RF6535
®
TXN
16
TXP 17
RXCT 18
RXBN 19
RXBP
20
15 14 13 12 11
10
VCC
9 GND
ANT 8 ANT1
7
GND
6
ANT2
1 2 3 4 5
The RF6535 integrates a complete solution in a single Front End Module (FEM) for
WiFi and ZigBee® applications in the 2.4GHz to 2.5GHz band. This FEM integrates the PA plus harmonic filter in the transmit path and an LNA in the receive side. It also integrates a diversity switch and provides balanced input and output signals for both the TX and RX paths respectively.
The RF6535 FEM is ideal for ZigBee® systems operating with a minimum output power of 20dBm and high efficiency requirements. On the receive path, the LNA provides 11.5dB of typical gain with only 8mA of current and excellent NF down to
3dB. This FEM meets or exceeds the system requirements for WiFi and ZigBee
® applications operating in the 2.4GHz to 2.5GHz band. The device is provided in a
3.5mm x 3.5mm x 0.5mm, 20-pin QFN package.
RF6535SQ
RF6535SR
RF6535TR13
RF6535PCK-410
Standard 25 piece bag
Standard 100 piece reel
Standard 2500 piece reel
Fully assembled evaluation board and 5 loose pieces
DS121107
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
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RF6535
Parameter
DC Supply Voltage
Operating Case Temperature
Storage Temperature
ESD Human Body Model RF Pins
ESD Human Body Model All Other
Pins
ESD Charge Device Model All Pins
Moisture Sensitivity Level
Maximum Input Power to PA
Maximum Input Power to LNA
Rating
5
-40 to +85
-40 to +150
500
500
500
MSL 2
+5
+10
Unit
V
°C
°C
V
V
V dBm dBm
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder.
Parameter
Overall
Operating Frequency Range
Operating Voltage (V
CC
)
Operating Voltage (V
CC_BIAS
)
Leakage Current
Transmit Parameters
Frequency
Input Return Loss
Balanced Input Impedance
Amplitude Imbalance
Phase Imbalance
Output Return Loss
Gain
Gain Flatness
Rated Output Power
Supply current
Supply current
Supply current
Thermal Resistance
2nd through 5th harmonic level
VSWR Stability and load mismatch susceptibility
VSWR No damage
Gain settling time
2400
9
-1
-15
10
24
-0.8
22
21
Min.
Specification
Typ.
Max.
Unit Condition
Specifications must be met across supply voltage, control voltage, and temperature ranges unless otherwise noted. Typical conditions: T =
25°C, V
CC
= 3.3V, CTL = High
2400
3.0
3
3.3
3.3
45
2483
4.2
4.2
60
MHz
V
V uA V
CC
0V
= 3.3V, RF = OFF, CTRL, SDN, ANT_SEL =
2483
200
28
23
240
230
220
55
-45
1
15
0.8
260
250
240
-42
MHz
dB deg dB dB dBm
At rated power dBm dBm mA mA mA
V
CC
= 3.3V, T = 25°C
V
CC
greater than or equal to 3.3V; Temperature less than or equal to 70°C
All conditions
P
O
= 23dBm 802.15.4OQPSK
P
O
= 22dBm 802.15.4OQPSK
P
O
= 21dBm, All conditions
°C/W V
CC
= 3.6V, P
OUT
= 23dBm, T
REF
= 85°C dBm/MHz Measured using standard 802.15.4OQPSK modulation signal
4:1
8:1
1 10 uS
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DS121107
RF6535
Parameter
Min.
Transmit Parameters
(continued)
Current sourced through TXCT pin
Voltage drop from TXCT pin to
TXP/TXN
Receive Parameters
Frequency 2400
Gain 9.5
Noise Figure
Current
Input IP3
Gain flatness
Input return loss
-0.5
6
7.5
Output return loss
Balanced Output Impedance
Amplitude imbalance
Phase imbalance
Current sourced through RXCT pin
-1
-15
Voltage drop from RXCT pin to
RXP/RXN
Antenna Switch
RF-to-Control Isolation 50
RF-to-ANT Isolation 17
Specification
Typ.
Max.
