payment
by the Buyer, in accordance with the conditions contained
in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format
is defective, the Seller undertakes to replace it at no charge
to the Buyer provided that it is informed of the defective
formatting within 90 days from the date of the original
download or receipt of the Product.
2.5 T
he person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or for
non-conformity shall be sent in writing to the Seller within 8
days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions.
They are expressed to be inclusive of all taxes. The prices
may be reevaluated from time to time. The effective price is
deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing
to acquire in the future the specific report and agreeing on the
fact that the report may be release later than the anticipated
release date. In exchange to this uncertainty, the company will
get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable
to Yole Développement, credit card or by electronic transfer to
the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice at
the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller does
not warrant the accuracy, completeness adequacy or reliability
of such information, which cannot be guaranteed to be free
from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller, provided
that the Seller ensures the substituted Product is similar to the
Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as
set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead
to any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case
only, the Buyer shall be entitled to ask for a reimbursement of
its first down payment to the exclusion of any further damages.
4.8 T
he Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness
for a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. Protection of the Seller’s IPR
6.1 A
ll the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute,
resell or publish the Product, or any part of it to any other
party other than employees of its company. The Buyer shall
have the right to use the Products solely for its own internal
information purposes. In particular, the Buyer shall therefore
not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 T
he Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time to
time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. Termination
7.1 I f the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the nonbreaching Party shall be entitled to terminate all the pending
orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit
of the Seller itself, but also for its licensors, employees and agents.
Each of them is entitled to assert and enforce those provisions
against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions
or to any contract (orders) entered into in application of
these Terms and Conditions shall be settled by the French
Commercial Courts of Lyon, which shall have exclusive
jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the
Seller, in accordance with these Terms and Conditions.
Yole Développement
From Technologies to Market
© 2015
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
Imaging
Photonics
MEMS &
Sensors
MedTech
Compound
Semi.
Manufacturing
LED / OLED
Power
Electronics
PV
Advanced
Packaging
26
4 BUSINESS MODELS
o Consulting and Analysis
•
•
•
•
•
o Financial services
Market data & research, marketing analysis
Technology analysis
Strategy consulting
Reverse engineering & costing
Patent analysis
•
•
•
•
•
M&A (buying and selling)
Due diligence
Fundraising
Maturation of companies
IP portfolio management & optimization
www.yole.fr
www.yolefinance.com
Blu Morpho
o Media
o Reports
• Market & Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
•
•
•
•
•
i-Micronews.com website
@Micronews e-newsletter
Technology magazines
Communication & webcast services
Events
www.i-Micronews.com
27
A GROUP OF COMPANIES
M&A operations
Due diligences
www.yolefinance.com
Blu Morpho
Market,
technology and
strategy
consulting
www.yole.fr
Fundraising
Maturation of companies
IP portfolio management & optimization
TBA
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
28
OUR GLOBAL ACTIVITY
Blu Morpho
Yole
Korea
40% of our business is in
EU countries
Yole Japan
30% of our business is in
Asia
Yole Inc.
30% of our business is in
North America
29
RESEARCH PRODUCTS - CONTENT COMPARISON
Breadth of the analysis
Depth of the analysis
Standard Reports
Workshops
Custom
Analysis
Custom analysis scope is defined with
you to meet your information and
budget needs
30
SERVING THE ENTIRE SUPPLY CHAIN
Integrators and
end-users
Our analysts
provide market
analysis,
technology
evaluation, and
business plan
along the
entire supply
chain
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
31
SERVING MULTIPLE INDUSTRIAL FIELDS
• We are
working
accross
multiples
industries to
understand the
impact of
More-thanMoore
technologies
from device to
system
Industrial and
defense
Energy
Transportation
makers
Medical
systems
Automotive
Mobile phone
and consumer
electronics
From A to Z…
32
REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Advanced packaging
• Power electronics
• Compound semiconductors
• OLED, LED & Laser diode
• Semiconductor Manufacturing
• Photovoltaics
• Batteries
o Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
www.i-Micronews.com
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
33
OUR 2015 REPORTS PLANNING
MARKET & TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− AlN Thin Film Markets And Applications
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled IR Imagers
− IR Detectors
− High End Gyro, Accelerometers and IMU
− Non-Volatile Memory
o LED
−
−
−
−
LED Module
OLED for Lighting
UV LED
LED Phosphors Market
o POWER ELECTRONICS
− Power Packaging
− Thermal Management for LED and Power
− Power Electronics for Renewable Energy
− Energy Management For Smart Grid And Smart Cities
− Status of Chinese Power Electronics Industry
− New Technologies For Data Center
o IMAGING & OPTOELECTRONICS
− Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
− Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns &
− IGBT Markets And Application Trends
Reverse Engineering)
− Power Electronics for HEV/EV*
− Uncooled IR Imagers
− Status of Power Electronics Industry
− Wafer Level Optics
− Status of the CMOS Image Sensors
o ADVANCED PACKAGING
− Machine Vision
− Advanced Packaging in Emerging Markets in China
− Status of the Advanced Packaging Industry
o MEDTECH
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Microfluidic for Sample Preparation
− WLCSP*
− Microfluidic Applications
− Flip Chip Business Update
− Sensors for Wearable Electronics And Mobile Healthcare
− 2.5D & 3DIC Business Update
− Fan-Out and Embedded Business Update
o COMPOUND SEMICONDUCTORS
− High Purity Alumina (HPA)
o MANUFACTURING
− Sapphire
− Lithography for MEMS, Advanced Packaging and LED
− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Diamond, Graphene… as a trend)
Image Sensors
− Non-Volatile Memory
* Reports to be decided within 2015
34
OUR 2015 REPORTS PLANNING
PATENT ANALYSIS by Knowmade
o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
− MEMS Microphone Applications
− Infrared Imaging
o Patent Investigation (crossed analysis based on Knowmade & Yole Développement expertise)
− Power GaN
− MEMS Gyroscope
− 6-axis & 9-axis Inertial MEMS IMUs
− Microbatteries
− Embedded Active & Passive Packages
− Interposer
− Phosphors for LED
TEARDOWN & REVERSE COSTING by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.
