NI FlexRIO FPGA Module
Specifications
This document lists the specifications of the National Instruments FlexRIO FPGA modules (NI PXI-7951R, NI PXI-7952R,
NI PXI-7953R, NI PXI-7954R, NI PXIe-7961R, NI PXIe-7962R, and NI PXIe-7965R) devices. Typical values are
representative of an average unit operating at room temperature. These specifications are typical at 25 °C unless otherwise noted.
Reconfigurable FPGA
LUTs/Flip-Flops
DSP48 Slices
(25 18 Multiplier)
Embedded Block
RAM (kbits)
Virtex-5 LX30
19,200
32
1,152
NI PXI-7952R
Virtex-5 LX50
28,800
48
1,728
NI PXI-7953R
Virtex-5 LX85
51,840
48
3,456
NI PXI-7954R
Virtex-5 LX110
69,120
64
4,608
NI PXIe-7961R
Virtex-5 SX50T
32,640
288
4,752
NI PXIe-7962R
Virtex-5 SX50T
32,640
288
4,752
NI PXIe-7965R
Virtex-5 SX95T
58,880
640
8,784
Device
FPGA
NI PXI-7951R
Default timebase ............................. 40 MHz
Timebase reference sources
NI PXI-795xR............................. PXI 10 MHz
NI PXIe-796xR........................... PXIe 100 MHz
Timebase accuracy
NI PXI-795xR............................. ±100 ppm, 250 ps
peak-to-peak jitter
NI PXIe-796xR........................... ±50 ppm, 250 ps
peak-to-peak jitter
Data transfers .................................. DMA, interrupts,
programmed I/O
Number of DMA channels
NI PXI-795xR............................. 3
NI PXIe-796xR........................... 16
FPGA Digital Input/Output
Number of general-purpose
channels ...........................................132, configurable as
132 single-ended,
66 differential, or a
combination of both1
Channels per bank
Bank 0/Bank 2 ............................32, single-ended per bank
Bank 1/Bank 3 ............................34, single-ended per bank
Compatibility...................................Configured via FPGA,
1.2 V to 3.3 V I/O
standards (refer to
www.xilinx.com)
Protection.........................................Refer to
www.xilinx.com
Current.............................................Refer to
www.xilinx.com
Maximum I/O data rates
Single-ended ...............................400 Mb/s for LVDCI25
Differential..................................1 Gb/s for LVDS
Global clock inputs..........................1 LVTTL, 1 LVDS
Connection resources
NI PXI-795xR .............................PXI triggers, Clk10, and
PXI star trigger
NI PXIe-796xR ...........................PXI triggers, Clk10,
PXI star trigger, DStarA,
DStarB, DStarC, and
Sync100
1
The 132 channels span across four FPGA banks. Refer to the Device Signals section for more information.
NI FlexRIO FPGA Module Specifications
2
ni.com
Device Signals
1
NI PXI-795x R
FlexRIO
RSVD_B2 on the NI PXI-795xR
2
GND
GClk_LVDS_n
GClk_LVDS
GND
GPIO_30
GPIO_30_n
GND
GPIO_31
GPIO_31_n
GND
GPIO_32
GPIO_32_n
GND
GPIO_33
GPIO_33_n
GND
GPIO_34
GPIO_34_n
GND
GPIO_35
GPIO_35_n
GND
GPIO_36
GPIO_36_n
GND
GPIO_37_CC
GPIO_37_n_CC
GND
GPIO_38_CC
GPIO_38_n_CC
GND
GPIO_39_CC
GPIO_39_n_CC
GND
GPIO_40_CC
GPIO_40_n_CC
GND
GPIO_41
GPIO_41_n
GND
GPIO_42
GPIO_42_n
GND
GPIO_43
GPIO_43_n
GND
GPIO_44
GPIO_44_n
GND
GPIO_45
GPIO_45_n
GND
GPIO_46
GPIO_46_n
GND
GPIO_47
GPIO_47_n
GND
GPIO_48
GPIO_48_n
GND
G21
S40
S39
G20
S38
S37
G19
S36
S35
G18
S34
S33
G17
S32
S31
G16
S30
S29
G15
S28
S27
G14
S26
S25
G13
S24
S23
G12
S22
S21
G11
S20
S19
G10
S18
S17
G9
S16
S15
G8
S14
S13
G7
S12
S11
G6
S10
S9
G5
S8
S7
G4
S6
S5
G3
S4
S3
G2
S2
S1
G1
G21
S114
S113
G20
S112
S111
G19
S110
S109
G18
S108
S107
G17
S106
S105
G16
S104
S103
