Registro Mercantil de Madrid - Tomo 18602 - Folio 105 – Sección 8 - Hoja nº M-323546 – Inscripción 1ª fecha 24/3/2003 - Núm. Identificación Fiscal B-83595280
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SEOSAT / INGENIO
No.:
SEOS-RS-ECE-PA-0005
Página/Page: D1
Edición/Issue: 05
Fecha/Date: 05.05.09
LISTA DE DISTRIBUCION
(DISTRIBUTION LIST)
NORMAL ⊗
CONFIDENCIAL
INTERNA (Internal)
DPT.
NOMBRE (Name)
SEOSAT/INGENIO ECE Team
EXTERNA (External)
Nº COPIAS
CIA.
NOMBRE (Name)
Nº COPIAS
ESA
Alex Popescu
20
CDTI
Juan Ureña
5
Registro Mercantil de Madrid - Tomo 18602 - Folio 105 – Sección 8 - Hoja nº M-323546 – Inscripción 1ª fecha 24/3/2003 - Núm. Identificación Fiscal B-83595280
Mod. M-7-E
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E1
05
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ESTADO DE LAS EDICIONES
ISSUE – RECORD
Nº de Edición
Issue Number
Incorporación de las Modificaciones
Incorporation of Change Proposals
Ed./Issue:
Fecha/Date:
Págs./Pages:
01
28.01.08
85 + Annexes
Initial Issue
Ed./Issue:
Fecha/Date:
Págs./Pages:
02
30.01.08
85 + Annexes
New Issue, changing EEE Parts
Procurement philosophy: Now it is based
on self procurement schedule
Ed./Issue:
Fecha/Date:
Págs./Pages:
03
30.07.08
104 + Annexes
New Issue, taking into account the
agreements with ESA in the negotiation
meeting SEOS-MN-ESA-SY-0012, as
well as some inputs from Astrium As250
PA requirements
Ed./Issue:
Fecha/Date:
Págs./Pages
04
27.02.09
104+ Anexes
New Issue for SRR, taking into account
harmonization with AS250, in section 7 of
the document
05
05.05.09
99+
Anexes
New Issue taking into account RIDs from
SRR and correction of some typo as well
as comments from Astrium to harmonize
with AS250.
The affected RIDs and actions of the
SRR are:
Ed./Issue:
Fecha/Date:
Págs./Pages
MPAS-43 (action CCC-04)
MPAS-39 (action EEE-01)
MPAS-71 (action PA-01)
MPAS-24 (action EEE-02)
MPAS-33 (action EEE-09)
MPAS-20 (action PA-02)
MPAS-34 (Action EEE-10)
Impacto sobre el producto
Impact on the product
Mod. M-9-E
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REPERTORIO DE MODIFICACIONES
CHANGE – RECORD
Nº
Fecha
Date
Pag. Afectadas
Changed Pages
Descripción del cambio
Description of Change
Impacto sobre el producto
Impact on the product
Mod. M-11-E Registro Mercantil de Madrid - Tomo 18602 - Folio 105 – Sección 8 - Hoja nº M-323546 – Inscripción 1ª fecha 24/3/2003 - Núm. Identificación Fiscal B-83595280
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CONTENTS
1.
SCOPE
11
1.1.
APPLICABILITY .......................................................................................................... 11
1.2.
APPLICABLE AND REFERENCE DOCUMENTS ...................................................... 12
1.2.1.
Applicable documents ................................................................................................. 12
1.2.2.
Standards documents.................................................................................................. 12
1.3.
REFERENCE DOCUMENTS ...................................................................................... 14
1.4.
TRACEBILITY OF CHANGES .................................................................................... 15
2.
ACRONYMS .............................................................................................................. 17
3.
PREFERENCE HIERARCHY .................................................................................... 19
4.
3.1.
GENERAL ................................................................................................................... 20
3.2.
RIGHT OF ACCESS ................................................................................................... 20
3.3.
PARTICIPATION......................................................................................................... 21
3.4.
RISK MANAGEMENT ................................................................................................. 21
3.5.
REPORTING ............................................................................................................... 21
3.6.
PA DATABASES ......................................................................................................... 22
3.7.
LOWER TIER SUBCONTRACTORS MANAGEMENT............................................... 22
QUALITY ASSURANCE ........................................................................................... 23
4.1.
QUALITY ASSURANCE MANAGEMENT................................................................... 23
4.1.1.
Quality Assurance Programme.................................................................................... 23
4.1.2.
Personnel Training and Certification ........................................................................... 23
4.1.3.
PA Programme Audits ................................................................................................. 23
4.1.4.
QA Role in Configuration Management....................................................................... 23
4.1.5.
Critical Item List ........................................................................................................... 24
4.1.6.
Ranking of Critical Items.............................................................................................. 24
4.2.
QUALITY ASSURANCE GENERAL REQUIREMENTS ............................................. 25
4.2.1.
Documentation and Data Control ................................................................................ 25
4.2.2.
Quality Records ........................................................................................................... 25
4.2.3.
Stamp Control.............................................................................................................. 25
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4.2.4.
Traceability .................................................................................................................. 25
4.2.5.
Metrology and Calibration............................................................................................ 26
4.2.6.
Non Conformance Control........................................................................................... 26
4.2.7.
Alert System ................................................................................................................ 26
4.2.8.
Handling, Storage and Preservation............................................................................ 27
4.2.9.
Statistical Quality Control and Analysis ....................................................................... 27
4.3.
QUALITY ASSURANCE REQUIREMENTS FOR DESIGN AND VERIFICATION..... 27
4.4.
QUALITY ASSURANCE REQUIREMENTS FOR PROCUREMENT ......................... 28
4.4.1.
Selection of Procurement Sources .............................................................................. 28
4.4.2.
Procurement Documents............................................................................................. 28
4.4.3.
Surveillance of Procurement Sources ......................................................................... 29
4.4.4.
Receiving Inspection.................................................................................................... 29
4.5.
QUALITY ASSURANCE REQUIREMENTS FOR MANUFACTURING, ASSEMBLY AND
INTEGRATION 29
4.5.1.
General ........................................................................................................................ 29
4.5.2.
Planning of Manufacturing, Assembly and Integration Activities and Associated
Documents 29
4.5.3.
Manufacturing Readiness Review ............................................................................... 30
4.5.4.
Control of Processes ................................................................................................... 30
4.5.5.
Workmanship Standards ............................................................................................. 31
4.5.6.
Materials and Parts Control ......................................................................................... 31
4.5.7.
Tooling Control ............................................................................................................ 31
4.5.8.
Cleanliness and Contamination Control ...................................................................... 31
4.5.9.
Inspection .................................................................................................................... 32
4.5.10.
Specific Requirements for Assembly and Integration.................................................. 32
4.5.11.
Manufacturing, Assembly and Integration Records..................................................... 33
4.6.
QUALITY ASSURANCE REQUIREMENTS FOR TESTS .......................................... 33
4.6.1.
Test Facilities............................................................................................................... 33
4.6.2.
Test Equipment............................................................................................................ 33
4.6.3.
Test Documentation..................................................................................................... 33
4.6.4.
Test Performance Monitoring ...................................................................................... 34
4.6.5.
Test Reviews ............................................................................................................... 34
4.6.6.
Test Readiness Reviews (TRR) .................................................................................. 34
4.6.7.
Test Review Board (TRB)............................................................................................ 35
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4.7.
5.
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QUALITY ASSURANCE REQUIREMENTS FOR ACCEPTANCE AND DELIVERY . 35
4.7.1.
General ........................................................................................................................ 35
4.7.2.
End Item Data Package............................................................................................... 35
4.7.3.
Delivery Review Board ................................................................................................ 36
4.7.4.
Shipping Control .......................................................................................................... 36
DEPENDABILITY ...................................................................................................... 37
5.1.
DEPENDABILITY PROGRAMME MANAGEMENT .................................................... 37
5.2.
DEPENDABILITY RISK REDUCTION AND CONTROL............................................. 38
5.2.1.
Identification and Classification of Undesirable Events............................................... 38
5.2.2.
Assessment of Failure Scenarios ................................................................................ 38
5.2.3.
Criticality Classification of Functions and Products..................................................... 39
5.2.4.
Actions and Recommendations for Risk Reduction .................................................... 39
5.2.5.
Risk Decisions ............................................................................................................. 39
5.2.6.
Verification of Risk Reduction...................................................................................... 39
5.3.
DEPENDABILITY ENGINEERING.............................................................................. 39
5.3.1.
Integration of Dependability in the Project................................................................... 39
5.3.2.
Dependability Requirements in Technical Specification.............................................. 40
5.3.3.
Dependability Design Criteria ...................................................................................... 40
5.3.4.
Involvement in Test Definition ..................................................................................... 41
5.3.5.
Involvement in Operational Aspects ............................................................................ 41
5.3.6.
Dependability Recommendations................................................................................ 42
5.4.
DEPENDABILITY ANALYSIS ..................................................................................... 42
5.4.1.
Dependability Analysis and the Project Life Cycle ...................................................... 42
5.4.2.
Reliability Analysis ....................................................................................................... 42
5.4.3.
Maintainability Analysis ............................................................................................... 45
5.4.4.
Availability Analysis ..................................................................................................... 45
5.4.5.
Classification of Design Characteristics in Production Documents............................. 46
5.4.6.
Critical Item List ........................................................................................................... 46
5.5.
6.
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
DEPENDABILITY TESTING, DEMONSTRATION AND DATA COLLECTION .......... 46
SAFETY
47
6.1.
GENERAL ................................................................................................................... 47
6.2.
SAFETY PROGRAMME ............................................................................................. 47
6.3.
SAFETY ENGINEERING ............................................................................................ 48
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6.3.1.
Design selection .......................................................................................................... 48
6.3.2.
Hazard reduction precedente ...................................................................................... 48
6.3.3.
Environmental compatibility......................................................................................... 49
6.3.4.
Fail-safe design ........................................................................................................... 49
6.3.5.
Hazard detection.......................................................................................................... 49
6.3.6.
Safety risk reduction and control ................................................................................. 49
6.3.7.
Failure Tolerance Requirements ................................................................................. 50
6.3.8.
Design for minimun risk ............................................................................................... 51
6.3.9.
Identification and control of safety-critical functionsº................................................... 51
6.4.
7.
No.:
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Fecha/Date:
SAFETY ANALYSIS REQUIREMENTS AND TECHNIQUES .................................... 52
6.4.1.
General ........................................................................................................................ 52
6.4.2.
Hazard analysis ........................................................................................................... 52
6.4.3.
Fault Tree Analysis ...................................................................................................... 52
6.5.
SAFETY VERIFICATION ............................................................................................ 53
6.6.
OPERATIONAL SAFETY............................................................................................ 53
6.7.
PRODUCT LIABILITY REQUIREMENTS ................................................................... 53
ELECTRICAL, ELECTRONIC & ELECTROMECHANICAL (EEE) COMPONENTS 55
7.1.
SCOPE 55
7.1.1.
General ........................................................................................................................ 55
7.1.2.
Objectives .................................................................................................................... 55
7.1.3.
Definitions .................................................................................................................... 56
7.2.
APPLICABILITY .......................................................................................................... 57
7.3.
COMPONENT PROGRAMME MANAGEMENT ......................................................... 57
7.3.1.
General ........................................................................................................................ 57
7.3.2.
Components Control Programme................................................................................ 57
7.3.3.
Parts Control Board (PCB) .......................................................................................... 58
7.3.4.
Declared Component List (DCL) ................................................................................. 58
7.3.5.
Electrical and mechanical GSE ................................................................................... 60
7.4.
COMPONENT SELECTION, EVALUATION AND APPROVAL ................................. 60
7.4.1.
General ........................................................................................................................ 60
7.4.2.
Manufacturer and component selection ...................................................................... 61
7.4.3.
Component Evaluation ................................................................................................ 64
7.4.4.
Parts Approval ............................................................................................................. 66
7.5.
PARTS PROCUREMENT ........................................................................................... 67
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7.5.1.
General ........................................................................................................................ 67
7.5.2.
Procurement Specification........................................................................................... 68
7.5.3.
Screening requirements .............................................................................................. 69
7.5.4.
Initial Customer Source Inspection (precap) ............................................................... 70
7.5.5.
Lot Acceptance ............................................................................................................ 70
7.5.6.
Final Customer Source Inspection (buy off) ................................................................ 70
7.5.7.
Incoming Inspections................................................................................................... 71
7.5.8.
Radiation Verification Testing (RVT) ........................................................................... 72
7.5.9.
Destructive Physical Analysis (DPA) ........................................................................... 73
7.5.10.
Relifing......................................................................................................................... 74
7.5.11.
Manufacturer's Documentation Deliveries................................................................... 74
7.6.
COMPONENT HANDLING AND STORAGE .............................................................. 75
7.7.
EEE PART QUALITY ASSURANCE........................................................................... 75
7.7.1.
Non-Conformances or failures..................................................................................... 75
7.7.2.
Alert and Problem Notification ..................................................................................... 75
7.7.3.
Traceability .................................................................................................................. 76
7.7.4.
Lot homogeneity for sampling test............................................................................... 76
7.8.
8.
No.:
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Fecha/Date:
SPECIFIC COMPONENTS ......................................................................................... 76
7.8.1.
General ........................................................................................................................ 76
7.8.2.
Application Specific Integrated Circuits (ASIC) ........................................................... 77
7.8.3.
Hybrids......................................................................................................................... 77
7.8.4.
One time programmable devices................................................................................. 77
7.8.5.
Monolithic Microwave Integrated Circuits (MMIC)....................................................... 78
7.8.6.
Electromagnetic Components ..................................................................................... 78
MATERIALS, MECHANICAL PARTS AND PROCESSES ...................................... 79
8.1.
ORGANISATION AND MANAGEMENT ..................................................................... 79
8.2.
CRITICALITY ANALYSIS............................................................................................ 79
8.3.
TECHNICAL REQUIREMENTS FOR SELECTION OF MATERIALS ........................ 80
8.3.1.
Vacuum........................................................................................................................ 81
8.3.2.
Prohibited Materials ..................................................................................................... 81
8.3.3.
Restricted Materials ..................................................................................................... 82
8.3.4.
Thermal Cycling........................................................................................................... 82
8.3.5.
ATomic OXygen (ATOX) ............................................................................................. 82
8.3.6.
Meteoritic/Debris Environment .................................................................................... 83
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8.3.7.
Electrochemical Compatibility...................................................................................... 83
8.3.8.
Corrosion ..................................................................................................................... 83
8.3.9.
Stress Corrosion .......................................................................................................... 83
8.3.10.
Fluid Compatibility ....................................................................................................... 84
8.3.11.
UV Radiation................................................................................................................ 84
8.3.12.
Allowable Stress .......................................................................................................... 84
8.3.13.
Limited Life Time ......................................................................................................... 84
8.3.14.
Electrostatic Discharge Protection............................................................................... 85
8.3.15.
Hydrogen Embrittlement.............................................................................................. 85
8.3.16.
Procurement of Materials ............................................................................................ 85
8.4.
MECHANICAL PARTS................................................................................................ 86
8.5.
PROCESSES .............................................................................................................. 86
8.5.1.
Mounting of EEE Parts ................................................................................................ 87
8.6.
TRACEABILITY ........................................................................................................... 88
8.7.
MATERIALS AND PROCESS CONTROL BOARD (MPCB) ...................................... 88
8.8.
PROPRIETARY MATERIALS, PARTS AND PROCESSES....................................... 89
8.9.
CONFIGURATION MANAGEMENT ........................................................................... 89
8.10.
MATERIALS, PARTS AND PROCESSES LIST ......................................................... 90
8.11.
SPECIFIC REQUIREMENTS FOR PYROTECHNIC DEVICES................................. 90
9.
SOFTWARE PRODUCT ASSURANCE.................................................................... 92
10.
CONFIGURATION MANAGEMENT ......................................................................... 93
11.
DOCUMENTATION ................................................................................................... 94
11.1.
DOCUMENT LEVEL AND CLASSIFICATION ............................................................ 94
11.2.
DOCUMENT CHANGE ............................................................................................... 95
11.3.
DOCUMENT STATUS LIST........................................................................................ 95
11.4.
DOCUMENT DISTRIBUTION AND RETRIEVAL ....................................................... 96
11.5.
DOCUMENTATION FORMAT AND TYPES............................................................... 97
11.6.
PRODUCT ASSURANCE DOCUMENT REQUIREMENTS ....................................... 97
11.6.1.
PA Plan........................................................................................................................ 97
11.6.2.
EIDP ............................................................................................................................ 97
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1. SCOPE
This document defines the Product Assurance requirements applicable to Subcontractors of
ECE for the SEOSAT programme. All products (equipment, software or services) procured in
the frame of the SEOSAT programme are required to conform to these Product Assurance
requirements.
These requirements are based on the ECSS series of documents or on ESA specific
documents such as the PSS series when no equivalent ECSS is available. They amend the
applicable documents when necessary to address some specific points.
Subcontractors shall impose these requirements upon their lower tier subcontractors and
suppliers as appropriate to the procured item.
The requirements are provided in table format, where it is included the requirement reference
number(first column), the text (second column) and finally the verification method (last
column), where:
¾
¾
¾
¾
¾
R whether the requirement is verified by Review
I whether the requirement is verified by Inspection
A whether the requirement is verified by Analysis
T whether the requirement is verified by Test
D whether the requirement is verified by Design/Definition
1.1. APPLICABILITY
These requirements are applicable to:
¾
¾
All delivered Hardware and Software models of the product
Elements of the GSE which interface directly with flight hardware (e.g.
connectors, cooling devices…) or which can have an impact on safety (e.g.
EGSE, lifting devices)
The requirements defined in this document are applicable to the SEOSAT project phases B
& C/D.
If specific requirements are considered as non-applicable, impracticable or inefficient for
implementation, the Subcontractor may propose alternative procedures to achieve the same
objectives. These procedures are subject to approval by ECE on a case-by-case basis.
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1.2. APPLICABLE AND REFERENCE DOCUMENTS
1.2.1.
Applicable documents
The following documents are applicable to the Product Assurance Requirement Document, and
are hierarchically superior to it:
[AD a]
Product Contract
[AD b]
Product Statement Of Work (SOW)
[AD c]
Product Requirements Document
[AD d]
General Design and Interface Requirements (GDIR)
[AD e]
SEOS-RS-ECE-SC-0011
Project Management Requirements
[AD h]
[AD j]
1.2.2.
SEOSAT/INGENIO Product Assurance & Safety Requirements for phase B/C/D/E1
SEOS-RS-ESA-PA-0003
SEOSAT/INGENIO Cleanliness Requirements
SEOS-RS-ECE-PA-0001
Standards documents
The following standards documents shall be applicable to the extent and with the modifications
specified in this document. When no issue is quoted, latest issue at contract signature shall
apply.
Product Assurance/Quality Assurance
[SD1]
ECSS-Q-00A
Policy and principles
[SD2]
ECSS-Q-20B
Quality Assurance
[SD3]
ECSS-M-00-03A
Risk Management
[SD4]
ECSS-Q-20-09B
Non-Conformance Control System
[SD5]
ECSS-Q-70-01A
Contamination and cleanliness control
Dependability and Safety
[SD6]
ECSS-Q-30B
Dependability
[SD7]
ECSS-Q-30-11A
Derating EEE components
[SD8]
ECSS-Q-30-02A
FMECA
[SD9]
ECSS-Q-40B
Safety
[SD10]
ECSS-Q-40-02A
Hazard Analysis
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Component selection, procurement and control
[SD11] ECSS-Q-60B
EEE Components
[SD12] ECSS-Q-60-01A
European Preferred parts list (EPPL) and its management.
[SD13] ESA/QPL
ESA/SCC Qualified Parts List
[SD14] DIV.SP.00034.T.ASTR
Generic Radiation Hardness Assurance Requirements for
EEE & Opto-electronics
[SD15] ECSS-Q-60-12A
MMIC's
[SD16] ECSS-Q-60-02A
ASIC/FPGA development
[SD17] MIL-PRF-38534
Hybrid Microcircuits, general specification for
[SD18] ECSS-Q-60-05
[SD20] ADS.E.782
[SD21] MIL-STD-883
[SD22] MIL-STD-750
[SD23] MIL-STD-202
[SD24] ADS.E.0705
Generic requirements for hybrid micro-circuits
Relifing procedure, EEE components
Test methods and procedures for microlectronics
Test methods for semiconductor devices
Test methods for electronic and electrical components
Guidelines for selection, procurement, control and use of
commercial EEE parts
Materials, Mechanical Parts and Processes
[SD25] ECSS-Q-70B Annexes
DML, DMPL
definition
and
DPL
[SD26] ECSS-Q-70-71A
Data for Selection of Space Materials and Processes
[SD27] ECSS-Q-70-02A
Thermal vacuum outgassing test for the screening of
Space materials.
[SD28] ASTM E595-90
Collected Volatile Condensable Materials (CVCM) from
outgassing from in a vacuum environment
[SD29] ECSS-Q-70-04A
Thermal cycling for the screening of space materials &
processes.
[SD30] MSFC-Spec 250
Protective finishes for space vehicles
[SD31] ECSS-Q-70-36A
Material selection for controlling stress corrosion cracking
[SD32] ECSS-Q-70-37A
Determination of susceptibility of metals to stress
[SD33] NHB 8060-1
Flammability, Odour and Outgassing requirements and
tests
[SD34] PSS-01-706
Particle and Ultra Violet Radiation Testing of Space
Materials
[SD35] MIL HDBK 5
Metallic materials and elements for aerospace vehicle
structures.
[SD36] ECSS-Q-70-22A
The control of limited shelf life material
[SD37] ECSS-Q-70-07A
Verification and approval of automatic machine wave
soldering
[SD38] ECSS-Q-70-08A
The Manual
Connections
[SD39] ECSS-Q-70-10A
Qualification of Printed Circuit Boards
Soldering
of
document
requirements
High-Reliability
Electrical
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[SD40] ECSS-Q-70-11A
Procurement of Printed Circuit Boards
[SD41] ECSS-Q-70-26A
The crimping of high reliability electrical connections
[SD42] ECSS-Q-70-28A
The repair and modification of PCB and solder joints for
space use
[SD43] PSS-01-738
High-reliability soldering for surface-mount and mixedtechnology PCB.
[SD44] PSS-01-605
The capability approval programme for the hermetic thinfilm hybrid microcircuits.
[SD45] PSS-01-606
The capability approval programme for hermetic thick-film
hybrid microcircuits.
[SD46] ECSS-Q-70-18A
The preparation, assembly and mounting of RF coaxial
cables.
[SD47] ECSS-Q-70-21A
Flammability testing for the screening of space materials
and processes.
[SD48] ECSS-Q-70-29
The determination of offgassing products from materials
and assembled articles.
[SD49] ECSS-E-30 Part 6
Mechanical – Part 6: Pyrotechnics
[SD50] ECSS-Q-70B
Materials, Mechanical Parts and Processes
Project Management standards
[SD51] ECSS-M-40
Configuration Management
[SD52] ECSS-M-50
Information/Documentation Management
[SD53] SEOS-PL-ECE-PM-0017
SEOSAT Configuration & Documentation management
Plan
1.3.
REFERENCE DOCUMENTS
The following documents provide reference material for understanding of these PA
requirements. They do not constitute requirements as such.
[RD1] ISO 9001:2000
Quality management system: Requirements
[RD2] MIL-HDBK-217F + Notice 2 Reliability Prediction for Electronic Equipment
[RD3] ESA-RD01 Revision 4
Outgassing
materials
and
thermo-optical
data
for
spacecraft
[RD4] MSFC-HDBK-527
Materials selection list for space hardware systems.
[RD5] ECSS-E-10-12
Methods for Calculation of Radiation Received and its
Effects and a Policy for Design Margins
[RD6] ECSS-E-10-04
Space Environment
[RD7] PSS-01-202
Preservation, Storage, Handling and Transportation of
ESA Spacecraft and Associated Equipment.
