LECTURE SUPPLEMENT #05 Bipolar Junction Transistor Models And Biasing Circuits Dr. John Choma Professor of Electrical Engineering University of Southern California Ming Hsieh Department of Electrical Engineering University Park: Mail Code: 0271 Los Angeles, California 90089–0271 213–740–4692 [USC Office] 213–740–7581 [USC Fax] 818–384–1552 [Cell] johnc@usc.edu PRELUDE: In this chapter, we develop the circuit level models and study the associated volt-ampere characteristics of the bipolar junction transistor. Although these models are not definitively derived, the physical properties on which they are premised are discussed in a largely qualitative fashion that exploits many of the arguments set forth in the preceding chapter on semiconductor PN junction diodes. The models and their engineering implications are then used to forge practical network topologies and corresponding design guidelines for bipolar technology biasing circuits. September 2009/January 2011 Lecture Supplement #05 BJT Models & Biasing J. Choma 3.1.0. INTRODUCTION The successful realization of reliable and reproducible analog signal processing networks boasting predictable I/O performance measures relies strongly on the availability of meaningful and mathematically tractable circuit level models for the device technologies utilized in these networks. The electrical properties that these models are called upon to emulate include both the static and dynamic volt-ampere characteristics of the devices, as well as the impact exerted on these characteristics by device operating temperature. The formulation and application of accurate models capable of relating observable electrical performance to pertinent physical phenomenology comprise daunting challenges in light of the complexities of semiconductor device physics and the vagarious nature of device processing. While the use of supremely accurate device models can be relegated to definitive computer-aided circuit investigations, the models exploited by circuit designers in pre-computer design-oriented analyses must nonetheless be sufficiently comprehensive to convey an insightful understanding of the performance attributes and limitations of the device technologies and circuit topologies of interest. In this chapter, we focus our attention on the silicon monolithic bipolar junction transistor (BJT). Our circuit level ruminations are directed toward understanding BJT performance limitations at high signal frequencies and efficient and reliable BJT biasing for linear signal processing applications. E − Ve − Vb + + + − − Ve + C Vc E Emitter (N+) B E + Ve + Vb − − − + Vc − Base (P) Collector (N) C Xw B + (a). Xe Xb Xc E Emitter (P+) Base (N) Collector (P) C Vc Xw − Vc + + Ve − B C B (b). Figure (3.1). (a). Schematic symbol and simplified cross section of the NPN bipolar junction transistor (BJT). (b). Schematic symbol and simplified physical abstraction of the PNP BJT. The cross section diagrams are not drawn to scale. BJTs are available in two flavors. We display the schematic symbol and simplified cross section abstraction of the NPN bipolar junction transistor, which is the principle type utilized in the signal flow paths of broadband analog networks, in Figure (3.1a), and we diagram its PNP transistor counterpart in Figure (3.1b). In each of these devices, a bipolar junction transisMing Hsieh Department of Electrical Engineering - 350 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma tor is seen as an amalgam of two PN junction diodes, which suggests immediately that the time devoted to studying the PN junction diode in the preceding chapter pays dividends in the process of forging an understanding of BJT operation. As is evident in the figure at hand, one of the two diodes implicit to a BJT is formed by the emitter and base semiconductor volumes, while the other is fashioned by the collector and base regions. In each of the transistors depicted in Figure (3.1), the emitter region is very heavily doped to an impurity concentration approaching the solid solubility limit of silicon; that is, the doping concentration is very near to the maximum that can be received by silicon. The average dopant concentration of the base layer is typically five to six orders of a magnitude less than that of the emitter, while the collector is doped to an impurity concentration that is one or two orders of a magnitude less than that of the base. For minimal geometry transistors intended for high frequency circuit applications, the emitter length, Xe, is generally under a micron, the base width, Xb, is two-tenths of a micron or smaller, and the collector length, Xc, is often as large as tens of microns. On the other hand, the feature thickness, Xw, of the transistor is generally under a micron, and the thickness, say Wb (dimension perpendicular to the page face), which is a designable geometric parameter in integrated circuit design, is at least as large as Xw. In monolithic technologies, the geometric parameter, Wb, is commonly referred to as the emitter finger length. The PN junction diode studied in the preceding chapter is a two-terminal element for which only a single current and a single voltage are available to define its volt-ampere properties. In contrast, the BJT is fundamentally a three-terminal device (actually four terminals in its monolithic embodiment) for which two independent voltages and two independent currents are required for a satisfying characterization of its observable electrical behavior. In the NPN structure of Figure (3.1a), one of the two independent current variables is the emitter current, Ie, which is displayed as a positive current flowing out of the transistor. Positive collector current and base current, Ic and Ib, respectively, flow into the device. On the other hand, the PNP unit shows positive emitter current as flowing into the transistor and positive collector and base currents flowing out of the device. In both cases, Kirchhoff happily radiates Ie = I c + Ib , (3-1) which affirms that only two of the three transistor terminal currents are independent electrical variables. The diagrams in Figure (3.1) also delineate an internal base-emitter junction voltage, Ve, and an internal base-collector junction voltage, Vc. Both of these voltages are interpreted as positive variables when the potential on the p-side of the applicable junction is larger than the potential on the n-side. The resultant internal collector to emitter voltage, Vb, of the NPN transistor is Vb = Ve − Vc . (3-2) An identical voltage relationship applies for the emitter to collector voltage of the PNP device. 3.2.0. EBERS-MOLL MODEL To first order, the static volt-ampere characteristics of either an NPN or a PNP bipolar junction transistor abide by the Ebers-Moll relationships[1], I c = I cc − I rr − I bc (3-3) , I b = I be + I bc Ming Hsieh Department of Electrical Engineering - 351 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing which by (3-1) implies an emitter current, Ie, of I e = I cc − I rr + I be . In (3-3), current Icc is given by ( Ve n f VT I cc = Ae J s e ) ( Ve n f VT − 1 = Is e J. Choma (3-4) ) −1 , (3-5) where Ae = Wb X w (3-6) is the injection area of the base-emitter junction. Like the injection area of a PN junction diode, Ae is the cross section area pierced by mobile charge carriers that are motivated to penetrate the junction interface between the emitter and base volumes. Continuing with (3-5), Js is the saturation current density of the transistor, Is = AeJs is the corresponding saturation current, nf is the injection coefficient of the base-emitter junction, and kT j VT = (3-7) q is the familiar Boltzmann voltage, with Tj representing the absolute temperature of the base-emitter junction. The saturation current density, Js in (3-5), and hence the effective saturation current, Is, is strongly affected by the operating temperature of the junction. As witnessed in conjunction with PN junction diodes, the numerical value of Js nominally doubles to quadruples for each ten degree centigrade rise in operating temperature. The current component, Icc, in (3-3), (3-4), and (3-5) is known as the forward transport current of the BJT. When the base-emitter junction of an NPN device is suitably forward biased (Ve > 0), electrons from the emitter are injected into the base region. In tandem with this electron transport, holes are similarly injected from the base to the emitter. However, the junction current manifested by injected holes is significantly smaller than is the junction current arising from injected electrons because the emitter region is doped to a concentration that is far larger than the impurity concentration to which the base volume is doped. The phrase, “suitably forward biased,” is taken to mean that in addition to the requirement of a positive junction voltage, Ve must be at least as large as the turn on or threshold voltage, Veon, of the base-emitter junction. We recall that for a junction of p-type and n-type silicon semiconductors, this threshold voltage is of the order of 700 mV. Our tacit study of (3-3) and (3-4) confirms that Icc is a component of collector current Ic and emitter current Ie, but it does not contribute to base current Ib. We can therefore logically attribute the forward transport current of an NPN transistor to those electrons that are injected into the base region from the emitter site and thence swept from the base into the collector. Since those electrons manifesting current Icc through their injection into the base are swept out of the base and into the collector, no net charge perturbation is evidenced in the base. Accordingly, the physical mechanisms contributing to the establishment of the forward transport current, Icc, do not influence the measurable base current, Ib. The transport from emitter to collector of injected minority carriers in the base is rendered plausible and likely by the relatively low impurity concentration and narrowness of the base region. In particular, low base region doping tends to bound the level to which base region holes can recombine with injected electrons therein. There simply are insufficient numbers of free base region holes to recombine with a large percentage of injected electrons. Such global transport is further encouraged by the built-in potential developed at the base collector junction, which effectively acts as an intrinsic junction reverse bias. This potential gives rise to an intrinMing Hsieh Department of Electrical Engineering - 352 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma sic field, directed from the collector