G15
S102
S101
G14
S100
S99
G13
S98
S97
G12
S96
S95
G11
S94
S93
G10
S92
S91
G9
S90
S89
G8
S88
S87
G7
S86
S85
G6
S84
S83
G5
S82
S81
G4
S80
S79
G3
S78
S77
G2
S76
S75
G1
GND
GND
GClk_SE
GND
GPIO_14
GPIO_14_n
GND
GPIO_15
GPIO_15_n
GND
GPIO_49
GPIO_49_n
GND
GPIO_50
GPIO_50_n
GND
GPIO_51
GPIO_51_n
GND
GPIO_52
GPIO_52_n
GND
GPIO_53
GPIO_53_n
GND
GPIO_54
GPIO_54_n
GND
GPIO_55
GPIO_55_n
GND
GPIO_56_CC
GPIO_56_n_CC
GND
GPIO_57_CC
GPIO_57_n_CC
GND
GPIO_58_CC
GPIO_58_n_CC
GND
GPIO_59_CC
GPIO_59_n_CC
GND
GPIO_60
GPIO_60_n
GND
GPIO_61
GPIO_61_n
GND
GPIO_62
GPIO_62_n
GND
GPIO_63
GPIO_63_n
GND
GPIO_64
GPIO_64_n
GND
GPIO_65
GPIO_65_n
GND
Bank 0
+3.3V
SCL
TB_Present_n
+12V
VccoA
RSVD
GND
IoModSyncClk_n1
IoModSyncClk2
GND
GPIO_0
GPIO_0_n
GND
GPIO_1
GPIO_1_n
GND
GPIO_2
GPIO_2_n
GND
GPIO_3
GPIO_3_n
GND
GPIO_4_CC
GPIO_4_n_CC
GND
GPIO_5_CC
GPIO_5_n_CC
GND
GPIO_6_CC
GPIO_6_n_CC
GND
GPIO_7_CC
GPIO_7_n_CC
GND
GPIO_8
GPIO_8_n
GND
GPIO_9
GPIO_9_n
GND
GPIO_10
GPIO_10_n
GND
GPIO_11
GPIO_11_n
GND
GPIO_12
GPIO_12_n
GND
GPIO_13
GPIO_13_n
GND
PCB
Primary Side
Bank 3
P1
S148
S147
P2
S146
S145
G37
S144
S143
G36
S142
S141
G35
S140
S139
G34
S138
S137
G33
S136
S135
G32
S134
S133
G31
S132
S131
G30
S130
S129
G29
S128
S127
G28
S126
S125
G27
S124
S123
G26
S122
S121
G25
S120
S119
G24
S118
S117
G23
S116
S115
G22
Bank 1
P1
S74
S73
P2
S72
S71
G37
S70
S69
G36
S68
S67
G35
S66
S65
G34
S64
S63
G33
S62
S61
G32
S60
S59
G31
S58
S57
G30
S56
S55
G29
S54
S53
G28
S52
S51
G27
S50
S49
G26
S48
S47
G25
S46
S45
G24
S44
S43
G23
S42
S41
G22
PCB
Secondary Side
Bank 2
+3.3V
SDA
TB_Power_Good
+12V
VccoB
Veeprom
GND
RSVD_A2
RSVD_A1
GND
GPIO_16
GPIO_16_n
GND
GPIO_17
GPIO_17_n
GND
GPIO_18
GPIO_18_n
GND
GPIO_19
GPIO_19_n
GND
GPIO_20
GPIO_20_n
GND
GPIO_21
GPIO_21_n
GND
GPIO_22
GPIO_22_n
GND
GPIO_23_CC
GPIO_23_n_CC
GND
GPIO_24_CC
GPIO_24_n_CC
GND
GPIO_25_CC
GPIO_25_n_CC
GND
GPIO_26_CC
GPIO_26_n_CC
GND
GPIO_27
GPIO_27_n
GND
GPIO_28
GPIO_28_n
GND
GPIO_29
GPIO_29_n
GND
PCB
Primary Side
Bank 0
Bank 1
PCB
Secondary Side
RSVD_B1 on the NI PXI-795xR
Figure 1. NI FlexRIO FPGA Module Front Connector Pin Assignments and Locations
© National Instruments Corporation
3
NI FlexRIO FPGA Module Specifications
Onboard DRAM1
Maximum Working Voltage3
Memory size
Maximum working voltage refers to the signal voltage plus the
common-mode voltage.
NI PXI-795xR .............................2 banks; 64 MB per bank
NI PXIe-796xR ...........................2 banks; 256 MB per bank
Channel-to-earth ............................. 0 V to 3.3 V,
Measurement Category I
Maximum theoretical data rate
Channel-to-channel ......................... 0 V to 3.3 V,
Measurement Category I
NI PXI-795xR .............................800 MB/s per bank
NI PXIe-796xR ...........................1.6 GB/s per bank
Caution Do not use this device for connection to
signals in Measurement Categories II, III, or IV.
Bus Interface
PXI...................................................Master, slave
Environmental
PXI Express
This device is intended for indoor use only.
Form factor .................................x4 PXI Express,
specification v1.0
compliant
Operating environment ................... 0 C to 55 C,
tested in accordance with
IEC-60068-2-1 and
IEC-60068-2-2.
Slot compatibility........................x4, x8, and x16
PXI Express or
PXI Express hybrid slots
Maximum Power
Relative humidity range.................. 10% to 90%,
noncondensing,
tested in accordance with
IEC-60068-2-56.
