4 Ω RON, Triple/Quad SPDT
±15 V/+12 V/±5 V iCMOS Switches
ADG1433/ADG1434
FUNCTIONAL BLOCK DIAGRAMS
ADG1433
S1A
D1
S1B
S3B
D3
S2B
S3A
D2
S2A
LOGIC
APPLICATIONS
Relay replacement
Audio and video routing
Automatic test equipment
Data acquisition systems
Temperature measurement systems
Avionics
Battery-powered systems
Communication systems
Medical equipment
GENERAL DESCRIPTION
IN1 IN2 IN3 EN
06181-001
4.7 Ω maximum on resistance @ 25°C
0.5 Ω on resistance flatness
Fully specified at ±15 V/+12 V/±5 V
3 V logic-compatible inputs
Up to 115 mA continuous current per channel
Rail-to-rail operation
Break-before-make switching action
16-/20-lead TSSOP and 4 mm × 4 mm LFCSP_VQ packages
SWITCHES SHOWN FOR
A 1 INPUT LOGIC.
Figure 1. ADG1433 TSSOP and LFCSP_VQ
ADG1434
S4A
S1A
D4
D1
S1B
S4B
IN1
IN4
IN2
IN3
The ADG1433 and ADG1434 are monolithic industrial CMOS
(iCMOS®) analog switches comprising three independently
selectable single-pole, double-throw (SPDT) switches and
four independently selectable SPDT switches, respectively.
S2B
S3B
All channels exhibit break-before-make switching action that
prevents momentary shorting when switching channels. An EN
input on the ADG1433 (LFCSP and TSSOP packages) and
ADG1434 (LFCSP package only) is used to enable or disable
the device. When disabled, all channels are switched off.
SWITCHES SHOWN FOR
A 1 INPUT LOGIC.
The iCMOS modular manufacturing process combines high
voltage, complementary metal-oxide semiconductor (CMOS),
and bipolar technologies. It enables the development of a wide
range of high performance analog ICs capable of 33 V operation
in a footprint that no other generation of high voltage parts has
been able to achieve. Unlike analog ICs using a conventional
CMOS process, iCMOS components can tolerate high supply
voltages while providing increased performance, dramatically
lower power consumption, and reduced package size.
The ultralow on resistance and on resistance flatness of these
switches make them ideal solutions for data acquisition and gain
switching applications, where low distortion is critical. iCMOS
construction ensures ultralow power dissipation, making the parts
ideally suited for portable and battery-powered instruments.
D3
D2
06181-002
S3A
S2A
Figure 2. ADG1434 TSSOP
ADG1434
S4A
S1A
D4
D1
S1B
S4B
S2B
S3B
D3
D2
S3A
S2A
LOGIC
IN1 IN2 IN3 IN4 EN
SWITCHES SHOWN FOR
A 1 INPUT LOGIC.
06181-101
FEATURES
Figure 3. ADG1434 LFCSP_VQ
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2009 Analog Devices, Inc. All rights reserved.
