DA6285.002
11 November, 2010
MAS6285
IC FOR XO TRIMMING
Very Low Power
Wide Trimming Range
Wide Supply Voltage Range
Very High Level of Integration
Electrically Trimmable
Low Cost
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DESCRIPTION
MAS6285 is capacitive digital to analog converter
integrated circuit well suited to make initial offset
trimming of the crystal oscillator. The trimming is
done by a serial bus and the calibration information
is stored in an internal PROM.
FEATURES
•
•
•
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APPLICATIONS
IC for Crystal oscillator offset trimming
Very small size
Minimum current draw
Wide operating temperature range
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High Frequency VCXOs
OCXOs
All Crystal Oscillators
BLOCK DIAGRAM
MAS6285
DA
2
CLK
PV
Digital
3
6
VDD
VSS
COUT
Figure 1. Block diagram of MAS6285.
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PIN DESCRIPTION
Pin Description
Serial Bus Data Input
Serial Bus Clock Input
Programming Input
Power Supply Voltage
Power Supply Ground
CDAC Output
Symbol
x-coordinate
y-coordinate
DA
CLK
PV
VDD
VSS
150
369
593
150
369
141
141
140
689
689
COUT
593
689
Note
Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left
floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly
are recommended to be performed in ESD protected area.
Note: Pad coordinates measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Input Voltage
Power Dissipation (max)
Storage Temperature
Latch-Up Current Limit
VDD - VSS
VIN
PMAX
TST
ILUT
-0.3
VSS -0.3
6.0
VDD + 0.3
100
150
V
V
mW
o
C
mA
-55
±100
Note
1)
Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not
operate under these conditions, but it will not be destroyed.
Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static
voltages (ESD).
Note 1: Not valid for programming pin PV
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Operating Temperature
Symbol
Conditions
VDD
TOP
Min
Typ
Max
2.5
-40
2.8
5.5
+85
Unit
V
C
o
ELECTRICAL CHARACTERISTICS
(recommended operation conditions)
Parameter
Operating Frequency
Capacitance Range
Supply Current
Symbol
fOP
COUT
ICC
Min
3.3
0.3
Typ
Max
Unit
Note
200
34.3
10
MHz
pF
µA
1)
2)
Note 1: Capacitance values are typical and may vary ± 25% due to the IC process variation. Capacitance range
guaranteed by design.
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11 November, 2010
Note 2: Minimum supply current is drawn when all bits are programmed as “0”. Maximum supply current is
drawn when all bits are left unprogrammed “1”.
IC OUTLINES
VDD
VSS
COUT
830 um
MAS6285
DA
CLK
PV
Die map reference
760 um
Figure 2. IC outline of MAS6285.
Note 1: MAS6285 pads are round with 80 µm diameter at opening.
Note 2: Pins PV, CLK and DA must not be connected in XO module end-user application.
APPLICATION
MAS6285
DA
2
CLK
PV
Digital
3
6
VDD
VSS
COUT
VC
OUT
VCXO
XIN
XOUT
X'Tal
Figure 3. Typical application for MAS6285.
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PIN CONFIGURATION (TSOT-6)
TSOT-6
DA
VDD
6
CLK
4
5
85AX
3
2
1
COUT VSS
PV
85AX = Product version (MAS6285AX, where x = letter or number)
Figure 4. TSOT-6 package.
PIN DESCRIPTION (TSOT-6)
Pin Name
Pin Number
in TSOT-6
Type
COUT
VSS
PV
CLK
DA
VDD
1
2
3
4
5
6
O
G
I
I
I
P
Function
CDAC Output with Bias Option
Power Supply Ground
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Power Supply Voltage
G = Ground, I = Input, O = Output, P = Power
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PIN CONFIGURATION (QFN-6)
QFN-6
85X
ZZZ
COUT
VSS
VDD
PV
CLK
DA
85X = Product version (MAS6285X, where X = letter or number)
ZZZ = MAS lot number (3 last digit)
Figure 5. QFN-6 package.
