Energy-Efficient, Air-Cooled Architecture
•Offers a wide range of flexible configurations
based on industry-standard technologies
•Uses innovative technologies at a great price to
performance ratio
•Delivers an integrated HPC cluster software stack
and reliable cluster management software
•Provides a modular and scalable turnkey solution
with worldwide support and services
Air-Cooled Architecture Delivering
Outstanding Price/Performance
System Overview
The Cray CS300-AC™ cluster supercomputer is a highly scalable
architecture that groups optimized, industry-standard building block
server platforms into a unified, fully integrated system. Designed
for medium- to large-scale capacity and data-intensive computing
workloads, the Cray CS300-AC addresses both massively parallel and
Big Data analysis challenges.
From a performance perspective, the Cray CS300-AC offers the ability
to scale to over 11,000 compute nodes (nearly 300 racks) and over
25 petaflops. It is integrated with Cray’s HPC cluster software stack
including Cray’s Advanced Cluster Engine™ management software,
providing a robust management suite delivering network, server,
cluster and storage management.
The Cray CS300-AC system turbocharges industry-standard
technologies with innovative and flexible HPC designs. A turnkey
solution offering compute density, superior energy efficiency and
price/performance with high performance network connectivity
and the latest processing technologies, the Cray CS300-AC system
delivers a wide range of configuration options. The air-cooled design
can provide additional savings in power consumption through the
use of rear door heat exchangers.
Ideal Environments
The Cray CS300-AC system is designed for medium-to-large scale
capacity and data-intensive computing workloads, addressing both
massively parallel applications and Big Data analytics challenges.
Capacity Computing
Configurations focus on the latest processors including Intel®
Xeon® and AMD Opteron™ with support for Intel® Xeon Phi™
coprocessors or NVIDIA® Tesla® GPU computing accelerators.
•Energy-efficient platform and superior performance per dollar
•Maximizes throughput for massive parallel computing
applications
Data-Intensive Computing
Configurations focus on memory and bandwidth with excellent
memory capacity per FLOP.
•Tight integration with Lustre-based global parallel storage
systems including Cray Cluster Connect and Cray Sonexion®
using hierarchical storage – SSD, HD RAS features and data
management and connectivity tools
• Processes, manages and analyzes large volumes of data – “Big
Data”
Air-Cooled, Energy-Efficient Architecture
•Efficient design with a wide range of flexible
configurations
•Optional 480V power distribution with a choice of 208V or
277V 3-phase power supplies
Flexible and Scalable Configurations
•Two-socket industry-leading x86 processors and
accelerator-based platforms
•Multiple interconnect options including 3D Torus/fat tree,
single/dual rail, QDR/FDR IB, GigE
•Wide range of parallel file storage systems including Cray
Cluster Connect and Cray Sonexion
Manageable
•Integrated HPC cluster software stack featuring Cray’s
Advanced Cluster Engine (ACETM) management software
•Multi Linux OS support
•Manages heterogeneous nodes with different OS stacks
•Message passing libraries, compilers (including Cray
Compiler Environment), debuggers and performance tools
•Network, server, cluster, and storage management
•Fine-grain system power and temperature monitoring
•Export and import of system configurations and images
•Detects hardware, fabric topology configuration errors
•Version control and ability to roll back changes
•Integrated support for SLURM and interoperable with any
commercial or open source scheduler
Reliable and Serviceable
•No single point of failure with fault-tolerant capabilities
•All critical components are easily accessible and hot
swappable
•Built-in multi-generation configuration software
•Turnkey installation services with worldwide support and
service options
Flexible and Energy-Efficient Architecture
The Cray CS300-AC system can be configured in a fat tree or 3D Torus
architecture making it optimized for superior application performance.
The system incorporates two types of dedicated nodes: compute
and service nodes. Compute nodes are designed to run parallel MPI
and/or Open MP tasks with maximum efficiency. Service nodes are
designed to provide scalability and I/O connectivity and can function
as login nodes where applications are compiled and launched.
Highly Configurable Compute Nodes
Each Cray CS300-AC system is based on blade or rackmount building
block platforms featuring up to 768GB DDR3 memory per node.
Memory controllers ensure highly reliable memory performance
while retaining platform upgradeability and flexibility. In addition, the
platform supports a variety of hybrid computing configurations.