ADG1433/ADG1434
TABLE OF CONTENTS
Features .............................................................................................. 1 Absolute Maximum Ratings ............................................................7 Applications ....................................................................................... 1 Thermal Resistance .......................................................................7 General Description ......................................................................... 1 ESD Caution...................................................................................7 Functional Block Diagrams ............................................................. 1 Pin Configurations and Function Descriptions ............................8 Revision History ............................................................................... 2 Typical Performance Characteristics ........................................... 10 Specifications..................................................................................... 3 Test Circuits ..................................................................................... 13 ±15 V Dual Supply ....................................................................... 3 Terminology .................................................................................... 15 12 V Single Supply ........................................................................ 5 Outline Dimensions ....................................................................... 16 ±5 V Dual Supply ......................................................................... 6 Ordering Guide .......................................................................... 17 REVISION HISTORY
6/09—Rev. B to Rev. C
Updated Outline Dimensions ....................................................... 16
Changes to Ordering Guide .......................................................... 17
3/09—Rev. A to Rev. B
Change to IDD Parameter, Table 1 ................................................... 4
Change to IDD Parameter, Table 2 ................................................... 5
Updated Outline Dimensions, Figure 39..................................... 17
6/08—Rev. 0 to Rev. A
Added Continuous Current per Channel Parameter, Table 1 .....4
Added Continuous Current per Channel Parameter, Table 2 .....5
Added Continuous Current per Channel Parameter, Table 3 .....6
Changes to Table 4.............................................................................7
Changes to Figure 30...................................................................... 13
Updated Outline Dimensions ....................................................... 16
Changes to Ordering Guide .......................................................... 17
10/06—Revision 0: Initial Version
Rev. C | Page 2 of 20
ADG1433/ADG1434
SPECIFICATIONS
±15 V DUAL SUPPLY
VDD = +15 V ± 10%, VSS = –15 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On Resistance Match Between
Channels, ΔRON
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VIH
Input Low Voltage, VIL
Input Current, IIL or IIH
+25°C
−40°C to
+85°C
−40°C to
+125°C1
VSS to VDD
4
4.7
0.5
0.78
0.5
0.72
±0.04
±0.3
±0.04
±0.3
±0.05
±0.4
5.7
6.7
0.85
1.1
0.77
0.92
±0.6
±3
±0.6
±3
±0.8
±8
2.0
0.8
±0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS2
Transition Time, tTRANS
Break-Before-Make Time Delay, tD
3
140
170
40
200
230
30
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion, THD + N
140
170
60
75
−50
−70
−70
0.025
−3 dB Bandwidth
Insertion Loss
CS (Off )
CD (Off )
CD, CS (On)
200
0.24
12
22
72
tON (EN)
tOFF (EN)
200
230
85
90
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
MHz typ
dB typ
pF typ
pF typ
pF typ
Rev. C | Page 3 of 20
Test Conditions/Comments
VS = ±10 V, IS = −10 mA; see Figure 25
VDD = +13.5 V, VSS = −13.5 V
VS = ±10 V, IS = −10 mA
VS = ±10 V, IS = −10 mA
VDD = +16.5 V, VSS = −16.5 V
VD = ±10 V, VS = ±10 V; see Figure 26
VD = ±10 V, VS = ±10 V; see Figure 26
VS = VD = ±10 V; see Figure 27
VIN = VGND or VDD
RL = 100 Ω, CL = 35 pF
VS = 10 V, see Figure 28
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 10 V, see Figure 29
RL = 100 Ω, CL = 35 pF
VS = 10 V, see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 10 V, see Figure 30
VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 32
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 34
RL = 110 Ω, 15 V p-p, f = 20 Hz to 20 kHz, see
Figure 35
RL = 50 Ω, CL = 5 pF, see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 33
f = 1 MHz
f = 1 MHz
f = 1 MHz
ADG1433/ADG1434
Parameter
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C 1
0.001
1
±4.5/±16.5
μA typ
μA max
μA typ
μA max
μA typ
μA max
V min/max
40
40
mA max
mA max
1
IDD
260
ISS
0.001
475
VDD/VSS
Continuous Current per Channel2
ADG1433
ADG1434
1
2
115
100
75
65
Unit
Temperature range for Y version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. C | Page 4 of 20