to the base, which attracts minority carriers (electrons in an NPN device) within the narrow confines of the base volume. An additional reverse bias (Vc < 0) imposed by external means across the base-collector junction serves to further promote the likelihood of emitter to collector charge transport through the base. Although the recombination of injected electrons with base region holes in an NPN transistor is discouraged because of the relatively low dopant concentration in, and narrowness of, the base, a small percentage of these injected minority carriers nevertheless succumb to recombination. The current arising from this recombination mechanism, which contributes directly to only the observable emitter and base currents of the subject transistor, is Ibe, which is given by I AJ I V n V V n V I be = cc = e s e e f T − 1 = s e e f T − 1 . (3-8) βf βf βf ( ) ( ) In this relationship, βf, the forward short circuit (meaning Vc = 0) base to collector current transfer ratio, is generally of the order of one hundred (greater than 100 in BJTs fabricated as a silicon-germanium heterostructure). In effect, the forward recombination current, Ibe, reflects those injected carriers that are “lost” in the base in the sense of reducing the number of injected carriers available for ultimate transport into the collector. For example, the implication of βf = 100 is that 99% of electrons injected into the base from the emitter escape a recombination fate and are successfully transported to the collector. The fact that the form of (3-8) mirrors the static volt-ampere relationship of a traditional diode is hardly surprising in that the emitter and base volumes shown in Figure (3.1) coalesce to form a classic PN junction diode. The effective saturation current of this intrinsic diode is Is/βf. Returning to (3-3) and (3-4), the current component, Irr, is given by ) ( ) ( I rr = Ae J s eVc nrVT − 1 = I s eVc nrVT − 1 , (3-9) while current Ibc is AJ I I I bc = rr = e s eVc nrVT − 1 = s eVc nrVT − 1 . (3-10) βr βr βr With Vc ≥ Vcon, the threshold voltage of the base-collector junction diode, majority carriers in the collector region are injected into the base region where they become minority carriers. Recombination in this so-called reverse direction is more probable than in the formerly considered forward direction because the base region is doped to a higher impurity concentration than is the collector. Current Ibc is a measure of this reverse recombination phenomena. Parameter βr is the reverse short circuit (meaning Ve = 0) base to emitter current transfer ratio. Owing to the likelihood of enhanced recombination in reverse operation, βr is substantially smaller than is its forward counterpart, βf. The current, Irr, represents the effects of collector-injected minority carriers that are swept from the base into the emitter by the built-in potential at the base-emitter junction or by an imposed reverse bias therein. In (3-9) and (3-10), nr is the injection coefficient of the base-collector PN junction. Generally, nr and nf in (3-5) and (3-9) are taken as identical constants that are only slightly larger than unity. ( ) ( ) Similar statements can be advanced for the current components, Icc, Irr, Ibe, and Ibc, of a PNP bipolar junction transistor. In the PNP device case, Icc and Irr are measures of injected holes that are transported from emitter to collector and from collector to emitter, respectively. As with NPN devices, Ibe represents the recombination current, which in the PNP case is attributed to base region electrons that recombine with holes injected from the emitter. On the other hand, Ibc Ming Hsieh Department of Electrical Engineering - 353 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma is the recombination current arising from base region electrons that recombine with holes injected from the collector. It is worth our underscoring that each of the four current components in the Ebers-Moll model of a bipolar junction transistor is directly proportional to the saturation current density, Js. Recall that Js increases dramatically with the operating temperature of the base-emitter junction. Thus, all three transistor currents −emitter current Ie, collector current Ic, and base current Ib− are vulnerable to device temperature increases if the base-emitter and base-collector junction potentials, Ve and Vc, respectively, are held fast over temperature. The flip side of this argument is that acceptable temperature stability in bipolar networks mandates designs for which Ve and/or Vc are allowed to decrease to compensate for the increased current ramifications of junction temperature increases. Additionally, it should be noted that all of the Ebers-Moll current components are directly proportional to the base-emitter junction area, Ae, just as the current flowing through a PN junction diode is proportional to its injection area. This circumstance means that for fixed values of the junction potentials, Ve and Vc, the emitter, base, and collector currents scale linearly with base-emitter junction area. Assume, for example, that the second of two identical transistors has a junction area that is K-times that of the first transistor and that both transistors are excited by equivalent base-emitter and base-collector junction potentials. Both transistors therefore exhibit the same current densities despite the fact that the second transistor conducts emitter, base, and collector currents that are respectively K-times larger than the corresponding currents of the first device. Since the internal self-heating caused by current conduction is intimately related to current density, as opposed to actual current level, the proper scaling of monolithic transistors can circumvent performance problems that may be incurred by excessive on-chip thermal gradients. In short, fat transistors are needed when large currents must be conducted, just as thick wires are required to power high current appliances, such as microwave ovens and electric clothes dryers. Base + Ib + Collector Base Vb Ib Ve Ve Ie − Ibc + + − Ibe Ic − + DBC Ic DBE Icc Irr Vb Ie − Collector − Emitter Emitter (a). Ic Ib − − Vb Ve Ve + Ibc − Ie + + Ibe Ic + − DBC Base − Ib Base Collector DBE Icc Ie Emitter Collector Irr Vb + Emitter (b). Figure (3.2). (a). Ebers-Moll model of the NPN bipolar junction transistor. (b). Ebers-Moll model of the PNP bipolar junction transistor. Ming Hsieh Department of Electrical Engineering - 354 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma 3.2.1. EBERS-MOLL MODEL INTERPRETATION In consideration of the fact that both the base-emitter and base-collector junctions of a BJT are PN junction diodes, the circuit level interpretation of (3-3) and (3-4) are the NPN and PNP model topologies offered in Figure (3.2). In these topologies, diode DBE represents the base-emitter junction diode, while DBC identifies the base-collector junction diode. A trivial model modification, which derives from (3-8) and (3-10) appears in Figure (3.3). In particular, (3-8) shows that the forward transport current, Icc, can be written as Icc = βfIbe. The forward transport component, Icc, of the collector current can therefore be represented as a current controlled current source controlled by the forward base recombination current, Ibe, which is conducted by diode DBE. Analogously, (3-10) implies Irr = βrIbc, thereby suggesting that the reverse transport component, Irr, of the collector current can be represented as a current controlled current source controlled by the reverse component of the base recombination current, Ibc, which is the current flowing through diode DBC. Base + Ib + Collector Base Vb Ib Ve Ve Ie − Ibc + + − Ibe Ic − + DBC Ic DBE βf Ibe βr Ibc Vb Ie − Collector − Emitter Emitter (a). Ic Ib Ibc − − − Vb Ve Ve + Ib Ie + + Ibe Ic + − DBC Base − Base Collector DBE βf Ibe Ie Emitter Collector βr Ibc Vb + Emitter (b). Figure (3.3). (a). Alternative Ebers-Moll model of the NPN bipolar junction transistor. Alternative Ebers-Moll model of the PNP bipolar junction transistor. (b). It is instructive to study the Ebers-Moll equations for the two special cases of Ve = 0 and Vc = 0. For example, with Vc = 0, (3-9) and (3-10) give Irr = 0 and Ibc = 0, whence by (3-3) and (3-4), I b = I be I c = I cc = β f I be = β f I b I e = I cc + I be = ( β f + 1) Ibe . = (3-11) ( β f + 1) I b Equation (3-11) gives rise to the circuit interpretation we submit in Figure (3.4a), where the voltage, Ve, of the indicated battery is presumed larger than the threshold voltage of the base-emitter PN junction in order to support measurable emitter and base currents in the transistor. This model underscores the logic of referring to parameter βf as a short circuit (Vc = 0) base to Ming Hsieh Department of Electrical Engineering - 355 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma collector current transfer ratio in that the ratio, Ic/Ib, of collector to base currents in the subject circuit is clearly βfIbe/Ibe = βf. we note a resultant ratio of collector current to emitter current of βf Ibe βr Ibc Ibe Ibc + + Ve Vc (βf +1)Ibe − (βr +1)Ibc − (a). (b). Figure (3.4). (a). An NPN bipolar junction transistor operated with a forward biased base-emitter junction and a short circuited base-collector junction. Voltage Ve is presumed to be at least as large as the threshold voltage of the base-emitter diode. (b). An NPN bipolar junction transistor operated with a forward biased base-collector junction and a short circuited base-emitter junction. Voltage Vc is at least as large as the threshold voltage of the base-collector diode. βf Ic = αf , (3-12) I e V =0 βf +1 c where parameter αf is commonly referred to as the short circuit emitter to collector current transfer ratio. This parameter is a measure of the extent of forward recombination in that (3-12) makes clear that the amount of emitter current that is not observed as collector current and is therefore “lost” in recombination, is (1−αf)Ie. For large βf and therefore for αf approaching unity, forward recombination in the base is minimal. On the other hand, with Ve = 0, Icc in (3-5) and Ibe in (3-8) are null and resultantly, I b = I bc (3-13) I c = − I rr − I bc = − ( βr + 1) I bc = − ( βr + 1) I b . I e = − I rr = − βr I bc = − βr I b The last result begets the circuit level representation in Figure (3.4b) in which the voltage, Vc, applied from the base to the collector is presumed to be at least as large as Vcon, the threshold voltage of the base-collector diode. In the circuit diagram at hand, parameter βr is recognized as the magnitude of the base to emitter current transfer ratio. The indicated positive value of the applied voltage Vc serves to inject carriers from the collector to the emitter. Many of these injected carriers recombine with holes in the base, while others are transported to the emitter to manifest the current, −βrIb. The resultant ratio of emitter current to collector current is Ie βr = αr . (3-14) I c V =0 βr + 1 e Ming Hsieh Department of Electrical Engineering - 356 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Since βr is of the order of one, at least half of the aforementioned injected carrier population is lost to recombination within the base volume. In (3-4), parameter αr is the short circuit collector to emitter current transfer ratio. 