Education in Microelectronics Technology
Ivan Szendiuch
Brno University of Technology, Faculty of Electrical Engineering and Communication Technology, Department
of Microelectronics
Údolní 53, Brno 602 00, Czech Republic, E-mail: szend@feec.vutbr.cz
Abstract
This paper deals with presentation of some new aspects in study program of Microelectronics
Technology on Faculty of Electrical Engineering and Communication Technology in Brno University
of Technology. Microelectronics technology education makes a part of new study program that was
there introduced in last years. This study program consists from three levels, Bachelor, Master and
Doctorate degree. Microelectronics technology that makes the fix part of this program is more and
more popular among students too. Some fundamental remarks concerning microelectronics
technology education process including steady development of curriculum are shown in this paper.
The paper results a sum of both, theoretical and practical experience of authors in the area of
microelectronic technology learning which were obtained during last twenty years in the education
sector as well in the research and management activities kept with some companies. In this paper is
presented complete Microelectronics technology education program at Brno University of
Technology. There is significant emphasis on area of actual development in interconnection and
packaging area as well in the whole assembly sector. Very important part makes practical education
in the microelectronics lab, which was positive valuated also by awarding of author by IMAPS inSan
Jose in the end of the past year. The quality of teaching at Brno University of Technology is
guaranteed by accreditation procedures, one at the national level by the Czech Ministry of Education,
another by the European Association for Education FEANI.
Introduction
Electronics technology makes very important part of the electrical engineering science. This
fact is closed to the increasing importance of the technological integration, where its impact is always
stronger not only on production and on equipments, but on design, processes as well on their use, and
handling including liquidation too. That means fundamentals of electrical engineering are important
for all electric engineering education branches, and also for some other too.
Development of semiconductor chips has made enormous strong progress in the end of last
century. The same situation didn’t set by assembly technology processes in. That means the assembly
technology is necessary to push more intensive to achieve the same technical level as by
semiconductor chips, both from point of view of complex electronic system. There are reasons to
distinguish electronics technology focused on chip and on system. This first concerning all what is
related to chip design and chip production, and the second is in brief branch of assembly technology.
Electronics assembly technology is one of the emerging domains in manufacturing
engineering. There has been an emerging global focus on this domain in both academia and industry
due to its enormous application potential. There is a need to explore innovative courses including
laboratory modules.
Of course in the microelectronics technology education there are comprised many formerly
independent areas, as material engineering, system engineering, computer practical, thermal
management, process management, quality management etc.
This paper shows system of study at Faculty of Electrical Engineering and Communication
Technology (FEEC) in Brno University of Technology, where bachelor, master and doctorate study is
presented with focus on Electronics Assembly Technology education.
Basic arrangement of study system
There are three levels of study program at the FEEC in Brno University of Technology, which
are bachelor, master and doctorate study.
Bachelor’s study program has nominal length of study 3 years. It is organized for education of
operational specialist in electronics/electric branch. There are five branch destination dedicated to
electric, electronic, communication and control area, which are:
- Electronics and Communication,
- Automation and Measurement,
- Teleinformatics,
- Power Electrics,
- Microelectronics and Technology.
Just last one known as “Microelectronics and Technology” is somewhat more presented in this paper.
This study program is aimed to modern microelectronics technology study, based on application of
technology integration impact and development (Fig. 1).
R&D
Selling
Use
Customer Service
Liquidation
Development of
Process
Technology
Integration
Development of
Product
Quality
Environment
…
Cost
Development of
Equipment
FIGURE 1: TERM “TECHNOLOGICAL INTEGRATION”
Attention is aimed to design, technology and application of electronics products, including
microelectronics packaging and interconnection area. Electric materials and processes including their
reliability and quality form a part of this program too. Products of this study specialization are
bachelors with knowledge in design and manufacturing in the branch of microelectronics technology,
especially in integrated circuits, electronic equipments and instruments including complete systems
and production lines.
Master study program follows up immediately after bachelor study as shown in the Figure 1.
This study program has two years program concentrated to microelectronics engineer education. More
complex offer of subjects in opposite to bachelor study program gives enough possibilities to students
for their specialization. Theoretical and practical knowledge from design and technology
microelectronics including packaging makes main part of this study program.
The subjects´ offer gives a wide opportunity to all students to make their own choice to reach
final professional profile. Subjects are generally divided in two parts:
- Special (oriented to student professional profile),
- General (oriented to general skills).
The group of special subjects includes three stages - basic (fundamental), main (principal) and
super-structural.