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1.4. TRACEBILITY OF CHANGES
In order to trace the changes from the previous issue (issue 04), here after it is a exhaustive
list with the changes implemented in this new issue. It is in format of table with the
requirement affected and the type of change implemented (new, re-wording, other
numeration, etc)
Requirement Changed
Section
Change
General
Changed EADS CASA Espacio
by ECE
1.2.1 Applicable documents
Added [AD j], Cleanliness
Requirements
1.2.2 Standard Documents
[SD13] removed date
1.2.2 Standard Documents
Added [SD50]
1.2.2 Standard Documents
Renumbering of [SD51],
[SD52], [SD53]
PA-005-51b
5.1 Dependability
Changed wording according to
SRR agreements
PA-005-51c
5.1 Dependability
Changed wording according to
above requirement
PA-005-637a
6.3.7 Failure Tolerance
Requirements
Wording changed of 1st bullet
according to SRR agreements
PA-005-733a
7.3.3 Parts Control Board (PCB)
Added last sentence according
to SRR agreements
PA-005-734d,e,f,g,
7.3.4 Declared Component List
(DCL)
Added ESA for approval,
according to SRR agreements
PA-005-741c
7.4 Component Selection,
Evaluation and approval
ADS.E.0705 put as guideline,
as agreed in SRR
PA-005-7423e
7.4.2.3 Radiation Hardness
Corrected typo [SD14]
7.4.2.3 Radiation Hardness
Variation Theshold LETth from
70 to 60 MeV/mg cm2. Raised
RFD at sytem level
7.4.2.3 Radiation Hardness
Added Equipment & referred
section of [SD14] in last
sentence
PA-005-7431h
7.4.3 Component Evaluation
New requirement according to
SRR agreements
PA-005-7431i
7.4.3 Component Evaluation
Previous PA-005-7431h
PA-005-7433b
7.4.3.3 Evaluation testing
PA-005-751h
7.5 Parts Procurement
PA-005-753e
PA-005-754a
7.5.3 Screening
7.5.4 Initial Customer
Added displacement damage
as agreed in SRR
Corrected reference[SD24]and
refrenced this document as
guideline as agreed in SRR
Corrected typo (PA-005-753g)
Added space for qualified
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Requirement Changed
PA-005-7510b
PA-005-782a,
Section
Source Inspection
7.5.8 Radiation
Verification Testing
(RVT)
7.5.10 Relifing
7.8 Specific Components
PA-005-783a
7.8 Specific Components
PA-005-784a,b,c,d,e
7.8 Specific Components
PA-005-784f
7.8 Specific Components
PA-005-785a,
PA-005-786a
7.8 Specific Components
PA-005-758a
Annex 2 DCL
Annex 3 PAD
Annex 5 Hot Dip Solder
Pretinning
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Change
ASICs
Rewording according to SRR
agreements
Added [SD20]
Modified
numbering
of
requirement
Modified
numbering
of
requirement
and
modified
wording
Modified numbering of
requirement
Modified
numbering
of
requirement & added wording
i.a.w SRR agreements
Modified
numbering
of
requirement
Added bullets in Note 1 for
Other info field
Added Displacement Damage
in Radiation Hardness Data
Removed sentence
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2. ACRONYMS
See List of Acronyms SEOS-LI-ECE-SY-0004
Here after is listed the principal acronyms referenced in this document:
ABCL
As Built Configuration List
ASIC
Application Specific Integrated Circuit
CIDL
Configured Item Data List
CIL
Critical Item List
CoC
Certificate of Conformance
CSI
Customer Source Inspection
CSL
Change Status List
DCL
Declared Component List
DML
Declared Material List
DMPL
Declared Mechanical Part List
DPL
Declared Process List
DPA
Destructive Physical Analysis
EFRL
Exponential Failure Rate Law
EIDP
End Item Data Package
EPPL
European Preferred Part List
ESD
Electrostatic Sensitive Device
EM
Engineering Model
FM
Flight Model
FMECA
Failure Mode Effect and Criticality Analysis
FPGA
Field Programmable Gate Array
GDIR
General Design and Interface Requirements
HSIA
Hardware/Software Interaction Analysis
KIP
Key Inspection Point
LAT
Lot Acceptance Testing
MIP
Mandatory Inspection Point
MRR
Manufacturing Readiness Review
NCR
Non-Conformance Report
NRB
Non-conformance Review Board
PA
Product Assurance
PAD
Part Approval Document
PCB
Part Control Board
PFM
Proto Flight Model
PIND
Particle Induced Noise Detection
PMP
Mechanical Parts, Materials, Processes
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PSA
Part Stress Analysis
QCI
Quality Conformance Inspection
QM
Qualification Model
QML
Qualified Manufacturers List
QPL
Qualified Products List
QSL
Qualification Status List
RoHS
Restriction of certain Hazardous Substances
RFA
Request for Approval
RVT
Radiation Verification Test
SCC
Space Components Coordination
SEP
Single Event Phenomenon
SEU
Single Event Upset
SOW
Statement Of Work
SPA
Software Product Assurance
SPF
Single Point Failure
TCI
Technology Conformance Inspection
WCA
Worst Case Analysis
WEEE
Waste Electrical and Electronic Equipment
WFRL
Weibul Failure Rate Law
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3. PREFERENCE HIERARCHY
In case of conflict between any requirement described in this document and other SEOSAT
Applicable document, the order of preference is:
1.
2.
3.
4.
the applicable S.O.W
The applicable Unit/Subsystem Specification
This document
Any other documents.
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3.1. GENERAL
PA-0005-31a
ECSS-Q-00 shall apply
R
PA-0005-31b
The Subcontractor shall nominate an experienced Product
Assurance (PA) responsible as focal point of contact for ESA and
ECE. He shall have the necessary organisational authority and
independence.
Experienced personnel from the contractors' Quality Assurance
organisation shall be involved for tasks, which require specific or
more detailed knowledge (for example parts, materials and
workmanship expertise).
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PA-0005-31c
The Subcontractor shall prepare, submit, implement and maintain an
effective PA and Safety programme in accordance with the
requirement of this document for the entire project duration. The
Product Assurance and Safety Plan shall describe in detail
(resources, tasks, responsibilities, methods and procedures, lower
tier subcontractors and suppliers monitoring) the programme to be
implemented to satisfy the requirements of this specification. It shall
be submitted to ECE for approval.
Subcontractors internal procedures may be referenced in the PA&S
Plan. In this case they shall be provided on request. Subcontractors
should be aware that referencing internal company procedures in
the PA & Safety Plan will limit the company's ability to unilaterally
change the procedures. All modifications to these procedures shall
be considered as modification to the PA& Plan.
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PA-0005-31d
The Subcontractor shall produce a Compliance Matrix of his PA &
Safety Plan to the requirements of this document.
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3.2. RIGHT OF ACCESS
PA-0005-32a
ESA and ECE shall have the right of access to all technical and
programmatic documentation, all areas and operations within the
Subcontractor's facilities and his low tier subcontractors’ facilities in
which they perform work related to the project or store items used for
the project.
R
PA-0005-32b
ECE shall have the right to have a resident within the
Subcontractor's facilities.
The Subcontractor shall make arrangements to allow ESA and ECE
personnel such access any time when requested.
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3.3. PARTICIPATION
PA-005-33a
ESA and ECE shall have the right to perform or participate in audits,
surveys, source inspections, test reviews, mandatory inspections,
Delivery Review Boards, Non-conformance Review Boards, etc. at
the Subcontractor's facilities and his lower tier subcontractors and
suppliers. ESA and ECE participation shall not in any way replace or
relieve the Subcontractor of his responsibility. It will rather aim at
contributing to the identification of problem areas and assessing
satisfactory progress.
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3.4. RISK MANAGEMENT
PA-005-34a
The Subcontractor shall establish and maintain a Risk Management
System in coherence with ECSS-M-00-03A, as defined in the
Statement Of Work and Project Management Requirements.
The Subcontractor shall draw up a list of critical elements and
associated actions for risk mitigation, and shall guarantee their
implementation.
The risk management process shall include the inputs from all
Product Assurance disciplines.
R,A
3.5. REPORTING
PA-005-35a
The Subcontractor shall prepare and submit a periodic PA progress
report as part of the overall project progress reporting as defined in
the Statement Of Work [AD b] and Project Management
Requirements PMR [AD e]. It shall cover all the programme tasks
under the Subcontractor's responsibility, including Lower Tier
Subcontractors.
It shall address at the minimum the following topics:
- Key Inspection Points status and results
- Critical Items status
- Status of Waivers, Deviations and Non-Conformances
- Qualification status
- Statement of any change (Lower Tier Subcontractors
organisation, design, parts, materials, processes or procedures)
in the period at the Subcontractor or lower tier subcontractors
level.
R
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3.6. PA DATABASES
PA-005-36a
All PA-related data and analysis (such as NCR, RFW, RFD, EEE
components list, materials and processes list) shall be managed by
means of electronic databases. The database format and content
shall be agreed with ESA & ECE in order to allow the import and
export of data.
R
3.7. LOWER TIER SUBCONTRACTORS MANAGEMENT
PA-005-37a
If the Subcontractor intends to sub-contract a part of the work to a
Lower Tier Subcontractor, this shall be formally notified to ECE for
approval. The Subcontractor shall identify all Lower Tier
Subcontractors down to the lowest level in a list identifying the
name, the location, the part of the work sub-contracted and the
heritage. Approval will be given by ECE on the basis of:
-
-
R
Clear evidence that all requirements applicable to the project
are transmitted to the Lower Tier Subcontractor.
Evaluation of the ability of the Lower Tier Subcontractor to do
the work and to fulfil the requirements and availability of a
validation file for review by ECE. If needed, ECE may request
an audit.
Definition by the Subcontractor of an Audit and Surveillance
plan of the Lower Tier Subcontractor that includes the right of
access to ECE.
PA-005-37b
Any change to the list of Lower Tier Subcontractors shall be
submitted to ECE.
R
PA-005-37c
The Subcontractor shall audit his Lower Tier Subcontractors to
ensure their compliance with the requirements. ECE shall be notified
of the Subcontractor's intention to audit a Lower Tier Subcontractor
by Fax or E-mail with Configuration reference and a copy of the
audit check list for ECE review. The Subcontractor shall produce an
audit report within one month of the audit.
R
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4. QUALITY ASSURANCE
4.1. QUALITY ASSURANCE MANAGEMENT
PA-005-41a
4.1.1.
PA-005-411a
4.1.2.
PA-005-412a
4.1.3.
PA-005-413a
4.1.4.
ECSS-Q-20B shall apply.
R
Quality Assurance Programme
The Subcontractor shall establish, implement and maintain a QA
programme in accordance with ECSS-Q-20B and describe its
contents in the QA plan, which can be part of the general PA &
Safety Plan or alternatively be a self-standing document.
R
Personnel Training and Certification
The Subcontractor shall establish a documented training programme
for QA personnel and all other personnel whose performance
determines or affects product quality.
R
PA Programme Audits
The Subcontractor shall conduct audits as defined below of its own
and of its lower tier subcontractors and suppliers facilities,
equipment, personnel, procedures, services, and operations
employed in the PA programme. Audits shall include:
a. Examination of all operations and documentation compared with
established requirements.
b. Recommendation for corrective and preventive actions and follow
up to assess results of recommendation.
ECE shall be notified in advance of major audits. Reports shall be
available at the subcontractor's facility for review.
ESA shall have the right to participate in these audits.
R
QA Role in Configuration Management
PA-005-414a
The Subcontractor shall provide configuration and data management
rules conforming with those specified by ECE.
R
PA-005-414b
The Subcontractor QA function shall ensure that the configuration
and data management rules are applied and shall attend all boards
established to authorize release of configured documents.
R
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4.1.5.
PA-005-415a
4.1.6.
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Critical Item List
A Critical Item List (CIL) shall be prepared and kept up to date. It
shall list critical items from the equipment design, hardware and
software with appropriate risk reduction means defined for the
various phases of the project (i.e. design reviews, special
procedures/inspections, double verification of highly critical items,
single point failure of category catastrophic critical or major, general
recording of single point failure connectors…). This list shall be used
to finally close out all the above critical items and their associated
risk reduction measures after being verified and recorded.
R
Ranking of Critical Items
PA-005-416a
The Subcontractor shall establish a ranking list as a PA
management tool in order to effectively plan and organize the
resources for the PA programme. This list shall present, sequentially
in the order of criticality, items of the equipment, which present
specific risks to the project.
The list shall be an aid to establish priorities of PA and other areas
related effort early in the programme and to plan audits, KIP/MIP's
and general QA surveillance accompanying the individual risk
reduction measures.
R
PA-005-416b
The Subcontractor shall analyse all product/development items of
the equipment against criticality relative to:
A,R
-
Safety
Reliability, Single Point Failure (SPF)
Radiation sensitive components
Limited life items
Procurement, manufacturing, assembly, inspection, test,
handling, storage and transportation constraints
Processes or activities subcontracted to Lower Tier
Subcontractors involving two or more levels of subcontracting
New industrial processes and technology (not qualified or not
standard)
New technology for the Subcontractor
New development versus qualified and flown
History of non-conformance
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4.2. QUALITY ASSURANCE GENERAL REQUIREMENTS
4.2.1.
PA-005-421a
4.2.2.
PA-005-422a
4.2.3.
PA-005-423a
4.2.4.
Documentation and Data Control
The Subcontractor QA function shall ensure that:
- The pertinent issues of appropriate documents and data are
available at all required locations;
- Any obsolete documents and data retained for legal and/or
knowledge preservation purposes are suitably identified;
- Proper data and documentation exchange procedures and
formats are set up throughout the project organisation;
- Documents required by the programme are verified and signed
by the designated people before release.
- Documents are identified and verified for adequacy; details are
current and incorporation of Product Assurance requirements;
- The list of current revision of documents is regularly established
to preclude the use of invalid and/or obsolete documents and
data.
R
Quality Records
The Subcontractor shall maintain quality records to provide
evidence of inspections, tests, configuration and material reviews,
to demonstrate completion of QA tasks and achievement of the
required quality, for at least the duration of the mission plus
margin. Especial care shall be paid to monitoring and control of
obsolescence issues.
R
Stamp Control
Stamps or signatures shall be used to:
- Signify the completion of operations and processes,
- Indicate inspection performance at source and incoming
inspection, in process inspection and tests, final inspection,
- Identify (if necessary) the operator and/or the authorized
personnel.
R
Traceability
PA-005-424a
The Subcontractor shall implement a traceability system in
compliance with the ECSS-Q-20B § 5.4.
R
PA-005-424b
The traceability system provide for the ability to:
- Establish bi-directional (backwards and forwards) and
unequivocal relationship between parts/materials/products and
associated documentation/records
R
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Trace data, personnel and equipment related to procurement,
fabrication, inspection, test and assembly activities.
The Subcontractor shall maintain photographic records of all flight
equipment as part of the equipment as built configuration file. For
electronic equipment, the individual PCBs shall be photographed
on both sides prior to conformal coating. Equipment shall be
photographed prior to closure. Pictures shall be taken of the inside
& outside of all flight units. All pictures shall be maintained in the
PA database and included in the relevant EIDP.
-
PA-005-424c
4.2.5.
PA-005-425a
4.2.6.
R
Metrology and Calibration
The Subcontractor shall control, calibrate, validate and maintain
inspection, measuring and test equipment to demonstrate the
conformance of product, according to the principles of ECSS-Q20B § 5.5.
R
Non Conformance Control
PA-005-426a
The Subcontractor shall establish and maintain a non conformance
control system in accordance with the detailed requirements in
ECSS-Q-20-09.
R
PA-005-426b
NCR reporting shall be applicable to hardware and software which
contributes to the achievement of qualification, e.g. structural
model, alignment model, spares… and to the flight standard
hardware and software.
R
PA-005-426c
A summary list of all NCR's (major and minor) shall be provided to
ECE monthly (e.g. together with the progress report).
R
PA-005-426d
The Subcontractor shall notify ECE of all major non-conformances
within two working days of their detection.
R
PA-005-426e
The use of an integrated project NCR tool is required for reporting
of major NCR to ECE & ESA..
R
4.2.7.
Alert System
PA-005-427a
The Subcontractor shall inform ECE about EEE components and
Material and Process alerts generated internally.
R
PA-005-427b
The Subcontractor shall process alerts issued by ECE.
R
PA-005-427c
The Subcontractor shall assess the impacts of these alerts and
shall inform ECE of their consequences, according to the principles
of ECSS-Q-20B § 5.7.
R
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Handling, Storage and Preservation
PA-005-428a
The Subcontractor shall prevent handling damage by providing
adequate protection of items during handling, appropriate handling
devices, procedures and instructions.
R
PA-005-428b
The Subcontractor shall provide secure storage areas compatible
with the cleanliness requirements to store incoming materials,
intermediate items and end items before shipping.
R
PA-005-428c
Non-conforming items awaiting disposition, scrap items and all
other items which require to be stored separately for health or
safety reasons shall be placed in segregated areas.
R
4.2.9.
PA-005-429a
Statistical Quality Control and Analysis
When applicable, statistical methods for process control are
recommended for early detection of significant variations in
manufacturing processes, in order to determine, analyse and
eliminate the causes of undesirable variations.
A statistical Quality Control and Analysis is not required for the
SEOSAT project,
4.3. QUALITY ASSURANCE REQUIREMENTS FOR DESIGN AND
VERIFICATION
PA-005-43a
The Subcontractor Quality Assurance programme for design and
verification shall ensure that:
- The Customer requirements are understood and taken into
account by the functions involved and any deviation properly
resolved with the Customer.
- Methods, data and means (including software) required for
each activity are developed, available and validated before
starting the activities requiring them.
- Critical items are identified.
- All technical risks are identified and provisions for their
reduction are implemented.
- Interfaces between different groups, which provide input to the
design and verification process, are defined and supported.
- Incomplete, ambiguous or conflicting requirements are
resolved with originators of requirements.
- Feedback information is maintained from production, test,
product assurance, and operations, towards design
implementation.
- Design and Verification activities are planned in a consistent
and logical way in line with the overall schedule.
R
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PA-005-43b
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The verification process is adequate and includes in particular
clear test, test model and verification philosophy with
acceptance/reject criteria.
The Subcontractor QA function shall ensure that all configuration
items and their constituent items are properly qualified with margins
commensurate with the application and use environment.
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4.4. QUALITY ASSURANCE REQUIREMENTS FOR PROCUREMENT
PA-005-44a
4.4.1.
PA-005-441a
4.4.1.1
PA-005-4411a
4.4.1.2
PA-005-4412a
4.4.2.
PA-005-442a
The Subcontractor shall control the procurement activity to ensure
that all items and services procured conform to S.O.W
requirements.
The control of procurement activity includes selection of
procurement sources, control of purchase documents, surveillance
of lower tier Suppliers and control of incoming items.
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Selection of Procurement Sources
The Subcontractor Quality Assurance organisation shall participate
in and approve the selection of procurement sources, according to
ECSS-Q-20B § 7.2.
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Selection Criteria
Procurement sources shall be selected, according to the principles
of ECSS-Q-20B § 7.2.2, on the basis of their demonstrated
capability to furnish items or services of the type and quality level
being procured. This capability shall be supported by objective
documentation.
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Record and List of Procurement Sources
The Subcontractor shall establish and maintain records of all
procurement source, according to the principles of ECSS-Q-20B §
7.2.3.
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Procurement Documents
The Subcontractor shall ensure that supplies are precisely
identified and that all applicable requirements are properly defined
in the procurement documents, according to the principles of
ECSS-Q-20B § 7.3.
The Subcontractor shall flow down ECE PA requirements tailored
to reflect the content and complexity of the subject of the
procurement activity.
The Subcontractor QA function shall review procurement
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documents prior to release, to verify the correct selection of
procurement sources and appropriateness of their content.
4.4.3.
PA-005-443a
4.4.4.
PA-005-444a
Surveillance of Procurement Sources
The Subcontractor shall exercise surveillance over the activities
carried out by his procurement sources during the contract
performance, according to the principles of ECSS-Q-20B § 7.4.
The surveillance shall include, to the extent appropriate, audits,
reviews, Mandatory Inspection Points, as well as direct supervision
by the Subcontractor's resident personnel at his procurement
sources facilities and source inspection.
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Receiving Inspection
The Subcontractor shall take appropriate actions to ensure that all
incoming supplies, including documentation and packaging,
whether delivered on his own premises or elsewhere, conform to
the requirements of the procurement documents, according to the
principles of ECSS-Q-20B § 7.5.
Inspections shall be performed in accordance with established
procedures and instructions, to ensure that quality level is properly
determined.
Incoming inspection records shall be maintained to ensure
traceability and the availability of historical data to monitor
performance of the procurement source.
R,I
4.5. QUALITY ASSURANCE REQUIREMENTS FOR MANUFACTURING,
ASSEMBLY AND INTEGRATION
4.5.1.
PA-005-451a
4.5.2.
PA-005-452a
General
The Subcontractor shall ensure that the deliverables are built,
assembled and integrated to the approved configuration baseline,
in a planned, controlled and reproducible manner, according to the
principles of ECSS-Q-20B § 8.
R
Planning of Manufacturing, Assembly and Integration Activities
and Associated Documents
The Subcontractor, after a complete review of all requirements
defined by the design and engineering documentation, shall plan
manufacturing, assembly and integration operations in coordination
with inspections and tests, according to the principles of ECSS-Q20B § 8.2.
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4.5.2.1
PA-005-4521a
4.5.2.2
PA-005-4522a
4.5.3.
PA-005-453a
4.5.4.
PA-005-454a
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Manufacturing Flow Chart and Mandatory Inspection Points (MIP)
Manufacturing, assembly and integration operations and
inspections shall be reflected in flow charts for the product, which
shall clearly depict the sequence of operations and associated
inspections and tests according to the principles of ECSS-Q-20B §
8.2.2. It shall include the identification of MIPs, together with the
reference to the procedures by which the various activities are to
be performed and the required cleanliness levels of facilities.
MIP shall require:
- An invitation to EADS CASA & ESA five working days in
advance
- The participation of ECE & ESA or their agreement to
proceed without their participation
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Shop Travellers
Adequate instructions, such as shop travellers, shall direct the
actual performance of manufacturing, assembly and integration
operations and inspections, to ensure that the activities proceed in
an orderly manner and according to the planned sequence,
according to the principles of ECSS-Q-20B § 8.2.3.
The Subcontractor shall also provide for detailed support
documents and instructions, such as operation drawings and
operation instruction sheets, to enable operations to be correctly
performed.
R
Manufacturing Readiness Review
The Subcontractor shall perform a review of the readiness for
manufacturing, prior to start the manufacturing of the first flight
product as specified in the SOW. ECE shall be invited to participate
in the MRR and be given at least 10 days notice of the MRR.
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Control of Processes
The Subcontractor shall monitor all processes used for
manufacturing, assembly and integration, and shall enforce all
applicable process requirements.
All manufacturing processes shall be covered by documented
process specifications or standards.
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4.5.5.
PA-005-455a
4.5.6.
PA-005-456a
4.5.7.
PA-005-457a
4.5.8.
PA-005-458a
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Workmanship Standards
The Subcontractor shall employ workmanship standards
throughout all phases of manufacturing, assembly and integration,
to ensure acceptable and consistent workmanship quality levels.
Documentary
workmanship
specifications
shall
identify
acceptance/rejection criteria.
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Materials and Parts Control
The Subcontractor shall ensure that only conforming items are
released and used, and that those not required for the operation
involved are removed from work operation areas.
Items having limited life or definite characteristics of quality
degradation or drift with age and/or use shall be marked to indicate
the dates, test times or cycles at which life was initiated and at
which the useful life will expire.
Sensitive items shall be processed or manufactured, inspected and
tested in a controlled environment to prevent any degradation.
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Tooling Control
The Subcontractor shall make provisions for accountability,
identification and maintenance of manufacture, assembly and
integration tooling.
Manufacture, assembly and integration tooling shall be checked for
its dimensional accuracy, regarding the product drawings, and
correct function.
Records shall be kept of all manufacturing equipment.
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Cleanliness and Contamination Control
The Subcontractor shall establish controls for molecular and
particulate cleanliness of spacecraft hardware and facilities, and
the limitation of sources of contamination, according to the
principles of ECSS-Q-20B § 8.8 and ECSS-Q-70-01.
Contamination shall be prevented to the maximum extent possible
by operating in clean working areas and by proper handling,
preservation, packaging and storage.
Contamination sensitive items shall be cleaned, controlled and
maintained to the required cleanliness levels.
The required cleanliness levels for all levels of flight hardware
shall be indicated on drawings, specifications, procedures, or
other documents controlling the manufacture, assembly,
integration and test of the items.
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PA-005-458b
The Subcontractor shall define methods, procedures and
responsibilities in a Cleanliness and Contamination Control Plan
approved by ECE.
The Cleanliness Plan has to provide a contamination analysis and
to define the cleanliness conditions of the hardware environment
during manufacturing, assembly and tests (clean room class), the
associated control of cleanliness (particle counter, witness
samples.), the personal clothing, the potential protection devices
(covers, bags.), the cleaning methods.
I,A,R
PA-005-458c
The contamination sensitive components shall be identified in the
Critical Item List.
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4.5.9.
Inspection
PA-005-459a
Inspection and tests shall be defined at the points of the
manufacturing, assembly and integration flow where maximum
assurance for correct processing and prevention of unrecoverable
or costly non-conformances can be obtained, according to the
principles of ECSS-Q-20B § 8.9.