3.2.1.1. Forward Active Operation A bipolar junction transistor is said to operate in its forward active, or linear active, regime when its base-emitter junction voltage exceeds the threshold potential (Ve ≥ Veon) of the base-emitter junction and its base-collector voltage is non-positive (Vc ≤ 0); that is the basecollector junction operates at either zero bias or is reverse biased by external means. The transistors in almost all bipolar technology circuits that are designed to operate as acceptable approximations of linear networks are biased in this operating domain. For Ve ≥ Veon and Vc ≤ 0, it is instructive to cast the collector current, Ic, in (3-3) as I c = β f I be − ( βr + 1) I bc = β f I b − β f + βr + 1 I bc . (3-15) ( ) Recalling (3-10), ) ) ⎛ β f + βr + 1 ⎞ V nV V nV Ic = β f Ib − ⎜ ⎟ Ae J s e c r T − 1 = β f I b − I co e c r T − 1 , (3-16) βr ⎝ ⎠ ( ( where ⎛ β f + βr + 1 ⎞ (3-17) I co ⎜ ⎟ Ae J s β r ⎝ ⎠ is termed the collector leakage current. Specifically, Ico is the collector current fashioned by an open circuited base (Ib = 0) and a base-collector junction that is strongly reverse biased (Vc << 0). This current is small since it derives from the minority carrier injection across the basecollector junction that strong reverse junction biasing promotes. There are at least two interesting aspects to (3-16). First, for Vc ≤ 0, Ic ≈ β f I b + I co ≈ β f I b , (3-18) Vc ≤0 Base Ib Ve + − Ic + Vc ≤ 0 − Ibe + Collector Base Ib − DBE βf Ib Vb Ie − Ve + Ic − Vc ≤ 0 + Ibe − DBE βf Ib Vb Ie Emitter (a). Collector + Emitter (b). Figure (3.5). (a). Approximate equivalent circuit of an NPN BJT for the case in which the base-emitter junction voltage, Ve, is at least as large as the threshold voltage, Veon, of the junction, and the base-collector junction voltage, Vc, is negative or no larger than zero. (b). Approximate equivalent circuit of a PNP BJT for the case in which Ve is at least as large as the threshold voltage of the junction, and Vc is negative or no larger than zero. which suggests that to the extent that parameter βf is a constant and Ico << βfIb, the collector current of a BJT operated in the forward active region is directly proportional to its base current; that is, the BJT emulates input base current to output collector current linearity. To this end, the BJT might be modeled for Vc ≤ 0 by the simple equivalent circuits postured in Figure (3.5). Ming Hsieh Department of Electrical Engineering - 357 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Moreover, since βf is a transistor metric that is significantly greater than one, the linearity between base and collector currents that is inferred by (3-18) establishes a vehicle for the realization of I/O gain from an input base port to an output collector port. A second point pertinent to (3-18) is that for Vc ≤ 0, current Ibc in (3-10) is essentially zero, which means that the forward recombination current, Ibe, dominantly determines the observed base current, Ib. Accordingly, (3-8) and (3-10) combine to yield Ic ( Ve n f VT ≈ β f I b ≈ β f I be = I cc = Ae J s e Vc ≤0 ) ( Ve n f VT − 1 = Is e ) −1 . (3-19) The last result is interesting in that it shows that in the forward active region, the collector current of a BJT is determined almost exclusively by the base-emitter junction voltage, Ve. Actually, since Ic ≈ Icc ≈ βfIbe, Ib ≈ Ibe, and Ie ≈ Icc + Ibe = (βf +1)Ibe for Vc ≤ 0, all three transistor currents, as opposed to the collector current alone, are determined almost exclusively by voltage Ve. This state of affairs is cause for jubilation since a design scenario in which all three transistor currents are predicated on a single device voltage is decidedly easier to embrace analytically than is a situation in which said currents are fixed by a suitable combination of two transistor voltages. It is important to understand that the transistor currents are independent of base-collector junction voltage only if the base collector junction is not forward biased. From (3-2), this requirement translates to an internal collector-emitter voltage (or emitter-collector voltage in PNP units), Vb, that must equal or exceed the base-emitter junction voltage Ve. In short, forward linear active BJT operation requires Vb ≥ Ve ≥ Veon. 3.2.1.2. Reverse Active Operation A bipolar junction transistor operating in its reverse active regime is the converse of forward active transistor operation; that is, the base-collector junction potential exceeds threshold potential (Vc ≥ Vcon), while its base-emitter voltage is non-positive (Ve ≤ 0). Transistors embedded in linear signal processing networks rarely operate as reverse active devices. Indeed, device operation in this domain is invariably the result of errors either in biasing or in topological layout. With Vc ≥ Vcon and Ve ≤ 0, (3-3), (3-4), and (3-8) deliver ⎛ β f + βr + 1 ⎞ V n V V nV I e = − βr I b + ⎜ ⎟ Ae J s e e f T − 1 = − βr I b + I eo e e r T − 1 , (3-20) ⎜ ⎟ βf ⎝ ⎠ where ⎛ β f + βr + 1 ⎞ I eo ⎜ (3-21) ⎟ Ae J s ⎜ ⎟ β f ⎝ ⎠ is termed the emitter leakage current. In particular, Ieo is the emitter current that results from an open circuited base (Ib = 0) and a base-emitter junction that is strongly reverse biased (Ve << 0). By comparison with (3-17), Ieo is smaller than the collector leakage current, Ico, in that parameter βf is much larger than parameter βr. ( ) ( ) With voltage Ve ≤ 0, current Ibe in (3-8) becomes entirely negligible, whence the base current, Ib, in reverse active mode is largely determined by the reverse recombination current, Ibc. Accordingly, the emitter current in (3-20) is set by the base-collector voltage, Vc, and is essentially independent of the base-emitter voltage, Ve. But since Ib ≈ Ibc and Ic = Ie − Ib ≈ −(βr + 1)Ibc with Ve ≤ 0, all currents in a reverse active transistor are approximately fixed by only voltage Vc. Moreover, the pertinent magnitude of the collector current to base current ratio is seen to Ming Hsieh Department of Electrical Engineering - 358 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma be (βr +1), which is far less than the base to collector transfer ratio, βf, evidenced in forward mode. The fact that the collector current to base current ratio is a measure of the achievable gain in a bipolar stage is reason enough to steer clear of reverse active operation in favor of forward active operation. 3.2.1.3. Saturation A BJT operates in saturation when both its base-emitter and base-collector junctions are forward biased. In the saturation regime, the base of a transistor is injected with mobile charge carriers from both the emitter and the collector, and all transistor currents are resultantly influenced by both of the junction voltages, Ve and Vc. Using (3-3), the collector to base current ratio in saturation is β f − ( βr + 1) ( I bc I be ) I − ( βr + 1) I bc Ic (3-22) = cc = . Ib I be + I bc 1 + ( I bc I be ) Since the recombination currents, Ibe and Ibc, are each positive in saturation, the collector current to base current ratio in (3-22) is clearly smaller than the gain metric, βf. In a word, the collector current to base current ratio always falls below the short circuit current gain, βf, when a transistor operates in its saturation domain. Aside from the dependence of all transistor currents on both transistor junction voltages, the degradation in I/O gain measure is ample reason to avoid saturation like the proverbial plague in linear BJT signal processing networks. Another reason to avoid saturation is poor frequency response since a significant amount of time is likely to be required to displace the enormous density of charge injected into the base. Additionally, and as is discussed shortly, saturation incurs current flow in the substrate body of a monolithic transistor, which can cause potentially damaging substrate heating and other deleterious effects. Finally, the intrinsic collector-emitter voltage in (3-2) is the difference of two positive junction voltages when the subject transistor enters its saturation regime. Because of the doping disparity between the emitter and collector volumes, this difference is always positive. It is normally designated as the collector-emitter saturation voltage, Vcesat, which is dependent on transistor currents and is typically in the range of 50 mV to 300 mV. We can determine the collector-emitter saturation voltage by solving (3-22) for the recombination current ratio, Ibc/Ibe. Denoting this ratio by Xce, β f − ( Ic Ib ) I (3-23) X ce bc = , I be 1 + βr + ( I c I b ) which is zero if (Ic/Ib) = βf. This disclosure is synergistic with engineering expectations in that (Ic/Ib) = βf in only the forward active regime of operation where the reverse recombination current, Ibc, approaches zero. Since (Ic/Ib) < βf in saturation positive Xce is indicative of device saturation. The result at hand, coupled with (3-3) and (3-8), delivers (1 + X ce ) Ae J s Ve n f VT (3-24) I b = (1 + X ce ) I be = e −1 , βf ( ) whence a base-emitter junction voltage of β f Ib ⎡ ⎤ Ve = n f VT ln ⎢1 + (3-25) ⎥. + 1 X A J ( ) ce e s ⎣ ⎦ It is interesting that operation in the saturation domain, where Xce > 0, reduces the base-emitter junction voltage from the level evidenced for a similar base current conducted by a transistor in Ming Hsieh Department of Electrical Engineering - 359 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma its forward active domain. This effect is reasonable in light of the fact that in saturation, the base current is partitioned between base-emitter and base-collector recombination components while in the active domain, the base current is almost exclusively determined by base-emitter recombination phenomena. Returning to (3-23), (3-3) and (3-10) yield ⎛ 1 + X ce ⎞ (1 + X ce ) Ae J s Vc nrVT (3-26) −1 , Ib = ⎜ e ⎟ I bc = X ce βr ⎝ X ce ⎠ which establishes a base-collector junction voltage of ⎡ X ce βr