SP-2 - Malcomtech

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MALCOM
Solder Paste Wettability Tester
Model SP-2
INSTRUCTION MANUAL
MALCOMTECH INTERNATIONAL
26200 INDUSTRIAL BLVD.
HAYWARD, CA 94545 USA
TEL. (510) 293-0580
WEB. www.malcomtech.com
FAX. (510) 293-0940
EMAIL. [email protected]
Revised 5/10/01
1
Introduction
Thank you for your purchase of our wetting tester SP-2.
This unit has been developed for evaluating various wettability in SMT soldering. It can evaluates
chip parts employed in SMT and printed circuit boards (PCB) in addition to the evaluation of the
wettability of solder paste. An N2 purge test has been applied by the standard unit to conform to the
expansion of the demands of N2 reflow furnaces in recent years; by reproducing the reflow
atmosphere by this tester at site and utilize this tester for evaluating various wettability.
Please carefully read this instruction manual before starting operation to operate the tester correctly
and to enable it to display its performance sufficiently. Keep this manual carefully after reading it.
Caution:
1. This manual was prepared in the most thorough manner possible, however, if you have
any doubts or suspect any errors, omission, discrepancies, etc., please contact us.
2. Malcom Instruments Corporation is not responsible for product failures resulting from the
misuse of the equipment or disregard of the enclosed instructions.
3. Please examine the shipping box and packing material. If the packing material and
shipping box are in good condition, they can be used to transport the unit. If the packing
material and shipping box show deterioration or damage, do not reuse the packing
material and shipping box. Since this unit is a precision instrument, it can be damaged if it
is transported in an inadequate container. In such circumstances, repairs will be charged
even if the nature of the damage is covered by the warranty.
4. Under any circumstances should the equipment be disassembled. If the equipment has
been disassembled or it appears to have been disassembled, the customer will be charged
for repairs and service.
5. The contents of this manual are subject to change without prior notice.
Revised 5/10/01
2
WARNING!!!
Since table moves vertically, do not place fingers under table.
WARNING!!!
This unit operates under extremely high temperature during
operation. Do not directly touch the cover.
Revised 5/10/01
3
Table of Contents
Packing List .........................................................................................................
4
Parts List
.........................................................................................................
5
Cautions
.........................................................................................................