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PA-005-459b
Among the inspections and tests as part of the manufacturing,
assembly and integration flow, some selected inspections, called
MIPs (Mandatory Inspection Points) shall be performed with ECE
participation.
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PA-005-459c
MIPs shall be identified on the manufacturing and Inspection flow
chart and agreed upon with ECE before flight model manufacturing
commences.
R
PA-005-459d
MIPs shall require an invitation being submitted at least five working
days in advance, and the participation of ECE, or ECE agreement
to proceed without their participation.
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4.5.10. Specific Requirements for Assembly and Integration
4.5.10.1 Control of Temporary Installations and Removals
The Subcontractor shall ensure the management and control of
flight items which are temporarily removed or non-flight items which
are temporarily installed to facilitate assembly, integration, testing,
handling or preservation of the end item.
Records of temporary installations and removals shall be
established and maintained.
I,R
PA-005-45101b Non flight items i.e. connector savers, covers, etc. shall be clearly
identified as "NOT FOR FLIGHT" and/or clearly highlighted by colour
I,R
PA-005-45101a
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coding in RED.
4.5.10.2 Logbooks
PA-005-45102a The Subcontractor shall prepare and maintain equipment logbooks
for all operations, identifying the chronological sequence of
operations, ( & operating hours for limited life items), and tests
performed on the item during the period covered by the logbook,
according to the principles of ECSS-Q-20B § 8.10.2.
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PA-005-45102b
Equipment logbooks shall start with the first qualification or flight
acceptance test after assembly.
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PA-005-45102c
The logbooks shall contain historical and quality data and
information which is significant for operation of the item, including
non-conformances, deviations and open tasks in accordance with
S.O.W.
R
4.5.11. Manufacturing, Assembly and Integration Records
PA-005-4511a
Manufacturing, assembly and integration records shall be
established and maintained, to provide all data required for
traceability, according to the principles of ECSS-Q-20B § 8.11.
R
4.6. QUALITY ASSURANCE REQUIREMENTS FOR TESTS
4.6.1.
PA-005-461a
4.6.2.
PA-005-462a
4.6.3.
PA-005-463a
Test Facilities
The Subcontractor shall ensure that test facilities, either internal or
external, comply with the project requirements, according to the
principles of ECSS-Q-20B § 9.1.
R
Test Equipment
The Subcontractor shall ensure, according to the principles of
ECSS-Q-20B § 9.2, that testing techniques and data are validated
prior to use and controlled during their use in testing. In particular,
provisions shall be made for testing, approval and configuration
control of the software involved and prevention of its being
tampered with.
R
Test Documentation
The Subcontractor shall ensure, according to the principles of
ECSS-Q-20B § 9.3 that tests are performed in accordance with
documented procedures.
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The Subcontractor shall ensure that all test are comprehensively
documented in test reports, and that they include, as a minimum:
a.- reference to the applicable test procedure, and description of
the deviations from it during the actual testing.
b.- test data records and evaluation.
c.- summary of test results
4.6.4.
PA-005-464a
4.6.5.
PA-005-465a
4.6.6.
Test Performance Monitoring
The Subcontractor shall verify, according to the principles of
ECSS-Q-20B § 9.4, that appropriate monitoring of test activities, is
defined in the test procedures, and that any non-conformances
are properly documented and treated.
R
Test Reviews
The Subcontractor shall invite ECE to attend Test Reviews, with a
notification of at least two weeks before the event.
R
Test Readiness Reviews (TRR)
PA-005-466a
The Subcontractor shall ensure that a Test Readiness Review is
performed prior to the flight qualification or the first acceptance
tests.
R
PA-005-466b
The Test Readiness Review (TRR) shall allow to determine the
following:
- That the as-built configuration status of the test specimen
conforms to the released baseline or differences are acceptable
and documented to assure that test objectives can be met,
- Status of existing non-conformances/failures, Request For
Waivers, open works and assessment that open actions do not
affect the test,
- Availability and approval of test procedures, including
acceptance, rejection and retest criteria,
- Verification that hazards and hazardous operations have been
clearly identified within the test procedure and appropriate actions
are implemented,
- Readiness of the test facilities and associated equipment
(cleanliness of test facility, calibration status and validity of all test
equipment, including any software),
- Non-conformance expected for closure during test execution,
- Schedule of key events and milestones,
- Assignment of responsibility during the test,
- Conclusion whether to release for testing.
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Test Review Board (TRB)
PA-005-467a
The Subcontractor shall ensure that a Test Review Board is
performed after major portions of qualification or acceptance tests
as defined in the SOW.
R
PA-005-467b
The Test Review Board (TRB) shall be held to determine that:
- All portions and steps of the applicable procedure have been
properly executed, and the test specimen and test equipment
have been brought to safe condition,
- All deviations from or modifications to the initial test procedure,
which had to be made during the test, were properly documented
and authorized,
- All required data records are complete and at least a first
assessment has been made to determine whether the
parameters were within required limits, or whether there is a
need for additional testing and/or further analysis of the results
before a conclusion can be reached,
- Non-conformances/failures have been recorded and at least
initial dispositions affecting continuation/completion of the test
have been made by the appropriate Non-conformance Review
Board,
- The test article can be released to the next step and the test
set-up can be dismantled.
R
4.7. QUALITY ASSURANCE REQUIREMENTS FOR ACCEPTANCE AND
DELIVERY
4.7.1.
PA-005-471a
4.7.2.
PA-005-472a
General
The Subcontractor shall establish, according to the principles of
ECSS-Q-20B § 10 a
formal acceptance process for all
deliverable items, at any contractual level, to ensure that
conformance of the items to be delivered is fully assessed and
documented.
The Subcontractor shall also ensure that the preparation of the
items for delivery and the physical delivery itself are performed in
such a way that quality degradation is prevented.
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End Item Data Package
The Subcontractor shall provide an EIDP for each deliverable end
item, according to the principles of ECSS-Q-20B § 10.2.
The EIDP shall constitute the basis for formal acceptance reviews.
The list of contents for EIDP is given in § 11 of this document.
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4.7.3.
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The Subcontractor shall provide an EIDP in electronic format to
ECE.
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Delivery Review Board
PA-005-473a
The Subcontractor shall ensure that a DRB is convened prior to
the delivery of units, separately assembled subsystems or
test/handling equipment for higher-level activities, according to the
principles of ECSS-Q-20B § 10.3.
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PA-005-473b
The DRB shall be responsible for reviewing the tests results and
authorizing the shipment of the items under acceptance, and
certifying by writing that:
a. The items conform to the contractual requirements and to an
approved design configuration.
b. All Non-conformances are closed-out, or corresponding
closure action plans, compatible with the delivery, are
accepted.
c. The relevant EIDP is complete and accurate.
R
PA-005-473c
ECE shall authorize the delivery.
R
4.7.4.
Shipping Control
PA-005-474a
The Subcontractor shall ensure that the items to be shipped from
his plant are inspected before release and found to be complete,
adequately preserved and packaged, correctly marked and
accompanied by all the required documentation, according to the
principles of ECSS-Q-20B § 10.5.
PSS-01-202 Standard shall be used as guidelines for detailed
requirements for packing, marking and labelling and transportation
I, R
PA-005-474b
Accompanying documentation shall include the EIDP and,
attached to the outside of the shipping container, the handling and
packing/unpacking procedure and any relevant safety procedures.
R
PA-005-474c
Each item shall be permanently marked with identification label
including at least the following:
- Part/product Name
- End Item Number
- Model
- Serial Number
- Name of the manufacturer
- Date of Manufacture
The identification label shall be legible with unaided eye from 0.5m
distance. The identification label shall meet all the requirements
applicable to the item.
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The Subcontractor shall make provisions for the prevention of
damage to items during transportation.
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5. DEPENDABILITY
The Dependability Assurance activities include the Reliability, Availability and Maintainability
assurance activities. Their purpose is to:
•
•
•
•
design and supply a reliable product (flight product) in compliance with the product
dependability requirements
identify Dependability critical items
set up and carry out all actions for risk mastering (as part of the risk management program)
guarantee that the as-built product is compliant with the Product Dependability requirements
and performance specified into the product technical specification.
5.1. DEPENDABILITY PROGRAMME MANAGEMENT
PA-005-51a
The Subcontractor shall develop, maintain and implement a
Dependability Programme Plan as part of the overall PA & Safety
Plan, based on the principles of ECSS-Q-30B and ECSS-Q-40B,
and addressing the requirements of this chapter 5.
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PA-005-51b
The subcontractor shall implement a dependability and safety
process in accordance with the category of the unit under its
responsibility.
For each product, the extent that dependability assurance is
applied shall be adapted to the severity of the consequences of
failures at system level. For this purpose, The products are
classified into appropriate categories in accordance with
consequence severity:
The consequences shall be quantified by their severity, which is
a measure of the magnitude of the consequence. The severity of
a consequence shall be classified according to the following
scale,
1.-catastrophic
2.- critical
3.- major
4.- negligible
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as defined in table 533b-1 of this document
The category of the unit (1,2,3 or4) will be defined by ECE in the
SOW [AD b], or in the ITT special condition to tender.
PA-005-51c
For units identified as category 1, or category 2, or category 3,
the Subcontractor shall develop, maintain and implement a
dependability and safety management plan (which may be part of
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the overall PA & Safety Plan). It will particularly contain a matrix
of compliance with this document.
The contractor dependability and safety management plan is
subject to approval by ECE.
PA-005-51d
The Subcontractor shall maintain a dependability and safety
documentation file, as part of the project documentation file,
including all data related to dependability and safety activities.
The dependability and safety file shall be available in house for
consultation by ECE.
A, R
PA-005-51e
The subcontractor shall provide for each design review, the
complete dependability and safety data to a level of detail
consistent with the objectives of the review and are presented to
the customer in accordance with the project review schedule
A, R
PA-005-51f
The dependability and safety deliverables are defined in the
SOW [AD b]
A, R
PA-005-51g
The subcontractor shall provide a dependability and safety status
report for each progress meeting and for each programme review
A, R
PA-005-51h
Subcontractors shall impose these requirements upon their lower
tier subcontractors and suppliers as appropriate to the procured
item.
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5.2. DEPENDABILITY RISK REDUCTION AND CONTROL
5.2.1.
PA-005-521a
5.2.2.
Identification and Classification of Undesirable Events
The Subcontractor shall provide identification of undesirable
events leading to the loss of degradation of product performance
together with their classification into categories related to the
severity of their consequences.
R
Assessment of Failure Scenarios
PA-005-522a
The Subcontractor shall investigate the possible scenarios leading
to the occurrence of undesirable events and shall identify failure
modes, failure origins and causes.
A, R
PA-005-522b
During preliminary design phase, functional FMEA shall be
performed to determine the effects for each function of the
product.
A, R
PA-005-522c
The list of undesirable events with their classification into criticality
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categories related to the severity of their consequences is
provided in the product technical specification
5.2.3.
Criticality Classification of Functions and Products
PA-005-523a
During preliminary design phase, the Subcontractor shall classify
functions into criticality categories which are directly related to the
severity of the consequences resulting from failure of the function.
R
PA-005-523b
The criticality shall be used to focus dependability effort on critical
items to comply with dependability requirements.
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5.2.4.
PA-005-524a
5.2.5.
Actions and Recommendations for Risk Reduction
The Subcontractor shall define actions and recommendations for
risk reduction up to an acceptable level, with respect to the project
dependability requirements.
R
Risk Decisions
PA-005-525a
The Subcontractor shall make and document decisions on risk
acceptance and actions for risk reduction.
R
PA-005-525b
Decisions shall be taken, controlled and implemented within the
risk management process applied on the project, as defined in
paragraph 3.4 of this document.
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5.2.6.
PA-005-526a
Verification of Risk Reduction
The Subcontractor shall perform appropriate verifications in order
to ensure that identified risks have been eliminated or reduced to
an acceptable level.
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5.3. DEPENDABILITY ENGINEERING
5.3.1.
PA-005-531a
Integration of Dependability in the Project
The Subcontractor shall ensure that the dependability assurance
process is an integral part of the engineering process,
implemented during all phases of the project beginning with the
conceptual phase and that the corresponding activities are
reported to the Product Assurance Manager and to the Product
Design Engineer.
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5.3.2.
PA-005-532a
5.3.3.
PA-005-533a
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Dependability Requirements in Technical Specification
The Subcontractor shall ensure that dependability requirements
are included in the preparation of technical specifications for their
lower tier subcontractors.
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Dependability Design Criteria
The Subcontractor shall take into account in the design of the
product the dependability requirements expressed in the product
Technical Specification and other project applicable documents in
paragraph 1.2.1.
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SEOSAT Failure events on system and subsystem level that will
affect mission success shall be classified on the basis of the
severity of their consequences, according to the severity
categories defined in Table 533b- 1 below
A,R
SYSTEM LEVEL Severity Categories
Severity
Category
Catastrophic 1
Critical 2
Failure effect
Loss of life, life threatening or permanently disabling
injury or occupational illness.
Loss of mission.
Major 3
Major mission degradation. (e.g.: Loss of PAN or MS
channel)
Negligible 4
Any other effect
SUBSYSTEM/ASSEMBLY/EQUIPMENT LEVEL Severity Categories
Severity
category
Level 1
Failure effect
Propagation of failure to other
subsystems/assemblies/equipment
Level 2
Loss of functionality.
Level 3
Degradation of functionality.
Level 4
Any other effect.
Table 533b-1:Severity Categorization : Dependability
5.3.4.
PA-005-534a
5.3.5.
PA-005-535a
Involvement in Test Definition
The Subcontractor shall ensure that dependability aspects are
covered in all development, qualification and acceptance test and
planning and reviews, including the preparation of test
specifications and procedures and the evaluation of test results.
R
Involvement in Operational Aspects
The Subcontractor shall ensure that dependability qualified staff
contribute to definition and review users manual and procedures
for verification of consistency with dependability analysis.
R
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5.3.6.
PA-005-536a
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Dependability Recommendations
The Subcontractor shall establish and maintain a system to track
the dependability recommendations in order to support the risk
reduction process
R
5.4. DEPENDABILITY ANALYSIS
5.4.1.
PA-005-541a
Dependability Analysis and the Project Life Cycle
The Subcontractor shall perform dependability analysis
throughout the project life cycle to support the conceptual,
preliminary and detailed development, the optimization of the
design, including the testing phase that leads to design
qualification.
5.4.2.
Reliability Analysis
5.4.2.1
FMECA
A, R
PA-005-5421a
A Failure Mode Effect and Criticality Analysis (FMECA) shall be
performed on the functional and physical design at equipment
level.
A, R
PA-005-5421b
The unit configuration (hardware, software) used for the analysis
shall be identified
R
PA-005-5421c
A FMECA established at functional block level (a functional block
is a part of the product dedicated to an elementary function) shall
be provided assessing main failure modes effects at unit level.
R
PA-005-5421d
In case of unit including software, the effects of software errors
shall be assessed at functional level.
In case of integrated complex modules (ASIC, ..), the effects of the
failures shall be assessed at functional level (considering the lay
out of the module).
R
PA-005-5421e
A detailed FMECA at parts level shall be provided:
- for interface circuits,
- for circuits identified as critical in the technical specification,
- for redundancy embedded in the same product.
R
PA-005-5421f
The applicable parts failure modes list (for FMECA at parts level)
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is provided in annex 6.
PA-005-5421g
The “residual” sensitive parts to Single Event Phenomenom (SEP)
(see definition in section 4.4 of GDIR [AD D]) shall be addressed
in the FMECA.
A, R
PA-005-5421h
Common mode and common cause failure shall be considered.
Multiple failures resulting from common cause or common mode
failures shall be considered as single failures when determining
failure tolerance.
A, R
PA-005-5421i
FMECA items identified as a safety hazard (refer to § 5.2) shall
include a cross reference to the corresponding paragraph in the
Hazard Analysis, where those particular items are treated.
R
PA-005-5421j
The analysis shall identify for each failure mode or SEP or
software error:
- The effects on the unit functions, on the unit performances
(including EMC performances], on the interfaces signals and the
impacts on the unit power dissipation.
- How each failure mode is detected and the associated unit
telemetries affected
- The need for specific monitoring and actions at to be
implemented at system level
- The gravity (or severity), as defined hereafter:
1 = failure propagation outside the unit
= internal failure propagation between unit redundant functions
2 = loss of all the functions of the unit
3 = loss of some functions within the unit
4 = without functional effect
R
PA-005-5421k
For equipment containing software, a Hardware/Software
Interaction Analysis shall be performed to ensure that the software
is designed to react in an acceptable way to hardware failures.
The Hardware/Software Interaction Analysis may be included in
the FMECA.
R
PA-005-5421l
The Compliance with the dependability and safety requirements
related to failure tolerance shall be assessed as a result of the
FMECA
R
PA-005-5421m
The Subcontractor shall identify, justify and track all residual non
conformances to dependability and safety requirements, such as
Failure Point Failure and Safety Hazards in the Critical Items List,
which shall be subject to ECE approval
R
PA-005-5421n
The FMECA procedure described in ECSS-Q-30-02 is required.
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The specific forms sheet used shall be agreed with ECE.
The FMECA shall be delivered in an electronic form to be agreed
with ECE.
PA-005-5421o
5.4.2.2
PA-005-5422a
5.4.2.3
In case of design modifications the FMECA shall be maintained
and delivered when appropriate.
R
Fault Tree Analysis
The Subcontractor shall perform a Fault Tree analysis for all
feared events, as required in the Technical Specification.
A, R
Reliability Prediction
PA-005-5423a
The Subcontractor shall perform reliability predictions to verify the
compliance to the reliability requirement defined in the Technical
Specification and to support the design trade-offs.
A,R
PA-005-5423b
All the assumptions used for the calculation shall be part of the
reliability assessment.
R
PA-005-5423c
MIL-HDBK 217F notice 2, taking into account the appropriate
quality levels, shall be used preferably as the failure rate
database. Where components are not covered by MIL-HDBK
217F notice 2, individual failure rates shall be agreed with ECE
and ESA.
R
PA-005-5423d
The reliability assessment shall be conducted under the
specified environmental conditions and under the actual
electrical stress applied.
A,R
PA-005-5423e
Mechanical parts shall be addressed in the reliability prediction
and the reliability data sources shall be provided.
R
PA-005-5423f
When the reliability prediction shows that the reliability target is not
met, the item shall be identified as critical and incorporated within
the risk management process for criticality reduction.
R
5.4.2.4
PA-005-5424a
Worst case Analysis
The Subcontractor shall perform a Worst Case Analysis on
electronic/ electrical equipment to demonstrate that it performs
within specification despite variations in its constituent part
parameters and the imposed environment.
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PA-005-5424b
The analysis shall verify that within combinations of specification
characteristics and part tolerance, the design still meets the
design performance at End Of Life.
A, R
PA-005-5424c
The statistical methods and tools used for the demonstration shall
be recorded and shall be made available for review.
R
PA-005-5424d
A worst case summary shall be provided identifying the main
critical functions on which analysis has been performed, the
supporting circuits and a compliance status shall be issued
identifying the critical areas (non conformance or null margin).
R
5.4.2.5
Part Stress Analysis
PA-005-5425a
The Subcontractor shall perform Parts Stress Analysis in order to
demonstrate the compliance of the design with the derating rules
defined in the document ECSS-Q-30-11
A,R
PA-005-5425b
Deviations from derating criteria shall be subject for a request for
deviation.
R
PA-005-5425c
For wire link fuses, the current derating factor shall be 50 % with
an additional derating of 0,2 %/°C for an increase in the
temperature of fuse body above 25 °C.
R
5.4.3.
Maintainability Analysis
PA-005-543a
The Subcontractor shall identify the preventive and corrective
maintenance actions for ground operations, including storage in
the Products User Manual.
Emergency restoration or repair activities necessary to sustain
system capabilities crucial to mission success shall also be
identified..
R
PA-005-543b
The Subcontractor shall identify in a Maintainability report and
agree with those items that cannot be checked after integration,
that require late servicing, access or replacement, and limited-life
items or consumables.
R
5.4.4.
Availability Analysis
The Availability Period is defined as the period the space segment and the link to the ground
segment provides the required mission data to the ground segment. Any other time is a period
of non-availability.
PA-005-544a
The Subcontractor shall provide the occurrence rates associated
R
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to events (Single Event Upset, Single Event Transient, …) leading
to unavailability of the product.
All the constraints associated to the recovery of product nominal
performances shall be identified and quantified:
- delay between product switch OFF and ON,
- warm up duration,
-….
5.4.5.
PA-005-545a
5.4.6.
PA-005-546a
Classification
Documents
Design
Characteristics
in
Production
Not applicable
Critical Item List
All critical items identified through the various dependability R
analysis shall be documented in the Critical Item List defined in
paragraph 4.1.5 of this document. The documentation for each
critical item shall include a justification for retention of that item
that shall be subject to approval by the customer.
5.5. DEPENDABILITY
COLLECTION
PA-005-55a
of
TESTING,
Not applicable
DEMONSTRATION
AND
DATA
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6. SAFETY
6.1. GENERAL
This section defines the Safety requirements.
The purpose of the Safety process is:
•
To design and supply a safe product (flight product and associated ground support
equipment) in compliance with
{
{
•
•
•
•
•
The applicable safety regulations
The legal European Union (EU) requirements related to the product liability
(including new approach directives) where appropriate
To prevent personnel death and injury on Ground
To prevent any damage to flight hardware, equipment and facilities during integration on
Ground
to identify safety critical items
to set up and carry out all actions for risk mastering (as part of the risk management
program)
to guarantee that the as-built product is compliant with the specified safety requirements
and performances.
PA-005-61a
The Subcontractor is responsible to ensure the safety of his
products. The safety programme relates to flight hardware and
associated Ground Support Equipment under the responsibility of
the Subcontractor.
R
PA-005-61b
ECSS-Q-40B shall apply supplemented by:
National (contractor manufacturing site location) and European
safety requirements shall be applicable.
“New approach” European union directives (connected to product
liability) shall be applicable where appropriate.
Launch site safety regulations (as specified in the related SOW [AD
b]) shall be applicable.
R
6.2. SAFETY PROGRAMME
PA-005-62a
The Subcontractor shall set up a safety organisation and a safety
representative.
R
PA-005-62b
The Subcontractor shall manage risks to human life, investments
made, mission and environment throughout the project by
performing the following activities:
R
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- Allocation of safety requirements
- Hazard identification
- Hazard evaluation
- Hazard prevention, reduction and control
- Hazard close out, including residual risk acceptance
All hazard assessments shall consider primarily the hazard
potential and categorize all hazards according to the consequence
severity defined in paragraph 6.3 of this document. Corresponding
controls shall be proposed.
PA-005-62c
The Subcontractor shall develop, maintain and implement a Safety
Programme Plan as part of the overall PA & Safety Plan, in
accordance with ECSS-Q-40B § 4.6.
R
PA-005-62d
The Subcontractor shall maintain a safety documentation file, as
part of the project documentation, including all data related to
safety.
The safety file shall be available in-house for consultation by ECE.
R
PA-005-62e
The Subcontractor shall generate a request for deviation or waiver
when safety requirements are not met.
R
6.3. SAFETY ENGINEERING
6.3.1.
PA-005-631a
6.3.2.
PA-005-632a
Design selection
Inherent safety shall be mandatory for design selection.
R
Hazard reduction precedente
The following reduction precedence shall be applied to identified
hazards, hazardous conditions and functions whose failures have
hazardous consequences, as detailed in ECSS-Q-40B § 5.2.3:
Hazard elimination:
Hazard minimization:
Hazard control-Safety devices: use of automatic safety devices to
reduce and make residual hazard controllable. They shall be
independent and verifiable.
Hazard control-Warning devices: devices shall be used for the timely
detection and the generation of an appropriate warning signal.
Hazard control-Special procedures: procedures shall be developed
to control the hazardous conditions for enhancement of the safety
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6.3.3.
PA-005-633a
6.3.4.
PA-005-634a
6.3.5.
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Environmental compatibility
The product design shall meet the applicable safety requirements
under the worst-case natural and induced environments as defined
by the GDIR [AD d].
R
Fail-safe design
Whenever feasible, a fail-safe design approach shall be used such
that a failure brings the product into a safe state.
R
Hazard detection
PA-005-635a
The product design shall provide the capability for detecting failures
that result in degradation of failure tolerance with respect to the
hazard detection, signalling and safing function. The performance
of these functions shall be verifiable during flight and ground
operational phases.
R
PA-005-635b
No single failure or single human error shall cause loss of the
emergency and warning functions together with the monitored
functions.
R
PA-005-635c
Emergency, warning and caution data, out of limit annunciation
and safing commands shall be given priority over other data
processing and command functions.