I b ⎤ Vc = nrVT ln ⎢1 + (3-27) ⎥. + 1 X A J ( ) ce e s ⎣ ⎦ Recalling (3-2) and assuming Xce > 0, the collector-emitter saturation voltage, Vcesat, in an NPN unit (or emitter to collector saturation voltage, Vecsat, in a PNP transistor) is n ⎧⎡ β f Ib ⎤ f ⎫ ⎪ ⎢1 + ⎪ (1 + X ce ) Ae J s ⎥⎦ ⎪⎪ ⎪⎪ ⎣ Vcesat = Ve − Vc = VT ln ⎨ , X ce > 0 . (3-28) nr ⎬ ⎪⎡ X ce βr I b ⎤ ⎪ ⎪ ⎢1 + (1 + X ce ) Ae J s ⎥⎦ ⎪⎭⎪ ⎩⎪ ⎣ Using (3-23), it is a simple matter to confirm that gain parameter βf is always larger than the product, Xceβr, and indeed, it is never equal to Xceβr. It follows that the collector-emitter saturation voltage in (3-28) is always a nonzero and positive voltage. For the case of identical junction injection coefficients, say nf = nr = n, the small transistor saturation current, AeJs, simplifies (328) to ⎛ βf ⎞ (3-29) Vcesat = Ve − Vc ≈ nVT ln ⎜ ⎟ , X ce > 0 , X β ⎝ ce r ⎠ which suggests that the saturation voltage is nominally dependent on only the current ratio, (Ic/Ib) (because of parameter Xce), and not on the individual transistor currents, Ic or Ib. ( ) 3.2.1.4. Cutoff There is nothing fundamentally wrong with asserting that a transistor is cutoff when any one of its three currents is zero. Historically, however, a transistor is said to be in cutoff when its emitter current, Ie is zero. You are asked to investigate this useless operating case in Problem #3.3. EXAMPLE #3.1: In an integrated circuit realized in bipolar transistor technology, PN junction diodes are realized as appropriate connections of bipolar junction transistors. Three plausible realizations appear in Figure (3.6). For each of these “diodes,” determine the volt-ampere characteristic equations, Id -versus- Vd, and give expressions for their effective saturation currents. Assume that the junction injection coefficients of the transistor are identical and equal to n. Ming Hsieh Department of Electrical Engineering - 360 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma SOLUTION #3.1: (1). In the interconnection of Figure (3.6a), the base and collector terminals are connected together, thereby constraining base-collector junction voltage Vc to zero and rendering voltage Vd equal to the base-emitter junction voltage, Ve. With Vc = 0, Ibc and Irr in (3-3) are null and thus, (3-3) and (3-8) provide Id + Id − + Vd Vd Vd − Id (a). (b). + − (c). Figure (3.6). (a). A diode formed by short circuiting the base to the collector of an NPN BJT. (b). A diode formed by short circuiting the base to the emitter of a PNP BJT. (c). A diode formed by short circuiting the collector to the emitter of an NPN BJT. ( ) I d = I b + I c = I be + I cc = β f + 1 I be . (E1-1) Using (3-8) once again, it follows that the volt-ampere characteristic of the subject diode interconnection is ⎛ βf +1⎞ V nV Id = ⎜ ⎟A J e d T − 1 , (E1-2) ⎜ βf ⎟ e s ⎝ ⎠ whereupon the effective saturation current, say Io, is seen to be ⎛ βf +1⎞ AJ Io = ⎜ ⎟ Ae J s = e s . (E1-3) ⎜ βf ⎟ αf ⎝ ⎠ ) ( (2). In Figure (3.6b), the base and emitter terminals are tied together, thereby constraining baseemitter junction voltage Ve to zero and rendering voltage Vd equal to base-collector junction voltage Vc. With Ve = 0, Ibe and Icc in (3-3) are zero and thus, (3-3) and (3-10) yield I d = − I c = I bc + I rr = ( βr + 1) I bc . (E1-4) Using (3-10) the volt-ampere characteristic of the subject diode interconnection is ⎛ β +1⎞ V nV Id = ⎜ r (E1-5) ⎟ Ae J s e d T − 1 , ⎝ βr ⎠ ) ( and the saturation current follows as ⎛ β +1⎞ Ae J s . Io = ⎜ r ⎟ Ae J s = αr ⎝ βr ⎠ (3). (E1-6) In Figure (3.6c), the collector and emitter terminals are interconnected, thereby rendering Vd = Ve = Vc. Accordingly, (3-3), (3-8) and (3-10) combine to give I d = I b = I be + I bc , (E1-7) and the volt-ampere characteristic of the subject diode interconnection is ⎛ 1 1 ⎞ V nV Id = ⎜ + ⎟ Ae J s e d T − 1 . (E1-8) ⎜ βf ⎟ β r⎠ ⎝ Clearly, the corresponding saturation current, Io, is ( Ming Hsieh Department of Electrical Engineering ) - 361 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma ⎛ 1 1 ⎞ Io = ⎜ + ⎟ Ae J s . ⎜ βf βr ⎟⎠ ⎝ (E1-9) COMMENTS: The only diode interconnection of the three considered topologies that precludes a forward biased base-collector junction is the configuration of Figure (3.6a). As is demonstrated subsequently, a forward biased basecollector junction can be detrimental in monolithic bipolar technology circuits and consequently, the diode configuration of Figure (3.6a) is rightfully deemed the most efficacious of the three considered interconnections. EXAMPLE #3.2: A PNP bipolar junction transistor has a forward short circuit current gain, βf, of 100 amps/amp, a reverse short circuit current gain, βr, of 1.0 amp/amp, a base-emitter junction injection coefficient, nf, of 1.025, and a base-collector junction injection coefficient, nr, of 1.0. When operated at room temperature (27 °C) in a particular circuit, the collector current, Ic, is measured to be 2 mA, while the base current is determined to be 200 μA. Calculate the emitter-collector saturation voltage, Vecsat. Assume a room temperature saturation current, Is, of 2 fA. SOLUTION #3.2: (1). Since Ic/Ib in this example is 2 mA/200μA = 10, which is obviously smaller than βf, the subject transistor is saturated. For the quoted parameters and Ic/Ib = 10, equation (3-23), which is applicable for NPN and PNP units alike, delivers a recombination current ratio, Xce = Ibc/Ibe of Xce = 7.50. (2). At a junction temperature of Tj = 27 °C, the Boltzmann voltage, VT, is VT = 25.89 mV. With Xce = 7.50, (3-28) resultantly delivers an emitter-collector saturation voltage of Vecsat = 85.05 mV. COMMENTS: As confirmed above, the emitter-collector saturation voltage is a small, positive number. It should be understood that the measured value of this metric is somewhat larger owing to ohmic resistances in the collector and emitter leads of the transistor. These resistances are addressed shortly. The fact that Xce is 7.50 indicates that the reverse recombination current precipitated by base region mobile carriers and collector-injected carriers is 7.5-times larger than the forward recombination current attributed to base region and emitter-injected carriers. In general, Xce > 1 is the norm in that the base region doping concentration is larger than the collector impurity concentration, which in turn is several orders of magnitude smaller than the impurity concentration in the emitter volume. 3.2.2. ENHANCEMENTS TO THE EBERS-MOLL MODEL Despite its better than half century age, the Ebers-Moll model remains a viable design tool for manually estimating bipolar circuit performance. Viability notwithstanding, numerous enhancements to the model demonstrably improve its accuracy, particularly for scaled, minimal geometry, monolithic bipolar devices. A definitive discussion of all of the modeling improvements postured in the archival literature in the better than five decades since the original publicaMing Hsieh Department of Electrical Engineering - 362 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma tion of the seminal Ebers and Moll paper is beyond the scope of this chapter. However, four specific modeling enhancements are potentially vital for a realistic design-oriented analyses of monolithic circuits that exploit state of the art bipolar devices in linear network applications. These improvements entail corrections for the transport current in the face of high emitter-base carrier injection, adjustments to the transport current necessitated by base conductivity modulation, parasitic resistances in the base, emitter, and collector, and incorporation of high frequency effects on the I/O transfer characteristics. The enhancements in the subsections that follow pertain only to the linear forward active regime of BJT operation (Ve ≥ Veon and Vc ≤ 0) since the focus of this chapter, and indeed the majority of this text, is circuit analysis that underpins the design and realization of linear active networks. 3.2.2.1. High Injection Phenomena The Ebers-Moll model implicitly presumes a low injection condition. For forward active operating circumstances, low injection operation is tantamount to a concentration of injected carriers from the emitter to the base that is significantly smaller than the background impurity concentration in the base volume. As this injected charge level rises toward the level of the base dopant concentration, a high injection condition is initiated, which manifests impaired carrier mobility due to the traffic jam of minority carriers that accumulate in the base. The upshot of degraded carrier mobility is an increased likelihood of carrier recombination, thereby giving rise to diminished charge transport into the collector region and hence, a reduced collector current. For the large geometry transistors prevailing some four or five decades ago and for most present day discrete component transistors, the low injection presumption is appropriate. But low injection presuppositions become progressively more dubious as transistor geometries shrink to the submicron scale that is commonplace in the monolithic state of the art. The Gummel-Poon model of a BJT accounts for these high injection effects by supplanting the transport current, Icc, in (3-5) with a corrected transport current, Ict, which is given by[2] I cc I cc I ct ≈ = , (3-30) I cc I cc 1+ 1+ I kf Ae J kf where Ikf is termed the forward knee current of the bipolar device, and Jkf is the corresponding forward knee current density[3]. The knee current parameter is a measure of the onset of high injection phenomena in the sense that Icc << Ikf is indicative of low injection conditions. When Icc, which remains stipulated by (3-5), is, in fact, significantly smaller than Ikf, Ict collapses to the transport current predicted by Ebers and Moll. Base Ib Ve + − Ic + Vc ≤ 0 − Ibe + DBE Ict Ie Collector Vb − Emitter Figure (3.7). Linear forward active region model of an NPN BJT with a correction adopted for high injection effects on carrier transport. The current, Ict, is given by (3-30). The indicated junction voltage, Ming Hsieh Department of Electrical Engineering - 363 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Ve, must be at least as large as the threshold voltage, Veon, of the base-emitter junction. We can gain a fundamental understanding of the impact of high injection phenomena on bipolar transistor performance by examining the model in Figure (3.7), which depicts the corrected form of the large signal bipolar model. Only an NPN model is drawn since the PNP model is little more than its NPN counterpart with the current directions