A Component Supplier’s
Green Approach
Texas Instruments
IPC/JEDEC Pb-free Conference
Dallas, TX
Dec 9, 2008
Mark Frimann
February 27, 2006
1
Texas Instruments & RoHS
Nickel-Palladium-Gold
Nickel-Palladium-GoldRoHS
RoHSCompliant
CompliantSolutions
Solutions(no
(no“Tin
“TinWhiskering”)
Whiskering”)
Unique
Part Numbers in addition to Standard Part Numbers
Unique Part Numbers in addition to Standard Part Numbers
Easy
Access to Material Content Information – ti.com/leadfree
Easy Access to Material Content Information – ti.com/leadfree
Awareness
Pilot/Ramp
Production
RoHS
Jan04
February 27, 2006
Jan05
Jan06
Jan07
2
Lead-Free Trivia
TI Ships
X
~1 mg of Lead
eliminated
~1 B-Units
per month
?
= Lead
eliminated
~100 Car Batteries
of Lead no longer used
each month
February 27, 2006
3
RoHS Directive Substances
RoHS Substance
Threshold
TI Use
(homogeneous material)
Lead (Pb)
<1000 ppm
Also in lead frames (<300ppm),
flip-chip solder bumps (exempt),
and solder die attach* (exempt)
… main issue for semiconductor suppliers
February 27, 2006
Lead frame Finish,
BGA Solder Balls,
Mercury (Hg)
<1000 ppm
None
Hex. Chromium (Cr6+)
<1000 ppm
None
PBBs (RoHS defined
Polybrominated Biphenyls)
<1000 ppm
None
PBDEs (RoHS defined
Polybrominated Diphenyl Ethers)
<1000 ppm
None
Cadmium (Cd)
< 100 ppm
BGA Solder Balls
(trace impurity)
* solder die attach used in high-power type parts such as power amplifiers
4
“Pb-Free” & “Green” TI Definitions
“Pb-Free”
“Pb-Free” == RoHS
RoHS &
& High
High Temp
Temp compatible
compatible
“Pb-Free” : TI defines "Pb-Free" or “RoHS Compliant” to mean semiconductor
products that are compatible with the current RoHS requirements for all 6
substances, including the requirement that lead not exceed 0.1% by weight in
homogeneous materials unless exempt. Where designed to be soldered at high
temperatures, TI “Pb-Free” and “RoHS Compliant” products are suitable for use
in specified lead-free processes.
“Green”
“Green” == “Pb-Free”
“Pb-Free” &
& no
no Bromine
Bromine or
or Antimony
Antimony
“Green” : TI defines "Green" to mean Pb-Free/RoHS Compliant and free of
Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed
0.1% by weight in homogeneous material).
February 27, 2006
5
Why go “Green”?
Removes
Removesadditional
additionalsubstances
substancesof
ofconcern
concern
Saves
Savestime
time&&effort
effortby
bycombining
combining22conversions
conversionsinto
into11qual
qual
Improves
Improvesthe
theMoisture
MoistureSensitive
SensitiveLevel
Level(MSL)
(MSL)of
ofthe
thePackage
Package
JEDEC MSL Rating
Floor Life Time
(J-STD-020C)
(before rebake reqd)
Floor Life
Condition
1
Unlimited
<30’C / 85% RH
2
1 year
<30’C / 60% RH
Example
Example
High-Temp
High-Temp
Reclassification
Reclassification
(i.e.
(i.e. 235’C
235’C 260’C)
260’C)
2A
<30’C / 60% RH
4
4 weeks
After
After
Mold
Mold Compound
Compound 168 hours
Upgrade
Upgrade
72 hours
5
48 hours
<30’C / 60% RH
5a
24 hours
<30’C / 60% RH
6
Time on Label (TOL)
<30’C / 60% RH
3
February 27, 2006
<30’C / 60% RH
<30’C / 60% RH
6
Getting the Lead (Pb) Out
Ball Grid Array (BGA) Parts
Leadframe Based Parts
Industry Standard Pb-Free Solution …
Common Pb-Free Solutions …
1) Tin-Silver-Copper Alloy Solder Balls
1) Nickel-Palladium-Gold Plating
2) Tin Plating (risk of “Tin Whiskers”)
iNEMI
iNEMI––Recommendations
Recommendationson
onLead-Free
Lead-FreeFinishes
Finishesfor
forComponents
ComponentsUsed
UsedininHigh-Reliability
High-ReliabilityProducts
Products(May2005)
(May2005)
Recommendation
Recommendation#1
#1––“Use
“UseaaNon-Tin
Non-Tinplating:
plating:Nickel-Palladium-Gold
Nickel-Palladium-Goldshould
shouldbe
bestrongly
stronglyconsidered
considered
for
lead-frame
applications.”
for lead-frame applications.”
