0 MALCOM Solder Paste Wettability Tester Model SP-2 INSTRUCTION MANUAL MALCOMTECH INTERNATIONAL 26200 INDUSTRIAL BLVD. HAYWARD, CA 94545 USA TEL. (510) 293-0580 WEB. www.malcomtech.com FAX. (510) 293-0940 EMAIL. info@malcomtech.com Revised 5/10/01 1 Introduction Thank you for your purchase of our wetting tester SP-2. This unit has been developed for evaluating various wettability in SMT soldering. It can evaluates chip parts employed in SMT and printed circuit boards (PCB) in addition to the evaluation of the wettability of solder paste. An N2 purge test has been applied by the standard unit to conform to the expansion of the demands of N2 reflow furnaces in recent years; by reproducing the reflow atmosphere by this tester at site and utilize this tester for evaluating various wettability. Please carefully read this instruction manual before starting operation to operate the tester correctly and to enable it to display its performance sufficiently. Keep this manual carefully after reading it. Caution: 1. This manual was prepared in the most thorough manner possible, however, if you have any doubts or suspect any errors, omission, discrepancies, etc., please contact us. 2. Malcom Instruments Corporation is not responsible for product failures resulting from the misuse of the equipment or disregard of the enclosed instructions. 3. Please examine the shipping box and packing material. If the packing material and shipping box are in good condition, they can be used to transport the unit. If the packing material and shipping box show deterioration or damage, do not reuse the packing material and shipping box. Since this unit is a precision instrument, it can be damaged if it is transported in an inadequate container. In such circumstances, repairs will be charged even if the nature of the damage is covered by the warranty. 4. Under any circumstances should the equipment be disassembled. If the equipment has been disassembled or it appears to have been disassembled, the customer will be charged for repairs and service. 5. The contents of this manual are subject to change without prior notice. Revised 5/10/01 2 WARNING!!! Since table moves vertically, do not place fingers under table. WARNING!!! This unit operates under extremely high temperature during operation. Do not directly touch the cover. Revised 5/10/01 3 Table of Contents Packing List ......................................................................................................... 4 Parts List ......................................................................................................... 5 Cautions ......................................................................................................... 6 I General 1. Summary ................................................................................................... 2. Features ..................................................................................................... 3. Performance Specifications ...................................................................... 4. Wettability Evaluation Specifications ...................................................... 5. Measuring Principle .................................................................................. 6. Names Of Component Parts...................................................................... 7. Functions................................................................................................... 7 7 8 9 10 11 14 II Operation Method 1. Installation Of Software ........................................................................... 2. Preparation For Measurement................................................................... 3. Summary Of Software .............................................................................. 4. Operation Procedures................................................................................ 5. Evaluation Parameters .............................................................................. 6. Data Analysis............................................................................................ 7. Wire Solder Measuring Method ............................................................... 17 18 23 25 33 35 38 III Files 1. Opening A File.......................................................................................... 2. Saving Data Into A File ............................................................................ 3. Conversion Into A Text File .................................................................... 