Test Conditions/Comments
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VDD
Digital inputs = 5 V
Digital inputs = 0 V, 5 V, or VDD
GND = 0 V
VDD = +13.5 V, VSS = −13.5 V
ADG1433/ADG1434
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On Resistance Match Between
Channels, ΔRON
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
Drain Off Leakage, ID (Off)
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VIH
Input Low Voltage, VIL
Input Current, IIL or IIH
+25°C
−40°C to
+85°C
−40°C to
+125°C1
0 to VDD
6
8
0.55
0.82
1.5
2.5
±0.04
±0.3
±0.04
±0.3
±0.06
±0.4
9.5
11.2
0.85
1.1
2.5
2.8
±0.6
±3
±0.6
±3
±0.8
±8
2.0
0.8
±0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS2
Transition Time, tTRANS
Break-Before-Make Time Delay, tD
4
200
255
80
310
350
55
tON (EN)
tOFF (EN)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
−3 dB Bandwidth
Insertion Loss
CS (Off)
CD (Off)
CD, CS (On)
POWER REQUIREMENTS
IDD
210
270
70
86
−10
–70
–70
135
0.5
25
45
80
320
360
95
105
0.002
VDD
Continuous Current per Channel2
ADG1433
ADG1434
1
2
65
60
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
MHz typ
dB typ
pF typ
pF typ
pF typ
475
5/16.5
40
35
mA max
mA max
260
100
85
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
μA typ
μA max
μA typ
μA max
V min/max
1
IDD
Unit
Temperature range for Y version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. C | Page 5 of 20
Test Conditions/Comments
VS = 0 V to 10 V, IS = −10 mA, see Figure 25
VDD = 10.8 V, VSS = 0 V
VS = 0 V to 10 V, IS = −10 mA
VS = 0 V to 10 V, IS = −10 mA
VDD = 13.2 V
VS = 1 V/10 V, VD = 10 V/1 V, see Figure 26
VS = 1 V/10 V, VD = 10 V/1 V, see Figure 26
VS = VD = 1 V or 10 V, see Figure 27
VIN = VGND or VDD
RL = 100 Ω, CL = 35 pF
VS = 8 V, see Figure 28
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 8 V, see Figure 29
RL = 100 Ω, CL = 35 pF
VS = 8 V, see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 8 V, see Figure 30
VS = 6 V, RS = 0 Ω, CL = 1 nF, see Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 32
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 34
RL = 50 Ω, CL = 5 pF, see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 33
f = 1 MHz
f = 1 MHz
f = 1 MHz
VDD = 13.2 V
Digital inputs = 0 V or VDD
Digital inputs = 5 V
VSS = 0 V, GND = 0 V
VDD = +10.8 V, VSS = 0 V
ADG1433/ADG1434
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match Between
Channels (ΔRON)
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
Drain Off Leakage, ID (Off)
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VIH
Input Low Voltage, VIL
Input Current, IIL or IIH
+25°C
−40°C to
+85°C
−40°C to
+125°C1
VSS to VDD
7
9
0.55
0.78
1.5
2.5
±0.02
±0.3
±0.02
±0.3
±0.04
±0.4
10.5
12
0.91
1.1
2.5
3
±0.6
±3
±0.6
±3
±0.8
±8
2.0
0.8
±0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS2
Transition Time, tTRANS
Break-Before-Make Time Delay, tD
4
315
430
90
480
550
55
tON (EN)
tOFF (EN)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion, THD + N
−3 dB Bandwidth
Insertion Loss
CS (Off)
CD (Off)
CD, CS (On)
POWER REQUIREMENTS
IDD
325
425
150
200
−10
−70
−70
0.06
145
0.5
18
32
80
490
545
225
240
0.002
VDD/VSS
Continuous Current per Channel2
ADG1433
ADG1434
1
2
60
55
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
MHz typ
dB typ
pF typ
pF typ
pF typ
1
±4.5/±16.5
35
35
mA max
mA max
0.001
95
85
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
μA typ
μA max
μA typ
μA max
V min/max
1
ISS
Unit
Temperature range for Y version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. C | Page 6 of 20
Test Conditions/Comments
VS = ±4.5 V, IS = −10 mA, see Figure 25
VDD = +4.5 V, VSS = −4.5 V
VS = ±4.5 V, IS = −10 mA
VS = ±4.5 V, IS = −10 mA
VDD = +5.5 V, VSS = −5.5 V
VD = ±4.5 V, VS = ±4.5 V, see Figure 26
VD = ±4.5 V, VS = ±4.5 V, see Figure 26
VS = VD = ±4.5 V, see Figure 27
VIN = VGND or VDD
RL = 100 Ω, CL = 35 pF
VS = 5 V, see Figure 28
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 5 V, see Figure 29
RL = 100 Ω, CL = 35 pF
VS = 5 V, see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 5 V, see Figure 30
VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 32
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 34
RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz, see Figure 35
RL = 50 Ω, CL = 5 pF, see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 33
f = 1 MHz
f = 1 MHz
f = 1 MHz
VDD = +5.5 V, VSS = −5.5 V
Digital inputs = 0 V, 5 V, or VDD
Digital inputs = 0 V, 5 V, or VDD
GND = 0 V
VDD = +4.5 V, VSS = −4.5 V
ADG1433/ADG1434
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 4.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs, Digital Inputs1
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
Continuous Current, S or D2
Operating Temperature Range
Industrial (Y Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature (Pb-Free)
Rating
35 V
−0.3 V to +25 V
−25 V to +0.3 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
250 mA
Table 5.