and voltage polarities reversed. The model clearly establishes a collector current, Ic, of[4] I cc I c = I ct = . (3-31) I cc 1+ Ae J kf At low injection levels, V n V I c = I ct ≈ I cc ≈ Ae J s e e f T , (3-32) where the unity term in the parenthesized quantity on the right hand side of (3-5) is ignored in deference to the requirement that Ve be at least as large as the base-emitter junction threshold potential, Veon. This threshold voltage is typically more than 25-times the effective thermal voltage, nfVT, which certainly justifies the neglect of the unity term in comparison to the exponential term. On the other hand, at high levels of carrier injection and correspondingly large forward transport currents, Icc, (3-31) approaches I c = I ct ≈ Ve 2n f VT Ae J kf I cc ≈ Ae J kf J s e . (3-33) Note that while the natural logarithm of the low injection collector current in (3-32) rises linearly with Ve/nfVT, the logarithm of the high injection collector current in (3-33) rises linearly with Ve/2nfVT. In effect, the forward base-emitter junction voltage to collector current transconductance, for which a measure is the derivative, dIc/dVe, is reduced by the onset of high injection phenomena. A related high injection phenomenological effect is an attenuation of the static current transfer ratio, Ic/Ib. Recalling (3-3) and (3-8), the Ebers-Moll, or low injection, BJT model predicts Ic/Ib ≈ βf in the linear domain. But noting that Icc = βfIb in this regime, (3-31) predicts Ic βf ≈ . (3-34) Ib I cc 1+ Ae J kf In general, this transfer relationship is traditionally symbolized as hFE, which is commonly referred to as the DC beta, or static beta of a transistor. Thus, at this stage of the model development, Ic βf βf hFE ≈ = . (3-35) Ib I cc I cc 1+ 1+ Ae J kf I kf As is demonstrated in discussions surrounding the design of suitable biasing networks for bipolar technology circuits, hFE is a troublesome parameter largely because of its direct dependence on parameter βf. In particular, the numerical value of βf suffers a variance of at least three -to- one owing to process uncertainties surrounding the implementation of a stereotypical submicron base width. The problem stems from the fact that βf is inversely dependent on the base width, whose control at submicron dimensions proves to be a daunting fabrication challenge. The lesson we Ming Hsieh Department of Electrical Engineering - 364 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma should learn here is that bipolar circuit design should be accomplished to ensure that critical performance metrics are not directly dependent on the highly vagarious parameter, hFE. 3.2.2.2. Base Conductivity Modulation The large signal BJT model in Figure (3.7) represents the collector-emitter port as an ideal controlled current source, Ict, that is independent of the internal collector-emitter voltage, Vb, and thus independent of the base-collector junction voltage, Vc. But it is intuitively evident that the transport of emitter-injected charge through the base and on into the collector is promoted by increased reverse bias across the base-collector PN junction. Equivalently, such charge transport is encouraged by increasing the internal collector-emitter voltage, Vb. This assertion stems from (3-2), which suggests that as Vb rises, voltage Ve, the forward biasing potential across the intrinsic base-emitter PN junction, changes only modestly from its threshold, or turn on, level. Thus, most of the increase afforded to voltage Vb is mirrored by an increase in (−Vc). The enhanced transport current promoted by increases in voltage Vb is known as the Early effect[5]. Two engineering reasons can be proffered to explain this transport current phenomenon. First, an increased Vb results in increased reverse bias across the base-collector junction, as noted above. This boost in reverse bias establishes stronger electric fields in the depletion layer surrounding the base-collector junction and in turn, these robust fields exert progressively more compelling attractive forces on the mobile carriers that are injected into the base volume from the emitter region. Such attractive forces serve to inhibit recombination between emitter-injected and base region carriers, thereby facilitating forward charge carrier transport through the base and hence, increased collector current. Second, the increased reverse bias at the base-collector junction widens the junction depletion layer therein. The immediate result of such widening is a commensurate narrowing of the neutral base width, which further decreases the likelihood of recombination of injected carriers with majority carriers in the base. Stated quite simply, the charge neutral base volume where recombination is most likely to occur is reduced. Collectively, the two reasons articulated herewith argue that the increased basecollector reverse bias increases the conductivity of the neutral base so that charge transport through the entire base is correspondingly promoted. A physically sound model for the foregoing base conductivity modulation, or Early effect, proves too cumbersome for manual estimates of static BJT performance. Instead, an empirical representation of the form, ⎛ V ⎞ I cc ⎜ 1 + b ⎟ ⎜ Vaf ⎟⎠ ⎛ V ⎞ ⎝ (3-36) Ic = = I ct ⎜ 1 + b ⎟ , ⎟ ⎜ V I cc af ⎝ ⎠ 1+ I kf is adopted for circuit level modeling, where Ict is given by (3-31) and voltage Vaf is an experimentally discerned Early voltage parameter, whose value for minimal geometry transistors is typically in the mid to high tens of volts. The resultant electrical model for the NPN device is shown in Figure (3.8), where it can be seen that the appended parenthesized term on the right hand side of (3-36) establishes a current-dependent resistance. This resistance, whose value is inversely proportional to current Ict, is in shunt with the controlled source, Ict. Ming Hsieh Department of Electrical Engineering - 365 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma We must now update the static current gain of the transistor to the slightly more complicated form, ⎛ ⎛ V ⎞ V ⎞ β f ⎜1 + b ⎟ β f ⎜1 + b ⎟ ⎜ ⎜ Vaf ⎟⎠ Vaf ⎠⎟ Ic ⎝ ⎝ (3-37) hFE ≈ = . Ib I cc I cc 1+ 1+ Ae J kf I kf Base Ib Ve Ic + Vc ≤ 0 − + − + DBE Ict Ie Collector Vaf Ict Vb − Emitter Figure (3.8). Linear forward active region model of an NPN BJT with an account made of both high injection and base conductivity modulation (Early effect) phenomena. Observe that the behavioral expression for the Early effect in (3-36) and in the current gain expression of (3-37) somewhat (but certainly incompletely) mitigates the deleterious impact of high injection phenomena. This observation explains why circuit designers interested in only a quick first order estimate of static BJT performance commonly opt for invoking only the EbersMoll model. 3.2.2.3. Parasitic Resistances The model in Figure (3.8) highlights only intrinsic transistor action in that the voltages appearing at the terminals of the transistor are internal base-emitter junction voltage, Ve, internal base-collector junction voltage, Vc, and internal collector-emitter voltage, Vb. In physically realizable structures, these internal voltages couple electrically to the accessible external terminals of the device through series resistances derived from the charge neutral regions of the collector, emitter, and base volumes. At the collector, a resistance, rc, appears as depicted in the revised model of Figure (3.9), in which both NPN and PNP models are offered in the interest of analytical completeness. Because of the length of the collector region and its low impurity concentration, rc is a relatively large resistance. For minimal geometry devices destined for broadband circuit applications, rc is in the range of mid tens of ohms to as much as low hundreds of ohms. In contrast, the extremely high impurity concentration of the emitter, together with its short length, promotes a series emitter resistance, re, that is very small, particularly for silicongermanium heterostructures. Typically, re is a few tenths of ohms to a few ohms. Both rc and re scale inversely with the base-emitter junction area, Ae, and since both are physical ohmic resistances, both contribute thermal noise to the total integrated output noise generated by the transistor. The base resistance, rb, like emitter resistance re and collector resistance rc, is an ohmic element that generates thermal noise and scales inversely with the base-emitter junction area. Owing to the inherently two-dimensional nature of the volt-ampere characteristics in the base region and emitter crowding, rb, is current dependent[6],[7]. The phrase, “emitter crowding,” refers Ming Hsieh Department of Electrical Engineering - 366 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma to an inability to establish uniformly constant voltage bias across the width of the base-emitter junction of a monolithic device. A commonly invoked empirical expression for the base resistance of a bipolar device subjected to emitter crowding is r − Rbm (3-38) rb = Rbm + bb , 1 + ( I c I rb ) Base Ib rb rc + Vc ≤ 0 − + Ve + − Vbe + Ict Vb − DBE Ibe Ic + Collector Vaf Ict Vce Ie re − Base − Ib (a). rb rc − Vc ≤ 0 + − Ve Veb − + − Ict Vb + DBE Ibe Ic − Emitter Collector Vaf Ict Vec Ie re + + Emitter (b). Figure (3.9). (a). The NPN BJT model of Figure (3.8) embellished by the incorporation of series resistances rc, re, and rb in the collector, emitter, and base leads, respectively. For most modeling circumstances, resistances rc and re can be ignored. (b). The PNP model counterpart to the NPN model in (a). where Ic is the collector current, Irb is an experimentally deduced constant that scales with baseemitter junction area, Rbm is the minimum base resistance (typically tens of ohms as extrapolated from high current measurements), and rbb is the zero bias (meaning Ic = 0) value of the measured base resistance. For minimal geometry transistors, current parameter Irb is generally of the order of one-half the transistor forward knee current, Ikf, while resistance rbb can be as large as a few hundred ohms. Figure (3.10) displays a plot of the normalized base resistance, rb/rbb, versus the normalized collector current, Ic/Irb, for various resistor ratios, rbb/Rbm. Notice that a better than two factor between the actual base resistance, rb, and its zero current value, rbb, is possible for even reasonable values of collector current. Because large base resistance generally reflects worst case operating conditions, in the senses of incurring reduced I/O voltage gain, compromised bandwidth, and increased thermal noise contribution to the net integrated output noise of a transistor, designers typically adopt the conservative worst case design stance of presuming a base resistance equaling its zero current value. Ming Hsieh Department of Electrical Engineering - 367 - USC Viterbi School of Engineering Lecture Supplement #05 1 BJT Models & Biasing J. Choma Norm. Base Resistance, (r b /r bb ) r bb /R bm = 2 r bb /R bm = 4 0.8 0.6 0.4 r bb /R bm = 20 r bb /R bm = 10 0.2 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Norm. Collector Current, (I c /I rb ) Figure (3.10). The dependence of the internal base resistance, rb, on the collector current flowing in a bipolar junction transistor. 