SEOUL SEMICONDUCTOR
Z-POWER LED Series
Technical Datasheet for X4218X
Z-Power series is designed for high current operation and
high flux output applications.
Features
• Super high Flux output
and high Luminance
Z-Power LED's thermal management perform exceeds
• Designed for high
current operation
other power LED solutions.
It incorporates state of the art SMD design and Thermal
emission material.
• Low thermal resistance
• SMT solderbility
• Lead Free product
Z Power LED is ideal light sources for general illumination
• RoHS compliant
applications, custom designed solutions, automotive large
LCD backlights
Application
• Mobile phone flash
• Automotive interior / exterior lighting
• Automotive signal lighting
• Automotive forward lighting
• General Torch
• Architectural lighting
• LCD TV / Monitor Backlight
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway lighting
• Remote / Solar powered lighting
• Household appliances
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Rev 00 – 2007 / 08
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Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 X7 –X8 X9 – X10 X11 X12 X13 X14
1. Part Number
- X1 : Color
- X2 : Z-Power LED series number
- X3 : LENS type
- X4 : Chip quantity (or Power Dissipation)
- X5 : Package outline size
- X6 : Type of PCB
- X7 : Grade of Characteristics code
2. Internal Number
- X8
- X9
3. Code Labeling
- X10 : Luminous flux (or Radiant flux for royal blue)
- X11 X12 X13 : Dominant wavelength (or x,y coordinates rank code)
- X14 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
–7X–7 X
X88 X9
PART NO. : XX11 XX22 XX33 XX44 XX55 XX66 X
QUANTITY : ###
LOT NUMBER : ##########
BIN CODE : X10 X11 X12 X13 X14
For more information about binning and labeling, refer to the Application Note -1
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Rev 00 – 2007 / 08
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Outline Dimensions
1. Dome Type
SLUG
Cathode Mark
Lens
Body
Lead
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
*The appearance and specifications of the product may be changed for improvement without
notice.
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Rev 00 – 2007 / 08
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Outline Dimensions
2. PCB Type
Rectangular Type
Star Typ
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
*The appearance and specifications of the product may be changed for improvement without
notice.
4
Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
1. Pure White (W42181, W42182)
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Min
Typ
Max
Unit
T rank
ФV [2]
70
80
91
lm
U rank
[2]
91
100
-
lm
CCT
-
6300
-
K
Ra
65
70
-
-
VF
2.9
3.25
3.8
V
Correlated Color Temperature
ФV
[3]
CRI
Forward Voltage
Value
[4]
View Angle
2Θ ½
132
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
1-2 Absolute Maximum Ratings
Parameter
Symbol
Forward Current
IF
Power Dissipation
Pd
4
W
Junction Temperature
Tj
145(@ IF ≤ 700mA)
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[8]
Value
Unit
1000 (@ Tj = 90 ºC)
[7]
1800 (@ 1KHz, 1/10 duty)
mA
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance.
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. (25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC.
[7] IF Max is guaranteed under the TJ ≤90 ºC.
[8] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink.
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Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
2. Warm White (N42181, N42182)
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
View Angle
Min
Unit
Typ
Max
ФV [2]
52
-
lm
CCT
3000
-
K
Ra
80
-
-
3.25
3.8
V
VF
[4]
Value
2.9
2Θ 1/2
120
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
2-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Pd
3.2
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
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Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
3. Warm White_2 (N42181L, N42182L)
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
[4]
View Angle
Value
Min
Unit
Typ
Max
ФV [2]
62
-
lm
CCT
3000
-
K
Ra
-
70
-
-
VF
2.9
3.25
3.8
V
2Θ 1/2
120
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
3-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Pd
3.2
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
7
Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
4. Natural White (S42181, S42182)
4-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
Min
ФV [2]
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
Value
[4]
View Angle
Unit
Typ
Max
65
-
lm
CCT
-
4000
-
K
Ra
-
73
-
-
VF
2.9
3.2
3.8
V
2Θ 1/2
120
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
4-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Pd
3.2
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[8]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance.
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. (25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC.