Scalable Interconnect Performance
The interconnect fabric for the system can be configured as a singleor dual-rail InfiniBand network. If single-rail, the compute nodes
have a single QDR or FDR InfiniBand connection to the InfiniBand
interconnect fabric. If dual-rail, the compute nodes have two
InfiniBand connectors. The InfiniBand I/O channels on the compute
nodes are based on low-latency host channel adapters. Each Scalable
Unit (SU) modular rack system configuration can be replicated over
and over to build reliable and very powerful large-scale systems using
industry-standard components with a choice of fat tree or 3D Torus
network topologies.
Intel® Xeon® Processor
The Intel Xeon processor is at the heart of the agile, efficient datacenter. Built on Intel’s industry-leading microarchitecture
based on the 22nm 3D Tri-Gate transistor technology and featuring Intel Node Manager, the Intel Xeon processor delivers
enhanced energy efficiency and performance that adapts to the most complex and demanding workloads. In addition, the
processor offers Intel Advanced Vector Exchange for accelerating floating point operations, Intel Turbo Boost Technology
2.0 for greater peak load performance and Intel Hyper-Threading for multi-threaded and concurrently running applications.
The Intel Xeon processor also offers Intel Integrated I/O, which supports PCIe 3.0 specifications to help reduce latency and
improve bandwidth by up to 2x over the previous Intel Xeon processor.
Intel® Xeon Phi™ Coprocessor for Parallel Workloads
The Intel Xeon Phi coprocessor x100 series is based on Intel Many Integrated Core (Intel MIC) Architecture and its works
synergistically with the Intel Xeon processor to increase developer productivity via common programming models and tools. The
Intel Xeon Phi coprocessor x100 series enables dramatic performance gains for demanding applications delivering over 1 teraflop
peak double-precision performance. It offers many-core compared to multicore with wider vector processing units for greater
floating point performance/watt. The Intel Xeon Phi coprocessor is highly parallel and programmable based on open standards
with support for data thread and process parallelism with full support from Intel Cluster Studio XE while delivering outstanding
aggregate performance and higher memory bandwidth.
AMD Opteron™ Processor
The AMD Opteron 6300 Series processor features up to sixteen cores per processor within the same package, 1MB of L2 cache per
core and a shared 16MB of L3 cache per socket delivering improved performance per watt for multithreaded environments, all in
the same power bands with the same power saving features as previous generations. It supports higher DDR3 frequencies and a
maximum memory bandwidth of 51.2GB/s for memory-intensive workloads. It features AMD-P 2.0 technology to control power
and cooling, Direct Connect Architecture 2.0 with HyperTransport™ Technology to help improve system efficiency and scalability,
and AMD Virtualization Technology making it easier to virtually manage your supercomputer. Overall, the AMD Opteron 6300
Series processor delivers performance for the real world and value for real budgets by offering low acquisition costs that help
reduce TCO.
NVIDIA® Tesla® K40 GPU Computing Accelerator
The NVIDIA® CUDA™ architecture enables developers to utilize simplified many-core NVIDIA GPUs to solve the most complex,
intensive computing tasks from the CPU to the GPU. It maximizes bandwidth while working with virtually any PCIe-complaint host
system. Solve your most demanding HPC and big data challenges on the NVIDIA Tesla K40 GPU Accelerator, the world’s fastest
accelerator that features 2,880 cores and the industry’s highest single and double precision peak floating point performance –
4.29Tflops and 1.43Tflops respectively. Equipped with 12GB of GPU accelerator memory, the NVIDIA Tesla K40 GPU accelerator
processes 2x larger datasets to solve the world’s most challenging computational problems. It also outperforms CPUs by up to 10x
and delivers additional performance with its GPUBoost feature, converting power headroom into user-controlled performance
boost.
Cray HPC Cluster Software Stack
Performance
Monitoring
Cray HPC Cluster Software Stack
Cray delivers a complete end-to-end solution
combining hardware, software and professional
services to support the job execution,
monitoring, management and debugging tools
that facilitate running large, complex HPC
applications. The HPC cluster software stack
works with multiple Linux OS distributions
such as Red Hat, CentOS and SUSE as well as
multiple open source and commercial compiler
suites, MPI distributions and many other HPC
software tools. The HPC software stack also
supports the Cray Compiler Environment (CCE)
and Cray LibSci.