40 40 41 IV Setting 1. Scale Change ............................................................................................ 2. Environments Setting................................................................................ 41 42 Revised 5/10/01 4 V Maintenance & Repair 1. Storage...................................................................................................... 2. Calibration & Inspection .......................................................................... 3. Repair ....................................................................................................... 4. Option & Spare Parts................................................................................ 43 43 43 44 VI Appendix 1. Outer Dimensions..................................................................................... 2. Troubleshooting........................................................................................ 3. Error Display ............................................................................................ 4. Interface Cable ......................................................................................... 5. To The User Of 200V Model ................................................................... 45 47 48 49 50 Revised 5/10/01 5 SP-2 Packing List Listed below are the items included along with the SP-2 solderability tester when it was shipped. If any of these items are missing, or any discrepancies are noticed between the packing list and actual items received, please contact your Malcom dealer as soon as possible. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. SP-2 Main Unit Heater Unit Magnetic Chuck Stencil Printer Stencil (For Use With Copper Tube) Stencil (For Use With Chip Resistor) Stand Cooling Fan Air Cooling Nozzle Copper Plate (20 Per Package) Copper Tube (20 Per Package) Copper Tube Holder Parts Jig Plate Holder PCB Holder Chip Holder (Set Of 4) N2 Purge Closing Plate Solderability Analyze Software <SPIN-2> RS-232C Cable Power Cord (W/ Adaptor) Manual Warranty Slip 1 1 1 1 1 1 1 1 1 1 1 1 5 1 1 1 1 1 1 1 1 1 Revised 5/10/01 6 Parts List 7. Stand 3. Magnetic chuck 9. Air cooling nozzle 2. Heater unit 1. SP-2 Main unit 8. Cooling fan 10. Copper plate (20ea) 11. Copper tube (20ea) 5. Stencil (for copper tube) 12. Copper tube holder 4. Stencil printer 14. Plate 15. PCB holder holder 6. Stencil (for chip resistor) 13. Parts jig 16. Chip holder 17. N2 purge closing plate 21. Power cord (w/ adaptor) Revised 5/10/01 7 Note Before Using 1. The load sensor is very sensitive do not expose it to any excessive shock or stress. (Do not put stress on the sensor more than 10gf directly.) 2. The heater unit including table and cover gets very hot during use, and following usage. Be careful that you do not burn yourself when opening the cover. 3. When raising or lowering the table, check for clearance, so that the heater cover does not make contact with the magnetic chuck. Once the chuck is in a testing position, open one door of the heater cover and check for clearance. 4. When opening or closing the upper cover, do not hit the sensor part (magnetic chuck, holder part) with the cover. 5. Do not bend the temperature and spring clamp assembly. It causes temperature difference. 6. Before making a test, be sure the thermocouple wire and heater control connectors are installed at the sockets in the back panel. 7. If magnetic chuck with or without test piece and jig installed makes contact with the table, the error light may turn on. To clear the error, push the reset button while lowering the table. Do not raise the table when the error light is on. 8. Use only a grounded power source, or circuit protection systems in the SP-2 may not work. 9. When measuring, open the air valve. It causes heater unit trouble. Revised 5/10/01 8 I. Introduction I – 1 Introduction The SP-2 will allow you to observe and evaluate the wettability of solder paste, components, and substrate materials from a surface mount technology perspective. Its important to keep this in mind while using the SP-2, after all, the main purpose of the SP-2 is to hopefully develop, enhance, and control your surface mount process productivity and reliability. I – 2 Features Now you should be able to test the efficiency of solder paste, components, or substrate materials, by measuring the surface tension and the dynamics as the solder paste changes its phase from a solid into a liquid, and wets with the materials it comes in contact with. These tests can be performed under various conditions as relating to reflow temperature and time profiles. Results from such