Package Type
TSSOP
LFCSP_VQ
ESD CAUTION
Data + 15%
−40°C to +125°C
−65°C to +150°C
150°C
260 (+ 0 to −5)°C
Overvoltages at A, EN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
2
See data given in the Specifications section (see Table 1 to Table 3).
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
Rev. C | Page 7 of 20
θJA
150.4
30.4
θJC
50
N/A
Unit
°C/W
°C/W
ADG1433/ADG1434
14
EN
S1B 2
S2B 5
TOP VIEW
(Not to Scale)
D2 6
13
VSS
12
S3B
11
D3
7
10
S3A
IN2 8
9
IN3
S2A
S2B 3
D2 4
14 GND
ADG1433
TOP VIEW
(Not to Scale)
S2A 5
S1B 4
ADG1433
06181-003
D1 3
PIN 1
INDICATOR
12 EN
11 VSS
10 S3B
9 D3
NOTES
1. EXPOSED PAD IS TIED TO SUBSTRATE, VSS.
Figure 4. ADG1433 TSSOP Pin Configuration
06181-005
D1 1
IN3 7
IN1
S3A 8
GND
13 IN1
16 S1A
16
15
IN2 6
VDD 1
S1A 2
15 VDD
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 5. ADG1433 LFCSP_VQ Pin Configuration
Table 6. ADG1433 Pin Function Descriptions
Pin No.
TSSOP LFCSP_VQ
1
15
2
16
3
1
4
2
5
3
6
4
7
5
8
6
9
7
10
8
11
9
12
10
13
11
14
12
Mnemonic
VDD
S1A
D1
S1B
S2B
D2
S2A
IN2
IN3
S3A
D3
S3B
VSS
EN
15
16
IN1
GND
13
14
Description
Most Positive Power Supply Potential.
Source Terminal 1A. Can be an input or an output.
Drain Terminal 1. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Source Terminal 2B. Can be an input or an output.
Drain Terminal 2. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Logic Control Input 2.
Logic Control Input 3.
Source Terminal 3A. Can be an input or an output.
Drain Terminal 3. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground.
Active Low Digital Input. When high, the device is disabled and all switches are off. When low, INx
logic inputs determine the on switches.
Logic Control Input 1.
Ground (0 V) Reference.
Table 7. ADG1433 Truth Table
EN
1
0
0
INx
X
0
1
SxA
Off
Off
On
SxB
Off
On
Off
Rev. C | Page 8 of 20
D4
S1B 4
17
S4B
16
VDD
ADG1434
VSS 5
GND
TOP VIEW
(Not to Scale)
6
S2B 7
D2 8
15
NC
14
S3B
13
D3
9
12
S3A
IN2 10
11
IN3
S2A
NC = NO CONNECT
D1
S1B
VSS
GND
S2B
1
2
3
4
5
PIN 1
INDICATOR
ADG1434
TOP VIEW
(Not to Scale)
15
14
13
12
11
D4
S4B
VDD
S3B
D3
NOTES
1. EXPOSED PAD IS TIED TO SUBSTRATE, VSS.
Figure 6. ADG1434 TSSOP Pin Configuration
06181-006
18
20
19
18
17
16
S4A
D1 3
6
7
8
9
10
IN4
D2
S2A
IN2
IN3
S3A
20
19
06181-004
IN1 1
S1A 2
S1A
IN1
EN
IN4
S4A
ADG1433/ADG1434
Figure 7. ADG1434 LFCSP_VQ Pin Configuration
Table 8. ADG1434 Pin Function Descriptions
Pin No.