February 27, 2006
7
“Tin Whiskering” Example
February 27, 2006
Photos courtesy of NASA Electronic Parts and Packaging (NEPP) Program - http://nepp.nasa.gov/whisker
8
Conversion Progress
Almost
Almostall
allplanned
plannedconversions
conversionshave
havebeen
beencompleted.
completed.
( (>96%
>96%based
basedon
onP/Ns,
P/Ns,>98%
>98%based
basedon
on4Q05
4Q05shipped
shippedunits
units) )
>98%
>98%of
ofthe
theconverted
convertedleadframe-based
leadframe-basedcomponents
components
use
usethe
theNickel-Palladium-Gold
Nickel-Palladium-Gold(NiPdAu)
(NiPdAu)finish.
finish.
February 27, 2006
9
TI “Pb-Free” Part Numbers
For BGA based parts …
YES.
For Leadframe based parts …
YES.
( Pb-Free PN added after TI leaded inventory is depleted )
February 27, 2006
10
Part Numbering, BGAs
SnPb Solder Balls
Lead-based Board Process (Low-Temp)
ADS5121IGHK
OPA2347YEDR
Bad Solder Joints
SnAgCu Solder Balls
Lead-Free Board Process (High-Temp)
ADS5121IZHK
OPA2347YZDR
* not actual color
••BGA
BGAParts
Partsare
arenot
notinterchangeable,
interchangeable,so
sotwo
twopart
partnumbers
numbersare
arerequired.
required.
••Support
Supportfor
forboth
bothversions
versionswill
willbe
bedriven
drivenby
bycustomer/market
customer/marketdemand.
demand.
••New
Zxx, YEx YZx).
Newpart
partnumbers
numberssubstitute
substituteaa“Z”
“Z”into
intothe
thepackage
packagesuffix
suffix(Gxx
(Gxx Zxx, YEx YZx).
••For
ForFlip-Chip
Flip-ChipBGAs,
BGAs,RoHS-Exempt
RoHS-ExemptPN
PN==Zxx
Zxxand
and100%
100%RoHS
RoHSPN
PN==Cxx
Cxx. .
February 27, 2006
11
Part Numbering, Leadframe Parts
SnPb Leadframe
Lead-based Board Process (Low-Temp)
TLC556CDR
Converted
TLC556CDR
TLC556CDRG4
NiPdAu Leadframe
Lead-Free Board Process (High-Temp)
G4
••TI’s
TI’sprimary
primaryPb-Free
Pb-Freesolution
solutionisisNickel-Palladium-Gold
Nickel-Palladium-Gold(NiPdAu).
(NiPdAu).
••TI’s
TI’sPb-Free
Pb-Freeleadframe
leadframeproducts
productsare
arebackward
backwardcompatible
compatiblewith
withSnPb
SnPbprocesses.
processes.
••AAPb-Free
Pb-FreePN
PNwill
willbe
beadded
addedusing
usingJEDEC/IPC
JEDEC/IPCbased
basedPb-Free
Pb-Freecodes.
codes.
••Both
Boththe
theStandard
StandardPN
PN&&the
thePb-Free
Pb-FreePN
PNwill
willbe
beorderable
orderablepart
partnumbers.
numbers.
February 27, 2006
12
TI Box Labeling
Outer
OuterBox
BoxShipping
ShippingLabels
Labelswill
willdisplay
displaythe
theordered
orderedpart
partnumber
number(Pb-Free
(Pb-FreePN
PNororStd
StdPN)
PN)
and
will
also
contain
the
PB-Free
logo
and
Pb-Free/Green
Finish
Code.
and will also contain the PB-Free logo and Pb-Free/Green Finish Code.
