Syllabus - The University of Texas at Arlington

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Fundamental MEMS, an Introduction to
MicroElectroMechanical Systems (MEMS)
Syllabus
Texas Christian University Course ENGR 40970
The University of Texas at Arlington Course EE 5349/4328
Time and location
TTh 3:30 - 5:20 p.m., Nedderman Hall, Room 109
Summer Semester
28 May – 9 August
Instructor
Edward S Kolesar, Ph.D., P.E., W.A. Moncrief Professor of Engineering
Department of Engineering
Tucker Technology Center, Room 212
Texas Christian University, Fort Worth, TX 76129
tel: (817) 257-6226; -7126
fax: (817) 257-7704
email: e.kolesar@tcu.edu
Office hours: by appointment.
Frank L. Lewis, Ph.D., P.E., Moncrief-O’Donnell Endowed Chair
Department of Electrical Engineering
Automation and Robotics Research Institute (ARRI)
The University of Texas at Arlington
7300 Jack Newell Blvd. South
Fort Worth, Texas 76118-7115
tel. 817-272-5972
fax. 817-272-5989
email: flewis@controls.uta.edu
Office hours: by appointment.
RA/TA
Jose Mireles
Automation and Robotics Research Institute (ARRI)
The University of Texas at Arlington
7300 Jack Newell Blvd. South
Fort Worth, Texas 76118-7115
tel. 817-272-5955
fax. 817-272-5989
email: jmireles@arri.uta.edu
Office hours: by appointment.
CAD lab
Location to be announced. Software: MEMS Pro by MEMSCaP
Course
homepage
Temporary: http://arri.uta.edu/acs/jmireles/MAINpage.htm
Later: http://mems.uta.edu
Required texts
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Suggested
references
Gregory T. A. Kovacs, Micromachined Transducers Sourcebook,
WCB/McGraw-Hill Book Company, NY, http://www.mhhe.com,
0-07-290722-3,1998.
Selected papers (will be distributed in class).
ISBN
IC Fabrication and VLSI Technology
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Marc Madou, Fundamentals of Microfabrication, CRC Press, NY, 1997.
David J. Elliott, Integrated Circuit Fabrication, 2nd ed., McGraw-Hill
Publishing Company, NY, 1989.
Peter Van Zant, Microchip Fabrication – A Practical Guide to
Semiconductor Processing, 2nd ed., McGraw-Hill Publishing Company,
NY, 1990.
W. Scott Ruska, Microelectronic Processing – An Introduction to the
Manufacture of Integrated Circuits, McGraw-Hill Publishing Company, NY,
1987.
Hong H. Lee, Fundamentals of Microelectronics Processing, McGraw-Hill
Publishing Company, NY, 1990.
Walter R. Runyan and Kenneth E. Bean, Semiconductor Integrated Circuit
Processing Technology, Addison-Wesley Publishing Company, MA, 1990.
S.M. Sze, VLSI Technology, 2nd ed., McGraw-Hill Publishing Company,
NY, 1988.
Sorab K. Ghandhi, VLSI Fabrication Principles – Silicon and Gallium
Arsenide, 2nd ed., John Wiley and Sons, Inc., NY, 1994.
Q.-Y. Tong and U. Gosele, Semiconductor Wafer Bonding – Science and
Technology, John Wiley and Sons, Inc., NY, 1999.
S.A. Campbell and H.J. Lewerenz, Semiconductor Micromachining, Vol. 1:
Fundamental Electrochemistry and Physics, and Vol. 2: Techniques and
Industrial Applications, John Wiley and Sons, Inc., NY, 1998.
Sensors, Actuators and MEMS
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Iwao Fujimasa, Micromachines – A New Era in Mechanical Engineering,
Oxford University Press, NY, 1996.
S.M. Sze (ed.), Semiconductor Sensors, John Wiley and Sons, Inc., NY,
1994.
Julian W. Gardner, Microsensors – Principles and Applications, John
Wiley and Sons, Inc., NY, 1994.
Ljubisa Ristic (ed.), Sensor Technology and Devices, Artech House, MA,
1994.
Randy Frank, Understanding Smart Sensors, 2nd ed., Artech House, MA,
2000.
Paul W. Chapman, Smart Sensors, ISA, NC, 1996.
Hector J. De Los Santos, Introduction to Microelectromechanical (MEM)
Microwave Systems, Artech House, MA, 1999.
Sergej Fatikow and Ulrich Rembold, Microsystem Technology and
Microrobotics, Springer Verlag, NY, 1997.
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P. Rai-Choudhury (ed.), MEMS and MOEMS Technology and
Applications, SPIE Press, WA, 2000.
William S. Trimmer, Micromechanics and MEMS – Classic and Seminal
Papers to 1990, IEEE Press, NY, 1997.
R. S. Muller, R. T. Howe, S. D. Senturia, R. L. Smith, and R. M. White
(eds.) Microsensors, IEEE Press, NY, 1991.
Journals
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IEEE/ASME Journal of Microelectromechanical Systems
Sensors and Actuators
Conferences
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Course
requirements and
grading
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Solid-State Sensor and Actuator Workshop (Hilton Head)
IEEE Micro Electro Mechanical Systems Workshop (MEMS)
Int. Conf. on Solid-State Sensors and Actuators (Transducers)
Four Homework Assignments: 40% - late homeworks lose 10% credit per
day; no credit is given after the solutions have been posted
Midterm Exam: 20% - open book
Course Project: 40% - project team(s) – individual or 2-3 students (with
approval of the instructors)
Homework
Design, analysis, layout, and simulation of MEMS devices.
Project
Small research project summarized in a four-page write-up (conference abstract
style). Papers of exceptional quality will be considered for submission to a
conference.
(elaborated by Dr. Edward Kolesar)
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