HPCC
Perfctr
IOR
PAPI/IPM
netperf
Development
Tools
Cray Compiler
Environment (CCE)
Intel® Cluster
Studio
PGI (PGI CDK)
GNU
Application
Libraries
Cray LibSci
MVAPICH2
OpenMPI
Intel® MPI
(Cluster Studio)
Resource
Management/
Job Scheduling
Grid Engine
Integrated
File System
NFS
SLURM
Integrated
Altair PBS
Professional
Local FS
(ext3, ext4, XFS)
IBM Platform
LSF
PanFS
Torque/Maui
Lustre
Provisioning
Cray® Advanced Cluster Engine (ACE™) Management Software
Cluster
Monitoring
Cray ACE (iSCB and OpenIPMI)
Remote Power
Management
Cray ACE
Remote Console
Management
Cray ACE
Operating
System
Linux (Red Hat, CentOS, SUSE)
Management Software Designed for the Cray
CS300 Cluster Supercomputer Series
Features and Benefits
Cray’s Advanced Cluster Engine (ACETM) management
software is part of Cray’s HPC cluster software stack. ACE
is a complete management software suite designed to
eliminate the complexity of managing an HPC cluster while
providing all the tools necessary to run large, complex
applications. ACE software includes command line (CLI) and
graphical user interfaces (GUI) providing flexibility for the
cluster administrator. An intuitive and easy-to-use ACE GUI
connects directly to the ACE Daemon on the management
server and can be executed on a remote system running
Linux, Windows or Mac OS. The management modules
include network, server, cluster and storage management.
ACE Software Supports:
•Multiple network topologies and diskless configurations
with optional local storage
•Network failover with high scalability and maximum
reliability
•Customizable HPC development environment for
industry-standard platforms and software configurations
•Heterogeneous nodes with different software stacks
•System power and temperature monitoring
Cray HPC Cluster Software Stack
Advanced Cluster Engine - Remote Management Software
Turns Cray Clusters into Functional, Usable, Reliable and Available Computing Systems
Cray CS300-AC Cluster Supercomputer
Architecture Air cooled, up to 80 nodes per rack cabinet
Support for up to 12-core, 64-bit, Intel® Xeon® processor E5-2600 v2 product family
Support for 12- or 16-core AMD Opteron™ 6300 Series processor
Processor Optional support for Intel® Xeon Phi™ coprocessors (5110P – 60 cores; 3120P -– 57 cores)
Optional support for NVIDIA® Tesla® GPU computing accelerators (K10 – 2x 1,536 cores; K20 – 2,496 cores;
K20X – 2,688 cores; K40 – 2,880 cores per GPU)
Up to 256GB registered ECC DDR3 SDRAM per compute node
Memory
Intel Xeon Phi coprocessor (5110P – 8GB GDDR5 memory; 3120P – 6GB GDDR5 memory
NVIDIA Tesla GPU computing accelerators (K10 – 8GB GDDR5 memory; K20 – 5GB GDDR5 memory; K20X – 6GB
GDDR5 memory; K40 – 12GB GDDR5 memory)
1GbE or 10GbE Ethernet
Interconnect
QDR or FDR InfiniBand with ConnectX®-3 or True Scale Host Channel Adapters
External I/O Interface
Options for single or dual-rail fat tree or 3D Torus
Advanced Cluster Engine (ACE™): Complete remote management capability
Graphical and command line system administration
System software version rollback capability
Redundant management servers with automatic failover
System Administration, Automatic discovery and status reporting of interconnect, server and storage hardware
Resource Management, Partition a cluster into multiple logical clusters, each capable of hosting a unique software stack
Job Scheduling Integrated job scheduling and management with options for Grid Engine, SLURM, Altair PBS Professional, IBM
Platform LSF or Torque/Maui
Remote server control (power on/off, cycle) and remote server initialization (reset, reboot, shut down)
Scalable fast diskless booting for large node systems and root file systems for diskless nodes
Multiple global storage configurations