There is other segmentation of subjects that are put in order as:
- Compulsory,
- To select.
The group of subjects to select is involved in three parts, which are:
- Special subjects from own branch,
- Special subjects from other branch,
- Universal subjects.
General point of view on complete system with introduction of main subjects for education in
Microelectronics Technology is designed in Figure 2. Joining to research and industry in conjunction
with thesis presentation is very important step that determining efficiency and quality of educational
process.
From Industry
:
From Research Center
- technical requests
- engineers, experts
- marketing results
- research results
conferences, seminars, workshops
F in a l p r o je c t d e fe n c e
a n d e x a m in a tio n
m e n ta l M a n a g e m e n t
S P C & Q u a lity
a n d R e lia b ility
O p to e le c tro n ic s
& N a n o e le c tro n ic s
M ic ro sy s te m s
P a c k a g in g & W L P
T h e rm a l
M an agem en t
R F /M ic ro v a w e a n d
W ire le s s
E c o -d e s ig n & E n v iro n -
In te rc o n n e c tio n
a n d P a c k a g in g
&
M C M ,M S M v s .
SOC, SOP
S y ste m E n g in e e rin g
&
P ro d u c tio n P ro c e s s
S M T , L T C C e tc .
M ic ro e le c tro n ic
A s se m b ly
T e c h n o lo g ie s &
T h ic k a n d T h in
F ilm s
M o n o lith ic
In te g ra te d C irc u its
P ro d u c tio n &
A S IC a n d C u sto m
c irc u its
M a te ria l
e n g in e e rin g
-c o n d u c to r s
-d ie le c tr ic s a n d
in s u la to r s
-s e m ic o n d u c to r s
-p o ly m e r s
e tc .
C irc u its T h e o ry
-a n a lo g
-d ig ita l
-m e m o rie s
-m ic ro p ro c e s so rs
P h y s ic s
C h e m istry
- p r o c e se ss o f
sy n th e sis / a n a ly sis
- c h e m ic a l
p r o p e rtie s ,
c o m p o sitio n s a n d
r e a c tio n s
D e s ig n
o f E le c tro n ic
In s tru m e n ts
an d
S y s te m s
-
e le c tric ity
o p tic s
s o lid s ta te
h ea t
m e c h a n ic s
CAD, CAM
&
C o m p u te r
G ra p h ic s
a n d M o d e lin g
O p e ra tin g S y ste m s
&
S o ftw a re
E n g in e e rin g
M a th e m a tic s
. - n u m e ric a l
E ss e n tia l o n C o m p u te r
H W /S W
a n a ly s is
- o p e r a tio n a l
m a te m a tic s
- sta tistic s
- p ro g ra m m in g a n d u s a g e
o f c o m p u te rs
- c o m p u te r o rg a n iza tio n
a n d a rc h ite c tu re
.
FIGURE 2: GENERAL SCHEMA OF KNOWLEDGE IN MICROELECTRONICS AREA WITH IMPACT ON TECHNOLOGY
Basic Aspects in Microelectronics Assembly Technology Education
Microelectronics technology becomes highly interdisciplinary area. There are many formerly
independent areas, as system engineering, computer practical, thermal management, quality
management etc.
It is very important the fact, that the development of each new product needs an integral
approach of issues, where are three basic factors influencing valuation - technical, economical and
qualitative. All are joined and closed together in the different way through lot of concrete factors that
have to be validated carefully. Some new activities are implemented to achieve optimal solution, as for
example DFM (Design for Manufacture).
The core of each electronic system is made by integrated circuits (IC) crated from one or more
semiconductor chips. For the longest time, the focus was on the chip – making it smaller, faster, more
powerful and more efficient (improving performance and complexity). There are many IC
performances and designs as well as many types of packages. Packaging was a long time simple and
manufacturers easily designed the integrated circuits, packaged them in different sizes and sold them.
Because semiconductor chips making all the time a big progress, their packaging, connection
and handling it must follow the same. Today chips are produced in various performances, as for
example bare, flip and last time packaged already on wafer (wafer level packaging). That is reason for
rise of “packaging and interconnection” area, which is actually in strong development period. Circuit
and system designers must have a thorough knowledge of IC packaging and all of options before
deciding on a package type for their products, to reach competitive quality level and reducing cost.