3.2.2.4. Transistor Capacitances An accurate assessment of the impact of high signal frequencies on transistor characteristics is a daunting challenge requiring careful consideration of charge storage and related memory effects that prevail within the semiconductor body of a bipolar junction transistor. At the circuit level, at least three capacitances must be incorporated into the transistor model to bracket the effects that high signal frequencies exert on observable BJT circuit performance. These capacitances are the base-emitter capacitance, Cπ, the base-collector junction depletion capacitance, Cμ, and the substrate depletion capacitance, Cs, as depicted in the high frequency NPN BJT model set forth in Figure (3.11). An analogous model prevails for the PNP device, wherein all current directions, all voltage polarities, and all diode interconnections are reversed. Base Ib rbb + Ve Vbe Cμ + − DBE rc + − Vc ≤ 0 Cπ + Ict Vb Ibe − − Vaf Vsc DSC Ict + Ic + Collector Cs Vce Ie re − Substrate − Emitter Figure (3.11). High frequency model of the NPN BJT. The high frequency model of a PNP BJT is topologically similar, with the provisos that the connections of both diodes are reversed, all voltage polarities are reversed, and the directions of all currents are reversed. Ming Hsieh Department of Electrical Engineering - 368 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma As in the case of a forward biased PN junction diode, the shunt interconnection of two capacitances model the high frequency effects at the base-emitter junction of a BJT operated in the linear active mode of transistor operation, where Ve ≥ Veon and Vc ≤ 0. The dominant component of these two capacitances is the base-emitter diffusion capacitance, Cbe. It is reminiscent of the diffusion component of net PN junction diode capacitance in that it models the effects of charge stored temporarily in the volume prior to its transport through or recombination in the base volume. This diffusion component, Cbe, of base-emitter junction capacitance is expressible as (3-39) Cbe = τ fe g m , where τfe is the average time required to transport minority carriers through the base region and gm is the forward transconductance of the BJT. Parameter τfe is naturally affected by the average mobility of the minority carriers in the base. Since minority carrier mobility diminishes with the increasing carrier concentration that necessarily underpins forward transport current in a BJT, τfe can be expected to increase with progressively larger transport currents. In effect, increased device capacitances, and thus potentially impaired circuit response speeds, can be expected when BJTs are compelled to conduct relatively large collector currents. The degradation of transport time induced by pronounced carrier concentrations in the base is somewhat mitigated by the imposed base-collector junction reverse bias, which exerts an attractive force on carriers injected into the base from the emitter. Accordingly, a plausible semi-empirical relationship for the effective minority carrier transport time, τfe, in (3-39) is Ic ⎞ ⎛ + 1 ⎜ I kf ⎟ ⎟, τ fe = τ fo ⎜ (3-40) ⎜ 1 + Vb ⎟ ⎜ Vaf ⎟⎠ ⎝ where τfo is the low current (small Ic), Vc = 0 value of the minority carrier transport time in the base of a BJT. Observe that the expression in question allows τfe to increase with progressive increases in the collector current, Ic, which is given by (3-31). On the other hand, (3-40) permits τfe to decrease with increasing Vb, which relates implicitly to the magnitude of reverse bias to which the base-collector junction is subjected. A small, but nonetheless important engineering lesson surfaces herewith. In particular, increasing Vb reduces τfe, and hence device capacitance Cbe, thereby promoting the possibility of improved circuit response speeds. But Vb increases only if a suitably larger voltage, Vce, biases the collector-emitter terminals of a transistor. In turn and for a given collector current, increased Vce increases the power dissipated in a BJT, thereby encouraging the philosophical stance that the price paid for improved circuit response speeds or bandwidth is likely increased circuit power dissipation. Continuing with (3-40), parameter τfo is typically in the range of tens to hundreds of picoseconds for minimal geometry transistors. For silicon-germanium heterostructure BJTs, τfo can be as small as only a few tenths of a picosecond. Since parameter τfo is nominally proportional to the square of base width Xb in Figure (3.1), a progressive narrowing of the base region yields dramatic dividends insofar as a reduction of base-emitter diffusion capacitance, Cbe, is concerned. There are, however, limits to the base region narrowness that can be tolerated. In particular, too narrow a base promotes a voltage breakdown condition known as punch through, wherein the reverse bias imposed at the base-collector junction allows the base side boundary of the base-collector depletion layer to encroach on the base-side boundary of the base-emitter depletion layer. Ming Hsieh Department of Electrical Engineering - 369 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Finally, the transconductance metric in (3-39) is, using (3-36), ⎞⎛ ∂I c Ic ⎛ Ic V ⎞ ⎜1 − ⎟⎜1 + b ⎟ . gm = (3-41) n f VT ⎜ Vaf ⎠⎟ ∂Ve 2 I cc I kf ⎟ ⎜⎝ ⎝ ⎠ Assuming that voltage Vb is much smaller than the Early voltage, Vaf, as is often the case in welldesigned, high performance BJT networks, (3-36) combines with (3-41) to deliver I c ⎛ 2 + I cc I kf ⎞ ⎜ ⎟. gm ≈ (3-42) 2n f VT ⎜ 1 + I cc I kf ⎟ ⎝ ⎠ The last result portrays the forward transconductance as increasing linearly with collector current Ic with a slope, dgm/dIc, of roughly 1/nfVT at low injection levels where Icc << Ikf. Under high injection conditions, transconductance gm continues to increase with Ic, but at a slope, dgm/dIc, that is a factor of two smaller than evidenced at low current levels. Another electronics lesson surfaces for here for us. Specifically, transconductance gm is a measure of attainable I/O gain in a BJT network. Increased gain potential accrues with increased gm, which obviously mandates enhanced collector current. But the aforementioned slopes suggest that diminishing gain returns accrue as currents approach levels commensurate with high injection operating conditions. Although the base-emitter junction is forward biased in the linear active mode of BJT operation, a narrow depletion layer nonetheless prevails at this PN junction. Accordingly, the second component of the net base-emitter junction capacitance is a depletion capacitance, Cje, which is associated with the transition region of the depletion layer. Under forward biased circumstances, this capacitance, which is analogous to the depletion component of capacitance prevailing in a forward biased PN junction diode, is given approximately by C jeo C je ≈ , (3-43) me ⎛ V ⎞ ⎜⎜ 1 − eon ⎟⎟ V je ⎠ ⎝ where Cjeo is the zero bias (meaning Ve = 0) value of the junction depletion capacitance, Vje is the built-in potential of the base-emitter junction, and me is the grading coefficient of the subject junction. The potential, Vje, is typically in the range of 800 mV to 900 mV, and parameter me is usually close to 0.5. It is understood that capacitance Cjeo scales linearly with the base-emitter junction area, Ae. In summary, the net base-emitter junction capacitance, Cπ, as delineated in Figure (3.11), is, recalling (3-39), (3-40), (3-41), and (3-43), ⎞ ⎛ C jeo I ⎞ I ⎛ Ic ⎟ + (3-44) . Cπ = Cbe + C je ≈ τ fo ⎜ 1 + c ⎟ c ⎜ 1 − me ⎜ ⎟ n f VT ⎜ ⎟ I 2 I I kf cc kf ⎛ ⎝ ⎠ V ⎞ ⎝ ⎠ ⎜⎜ 1 − eon ⎟⎟ V je ⎠ ⎝ Since the base-collector junction of a BJT is reverse biased under linear active operating circumstances, the capacitance, Cμ, in Figure (3.11) is exclusively a depletion capacitance. Accordingly, it is given by the familiar mathematical form, C jco Cμ = . (3-45) mc ⎛ ⎞ V ⎜⎜ 1 − c ⎟⎟ V jc ⎠ ⎝ Ming Hsieh Department of Electrical Engineering - 370 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma In (3-35), Cjco is the zero bias (meaning Vc = 0) value of the base-collector junction depletion capacitance, Vjc is the built in potential of the base-collector junction (of the order of 700 mV to 800 mV), and mc is the grading coefficient of the junction. Typically, 1/3 ≤ mc ≤ 1/2. Capacitance Cjco, like Cjeo, scales linearly with the base-emitter junction area. Substrate Collector Base Emitter Intrinsic Transistor N+ Collector Contact N+ Type Emitter P-Type Base N-Type Collector P+ Substrate Contact P+ Substrate Contact Silicon Dioxide N+ Buried Layer P-Type Substrate Figure (3.12). Simplified cross section representation of a monolithic NPN bipolar junction transistor. The diagram is not drawn to scale. The section of the diagram enclosed by the dotted rectangle is known as the intrinsic transistor. It corresponds to the cross section abstraction appearing in Figure (3.1a). In an attempt to facilitate our comprehension of the engineering significance of the substrate diode, DSC, and its associated substrate capacitance, Cs, it is necessary for us to digress to the cross section diagram of a monolithic transistor. To this end, a simplified cross section of an NPN monolithic BJT is abstracted in Figure (3.12). The vertical part of the diagram enclosed by the dotted rectangle lying directly under the emitter terminal and consisting of the n+-emitter, the p-type base, and the n-type collector is the intrinsic transistor and corresponds to the simplified BJT structure we provided in Figure (3.1a). Since all terminal contacts are necessarily formed at the surface of the structure, the collector metal contact is incident with a heavily doped diffused or implanted collector contact to reduce the parasitic series resistance associated with the collector. A further reduction in this series resistance is fomented by assuring that this n+-collector contact is