user Guide | UG:015
VI Chip® High Voltage BCM® Bus Converter 6123
Evaluation Board User Guide
Written by: Peter Makrum
Applications Engineer
November 2013
ContentsPage
Important Notice
1
IMPORTANT NOTICE:
Hazardous voltages are present on the HV BCM Evaluation Board under power.
Introduction1
PERSONAL CONTACT WITH LINE VOLTAGE MAY RESULT IN SEVERE INJURY, DISABILITY,
OR DEATH. IMPROPER OR UNSAFE HANDLING OF THIS BOARD MAY RESULT IN
SERIOUS INJURY OR DEATH.
Features2
Using the High Voltage
BCM Bus Converter 6123
Evaluation Board
+IN, -IN
3
+OUT, -OUT
5
Output Voltage
Measurement Jack (J104)
5
Input Current
Measurement
5
safely at high temperatures.
Output Current
Measurement
5
n Remove power and use caution when connecting and disconnecting test probes and interface lines to avoid inadvertent short circuits and contact with hot surfaces.
5
The list below is not comprehensive and is not a substitute for common sense and good practice.
n During operation, the power devices and surrounding structures can be operated Temperature Monitor (TM) 5
Enable Control (EN)
5
Auxiliary Voltage
Source (VAUX)
5
Input Filter Details
6
Thermal Considerations
7
Bill of Materials
9
Ordering Information
Read the precautions below entirely BEFORE using the HV BCM Evaluation Board. Do
not operate the evaluation board unless you have the appropriate safety precautions
in place on your bench to guarantee safety.
10
n When testing electronic products always use approved safety glasses. Follow good laboratory practice and procedures.
n Avoid creating ground loops when making measurements of the isolated input or output voltage.
n Care should be taken to protect the user from accidental contact when under power.
n Care should be taken to avoid reversing polarities if connecting to the opposite (solder) side of the board.
n The Customer Evaluation Board described in this document is intended to acquaint the reader with the benefits and features of high voltage distribution. They are not designed to be installed in end-use equipment.
n Refer to the specific HV BCM module data sheet for electrical details.
Introduction
This evaluation board offers a convenient means to evaluate the performance of
Vicor’s HV BCM Bus Converter 6123 and has been optimized for user convenience.
Refer to the appropriate data sheet for performance and operating limits. Data sheets
are available at vicorpower.com.
UG:015
vicorpower.com Applications Engineering: 800 927.9474
Page 1
Features
1. Underbelly cooling planes in addition to surface mounted heat sink
2. Input and output accommodation for a current probe wire loops
3. Input, output and signals Kelvin test point
4. Oscilloscope output voltage probe jack for voltage and ripple measurements
5. Input and output board-to-board connector footprint reserved for future use
6. Ring lug or solder connections
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vicorpower.com Applications Engineering: 800 927.9474
Page 2
UG:015
vicorpower.com Pin 3
Pin 2
Pin 3
Pin 1
H103
H104
H102
TM
EN
VAUX
TP104
TP105
SIGNAL CONNECTORS
750
0603
14695-7500
R107
0
-VIN
C103
38830-474
2220
0.47
-VIN
0805
LED SML-211UTT86
40058
D101
C102
38830-474
2220
0.47
0603
14695-00R0
0603
14695-00R0
R104 0
0603
14695-00R0
R105 0
R106
C101
38830-474
2220
0.47
LED INDICATOR
C100
0.47
2220
38830-474
R101
0
2010
21571-0R00
R102
0
2512
34727-00R0
3
2
1
3
2
1
D100
NP
H101
-VIN
TP101
TP100
+VIN
PRIMARY
i
-VIN
PRIMARY
i
J101
37783
CONN 3 POS WIRE TO BOARD SMD
J100
37783
CONN 3 POS WIRE TO BOARD SMD
C104
CAP_ALEL
40165-275
2.7
R103
NP
+VIN_EMI
H100
PS100
-OUT
+OUT
BCM380P475T1K2A30
C110
38830-474
2220
0.47
GND
C111
38830-474
2220
0.47
HS
40145
BOM, HEATSINK, PUSH PIN, LF 6123, 11MM
-VOUT
Applications Engineering: 800 927.9474
FID01
C112
38830-474
0.47
2220
+VOUT_EMI
FID02
H106
TP107
TP106
+VOUT
H105
-VIN
33292
J104
0
2512
34727-00R0
0
2512
34727-00R0
R111
R110
20
19
18
17
14 Power
Pins
15
16
J102B
13
+VIN
J103B
16
14 Power
Pins
15
13
17
18
19
20
-VOUT
39571
CONN 8+12 POS RIGHT ANGLE TERMINAL TH
+VOUT
-VOUT
+VOUT
Plated large Via both ends of resistor
allowing the use of a current probe.