Redundant power, cooling, and management servers with failover capabilities
Reliable, Available,
Redundant networks (InfiniBand, GbE and 10GbE) with failover
Serviceable (RAS)
All critical components easily accessible and hot swappable
File System
Cray Cluster Connect, Cray Sonexion, NFS, Local FS (Ext3, Ext4 XFS), Lustre® and Panasas® PanFS available as
global file systems
Disk Storage Full line of FC-attached disk arrays with support for FC, SATA disk drives and SSDs
Operating System Red Hat, SUSE or CentOS
Performance Monitoring Tools Options for HPCC, Perfctr, IOR, PAPI/IPM, netperf
Options for Open MPI, MVAPICH2 or Intel MPI Libraries
Compilers, Libraries & Tools Cray Compiler Environment (CCE), Cray LibSci, PGI, Intel Cluster Toolkit compilers, NVIDIA® CUDATM, CUDA C/C++/
Fortran, OpenCL, DirectCompute Toolkits, GNU, TotalView, OFED programming tools
Power Up to 28KW per cabinet depending on configuration
Optional 480V power distribution with a choice of 208V or 277V 3-phase power supplies
Air cooled
Cooling Features Airflow: 3,000 cfm; Intake: front; Exhaust: back
Optional passive or active chilled cooling rear door heat exchangers
Cabinet Dimensions (HxWxD) 78.39”(1991mm) x 23.62”(600mm) x 47.24”(1200mm) standard 42U/19” rack cabinet
Cabinet Weight 1,856.3 lbs.; 232 lbs./sq. ft. per cabinet
Support and Services Turnkey installation services with worldwide support and service options
BUILDING BLOCK PLATFORM
Cray GreenBlade™ System
Building Block Platform for the Cray CS300-AC™ Cluster Supercomputer
The Cray GreenBlade™ system is an energy efficient, air-cooled and modular component building block platform for the Cray
CS300-AC™ cluster supercomputer. It consolidates server, storage, power and simplified management capabilities while providing
performance, reliability, density and upgradeability. With flexible configuration options and low total cost of ownership, the Cray
GreenBlade system allows companies to grow at their own pace.
Customers can choose from two GreenBlade subrack height form factors: 5U and 8U. Both subracks feature hot-swappable and
redundant cooling fans, power supplies and blade nodes. The GreenBlade system’s unique design decreases power consumption
per node compared to 1U servers, significantly reducing datacenter energy costs. In addition, the subrack systems offer hybrid server
node configurations with a modular and flexible architecture that gives customers affordable and easy-to-deploy mix and match
compute blade options.
Based on the Intel® Xeon® processor, the GreenBlade system offers outstanding performance. Each processor supports up to twelve
cores, handling up to 48 threads per node while drawing less power to achieve higher clock speeds for better efficiency. The blades
also offer integrated SATA, PCIe, and support for Intel Advanced Vector Extensions, Intel Turbo Boost Technology 2.0, and Intel
Integrated I/O with Intel Data Direct I/O.
The Cray GreenBlade system provides intelligent power control and integrated IPMI for remote server management capabilities.
For customers that require a more complete management solution, Cray offers its Advanced Cluster Engine (ACE™) management
software suite.
Features and Benefits
Two Intel® Xeon® processors per node, up to twelve cores for each CPU
•Built on Intel’s industry-leading 22nm 3D Tri-Gate transistor technology
•Up to 35% performance boost over prior Intel Xeon processor generations
•Reduces latency and improves bandwidth with Intel Integrated I/O
•Intel Node Manager allows hosting of heavier workloads while guarding against overheating
•Intel Advanced Vector Extensions accelerate floating point operations
Modular, flexible and scalable building block platform