tests can then be compared to those prescribed by the manufacturer, or with those implemented in your own reflow process. Certain limitations however, between am actual reflow environment and a simulated one as in the case with the SP-2 can not be overlooked. For this reason, all the questions you ask of the SP-2 must also be confirmed by testing the results under actual conditions. To say that everything that is known about soldering surface mount components to printed circuit boards is all you need to know, or that your reflow or soldering process is already operating with productivity and reliability, is to suppose that you need not even use the SP-2. The SP-2 is a solderability tester designed with the surface mount process in mind. This is also what makes this product so unique, and hopefully very useful to you. The SP-2 is able to to control a simulated SMT reflow environment by means of a semi closed heating chamber, including a heating element in the insulated cover, and on the table itself. This chamber also allows you to test your paste, component, or substrate in a nitrogen rich environment by means of an inlet and outlet tubing connectors. These features enhance the SP-2 as a model of an actual SMT reflow environment. Revised 5/10/01 9 I – 3 Performance Specifications Item Specifications Load Sensor Temperature Sensor Heater Unit Principle Electro-balance sensor Measurement range 10.00 gf – - 5.00 gf Measurement accuracy ± (10 mgf + 1 digits) Resolution Less than 900 mgf : 0.001 gf more than 900 mgf : 0.005 gf Measurement range 0 – 300 ゜C Measurement accuracy ± 3 ゜C * Temperature of heater unit Room temperature – 300 ゜C O2 Concentration Semi closed heater unit With nipple for N2 purge test Temperature profile setting 1. Preheat temperature 2. Preheat time 0 – 300 sec. 3. Temperature rump up speed 3゜C /sec. (Max.: 4゜C / sec.) 4. Maximum temperature 5. Maximum temperature time Melting point Preset solder paste melting point Table movement Automatic : operated with start / stop switch Manual : operated with up/down switch (can select 3 steps speed) RS-232C cable (Malcom format) Digital output Air supply Original air pressure : 0.2 – 0.5 Mpa (Approx. 2 – 5 kgf / cm2 ) Adjust air : 0.2 Mpa (Approx. 2kgf / cm2 ) Power * Load sensor accuracy is not concerned oscillation. Revised 5/10/01 10 I – 4 Specifications for Solderability Analyze Evaluate object Test piece Solder paste Circuit board Printed shape Solder paste Copper pipe (#1) (oxidation *) Test sample Copper plate 25 x 31 t =0.3mm Φ6.5t =0.3mm Specified paste Copper plate Actual board Pad for component Specified paste Copper plate25 x 31t = 0.3mm Φ6.5 t =0.3mm Chip parts Printed board Piece of board * 1 Oxidation 150゜C 30 min. Inner diameter 4φ Sensor Attachment 3. Magnetic chuck 12. Copper tube holder Copper tube 14. Plate holder 15. PCB holder Copper angle Piece of board 5. Stencil (for copper tube) 13. Parts jig QFP, SOP 1005 1608 2012 3216 16. Chip holder Chip parts 6. Stencil (for chip resistor) Revised 5/10/01 11 I – 5 Measurement Principle (1) Heater table moves up to solder paste touch to test piece. (2) The table stops 10sec., after the test piece was inserted solder paste as set amount. (3) Heater unit temperature rises as set temperature profile. (4) Inspects the interact power with micro load sensor, and record as curve while the solder paste melts and then the test piece wets. Micro load sensor Contact pin Sensor part Chip holder Air or N2 Chip Air or N2 Heater unit up Copper plate down Heater Solder paste Up-down part Temperature Profile M.P. : T.a. : (゜C) T.b. : t.a. : t.b. : K.a. : Melting point setting ( ゜C) Preheat temperature setting Peak temperature (゜C) Preheat time (s) Peak time (s) Ramp up preheat temperature (゜C / s) K.b. : Ramp up peak temperature (゜C / s) Revised 5/10/01 12 I – 6 Nomenclature I – 6 – 1 Main unit (2) Top cover (1) Magnetic chuck (3) Heater table (4) Temperature sensor (5) X axis Adjustment (5) Y axis Adjustment Revised 5/10/01 13 (11) On-line display LED (12) Error display LED (13) Reset button (9) Load display LED (14) Heater lamp (15) Table speed switch (10) Temperature display LED (8) Unit display LED (20) Air supply valve (16) Table up-down button (18) Air gauge (19) Air regulator (7) Power (17) Cooling switch Revised 5/10/01 14 I – 6 – 3 Rear Panel (33) Temperature input terminal for heater table (28) Air output nipple for heater (21) Circuit breaker (29) Air input nipple (34) Temperature input terminal for upper heater (30) 10L input nipple for N2 or air (35) Cooling air output nipple (32) Heater power (23) Fuse holder (31) 10L air output nipple (27) Dip switch (25) Terminal block (22) Unit power (24) Fan power (26) RS-232C connector Revised 5/10/01 15 I – 7 Function Description I – 7 – 1 Main Unit (1) Magnetic chuck Holds the sample which is to be tested. The sensor is located above of the magnetic chuck, so do not put strong stress more than 10gf. (2) Top cover Top cover has a built in heating device. (3) Heater table Used to deliver heat through the base material into the paste raised and lowered by manual and automatic control. (4) Temperature sensor Measures heater table temperature. (5) X axis adjustment Moves the table in the X direction. Adjusts the position of the sample relative to print pattern. (6) Y axis adjustment Moves the table in the Y direction. Adjusts the position of the sample relative to print pattern. I – 7 – 2 Control panel (7) Power switch Turns on the power. (8) Unit display LED gf : Displays stress as gf. mN: Displays stress as mN. (9) Load display LED Displays measured value.. (10) Temperature display LED Displays heater table temperature. (11) On-line display LED Lights while computer send signal to SP-2 main unit to Measure until finish the measurement. (12) Error display LED Lights when error occurs during preparing measurement or measuring, and stops function. (13) Reset button When error occurred, resets the error. Except error reset, clears load data electrically. (14) Heater lamp Lights during heater control working, and when it stops heater, the lamp turned off. (15) Table speed switch Switches table up-down speed. FAST > NORM > SLOW (fast, normal, slow) Revised 5/10/01 16 (16) Table up-down switch UP: Lifts the tableDOWN: Lowers the table. (17) Cooling switch Controls the cooling fan output terminal (24) and air output nipple with cooling valve (35) on the rear panel. (18) Air gauge Indicates the supply power voltage of heater and cooling air. Set the pressure to 0.2MPa (approx. 2kgf/cm2) by air regulator (19). (19) Air regulator Indicates the feed pressure of heater and cooling air. Set the pressure to 0.2MPa (approx. 2kgf/cm2). (20) Air supply valve Supplies air to the heater before measurement (due to a hot air). Turn on the air supply valve. I – 7 – 3 Rear panel (21) Circuit breaker Connect the power supply to the ground without fail for ensuring normal functions. If the circuit breaker was turned off, locate its cause and take necessary remedial measures before use. (22) Unit power Connect this power connector to a grounded rated power source. (23) Fuse connector 7A (rating) (24) Fan power Power output terminal for cooling fan.This is controlled by cooling switch (17) on the control panel. Caution:Never connect any fan other than the attached cooling fan to this terminal, otherwise a trouble may occur. (25) Terminal block This is used for control terminals, etc. (option) (26) RS-232C connector Serves as a digital output connector for measuring data. Revised 5/10/01 17 (27) Dip switch These switches are used for setting the measurement. ON OFF 1 8 SW1 1 8 SW2 These switches are preset at the delivery time. (28) Air output nipple for heater Supplies air to the heater.Connect this nipple to the heater air tube. (29) Air input nipple Source air inlet for heater and cooling. Air pressure: 0.2 ~ 0.5MPa (Approx. 2 ~ 5kgf/cm2) (30)10L input nipple for N2 or air This nipple is internally connected to the heater air output nipple (28) and air is turned on and off by air supply valve (20) on the control panel. This nipple is normally connected to 10liter air output nipple (31). However, plug the 10-liter air output nipple (31) and connect this input nipple to N2 feed source when measurement is done in an N2 atmosphere. (N2 feed rate 0.2MPa, 10 liters/min) (31)10L air output nipple The pressure of the air fed into the main unit by air input nipple (29) is regulated by air regulator (19) on the control panel, and the regulated air is output from this nipple at a rate of l0 liters/min by the speed controller. This nipple is normally connected to N2 or air 10-liter input nipple. Plug this nipple when measurement is done in an N2 atmosphere. (32) Heater power Connect the metal connector of the heater unit to this terminal. (33) Temperature input terminal Connect the temperature sensor of the heater table to this for heater terminal. (34) Temperature input terminal Connect the temperature sensor of the upper heater. for upper heater (35) Cooling air output nipple This cooling air output nipple is turned on and off by cooling switch. (17) on the control panel. Regulate the air flow by this valve. Revised 5/10/01