deep enough to coalesce with the n+ buried layer that abuts the lightly doped intrinsic collector region. The entire structure rests atop a lightly doped p-type substrate to which electrical accessibility is provided at the surface through dual p+-substrate contacts. Aside from allowing an electrical contact to the substrate foundation of the NPN transistor, these deep substrate contacts create a mechanism to isolate the subject NPN device from adjacent on chip transistors. The isolation proves effective if the substrate terminal at the transistor surface is incident with the most negative potential afforded by the circuit in which the NPN transistor is electrically embedded, thereby ensuring nominally non-conductive, reverse biased PN junctions around the Ming Hsieh Department of Electrical Engineering - 371 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma periphery of the NPN unit. In effect, the reverse bias at the collector-substrate junctions renders the NPN transistor a virtual electrical island in a sea of potentially many other active and passive devices that are incorporated on the chip in question. Electrical contact is similarly made to the p-type base by doping the base region adjacent to the emitter region sidewalls at a level that is higher than the impurity concentration of the intrinsic base immediately below the emitter. In addition to mitigating work function phenomena between metal contact and semiconductor and reducing the series base resistance, this doping gradient minimizes carrier injection from the emitter to the base along the emitter sidewalls, thereby rendering the simplistic diagram in Figure (3.1a) reasonably reflective of the transistor action implied by the cross section under present consideration. Our study of the diagram in Figure (3.12) reveals that in addition to realizing the desired vertical NPN transistor, a parasitic PNP device, QP, is forged with the p-type substrate, the n-type collector and the p-type base. While a parasitic PNP transistor is unquestionably formed, questions can be raised as to whether its emitter is the NPN substrate or the base region of the desired NPN unit. These questions can be answered only when the nature of the electrical connection made to the substrate contact is clarified. Collector Collector Base Base QP Emitter QP Substrate Emitter (a). Substrate (b). Figure (3.13). (a). Behavioral representation of a monolithic NPN transistor for the case in which the substrate is biased to a potential that is larger than the potential applied to the collector of the NPN device. (b). Behavioral representation of a monolithic NPN transistor for the case in which the substrate is returned to the most negative circuit potential afforded by the circuit into which the NPN transistor is embedded. To the foregoing end, consider the atypical case in which the substrate is not connected to the most negative of available circuit potentials and instead supports a voltage with respect to ground that is larger than the voltage developed at the collector of the NPN transistor. Because the substrate-collector junction is forward biased, the substrate can rationally be viewed as the emitter of parasitic transistor QP, and the resultant circuit level abstraction becomes the structure we show in Figure (3.13a). The forward bias across the substrate-collector junction allows holes from the substrate to be injected into the NPN collector region, particularly in the substratecollector junction neighborhood lying to the right of the buried layer. Given that the base-collector junction of the NPN device is reverse biased for linear forward active operation, the basecollector junction of QP is correspondingly reverse biased. Traditional transistor action through the PNP device is therefore fostered, which means that the base current conducted by the vertical NPN device is perturbed by the collector current of the parasitic PNP transistor. Assuming that the DC beta of QP is greater than one, the immediate impact of this enhanced NPN base current is a reduction of the available current transfer ratio, hFE, for the NPN unit. Obviously, the power Ming Hsieh Department of Electrical Engineering - 372 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma dissipation of the overall structure increases because the substrate now conducts the current that is demanded by the emitter of transistor QP. When, as is virtually mandated in linear signal processing applications, the substrate is connected to the most negative circuit potential, the substrate-collector PN junction is reverse biased. Accordingly, the substrate is precluded from serving as a PNP transistor emitter that injects holes into the NPN collector, or equivalently, the PNP base. Instead, the substrate acts as the collector region of transistor QP, thereby permitting the base of the NPN structure to be delineated as the emitter of QP, as shown in Figure (3.13b). The routine reverse biasing of the base-collector junction of the NPN transistor operated in its forward active mode imposes a reverse bias across the base-emitter junction of transistor QP. Consequently, QP conducts only negligible leakage current and therefore exerts minimal impact on the operation of the target NPN device at low signal frequencies. At high signal frequencies, the base-collector depletion capacitance of QP can be absorbed into capacitance Cμ of the NPN transistor. Moreover, the reverse biased PN junction diode observed at the QP base-emitter junction shunts the reverse biased diode evidenced at the NPN base-collector junction. The reversed biased substrate-collector junction can be modeled as a shunt interconnection of a reverse biased diode, DSC, and the depletion capacitance, Cs, associated with the substrate-collector junction. The foregoing capacitance item assumes its usual depletion capacitance form, Cso Cs = , (3-46) ms ⎛ V ⎞ ⎜⎜ 1 − sc ⎟⎟ V js ⎠ ⎝ where Vsc is the reverse biased, and therefore negative, voltage established across the substratecollector junction, Vjs is the built in potential of said junction, ms is the grading coefficient of the subject junction, and Cso is the Vsc = 0 value of the substrate-collector depletion capacitance. For a properly biased, minimal geometry, high speed NPN transistor, Vjs is in the range of 550 mV to 700 mV, ms is of the order of a third, and Cso is typically a few femtofarads to tens of femtofarads. The base-collector junction of the NPN transistor is forward biased when the device enters its saturation regime. Correspondingly, the base-emitter junction of the parasitic PNP device in Figure (3.13b) mirrors this forward biasing, which, along with the imposed reverse bias at the substrate-collector junction, forces QP to conduct and actually to function in its forward active domain. The result is a degraded short circuit current gain in the NPN transistor, whose base must now supply current to the PNP emitter. Aside from degraded current gain, the power dissipation of the entire structure increases and undesirable heating of the substrate is incurred because of the collector current manifested in transistor QP. These observations support our earlier contention that BJT operation in saturation must be avoided at all reasonable engineering costs. 3.3.0. SMALL SIGNAL MODEL In order for a bipolar junction transistor to respond in a nominally linear fashion to applied input signal excitation, it must be biased in its forward active domain. As we have previously asserted, the prerequisites cultivating operation in this domain are that (1) the base-emitter junction voltage, Ve, be at least as large as the junction threshold voltage, Veon, and (2) the basecollector junction voltage, Vc, be negative or at most zero. The latter requirement is equivalent to Ming Hsieh Department of Electrical Engineering - 373 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma stipulating that the internal collector-emitter (or emitter-collector in PNP devices) voltage, Vb, be equal to or greater than the base-emitter junction voltage, Ve. For monolithic devices, an additional necessity is that the substrate terminal be returned to the most negative potential available in the circuit into which the transistor is embedded. These biasing constraints establish a quiescent, or zero signal, collector current, say IcQ, and corresponding base and emitter quiescent currents, IbQ and IeQ, respectively, which are given by I bQ = I cQ hFE , (3-47) I eQ = I bQ + I cQ = ( hFE + 1) I bQ = ( hFE + 1) I cQ hFE = I cQ αFE ( ) where hFE is given by (3-37) and I cQ hFE αFE = I eQ hFE + 1 (3-48) is nearly unity because hFE is typically much larger than one. The three quiescent BJT currents correlate closely with a Q-point base-emitter terminal voltage VbeQ and correspond loosely to a Q-point collector-emitter terminal voltage, VceQ, which, as inferred by Figure (3.11), satisfy the KVL constraints, VbeQ = I bQ rbb + VeQ + I eQ re (3-49) . VceQ = I cQ rc + VbQ + I eQ re Since VeQ > Veon and all transistor currents are nonzero and positive in the forward active regime, VbeQ > VeQ > Veon. In actual practice, the Q-point base current and series emitter resistance are so small that VbeQ is very nearly equal to VeQ. Moreover, the requirement that VcQ, the Q-point value of the base-collector junction voltage, not exceed zero gives rise to the static operating constraint, VceQ ≥ VbeQ. rbb rc Cμ Base V + − Collector rπ I Cπ gmV re ro Cs Substrate Emitter Figure (3.14). Approximate small signal model of either an NPN or a PNP bipolar junction transistor. The model presumes that the transistor undergoing study is biased for linear operation in its forward active domain, which in turn presupposes that the substrate terminal is incident with the signal ground of the circuit into which the subject transistor is embedded. Subject to the absence of relevant model information, resistances rc and re are routinely taken to be zero. In the forward active domain, the small signal model of either an NPN or a PNP bipolar junction transistor is the structure depicted in Figure (3.14). The subject model is offered with two caveats. First, it is presumed that the model is typically exploited to arrive at conservative estimates of bipolar circuit performance. Thus, the current-dependent resistance, rb in (3-38), is supplanted by the maximum anticipated base resistance, rbb, which simplifies relevant circuit analyses in that resistance rbb is current invariant. Second, the substrate is presumed connected to the most negative of available circuit potentials. This means that the