R
6.3.6.
PA-005-636a
Safety risk reduction and control
The severity consequence of identified hazardous events shall be
classified as follows:
Severity
category 1
Designation
catastrophic
category 2
critical
category 3
marginal
category 4
negligible
Description
Loss of human life; life hreatening,
permanently disabling injury or
occupational illness. Severe detrimental
environmental effects.
temporarily disabling but not lifethreatening injury to persons and major
damage to property, including the
environment
minor injuries to persons; significant
damage to or deterioration of property,
including the environment
without consequence for persons, property
and the environment
Note: Failure modes or activities which e.g. in case of human error can lead to
any such hazard except "negligible" shall be identified as "Residual Hazards" and
are subject to formal approval.
R
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Table 636a-1:Hazard severity categories
PA-005-636b
6.3.7.
PA-005-637a
The hazardous events of the product and associated severity are
specified in the Technical Specification.
R
Failure Tolerance Requirements
The contractor shall verify the capability of the design to sustain
single or multiple failures as defined by the following failure
tolerance requirements:
ƒ
ƒ
ƒ
The failure of the unit will not propagate a failure to
other subsystems /assemblies/equipment, defined as
level 1 in table 533b-1
Single point failures which cannot be eliminated from the
design with reasonable effort (or fault tolerance
requirements which cannot be met) shall be summarized
in a single Point failure/Critical item list as specified in
section 4.1.5 Critical Items Control above. They are
subject to formal approval by ECE & ESA on a case-bycase basis with a detailed retention rationale.
No single hardware failure or operator error shall cause
effects on any level of the SEOSAT system of the severity
1 or 2 as defined in the table 636a-1 above
ƒ
No two hardware failures, two operator errors, a
combination of a hardware failure and an operator error
or a software failure shall cause effects on any level of
the SEOSAT system of the severity 1 as defined in Table
636a-1
ƒ
Improper command or command sequences or software
errors (e.g. originating from Single event Upsets) shall not
cause effects on any level of the SEOSAT system of the
severity 1 or 2 as defined in Table 533b-1,Dependability
design criteria, damage of hardware and shall not result
in operational conditions which cannot be restored by
ground command. This is also applicable for ground
testing of flight hardware. Exceptions shall be approved
by ECE & ESA and shall be reflected in the SEOSAT
User manual.
For the failure consequence “Major mission degradation”
the acceptable failure tolerance has to be agreed on a
case by case basis depending on the severity of the
degradation.
The failure tolerance approach needs not to be applied
to: primary structures, load-carrying structures, structural
ƒ
ƒ
R
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fasteners, load-carrying elements of mechanisms,
pressure vessels. Fracture control for these items shall
be applied as defined in ECSS-E-30-01.
ƒ Alternative or redundant safety-critical functions shall be
physically and functionally separated or protected in such
a way that any event that causes the loss of one path
shall not result in the loss of alternative or redundant
paths.
ƒ Hardware or software failures shall not cause additional
failures with hazardous effects or propagate to cause the
hazardous operation of interfacing hardware.
Note: Additional failure tolerance requirements may be defined by
the Launch Authority or by the applicable safety regulations
6.3.8.
PA-005-638a
6.3.9.
Design for minimun risk
Hazards related to mechanisms, structures, pressure vessels,
pressurized lines and fittings, material compatibility and material
flammability shall be controlled by the safety-related properties and
characteristics of the design, such as margin or factors of safety.
Positive safety margins shall exist when considering the worst
credible combination of environmental conditions.
A,R
Identification and control of safety-critical functionsº
PA-005-639a
A product function that, if lost or degraded, or through incorrect or
inadvertent operation, could result in catastrophic or critical
hazardous consequences shall be identified as a safety-critical
function.
R
PA-005-639b
Inadvertent operation of a safety critical function shall be prevented
by:
ƒ Two independent inhibits, if it induces critical
consequences, or
ƒ Three independent inhibits, if it induces catastrophic
consequences.
R
PA-005-639c
A Safety Critical Items List shall be established and included in the
Critical Items List
Each safety Critical Item that is retained shall be supported with a
justification for retention which shall be subject to ECE approval..
R
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6.4. SAFETY ANALYSIS REQUIREMENTS AND TECHNIQUES
6.4.1.
PA-005-641a
6.4.2.
General
Safety analysis shall be performed, initiated early in the design
phase, in a systematic manner.
Hazard analysis
PA-005-642a
Hazard analysis shall be performed in accordance with ECSS-Q40-02 and documented in Hazard Reports to support the hazard
reduction process. Hazard analysis and reports shall conform to
Annex B of ECSS-Q-40B to identify and evaluate:
- Hazards associated with the product design, its operation
and the operation environment
- Hazardous effects resulting from the physical and functional
propagation of initiator events,
- Hazardous events resulting from the failure of product
functions
- Time critical situations
The following potential initiators events shall be considered:
- Hardware failure (random or time dependent)
- Latent software error
- Operator error
- Design inadequacies, including:
- Inadequate margins
- Unintended operating modes caused by sneak-circuits
- Material inadequacies and incompatibilities
- Hardware/Software interactions
- Natural and induced environmental effects
- Procedural deficiency
PA-005-642b
Safety risk assessment shall be conducted all along the safety
programme implementation.
6.4.3.
A,R
R
Fault Tree Analysis
PA-005-643a
The Subcontractor shall perform a Fault Tree analysis for all safety
critical feared events specified in the Technical Specification in
order to verify the required failure tolerance of the product.
R
PA-005-643b
The results of FMECA shall be used to support the hazard analysis
in the evaluation of effects of failures.
R
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6.5. SAFETY VERIFICATION
PA-005-65a
Adequate end-to-end validation tests on safety critical functions to
determine or demonstrate the margin of safety or degree of
hazard shall be implemented where appropriate.
R,T
6.6. OPERATIONAL SAFETY
PA-005-66a
Not applicable
6.7. PRODUCT LIABILITY REQUIREMENTS
In addition to safety analyses, the Subcontractor will address specifically the requirements
issued by the European Union in terms of product liability and related directives.
PA-005-67a
The liability requirements shall apply to every product (flight
product and ground support equipment) under the responsibility of
the Subcontractor.
R
PA-005-67b
The Subcontractor shall identify for each product under his
responsibility the applicability of the EU directives.
R
A non exhaustive list of directives to be considered is given hereunder for information:
Reference
92/59/EEC
85/374/EEC
99/5/EEC
73/23/EEC
98/37/EEC
89/336/EEC
97/23/EEC
93/15/EEC
94/9/EEC
90/270/EEC
91/157/EEC
92/58/EEC
Title
General product safety
Product Liability
Radio equipment and telecommunications terminal Equipment
Low voltage
Machinery
Electromagnetic compatibility (EMC)
Pressure equipment
Explosives for civil use
Equipment and protective systems intended for use in explosive
atmospheres
Display screen equipment
Batteries and accumulators
Safety signs
PA-005-67c
Where applicable, the Subcontractor shall perform the related
certification towards the EU directives.
R
PA-005-67d
The Subcontractor shall perform for each product under its
responsibility a safety assessment report in line with the safety
analysis.
R
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PA-005-67e
After compliance assessment the Subcontractor shall deliver when
appropriate a formal Declaration of Conformity mentioning the legal
data asserted by the EU directives.
R
PA-005-67f
Each product, where appropriate, shall be CE marked and in
accordance with European Legislation. The CE marking shall
include the name of the Subcontractor company.
R
PA-005-67g
The user's manual of each product, where appropriate, shall
address the product safety issues and the related procedures.
R
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ELECTRICAL, ELECTRONIC & ELECTROMECHANICAL
(EEE) COMPONENTS
7.1. SCOPE
7.1.1.
General
This chapter establishes, for the SEOSAT programme, the requirements for selection,
procurement, use and control of EEE (Electrical, Electronic and Electromechanical) parts.
PA-005-711a
These requirements are in line with the principles of ECSSQ-60B clause 5: requirements for class 2, except for the
following cases for which Class 1 Components requirements
are fully applicable:
1 - Hybrid circuits (self made or procured)
2 - ASICS, Oscillators, Relay, Fuses
3 - When the SEOSAT reliability requirements cannot be
met
4 - When the SEOSAT radiation requirements cannot be
met
5 - For any SPF with severity category catastrophic,
critical and major.
6 - When EEE components are used to support safetycritical functions.
Compliance to points 3 to 6 will be verified as part of
normal work on a case by case basis.
7.1.2.
Objectives
The objective of the EEE component selection, control, procurement and use requirements
is to ensure that the EEE components used in a space project allows the project as a whole
to meet its mission requirements.
Important elements of EEE component requirements include:
• component programme management
• component selection, evaluation and approval
• procurement
• handling and storage
• component quality assurance
• components data acquisition, storage and dissemination
• specific components
The main tools which can be used to reach the objective are:
• concurrent engineering
• standardization of EEE component types
• characterization of components
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• assessment of component manufacturers including declared competencies and processes
• testing, screening, lot acceptance and periodic testing
• procurement specifications
• control and inspection
• control of non conforming materials
• assessment and use of existing components data
• control of EEE Components with specific attention being given to those with limited data or
confidence information management.
7.1.3.
Definitions
The following terms and definitions are specific to this document in the sense that they are
complementary or additional to those contained in ECSS-P-001.
NOTE 1 : The term “EEE component“ is synonymous with the terms "EEE Part",
"Component" or just "Part".
NOTE 2 : For the purpose of clear understanding of this document, hereunder is a listing of
component categories which are covered by the term EEE component, encapsulated or non
encapsulated, irrespective of the quality level :
• Capacitors
• Connectors
• Crystals
• Discrete semiconductors (including diodes, transistors)
• Filters
• Fuses
• Magnetic components (e.g. Inductors, Transformers, including in-house products)
• Monolithic Microcircuits (including MMICs)
• Hybrid circuits
• Relays
• Resistors, heaters
• Surface acoustic wave devices
• Switches (including mechanical, thermal)
• Thermistors
• Wires and Cables
• Optoelectronic Devices (including opto-couplers, LED, CCDs, displays, sensors)
• Passive Microwave Devices (including, for instance, mixers, couplers, isolators and
switches)
Qualified parts
Parts belonging to QPLs or QMLs from the following normative systems : ESCC, MIL, JAXA,
CECC
Screening
Tests, inspections or combination thereof, imposed on 100% of parts, to remove
unsatisfactory items or those likely to exhibit early failures
Space qualified parts
Parts belonging to QPLs or QMLs from the following normative systems (ESCC, MIL, JAXA)
according to the space quality level defined in these systems
Commercial component
Part neither designed, nor manufactured with reference to military or space standards.
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7.2. APPLICABILITY
PA-005-72a
The provisions of this document shall apply to all parties involved
at all levels in the realization of the SEOSAT programme.
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PA-005-72b
Components for engineering models, when used for qualification
purpose (EQM), shall be from the same design type (form, fit,
function) and manufacturer as the ones intended to be used on
flight standard models.
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7.3. COMPONENT PROGRAMME MANAGEMENT
7.3.1.
General
ECE appoints a parts engineer for the program who is in charge of the overall activities, at
ECE level, concerning the selection, procurement, use and control of EEE parts.
PA-005-731a
The Subcontractor shall establish and implement throughout the
duration of the business agreement a component programme which
ensures that the requirements of the project as defined by ECE and
the Subcontractor in the related business agreement are in
compliance with this standard.
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PA-005-731b
SEOSAT EEE Parts Procurement Policy is based on Self
Procurement philosophy with the coordination and approval of the
ECE EEE Parts Procurement Engineer.
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7.3.2.
Components Control Programme
7.3.2.1
Organisation
PA-005-7321a
The Subcontractor shall identify the organization responsible for the
management of the component programme, and describe the
organization’s approaches (including the procurement system and
its rationale) and capability to efficiently implement, manage, and
control the component requirements.
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PA-005-7321b
The Subcontractor shall ensure that all component requirements
are flowed down to all lower tier subcontractors levels and ensure
that all lower tier subcontractors are compliant to these component
requirements.
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7.3.2.2
PA-005-7322a
Component control Plan
The Subcontractor shall prepare a compliance matrix to this
document to describe and justify his control procedures for
component.
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7.3.3.
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The Subcontractor shall submit his compliance matrix to ECE for
approval.
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Parts Control Board (PCB)
PA-005-733a
The approval of the selection and usage of EEE parts shall be
implemented through Parts Control Boards (PCBs) held between
ECE and the Subcontractor (or lower tier supplier).
ESA representative will attend the PCB, and he will also
participate in the approval of EEE parts to be used
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PA-005-733b
At ECE level, the PCB is chaired by the ECE parts engineer and
board members should consist of designer, EEE parts engineer,
PA manager, system representative, any other relevant experts
(radiations, assembly, RAMS…) from ECE and the Subcontractor.
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PA-005-733c
At Subcontractor's level, the PCB is chaired by the
Subcontractor's parts engineer. The composition of the PCB shall
as a minimum include the Subcontractor’ parts engineer, the prime
contractor’s representative and the lower tier subcontractor parts
engineers.
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PA-005-733d
Others pertinent experts from ECE or Subcontractor may also
participate, on request
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PA-005-733e
7.3.4.
PA-005-734a
Depending on the progress of the programme, the main
PCB activities shall be :
¾ Review and approval of the Subcontractor's EEE parts
management plan and any associated document,
¾ Parts approval including evaluation activities (via
Subcontractor DCL or PAD review),
¾ Problem assessment (e.g. non-conformances, RFD,
RFW, and alerts),
¾ Procurement status (including schedule, dispatching,
delivery schedule),
¾ Assessment activities (by sampling) : procurement
conditions & control operations vs PAD, “as built” vs
“as designed”
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Declared Component List (DCL)
The Subcontractor shall issue a DCL for each equipment in an
editable electronic format, identifying all component types needed.
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The content of this DCL is described in Annex 2.
PA-005-734b
This list shall be kept under configuration control (issue and
identification of changes).
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PA-005-734c
The DCL shall be issued as a minimum at PDR and CDR (as
designed) and at flight hardware delivery (as built).
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PA-005-734d
After equipment CDR, all modifications affecting the PAD
information shall be implemented, in the "as designed" DCL,
through the CN / CR process, submitted to ECE & ESA for
approval.
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NOTE: For PAD generation, see section 7.4.4
PA-005-734e
The “as designed” DCL shall be sent to ECE & ESA for approval.
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PA-005-734f
Any change of parts during equipment manufacturing (e.g. type and
manufacturer) shall be handled through RFWs submitted to ECE &
ESA for approval
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PA-005-734g
The “as built” DCL reflecting the actual EEE parts assembled into
the flight hardware and their date code, shall be provided to ECE &
ESA for review at the DRB of the flight hardware.
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PA-005-734h
The following information shall be included as a minimum in the
DCL by the Subcontractor:
• A description of the purpose, objective, content and the reason
prompting its preparation
• A list the applicable and reference documents to support the
generation of the document
• Any additional terms, definition or abbreviated terms used
• Component number (commercial equivalent designation)
• Family (ESCC group code)
• Package
• Value or range of values with tolerance for non qualified parts
• Component manufacturer (name, country)
• Generic procurement specification
• Detail procurement specification (with issue & revision for non
qualified parts)
• Specification amendment (including issue and revision)
•Name of the procurement agent (CPPA, Subcontractor, distributor)
• Quality level and lot test (ESCC LAT/LVT, MIL TCI/QCI/CI)
• Space qualified status (yes or no)
• RVT (yes or no)
• Reference of the PAD or Justification Document
• Approval status of the part
• Change identification between each DCL issue
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• Date-code (only for “as built” DCL)
PA-005-734i
7.3.5.
For space qualified parts, the DCL shall identify the approval status
and list the remark “QPL”, together with the following procurement
details:
¾ procurement inspections by customer (pre cap inspection, etc)
if any
¾ Single Event Effects Linear Energy Transfer (SEE LET)
threshold and/or total dose sensitivity level (when applicable)
¾ Date Code. In case of procurement from stock, date of re-life
activities if applicable.
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Electrical and mechanical GSE
PA-005-735a
EEE components used in GSE, which are physically and directly
interfacing to flight hardware, shall meet the requirements of this
document.
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PA-005-735b
Flight hardware interfaces to GSE shall be protected by connector
savers.
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7.4. COMPONENT SELECTION, EVALUATION AND APPROVAL
7.4.1.
PA-005-741a
General
The Subcontractor shall ensure that the following requirements are
met during his selection process :
¾ Project requirements (e.g. quality levels, component policy,
manufacturing and delivery schedules and budgets, quantities)
¾ Design requirements (e.g. component type, case, dimensions,
materials)
¾ Production requirements (e.g. packaging, thermal and storage
constraints, component mounting process)
¾ Operational requirements (e.g. electrical, mechanical, radiation,
reliability, assembly, and lifetime)
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NOTE : The Subcontractor of each product is responsible for the selection of components that
do enable the performance, lifetime, environmental, material, safety, quality and reliability
requirements of the product of which it forms a part, to be satisfied in all respects.
PA-005-741b
The selection of commercial parts is allowed for performance criteria
or severe cost impact, when no equivalent part, in term of
performance or cost, can be found in the quality level defined in
annex 1.
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The documentation to be used as a guideline for selection,
procurement, use and control of commercial EEE (Electrical,
Electronic and Electromechanical) parts is listed in document
ADS.E.0705. [SD24].
7.4.2.
Manufacturer and component selection
7.4.2.1
General rules
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PA-005-7421a
The Subcontractor shall establish and maintain in his own facility,
and ensure that his suppliers also establish and maintain,
procedures for selecting and controlling all components intended for
use in deliverable products.
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PA-005-7421b
Components shall be selected on the basis of proven qualification,
characterization, and previous space experience and data, relevant
with regard to the requirements for the programme, from
manufacturers or sources (preferably European) employing
effective Product Assurance Programmes in manufacturing and
test.
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PA-005-7421c
Preference shall be given to components which necessitate the least
evaluation or qualification effort.
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PA-005-7421d
When selecting items, the subcontractor shall check the current
data, applicability of the basis of qualification, problem notifications
and alerts, and adequacy of specifications.
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7.4.2.2
EEE Parts & Material Restriction
PA-005-7422a
The Subcontractor shall ensure that non-hermetically sealed
materials of components meet the requirements of ECSS-Q-70
regarding off-gassing, out-gassing, flammability, toxicity and/or
other criteria specified for the intended use.
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PA-005-7422b
The Subcontractor shall evaluate the robustness of selected EEE
components to the stresses induced by his assembly techniques.
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PA-005-7422c
With respect to health and safety, beryllium oxide (except if
identified in the specification), cadmium, lithium, magnesium,
mercury, radioactive material and all material which may cause a
safety hazard shall not be used.
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PA-005-7422d
For limited life, known instability, safety hazard or reliability risk
reasons, the use of EEE parts listed below shall not be used :
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¾
¾
¾
¾
¾
¾
¾
¾
¾
¾
¾
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Pure tin (less than 3% Pb in case of SnPb alloy) used as a
finish on the leads, terminations and external surfaces of
components and packages
Hollow core resistors,
Potentiometers (except for mechanism position monitoring),
Non-metallurgically bonded diodes,
Semiconductor dice non passivated on active area,
Wet slug tantalum capacitors other than construction using
double seals and a tantalum case,
Any component whose internal construction uses metallurgic
bonding with a melting temperature not compatible with the
end-application mounting conditions.
Wire-link fuses < 5A (for new design),
TO5 relays without double welding or with integrated diodes
RNC90 > 100 Kohms,
TO3 & DO4/DO5 or similar packages (shall not be used for
new designs).
PA-005-7422e
The use of pure tin in internal cavities may be authorized, on a
case-by-case basis, based on the demonstration there is no
alternative product and there is no risk (supported by technical
note).
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PA-005-7422f
As per 7422e, the justification of the use of pure tin shall be
presented during PCB to ECE & ESA for approval.
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PA-005-7422g
The use of pure tin (inside or outside the part) shall be declared in
the PAD.
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PA-005-7422h
A justification for the use of non-European components shall be
submitted for approval.
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PA-005-7422i
Components shall be selected such that they are not affected by
trading barriers (e.g. ITAR regulations). Where this requirement
cannot be met, the justification for use of such components shall be
supplemented with a risk assessment detailing potential impacts for
the project and identifying back-up solutions.
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7.4.2.3
Radiation hardness
The requirements for the radiation hardness assurance programme, to be applied to cover
part radiation issues, are described in the "Generic Radiation Hardness Assurance
Requirements for EEE and Opto-electronics" DIV.SP.00034.T.ASTR. [SD14]
These requirements are established for all kinds of radiation including cosmic (heavy ions),
trapped (charged particles – electrons, protons – in radiation belts) and solar flares (heavy
ions, protons).
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PA-005-7423a
The Subcontractor shall implement a Radiation Hardness
Assurance programme at his level consisting of assessing the
actual radiation tolerance of the selected components for
compliance with the radiation requirements in terms of total dose,
displacement damages and single events effects.
This programme shall be documented by a Radiation Hardness
Assurance plan or by a compliance matrix covering the collection of
all relevant information and specifying the necessary actions in
terms of preventive / corrective solutions (e.g. Local shielding,
design solution, derating…), evaluation and procurement (e.g.
RVT), planning and control.
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PA-005-7423b
The Radiation Hardness Assurance plan or a compliance matrix
shall be submitted to ECE for approval.
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PA-005-7423c
The Subcontractor shall issue an Equipment Radiation Analysis
document identifying all sensitive components with respect to the
relevant radiation effects, their impact and giving an adequate
design solution (local shielding, design solution, specific test, RVT,
…) for the relevant product.
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PA-005-7423d
The Equipment Radiation Analysis shall be submitted to ECE and
ESA for approval.
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PA-005-7423e
Regarding SEE, technologies shall be selected, wherever possible,
which are inherently insensitive to single event effects and latch-up.
¾ For Single Event latch-up (SEL) and Single Event Upset
(SEU) sensitivity, components with an assured LETth> 60
MeV/mg cm ² shall be considered as SEL and SEU
insensitive.
¾ Components exhibiting a sensitivity between 15 MeV/mg cm²
< LETth < 60 MeV/mg cm² shall be subject to the appropriate
Heavy Ion SEE rate prediction.
¾ Components with a sensitivity of LETth < 15 MeV/mg cm²
shall be subject to the appropriate Heavy Ion and Proton SEE
rate prediction.
¾ Parts showing an LETth < 3.7 MeV/mg cm² for SEL shall not
be used.
¾ Depending on the rate prediction results, for sensitive
components, SEE countermeasures shall be implemented as
required on the application level.
¾ In the case that SEE testing is required for any component,
this should be described in the Radiation Test Plan.
¾ Proton test results are not considered conclusive for SEL
sensitivity demonstration and must be supported by Heavy Ion
test results.
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For MOSFET devices, the requirements concerning SEB and
SEGR are contained in the derating requirements.
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Optocouplers and other optical semiconductors shall be selected
on the basis of their hardness against proton radiation, and
displacement damage.
Unless otherwise demonstrated, it shall be assumed that protons
and heavy ions can generate transient spikes at the output of linear
components and optocouplers that could cause the connecting
circuits to respond in an unwanted way (e.g. when the IC output is
connected to a “latchable” circuit). It shall be demonstrated that the
circuits designs are able to discriminate between a desired
condition (for which it has been designed) and the induced transient
conditions against which it should be resistant.
PA-005-7423g
The classification of parts as sensitive or insensitive shall be
justified by means of submission of a Radiation Analysis report,
which shall contain details of the predicted radiation environment
and the radiation sensitivity data (including reference to source)
for each component.
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NOTE : More detailed information about the above requirements is given in ECSS-E-10-12.
NOTE : The verification of the radiation test results in the frame of the Equipment Radiation
Control Board (ERCB) process, as described in [SD 14, section 7.2.2 ], is not required.
7.4.2.4
Derating
The EEE parts derating requirements are defined in chapter 5 (Reliability /
Dependability).
7.4.3.
Component Evaluation
7.4.3.1
General
T,R
PA-005-7431a
The Subcontractor shall perform a component evaluation in
absence of an approved demonstration that a component has the
ability to conform to the requirements for functional performance,
quality, dependability, and environmental resistance as required for
the project.
PA-005-7431b
The Subcontractor shall plan and carry out the evaluation
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PA-005-7431c
The planning of evaluation actions shall be derived from the results
of an assessment of the design and application of the needed
component.
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PA-005-7431d
They shall be described in an evaluation plan, sent to ECE and
ESA for approval, and include the following elements:
¾ Constructional Analysis
¾ Evaluation Testing
¾ Radiation Hardness
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PA-005-7431e
In the definition of the evaluation programme any information
including pertinent reliability, analysis and test data from the
manufacturer of the component and previous use in comparable
application shall be considered.