11.5
3
8
7
8.5
200
20
18.0
0.1
2483
13.5
4
11
0.5
1
15
1
0.1
RF-to-RF Isolation
Antenna Select Switch Speed
Control Logic
Control Logic = HIGH
Control Logic = HIGH
Control Logic = LOW
Control Current. Logic HIGH
Control Current. Logic LOW
18
= V
CC
-0.3
1.7
20
1.8
0
10
0.1
1
= V
CC
3.6
0.2
Unit Condition mA
V dB deg mA
V dB dB dB
MHz dB dB mA dBm
From antenna to RX pin (entire RX path).
From antenna to RX pin (entire RX path).
LNA + Switches dB dB dB uS
V
V
V
A
A
Measured at any control pin while in TX or RX mode.
Measured from Antenna to RX port while in
Transmit mode. Measured from Antenna to TX port while in Receive mode.
Measured from TX port to RX port while in receive or transmit modes.
ANT1 or ANT2 path, TX or RX mode
SDN and ANT_SEL
CTL
All Logic I/O’s
All Logic I/O’s
All Logic I/O’s
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RF6535
Enable/Shutdown pin for entire module. See logic table for operation.
Voltage Supply. An external 1 F capacitor might be needed for low frequency decoupling.
Control pin for Antenna select. See logic table for operation.
Enable voltage pin for both PA/Transmit Switch and LNA/Receive Switch. See logic table for operation.
No connect pin. Must be left floating.
This is the common port (antenna). It is matched to 50 and DC-block is provided internally.
Ground.
This is the common port (antenna). It is matched to 50 and DC-block is provided internally
Ground.
Voltage Supply. An external 1 F capacitor might be needed for low frequency decoupling
No connect pin. Must be left floating.
Voltage Supply. An external 1 F capacitor might be needed for low frequency decoupling
Voltage Supply. An external 1 F capacitor might be needed for low frequency decoupling
Ground.
Center tap for pass-thru DC voltage to TXN and TXP pins that connect to the TXVR SOIC.
100 single ended, 200 differential.
100 single ended, 200 differential.
Center tap for pass-thru DC voltage to RXBN and RXBP pins that connect to the TXVR SOIC.
100 single ended, 200 differential.
100 single ended, 200 differential.
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DS121107
RF6535
DS121107
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
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RF6535
Tx Mode
• With the RF source disabled, apply 3.3V to V
CC
with other controls set to 0V
• Apply 3.0V to SDN and 1.8V to CTL
• Apply 0V to ANT_SEL to select the ANT1 port, or 3.0V to select the ANT2 port
• V
CC current should rise to 70mA to 80mA quiescent current
• Enable the RF source; V
CC
current should rise to a maximum of 200mA depending on output power
RX Mode
• With the RF source disabled, apply 3.3V to V
CC
with other controls set to 0V
• Apply 3.0V to SDN, keeping CTL at 0V
• Apply 0V to ANT_SEL to select the ANT1 port, or 3.0V to select the ANT2 port
• V
CC
current should rise to 7mA to 8mA
• Enable the RF source; V
CC
current may increase a few mA depending on output power
TX-ANT1
TX_ANT2
RX-ANT1
RX-ANT1
All OFF
3.0V
3.0V
3.0V
3.0V
0
1.8V
1.8V
0
0
0
0V
3.0V
0V
3.0V
0
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DS121107
RF6535
VCC
CT
J1
TX
50 strip
1
BALUN
2 2450MHz
3
50
- 200
6
5
4
4
BALUN
5
2450MHz
6
50
- 200
1
3
2
50
100 strip
100 strip
CT
100 strip
100 strip
16
17
18
19
20
C6
0.1
F
L9
4.3nH
C5
0.1
F
L8
1.8nH
15 14 13 12 11
U1
RF6535
8
7
6
10
9
1 2 3 4 5
strip
J2
RX
SDN
L1
3.0nH
ANT_SEL
C4
1.0
F
C3
0.9pF
L6
1.3nH
L7
3.6nH
L2
3.6nH
L3
1.3nH
C2
0.9pF
L5
3.6nH
L4
3.6nH
50 strip
50 strip
C1
0.1
F
VCC CTL
J3
ANT1
J4
ANT2
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RF6535
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3 inch to 8 inch gold over 180 inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended.
PCB Metal Land and Solder Mask Pattern
Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, the power dissipation, and this electrical requirements. Example of the number and size of vias can be found on the RFMD evaluation board layout.
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DS121107