TSSOP LFCSP_VQ
1
19
2
20
3
1
4
2
5
3
6
4
7
5
8
6
9
7
10
8
11
9
12
10
13
11
14
12
15
N/A
16
13
17
14
18
15
19
16
20
17
N/A
18
Mnemonic
IN1
S1A
D1
S1B
VSS
GND
S2B
D2
S2A
IN2
IN3
S3A
D3
S3B
NC
VDD
S4B
D4
S4A
IN4
EN
Description
Logic Control Input 1.
Source Terminal 1A. Can be an input or an output.
Drain Terminal 1. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground.
Ground (0 V) Reference.
Source Terminal 2B. Can be an input or an output.
Drain Terminal 2. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Logic Control Input 2.
Logic Control Input 3.
Source Terminal 3A. Can be an input or an output.
Drain Terminal 3. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
No Connect.
Most Positive Power Supply Potential.
Source Terminal 4B. Can be an input or an output.
Drain Terminal 4. Can be an input or an output.
Source Terminal 4A. Can be an input or an output.
Logic Control Input 4.
Active Low Digital Input. When high, the device is disabled and all switches are off. When low, INx
logic inputs determine the on switches.
Table 9. ADG1434 TSSOP Truth Table
INx
0
1
SxA
Off
On
SxB
On
Off
Table 10. ADG1434 LFCSP_VQ Truth Table
EN
1
0
0
INx
X
0
1
SxA
Off
Off
On
SxB
Off
On
Off
Rev. C | Page 9 of 20
ADG1433/ADG1434
TYPICAL PERFORMANCE CHARACTERISTICS
7
VDD = +15V
VSS = –15V
TA = 25°C
6
ON RESISTANCE (Ω)
4
3
2
1
0
–16.5
VDD
VDD
VDD
VDD
VDD
= +15V, VSS = –15V
= +13.5V, VSS = –13.5V
= +12V, VSS = –12V
= +10V, VSS = –10V
= +16.5V, VSS = –16.5V
–12.5
–8.5
–4.5
5
4
3
2
1
–0.5
3.5
7.5
11.5
15.5
SOURCE OR DRAIN VOLTAGE (V)
0
–15
06181-007
ON RESISTANCE (Ω)
5
TA = +25°C
TA = +85°C
TA = –40°C
TA = +125°C
–10
–5
0
5
10
15
SOURCE OR DRAIN VOLTAGE (V)
06181-010
6
Figure 11. On Resistance as a Function of VD (VS) for Different Temperatures,
±15 V Dual Supply
Figure 8. On Resistance as a Function of VD (VS), Dual Supply
12
9
VDD = +5V
VSS = –5V
TA = 25°C
8
10
5
4
3
2
1
0
–7
VDD
VDD
VDD
VDD
–6
= +7V, VSS = –7V
= +5.5V, VSS = –5.5V
= +5V, VSS = –5V
= +4.5V, VSS = –4.5V
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
7
4
0
–5
TA = +25°C
TA = +85°C
TA = –40°C
TA = +125°C
–4
–3
–2
–1
0
1
2
3
4
5
SOURCE OR DRAIN VOLTAGE (V)
Figure 12. On Resistance as a Function of VD (VS) for Different Temperatures,
±5 V Dual Supply
Figure 9. On Resistance as a Function of VD (VS), Dual Supply
13
10
TA = 25°C
VSS = 0V
12
VDD = 12V
VSS = 0V
9
11
8
ON RESISTANCE (Ω)
9
8
7
6
5
4
2
1
0
VDD
VDD
VDD
VDD
VDD
= 12V
= 13.2V
= 10.8V
= 8V