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PA-005-7431f
Omission of any of these elements, or alternative activities, shall be
justified.
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PA-005-7431g
All tests and inspections shall be carried out on representative
samples of the component type from the current production of the
same manufacturer as intended to be used for the flight hardware
(including programming tools and software for programmable
devices).
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PA-005-7431h
The supplier shall summarize the result of all evaluation actions in
the evaluation report, sent to ECE & ESA for approval
A,R
PA-005-7431i
It shall be reviewed to determine if they will have an impact on the
content of the procurement specification.
A,R
NOTE : For guidance for the assessment of the environmental aspects refer to ECSSE-10-12 and ECSS-E-10-04.
7.4.3.2
Constructional analysis
PA-005-7432a
Constructional analysis shall be carried out on representative
R
components.
NOTE : The primary aim of constructional analysis is to provide an early indication of
a component’s probability of meeting the evaluation requirements and the operational
goals of the concerned programme.
PA-005-7432b
The Constructional Analysis shall comprise destructive and nondestructive inspections, analyses, and testing, to identify :
¾ Design and construction technology,
¾ Materials used,
¾ Inherent reliability aspects,
¾ Quality of workmanship,
¾ Potential hazards.
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PA-005-7432c
7.4.3.3
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The findings of the analysis shall be contained within a
Constructional Analysis Report and shall be included in the
Evaluation Report.
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Evaluation testing
PA-005-7433a
The evaluation shall determine which inspections or tests are
required to provide the confidence that the component type under
evaluation, when assembled and tested in accordance with the
procurement specification, successfully meets the mission
requirements.
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PA-005-7433b
The Subcontractor shall review the already existing data in order to
adapt the content of the evaluation testing which can include:
¾ Endurance test (operating at elevated temperature and
electrical stress),
¾ Mechanical stress
(shock, vibration, constant
acceleration),
¾ Environmental stress (thermal shock, temperature
cycling, high and low temperature storage, humidity),
¾ Assembly capability testing,
¾ Radiation testing, for total dose, displacement damage
and single event effects sensitivity
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NOTE : For guidance refer to ESCC basic specification no. 22600 and the ancillary
specifications for dedicated component families.
7.4.4.
Parts Approval
PA-005-744a
The Subcontractor shall document the procedure for approval of
each component type intended for use in flight products.
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PA-005-744b
The approval of components shall be based on consideration of all
pertinent data including both electrical and environmental
performances as well as the quality and the dependability
assurance requirements.
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PA-005-744c
The Subcontractor shall maintain a system of traceability of the
acceptance and approval of each component used in flight
products.
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PA-005-744d
A PAD is also required for the following specific components:
¾ Hybrids
¾ ASICs
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One time programmable devices
MMICs
Parts subject to export restrictions or regulations (e.g. ITAR)
¾
¾
¾
PA-005-744e
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The approval process by ECE and ESA shall be organized as
follows:
¾ All parts belonging to EPPL, NPSL or qualified according to
quality levels defined in Annex 1 are approved by listing them
in the DCL
¾ A PAD as specified in Annex 3 is required for any other part
(including CECC parts)
¾ A PAD as specified in Annex 3 is also required for EPPL,
NPSL or qualified parts when:
-
R
additional controls are required (e.g. precap, buy-off,
LAT/LVT, RVT, DPA)
-
used outside the specified limits
-
specific tests are required during procurement as per
Annex 1
¾
PA-005-744f
A Justification document is required for any commercial part,
instead of PAD
When a PAD or a Justification Document is required, the approval
process by ECE shall include 2 steps:
¾ step 1: approval of the part type and attached action plan,
through PAD or Justification Document for the PDR
¾ step 2: approval of the results of the action plan defined
during step 1 through PAD or Justification Document
R
7.5. PARTS PROCUREMENT
7.5.1.
General
PA-005-751a
The Subcontractor shall ensure that all procured components meet
the programme requirements with respect to inspection, screening
and tests.
T,R
PA-005-751b
Class 2 components shall meet the quality
supplementary conditions specified in Annex 1.
and
T,R
PA-005-751c
The Subcontractor shall be responsible for manufacturer
surveillance and control throughout the procurement programme.
T,R
PA-005-751d
For non qualified parts, procurer shall put in place a configuration
control system to ensure that any change of the product (i.e. mask,
manufacturing or assembly process) affecting evaluation,
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performance, quality, reliability and interchangeability
communicated to him by the manufacturer (e.g. PCN).
is
PA-005-751e
The Subcontractor shall ensure the compatibility of the change with
its application.
R
PA-005-751f
The change shall be submitted to ECE and to ESA for approval.
R
PA-005-751g
To reduce the risk of procuring counterfeit components, when parts
are not directly procured from the manufacturer, the Subcontractor
shall procure parts only from distributors duly franchised by the
parts manufacturer
R
PA-005-751h
The documentation to be used as a guideline for selection,
procurement, use and control of commercial EEE (Electrical,
Electronic and Electromechanical) parts is listed in document
ADS.E.0705. [SD24].
R
7.5.2.
Procurement Specification
PA-005-752a
The Subcontractor shall procure EEE components according to
controlled specifications.
R
PA-005-752b
International specifications systems, new specifications or
manufacturer’s datasheets under configuration shall be used by
the Subcontractor.
R
PA-005-752c
Any new specification shall be prepared and designed by the
Subcontractor as per existing international specification systems
(ESCC, MIL). Preference shall be given to ESCC format when
agreed by the manufacturer.
R
PA-005-752d
Any new specification shall include the following items:
¾ Absolute maximum ratings
¾ Electrical and mechanical parameters and limits
¾ Screening, burn–in, and acceptance requirements
¾ Package material and lead finish
¾ Documentation/data requirements
¾ Delta limits when applicable
¾ Criteria for percent defective allowable
¾ Lot Validation Testing / Quality Conformance Inspections
¾ Marking
¾ Storage requirements
¾ Requirements for lot homogeneity
¾ Serialization (when applicable)
¾ Protective packaging and handling requirements
¾ Radiation Verification Testing requirements, when applicable
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PA-005-752e
The use of any new specification or datasheet shall be submitted to
ECE and ESA for approval through the PAD process
R
PA-005-752f
Upon request, any new procurement specification prepared in the
frame of the project, shall be delivered to ECE.
R
PA-005-752g
The Subcontractor shall keep each procurement specification or
manufacturer’s datasheet under configuration control.
R
7.5.3.
Screening requirements
PA-005-753a
All components to be incorporated in flight hardware shall be
submitted to screening tests.
T,R
PA-005-753b
The screening test requirements shall be so designed that
accumulated stress will not jeopardize the part reliability.
T,I,R
PA-005-753c
All screening tests shall be performed at the component
manufacturer's premises or at a source approved for the
performance of screening.
R
PA-005-753d
The EEE parts shall be procured or up screened to the quality
standard and screening requirements of ESCC or MIL system, as
described in annex 1.
In general, for SEOSAT project the Class 2 components
requirements as defined in ECSS-Q-60B is applicable with the
following exceptions, where Class 1 Components requirements is
applicable:
1) Hybrid circuits (self made or procured)
2) ASICs., Oscillators, Relay, Fuses
3) When the UNIT/SUBSYSTEM reliability requirements
cannot be met.
4) When the UNIT/SUBSYSTEM radiation requirements
cannot be met.
5) For any single point failure with severity category
catastrophic, critical and major.
6) When EEE components are used to support safety-critical
functions.
Compliance to the points 3,4,5 & 6 will be verified as part of
normal work on a case by case basis.
R
PA-005-753e
The components used for Engineering models shall meet the
same functional requirements as the ones for flight hardware,
although they do not have to meet the same quality requirements.
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Initial Customer Source Inspection (precap)
PA-005-754a
The procurement entity shall carry out, at manufacturer’s
premises, a customer precap inspection for the non space
qualified ASICs and the following parts types : relays, crystals,
oscillators and hybrids.
R
PA-005-754b
When not covered by MIL or ESCC specifications, methods and
accept/reject criteria for customer’s precap inspection shall be
documented by a procedure to be presented to ECE, on request,
for review.
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7.5.5.
Lot Acceptance
PA-005-755a
The Subcontractor shall ensure that any lot or datecode of EEE
parts is submitted to a lot acceptance procedure (in line with
applied normative systems) according to the following rules :
Space qualified parts
- ESCC: user’s lot acceptance on the procured lot is not required
due to periodic lot validation testing performed by the
manufacturer.
- MIL: QCI or TCI performed by the manufacturer is in accordance
with the quality level of the MIL specification.
Non-space qualified parts
The content of the lot acceptance is defined according to the
available data. The proposed lot acceptance is approved through
the approval process (see subclause 7.4.2.2).
Commercial parts
The content of the lot acceptance is defined according to
information provided by the Justification Document.
The proposed lot acceptance is approved through the approval
process (see subclause 7.4.2.2).
R
PA-005-755b
The sample size for lot acceptance which may be reduced in
some cases, shall be submitted to ECE for approval through a
PAD (see section 7.4.2.2).
R
7.5.6.
PA-005-756a
Final Customer Source Inspection (buy off)
The procurement entity shall carry out, at manufacturer’s premises,
a final customer source inspection for non-space qualified parts and
for critical space qualified parts (including as a minimum relays and
oscillators), based on inspections, tests and review activities to
verify that the requirements of the purchase order are met prior to
I,R
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shipment of the flight parts.
PA-005-756b
The buy-off shall include:
¾ External visual inspection
¾ Witnessing electrical measurements
¾ Verifying mechanical dimensions
¾ Review and verification of the data-package
I,R
PA-005-756c
The buy-off may be replaced by an incoming inspection at
procurement entity's facilities.
I,R
PA-005-756d
If the buy-off is replaced by an incoming inspection at procurement
entity's facilities, it shall be reported in the PAD which is submitted
to the ECE for approval.
I,R
7.5.7.
Incoming Inspections
PA-005-757a
The procurement entity shall perform incoming inspection at his
premises on all components to verify conformance with the
purchase order requirements.
I,R
PA-005-757b
The incoming inspection shall include the following items:
¾ Marking control
¾ Quantity verification
¾ Packing checking
¾ Review of the manufacturer delivered documentation
¾ Additional tests when the buy-off has not been performed
(external visual by AQL 0,65% or sampling [20 parts min]
and electrical measurements at room temperature on 20
parts)
¾ Additional tests based on the type of component, criticality
and heritage with the manufacturer (e.g. solderability tests,
electrical tests)
I,R
PA-005-757c
The incoming inspection shall be documented by a procedure to
be sent, on request, to ECE for review.
R
PA-005-757d
If the parts have passed successfully a final CSI (or buy-off), the
incoming inspection may be reduced to:
¾ Packing checking
¾ Quantity verification
I,R
PA-005-757e
In case the incoming inspection has been performed by a
procurement agent, the incoming inspection performed by the
end-user, may be limited to the following items:
¾ Packing checking
I,R
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¾
7.5.8.
PA-005-758a
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Quantity verification
Radiation Verification Testing (RVT)
When the component radiation sensitivity, as calculated either
from radiation characterization test or from existing radiation
effects data, is suspected to be inadequate with respect to the
component anticipated dose, 11 samples (10 irradiated parts + 1
witness part) from the lot Date Code or wafer lot under
procurement shall be submitted to RVT .
For a RVT done on a lot different of the FM lot, to demonstrate
the insensitivity of the part, the RVT shall be done to a level of a
factor 2 higher than the expected dose in the application. The
effects of ELDRS (Enhanced Low Dose Rate Sensitivity) shall be
taken into account.
For a RVT done on the project FM lot (or wafer lot), when
previous radiation data show that the component can not
withstand 2 times the radiation dose in the application, the margin
could be relaxed up to 1.2 upon ECE approval.
RVT testing shall be defined in a Radiation Test Plan to be
submitted to ECE for approval.
In a such case, the procurer shall issue a PAD submitted to ECE
and ESA for approval.
Due to the potentially large lot to lot variation of parts affected by
ELDRS, all bipolar based device lots shall be irradiation tested at
the proposed low dose rate window.
For TIDS estimates on a specific part type, used TID test report
shall comply with the following rules :
- Test
performed
in
accordance
with
European
ESA/SCC22900 [RD06] or US MIL-STD883D 1019.7 [RD05]
total dose test procedures, with dose rate included in
ESA/SCC22900 low dose rate window for devices using
bipolar or BiCMOS technology (36 to 360 rad(Si)/h)
and,
For Bipolar Based ICs
- Provided the tested parts are from the same wafer fabrication
plant and manufactured with technology identical
(subcontractor to provide ECE project team with evidence
that technology is identical for approval) to the technology to
be used for FM parts, parts tested date code:
i/ not more than 4 years older than the FM parts Date
Code (DC),
or,
ii/ tested parts from the same diffusion lot as the FM
parts, whatever date code
T,R
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and,
- Test biasing conditions worst or equivalent to the application.
And,
- No rebound effect observed during testing
PA-005-758b
The RVT shall be done i.a.w. ESA/SCC22900 or US MIL-STD
883D 1019.6, as defined in DIV.SP.00034.T.ASTR
R
PA-005-758c
On a case-by-case basis, for mature technology (as defined in
DIV.SP.00034.T.ASTR) having demonstrated no major hardness
variability in total dose response, the sample size may be limited
to 6 samples (5 irradiated parts + 1 witness part) and that shall be
submitted to ECE and ESA for approval, through RFD.
R
PA-005-758d
The results of the RVT shall be documented by a report and shall
be provided to ECE for review, on request.
R
7.5.9.
Destructive Physical Analysis (DPA)
DPA comprises a series of inspections, tests and analyses performed on a sample of
components to verify that the material, design and workmanship used for its
construction, as well as the construction itself, meet the requirements of the relevant
specification and are suitable for the intended application.
PA-005-759a
The DPA shall be performed on 3 samples per lot for the following
non-space qualified parts types: as a minimum relays, oscillators,
crystals, ASIC, hybrids and commercial parts and for the space
qualified relays and oscillators.
DPA shall be performed according to MIL-STD 883 method 5009
and MIL-STD-1080
I,R
PA-005-759b
DPA may be carried out on representative samples of the
components families.
R
PA-005-759c
The DPA sample size may be reduced in some cases which shall
be submitted to ECE for approval through the PAD (or Justification
Document) process.
R
PA-005-759d
The DPA process shall be documented by a procedure to be sent,
on request, to ECE for review.
R
PA-005-759e
The Subcontractor shall ensure that the outcome of the DPA is
satisfactory prior to the installation of the components into flight
hardware.
R
PA-005-759f
Independent laboratories may perform DPA when approved by
R
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ECE
PA-005-759g
DPA may be performed by the manufacturer if witnessed by the
Subcontractor (or approved representative).
R
PA-005-759h
For health and safety hazard reasons, any test producing beryllium
oxide dust may be omitted.
R
PA-005-759i
The results of DPA shall be documented by a report sent to ECE,
on request, for information.
T,R
7.5.10. Relifing
PA-005-7510a
Components from a Subcontractor’s or parts procurement agent’s
stock may be used provided the following criteria are met:
¾ The parts are stored according to minimum conditions
given in § 7.6,
¾ The minimum overall requirements (including screening)
are in accordance with the present document,
¾ The lot homogeneity and traceability can be
demonstrated,
¾ The EEE parts documentation, is available and the
content is acceptable, in accordance with the project
requirements (including radiation data, if necessary),
¾ There are no open NCR’s and no unresolved alerts with
respect to their date code
R
PA-005-7510b
For components meeting the above criteria and which have a lot /
Date Code exceeding 7 years (calculated from the manufacturing
Date Code to the date of intended installation in flight hardware) a
relifing shall be performed by the Subcontractor according to
ADS-E-0782 [SD20] or an equivalent procedure which details the
maximum storage period, the testing and control sequence
applied, as well as the acceptance and rejection criteria.
R
PA-005-7510c
This procedure shall be submitted to ECE for approval.
R
PA-005-7510d
Parts older than 10 years shall not be installed on boards.
R
7.5.11. Manufacturer's Documentation Deliveries
PA-005-7511a
The manufacturer’s CoC shall be delivered to the parts procurer.
R
PA-005-7511b
Any other data (i.e. LAT/Lot Validation Testing, QCI/TCI), defined in
the applicable procurement documents, shall be available at the
manufacturer’s facilities (and delivered to parts procurer on
R
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request) or delivered to the parts procurer in line with the purchase
order.
PA-005-7511c
For non qualified parts, the documentation minimum storage
period shall be 10 years after delivery of components by the
manufacturer.
R
NOTE : For qualified parts, the documentation storage period is under the responsibility of
the manufacturer and the qualifying authority.
7.6. COMPONENT HANDLING AND STORAGE
PA-005-76a
The Subcontractor shall establish and implement procedures for
handling and storage of components in order to prevent possible
degradation, as applicable for any facility dealing with components
for flight application.
R
PA-005-76b
On request, these procedures shall be sent to ECE for review.
R
PA-005-76c
As a minimum the following areas shall be covered:
¾ Control of the environment in accordance with ESCC
Basic Specification No. 24900
¾ Measures and facilities to segregate and protect
components during receiving inspection, storage, and
delivery to manufacturing.
¾ Control measures to ensure that electrostatic discharge
susceptible components are identified and handled only
by trained personnel using anti static packaging and
tools., tools and other means, including procedures.
R
7.7. EEE PART QUALITY ASSURANCE
7.7.1.
PA-005-771a
7.7.2.
Non-Conformances or failures
The Subcontractor shall apply the requirements defined in
paragraph 4.2.6 of this document.
R
Alert and Problem Notification
PA-005-772a
The Subcontractor shall take into account all received alerts from
international alert systems and from ECE and shall validate that
there are no alert on the proposed parts with respect to the batch
information (including date-code).
R
PA-005-772b
If alerts become available at a later stage, the Subcontractor shall
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analyse the alerts, analyse the project risk and propose an action
plan for approval by ECE.
PA-005-772c
7.7.3.
The Subcontractor PA manager & EEE Programme responsible
shall have direct access to the Alert System of ESA:
http://alerts.esa.int)
R
Traceability
PA-005-773a
The traceability of individual components during manufacturing
and testing shall be maintained as required by the procurement
specifications.
R
PA-005-773b
The traceability shall be maintained through incoming, storage,
and installation at the procurer and Subcontractor of the
component in accordance with programme PA requirements.
R
PA-005-773c
In any case, the traceability requirements imposed by the
Subcontractor on the EEE parts manufacturer or distributor shall
allow managing the adequacy of the tests performed by the
Subcontractor (i.e. evaluation, lot validation, any additional test or
inspection).
R
PA-005-773d
The traceability of EEE parts during installation in equipment, shall
be ensured by the Subcontractor to allow the traceability of the
manufacturer lot/date code number of the EEE parts actually
mounted.
R
PA-005-773e
If as built DCL has not yet been delivered, the Subcontractor shall
be able to provide these information (part type actually installed
with its relevant lot/date code number) within one week.
R
7.7.4.
PA-005-774a
Lot homogeneity for sampling test
For radiation tests, the sampling shall take into account the wafer
lot distribution.
7.8. SPECIFIC COMPONENTS
7.8.1.
General
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PA-005-781a
7.8.2.
PA-005-782a
7.8.3.
PA-005-783a
7.8.4.
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For the specific component types identified below, reference shall
be made to applicable standards, in addition to the requirements of
this standard.
R
Application Specific Integrated Circuits (ASIC)
The specific requirements detailed in ECSS–Q–60–02 shall apply
for the design development..
R
Hybrids
The hybrids shall be procured or up screened to the quality
standard and screening requirements of ESCC-Q-60-05 level 1 or
MIL PRF38534 Class K, as described in annex 1. Therefore, US
hybrids in QPL Class K will be accepted without any additional
tests.
The specific requirements detailed in ECSS-Q-60-05 shall apply
R
One time programmable devices
PA-005-784a
The specific requirements for FPGA, detailed in ECSS–Q–60–02,
shall apply for the design development.
R
PA-005-784b
The PAD shall allow traceability to the information related to the
procurement of blank parts, the programming and the acceptance
of the programmed parts.
R
NOTE : The programming and the acceptance of the programmed parts may be part of PCB
if not indicated in the PAD.
PA-005-784c
One time programmable components shall be submitted to a postprogramming sequence.
R
PA-005-784d
A dynamic post-programming burn-in shall be applied to FPGAs,
according to test method 1015 of the MIL-STD-883.
R
PA-005-784e
The Subcontractor shall prepare a post-programming procedure
for ECE approval, depending on part types (including when
necessary electrical tests, programming conditions and
equipment, burn-in conditions, additional screening tests and
specific marking after programming).
R
PA-005-784f
The lot acceptance procedure, as defined in clause 7.5.5, shall
be performed on devices coming from the flight lot and
R
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programmed on the same kind of hardware tools and compatible
software.
In case of several designs based on the same lot of blank parts,
the lot acceptance procedure, as defined in clause 7.5.5, may be
limited to one representative flight programmed design.
7.8.5.
PA-005-785a
7.8.6.
PA-005-786a
Monolithic Microwave Integrated Circuits (MMIC)
The specific requirements detailed in ECSS–Q–60–12 shall apply.
R
Electromagnetic Components
The "in house" electromagnetic parts shall be designed and
screened using MIL-STD-981 as a guide line.
Minimum screening on a 100% sampling basis shall be :
- visual inspection
- electrical measurements before test
- thermal cycling
- high temperature storage (minimum 96h) (optional)
- final electrical measurements.
R
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8.
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MATERIALS, MECHANICAL PARTS AND PROCESSES
8.1. ORGANISATION AND MANAGEMENT
PA-005-81a
The materials, mechanical parts and processes organisation and
management programme shall be defined in the Subcontractor PA
& Safety Plan, according to the principles of ECSS-Q-70.
R
PA-005-81b
It shall be the responsibility of each Subcontractor and their lower
tier contractors to ensure that materials, mechanical parts and
processes used in all their products and during the assembly,
integration and testing (AIT) of flight hardware, comply with all
contractual, design, quality and performance requirements and
that the materials will not be degraded as a result of
manufacturing, assembly, test, transportation and operating
conditions to which they will be subjected.
R
PA-005-81c
The materials, mechanical parts and processes shall satisfy
ground and flight environmental constraints concerning:
- Resistance to mechanical environment (shocks and
vibrations during tests, transportation and launch…)
- Resistance to vacuum
- Resistance to radiation and atomic oxygen (for low earth
orbit)
- Compatibility to thermal cycling as per ECSS-Q-70-04
R
8.2. CRITICALITY ANALYSIS
The Critical Items List detailed in sections 4.1.5 of this document shall include all critical
materials, mechanical parts and processes. The definition of a critical material, mechanical
part or process, taken from PSS-01-700 and ECSS-Q-70 is detailed below:
Materials: a material is to be considered critical if:
-
It is new, has no previous space use or is non-qualified, for the application in question.
Previous use has highlighted technical issues.
It is prohibited but used in space owing to legal deviations.
It is a state changing material (lubricant, pyro device, glues).
Mechanical parts: a mechanical part is considered critical if:
-
It is new, has no previous space use or is non-qualified, for the application in question.
Previous use has highlighted technical issues.
Failure of the mechanical part can adversely affect the performance or destroy a major
part or function of the spacecraft.
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- The quality of the mechanical part cannot be assessed by simple tests.
Processes: a process is considered critical if:
-
It is new, has no previous space use or is non-qualified, for the application in question.
Previous use has highlighted technical issues.
Failure of the process can adversely affect the performance or destroy a major part or
function of the spacecraft.
The Subcontractor has no prior application experience.
The quality of the process cannot be assessed by examining the end product.
It is fully operator dependant.
PA-005-82a
Materials, mechanical parts and processes identified as critical
should be subject to the Request for Approval (RFA) procedure
detailed in ECSS-Q-70. RFAs are submitted to ECE and ESA for
approval.
R
PA-005-82b
The Subcontractor shall perform a risk assessment for each
critical item in order to justify the contents of the RFA.
R
PA-005-82c
All critical materials, mechanical parts and processes shall be
evaluated and validated/ qualified, with the resulting
acceptance/use with deviation identified in the DML, DMPL and
DPL documentation. The validation/qualification reports are to be
approved by ECE and ESA.
R
PA-005-82d
The validation or qualification of all critical materials, mechanical
parts or processes shall be completed and accepted by ECE
before the materials, mechanical parts or processes are used on
either Qualification or Flight Model hardware.
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8.3. TECHNICAL REQUIREMENTS FOR SELECTION OF MATERIALS
PA-005-83a
The selection, evaluation and validation of materials for the
SEOSAT mission shall be conducted in accordance with the
general technical requirements of ECSS-Q-70. The requirements
of this section replace clause 3.1.1 of ECSS-Q-70.