POWER CONNECTOR TO MAIN BOARD
C107
C105
C106
C108
1uF
1uF
1uF
1uF
1206
1206
1206
1206
25185-105 25185-105 25185-105 25185-105
+VOUT_EMI
39571
CONN 8+12 POS RIGHT ANGLE TERMINAL TH
EMI GND / PCB BOTTOM HEATSINK
J109
-VOUT
SECONDARY
i
SECONDARY
i
EMI GND / PCB BOTTOM HEATSINK
C109
38830-474
2220
0.47
6123
-IN
+IN
VAUX
CL
EN
DA
HSGND
BCM ON/OFF CONTROL
SW100
SW TOGGLE SPDT 1 POS SMD
35919
-VIN
1
2
3
30276
1206
03203-3R65
L100
33336-2R2
IND 2.2uH 20% 14A
Pin 3
Pin 2
0603
15462-1001
HV BCM 6123
AD
TM
-VOUT
J108
+VOUT
J107
Eval Board Schematic
J106
F100
FUSE 5A 400VDC
+VIN
Plated large Via both ends of resistor
allowing the use of a current probe.
C113
0.01uF
0603
29400-103
TP103
Figure 1.
-VIN
J105
+VIN
R100
3.65
Pin 1
R112
1K
Using the High Voltage BCM® Bus Converter 6123 Evaluation Board
-VIN
+VIN_EMI
Page 3
Using the High Voltage BCM® Bus Converter 6123 Evaluation Board (Cont.)
Figure 2.
Eval Board Assembly Drawing
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Page 4
Using the High Voltage BCM® Bus Converter 6123 Evaluation Board (Cont.)
+ IN, –IN
Connect a high-quality, low-noise power supply to the +IN and –IN terminals of the
evaluation board. The interconnect leads should be capable of the rated DC current and
as short as possible. Additional capacitance may be required on the evaluation board to
compensate for impedances in the interconnect leads and source supply. It is important
to remember that noise from the source and voltage drops, will appear at the output
of the bus converter multiplied by its K factor. Test points +IN and –IN can be used to
monitor the input and are located on the PCB top left corner.
+ OUT, –OUT
An electronic or passive load could be connected to +OUT and –OUT terminals. Most
commercially available electronic loads do not have current slew rates capable of fully
exercising the BCM module. Test points +OUT and –OUT can be used to monitor the
output and are located on the PCB top right corner.
Output Voltage Measurement Jack (J104)
This connector is kelvin connected to the module output pins providing accurate
measurements of the output voltage ripple of the BCM module. Many types of scope
probes may be directly connected to this point.
Input Current Measurement
A current probe can be used when adding a wire loop to R102 side VIAs and removing
R102 resistor. Input bulk capacitor C104 is downstream of this measurement point.
Output Current Measurement
A current probe can be used when adding a wire loop to R110 and R111 side VIAs and
removing both R110 and R111 resistors.
Temperature Monitor (TM)
The BCM TM pin outputs a 250 kHz PWM signal. A 1 kΩ and a 10 nF low pass filter
precedes the TM test point for measurement simplicity.
Enable Control (EN)
Connecting the BCM EN pin to –IN will disable the module. SW100 can be used to
disable for convenience. During normal operation or while VIN is applied this pin will
be high if read using a DMM through the EN test point.
Auxiliary Voltage Source (VAUX)
The BCM VAUX can be used as a fault flag as well as an auxiliary 3.3 V up to 4 mA
current capability. An LED is placed on this pin indicating operation. A test point is
also provided.
UG:015
vicorpower.com Applications Engineering: 800 927.9474
Page 5
Input Filter Details
It is important to remember the fast response of most BCM® modules can readily show
the limitations of the source, load, and associated wiring connected to the evaluation
board. Care should be exercised to minimize stray source and load impedances in order
to fully exercise the module. The evaluation board is equipped with an input filter as
simulated in Figure 3.
Figure 3.