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
8
Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
5. Royal Blue (D42181, D42182)
5-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Radiant Power
Symbol
[1]
Dominant Wavelength
Forward Voltage
[3]
[4]
Value
Unit
Min
Typ
Max
ФV [2]
-
360
-
mW
λD
455
460
465
nm
VF
2.9
3.25
3.8
V
2Θ 1/2
130
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
View Angle
5-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
1000
mA
Power Dissipation
Pd
4
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
9
Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
6. Blue (B42181, B42182)
6-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Dominant
Symbol
[1]
Wavelength[3]
Forward Voltage
[4]
View Angle
Value
Unit
Min
Typ
Max
ФV [2]
-
22
-
lm
λD
455
465
475
nm
VF
2.9
3.25
3.8
V
2Θ 1/2
130
deg.
Thermal resistance
[5]
RθJ-B
8.5
ºC /W
Thermal resistance
[6]
RθJ-C
6.9
ºC /W
6-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
1000
A
Power Dissipation
Pd
4
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 145 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 145 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
10
Rev 00 – 2007 / 08
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Characteristics for Dome type Z-Power LED
7. Green (G42181, G42182)
7-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Dominant Wavelength[3]
Forward Voltage
[4]
View Angle
Value
Unit
Min
Typ
Max
ФV [2]
-
70
-
lm
λD
520
525
535
nm
VF
2.9
3.25
3.8
V
2Θ 1/2
130
deg.
Thermal resistance
[5]
RθJ-B
9.5
ºC /W
Thermal resistance
[6]
RθJ-C
8.0
ºC /W
7-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
1000
mA
Power Dissipation
Pd
4
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 145 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 145 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sin
11
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Characteristics for Dome type Z-Power LED
8. Red (R42181, R42182)
8-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
Parameter
Luminous Flux
Symbol
[1]
Dominant Wavelength[3]
Forward Voltage
[4]
View Angle
Value
Unit
Min
Typ
Max
ФV [2]
-
48
-
lm
λD
618
625
630
nm
VF
2.0
2.3
3.0
V
2Θ 1/2
130
deg.
Thermal resistance
[5]
RθJ-B
9
ºC /W
Thermal resistance
[6]
RθJ-C
7.8
ºC /W
8-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
Pd
2.4
W
Junction Temperature
Tj
145
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
±20,000V HBM
-
ESD Sensitivity
[7]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 145 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ ≤ 145 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
12
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Color spectrum, TA=25ºC
1. Pure White
1 .0
S ta n d a r d e y e r e s p o n s e c u r v e
Distribution
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0
300
400
500
600
700
800
900
800
900
W a v e le n g th ( n m )
2. Warm White (N42180)
0 .8
Distribution
Relative Spectral Power
1 .0
0 .6
0 .4
0 .2
0 .0
300
400
500
600
700
W a v e le n g t h ( n m )
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Color spectrum, TA=25ºC
3. Warm White(N42180L)
1 .0
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0
300
400
500
600
700
800
900
W a v e le n g th ( n m )
4. Natural White
1 .0
Distribution
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0
300
400
500
600
700
800
W a v e le n g th ( n m )
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Color spectrum, TA=25ºC
5. Red, Green, Blue
1 .0
Distribution
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0
400
500
600
700
W a v e le n g th ( n m )
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Junction Temperature Characteristics
1. Relative Light Output vs. Junction Temperature at IF=350mA, TA=25℃
160
Relative Light Output(%)
140
120
100
80
60
40
N42180, N42180L, S42180
W42180
B42180
G42180
20
0
20
40
60
80
100
120
140
120
140
Relative Light Output [%]
Junction Temperature
140
R42180
120
100
80
60
40
20
0
20
40
60
80
100
o
Junction Temperature, TJ [ C]
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Junction Temperature Characteristics
2. Junction Temperature vs Wavelength shift TA=25℃
Dominant wavelength shift(nm)
6
R ed
G re e n
B lu e , R o ya l B lu e
5
4
3
2
1
0
0
25
50
75
100
125
150
o
J u n ctio n T em p era tu re( C )
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Forward Current Characteristics
1. Forward Voltage vs. Forward Current, TA=25℃
Average Forward Current [mA]
1000
Blue, Royal blue, Green
Pure White, Warm White, Natural White
800
600
400
200
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage [V]
Average Forward Current [mA]
800
Red
700
600
500
400
300
200
100
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Forward Voltage [V]
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Forward Current Characteristics
