MYXFC32GJDDQ
MMC Controller and 32GB NAND Flash
Advanced information. Subject to change without notice.
Features
• Tin-lead ball metallurgy
• MultiMediaCard (MMC) controller and 32GB
NAND Flash
• VCC: 2.7–3.6V
• VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V
• Typical current consumption
Standby current: 90μA
Active current (RMS): 90mA
MMC - Specific Features
• JEDEC/MMC standard version 4.41-compliant (JEDEC
Standard No. 84-A441) - SPI mode not supported
(see www.jedec.org/sites/default/files/docs/JESD84-A441.pdf)
Advanced 11-signal interface
x1, x4, and x8 I/Os, selectable by host
MMC mode operation
Command classes: class 0 (basic); class 2 (block read);
class 4 (block write); class 5 (erase); class 6 (write
protection); class 7 (lock card)
MMCplus™ and MMCmobile™ protocols
Temporary write protection
52 MHz clock speed (MAX)
Boot operation (high-speed boot)
Sleep mode
Replay-protected memory block (RPMB)
Secure erase and trim
Hardware reset signal
Multiple partitions with enhanced attribute
Permanent and power-on write protection
Double data rate (DDR) function
High-priority interrupt (HPI)
Enhanced reliable write
Configurable reliability settings
Background operation
Fully enhanced configurable
Table 1: MLC Partition Performance
Condition
MYXFC32GJDDQ
Units
Sequential write
20
MB/s
Sequential read
44
MB/s
Rando write
90
IOPs
Random read
1100
IOPs
Note: Bus in x8 I/O mode. Sequential access of 1MB chunk; random
access of 4KB chunk. Additional performance data, such as power
consumption or timing for different device modes, will be provided in a
separate document upon customer request.
OptionsCode
• Package (Sn63 Pb37 solder)
100-ball LFBGA
(14mm x 18mm x 1.4mm)
BG
• Operating Temperature
Industrial (-40°C ≤ TC ≤ +85°C)
IT
Backward-compatible with previous MMC modes
• ECC and block management implemented
Micron Part. No. MTFC32GJDDQ-4M
November 21, 2014 • Revision 1.0
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Form #: CSI-D-686 Document 013
4GB, 8GB, 16GB, 32GB: e·MMC
100-Ball Signal Assignments
MYXFC32GJDDQ • MMC controller and 32GB NAND Flash
Advanced information. Subject to change without notice.
100-Ball Signal Assignments
3: 100-Ball LFBGA (Top View, Ball Down)
FigureFigure
1: 100-Ball
LFBGA
1
2
3
4
(Top View, Ball Down)
A
NC
B
NC
5
6
7
8
NC
9
10
NC
NC
A
NC
B
D
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
D
E
RFU
RFU
VDDIM
RFU
RFU
RFU
RFU
RFU
E
F
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
F
G
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
G
H
VSSQ
VCCQ
RFU
RFU
RFU
RFU
VCCQ
VSSQ
H
J
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
J
K
DAT0
DAT2
RFU
RFU
RFU
RFU
DAT5
DAT7
K
L
VCCQ
VSSQ
VCCQ
RFU
RFU
VCCQ
VSSQ
VCCQ
L
M
RFU
RFU
VSSQ
RST_n
RFU
VSSQ
RFU
RFU
M
N
P
Micron Confidential and Proprietary
DAT1
DAT3
RFU
RFU
RFU
RFU
DAT4
DAT6
VSSQ
VCCQ
RFU
CMD
CLK
RFU
VCCQ
VSSQ
Package Dimensions
T
NC
U
NC
N
4GB, 8GB, 16GB, 32GB: e·MMC
Package Dimensions
P
Figure 4: 100-Ball LBGA – 14.0mm x 18.00mm x 1.4mm (Package
Code:
DQ)
T
NC
NC
NC
A
U
NC
Seating plane
0.12 A
1. Connect a 1μF decoupling capacitor from VDDI to ground.
2. Some test100X
pads
on the device are not shown. They are not solder balls and are for MiØ0.466
Micron Confidential and Proprietary
Dimensions
Figure 2: 100-Ball LFBGA
cron internal
use apply
only.
to solder balls postBall A1 ID
Ball A1 ID
reflow
onversions
Ø0.40
SMD of
Some8GB,
previous
the JEDEC product or mechanical specification had defined
14.0mm x 18.00mm x 1.4mm 3. 4GB,
16GB,
32GB:
e·MMC
ball pads.
10 9 8 7 6 5 4 3 2 1
Package
reserved for
futureDimensions
use (RFU)
balls as no connect (NC) balls. NC balls assigned in the pre(Package Code: DQ)
A ground on the system board. To enavious specifications could have been connected to
B
age Dimensions
ble new feature introduction, some of these ballsC are assigned as RFU in the v4.4 meD
chanical specification. Any new PCB footprint implementations
should use the new ball
E
assignments
and leave the RFU balls floating on the
system board.
4: 100-Ball LBGA – 14.0mm x 18.00mm x 1.4mm (Package Code:
DQ)
F
G
4. VCC, V18
, V , and VSSQ balls must all be connected.
CCQ
±0.1 SS
Notes:
H
10.0 CTR
Seating plane
J
K
16.0 CTR
L
A
0.12 A
M
N
X Ø0.466
ensions apply
older balls postow on Ø0.40 SMD
pads.
6
PDF: 09005aef8523caab
emmc_4-32gb_ctrd_441_100b-it.pdf - Rev. B 9/13 EN
Notes: 1. All dimensionsBall
areA1inIDmillimeters.
2.
Solder
ball
material:
Sn63/Pb37
10 9 8 7 6 5 4 3 2 1
3. Micron – MTFC32GJDDQ-4M
A
T
1.0 TYP
Ball A1 ID
U
1.0 TYP
9.0 CTR
B
36X Ø0.325 on 0.5 pitch.
Ni/Au plated test pads.
No solder balls.
D
E
10.0 CTR
0 CTR
1.3 ±0.1
0.303 MIN
14 ±0.1
C
November 21, 2014 • Revision 1.0
P reserves the right to change products or specifications without notice.
Micron Technology, Inc.
R
© 2013 Micron Technology, Inc. All rights reserved.
F
G
H
J
K
L
M
N
Notes:
1. Dimensions are in millimeters.
2. Solder ball material: SnAgCu (96.5% Sn, 3% Ag, 0.5% Cu).
3. Test pads are not solder balls and are for Micron internal use only.
Micross US (Americas) • 407.298.7100
Micross UK (EMEA & ROW) • +44 (0) 1603 788967
sales@micross.com
www.micross.com
P
R
1.0 TYP
T
Form #: CSI-D-686 Document 013