PIN DESCRIPTION (QFN-6)
Pin Name
Pin Number
in TSOT-6
Type
COUT
VSS
VDD
DA
CLK
PV
1
2
3
4
5
6
O
G
P
I
I
I
Function
CDAC Output with Bias Option
Power Supply Ground
Power Supply Voltage
Serial Bus Data Input
Serial Bus Clock Input
Programming Input
G = Ground, I = Input, O = Output, P = Power
Exposed pad* can be connected to ground or left floating
* see package outline information on page 8
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PACKAGE OUTLINE (TSOT-6)
e
GAUGE PLANE
b
CL
CL
E
L2
L
CL
E1
e1
D
c
CL
1) PACKAGE OUTLINE DIMENSIONS INCLUSIVE
OF METAL BURR & SOLDER PLATING
A
A2
2) PACKAGE OUTLINE EXCLUSIVE OF MOLD
FLASH
A1
3) ALL SPECIFICATIONS COMPLY TO JEDEC
MO193
4) Q REFERS TO ALL PACKAGE DRAFT ANGLES
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
c
D
E
E1
e
e1
L
L2
Q
-0.01
0.84
0.30
0.12
-0.05
0.87
-0.127
2.90BSC
2.80BSC
1.60BSC
0.95BSC
1.90BSC
0.40
0.25BSC
10°
1.00
0.10
0.90
0.45
0.20
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.30
4°
0.50
12°
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SOLDERING INFORMATION (TSOT-6)
◆ For Lead-Free / RoHS Compliant Green TSOT-6
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
Seating Plane Co-planarity
Lead Finish
TAPE & REEL SPECIFICATIONS (TSOT-6)
W3
W2
Feeding Direction
A
D
N
C
8 mm
W1
85AX
85AX
B
4 mm
Other Dimensions according to EIA-481 Standard
3000 Components on Each Reel
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
W 3 (includes flange distortion at outer edge)
Trailer
Leader
Min
1.5
12.80
20.2
50
8.4
7.9
160
390,
of which minimum 160 mm of
empty carrier tape sealed with
cover tape
Max
Unit
178
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
9.9
14.4
10.9
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PACKAGE OUTLINE (QFN-6)
D
TOP VIEW
E/2
D/2
A
SIDE VIEW
A3
PIN 1 MARK AREA
A1
SEATING
PLANE
D2/2
L
E2/2
D2
E2
SHAPE OF PIN #1
IDENTIFICATION
IS OPTIONAL
BOTTOM VIEW
b
EXPOSED PAD
e
Symbol
Min
A
A1
A3
b
D
D2 (Exposed pad)
E
E2 (Exposed pad)
e
L
0.700
0.000
0.178
0.200
1.350
0.750
0.300
Nom
PACKAGE DIMENSIONS
0.750
0.020
0.203
0.250
2.000 BSC
1.400
2.000 BSC
0.800
0.650 BSC
0.350
Max
Unit
0.800
0.050
0.228
0.300
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
1.450
0.850
0.400
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
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SOLDERING INFORMATION (QFN-6)
◆ For Lead-Free / RoHS Compliant Green QFN
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
EMBOSSED TAPE SPECIFICATIONS (QFN-6)
Pin 1 orientation / top view
DO
PO
P2
P1
T
X
E
W
10
O
MAX
F
B0
X
A0
K0
User Direction of Feed
Detail X-X
Dimension
Min/Max
Unit
Ao
Bo
Do
E
F
Ko
Po
P1
P2
T
W
2.30 ±0.05
2.30 ±0.05
1.50 +0.1/-0.0
1.75 ±0.10
3.50 ±0.05
1.00 ±0.05
4.0
4.0
±0.10
2.0
±0.05
0.254
±0.02
8.00 ±0.3/-0.1
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
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REEL SPECIFICATIONS (QFN-6)
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
Components
Min
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
1.5
12.80
20.2
50
8.4
Leader
Max
Unit
178
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
9.90
14.4
160
390,
of which minimum 160 mm of
empty carrier tape sealed with
cover tape
3000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
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ORDERING INFORMATION
Product Code
Product
Package
MAS6285AA1WA900
MAS6285AA1T0206
IC FOR XO Trimming
IC FOR XO Trimming
MAS6285AA1Q1806
IC FOR XO Trimming
Tested wafers 215 µm
TSOT-6 Pb-free,
RoHS compliant
QFN-6 Pb-free,
RoHS compliant
Comments
T&R/3000 pcs/reel
T&R/3000 pcs/reel
Please contact Micro Analog Systems Oy for other wafer thickness options.
◆ The formation of product code
Product name
MAS6285
Design version
AA1
Package type
WA9 = 215 µm thick EWS tested wafer
T02 = TSOT-6 RoHS Compliant
Q18 = QFN-6 RoHS Compliant
Delivery format
00 = bare wafer
06 = tape & reel
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kutomotie 16
FI-00380 Helsinki, FINLAND
Tel. +358 10 835 1100
Fax +358 10 835 1119
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
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