2. Forward Current vs. Normalized Relative Luminous Flux, TA=25℃
Relative Lumious Flux(a.U)
2.5
Blue, Royal blue, Green
Pure White, Warm White, Natural White
2.0
1.5
1.0
0.5
0.0
0
200
400
600
800
1000
Forward Current [mA]
Relative Lumious Flux(a.U)
2.5
RED
2.0
1.5
1.0
0.5
0.0
0
200
400
600
800
Forward Current [mA]
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Forward Current Characteristics
3. Forward Current vs Wavelength shift TA=25℃
8
RED
GREEN
B L U E , R o y a l B lu e
Dominant wavelength Shift(nm)
6
4
2
0
-2
-4
0
100
200
300
400
500
600
700
F o rw a rd cu rren t(m A )
800
900
1000
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Ambient Temperature vs Allowable Forward Current
1-1. Pure White, Warm White, Natural White, Green, Royal Blue, Blue
(TJMAX = 145 ºC, @350mA)
400
350
Current [mA]
300
250
o
RjaT = 60 C/W
200
o
RjaT = 50 C/W
o
RjaT = 40 C/W
150
o
RjaT = 30 C/W
100
50
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
1-2. Pure White, Warm White, Natural White, Green, Royal Blue, Blue
(TJMAX = 145 ºC, @700mA)
800
700
Current [mA]
600
500
o
RjaT = 35 C/W
400
o
RjaT = 30 C/W
o
RjaT = 25 C/W
300
o
RjaT = 20 C/W
200
100
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
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Ambient Temperature vs Allowable Forward Current
Pure White, Green, Royal Blue, Blue
(TJMAX = 90 ºC, at 1000mA)
1200
1000
Current [mA]
1-3.
800
o
RjaT = 25 C/W
600
o
RjaT = 20 C/W
400
200
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
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Ambient Temperature vs Allowable Forward Current
1-4. Red (TJMAX = 145 ºC, at 350mA)
Current [mA]
400
300
200
o
RjaT = 60 C/W
o
RjaT = 50 C/W
o
RjaT = 40 C/W
100
o
RjaT = 30 C/W
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
1-5. Red
(TJMAX = 145 ºC, @700mA)
800
700
Current [mA]
600
500
400
o
RjaT = 60 C/W
300
o
RjaT = 50 C/W
200
o
RjaT = 40 C/W
o
RjaT = 30 C/W
100
0
0
25
50
75
100
125
150
o
Ambient Temperature [ C]
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Typical Dome Type Radiation pattern
1. Pure White
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
90
0.0
-80
-60
-40
-20
0
Angle(deg.)
2. Warm White, Natural White
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
0.0
-80
-60
-40
-20
0
90
Angle(deg.)
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Typical Dome Type Radiation pattern
3. Royal Blue, Blue, Green
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
90
0.0
-80
-60
-40
-20
0
Angle(deg.)
4. Red
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
0.0
-80
-60
-40
-20
0
90
Angle(deg.)
25
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Recommended Soldering
1. Solder pad
2. Solder paste pattern
1. Paste thickness : 0.2mm
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
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Soldering profile, TA=25ºC
1. Reflow Soldering Conditions / Profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Pre-heating
~
180
Rising
5 °C/sec
Cooling
-5 °C/sec
150
0
Time
[Hr]
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
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PCB Type Reel Packaging - Rectangular type
MIN 1.5
10 pitch cumlative
tolerance on tape ±0.2
CENTER
DETALE"A"
5°TYPICAL
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
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PCB Type Reel Packaging - Star type
MIN 1.5
DETALE"A"
10 pitch cumlative
tolerance on tape ±0.2
CENTER
5° TYPICAL
DETAIL 'A'
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
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Packaging Structure
Aluminum Vinyl Bag
PART NO. : ######-##
QUANTITY : 250
LOT NUMBER : #######-#######
BIN CODE : #######
Outer Box
TYPE
c
SIZE(mm)
a
c
b
350 350 370
ZLED
PART : W42180-**
PO CODE : ##
Q'YT : ######
LOT NO : YMDD-#####
DATE : ######
ZLED
b
SEOUL SEMICONDUCTOR CO.,LTD
a
Note :
1. 6~10 reels are loaded in box
2. Scale none
3. For more information about binning and labeling, refer to the Application Note - 1
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Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30
degrees Centigrade. Humidity 50% maximum.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
• Attaching LEDs, don’t use adhesives to generate organic vapor.
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Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Dust sensitivity silicone resin need containers having cover for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevent.
• Please do not force over 2000 gf impact or pressure diagonally on the silicon lens.
It will cause fatal damage of this product
• Please do not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
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