MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 5x6, 1.27P PowerPhase FET
CASE 506CR
ISSUE C
DATE 07 JUL 2015
1
2X
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND b1 APPLY TO PLATED TERMINAL AND ARE
MEASURED BETWEEN 0.15 AND 0.25 MM FROM THE TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED PADS AS WELL AS THE
TERMINALS.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
0.20 C
D
A
B
D1
8
7
ÏÏ
ÏÏ
PIN ONE
IDENTIFIER
1
2
6
2X
0.20 C
5
E1
E
4X
h
3
c
4
A1
TOP VIEW
A
0.10 C
DETAIL A
0.10 C
C
NOTE 4
SIDE VIEW
8X
b
0.10
M
0.05
M
1
5X
DETAIL A
L
6X
SEATING
PLANE
NOTE 6
0.10
C A B
C
M
C A B
DIM
A
A1
b
b2
c
D
D1
D2
D3
E
E1
E2
E3
E4
e
G
G1
h
L
L2
MILLIMETERS
MIN
MAX
0.90
1.10
0.00
0.05
0.40
0.60
0.40
0.60
0.20
0.30
5.15 BSC
4.90
5.10
3.70
3.90
2.96
3.16
6.15 BSC
5.80
6.00
2.37
2.57
1.05
1.25
1.36
1.56
1.27 BSC
0.625 BSC
1.615 BSC
−−−
12 _
0.34
0.59
1.68
1.93
D2
NOTE 3
1
E3
b2
0.10
G1
E4
M
C A B
E2
G
RECOMMENDED
SOLDERING FOOTPRINT*
L2
D3
e/2
e
BOTTOM VIEW
5.50
4.05
SUPPLEMENTAL
BOTTOM VIEW
1.27
PITCH
0.62
GENERIC
MARKING DIAGRAM*
2.07
1
5X
0.75
0.54
1.22
2.67
XXXXXX
AYWZZ
1.66
XXXXXX= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
*This information is generic. Please refer
to device data sheet for actual part
marking.
DOCUMENT NUMBER:
98AON78387F
5X
0.71 2.31
0.76
0.23
0.98
6.50
6X
0.65
4.10
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8 5X6, 1.27P POWERPHASE
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1 FET
DOCUMENT NUMBER:
98AON78387F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
18 SEP 2013
A
MODIFIED RECOMMENDED MOUNTING FOOTPRINT. REQ. J. O’NEIL.
04 FEB 2014
B
CHANGED DIMENSION A FROM 1.35MIN, 1.55MAX TO 0.90MIN, 1.10MAX. REQ.
BY J. O’NEIL.
06 NOV 2014
C
CORRECTED NUMBER OF SIDE LEADS ON TOP VIEW, ISO IMAGE AND MARKING DIAGRAM FROM TWO TO THREE. REQ. BY P. CELAYA.
07 JUL 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. C
Case Outline Number:
506CR