R
PA-005-83b
The data provided in ECSS-Q-70-71 can be used for the selection
of materials with a previous history of space use. Materials
selected for use on the basis of prior space use by the
Subcontractor must have been used in a directly comparable
application with identical environmental and lifetime requirements.
Materials specified for use without previous space use or materials
with previous space use in other applications (critical materials)
shall be validated to demonstrate full compliance with the
requirements of ECSS-Q-70, Section 8.3 of this document and the
requirements of the SEOSAT mission. The validation shall be
documented and referenced in the DML.
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Vacuum
PA-005-831a
The general acceptance criteria for materials used for this mission
shall be as follows:
Recovered Mass Loss < 1.00%
Collected Volatile Condensable Material <0.10%
Where the contamination and cleanliness analysis (see § 4.5.8)
highlights a requirement for more stringent out gassing controls
i.e. materials in the vicinity of optical surfaces, then the maximum
values above will be modified to suit the specific requirements.
This shall be addressed on a case-by-case basis as and when the
contamination and cleanliness analysis indicates a potential
problem.
Material out gassing data can be obtained from ESA RD01
Revision 4 or MSFC-HDBK-527 or MAPTIS or ECSS-Q-70-71.
R
PA-005-831b
Materials which do not meet the above requirements or which are
considered as critical from the contamination analysis as per §
4.5.8, shall be submitted to vacuum bake out. The bake out
parameters shall be agreed with ECE on a case-by-case basis.
These parameters must be identified in the Declared Material List.
An out gassing test must be performed on the materials after
vacuum bake out to demonstrate compliance with the
requirements of section 831a according to ECSS-Q-70-02 or
ASTM-ES-95-90. In all instances, a test reference from an ESA or
NASA approved source must be provided to assure the accuracy
of the data.
It must also be satisfactorily demonstrated that the vacuum bake
out has not adversely affected the performance or function of the
materials or parts.
R
PA-005-831c
Materials, for which no relevant out-gassing data are available, or
that have shown batch variability, shall be subjected to an outgassing test as per ECSS-Q-70-02 or ASTM E595-90. In all
instances, a test reference from an ESA or NASA approved
source must be provided to assure the accuracy of the data and
the same cure/processing conditions must apply to both the
samples.
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8.3.2.
PA-005-832a
Prohibited Materials
The use of pure mercury, cadmium, pure electrodeposited or hot
dipped tin plated surface coatings (with more than 97% pure tin),
zinc and PVC is prohibited. These materials cannot be used under
any circumstances.
D,R
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Restricted Materials
PA-005-833a
The use of beryllium-oxide, low alloy steels, carcinogens, friable
materials, radioactive materials or magnetic materials (for
structural applications) is restricted.
Where the use of any of these materials is unavoidable, the
material use should be evaluated on a case-by-case basis through
the use of the RFA procedure, with the agreement of ECE. The
justification for use should be documented and referenced in the
DML.
D,R
PA-005-833b
Silicone based and aromatic based materials shall be avoided.
Silicone based adhesives may only be used with prior agreement
of ECE and ESA. Demonstration that silicone containment areas
are used to avoid contamination shall be provided by the
Subcontractor.
D,R
PA-005-833c
The Subcontractor shall demonstrate their compliance with WEEE
and RoHS regulations as they become applicable.
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8.3.4.
PA-005-834a
Thermal Cycling
Tests to assess the effect of thermal cycling on the performance of
the materials used shall be conducted in accordance with ECSSQ70-04. The number of cycles and the temperature extremes shall
be selected, with agreement of ECE, to accurately reflect the
predicted mission environment and to cover ground test exposure
prior and up to Launch.
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This is to ensure that the effect of CTE differences over the application temperature
range do not cause degradation of materials or structures i.e. bonded joints during inorbit service.
8.3.5.
PA-005-835a
ATomic OXygen (ATOX)
The effects of atomic oxygen on the outer surfaces of the
spacecraft shall be assessed on the basis of the orbit parameters
and mission duration. It shall be demonstrated, either by test or by
the presentation of previous test reports, that all thermal control
materials subject to an ATOX environment shall conform to End
Of Life EOL (Minimum) thermo-optical requirements. All other
materials exposed to atomic oxygen should be either selected to
be resistant to attack or protected to avoid in-orbit degradation of
the material's performance.
D,R
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The ATOX environment for the SEOSAT orbit is defined in the
General Design Interface Requirements GDIR [AD d].
8.3.6.
PA-005-836a
8.3.7.
PA-005-837a
8.3.8.
Meteoritic/Debris Environment
The influence of a meteoritic/debris environment on the materials
shall be assessed on a case-by-case basis.
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Electrochemical Compatibility
Where the design requires dissimilar metals to be in contact, the
choice of the pair of metallic materials used shall take into account
ECSS-Q-70-71 Table 1 page 26 or MSFC-SPEC-250 data.
D,R
Corrosion
PA-005-838a
Aluminium surfaces shall be treated for corrosion protection with
an approved chemical conversion coating, anodic treatment or
surface primer. Mechanical parts made of stainless steel shall be
passivated. Where non-corrosion resistant steels are specified, an
approved surface coating shall be applied to the material surface.
This requirement shall apply to GSE as well as flight equipment.
For all other materials, their ability to perform satisfactorily with
respect to corrosion resistance in the untreated state over the life
cycle of the mission (manufacture, storage, transportation and
launch) shall be supported by acceptable data i.e. MSFC-HDBK527. Otherwise appropriate surface treatments shall be applied
and qualified for use on the SEOSAT mission.
D,R
PA-005-838b
All surface coatings and treatments applied must be identified in
the DML and are subject to the technical requirements for
selection of materials detailed in this document.
D,R
PA-005-838c
The application processes must also be identified in the DPL and
are subject to the technical requirements for approval and use of
processes detailed in this document.
D,R
8.3.9.
Stress Corrosion
PA-005-839a
Metallic materials used in structural applications shall have a high
resistance to Stress Corrosion Cracking (SCC) and shall be
chosen from Table 1 of ECSS-Q-70-36.
D,R
PA-005-839b
Metallic materials and welds that are not listed in ECSS-Q-70-36
or whose SCC resistance is unknown shall be tested and
categorized according to the requirements of ECSS-Q-70-37.
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PA-005-839c
SCC evaluation shall be initiated through the submission of an
SCC evaluation form, as detailed in Annex A of ECSS-Q-70-36.
This requirement shall apply to GSE as well as flight components.
D,R
PA-005-839d
Where a metal listed in either Table 2 or 3 of ECSS-Q-70-36 is
specified for use, it must be subject to the SCC Evaluation form
procedure prior to incorporation into qualification or flight model
hardware.
D,R
8.3.10. Fluid Compatibility
PA-005-8310a
Materials that will be in contact with an identified fluid shall be
compatible with that fluid. If compatibility data are not available,
then testing shall be performed according NHB 8060-1, test
number 15.
D,R
8.3.11. UV Radiation
PA-005-8311a
Where applicable, materials shall be evaluated for UV/particle
radiation to PSS01-706 according to the fact that external
materials are not shielded and have to withstand high levels of
radiation doses. The specific radiation environment for the
SEOSAT mission is defined in the General Design Interface
Requirements GDIR [AD d].
D,R
8.3.12. Allowable Stress
PA-005-8312a
Allowable stresses for metallic materials shall be derived from D,R
MIL-HDBK-5. Other sources shall be subject to approval.
Composite structure allowable stresses shall conservatively allow
for degradation due to moisture, temperature and process
variables. The material justification shall prove hardware structural
integrity during storage, ground testing and on-orbit life. For nonmetallic materials, the determination of allowable stresses shall be
documented and referenced in the strength summary.
8.3.13. Limited Life Time
PA-005-8313a
Materials with limited lifetime characteristics shall be subject to
lot/batch acceptance tests, and shall have the date of manufacture
and shelf-life expiration date marked on each lot/batch.
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PA-005-8313b
Storage conditions must be controlled to avoid degradation of the
material. Storage conditions and shelf life should be stated in the
procurement specification.
R
PA-005-8313c
Subcontractors shall provide systems that meet the requirements
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of ECSS-Q-70-22 for monitoring and controlling the time which
limited life materials are exposed to normal working conditions i.e.
ambient temperature rather than refrigerator or freezer conditions.
8.3.14. Electrostatic Discharge Protection
PA-005-8314a
Materials used in areas sensitive to electrostatic discharge shall
be selected to ensure that the maximum potential difference
between any two points on the spacecraft is within the limits of the
ESD/EMC specification for the mission.
These are defined by the SEOSAT GDIR Ref [AD d].
D,R
8.3.15. Hydrogen Embrittlement
PA-005-8315a
Metallic materials, in particular high strength steels and
titanium/titanium alloys, which will be exposed to a hydrogen rich
atmosphere during service or subject to processes capable of
introducing hydrogen or hydrogen related features (metal hybrids)
into the metal, shall be evaluated to determine susceptibility to
embrittlement. Where a material is considered susceptible, the
material and/or the processes to which the material is subject shall
be optimized to completely eliminate the risk of embrittlement.
D,R
8.3.16. Procurement of Materials
PA-005-8316a
All materials shall be procured against current and fully configured
procurement specifications, with the technical content and delivery
conditions, including inspection and certification, agreed by both
the supplier and procuring body. The specification shall define the
critical material properties, requirements, test methods and
acceptance criteria (that can be part of a separate Material
Acceptance document), including sampling frequency and test
sample definition to ensure consistent performance in the
material's specific application. This is to ensure that materials and
mechanical parts are traceable to a defined standard and are of a
consistent performance with respect to the critical parameters
required by the intended application. Note that catalogue
numbers, material designations and specifications, which only
define material composition, are not considered procurement
specifications as defined herein.
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PA-005-8316b
If configured drawings are used as a means of material
procurement, then the same details that are to be in the
procurement specification are to be included on the drawing.
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For materials with a limited shelf life, packaging, shipping and
storage conditions shall be specified to ensure the material does
not degrade during shipping or storage. The shelf life, optimum
storage conditions and optimum working conditions should be
defined by the procurement specification.
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8.4. MECHANICAL PARTS
PA-005-84a
The selection, evaluation and qualification of mechanical parts for
the SEOSAT mission shall be conducted in accordance with the
general technical requirements of ECSS-Q-70. This chapter is a
supplement to clause 6 of ECSS-Q-70.
R
PA-005-84b
The Subcontractor shall maximize the use of existing national or
international standards.
R
PA-005-84c
All mechanical parts shall be selected on the basis of previous
space use in an identical application. Where a part does not have
prior space use or was used in an alternative application, the part
shall be deemed critical, as defined in section 8.2 of this
document, and will be subject to the RFA procedure. The part
shall be subject to an evaluation and qualification process and the
approval for use referenced in the DMPL.
R
PA-005-84d
Where a mechanical part is not controlled by a national or
international standard, current and fully configured specifications
applicable to the relevant subcontractor should be used to ensure
full control over the procurement and performance of the
mechanical part. All specifications should be referenced in the
DMPL.
R
PA-005-84e
All materials that comprise a mechanical part must be individually
assessed in accordance with the requirements of this document
and listed on the DML. If required, they are to be evaluated
through the submission of a RFA.
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8.5. PROCESSES
PA-005-85a
The selection, evaluation and validation of processes for the
SEOSAT mission shall be conducted in accordance with the
general technical requirements of ECSS-Q-70. This chapter is a
supplement to clause 7 of ECSS-Q-70.
R
PA-005-85b
The Subcontractor shall maximize the use of existing ESA or
ECSS specifications.
R
PA-005-85c
All processes shall be selected on the basis of previous space
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use. Any critical process, as defined by section 8.2 of this
document, shall be subject to a RFA and evaluated to
demonstrate a capability to meet the mission requirements with an
acceptable margin. The evaluation shall be documented and
referenced in the DPL.
PA-005-85d
Where a process is not controlled by an ECSS specification,
current and fully configured specifications applicable to the
relevant subcontractor shall be used to ensure process control. All
specifications should be referenced in the DPL.
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In particular, the following specifications shall be used for the appropriate processes:
Process
Specification
Number
Activity
ECSS-Q-70-07
Verification and approval of automatic machine wave soldering
ECSS-Q-70-08
The Manual Soldering of High-Reliability Electrical Connections
ECSS-Q-70-10
Qualification of Printed Circuit Boards
ECSS-Q-70-11
Procurement of Printed Circuit Boards
ECSS-Q-70-26
The crimping of high reliability electrical connections
ECSS-Q-70-28
The repair and modification of PCB and solder joints for space
use
PSS-01-738
High-reliability soldering for surface-mount and mixed-technology
PCB
PSS-01-605
The capability approval programme for the hermetic thin-film
hybrid microcircuits
PSS-01-606
The capability approval programme for hermetic thick-film hybrid
microcircuits
ECSS-Q-70-18
The preparation, assembly and mounting of RF coaxial cables
Where a subcontractor/supplier uses other specifications for the specific activities listed
above they shall provide a statement that the alternative process complies with the
requirements of the above documents.
8.5.1.
Mounting of EEE Parts
PA-005-851a
According to ECSS-Q-70, the Subcontractor shall be able to
demonstrate the adequacy and the qualification status of his
mounting and assembly rules with respect to the use of various
package technologies and materials.
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PA-005-851b
As a minimum, the relevant procedures shall address:
- Mounting of EEE parts on printed circuits boards must be
done according to ECSS-Q-70-08 and PSS 01-738.
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Design of Printed Circuit Boards or any support receiving
EEE parts (thermal requirements, rules for implantation of
EEE parts, …).
Storage and handling on the assembly line.
Preparation of EEE parts before mounting.
Mounting process, in compliance with maximum rating
authorized by the specification.
Criteria for visual inspection.
Storage conditions of Printed Circuit Boards or any support
receiving EEE parts.
PA-005-851c
These procedures shall be available for review by ECE, on
request
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PA-005-851d
Parts procured in gold version then submitted to hot solder dip
operations, shall be subjected to the requirements of the annex 5.
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8.6. TRACEABILITY
PA-005-86a
A unique reference number or code and a lot number shall
identify materials and parts.
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PA-005-86b
The Subcontractor shall ensure that it is possible, should there
be an incident or Non-Conformance or for the purpose of
technical investigations following failure or damage, to
reconstitute the material or part history, either individually
(individual traceability) or by the manufacturing lot it was part of
(lot traceability).
R
PA-005-86c
The Subcontractor shall ensure that the full traceability of
materials and parts is maintained and recorded throughout the
build and test programme of the spacecraft.
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8.7. MATERIALS AND PROCESS CONTROL BOARD (MPCB)
PA-005-87a
A Material and Process Control Board (MPCB) shall be
established between ECE and the Subcontractor specialists of
Materials and Processes. ECE shall convene as MPCBs as
needed throughout the life of the contract.
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PA-005-87b
ECE shall chair these meetings and ESA shall be invited to
attend. The MPCB shall be initiated prior to PDR or during
EQSR, when applicable.
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PA-005-87c
The function of the MPCBs is to ensure that each of the following
is carried out:
- Evaluate and approve the DML, DMPL and DPL prior to
submission of these documents to PDR, CDR and QR or
during EQSR, when applicable.
- Ensure that PMP management is conducted in accordance
with this document.
- Evaluate the RFAs submitted for approval of critical
materials, mechanical parts and processes.
- Ensure that PMP implementation is performed in
accordance with design and manufacturing documents
(mandatory inspection points and key inspection points) and
to request audits and/or technical reviews where considered
necessary.
- Support investigations to resolve PMP non-conformances.
- Provide ECE and ESA with regular PMP updates.
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PA-005-87d
The following documentation should be made available to MPCB
participants prior to any meeting:
- DML, DMPL, DPL
- CIL
- PMP qualification programme and associated reports
- Audit reports (where applicable)
- Incoming PMP reports
- Top level drawings
- RFA documentation
- Non-conformance reports/deviation requests/waivers.
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8.8. PROPRIETARY MATERIALS, PARTS AND PROCESSES
PA-005-88a
Where materials, parts or processes are considered proprietary
by the Subcontractor and/or supplier. ECE will respect the right of
the third party to withhold certain details. However sufficient
information must be made available to ECE to allow a full
evaluation of the Material, Part or Process with respect to the
mission environment and lifetime requirements and to allow a full
risk assessment to be carried out. The level of information
exchange will be defined on a case-by-case basis dependant on
the sensitivity of the requested information.
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8.9. CONFIGURATION MANAGEMENT
PA-005-89a
The Subcontractor shall implement a configuration system to
control process change for his own processes and for the
processes of his Lower Tier Subcontractors. These changes shall
be submitted for approval through the PA reporting. In this case,
ECE can organize a Material and Processes Control Board to
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analyse impacts of the process change on the qualification status
of the process.
8.10. MATERIALS, PARTS AND PROCESSES LIST
PA-005-810a
The Subcontractor shall provide the following lists:
Declared Material List (DML)
Declared Mechanical Part List (DMPL)
Declared Process List (DPL)
Critical Items List (CIL)
The lists shall cover all materials and processes used in the
product, including those used at lower tier subcontractors level
and all materials, mechanical parts and processes used during
the AIT phase. DML and DMPL may be submitted as a single,
consolidated document.
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PA-005-810b
The preparation and content of DML, DMPL and DPL
documentation shall comply with the document requirements
definition given in annexes B, C and D of ECSS-Q-70.
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PA-005-810c
For each product, DML, DMPL and DPL documentation shall be
prepared in the format defined in annexes B, C and D of ECSSQ-70.
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PA-005-810d
The Subcontractors shall issue and submit their DMLs and DPLs
for approval to ECE electronically using the ESA DML DPL tool.
Last version of the tool can be downloaded from
http://esmat.esa.int/ESA_Tool/esa_tool.html
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8.11. SPECIFIC REQUIREMENTS FOR PYROTECHNIC DEVICES
The selection, procurement and application of pyrotechnic devices shall conform to the
requirements of ECSS-E-30 Part 6A. All devices selected for use on the spacecraft must be
subject to the qualification, acceptance and verification testing of this specification. In
particular, the following requirements must be adhered to:
PA-005-811a
All devices must be qualified against the mission requirements in
accordance with ECSS-E-30 Part 6A. This shall also include
demonstration by test prior to launch.
PA-005-811b
All devices must be subject to lot acceptance testing upon
receipt.
PA-005-811c
Prime and redundant devices must not be taken and installed
from the same lot. Both lots must be subject to acceptance
testing.
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The pyrotechnic device subsystem must be subject to an end-toend test prior to launch.
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9. SOFTWARE PRODUCT ASSURANCE
PA-005-9a
All software requirements are defined by Applicable Document
[AD f].
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10. CONFIGURATION MANAGEMENT
PA-005-10a
ECSS-M-40 shall apply.
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PA-005-10b
The Subcontractor Configuration Management organisation,
disciplines and procedures shall guarantee an effective control
over the design and built status of all deliverable systems,
equipments, units and their related software, including Electrical,
Optical and Mechanical ground support equipments, from the
initial definition throughout the entire life cycle of the project.
R
PA-005-10c
The Subcontractor shall establish, implement and operate an
efficient change control system by which any change or limited
relaxation to configuration identification of a Configured Item after
formal establishment of its baseline will be identified, evaluated,
classified, justified, approved and implemented or rejected
throughout the complete project life cycle.
The change control procedure could be an annex of
Configuration Management Plan.
R
PA-005-10d
The Subcontractor shall be responsible for the configuration
reconciliation of each deliverable Configured Item product, that
is:
- The comparison between the approved design standard
and the "as built and tested" configuration, and the
reconciliation of any differences by means of approved
waivers or change proposals.
- The comparison between the different delivered models
R
PA-005-10e
The Subcontractor shall prepare a Configuration Control and
Documentation Management Plan showing how his configuration
and documentation Management System will operate. This plan
shall also describe the management of qualification of product
and processes.
R
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11. DOCUMENTATION
PA-005-11a
The Subcontractor shall achieve an effective control of the
documentation issued and used in the framework of SEOSAT.
The Subcontractor information and documentation management
shall be described in the management plan. ECSS-M-50 shall
apply.
R
PA-005-11b
The documentation system shall be capable of providing up-todate information on all aspects of the sub-contract, at all times.
Documentation shall be easy to access by all participants within
the Subcontractors organisation.
R
PA-005-11c
The documentation system shall, in particular, serve as a
reference for technical interfaces and for introducing and
executing all project modifications. The project documentation
centre shall be equipped with effective and reliable means of
reproduction and transmission of documents.
R
PA-005-11d
The Subcontractor shall grant access to the documents, if so
required, by ECE and ESA.
R
11.1. DOCUMENT LEVEL AND CLASSIFICATION
PA-005-111a
All documents shall fall into one of four different levels:
- Level
1:
the
Contractually
Controlled
Baseline
Documentation. (Only ECE issued documents).
- Level 2: the Class A documents issued by the
Subcontractor and to be submitted to ECE for approval.
- Level 3: all other documents issued by the Subcontractor,
either for review (Class R) or for information (Class I).
- Level 4: Documents available at Subcontractor premises or
on request (Class C).
The classification of documents is as follows:
o
o
Class A: Documents issued by the Subcontractor, which shall be approved, by the
Subcontractor and ECE prior to their implementation. After approval, these
documents are contractually binding. ECE reserves the right to request other ECE
companies and ESA to review these documents and will collate their comments prior
to notification to the Subcontractor.
Class R: these documents shall be sent to ECE for review, but shall be approved only
by the Subcontractor prior to their implementation. Implementation can start as soon
as the Subcontractor corrects errors and inconsistencies that have incurred ECE's
disapproval. Failure to comply with these requirements shall be at the Subcontractor's
risk. In any case, the Subcontractor shall notify ECE of his decision before
R
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o
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implementation. ECE reserves the right to request other ECE companies and ESA to
review these documents and will collate their comments prior to notification to the
Subcontractor.
Class C: these documents shall be available on request.
Class I: All other documents.
PA-005-111b
The Subcontractor shall implement the required numbering,
approval and update procedure, and classification of each
document issued in the frame of SEOSAT.
R
PA-005-111c
The Subcontractor shall ensure that all documents and document
updates are approved as required.
R
11.2. DOCUMENT CHANGE
PA-005-112a
All documents shall be subject to the Configuration Management
Requirements.
R
PA-005-112b
All documents shall be updated either by a revision
issue. Revisions will be made for minor additions,
changes of information. New issues will be made
changes in the scope or the text have evolved.
In any case, a complete document should be the
delivery.
R
or by a new
deletions or
when major
baseline for
11.3. DOCUMENT STATUS LIST
PA-005-113a
The Subcontractor shall create and maintain a Document Status
List, recording all the documents produced during the Contract,
including reports, specifications, plans and minutes. The list shall
indicate the document reference, class of document, date of issue,
status (draft or approved), confidentiality level and distribution.
This list shall be continuously updated.
R
PA-005-113b
The Subcontractor shall submit an updated Document Status List
at the occasion of each Progress Meeting or at specific request by
ECE.
R
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11.4. DOCUMENT DISTRIBUTION AND RETRIEVAL
PA-005-114a
As soon as they become available, the Subcontractor shall submit
to ECE all contractual deliverable documents, which are produced
during the execution of the Contract. Document format, content
and table of content shall be in accordance with the specific
requirements as defined in the Statement of Work.
R
PA-005-114b
Any document to be discussed at a meeting with ECE shall be
submitted two weeks prior to such meeting.
R
PA-005-114c
Formal documentation specifically issued by the Subcontractor in
the frame of the SEOSAT Contract, shall be signed for
authorization by the Subcontractor's Project Manager, the PA/QA
Manager and by the members of the Subcontractors team as
relevant.
R
PA-005-114d
The Subcontractor shall distribute all documents as specified in
the Deliverable Document List as contained within the Statement
of Work.
R
PA-005-114e
All documents shall be delivered electronically in PDF format. The
PDF format shall be derived from the original source file.
For each electronically created document a set of key words
should be provided for easy reading and reference.
R
PA-005-114f
The Subcontractor shall ensure that documents are available for
retrieval by any authorized person and shall store documents in a
manner that enables easy and speedy retrieval.
R
PA-005-114g
The Subcontractor shall protect and distribute documents
according to the level of confidentiality of information they contain
R
PA-005-114h
The Subcontractor shall provide access to ECE and ESA to all
project documents, regardless of their confidentiality.
R
PA-005-114i
All documents shall be retained for a period of not less than 10
years, following the completion of the contract. The documents
may be stored on transferable, electronic media, such as CD
ROM.
R
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11.5. DOCUMENTATION FORMAT AND TYPES
PA-005-115a
Documentation and data from the Subcontractor shall comply with
the requirements of the SEOSAT Documentation Standards
Document.