•Support for Intel® Xeon Phi™ coprocessors or NVIDIA® Tesla® GPU computing accelerators
•IPMI 2.0 compliant with cluster management software options
•Reliable and serviceable with hot-swappable, redundant fans and power supplies
•Power-optimized design delivers reduced power consumption
Cray GreenBlade Subracks
BUILDING BLOCK PLATFORM
Cray GreenBlade Subracks
Cray SR8116
(Custom Only)
Cray SR5110
Form Factor 5U
8U
10 GB512X CPU Blades (or)
16 GB512X CPU Blades (or)
Server Capacity 5 GB512X CPU Blades + 5
Expansion Blades
8 GB512X CPU Blades + 8
Expansion Blades
Up to 20 CPUs
Cray SR8104
8U
8U
4 GB812X Management
Blades
4 GB824M/N Hybrid Blades
Up to 32 CPUs
Up to 10 CPUs + 10 NVIDIA
Tesla® K10/K20/K20X/K40
Processor Capacity accelerators
®
Up to10 CPUs + 10 Intel®
Xeon Phi™ coprocessors
3120P/5110P
Up to 16 CPUs + 16 NVIDIA
Tesla K10/K20/K20X/K40
accelerators
Cray SR8204
Up to 8 CPUs + 16 NVIDIA
Tesla K10/K20/K20X/K40
accelerators
Up to 8 CPUs
Up to 8 CPUs + 16 Intel Xeon
Phi coprocessors
3120P/5110P
Up to16 CPUs + 16 Intel
Xeon Phi coprocessors
3120P/5110P
Up to 4 1630W highefficiency PSUs in redundant
Power Supply N+1 configuration
Up to 6 1630W highefficiency PSUs in redundant
N+1 configuration
Up to 6 1630W highefficiency PSUs in redundant
N+1 configuration
Up to 6 1630W highefficiency PSUs in redundant
N+1 configuration
Max power delivery: 4.89kW
Max power delivery: 8.15kW
Max power delivery: 8.15kW
Max power delivery: 8.15kW
6
6
6
Redundant Cooling
3
Fan Units
Remote Management
Dimensions (HxWxD)
Optional: Up to 2 GbE LAN ports for iSCB management communications
8.6” x 19” x 30”
218 x 483 x 764 (mm)
Maximum Weight
173.6 lbs. (78.4 kg)
(including servers & PSUs)
13.84” x 19”x 30”
351 x 483 x 764 (mm)
13.84” x 19”x 30”
351 x 483 x 764 (mm)
13.84” x 19” x 31.58”
351 x 483 x 802 (mm)
273 lbs. (123.8 kg)
215 lbs. (97.5 kg)
246 lbs. (116.1 kg)
Cray GreenBlade Building Block Platform Configuration Matrix
BUILDING BLOCK PLATFORM
Cray GreenBlade Subracks
5U – SR5110
8U – SR8116
(Custom Only)
8U – SR8104
8U – SR8204
Cray GreenBlade Servers
Management Blade Server
GB812X (CPU)
ü
Compute Blade Server
GB824M
GB512X (CPU)
GB512M (Coprocessor Expansion)
GB512N (Accelerator Expansion)
ü
ü
ü
ü
ü
ü
GB824M (CPU/Coprocessor Hybrid)
ü
ü
GB824N (CPU/Accelerator Hybrid)
GB512X Blade Node
GB824N
GB512X Blade Node
+ GPU/Coprocessor
Expansion
GB812X
Cray GreenBlade System: Compute Blade Server Specifications
BUILDING BLOCK PLATFORM
Cray GreenBlade Servers
Compute
Management
Cray GB512X
Cray GB812X
CPU Sockets
Compute Hybrid
Cray GB824M
2 per chassis
Processor
Up to 12-core Intel® Xeon® processor E5-2600 v2 product family (115W max per CPU)
Chipset
Intel C600-A Platform Controller Hub (PCH)
System Bus
Intel QuickPath Interconnect (Intel QPI)
Memory Type
800/1066/1333/1600/1866 MHz LR/U/R-DIMMs DDR3
Memory Capacity
Accelerator/Coprocessor
Up to 256GB in 8 DIMMs across 8 memory channels
(4 channels per processor using 32GB DIMMs)
Optional GB512N expansion
blade – up to 2 NVIDIA®
Tesla® GPUs (K10 – 2x
1,536 cores; K20 – 2,496
cores; K20X – 2,688 cores;
K40 – 2,880 cores per GPU)
Disk Controller On-board SATA 6Gb/s
Hard Drive Bays 1 fixed 2.5”
Up to 512GB in 16 DIMMs across 8 memory channels
(4 channels per processor using 32GB DIMMs)
N/A
Up to 4 Intel Xeon Phi
coprocessors
(3120P – 57 cores; 5110P –
60 cores per coprocessor)
Up to 4 NVIDIA Tesla GPUs
(K10 – 2x 1,536 cores; K20
– 2,496 cores; K20X – 2,688
cores; K40 – 2,880 cores per
GPU)
Add-on SATA/SAS RAID
w/BBU
On-board SATA 6Gb/s
On-board SATA 6Gb/s
3 hot-swap 3.5” or
6 hot-swap 2.5”
2 hot-swap 2.5”
2 hot-swap 2.5”
Optional GB512M
expansion blade - up
to 2 Intel® Xeon Phi™
coprocessors (3120P – 57
cores; 5110P – 60 cores per
coprocessor)
Graphics