= 5V
1
2
3
6
5
4
3
2
TA = +25°C
TA = +85°C
TA = –40°C
TA = +125°C
1
4
5
6
7
8
9
10
11
12
13
SOURCE OR DRAIN VOLTAGE (V)
Figure 10. On Resistance as a Function of VD (VS), Single Supply
0
06181-009
3
7
0
2
4
6
8
SOURCE OR DRAIN VOLTAGE (V)
10
12
06181-012
10
ON RESISTANCE (Ω)
6
2
SOURCE OR DRAIN VOLTAGE (V)
0
8
06181-011
ON RESISTANCE (Ω)
6
06181-008
ON RESISTANCE (Ω)
7
Figure 13. On Resistance as a Function of VD (VS) for Different Temperatures,
12 V Single Supply
Rev. C | Page 10 of 20
ADG1433/ADG1434
70
1600
ID, IS (ON) + +
1200
IS (OFF) + –
1000
IDD PER CHANNEL
TA = 25°C
60
50
800
IDD (µA)
600
40
30
400
20
IS (OFF) – +
200
10
0
20
40
60
80
100
120
TEMPERATURE (°C)
0
06181-013
2
0
10
12
14
200
VDD = +5V
1400 VSS = –5V
VBIAS = +4.5V/–4.5V
TA = 25°C
150
ID, IS (ON) + +
1200
CHARGE INJECTION (pC)
LEAKAGE CURRENTS (pA)
8
Figure 17. IDD vs. Logic Level
1600
1000
IS (OFF) + –
800
600
ID, IS (ON) – –
400
200
100
50
VDD = +5V
VSS = –5V
0
VDD = +12V
VSS = 0V
–50
–100
VDD = +15V
VSS = –15V
–150
0
IS (OFF) – +
20
40
60
80
100
120
–200
–15
06181-014
0
TEMPERATURE (°C)
–10
–5
0
5
10
15
VS (V)
Figure 15. Leakage Currents as a Function of Temperature, ±5 V Dual Supply
Figure 18. Charge Injection vs. Source Voltage
2000
350
VDD = 12V
1800 VSS = 0V
VBIAS = 1V/10V
1600
300
ID, IS (ON) + +
1400
250
TIME (ns)
ID, IS (ON) – –
1200
1000
800
IS (OFF) + –
600
VDD = +5V
VSS = –5V
VDD = +12V
VSS = 0V
200
150
VDD = +15V
VSS = –15V
100
400
200
50
0
IS (OFF) – +
0
20
40
60
80
100
120
TEMPERATURE (°C)
06181-020
–200
6
LOGIC, INx (V)
Figure 14. Leakage Currents as a Function of Temperature, ±15 V Dual Supply
–200
4
06181-016
–200
VDD = +5V
VSS = –5V
06181-015
ID, IS (ON) – –
0
LEAKAGE CURRENTS (pA)
VDD = +15V
VSS = –15V
VDD = +12V
VSS = 0V
Figure 16. Leakage Currents as a Function of Temperature,
12 V Single Supply
0
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 19. Transition Time vs. Temperature
Rev. C | Page 11 of 20
120
06181-017
LEAKAGE CURRENTS (pA)
VDD = +15V
1400 VSS = –15V
VBIAS = +10V/–10V
ADG1433/ADG1434
0
LOAD = 110Ω
TA = 25°C
0.09
0.08
–30
0.07
THD + N (%)
–40
–50
–60
–70
VDD = +5V, VSS = –5V, VS = +5V p-p
0.06
0.05
0.04
0.03
–80
–90
0.02
–100
0.01
–110
1k
10k
100k
1M
10M
100M
1G
FREQUENCY (Hz)
VDD = +15V, VSS = –15V, VS = +15V p-p
0
10
06181-018
OFF ISOLATION (dB)
–20
0.10
VDD = +15V
VSS = –15V
TA = 25°C
10k
100k
Figure 23. THD + N vs. Frequency
0
–20
1k
FREQUENCY (Hz)
Figure 20. Off Isolation vs. Frequency
–10