R
11.6. PRODUCT ASSURANCE DOCUMENT REQUIREMENTS
11.6.1. PA Plan
PA-005-1161a
The PA plan shall describe the overall PA programme including
reliability, quality, safety, parts, materials and software.
It shall include:
- Statement of policy
- Product Assurance Organisation
- Schedule
- Documentation
- Reporting
- A KIP/MIP (Key Inspection Point/Mandatory Inspection Point)
programme where criteria for KIP's (to be attended by
Subcontractor QA) and MIP's (to be attended by
Subcontractor QA and ECE) shall be defined
- Cleanliness and Contamination Control
- Critical Items Control Programme
- Sizing of PA effort based on ranking list of critical items and
characteristics
- Audit planning
- Reliability inputs/planning
- Safety inputs/planning
- Component Control Plan (if not a self standing document)
- Software PA plan (if not a self standing document)
- Compliance matrix against this set of requirements
R
11.6.2. EIDP
11.6.2.1 General
PA-005-11621a
Complete copy of the EIDP's shall be submitted to ECE at least 10
working days prior to the Delivery Review (final updates may be
given at the review).
The EIDP content is subject to ECE approval.
R
11.6.2.2 Content
PA-005-11622a
The EIDP is a collection of the data related to the manufacturing,
assembly, integration and test of a deliverable configuration item.
R
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It shall constitute the basis to support the acceptance of the
product. One copy shall always accompany the hardware or
software.
The following subjects in the form of documents shall constitute
the EIDP.
1. EIDP contents list (including list of lower-level EIDPs
incorporated & lower level log book if applicable)
2. EIDP change record
3. Certificate of conformance (CoC), with reference & statement
4. As-Built configuration list with reconciliation versus as-designed
configuration
5. Record and justification of design or build changes versus the
qualification (or PFM).
10. Change Requests status list
6. RFD/RFW list and copies of the Requests.
7. Non-conformance list (Major & Minor) and copies of major
NCRs.
8. Open item register (Open works, List of missing items, differed
works, loose items) & Temporary installation records (e.g. removebefore-flight items)
10. Proof load certificate (when relevant)
11. Cleanliness certificate & Contamination Status
12. Operational constraints, Operating and Maintenance
operations/procedures. (including electrical/functional schematics)
plus TM/TC data sheets. User manual
13. Calibration curves and records
14. Special packaging, handling and shipping procedures
(Packaging, handling, storage, safety, cleanliness and shipping
operations/procedures) (there shall be also provided external to
the hardware shipping container if the EIDP is enclosed in the
container or shipped separately)
15. Deliverable items list (including loose items and spares)
16. Verification compliance matrix
17. Acceptance test plan and procedures (as run)
18. Acceptance tests reports
19. Interface control document and drawings (e.g. mechanical,
electrical ICDs, key assembly drawings, detailed circuit diagrams
shall be available for consultation)
20 Logbook ( *)
21. Limited life items list (if applicable)
22. Copies of key inspection (KIP) and mandatory (MIP) reports
23. Pictures of all flight hardware down to board level shall be
available at Contractor’s premises for consultation
24. DRB minutes of meeting
25. CE Certificate of Compliance & label
26. Hardware and Software maintenance manual (for GSE)
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27. Maintenance plan (for Software)
28. Shipping documents
The content of the EIDP is defined in the SEOSAT DRD.
(*)
A log book shall be delivered with each end item
identifying the chronological sequence of operations, ( & operating
hours for limited life items), including tests, performed on the
product, starting at least from the beginning of the first acceptance
test sequence. Annex B of ECSS-Q-20B shall be used as
guideline.
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Annex1- 1
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ANNEX 1
EEE PARTS SCREENING
REQUIREMENTS
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SEOSAT / INGENIO
Capacitors, molded, ceramic
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Annex1- 2
05
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QUALITY LEVEL
EEE PART FAMILY
Capacitors, chip, ceramic
No.:
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Fecha/Date:
ESCC
ESCC 3009 level C
ESCC 3001 level C
MIL
MIL-PRF-55681
EFR level R min
MIL-PRF-123
MIL-PRF-123
MIL-PRF-20
EFR level R min
MIL-PRF-39014
EFR level R min
MIL-PRF-49470
EFR level T
COMMENTS
CECC / Other
CECC 32101
See note 1
+ burn-in
(qualified parts)
CECC 30601
(type 1)
See note 1
+ burn-in
(qualified parts)
CECC 30701
(type 2)
+ burn-in
(qualified parts)
Capacitors, glass
(CYR type)
Capacitors, mica
ESCC 3007 level C
MIL-PRF-23269
EFR level R min
MIL-PRF-39001
EFR level R min
MIL-PRF-55365
WFR level C min
MIL-PRF-39006
Capacitors, chip, solid tantalum
(TAJ, T495, CWR11)
Capacitors, non-solid tantalum,
electrolytic (CLR79)
ESCC 3011 level C
ESCC 3012 level C
ESCC 3003 level C
Capacitors, solid tantalum,
electrolytic (CSR type)
ESCC 3002 level C
Capacitors, super metallized
plastic film, (CRH type)
Capacitors, metallized film,
(KM94S, PM94S, PM90SR2,
MKT, …)
ESCC 3006 level C
Capacitors, variable
Connectors, D-sub rectangular,
non filtered
Connectors, D_sub rectangular,
filtered
ESCC 3010 level C
ESCC 3401, level B
Connectors, printed circuit board
Connectors, coaxial RF
ESCC 3401 level B
ESCC 3402 level B
MIL-PRF-39012
MIL-DTL-83517
MIL-PRF-55339
Connectors, microminiature
rectangular
ESCC 3401 level B
MIL-DTL-24308
Connectors, non filtered, circular
ESCC 3401 level B
MIL-DTL-38999
class G or H
Connectors, filtered, circular
Not recommended for new
designs
All capacitors shall be surge
current tested
39006 / 22, 25, 30, 31 and "H"
designated devices are
recommended
Surge current test mandatory on
low ESR capacitors (CSR21 and
CSR33).
EFR level R min
MIL-PRF-39003
WFR level C min
MIL-PRF-83421 EFR
level R min
ESCC 3006 level C
MIL-DTL-24308
ESCC 3405 level B
ESCC 3405 level B
GSFC-311-P
Standard space
FR 165 type
-
Lifetest 1000h / 125°C / 1,5Ur on
each tubular ceramic lot.
By default, assured for ESCC
products.
Lifetest 1000h /
1,5Ur on each
ceramic lot. By
assured
for
products.
125°C /
tubular
default,
ESCC
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SEOSAT / INGENIO
ESCC
ESCC 3501, level B
ESCC 5000
CECC / Other
MIL-PRF-19500,
JANTXV + PIND test
commercial
parts according
to JD
commercial
parts according
to JD
ESCC 5010 level C
+ PIND test
MIL-PRF-19500,
JANTXV + PIND test
Filters
ESCC 3008 level C
MILPRF-28861, Class
S
MIL-PRF-23419
Fuses (Wire link ≥ 5 A)
Fuses (CERMET)
Heaters flexible
ESCC 4009 level C
Inductors, coils, (molded)
ESCC 3201 level C
Inductors, coils (non molded)
Integrated circuits
ESCC 3201 level C
ESCC 9000
Integrated circuits
(ASIC only)
Integrated circuits microwave
(MMIC)
ESCC 9000
PIND test (see note 2)
PIND test (see note 2)
Burn-in (168 h -85ºC 50% rated
current) is mandatory on each lot
MIL-PRF-23419
ESCC 9010 level C
+PIND test
GSFC-S-311P79
MIL-PRF-39010, EFR
level R min
MIL-STD-981 Class S
MIL-STD-981 Class S
MIL-PRF-38535,
Class Q or M + PIND
test
MIL-PRF-38535,
Class V
MIL-PRF-38535,
Class Q or M + PIND
test
commercial
parts according
to JD
PIND test (see note 2)
For programmable devices, see
§ 7.5.11.3
PIND test (see note 2)
commercial
parts according
to JD
PIND test (see note 2)
ESCC 3202 level B
ESCC 3404 level B
Microwave passive parts
(attenuators, loads)
ESCC 3403 level C
Oscillators (hybrids)
ECSS Q-60-05
Level 1
ESCC 3601/3602,
level B
Relays, electromagnetic, latching
and non-latching
COMMENTS
MIL
Diodes microwave
Microwave passive parts
(isolators, circulators)
Microwave passive parts
(coupler, power dividers)
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Annex1- 3
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QUALITY LEVEL
EEE PART FAMILY
Crystals resonators
Diodes
No.:
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Resistors, fixed, film, (RNC, RLR,
MB x xxx type, except RNC90)
ESCC 4001 level C
Resistors, high precision, fixed,
metal foil (RNC90)
Resistors, network, thick film
ESCC 4001 level C
ESCC 4005 level C
MIL-PRF-23971
(dividers) "space
flight"
MIL-DTL-39030
(loads)
S letter (screened
parts)
MIL-DTL-3933
(attenuators)
S letter (screened
parts)
MIL-PRF-55310
(Class 2) Level S
MIL-PRF-39016
EFR level R min
+ ESCC screening
according to chart 3
MIL-PRF-55182
EFR level R min
MIL-PRF-39017
EFR level R min
MIL-PRF-55182/9
EFR level R min
MIL-PRF-83401 level
CECC 40101
+ burn-in
(qualified parts)
100 Kohms max allowed is also
applicable to MIL parts
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SEOSAT / INGENIO
Resistors, power, fixed, wire
wound, chassis mounted (RER
type)
Resistors, precision, fixed, wire
wound (RBR type)
Resistors, fixed, film, high voltage
(RHV type)
Resistors, fixed, thick and thin
film chip
Switches, thermostatic
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Annex1- 4
05
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QUALITY LEVEL
EEE PART FAMILY
Resistors, current sensing (RLV
type)
Resistors, power, fixed, wire
wound (RWR type)
No.:
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COMMENTS
ESCC
MIL
M
MIL-PRF-49465
CECC / Other
ESCC 4002 level C
MIL-PRF-39007
EFR level R min
ESCC 4003 level C
MIL-PRF-39009
EFR level R min
CECC 40201
+burn-in
(qualified .parts)
CECC 40201
+burn-in
(qualified parts)
MIL-PRF-39005
EFR level R min
Diameter of wire shall be greater
than 0.03 mm
ESCC 4001 level C
ESCC 4001 level C
MIL-PRF-55342
EFR level R min
ESCC 3702 level C
MIL-PRF-24236 (b)
CECC 40401
+ burn in
(qualified parts)
(b) Products based on MIL-PRF24236 are allowed with ESCC
screening :
Run-in
(500 cycles 60/100mA)
Elect. test per ESCC table 2
External visual insp. 100%
Switches, electromechanical
Thermistors
ESCC 3701 level C
ESCC 4006 level C
MIL-PRF-8805
MIL-PRF-23648
Transformers
Transistors
ESCC 3201 level C
ESCC 5000
MIL-STD-981 Class S
MIL-PRF-19500,
JANTXV+PIND Test
Transistors microwave, (bipolar
and GaAs)
ESCC 5010 level C
+PIND test
MIL-PRF-19500,
JANTXV+PIND test
Cables & wires, low frequency
Cables, coaxial
Hybrids
ESCC 3901 level B
ESCC 3902 level B
ESCC-Q-60-05
Level 1
ESCC 3502 level C
MIL-W-22759
MIL-C-17
MIL-PRF-38534 Class
K
MIL-PRF-38534 Class
K
Surface Acoustic Waves (WAV)
filters
Charge coupled devices (CCD)
Opto discrete devices
Photodiodes, LED
Phototransistors
Opto-couplers
Solar cells
ESCC 9020 Level B
ESCC 5000
ESA PSS-01-604
MIL-PRF-19500,
JANTXV+PIND test
GSFC-S-311P18
commercial
parts according
to JD
commercial
parts according
to JD
commercial
parts according
to JD
- PIND test (see note 2)
- PIND test (see note 2)
PIND test (see note 2)
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Note 1:
For ceramic capacitors procured through ESCC or MIL specifications but in an extended, non
qualified, range of values or not belonging to ESCC QPL or MIL QML/QPL, the humidity, steady
state, low voltage test (cf SCC 3009, § 5.2.2) is mandatory if U rated < 50V and C > 1 µF.
Note 2:
Particle Inducted Noise Detection (PIND) test is applicable to all cavity packages of active
components.
By default , PIND test is assured for ESCC products.
•
•
For semiconductor devices the JANS criteria is applicable per MIL-PRF-19500.
The lot is submitted to 100% PIND testing according to test condition A (per method 2052 of
MIL-STD-750).
For integrated circuits the Class V criteria is applicable per MIL-PRF-38535 The lot is submitted
to 100 % PIND testing according to test condition A (per test method 2020 of MIL-STD-883).
By default, assured for ESCC products.
•
For active parts (transistors, diodes) packaged in TO3, DO4 or DO5, the PIND test method is
submitted to the EADS CASA Espacio for approval (and the ESA, if required, for information), in
order to ensure the efficiency of the operating mode.
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ANNEX 2
REQUESTED INFORMATION FOR
“DCL”
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DCL FORMAT
Item
No
FC
GC
Genereic Values
&
Part Type Characteristics
Package
Component No
Generic Spec Detail Spec
Q Level
MFR
Date
Code
QPL
PPL
Crit
DCL
Comments
FI Qty
Att Qty
Sp Qty
Tot
Qty
Need
date
Offer
Additional
Parts
Total
parts
(1) Note: Other info shall include :
¾ Procurement inspections by Customer (pre-cap inspection, etc), if any
¾ Single Event Effects Linear Energy Transfer (SEE LET) threshold and/or total dose and/or displacement damage sensitivity level (when applicable)
¾ If applicable, DC or date of relife will be added in the DCL.
PAD CONTRL FORMAT
PAD CONTROL
PAD No
Pres
Date
Pres
Reference
Ap P
Date
Ap P
Reference
Ap
ESA
Date
Ap ESA
Reference
Rejected
PAD
Comments
Other
info (1)
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No.:
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DCL & PAD Control Legend
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DCL LEGEND
S/C User
Character, 10 max
Equipment
Character, 10 max
DCL Reference
DCL issue
Character, 30 max
Character, 11 max
Item No
Number, 3 digit max
FC
Number, 2 digit max
GC
Number, 2 digit max
Generic Part Type
Values & Characteristics
Character, 30 max
Character, 20 max
Component Number
Generic Spec
Character, 30 max
Character, 30 max
Detail Spec
Character, 30 max
Q Level
Character, 6 max
MFR
Character, 5 max
QPL
Date Code
Character, 1 max
Characacter, 10 max
Proc
Character, 4 max
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Subcontractor or User code (assigned by the programme) who will
use the item
Equipment Code (assigned by the programme) where the item is
used
Reference given by the subcontractor (or user ) to his DCL
Issue, rev & date of the DCL
To remark, that for one item line, these four first data should be the
same for each Subcontractor DCL
Sequential number given by each subcontractor (or user) list of each
line item, for traceability purposes
Family code as per ESA ECSS Q-60 code list. See family codes
reflected at ESA web https: //escies.org/public/eppl/family.html
Group code as per ESA ECSS Q-60 code list. See group codes
reflected at ESA web https: //escies.org/public/eppl/group.html
Manufacturer designation for the item
Values & characteristics for the complete definition of the item (not
included in the generic part type), including packaging
Component number, as defined in the detail specification
Reference of the Generic Specification for procurement (including
issue/rev)
Reference of the Detail Specification for procurement (including
issue/rev)
QML-V, QML-Q, SCC B, SCC C, JAN S, JAN XV, FR S, FR R,… As
applicable
Manufacturer code. Manufacturer Plant to be reflected (4th character
in the code) when relevant
“Y” if listed in the QPL, “N” if not included
Date when the parts has been procured (for stock parts). Only for as
built DCL
Procurer “SELF” procurer, or other to be here reflected
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DCL LEGEND
CRIT
Character, 5 max
DCL Comments
FI QTy
Att Qty
Character , 50 max
Number, 6 digit max
Number, 6 digit max
Sp Qty
Tot Qty
Need date
Number, 6 digit max
Number, 6 digit max
Character, 10 max
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Indication of the criticality for the item:
“N” for no critical item
“L” for Long Lead Items (LLI) and schedule critical items
“E” for items to be qualified or evaluated
“Q” for devices not meeting the minimum quality requirements
“O” for others critical items, to be specified in DCL Comments
Any comments for this item, reference to other documentation
Total quantity required for the flight mode
Quantity required for attrition calculated in accordance with the
attrition rules for the programme
Total spare quantity required for the space model
Total quantity
Date when the user needs the parts at home for assembly
PAD CONTROL LEGEND
PAD No.
Pres date
Pres Reference
App P Date
AP P reference
Ap ESA Date
Ap ESA reference
Rejected
PAD Comments
Character, 30max
dd-mm-yy
Character, 30maz
dd-mm-yy
Character, 30 max
dd-mm-yy
Character, 30 max
Character, 1 max
Character, 50 max
PAD CONTROL
PAD reference as assigned by the user for this DCL item, “N/A” when PAD not applicable
Date in which the PAD is presented for approval
Reference of the document (FAX, M.O.M., etc) where the PAD is presented
Date in which the Pad is approved by the Prime
Reference of the document (FAX, M.O.M., etc) where the PAD is approved by the prime
Date in which the PAD is approved by ESA
Reference of the document (FAX, M.O.M., etc) where the PAD is approved by ESA
“X2 if the PAD has been rejected. Actions to be indicated in “PAD comments”
Any comment to this PAD, refernce to other documentation
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Left intentionally in blank
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FAMILY
CODE
FAMILY
GROUP
CODE
1
CAPACITOR
1
CERAMIC
2
CHIP
3
TANTALUM SOLID
4
TANTALUM WET
5
6
PLASTIC
METALLIZED
GLASS
7
MICA
8
VARIABLE
2
CONNECTOR
GROUP
9
ALUMINUM SOLID
10
FEEDTHROUGH
1
CIRCULAR
2
RECTANGULAR
3
PCB
4
ATTENUATORS
LOADS
RF COAXIAL
5
6
GLASS FIBRE
7
TRIAX
3
CRYSTAL
1
ALL
4
DIODE
1
SWITCHING
2
RECTIFIER
3
5
VOLTAGE
REGULATOR
VOLTAGE
REFERENCE/ZENER
SCHOTTKY BARRIER
6
PIN
4
7
HOT CARRIER
8
TRANSIENT
SUPPRES/ZENER
TUNNEL
9
10
11
HIGH
VOLTAGE
RECTIFIER
VARACTOR
12
STEP RECOVERY
13
TUNNING
14
CURRENT
REGULATOR
MICROWAVE
15
5
FILTER
1
ALL
6
FUSE
1
ALL
7
INDUCTOR/COIL/CHOKE
1
RF COIL
2
CORES
3
CHIP
Family / Groups list codes (1)
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
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FAMILY
CODE
FAMILY
GROUP
CODE
8
MICRO CIRCUIT
1
8
MICRO CIRCUIT
10
RELAY
RESISTOR
THERMISTOR
GATE BUFFER
FLIP-FLOP LATCH
3
MULT-DIV-COUNT
4
CONVERTER
5
DE/CODE-DE/MUX.
6
COMP-FOLLOW-REG.
7
FUNC/PARITY GEN.
8
TIME-TRIG-SWITCH
9
AMPLIFIER
10
TRAN/RECEIVER-DRV
11
MEMORY
12
TRANSISTOR ARRAY
13
MULTIVIBRATOR
14
OSCILLATOR
P-INTERFACE
16
OTHER FUNCTIONS
17
ASIC
18
DETECTOR
19
DIODE ARRAY
20
21
DATA
ACQUISITION
SYSTEM
PRECISION VOL.REF.
22
GATE ARRAY
23
SIGNAL CONDITION
99
FAMILY
1
LATCHING
2
NON LATCHING
3
SOLID STATE
1
METAL OXIDE
2
4
WIREWOUND
PRECISION
WIREW.CHASSIS
MOUNT/POWER
VARIABLE
5
COMPOSITION
6
THICK FILM
3
11
GROUP
2
15
9
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7
SHUNT
8
FILM
9
CHIP
10
NETWORK
11
HIGH VOLTAGE
1
ALL
Family / Groups list codes (2)
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FAMILY
CODE
FAMILY
GROUP
CODE
12
TRANSISTOR
1
13
WIRE/CABLE
No.:
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GROUP
LOW POWER NPN
2
LOW POWER PNP
3
HIGH POWER NPN
4
HIGH POWER PNP
5
FET N CHANNEL
6
FET P CHANNEL
7
MICROWAVE
8
MULTIPLE
9
SWITCHING
10
RF NPN LOW POWER
11
RF PNP LOW POWER
12
1
RF FET N CHANNEL/P
CHANNEL
LOW FREQUENCY
2
COAXIAL
3
GLASS FIBRE
14
TRANSFORMER
1
ALL
15
MOTORS
1
ALL
16
SWITCH
1
ALL
18
OPTO
ELELCTRONIC
1
PHOTOCOUPLER
2
LED
3
DISPLAY
4
LASER DIODE
5
PHOTOTRANSISTOR
19
THYRISTOR
1
ALL
20
SENSORS
1
ALL
21
HEATERS
1
ALL
22
LAMPS (BULBS)
1
ALL
2
HALOGEN
3
UV
23
HYBRIDS
1
ALL
24
LOUDSPEAKER
1
ALL
30
RF PARTS (MW)
1
INDUCTORS
2
MMIC
3
HYBRIDS
4
COILS
5
ISOLATORS/CIRCULATORS
6
SWITCHES
7
POWER
99
MISCELLANEOUS
Family / Groups list codes (3)
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
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FAMILY
CODE
FAMILY
GROUP
CODE
GROUP
31
BATTERY
1
ALL
99
MISCELLANEOUS
1
THERMOSTAT
99
ALL
Family / Groups list codes (8)
MANUFACTURER CODES
MFR
CODE
ACT U
MFR NAME
ACTEL
ADI U
ADI ELECTRONICS
AEC U
AERO ELECTRIC CONNECTOR
AEM U
AEM
AGI U
AIB U
AGILENT
AIRBORN
AMH U
AMPHENOL
AMI U
AMI
AMM U
AMERICAN MICRO PRODUCTS
AND U
API U
ANALOG DEVICES
API ELECTRONICS
APT U
ADVANCED POWER TECH.
APX U
APEX
ARC G
ARCOTRONICS
ARF U
AEROFLEX-UTMC
ASM U
ATC U
AUSTIN SEMICONDUCTORS
ATC
ATM F
ATMEL
AVX U
AVX
AXO F
AXON CABLE
BAB U
BAE G
BABCOK
BAE SYSTEMS
BBR U
TEXAS INSTRUMENTS
BEC U
BLILEY ELECTRIC
BET R
BETATHERM
BEY D
BSS U
BEYSCHLAG
COOPER BUSSMAN
CAD U
CADDOCK ELECTRONICS
CAN U
ITT CANNON
CIN U
CINCH CONNECTOR
CMA C
C-MAC
COD U
CORNEL DUBILIER
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MFR
CODE
COR U
CRC U
MFR NAME
OFC
COMPONENT RESEARCH
CRI U
CRISTEK INTERCONNECTS
CRO C
CROVEN
CYP U
CYPRESS
DAT U
DDC U
DATEL
DDC
DEB U
DEARBORN
DEL U
API DELEVAN
DEU F
DEUTSCH
DLL U
MAXIM
DNX G
DPA U
DYNEX
DPA LABS
DRK N
DRAKA FILECA
DYN U
DYNALEC
EAT U
EATON
EDC U
ELE U
ELECTRON DYNAMICS CRYSTAL
ELECTRONIC CONCEPTS
ESP U
ERIE
EUR F
EUROFARAD
FAI U
FAIRCHILD
FCI F
FRAMATOME
FER U
FIC U
FERRAZ SHAWMUT
FIC CORP.