Network Interface
Cray GB824N
Integrated VGA graphics
Dual-port Ethernet controller (optional on-board single-port ConnectX®-3 QDR or FDR InfiniBand with QSFP)
I/O
2 USB 2.0 compliant, 2 RJ-45 LAN ports, DB-15 VGA, optional IB (QSFP)
Up to 4 low profile:
1 x16 (internal)
PCIe Gen3 Expansion slots 1 low profile x16
1 x16
2 x8
1 low profile x8 (Not
available with on-board IB)
1 low profile x8 (not
available with on-board IB)
4 x16 for Intel Xeon Phi
coprocessors
3120P/5110P
4 x16 for NVIDIA Tesla K10/
K20/K20X/K40 GPUs
Cray Inc. • 901 Fifth Avenue, Suite 1000 • Seattle, WA 98164 • Tel: 206.701.2000 • Fax: 206.701.2500 • www.cray.com
© 2013 Cray Inc. All rights reserved. Specifications are subject to change without notice. Cray is a registered trademark, and GreenBlade, CS300-AC and ACE are trademarks of Cray Inc. All other trademarks mentioned herein are the
properties of their respective owners. Performance statements and results have been estimated based on internal Cray analysis and are provided for informational purposes only. Any difference in system hardware or software design or
configuration may affect actual performance. Cray does not control or audit the design or implementation of third party benchmarks and product claims in this document. 20131030EMS
BUILDING BLOCK PLATFORM
Cray Rackmount Servers
Building Block Platforms for the Cray CS300-AC™ Cluster Supercomputer
Cray rackmount servers offer air-cooled and flexible building block platforms for the Cray CS300-AC cluster supercomputer. These
optimized, industry-standard building block platforms provide a wide range of configuration options delivering outstanding
performance, reliability and flexibility for medium- to large-scale capacity and data-intensive computing workloads. Cray rackmount
servers offer configuration flexibility with a choice of one or four motherboards in a 2U form factor. Configurations can be based on
AMD Opteron™ or Intel® Xeon® processors as well as hybrid options featuring Intel® Xeon Phi™ coprocessors.
Features and Benefits
•Latest AMD Opteron or Intel Xeon processor technology
•Support for Intel Xeon Phi coprocessors
•Compact design delivering outstanding storage capacity, memory and I/O bandwidth
•Support for 256GB, 512GB, or 768GB of memory per server
•Toolless access to chassis, memory, HDDs, PCI card, blowers and power supply
•Easy to maintain and service – hot-swappable power supplies, hard drives and fans
•Choice of Linux or Windows® operating systems
•Outstanding total cost of ownership, system density and computing capability
Rackmount Server Comparison Table
Based on the latest AMD Opteron or Intel Xeon processor technology
Compute Nodes
2320HT
Motherboard 4 per chassis
AMD Opteron 6300 Series
CPU processor
CPU Capacity 2 per board; 8 per chassis
512GB in 16 DIMM slots per
Max. Memory board
Storage 6.0TB SATA
Power Supply 1400W redundant
CPU / 42U Rack 168
Management Nodes
2620XT
4 per chassis
2328H
2628X
1 per chassis
1 per chassis
Intel Xeon processor
E5-2600 v2 product family
AMD Opteron 6300 Series
processor
Intel Xeon processor
E5-2600 v2 product family
with support for Intel Xeon
Phi coprocessors (3120P,
5110P, 7120P, 3120A)
2 per board; 8 per chassis
2
2
256GB in 8 DIMM slots per
board
512GB in 16 DIMM slots
768GB in 24 DIMM slots
6.0TB SATA
16.0TB SATA
16.0TB SATA/SAS
1600W redundant
720W redundant
750W redundant
168
42
42
Cray 2320HT Rackmount Server Specifications
Based on the AMD Opteron™ 6300 Series processor, the performance-optimized Cray 2320HT is a four motherboard server with
two processors per motherboard offering a high density, eightprocessor 2U server. This server is the foundation for building a
large cluster with a minimum of floor space.