100
06181-032
–10
0
VDD = +15V
VSS = –15V
TA = 25°C
–20
VDD = +15V
VSS = –15V
TA = 25°C
V p-p = 0.63V
–40
–40
ACPSRR (dB)
CROSSTALK (dB)
–30
–50
–60
–70
NO DECOUPLING
CAPACITORS
–60
–80
–80
–90
DECOUPLING
CAPACITORS
ON SUPPLIES
–100
10k
100k
1M
10M
100M
1G
FREQUENCY (Hz)
Figure 21. Crosstalk vs. Frequency
0
–1.5
–2.0
–2.5
–3.0
–3.5
1k
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
06181-100
ON RESPONSE (dB)
–1.0
–4.0
100
1k
10k
100k
FREQUENCY (Hz)
Figure 24. ACPSRR vs. Frequency
VDD = +15V
VSS = –15V
TA = 25°C
–0.5
–120
100
Figure 22. On Response vs. Frequency
Rev. C | Page 12 of 20
1M
10M
06181-035
–110
1k
06181-019
–100
ADG1433/ADG1434
TEST CIRCUITS
V
A
D
IDS
D
Figure 26. Off Leakage
ID (ON)
D
NC = NO CONNECT
A
VD
06181-023
S
NC
Figure 27. On Leakage
VDD
VSS
VIN
50%
50%
VIN
50%
50%
VSS
VDD
SB
VS
0.1µF
D
SA
VOUT
RL
100Ω
IN
CL
35pF
90%
90%
VOUT
tON
tOFF
06181-024
GND
VIN
Figure 28. Switching Timing
0.1µF
VDD
VSS
VDD
VSS
SB
VS
0.1µF
VIN
D
SA
VOUT
RL
100Ω
IN
VOUT 80%
CL
35pF
tBBM
GND
tBBM
06181-025
VIN
Figure 29. Break-Before-Make Delay, tD
VDD
VSS
VDD
VSS
0.1µF
3V
ENABLE
DRIVE (VIN)
ADG1433
INx
S1A
INx
S1B
VS
VIN
VOUT
D1
EN
GND
50%
0V
VOUT
INx
50Ω
50%
RL
100Ω
CL
35pF
OUTPUT
0V
Figure 30. Enable Delay, tON (EN), tOFF (EN)
Rev. C | Page 13 of 20
tOFF (EN)
0.9VOUT
tON (EN)
0.9VOUT
06181-026
0.1µF
A
VD
Figure 25. On Resistance
0.1µF
ID (OFF)
VS
06181-021
VS
S
06181-022
IS (OFF)
S
ADG1433/ADG1434
VS
VDD
VSS
VDD
VSS
0.1µF
VIN (NORMALLY
CLOSED SWITCH)
SB
D
NC
SA
CL
1nF
IN
VOUT
OFF
VIN (NORMALLY
OPEN SWITCH)
VOUT
GND
VIN
ON
ΔVOUT
QINJ = CL × ΔVOUT
06181-027
0.1µF
Figure 31. Charge Injection
VDD
VDD
VSS
NC
SB
SA
NETWORK
ANALYZER
NETWORK
ANALYZER
VSS
VOUT
50Ω
VDD
SA
RL
50Ω
50Ω
D
SB
VS
D
VIN
GND
OFF ISOLATION = 20 log
VOUT
VOUT
VS
VDD
VDD
0.1µF
VSS
0.1µF
0.1µF
VDD
VSS
SA
SB
VOUT
VS
Figure 34. Channel-to-Channel Crosstalk
VSS
0.1µF
GND
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
Figure 32. Off Isolation
R
50Ω
IN
VS
06181-028
RL
50Ω
VSS
NETWORK
ANALYZER
NC
06181-030
VDD
IN
0.1µF
0.1µF
0.1µF
IN
VSS
0.1µF
AUDIO PRECISION
VDD
50Ω
50Ω
VSS
RS
S
VS
VS
V p-p
IN
D
RL
50Ω
GND
D
VIN
INSERTION LOSS = 20 log
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
06181-029
GND
RL
110Ω
Figure 33. Bandwidth
Figure 35. THD + Noise
Rev. C | Page 14 of 20
VOUT
06181-031
VIN
VOUT
ADG1433/ADG1434
TERMINOLOGY
tBBM
Off time measured between the 80% point of both switches
when switching from one address state to another.