Electronics
Components
IC´s
Design
Semiconductor
Structures
Analog and
Digital
Circuits
Microsystems
Technology
Packaging and
Interconnect
PCB and SMT
FIGURE 3: THE MAIN PARTS OF MICROELECTRONICS ASSEMBLY TECHNOLOGY SECTOR
More complex point of view on Microelectronics Technology educational sector, which is
ensured from Department of Microelectronics, is shown in Figure 3. Microelectronics and Packaging
area is designed as Microsystems technology.
Developed Program for Microelectronics Assembly Technology
The basic framework of the subject was established with the support of survey results obtained
from about twenty small and medium enterprises suggest that the manufacturing process aspects of the
modern microelectronics technology are very significant field for not only research, development and
production, but also for services and users, especially acting in certain management level. Therefore,
the following framework for Microelectronics Assembly Technology was recommended to give the
basic knowledge in this branch:
- Introduction to Electronics technology, Hardware and Impact of Technological Integration
- What are the Semiconductor Chips and its Performance in context of Packaging
- Passive Elements including Embedded, its Performance and Selection
- Substrates, Organic and Inorganic, Polymer Technology
- Thick & Thin Film Technologies and HIC´s, including their Non-conventional Applications
- Assembly Technologies for Electronic Equipments and Systems – SMT, LTCC etc.
- The Electronic Packaging - Fundamentals of Electrical Design and Thermal Management
- Hardware for PC and Interconnection Issue, MCM, WLP etc.
- Soldering as decisive Operation for Electronic Systems Reliability
- Electronics Production Process and SPC, Statistical Fundamentals and Tools
- Quality Engineering and TQM, Directives in Electronics – WEEE, RoHS, EuP, CE
- Life Cycle Assessment, Eco-design and Electronics Impact on Environment
This matter is arranged in twelve sections (Fig. 4), which concern many activities that must
mostly technicians and engineer tray to solve in their daily praxis. The matter of the single section is
partly independent from any special knowledge and is created as complex whole, which can by used
without any others. On the other hand all single section makes the basic view on one part of
microelectronics assembly technology, short known hardware.
This program is arranged in two levels, for Bachelor study (Microelectronics Technology and
Components), and for Master study (Modern Microelectronics Technologies). Both courses are
organized in one semester period with weakly program consisting from one theoretical lesson (2,5
hours) and lab lesson (2 hours). The lab curriculum is organized on the basis of non-vacuum
technologies, where thick film and surface mount technology make “carrying structure” for good part
of exercises. That means the basic production line for thick film technology and for surface mount
technology including some test and measurement equipments make good basis for flexible
arrangement of the single lab exercises. In more diploma thesis and research projects are made in this
lab as well.
Introduction to
Electronics Hardware
and Impact of
Technological
LCA,Eco-design and impact
of electrical products on
Environment
Quality Engineering
and TQM, Directives
WEEE, RoHS,EuP,CE
12
11
Electronics Production
Process and SPC,
Statistic Fundamentals
Soldering as decisive
Operation for Electronic
Systems Reliability
1
What are the Semiconductor
Chips and its Packaging
2
Electronics
Assembly
Technology
Program
10
3
4
5
9
8
Hardware for PC and
Interconnection Issue,
MCM, WLP etc.
7
The Electronic Packaging Fundamentals of Electrical
Design
and
Thermal
Management
6
Passive Elements including
Embedded, its Performance
in Context of Packaging
Substrates, Organic and
Inorganic, Polymer
Technology
Thick
&
Thin
Film
Technologies and HIC´s,
including
their
Nonconventional applications
Assembly Technologies
for Electronic
Equipments and SystemsSMT, LTCC ..
FIGURE 4: MAIN TOPICS OF MICROELECTRONICS ASSEMBLY TECHNOLOGY EDUCATION
Lab with Virtual Program Support
Inseparable part of the Microelectronics Assembly Technology education is experimental education
program that makes a fix part of bachelor, master and doctorate study. Experimental parts of education
run in microelectronics technology lab, which is systematically developed more than twenty years.
This lab is based on non-vacuum technology processes where thick films, SMT and packaging
equipments make the main part of lab arrangement. Students pass here the complete non-vacuum thick
film process, starting with design of own layout and continuing with realization of patterns by screen
printing and their measurement. Both, bare die and SMD components can be mount in this lab. For
example there are four different reflow soldering equipments to use as well as YAG laser or various
pick and place placers including flip-chip mounting. Equipments for packaging as dispensers and
fluidization are inseparable part of lab too. Optimizing and simulation by ANSYS, Flowmeric and
ANSOFT form the next part of this experimental part. Development of the lab is supported by diploma
and PhD thesis. Some new parts are formed by eco-design and reliability investigation exercises.