BUILDING BLOCK PLATFORM
Cray 2320HT Server
Motherboard 4 per chassis
Processor 12- to 16-core AMD Opteron 6300 Series processor
Processor Capacity 2 per board; 8 per chassis
Chipset AMD SR5670/SP5100
Memory Type Registered ECC DDR3 1066/1333/1600MHz
Memory Capacity Up to 512GB in 16 DIMMs (per board, using 32GB DIMMs)
Disk Controller On-board SATA controller (RAID 0,1) (per board)
Drive Bays Up to 3 hot swap 3.5” SATA (per board)
Storage Capacity Up to 6.0TB SATA
On-Board Graphics Integrated Matrox G200 16MB DDR2 VGA graphics
Network Interface
On-board dual-port Intel 82576 Gigabit Ethernet controller
Optional on-board 1-port Mellanox ConnectX-2 QDR InfiniBand (QSFP)
Input/Output 2 USB 2.0 compliant ports, two RJ45 LAN ports, VGA, serial, dedicated LAN for IPMI (per board)
Expansion Slots Low-profile PCIe 2.0 x16 slot with riser card (per board)
Power Supplies Redundant (1+1) 1400W high efficiency (80 PLUS Gold efficiency)
Power Input
AC input voltage: (1100W output) 100V-140V AC; 11-7.5A
Rated input frequency: 50-60Hz
Cooling 4x 80mm PWM cooling fans
Weight 85 lbs.; 38.6 kg.
Dimensions 3.47”H (88mm) x 17.25”W (438mm) x 28.55”D (725mm)
Temperature Operating: 10-35°C; Storage: -40-70°C
Server Management IPMI 2.0 integrated on the BMC (per node)
AMD, the AMD Arrow logo, AMD Opteron™, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Cray 2328H Rackmount Server Specifications
Based on the AMD Opteron™ 6300 Series processor, the Cray
2328H server offers up to two processors per server. Designed to
address a variety of HPC applications, it offers outstanding memory
and storage capacity, energy efficiency and configuration flexibility.
BUILDING BLOCK PLATFORM
Cray 2328H Server
Motherboard 1 per chassis
Processor 12- to 16-core AMD Opteron 6300 Series processor
Processor Capacity 2
Chipset AMD SR5670/SP5100
Memory Type Registered ECC DDR3 1066/1333/1600MHz
Memory Capacity Up to 512GB in 16 DIMM slots (using 32GB DIMMs)
Disk Controller
Drive Bays
On-board SATA controller (AMD SP5100), up to 6 ports (RAID 0, 1, 10)
Optional: up to 8 ports SATA/SAS with add-on HW RAID controller
8 hot-swap 3.5” SATA (SAS available with optional HW RAID controller)
Optical drive bay supports slim DVD-ROM drive
Storage Capacity Up to 32TB SATA
On-Board Graphics Integrated Matrox G200 16MB DDR2 VGA graphics
Network Interface On-board dual-port Intel 82576 Gigabit Ethernet controller
Input/Output 4 USB 2.0 compliant ports, 2 RJ45 LAN ports, keyboard, mouse, VGA and serial ports, dedicated LAN for IPMI
Expansion Slots 3 PCIe 2.0 x8 slots
Power Supplies Redundant 720W high efficiency (80 PLUS Gold efficiency)
AC input voltage: 100V-240V AC
Power Input Rated input current: 9A-4A
Rated input frequency: 50 - 60Hz
Cooling 3 80mm PWM cooling fans
Weight 55 lbs.; 29.9 kg.
Dimensions 3.5”H (89mm) x 17.2”W (438mm) 25.5”D (648mm)
Temperature Operating: 10-35°C; Storage: -40-70°C
Server Management IPMI 2.0 integrated on the BMC
AMD, the AMD Arrow logo, AMD Opteron™, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Cray 2620XT Rackmount Server Specifications
Based on the Intel® Xeon® processor E5 family, the Cray 2620XT
server improves datacenter performance. This four motherboard
server offers two processors per motherboard, delivering high
performance and system responsiveness with outstanding memory
bandwidth for data-intensive applications.