Ordered PN
Customer
E4
Inner Box/Reel Labels
MSL
Caution
Label
JEDEC Pb-Free Logo & Finish Code
High-Temp
& Low-Temp
MSL Ratings
Assembly Site & Assembly Date Code (YYWW)
Comparing
Comparingthe
theAssembly
AssemblySite
Site&&Date
DateCode
Codetotothe
theSearch
SearchTool
Toolinfo
infowill
willalways
alwaysidentify
identify“Pb-Free”
“Pb-Free”parts.
parts.
February 27, 2006
13
Symbolization Strategy
• Parts will be marked with the following 2-character codes,
space permitting. (~98% of devices are OK, pkg size must be > 3.5mm X 3.5mm )
• This added symbolization may lag the Conversion Date Code
by 1-2 months due to WIP issues.
JEDEC/IPC Finish
Categories
JEDEC/IPC Pb-Free*
Marking Standard
TI-Green*
Marking Standard
E1
E4
G1
G4
(JESD97, IPC-1066)
SnAgCu (BGA solder balls)
Precious Metals (No Tin) Ag, Au, NiPd, NiPdAu
*JESD97 only requires Pb < 1000ppm, TI will only use these markings when parts meet our Pb-Free & Green definitions.
(TI “Pb-Free” = RoHS & High-Temp compatible, TI “Green” = TI “Pb-Free” and no Sb/Br)
Some TI parts (<3%) will use E3 (Matte Tin) or E6 (Tin-Bismuth).
February 27, 2006
14
ti.com Product Folder Example
February 27, 2006
15
ti.com Pb-Free Search Tool
Li-Ion Charge Mgmt IC
February 27, 2006
www.ti.com/productcontent
16
Pb-Free Search Tool Results
Primary Summary Information
>>
RoHS & JIG Level A Substances
Green & JIG Level B Substances
>>
Recyclable Metals & Last Update Info
February 27, 2006
( click for the rest of the columns )
17
Pb-Free Search Tool
Product Content Details
February 27, 2006
( click for more )
18
Material Declaration Certificate
February 27, 2006
ti.com/leadfree
19
TI “Pb-Free” & “Green” Summary
TI’s
TI’sprimary
primaryPb-Free
Pb-FreeSolution
Solutionisis“Whisker-Free”
“Whisker-Free”
We
Wehave
have>15
>15years
yearsexperience
experiencewith
withNiPd
NiPdbased
basedleadframes
leadframes
We’re
We’redoing
doing44conversions
conversions(Pb-Free
(Pb-Free&&Whisker-Free,
Whisker-Free,High-Temp
High-Temp&&Green)
Green)
at
atthe
thesame
sametime
timefor
formost
mostparts
parts==fewer
fewerchanges
changesfor
forcustomers
customers
We’re
We’readding
addingPb-Free
Pb-FreePNs
PNsfor
forBGA
BGA&&Leadframe
Leadframebased
basedparts
parts(Z,
(Z,G4)
G4)
We’re
We’reproviding
providingeasy
easyaccess
accessto
tokey
keyPb-Free
Pb-Freeinfo
info(Search
(SearchTool,
Tool,etc)
etc)
Bottom line - We’re trying to do our part to make this industry transition easier for you.
February 27, 2006
20
Additional TI Pb-Free Info
Self-Serve
Self-Serve …
…
General
––ti.com/ecoinfo
GeneralInfo
Info
ti.com/ecoinfo
App
––ti.com/leadfree
AppNotes
Notes
ti.com/leadfree
Product
––ti.com
ProductFolders
Folders
ti.com
Product
ProductContent/Sch
Content/Sch––ti.com/productcontent
ti.com/productcontent
Pb-Free
Pb-FreeCertificate
Certificate ––ti.com/leadfree
ti.com/leadfree
TI
TI Help
Help …
…
TI
––support.ti.com
TITech
TechSupport
Support
support.ti.com
Questionnaires
––ezSurveys@list.ti.com
Questionnaires
ezSurveys@list.ti.com
TI-authorized
TI-authorizedSales
SalesRepresentative
Representative
February 27, 2006
21