6
I General
1. Summary ...................................................................................................
2. Features .....................................................................................................
3. Performance Specifications ......................................................................
4. Wettability Evaluation Specifications ......................................................
5. Measuring Principle ..................................................................................
6. Names Of Component Parts......................................................................
7. Functions...................................................................................................
7
7
8
9
10
11
14
II Operation Method
1. Installation Of Software ...........................................................................
2. Preparation For Measurement...................................................................
3. Summary Of Software ..............................................................................
4. Operation Procedures................................................................................
5. Evaluation Parameters ..............................................................................
6. Data Analysis............................................................................................
7. Wire Solder Measuring Method ...............................................................
17
18
23
25
33
35
38
III Files
1. Opening A File..........................................................................................
2. Saving Data Into A File ............................................................................
3. Conversion Into A Text File ....................................................................
40
40
41
IV Setting
1. Scale Change ............................................................................................
2. Environments Setting................................................................................
41
42
Revised 5/10/01
4
V Maintenance & Repair
1. Storage......................................................................................................
2. Calibration & Inspection ..........................................................................
3. Repair .......................................................................................................
4. Option & Spare Parts................................................................................
43
43
43
44
VI Appendix
1. Outer Dimensions.....................................................................................
2. Troubleshooting........................................................................................
3. Error Display ............................................................................................
4. Interface Cable .........................................................................................
5. To The User Of 200V Model ...................................................................
45
47
48
49
50
Revised 5/10/01
5
SP-2 Packing List
Listed below are the items included along with the SP-2 solderability tester when it was shipped. If
any of these items are missing, or any discrepancies are noticed between the packing list and actual
items received, please contact your Malcom dealer as soon as possible.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
SP-2 Main Unit
Heater Unit
Magnetic Chuck
Stencil Printer
Stencil (For Use With Copper Tube)
Stencil (For Use With Chip Resistor)
Stand
Cooling Fan
Air Cooling Nozzle
Copper Plate (20 Per Package)
Copper Tube (20 Per Package)
Copper Tube Holder
Parts Jig
Plate Holder
PCB Holder
Chip Holder (Set Of 4)
N2 Purge Closing Plate
Solderability Analyze Software <SPIN-2>
RS-232C Cable
Power Cord (W/ Adaptor)
Manual
Warranty Slip
1
1
1
1
1
1
1
1
1
1
1
1
5
1
1
1
1
1
1
1
1
1
Revised 5/10/01
6
Parts List
7. Stand
3. Magnetic chuck
9. Air cooling nozzle
2. Heater unit
1. SP-2 Main unit
8. Cooling fan
10. Copper plate
(20ea)
11. Copper tube
(20ea)
5. Stencil
(for copper tube)
12. Copper
tube
holder
4. Stencil printer
14. Plate 15. PCB
holder
holder
6. Stencil
(for chip resistor)
13. Parts
jig
16. Chip holder
17. N2 purge
closing plate
21. Power cord (w/ adaptor)
Revised 5/10/01
7
Note Before Using
1. The load sensor is very sensitive do not expose it to any excessive shock or stress.
(Do not put stress on the sensor more than 10gf directly.)
2. The heater unit including table and cover gets very hot during use, and following
usage. Be careful that you do not burn yourself when opening the cover.
3. When raising or lowering the table, check for clearance, so that the heater cover does not
make contact with the magnetic chuck. Once the chuck is in a testing position, open one
door of the heater cover and check for clearance.
4. When opening or closing the upper cover, do not hit the sensor part (magnetic chuck,
holder part) with the cover.
5. Do not bend the temperature and spring clamp assembly. It causes temperature
difference.
6. Before making a test, be sure the thermocouple wire and heater control connectors are
installed at the sockets in the back panel.
7. If magnetic chuck with or without test piece and jig installed makes contact with the
table, the error light may turn on. To clear the error, push the reset button while lowering
the table. Do not raise the table when the error light is on.
8. Use only a grounded power source, or circuit protection systems in the SP-2 may not
work.
9. When measuring, open the air valve. It causes heater unit trouble.
Revised 5/10/01
8
I. Introduction
I – 1 Introduction
The SP-2 will allow you to observe and evaluate the wettability of solder paste,
components, and substrate materials from a surface mount technology perspective.
Its important to keep this in mind while using the SP-2, after all, the main purpose of
the SP-2 is to hopefully develop, enhance, and control your surface mount process
productivity and reliability.
I – 2 Features
Now you should be able to test the efficiency of solder paste, components, or substrate
materials, by measuring the surface tension and the dynamics as the solder paste changes
its phase from a solid into a liquid, and wets with the materials it comes in contact with.
These tests can be performed under various conditions as relating to reflow temperature
and time profiles. Results from such tests can then be compared to those prescribed by
the manufacturer, or with those implemented in your own reflow process. Certain
limitations however, between am actual reflow environment and a simulated one as in
the case with the SP-2 can not be overlooked. For this reason, all the questions you ask
of the SP-2 must also be confirmed by testing the results under actual conditions.
To say that everything that is known about soldering surface mount components to
printed circuit boards is all you need to know, or that your reflow or soldering process
is already operating with productivity and reliability, is to suppose that you need
not even use the SP-2. The SP-2 is a solderability tester designed with the surface
mount process in mind. This is also what makes this product so unique, and hopefully
very useful to you.
The SP-2 is able to to control a simulated SMT reflow environment by means of a semi
closed heating chamber, including a heating element in the insulated cover, and on the
table itself. This chamber also allows you to test your paste, component, or substrate in
a nitrogen rich environment by means of an inlet and outlet tubing connectors. These
features enhance the SP-2 as a model of an actual SMT reflow environment.