BUILDING BLOCK PLATFORM
Cray 2620XT Server
Motherboard 4 per chassis
Processor Intel Xeon processor E5-2600 v2 product family - up to 12 cores per processor
Processor Capacity 2 per board; 8 per chassis
Chipset Intel C600-A Platform Controller Hub (PCH)
System Bus Intel QuickPath Interconnect (QPI)
Memory Type Support for 800/1066/1333/1600/1866 MHz ECC RDIMM DDR3 memory
Memory Capacity Up to 256GB in 8 DIMMs across 8 memory channels (4 channels per processor)
Disk Controller Bridgeboard connector for SAS/SATA via Intel® C600 series chipset
Drive Bays Three 3.5” SATA/SAS hot swap drives (per node)
Storage Capacity Up to 12TB SATA/SAS (per node)
On-Board Graphics Integrated 2-D video controller, 128MB DDR2 memory (per node)
Network Interface
Input/Output
Integrated dual-port Ethernet controller (Optional ConnectX-3 QDR or FDR InfiniBand with QSFP
connector) (1 port per board)
2 USB 2.0 compliant ports, two RJ-45 LAN ports, DB-15
Optional InfiniBand (QSFP) (per node)
Expansion Slots 1 x16 PCIe Gen3 PCI riser slot capable of supporting a low-profile add-in card (per node)
Power Supplies 3 high speed hot-swap redundant 40mm dual-rotor fans per node optimized by fan speed control
Power Input Dual 1600W common redundant power supplies (80 PLUS Platinum efficiency)
Cooling 13.3A max at 110VAC; 6.67A max at 220VAC
Weight 83.78 lbs.; 38 kg.
Dimensions 3.45”H (88mm) x 17.24”W (438mm) x 27.87”D (708mm)
Temperature Operating: 10°C-35°C; Storage: -40°C-70°C
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and other countries.
Cray 2628X Rackmount Server Specifications
Based on the Intel® Xeon® processor E5 family, the Cray 2628X
server is a platform for multi-server configurations such as cluster
head nodes or technical application servers requiring flexible
infrastructure. It offers extreme memory capacity scalability and
support for hybrid configuration options with the Intel® Xeon Phi™
coprocessor for higher performance and scalability.
BUILDING BLOCK PLATFORM
Cray 2628X Server
Motherboard 1 per chassis
Processor
Intel Xeon processor E5-2600 v2 product family - up to 12 cores per processor
Support for Intel Xeon Phi coprocessors (3120P, 5110P, 7120P, 3120A)
Processor Capacity Up to 2 CPUs; up to 2 coprocessors
Chipset Intel C600-A Platform Controller Hub (PCH)
System Bus Intel QuickPath Interconnect (QPI)
Memory Type Support for 800/1066/1333/1600/1866 MHz ECC RDIMM DDR3 memory
Memory Capacity Up to 768GB in 24 DIMM slots
Disk Controller 8-port HW SATA RAID controller, optional battery backup
Drive Bays 8x 3.5” drives with slim optical DVD-ROM drive
Storage Capacity Up to 32TB SATA (or optional SAS)
On-Board Graphics Integrated 2-D video controller, 16MB DDR3 memory
Network Interface
Integrated quad-port Ethernet controller
(optional 10G expansion module)
Input/Output 3 USB 2.0 compliant ports, 4 RJ-45 LAN ports, DB-15 VGA, dedicated LAN port for remote management
Expansion Slots 2 riser cards; 3 x8 PCIe slots on each (2x FHFL, 1x FHHL)
Power Supplies 80mm fans with redundant and hot swap option
Power Input Dual 750W redundant power supplies; 80 PLUS Platinum efficiency
Cooling 8.33A max at 110VAC; 4.17A max at 220VAC
Weight 65 lbs; 29.5 kg
Dimensions 3.45”H x 17.24”W x 27.87”D
Temperature
Operating: 10°C-35°C
Storage: -40°C-70°C
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and other countries.
Cray Inc. • 901 Fifth Avenue, Suite 1000 • Seattle, WA 98164 • Tel: 206.701.2000 • Fax: 206.701.2500 • www.cray.com
© 2013 Cray Inc. All rights reserved. Specifications are subject to change without notice. Cray is a registered trademark and Cray CS300-AC is a trademark of Cray Inc. All other trademarks mentioned herein are the properties
of their respective owners. Performance statements and results have been estimated based on internal Cray analysis and are provided for informational purposes only. Any difference in system hardware or software design or
configuration may affect actual performance. Cray does not control or audit the design or implementation of third party benchmarks and product claims in this document. 201301028EMS