RON
Ohmic resistance between Terminal D and Terminal S.
ΔRON
The difference between the RON of any two channels.
RFLAT(ON)
The difference between the maximum and minimum value of
on resistance as measured.
VIL
Maximum input voltage for Logic 0.
VIH
Minimum input voltage for Logic 1.
IS (Off)
Source leakage current when the switch is off.
IIL (IIH)
Input current of the digital input.
ID (Off)
Drain leakage current when the switch is off.
IDD
Positive supply current.
ID, IS (On)
Channel leakage current when the switch is on.
ISS
Negative supply current.
VD (VS)
Analog voltage on Terminal D and Terminal S.
Off Isolation
A measure of unwanted signal coupling through an off channel.
CS (Off)
Channel input capacitance for off condition.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
CD (Off)
Channel output capacitance for off condition.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
CD, CS (On)
On switch capacitance.
On Response
The frequency response of the on switch.
CIN
Digital input capacitance.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
tON (EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
tTRANS
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
AC Power Supply Rejection Ratio (ACPSRR)
A measure of the ability of a part to avoid coupling noise
and spurious signals that appear on the supply voltage pin
to the output of the switch. The dc voltage on the device is
modulated by a sine wave of 0.62 V p-p. The ratio of the
amplitude of signal on the output to the amplitude of the
modulation is the ACPSRR.
Rev. C | Page 15 of 20
ADG1433/ADG1434
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.30
0.19
0.65
BSC
0.20
0.09
SEATING
PLANE
COPLANARITY
0.10
0.75
0.60
0.45
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.00
BSC SQ
0.60 MAX
12 13
3.75
BSC SQ
TOP VIEW
12° MAX
1.00
0.85
0.80
SEATING
PLANE
4
9
8
2.65
2.50 SQ
2.35
5
0.25 MIN
1.95 BCS
0.80 MAX
0.65 TYP
0.30
0.23
0.18
1
16
EXPOSED
PAD
0.65
BSC
PIN 1
INDICATOR
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-13)
Dimensions shown in millimeters
Rev. C | Page 16 of 20
031006-A
PIN 1
INDICATOR
0.50
0.40
0.30
ADG1433/ADG1434
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
0.30
0.19
COPLANARITY
0.10
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.60 MAX
4.00
BSC SQ
0.60 MAX
15
PIN 1
INDICATOR
20
16
1
PIN 1
INDICATOR
3.75
BSC SQ
0.50
BSC
2.65
2.50 SQ
2.35
EXPOSED
PAD
(BOTTOM VIEW)
5
1.00
0.85
0.80
12° MAX
0.80 MAX
0.65 TYP
0.30
0.23
0.18
SEATING
PLANE
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
10
6
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
0.50
0.40
0.30
TOP VIEW
11
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG1433YRUZ 1
ADG1433YRUZ-REEL1
ADG1433YRUZ-REEL71
ADG1433YCPZ-REEL1
ADG1433YCPZ-REEL71
ADG1434YRUZ1
ADG1434YRUZ-REEL1
ADG1434YRUZ-REEL71
ADG1434YCPZ-REEL1
ADG1434YCPZ-REEL71
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Z = RoHS Compliant Part.
Rev. C | Page 17 of 20
EN Pin
Yes
Yes
Yes
Yes
Yes
No
No
No
Yes
Yes
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-20
RU-20
RU-20
CP-20-4
CP-20-4
ADG1433/ADG1434
NOTES
Rev. C | Page 18 of 20
ADG1433/ADG1434
NOTES
Rev. C | Page 19 of 20
ADG1433/ADG1434
NOTES
©2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06181-0-6/09(C)
Rev. C | Page 20 of 20