FIR F
FIRADEC
FSI U
FIBER SYSTEMS
GEC U
GENERAL CONNECTOR
GEM U
GHT U
GUARDIAN ELECTRIC
G & H TECHNOLOGY
GLE U
GLENAIR
GPD U
GERMANIUM POWER DEVICES
HCC U
GLASSEAL
HIR U
HOL U
HIREL CONNECTORS
HOLT
HON U
HONEYWELL
HTE U
HI-TECH SWISS
HYC U
HYCOMP
HYP G
FRB/HYPERTAC
IDT U
INF D
IDT
INFINEON
INR U
INTERNATIONAL RECTIFIER/OMNIREL/LAMBDA
INT U
INTERSIL
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MFR
CODE
IRC U
ITP U
MFR NAME
INTERNATIONAL RESISTIVE
INTERPOINT
JOS U
JOSLYN SUNBANK
KEM U
KEMET
KNX U
KNOX SEMICONDUCTORS
LAN U
LAT U
LANSDALE
LATTICE SEMICONDUCTORS
LEA U
LEACH
LIF U
LITTELFUSE
LTC U
LINEAR TECHNOLOGY
LUC U
LUCENT
MCD U
MCN U
MICRODOT CONNECTORS
MICRO NETWORKS
MCR U
MICRON TECHNOLOGY
MEC U
MIN-E-CON
MII U
MICROPAC
MIS U
MLL U
MINI SYSTEMS
MALLORY
MNC U
MINCO
MPS U
MICRO PRECISION SWISS
MRL U
MICREL
MSC U
MICROSEMI
MSD U
MSK U
MSD
MS KENNEDY
MSS U
MSIS SEMICONDCUTORS
MTR U
M-TRON
MXS U
MAXWELL
NAT U
NEX F
NATEL ENGINEERING
NEXAS
NHI U
NATIONAL HYBRID
NSC U
NATIONAL SEMICONDUCTORS
OPT U
OPTEK
PAC U
PCD U
PACIFIC AEROSPACE
PRECISION CONNECTOR
PHO U
PHOENIX INTERCONNECT
PHU U
PACKARD HUGHES
PIC U
PICONICS
PRC U
PRESIDIO COMPONENTS
PSR U
PST U
PERFORMANCE SEMICONDUCTORS
POSITRONIC
PWT U
POWERTECH
QCK U
QUICKLOGIC
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SEOSAT / INGENIO
MFR
CODE
QPL U
QTH U
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
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MFR NAME
QP LABS
Q-TECH
RAD F
RADIALL
RFI U
RFI
RIC T
IRCA -RICA
ROC U
SAR U
ROCHESTER
SARNOFF
SCI U
SPECTRUM CONTROL
SCO U
SEMICOA
SEC U
SILVERED ELECTRONIC
SET U
SEMTECH
SIM U
SIP U
SIMTEK
SIPEX
SIT U
SI-TAC CONNECTORS
SMI U
S V MICROWAVE
SML G
SEMELAB
SMT U
SNP U
SEMITRONICS
SIGNAL PROCESSING
SOA U
STATE OF THE ART
SOL U
SOLITRON
SST U
SENSITRON
STC U
SILICON TRANSISTOR
STM F
STN U
ST MICROELECTRONICS
STONE CITY
TAL U
TALEH
TAN U
TANSITOR ELECTRONICS
TDY U
TELEDYNE
TEC G
TEM U
TEC
TEMEX
TEP U
TEPRO
TEP U
TEPRO
TEX U
TEXAS INSTRUMENTS
TFM G
TUX U
FILM MICRO.
TUSONIX
TYC G
TYCO ELECTRONICS/AMP/M/A-COM/CCI
UCM U
UNITED CHEMI-CON
UCR U
U.S. CRYSTAL
ULM U
ULTI MATE
VAL U
VCN U
VALPE-FISHER
VECTRON
VIS U
VISHAY
VIS U
VISHAY SPRAGUE
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MFR
CODE
VMU U
WAF U
No.:
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Fecha/Date:
MFR NAME
VOLTAGE MULTIPLIERS
WAFERSCALE
WLB U
WILLBRECHT
WLG D
W.L. GORE
WMT U
WITHE ELECTONIC DEVICES
XIC U
XIL U
XICOR
XILINX
XSI U
XSIS
YSI U
YELLOW SPRINGS
ZAR N
ZARLINK
ZIL U
ZILOG
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ANNEX 3
RECOMMENDED FORMAT FOR
PAD
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PROJECT:……………
…………….
Sheet 1of ( )
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
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Doc No: …………….
Prepared
Issue: …………….
Date: …………….
Approval requested by: …………………….
Family: …………….
Fcode [ ]
Group: …………….
Gcode [ ]
Component Number:……………………………….
Commercial Equivalent Designation: …………….
Manufacturer/Country: …………………………….
Technology/Characteristics (value or range of values with tolerance, voltage, package, etc.): ………………..
Pure tin free (Y/N) [ ]
Generic specification: …………….
Detail specification: ……………….
Specification amendment: ……….
Issue:……
Issue:……
Quality level: …………….
APPROVAL STATUS
EPPL Part 1/2 listed (1/2/N) [ ]
ESCC QPL or EQML listed (Y/N) [
MIL QPL or QML listed (Y/N) [ ]
Rev.:……
Rev.:……
variant:……
variant:……
Procurement by: ……………………………
]
If yes, QPL/QML Reference: ………………….
Other approvals/former usage ………………………………….
Evaluation program required (Y/N) [ ]
If yes reference of the Evaluation Program: …………………..
PROCUREMENT INSPECTIONS and TESTS
Precap Y/N
[
]
Lot acceptance:
ESCC LAT/LVT LAT level or subgroup
MIL QCI/TCI group
Buy-off Y/N
DPA Y/N
[
[
[
[
]
]
]
] if yes: sample size ………………………….
Complementary tests …………….…………….…………………..
RADIATION HARDNESS DATA.
Radiation Evaluation Program Y/N [ ]
Doc. Ref.: …………….…………….…………….
Total Dose Effects:
Evaluation Test Data (report) reference: ………………………….
Single Event Effects: SEL/SEU/SET/SEFI/SEB/SEGR/others: (cross out where in applicable)
Evaluation Test Data (report) reference: ………………………….
Displacment Damge (if applicxable
Evaluation Test Data (report) reference:………………………………………………..
RVT required Y/N [ ]
If yes reference of RVT test plan:
REMARKS
Approval customer…………….…………….…………….
Approval first-level supplier…………….…………………
Date…………….
Date…………….
Page 1
by:
No.:
Página/Page:
Edición/Issue:
Fecha/Date:
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SEOSAT / INGENIO
PROJECT:
Sheet 2 of [ ]
Doc No:
Issue: Date:
Approval requested by:
Family:
Fcode [ ]
Component Number:
Testing level:
DETAILS OF SPECIFICATION MODIFICATIONS PENDING
DETAILS OF EVALUATION PROGRAMME PLANNING
Evaluation programme under:
Design assessment (Y/N) [ ]
Constructional analysis (Y/N) [ ]
If [N] entered above, provide rationale:
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Group:
Similar to style:
Gcode [ ]
Manufacturer audit (Y/N) [ ]
Sample size .........................................
Radiation testing (Y/N) [ ]
Evaluation testing (Y/N) [ ]
Sample size .........................................
If [N] entered above, provide rationale for evaluation acceptance:
TYPE APPROVAL TESTING
SCC LAT 1 [ ]
Other [ ] (Give details below)
Approval customer ........................................................................ Date ......................
Approval first–level supplier ........................................................ Date ......................
Page 2
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No.:
Página/Page:
Edición/Issue:
Fecha/Date:
Doc No:
Unique sequential number
Issue:
Issue of document
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Date:
Date of issue
Project:
Name of project using the component
Prepared by:
Name of the person submitting the PAD
Approval requested by:
Name of the company submitting the PAD
Family:
Capacitor, resistor, etc. (Refer ECSS Family Code)
Group:
Ceramic, tantalum, etc. (Refer ECSS Group Code)
Component Number:
In accordance with the procurement specification
May be generic to cover several range of parts (with
justification): e.g. range of resistors or capacitors or variants for
connectors & accessories
Commercial Equivalent Designation
Self Explanatory
Technology/Characteristics
Additional details of the components covered by the PAD
Pure tin free (Y/N)
When tin ≥ 97% (inside the component and terminations)
Generic specification:
Relevant specification
Detail specification:
Relevant specification with issue and revisions
Only required for non qualified parts
Specification Amendment:
Relevant specification with issue and revisions
Quality level:
As defined in Annex A
Procurement by:
Identify the name of the company procuring the part. E.g. This
can be self, CPPA, distributor, manufacturer or a combination
thereof
Manufacturer/Country:
Self-explanatory
Approval status:
Information about known approvals (EPPL, ESCC, ESCC/QML,
MIL, MIL/QML or other approvals/former usage)
EPPL Part 1/2 listed (1/2/N)
If the part is in the European Preferred Parts list, indicate if the
part is in part 1 or part 2. If not write "N" for No
Evaluation program required:
Y/N as applicable
Procurement inspections and test:
Y/N as applicable
DPA sample size:
Number
Complementary tests
Testing/Inspection in addition to that defined in the procurement
specification shall be identified E.g. PIND, upscreening, …
Lot Acceptance:
Identify level and subgroups
Radiation Hardness Data
Self-explanatory
Total Dose Effects:
Evaluation Test Data (report) reference:
Reference of the test report for Total Integrated Dose including
the Enhanced Low Dose Rate (ELDR) effect
SEL/SEU/SET/SEFI/SEB/SEGR/others:
Evaluation Test Data (report) reference:
Reference of the test report for Single Event Latchup/Single
Event Upset/Single Event Transient/Single Event Functional
Interrupt/Single Event Burn out/Single Event Gate Rupture
Cross out where inapplicable
RVT
Radiation Verification Test: Yes or No where inapplicable
REMARKS
Any additional information
Approval customer:
Signature signifies acceptance
Approval first-level supplier:
Signature signifies acceptance
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ANNEX 4
EEE PARTS ATTRITION RULES
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FM quantity
needed by equipment
1 to 4
5 to 11
12 to 23
24 to 60
61 to 120
> 120
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Attrition quantity
per equipment
100 %
5 units
7 units
10 units
12 units
10 %
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ANNEX 5
HOT DIP SOLDER PRETINNING
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Screening after hot solder dip operations by users
This annex is applicable to EEE parts packaged in:
¾
¾
¾
SMD-1, -2, -5, -22
LCC (including JLCC)
Micro X1
Parts procured in gold version (pre-tinning done by users) shall be subjected to:
¾
Hermeticity Fine and Gross leak – 100% - (according to the relevant MIL test
method)
Note: no more than 25 parts per batch during gross leak test
¾
¾
DC Electrical test at ambient temperature AQL 0.65%
External visual inspection 100% (according to criteria from ESCC basic
specification or MIL test method)
In this case the 0.75mm criteria from ECSS-Q70-08A shall be applied for leaded
devices.
However, this criteria should be adapted case-by-case to the package dimension.
For very small packages (e.g. micro-X packages), at least a clear line free of SnPb
should be visible between lid seal and solder.
For unleaded packages, tinning shall extend to the seating plane.
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ANNEX 6
PARTS FAILURE MODES LIST
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1 CAPACITORS
Part Type
Failure Mode
Remark
Capacitor (ceramic &
ceramic chip, non solid
tantalum, glass, mica,
semiconductor)
• Open Circuit
• Short Circuit
Capacitor (solid tantalum)
• Short circuit
• Open circuit
• Current leakage
- very unlikely
- depending on leakage value, final effect can be either short circuit or
open circuit (in case of over heating and burst)
In particular for CMS tantalum capacitor open circuit condition after short
circuit to be considered.
Film Capacitor (plastic
metallic)
• Open Circuit
• Short Circuit
- For self-healing capacitor (typical PM94, PM96,
PM90, …) the short circuit shall be considered in the FMECA (for
traceability aspects).
The minimum self-healing energy shall be indicated in the FMECA.
Feed through Capacitor
• Open Circuit
• Short Circuit
• Short Circuit with
Structure
2 CONECTORS
Part Type
Connector (circular,
rectangular, printed circuit
board, micro-miniature,
rack and panel)
Failure Mode
Remark
• Open Circuit on a pin
• Short Circuit between adjacent pins (1)
• Connector Disconnection (2)
• SC between connector pin and
housing
- (1) Subcontractor shall justify the correct
Implementation of segregation rules of redundant and
critical signals * at connector level (free pin not used
between them or by using specific connectors).
FMECA shall cover short circuit between adjacent pins
only when segregation rules are not respected.
SPF caused by short circuit of adjacent pins shall be
identified.**
- (2): The number of critical connectors (i.e. the demating
of which has critical effects on the mission) shall be
minimized by design. A specific analysis shall be
performed for identifying critical connectors.
Connector disconnection is considered as a not credible
failure in flight providing a locking device exists and
verification of locking is performed during AIT. An
appropriate justification shall be provided
*critical : when failure leads to deviate from the failure tolerance requirement or for safety critical
functions
** Exemple of short-circuits between adjacent pins:
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3 CRYSTAL / PIEZZO-ELECTRIC DEVICES
Part Type
Crystal Resonator
(quartz)
Failure Mode
• Open Circuit (no clock signal)
• Drift of the frequency
Remark
- drift means over the worst case range specified
- the worst effect with regard to the device
function shall be assessed
4. DIODE
Part Type
Diode (any type)
Failure Mode
• Open Circuit
• Short Circuit
• Short Circuit to ground: for
diodes installed
directly on structure.
Remark
- Very unlikely
5. RF DIODE
Part Type
RF Diode (microwave
schottky Si & GaAs, Pin,
microwave PIN,
microwave GUNN GaAs)
Failure Mode
Remark
• Open Circuit
• Short Circuit
6. FILTER
Part Type
Feed-through Filter
Failure Mode
Remark
• Open Circuit
• Short Circuit
• Short Circuit with Structure
7. FUSE
Part Type
Fuse solid state
Failure Mode
Remark
• Open Circuit Glass fuses are generally
forbidden with the exception of wire link
fuses
8. INDUCTOR
Part Type
Inductors
Failure Mode
• Open Circuit
• Short Circuit between windings (1)
Remark
(1): Short circuit between windings is analyzed
except if insulation (other than enamel) exists
between the windings. To be addressed in the analysis
9. TRANSFORMER
Part Type
Transformers
Failure Mode
• Open Circuit
• Short Circuit
Remark
- Transformer primary/secondary, +/- primary, +/secondary. Short circuit between windings is analyzed
except if insulation (other than enamel) exists between
the windings. To be addressed in the analysis
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10. INTEGRATED CIRCUIT
10.1 LOGIC
Part Type
Integrated circuits
(logic)
Microprocessor
Micro-controller
Peripheral
Memory SRAM
Memory DRAM
Programmable logic
ASIC technologies
(digital, linear, mixed)
Logic families
Failure Mode
• Output Stuck (1)
• Input Stuck (2)
• Loss of Power Supply
• Short Circuit (3)
• SEP for sensitive circuit (4)
• Loss or degradation of the
function (5)
• According to technology:
wrong address,
wrong bits(s),…
Remark
(1): VCC+, VCC-, 0, 1, High Impedance
(2): VCC+, VCC-, 0, 1
(3): VCC+/VCC(4): SEP effect analysis performed in the FMECA shall
be based on the output s of the radiation analyses.
(5): For complex IC's (ASIC, μP,…), a functional
FMECA shall be performed taking into account the
physical implementation
10.2 PROM (non volatile memories)
Part Type
Integrated circuits
(non
volatile memories)
PROM
EPROM
EEPROM
Failure Mode
• Output Stuck (1)
• Input Stuck (2)
• Loss of Power Supply
• Short Circuit (3)
• SEP for sensitive circuit (4)
• According to technology:
wrong address,
wrong bits(s),…
Remark
(1): VCC+, VCC-, 0, 1, High Impedance
(2): VCC+, VCC-, 0, 1
(3): VCC+/VCC(4): SEP effect analysis performed in the FMECA shall
be based on the output s of the radiation analyses
10.3 LINEAR
Part Type
Failure Mode
Remark
Integrated circuits
(linear)
Voltage comparator
• Output Stuck (1)
• Input Stuck (2)
• Loss of Power Supply
• Short Circuit (3)
• Loss or Degradation of the
function
(1): VCC+, VCC-, High Impedance
(2): VCC+, VCC(3): VCC+/VCC
SET worst case effect shall be defined when
sensibility identified through radiation analyses
(generally temporary effect).
Integrated circuits
(linear)
Voltage regulator
Switching regulator
• Output Stuck (1)
• Input Stuck (2)
• Loss of Power Supply
• Short Circuit (3)
• Loss or Degradation of the function
(1): VCC+, VCC-, High Impedance
(2): VCC+, VCC(3): VCC+/VCC
SET worst case effect shall be defined when
sensibility identified through radiation analyses
(generally temporary effect).
Integrated circuits
(linear converters)
Analog to digital
converter
Digital to analog
converter
• Output Stuck (1)
• Input Stuck (2)
• Loss of Power Supply
• Short Circuit (3)
• Loss or Degradation of the function
(1) VCC+, VCC-, High Impedance
(2) VCC+, VCC(3) VCC+/VCC
SET worst case effect shall be defined when
sensibility identified through radiation analyses
(generally temporary effect).
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11. RELAY
Part Type
Relays and switches
Failure Mode
Remark
• Relay stuck in one position
• Coil Open Circuit
• 2 open contacts (relay stuck in
intermediate position)
• 2 contacts in opposite position
• Short Circuit between fix contacts
• Short Circuit between coil and one
contact
See details in table hereafter.
Failure modes only applicable to electromechanical
devices. For other devices performing same function
(e.g. thermally actuated micro-machined relays),
alternate possible failure modes must be identified and
considered according to the technology of the relay
The following table and figures identifies the failure modes, which shall be analyzed for relays:
A: applicable
N/A: not applicable
Failure modes
Mono-stable
relays
(type J412, T12,
GP5 or
equivalent)
Bi-stable relays
(type J422, TL12,
GP250 or
equivalent)
Bi-stable relays
(type EL210 or
equivalent)
Bi-stable relays
(type GP3 or
equivalent)
Relay stuck in OFF
position:
• coil Open Circuit
• contact stuck OFF
A
A
A
A
A
A
A
A
Relay stuck in ON
position:
• coil Open Circuit
• contact stuck ON
N/A
A
A
A
A
A
A
A
Coil Short Circuit
2 open contacts (relay
stuck in intermediate
position)
N/A
N/A
N/A
A (2)
N/A
N/A
N/A
A (1)
2 contacts in opposite
positions
Short Circuit between
fix contacts
Short Circuit between
coil and one contact
A (1)
A (1)
N/A
A (1)
A (1)
A (1)
N/A
A (1)
A (1)
A (1)
N/A
(1): Negligible probability of occurrence. To be considered in the FMECA for traceability aspects.
(2) : Not applicable for GP250
Table A1/1: relays failure modes
2 open contacts (relay stuck in intermediate position):
A
(
1
)
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2 contacts in opposite positions:
Short Circuit between fix contacts:
12. RF SWITCH
Part Type
RF Switches
Failure Mode
• Fixed in original position
• Failed in intermediate position
Remark
- concerns Wave GuidesG only
13. RESISTOR
Part Type
Resistor (metal film precision
[RNC except 90], metal film
semi precision [RLR], foil
[RNC90], film or foil chips,
carbon composition, deposited
thick film, microwave load)
Failure Mode
• Open Circuit
Resistor (wire wound high
• Open Circuit
precision [type RBR56], wire
• Short Circuit
wound power [type RWR, RER])
Film network
Remark
• Open Circuit
- Short circuit only for wire-wound resistors
(typical RE, RER, RWR, RB, RBR, …); low
probability of occurrence
- Short circuit only for printed resistors and
microcomponents
- The open circuit of the common connection
14. HEATER
Part Type
network resistor (Heaters,
flexible)
Failure Mode
• Open Circuit, including heater
delamination (for thermofoil)
• Short Circuit between heater and
Structure
• Short Circuit between lines (multilayer heater)
Remark
- Input or output of the heater; depending on device
technology
- Depending on device technology; low probability of
occurrence
- Note : Disbonding shall also be analyzed but it is not an
internal heater failure mode
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15. THERMISTOR
Part Type
Thermistors
Failure Mode
Remark
• Open Circuit
• Short Circuit
• Erroneous Measurement (drift or
blocked)
16. BIPOLAR TRANSISTOR
Part Type
Transistors (bipolar)
Failure Mode
• Open Circuit (1)
• Short Circuit (2)
Remark
(1), (2): Linear and switching (E/B, E/C, B/C)
17. FET TRANSISTOR
Part Type
FET Transistor (N
channel, P channel)
Failure Mode
• Open Circuit
• Short Circuit
Remark
- Linear and switching (D/S, G/S, G/D)
- Linear and switching (D/S, G/S, G/D)
- All failures causing over dissipation exceeding rated
value must be analysed (thermal risk failure propagation)
18. RF
Part Type
Failure Mode
Remark
RF Bipolar Transistor
(RF/microwave PNP low
power/low noise,
RF/microwave bipolar
power, microwave power
GaAs, microwave low
noise GaAs)
• Open Circuit
• Short Circuit
- Linear and switching (E/B, E/C, B/C)
- Linear and switching (E/B, E/C, B/C)
RF FET Transistor
(RF/microwave FET N &
P channel, RF/microwave
FET power Si, microwave
power GaAs, microwave
low noise GaAs)
• Open Circuit
• Short Circuit
- Linear and switching (D/S, G/S, G/D)
- Linear and switching (D/S, G/S, G/D)
19. WIRE
Part Type
Wires and cables
Failure Mode
• Open Circuit
Remark
- Applicable for the primary power lines only
-The effect of the failure on the other redundant line shall
be assessed ( compliance to the derating requirement in
case of permanent effect, compliance to the rating
requirement for temporary effect)
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20. OPTO-ELECTRONIC
Part Type
Failure Mode
Opto-Electronics (LED,
photo diode/sensor, laser
diode)
• Open Circuit
• Short Circuit
Opto-Electronics (photo
transistor and optocoupler)
Diode :
• Open Circuit
• Short Circuit
Transistor :
• Open Circuit (C/E)
• Short Circuit (C/E)
Diode/Transistor :
• Short Circuit input/output
• CTR decreases
• leakage current increase
Remark
-To consider according to used technology
-To consider radiation/aging effects leading to
characteristics modifications (eg CTR/gain) and
loss of performance
21. FIBER OPTIC
Part Type
Fiber Optic (bend radius,
cable tension, fiber tension)
Failure Mode
Remark
• Open circuit
• drift in transmission performance
22. MMIC
Part Type
MMIC Devices
Failure Mode
• Failure modes of components when
viewed as discrete parts
• Presence of DC voltage or current at
RF input or output
Remark
- e.g. short of DC block capacitor
23. HYBRID
Part Type
Hybrid
Failure Mode
Failure modes of components when
viewed as discrete parts
Remark
Physical layout taken into account
24. RF PASSIVE
Part Type
RF Passive
Components
Failure Mode
• Open Circuit of an access or connection
• Internal Short Circuit
• Weld failure
• Detuning
• Deplating
• - Any other failure mode causing loss or
degradation of performances
Remark
Components : Isolator/Circulator, SMA/RF connector,
Waveguide, Filter (this is a non exhaustive list)
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25. THERMOSTAT
Part Type
Thermostat
Failure Mode
• Blocked open
• Blocked closed
• Drift of commutation thresholds
• - Short Circuit of input or output with
Structure
Remark
- Depending on device technology and when
applicable very unlikely
26. BATTERY
Part Type
Cells of battery LiC/Li-Ion
Failure Mode
• Short Circuit (1)
• Open Circuit
• Rupture
• Leakage
Remark
(1): Assumed with a negligible probability of
occurrence
27. SOLAR CELL
Part Type
Solar Cell (Si or AsGa)
Failure Mode
• Short Circuit
• Open Circuit
• Short Circuit of input or output with
Structure
Remark
- Total or partial surface loss; low probability of
occurrence
- Depending on device technology
28. HEAT PIPE
Part Type
Heat Pipe
Failure Mode
• Rupture
• Leakage
• Insufficient thermal transfer
Remark
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29. CHEMICAL PROPULSION
Part Type
Failure Mode
All pressurized element (tank,
tubing, welded & screwed
connections, filter, valve,
regulator, pressure transducer,
...)
- Rupture
- External leakage
Pressure transducer
- Incorrect measurement
Filter
- Clogging
- Insufficient filtering
Pyrotechnic valve, Electro
valve (isolation)
- Internal leakage
- Stuck open / close
- Untimely closed / opened
Bi-propellant thruster valve
- Internal leakage
- Stuck open / close
- Asymmetric opening
Pressure regulator
- High output pressure
- Low output pressure
Non-return valve
- Internal leakage
- Stuck open / close
Fill & Drain valve
- Rupture
- External leakage
Remark
Failure mode to be confirmed by the supplier. The
stuck open failure and leakage of both propellants
have a very low probability of occurrence
- Compared to normal pressure
- Compared to normal pressure
30. MISCELLANEOUS
Part Type
Failure Mode
Remark
MICROPROCESSORS
Failure modes from microprocessor Functional
Analysis.
ASIC
Failure modes from ASIC Functional Analysis
*** END OF DOCUMENT ***