Requirement2
NI PXI-795xR
+5 VDC (±5%)............................2 A
Altitude ........................................... 2,000 m at 25 C ambient
temperature
+3.3 VDC (±5%).........................2 A
+12 V ..........................................0.5 A
Pollution Degree ............................. 2
–12 V...........................................0 A
Storage environment
NI PXIe-796xR
Ambient temperature range ........ –40 C to 70 C,
tested in accordance with
IEC-60068-2-1 and
IEC-60068-2-2.
+3.3 VDC (±5%).........................3 A
+12 V ..........................................2 A
Physical
Relative humidity range ............. 5% to 95%,
noncondensing,
tested in accordance with
IEC-60068-2-56.
Dimensions (not including connectors)
NI PXI-795xR .............................18.8 cm × 12.9 cm
(7.4 in. × 5.1 in.)
NI PXIe-796xR ...........................16.1 cm × 10.8 cm
(6.3 in. × 4.3 in.)
Note Clean the device with a soft, non-metallic
brush. Make sure that the device is completely dry
and free from contaminants before returning it to
service.
Weight
NI PXI-795xR .............................190 g (6.7 oz)
NI PXIe-796xR ...........................213 g (7.5 oz)
I/O connector ...................................High-density card edge
1
2
3
The NI PXI-7951R/NI PXIe-7961R does not have onboard DRAM.
Power requirements are dependent on the adapter module and contents of the LabVIEW FPGA VI used in your application.
Voltage ranges are dependent on the I/O standards available for your application. For more information on available
I/O standards, refer to Xilinx documentation, available at www.xilinx.com.
NI FlexRIO FPGA Module Specifications
4
ni.com
Shock and Vibration
CE Compliance
Operational shock ........................... 30 g peak, half-sine,
11 ms pulse,
tested in accordance with
IEC-60068-2-27. Test
profile developed in
accordance with
MIL-PRF-28800F.
This product meets the essential requirements of applicable
European Directives as follows:
Nonoperating .............................. 5 Hz to 500 Hz, 2.4 grms,
tested in accordance with
IEC-60068-2-64.
Nonoperating test profile
exceeds the requirements
of MIL-PRF-28800F,
Class 3.
Environmental Management
National Instruments is committed to designing and
manufacturing products in an environmentally responsible
manner. NI recognizes that eliminating certain hazardous
substances from our products is beneficial not only to the
environment but also to NI customers.
Safety
This product meets the requirements of the following
standards of safety for electrical equipment for measurement,
control, and laboratory use:
•
UL 61010-1, CSA 61010-1
For additional environmental information, refer to the NI and
the Environment Web page at ni.com/environment. This
page contains the environmental regulations and directives
with which NI complies, as well as other environmental
information not included in this document.
Note For UL and other safety certifications,
refer to the product label or the Online Product
Certification section.
Waste Electrical and Electronic Equipment (WEEE)
EU Customers At the end of the product life cycle,
all products must be sent to a WEEE recycling
center. For more information about WEEE
recycling centers, National Instruments WEEE
initiatives, and compliance with WEEE Directive
2002/96/EC on Waste Electrical and Electronic
Equipment, visit ni.com/environment/weee.
Electromagnetic Compatibility
This product meets the requirements of the following EMC
standards for electrical equipment for measurement, control,
and laboratory use:
•
EN 61326 (IEC 61326): Class A emissions; Basic
immunity
•
EN 55011 (CISPR 11): Group 1, Class A emissions
•
AS/NZS CISPR 11: Group 1, Class A emissions
•
FCC 47 CFR Part 15B: Class A emissions
•
ICES-001: Class A emissions
2004/108/EC; Electromagnetic Compatibility
Directive (EMC)
Refer to the product Declaration of Conformity (DoC) for
additional regulatory compliance information. To obtain
product certifications and the DoC for this product, visit
ni.com/certification, search by model number or
product line, and click the appropriate link in the Certification
column.
Operating .................................... 5 Hz to 500 Hz, 0.3 grms
IEC 61010-1, EN 61010-1
2006/95/EC; Low-Voltage Directive (safety)
•
Online Product Certification
Random vibration
•
•
⬉ᄤֵᙃѻક∵ᶧࠊㅵ⧚ࡲ⊩ ˄Ё RoHS˅
National Instruments ヺড়Ё⬉ᄤֵ
ᙃѻકЁ䰤ࠊՓ⫼ᶤѯ᳝ᆇ⠽䋼ᣛҸ (RoHS)DŽ݇Ѣ
National Instruments Ё RoHS ড়㾘ᗻֵᙃˈ
䇋ⱏᔩ ni.com/environment/rohs_chinaDŽ
Ёᅶ᠋
(For information about China RoHS compliance,
go to ni.com/environment/rohs_china.)
Note For the standards applied to assess the EMC
of this product, refer to the Online Product
Certification section.
Note EMC compliance evaluated with a wrapback
adapter module and general purpose I/O (GPIO)
signals configured to LVTTL I/O standard, slew rate
set to slow, and drive strength set to 6 mA. EMC
compliance of other I/O standards, faster slew rates,
and greater drive strength is not guaranteed.
© National Instruments Corporation
5
NI FlexRIO FPGA Module Specifications
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