Revised 5/10/01
9
I – 3 Performance Specifications
Item
Specifications
Load Sensor
Temperature
Sensor
Heater Unit
Principle
Electro-balance sensor
Measurement range
10.00 gf – - 5.00 gf
Measurement accuracy
± (10 mgf + 1 digits)
Resolution
Less than 900 mgf : 0.001 gf
more than 900 mgf : 0.005 gf
Measurement range
0 – 300 ゜C
Measurement accuracy
± 3 ゜C *
Temperature of
heater unit
Room temperature – 300 ゜C
O2 Concentration
Semi closed heater unit
With nipple for N2 purge test
Temperature profile setting
1. Preheat temperature 2. Preheat time 0 – 300 sec.
3. Temperature rump up speed 3゜C /sec.
(Max.: 4゜C / sec.)
4. Maximum temperature
5. Maximum temperature time
Melting point
Preset solder paste melting point
Table movement
Automatic : operated with start / stop switch
Manual : operated with up/down switch
(can select 3 steps speed)
RS-232C cable (Malcom format)
Digital output
Air supply
Original air pressure : 0.2 – 0.5 Mpa
(Approx. 2 – 5 kgf / cm2 )
Adjust air : 0.2 Mpa (Approx. 2kgf / cm2 )
Power
* Load sensor accuracy is not concerned oscillation.
Revised 5/10/01
10
I – 4 Specifications for Solderability Analyze
Evaluate object
Test piece
Solder paste
Circuit board
Printed shape
Solder paste
Copper pipe (#1)
(oxidation *)
Test sample
Copper plate
25 x 31
t =0.3mm
Φ6.5t =0.3mm
Specified paste
Copper plate
Actual board
Pad for
component
Specified paste
Copper plate25 x
31t = 0.3mm
Φ6.5
t =0.3mm
Chip parts
Printed board
Piece of board
* 1 Oxidation
150゜C
30 min.
Inner diameter 4φ
Sensor Attachment
3. Magnetic chuck
12. Copper tube holder
Copper tube
14. Plate
holder
15. PCB
holder
Copper angle
Piece of
board
5. Stencil
(for copper tube)
13. Parts
jig
QFP, SOP
1005
1608
2012
3216
16. Chip holder
Chip parts
6. Stencil
(for chip resistor)
Revised 5/10/01
11
I – 5 Measurement Principle
(1) Heater table moves up to solder paste touch to test piece.
(2) The table stops 10sec., after the test piece was inserted solder paste as set amount.
(3) Heater unit temperature rises as set temperature profile.
(4) Inspects the interact power with micro load sensor, and record as curve while the solder
paste melts and then the test piece wets.
Micro load sensor
Contact pin
Sensor part
Chip holder
Air or N2
Chip
Air or N2
Heater unit
up
Copper plate
down
Heater
Solder paste
Up-down part
Temperature Profile
M.P. :
T.a. :
(゜C)
T.b. :
t.a. :
t.b. :
K.a. :
Melting point setting ( ゜C)
Preheat temperature setting
Peak temperature (゜C)
Preheat time (s)
Peak time (s)
Ramp up preheat temperature
(゜C / s)
K.b. : Ramp up peak temperature
(゜C / s)
Revised 5/10/01
12
I – 6 Nomenclature
I – 6 – 1 Main unit
(2) Top cover
(1) Magnetic chuck
(3) Heater table
(4) Temperature sensor
(5) X axis Adjustment
(5) Y axis Adjustment
Revised 5/10/01
13
(11) On-line display
LED
(12) Error display
LED
(13) Reset button
(9) Load display
LED
(14) Heater lamp
(15) Table speed
switch
(10) Temperature display LED
(8) Unit display LED
(20) Air supply valve
(16) Table up-down
button
(18) Air gauge
(19) Air regulator
(7) Power
(17) Cooling switch
Revised 5/10/01
14
I – 6 – 3 Rear Panel
(33) Temperature input
terminal for heater table
(28) Air output nipple
for heater
(21) Circuit breaker
(29) Air input nipple
(34) Temperature input
terminal for upper heater
(30) 10L input nipple
for N2 or air
(35) Cooling air
output nipple
(32) Heater power
(23) Fuse holder
(31) 10L air output
nipple
(27) Dip switch
(25) Terminal block
(22) Unit power
(24) Fan power
(26) RS-232C connector
Revised 5/10/01
15
I – 7 Function Description
I – 7 – 1 Main Unit
(1) Magnetic chuck
Holds the sample which is to be tested. The sensor is located
above of the magnetic chuck, so do not put strong stress more
than 10gf.