The whole education process in Microelectronics Technology is supported by e-learning,
which was developed in Microelectronics Department at BUT. The module is based on web content
technologies (HTML, CSS, PHP and Macromedia Flash). The virtual lab module shows
microelectronic technologies in process in continuity with lab equipments.
It is provided mainly by Flash based multimedia content (2D/3D interactive animations and
pictures) accessible via internet. User will be able to study these processes alive. There is possibility to
change input parameters and see how this will affect final result. Animations are supplied with
description of appropriate technology process.
Some examples are shown in Figure 5 that shows frames of selected microelectronic technologies
animations.
This e-learning program describes technologies and processes concerning following technologies:
Thick film technology
Thin film technology
PWB manufacturing
SMT technology
Packaging and HDI technology
Thermal management and ANSYS modelling
Internal module handles students agenda who attend courses at Department of
Microelectronics, FEEC, BUT. The agenda contains these parts:
- laboratory reports control part,
- test examination part,
- forums related with themes of Virtual laboratory module,
- other study materials related with microelectronic technologies,
- administration related parts,
- etc.
Users will dispose different types of access rights.
A)
B)
C)
D)
E)
FIGURE 5: EXAMPLES OF ANIMATION: A), B) ULTRASONIC WIRE BONDING C), D) SMD PICK AND PLACE
E) VAPOUR PHASE SOLDERING
Conclusion
Electronics Technology is one of the emerging domains in manufacturing engineering. There
exists an strong global focus on this domain in both academia and industry due to its enormous
application potential. In this context, there is a need for pushing steady this area. That asks make
innovative course and laboratory modules which will introduce these emerging concepts and
techniques to engineering students. These must be innovated permanently according to
microelectronics technology development abroad the world.
It was discovered from students that the virtual environments enabled students with different
learning approaches to learn at their own pace. It allowed the students to ‘virtually experiment and
learn’ as well as provided them a more interactive environment to ask questions about specific
problems and new solutions. In more the combination theory – praxis - virtual environment allows to
gain a better understanding of this matter and related issues in a shorter time.
As strong development in electric/electronic industry sector is accompanied with strategically
changes, as well fundamental changes must be applied in educational system too. This matter has a
general validity due to increasing effect of electronics technology on ambient and environment (PC,
mobile phones, TV sets, various types of recorders, cameras, players etc.). For managers in the each
level and people in leading positions is necessary to understand basic principles and functions of
electronics hardware, to be able make decisions and to lead discussion with collaborators.
Acknowledgement
Funding for this research was obtained through grant project from the Czech Ministry of
Education (MSM 0021630503 MIKROSYN „New Trends in Microelectronic Systems and
Nanotechnologies”) and in collaboration with couple of electronics production companies (Pbt,
Guliver, Tyco etc.) which operating in Brno region territory as well with some foreign companies
(Aurel, Rehm, etc.). Their involvement and assistance is gratefully acknowledged.
References
[1] Tummala, R.: Fundamentals of Microsystems Packaging, McGraw-Hill, New York, London,
Sydney, Madrid, Lisbon, Milan, San Juan, Seoul, Mexico City, Toronto, 2001
[2] Haag, S., Forbín,T.: Assessing Corporate Reinvestment in Engineering Education: UniversityIndustry Collaboration, ICEE 2005 Proceedings, Vol. 2, p.328-333, Gliwice, Poland, July 2529,2005
[3] Vasko, C., Szendiuch,I., Novotny,M.: Virtual Laboratory of Microelectronic Mounting and
Packaging, Proc. International Conference on Engineering Education, 3 – 7 September, 2007,
Coimbra
[4] ECTS – European Credit Transfer and Accumulation System,
http://europa.eu.int/comm/education/socrates/ects.html
[5] Květoň, K., Základy e-learningu 2003. Ostrava, University of Ostrava, 2004, 1st edition,61 pp,
ISBN 80-7042-986-0.
[6] Szendiuch, I.: Some New Aspects in Microelectronics Assembly Technology Education, 53rd
ECTC, International Workshop on Micro-systems Packaging Education, New Orleans,
May 27, 2003, p. 12-17
[7] Szendiuch, I.: Importace of Eco-design Implementation in Engineering Education, Innovations
2007, World Innovations in Engineering Education and Research, Chapter 5, p 55-63, INEER,
Bergell House Publishing, USA, 2007