* Reports to be decided within 2015
35
OUR 2014 PUBLISHED REPORTS LIST
− LED Packaging
− LED Front-End Manufacturing Trends
− LED Front-End Equipment Market
MARKET & TECHNOLOGY REPORTS
by Yole Développement
o MEMS & SENSORS
− Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
− MEMS Microphone: Market, Applications and Business Trends 2014
− Status of the MEMS industry
− MEMS & Sensors for Mobile Phones and Tablets
− High End Gyroscopes and Accelerometer Applications
− Inertial MEMS Manufacturing Technical Trends
− New Detection Principles & Technical Evolution for MEMS & NEMS
− 6/9 DOF Applications in Consumer Electronics
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Silicon Photonics
o MEDTECH
− Point of Care Testing: Applications for Microfluidic Technologies
− Solid State Medical Imaging: X-ray and Endoscopy
o COMPOUND SEMICONDUCTORS
− RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 20102020
− SiC Modules, Devices and Substrates for Power Electronics Market
− GaN-on-Si Substrate Technology and Market for LED and Power Electronics
− Power GaN Market
− Graphene Materials for Opto & Electronic Applications
− Sapphire Applications and Market: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for HEV/EV
− Inverters
− Gate Driver Unit Market for Power Transistors
o
PHOTOVOLTAICS
− Emerging and Innovative Technology Approaches in the Solar Industry
o ADVANCED PACKAGING
− 3DIC Equipment and Materials
− 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
o MANUFACTURING
− Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics
− Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
PATENT ANALYSIS
by Knowmade
−
−
−
−
LED Based on Nano-wires Patent Investigation
GaN on Si Patent Investigation (LED, Power devices and RF Devices)
New MEMS Devices Patent Investigation
Non Volatile Memory Patent Investigation
TEARDOWN & REVERSE COSTING
by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
o LED
36
MICRONEWS MEDIA
o
About Micronews Media
Micronews
Media, powered
by
Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community.
With our services, we help you to reach your
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high addedvalue editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o
Focused
community
Five supports and channels for your visibility
•
•
•
A technology magazine to highlight
your
visibility
with
advertisements,
company profiles, product descriptions and
white papers
A webcast to highlight your expertise and
develop
your
business
identifying
commercial leads
Large
community
Mass contacts
Identified
contacts
Articles, advertisements & logo and
banners dedicated to your company, its
products and expertise in @Micronews enewsletter and on i-Micronews.com
37
COMMUNICATION SERVICES
All services listed below are available on–demand.
o
i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o
@Micronews, the e-newsletter
Headline article - Tiles
o
Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event with Yole support (logistics, promotion, data…)
o
Technology Magazines: Custom – Co-produced
Increase your visibility through a dedicated technology magazine
with ads, company profile, product descriptions and white papers.
It can be a custom magazine: your company is the only one to
benefit from it – or a co-produced one: up to 2 companies.
Contacts:
Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),
Media & Communication Coordinators.
38
CONTACT INFORMATION
o Consulting and Specific Analysis
•
North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
•
Japan:Yutaka Katano, General Manager,Yole Japan & President, Yole K.K.
Email: katano@yole.fr
•
RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
o Report business
•
North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
•
Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
•
Japan & Asia: Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
Email: onozawa@yole.fr
•
Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
•
Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
Follow us on
o General
•
Email: info@yole.fr
39