(2) Top cover
Top cover has a built in heating device.
(3) Heater table
Used to deliver heat through the base material into the paste
raised and lowered by manual and automatic control.
(4) Temperature sensor
Measures heater table temperature.
(5) X axis adjustment
Moves the table in the X direction.
Adjusts the position of the sample relative to print pattern.
(6) Y axis adjustment
Moves the table in the Y direction.
Adjusts the position of the sample relative to print pattern.
I – 7 – 2 Control panel
(7) Power switch
Turns on the power.
(8) Unit display LED
gf : Displays stress as gf.
mN: Displays stress as mN.
(9) Load display LED
Displays measured value..
(10) Temperature display LED
Displays heater table temperature.
(11) On-line display LED
Lights while computer send signal to SP-2 main unit to
Measure until finish the measurement.
(12) Error display LED
Lights when error occurs during preparing measurement or
measuring, and stops function.
(13) Reset button
When error occurred, resets the error. Except error reset,
clears load data electrically.
(14) Heater lamp
Lights during heater control working, and when it stops heater,
the lamp turned off.
(15) Table speed switch
Switches table up-down speed.
FAST > NORM > SLOW (fast, normal, slow)
Revised 5/10/01
16
(16) Table up-down switch
UP: Lifts the tableDOWN: Lowers the table.
(17) Cooling switch
Controls the cooling fan output terminal (24) and air output
nipple with cooling valve (35) on the rear panel.
(18) Air gauge
Indicates the supply power voltage of heater and cooling air.
Set the pressure to 0.2MPa (approx. 2kgf/cm2) by
air regulator (19).
(19) Air regulator
Indicates the feed pressure of heater and cooling air.
Set the pressure to 0.2MPa (approx. 2kgf/cm2).
(20) Air supply valve
Supplies air to the heater before measurement (due to a hot
air). Turn on the air supply valve.
I – 7 – 3 Rear panel
(21) Circuit breaker
Connect the power supply to the ground without fail for
ensuring normal functions. If the circuit breaker was turned off,
locate its cause and take necessary remedial measures before
use.
(22) Unit power
Connect this power connector to a grounded rated power
source.
(23) Fuse connector
7A (rating)
(24) Fan power
Power output terminal for cooling fan.This is controlled by
cooling switch (17) on the control panel. Caution:Never
connect any fan other than the attached cooling fan to this
terminal, otherwise a trouble may occur.
(25) Terminal block
This is used for control terminals, etc. (option)
(26) RS-232C connector
Serves as a digital output connector for measuring data.
Revised 5/10/01
17
(27) Dip switch
These switches are used for setting the measurement.
ON
OFF
1
8
SW1
1
8
SW2
These switches are preset at the delivery time.
(28) Air output nipple for heater
Supplies air to the heater.Connect this nipple to the heater air
tube.
(29) Air input nipple
Source air inlet for heater and cooling.
Air pressure: 0.2 ~ 0.5MPa (Approx. 2 ~ 5kgf/cm2)
(30)10L input nipple for N2 or
air
This nipple is internally connected to the heater air output
nipple (28) and air is turned on and off by air supply valve (20)
on the control panel. This nipple is normally connected to 10liter air output nipple (31). However, plug the 10-liter air output
nipple (31) and connect this input nipple to N2 feed source
when measurement is done in an N2 atmosphere. (N2 feed rate
0.2MPa, 10 liters/min)
(31)10L air output nipple
The pressure of the air fed into the main unit by air input
nipple (29) is regulated by air regulator (19) on the control
panel, and the regulated air is output from this nipple at a rate
of l0 liters/min by the speed controller.
This nipple is normally connected to N2 or air 10-liter input
nipple. Plug this nipple when measurement is done in an N2
atmosphere.
(32) Heater power
Connect the metal connector of the heater unit to this terminal.
(33) Temperature input terminal Connect the temperature sensor of the heater table to this
for heater
terminal.
(34) Temperature input terminal Connect the temperature sensor of the upper heater.
for upper heater
(35) Cooling air output nipple
This cooling air output nipple is turned on and off by cooling
switch. (17) on the control panel.
Regulate the air flow by this valve.
Revised 5/10/01
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