Eval Board Assembly Drawing
UG:015
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Page 6
Thermal Considerations
A fan blowing across the evaluation board and heat sink assembly is required during
operation. It is recommended to use a typical (4 x 4) inches fan (similar to an EBMPAPST 3212). It is recommended to place the evaluation board using the supplied
rubber feet about 0.4 inches off a flat surface. As per the example below, the board was
tested using a fan about 4 inches from the board. The maximum internal temperatures
of the BCM® at full rated power should remain below 80°C at 25°C ambient air.
Figure 4.
Double Side Cooling and Leads
Thermal Model
Thermal Resistance Top
1.24°C / W
MAX INTERNAL TEMP
Thermal Resistance Bottom
1.33°C / W
Power Dissipation (W)
TCASE_BOTTOM (°C)
Thermal Resistance Leads
7°C / W
+
–
TCASE_LEADS(°C)
+
–
TCASE_TOP(°C)
+
–
Figure 5.
Example Setup
Top airflow was measured above the edge of the midpoint of the output side of the PCB,
over the oscilloscope probe terminal. Bottom airflow was measured under the edge of
the midpoint of the output side of the PCB.
IR images were taken while evaluating several fans to guarantee full power operation
within data sheet thermal specification. Figure 6 shows one case where an off-the-shelf
fan “EBM-PAPSTJH3” was set to 12 VIN. The measured top airflow is 1,500 LFM and
bottom is 2,250 LFM. The internal temperature is estimated to be 66°C. Figure 7 shows
a top surface IR image max of 40°C. Figure 8 shows another case using the same fan
where VIN is set 6 V. In this case, the measured top airflow is 1,000 LFM and bottom is
1,750 LFM. The internal temperature is estimated to be 64°C. Figure 8 a top IR image
max of 44°C.
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vicorpower.com Applications Engineering: 800 927.9474
Page 7
Thermal Considerations (Cont.)
Figure 6.
IR with EBM-PAPSTJH3 Fan
Fan Input 12 V, Top 1,500 LFM,
Bottom 2,250 LFM
Figure 7.
IR image with EBM-PAPSTJH3 Fan
Fan Input 6 V, Top 1,000 LFM,
Bottom 1,750 LFM
UG:015
vicorpower.com Applications Engineering: 800 927.9474
Page 8
Bill of Materials
Table 1.
Reference
Designator
Description
Vicor Part Number
+IN, -IN, TM, EN, VAUX,
+OUT, -OUT
TEST POINT, SURFACE MOUNT
C100, C101, C102, C103, C109,
C110, C111, C112
CAP X7T 0.47 µF 10% 630 V 2,220
38830-474
27995
C104
CAP ALEL 2.7 µF 20% 500 V 8 x 10
40165-275
C105, C106, C107, C108
CAP X7R 1.0 µF 10% 100 V 1,206
25185-105
C113
CAP X7R 0.010 µF 10% 50 V 0603
29400-103
D101
LED SML-211UTT86 0805
40058
HARDWARE
BOM CONN KIT ARRAY EVAL BRD
26647
HS
BOM, ASSEMBLY, 6123 LF PUSH PIN HEAT SINK
40145
F100
FUSE 5 A 125 V PCD-5-R
30276
J100, J101
CONN 3 POS WIRE TO BOARD SMD
37783
J104
JACK VERTICAL MECH THRU HOLE
33292
L100
IND 2.2 µH 20% 14 A 2,525 0.095HT
33336-2R2
PAD1, PAD2, PAD3, PAD4
BUMPER, ADHESIVE-BACKED, RECESSED
38269
PCB
SNGLTD PCB 6123 CHIP HV BCM EVAL BRD
40059
R100
RES 3.65 Ω 1/4 W 1% 1,206
03203-3R65
R101
RES 0 Ω 3/4 W 5% 2,010
21571-0R00
R102, R110, R111
RES 0 Ω 2 W 2,512
34727-00R0
R104, R105, R106
RES 0 Ω JUMPER 1 A 0603
14695-00R0
R107
RES 750 Ω 1/10 W 5% 0603
14695-7500
R112
RES 1 kΩ 1/10 W 1% 0603
15462-1001
SW100
SW TOGGLE SPDT 1 POS SMD
UG:015
vicorpower.com Applications Engineering: 800 927.9474
35919
Page 9
Ordering Information
To order evaluation boards, substitute BCM with BCD in part number.
For any questions, comments or further design support, please contact your local
Field Applications Engineer.
Go to: http://www.vicorpower.com/contact-us for ordering information and application
support.
The Power Behind Performance
Rev 1.1
12/2013
vicorpower.com Applications Engineering: 800 927.9474
Page 10