substrate-collector PN Ming Hsieh Department of Electrical Engineering - 374 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma junction diode, DSC in Figure (3.11), can be ignored for small signal analyses since it is reverse biased and therefore conducts only minutely small leakage currents. Since the substrate is connected purposefully to a suitable constant potential that is either circuit ground or a static voltage lying below circuit ground, the substrate lies at signal ground potential in that no signal is supported at the substrate terminal. As witnessed in the small signal model of a PN junction diode, the BJT model at hand is capable of establishing only the appropriate interrelationships among the signal components of all transistor voltage and current variables. It cannot predict Q-point voltages and currents and indeed, the parameters of the small signal model rely a priori on the numerical values of these Q-point currents and voltages. In the model of Figure (3.14), rbb, re, and rc, are physical resistances that account for voltage drops incurred by currents flowing in the charge neutral regions of the base, emitter, and collector, respectively. On the other hand, the resistance, rπ, is a mathematical artifact arising from a linear representation of the volt-ampere characteristics indigenous to the base-emitter junction diode. In particular, if the forward base recombination current, Ibe, in (3-8) is approximated by only the linear terms in its Taylor series expansion about the transistor operating point established in part by Ve = VeQ, ∂I I be ≈ I beQ + be Ve − VeQ . (3-50) ∂Ve Q ( ) With reference to Figure (3.14), (Ve − VeQ) in this relationship is the signal-induced change, V, across the internal base-emitter junction terminals and (Ibe − IbeQ) is the corresponding signal induced change, I, in the forward recombination current. Accordingly, resistance rπ in the subject model derives from I beQ ∂I be Ae J s Ve n f VT 1 ≈ e (3-51) = . ∂Ve Q n f VT rπ n f VT β f Q Given that current IbeQ closely approximates the quiescent transistor base current, IbQ, in the linear forward region of operation, (3-47) combines with (3-51) to deliver n f VT n f VT hFE n f VT (3-52) rπ ≈ ≈ = . I beQ I bQ I cQ We see that he small signal resistance, rπ, is vulnerable to the gain metric, hFE, whose observed value suffers significant variance due to processing uncertainties. Additionally, the inverse dependence of rπ on Q-point collector current, along with the direct dependence of Boltzmann voltage VT on absolute temperature, renders it dependent on junction temperature Tj unless we design the circuit to ensure a quiescent collector current proportional to absolute junction temperature. The latter condition is commonly referred to as a proportional to absolute temperature design, or PTAT design. Like rπ, the Early resistance, ro, in Figure (3.14) is also a mathematical artifact. But in contrast to rπ, which derives from a consideration of the volt-ampere characteristics of the baseemitter junction, ro pertains to a coefficient in the linearized Taylor series expansion of the function that relates transistor collector current to internal collector-emitter voltage, Vb. From (3-36) and (3-5), which collectively advance a collector current dependence on both base-emitter junction voltage, Ve, and intrinsic collector-emitter voltage, Vb, the pertinent two-variable Taylor series expansion for the collector current, Ic, is Ming Hsieh Department of Electrical Engineering - 375 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma ∂I c ∂I c Ve − VeQ + Vb − VbQ . (3-53) ∂Ve Q ∂Vb Q The coefficient of (Ve − VeQ) on the right hand side of this relationship is the Q-point value of the transconductance, gm, introduced in (3-40); that is, ⎞⎛ I cQ ⎛ I cQ V ⎞ ∂I c ⎜1 − ⎟ ⎜ 1 + bQ ⎟ . = gm (3-54) ∂Ve Q n f VT ⎜ Vaf ⎟⎠ 2 I ccQ I kf ⎟ ⎝⎜ ⎝ ⎠ On the other hand, the coefficient of (Vb − VbQ) produces an expression for the Early resistance ro. In particular, (3-36) yields I cQ 1 ∂I c I = ct = , (3-55) ro ∂Vb Q Vaf VbQ + Vaf I c ≈ I cQ + ( ) ( ) Q whence ro = VbQ + Vaf . I cQ (3-56) In most cases, voltage VbQ in (3-54) and (3-56) can be supplanted by the Q-point collector-emitter voltage, VceQ, since the quiescent voltage drops in both the collector resistance, rc, and the emitter resistance, re, are generally small enough to warrant their tacit neglect. Accordingly, ⎞⎛ ⎞ I cQ ⎛ I cQ V ⎜1 − ⎟ ⎜ 1 + ceQ ⎟ gm ≈ n f VT ⎜ Vaf ⎟⎠ 2 I ccQ I kf ⎟ ⎜⎝ ⎝ ⎠ . (3-57) VceQ + Vaf ro ≈ I cQ Clearly, resistance ro in (3-57) is large for very small collector bias currents, IcQ. With reference to the small signal model of Figure (3.14), it follows that at low signal frequencies where all device capacitances can be ignored, the collector-emitter port of a BJT emulates an ideal voltage controlled current source (VCCS) for low level biasing. However and despite this low frequency VCCS nature of the collector-emitter port, the transistor does not behave as an ideal transconductance element because of the finite input impedance evidenced between the base and emitter terminals. This situation confers the possibility of representing the collectoremitter output port as a current controlled current source (CCCS) that is controlled by the signal recombination current, I, flowing as shown through resistance rπ. Since the model at hand verifies V = rπI, gmV = gm rπ I βac I , (3-58) where, by (3-57) and (3-52), the so-called signal beta, or AC beta, βac, of a bipolar junction transistor is ⎛ ⎞⎛ I cQ V ⎞ ⎟ ⎜ 1 + bQ ⎟ . βac = gm rπ = hFE ⎜ 1 − (3-59) ⎜ Vaf ⎟⎠ 2 I ccQ I kf ⎟ ⎜⎝ ⎝ ⎠ Ming Hsieh Department of Electrical Engineering - 376 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing rbb Base V J. Choma rc Cμ + − Collector rπ I Cπ βac I re ro Cs Substrate Emitter Figure (3.15). Alternative small signal model of the BJT. Note herein that in contrast to the small signal model in Figure (3.14), the collector-emitter port contains the current controlled current source, βacI, whose controlling current, I, is conducted by the model resistance, rπ. Figure (3.15) depicts the alternative CCCS model, for which prudence dictates our underscoring that current I is not the base current at all signal frequencies. In particular, the net signal base current must supply current to the branch represented by resistance rπ, and the currents conducted by the branches comprised of capacitances, Cπ and Cμ. In short, current I in the βacI generator is always only the current that flows through the resistance, rπ. EXAMPLE #3.3: The diode-connected transistor in Figure (3.6a) operates in a circuit that allows the silicon technology transistor to conduct a quiescent collector current, IcQ, of 4 mA. A room temperature (27 °C) characterization of the transistor at hand reveals a maximum base resistance, rbb, of 140 Ω, a nominal series collector resistance, rc, of 20 Ω, and a nominal emitter resistance, re, of 0.9 Ω. Moreover, the DC beta, hFE, of the considered device is found to be at least 120 amps/amp, the knee current, Ikf, is 12 mA, the Early voltage, Vaf, is 45 volts, and the saturation current, Is, is 10 fA. Use these numerical data to compute the low frequency small signal parameters of the transistor. Exploit these parameters to determine the low frequency, small signal terminal resistance, say rd, of the diode-connected structure. Assume a base-emitter junction injection coefficient of nf = 1. SOLUTION #3.3: (1). In the diode interconnection of Figure (3.6a), the measurable quiescent collector-emitter voltage, Vd, of the transistor is identical to the quiescent base-emitter voltage, say VbeQ. In silicon, positive VbeQ, and hence voltage Vd, is rarely larger than 800 mV. Owing to the voltages dropped across the internal collector and emitter resistances, the internal Q-point collector-emitter voltage, VbQ, in Figure (3.9a) must therefore be smaller than 800 mV, which assuredly is a voltage level that is significantly smaller than the forward Early voltage, Vaf = 45 volts. It follows that the collector current in (3-36) is essentially the net transport current, Ict. Setting IcQ = Ict in (3-30), the Q-point Ebers-Moll transport current, IccQ, can therefore be determined. Unfortunately, a quadratic relationship must be solved to arrive at IccQ. The relevant fruit of this annoying exercise is ⎡ I cQ ⎛ 4I kf ⎞ ⎤ ⎜1 + 1 + ⎟ ⎥ = 7.07 mA . I ccQ = I cQ ⎢1 + (E3-1) 2I kf ⎜ I cQ ⎟ ⎥ ⎢⎣ ⎝ ⎠⎦ (2). With nf = 1, Is = 10 fA, IccQ = 7.07 mA, and, recalling (3-7), VT = 25.89 mV for a junction temperature of Tj = 300.16 °K, (3-5) gives a Q-point voltage, VeQ, developed across the Ming Hsieh Department of Electrical Engineering - 377 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma intrinsic base-emitter junction diode of VeQ = 706.36 mV. Now, for IcQ = 4 mA and hFE = 120 amps/amp, the Q-point base current, IbQ, is IbQ = IcQ/hFE = 33.33 μA, while the Q-point emitter current, IeQ, is IeQ = (hFE+1)IbQ = 4.03 mA. These currents, the computed internal base-emitter junction voltage of VeQ = 706.36 mV, the given base resistance of rbb = 140 Ω, and the emitter resistance of re = 0.9 Ω imply, via (3-49), a quiescent base-emitter terminal voltage, VbeQ, of VbeQ = I bQ rbb + VeQ + I eQ re = 714.66 mV , (E3-2) which is only slightly more than 8 mV above its intrinsic junction voltage counterpart. Since VbeQ is identical to voltage Vd in Figure (3.6a), the internal collector-emitter voltage, VbQ, at the quiescent operating point of the diode-connected transistor is VbQ = Vd − I cQ rc − I eQ re = 631.03 mV . (E3-3) Note that voltage VbQ is more than 71-times smaller than the forward Early voltage, Vaf, of the transistor, which assuredly validates our previously invoked approximation of IcQ ≈ Ict in (3-30). (3). The foregoing calculations set the table for evaluating the small signal parameters of the considered BJT. Using (3-52), the small signal base-emitter junction resistance, rπ, is rπ = 776.66 Ω. From (3-54) the forward transconductance, gm, is 122.66 mS, and since βac = gmrπ, the AC beta of the transistor is βac = 95.26 amps/amp. Finally, VbQ = 631.03 mV, Vaf = 45 V, and IcQ = 4 mA in (3-56) yield an Early resistance, ro, of ro = 11.41 KΩ. I rbb Ix V + Vx − Ix + − rπ I rc βac I ro Ix − (βac+1)I re Ix − I + Vx Ix − Ix Figure (3.16). Low frequency, small signal model of the diode connected transistor in Figure (3.6a). The effective, or small signal terminal resistance, rd, of the diode connection is determined via the “ohmmeter” method, which entails a calculation of the voltage to current ratio, Vx/Ix. (4). If we lean on Figure (3.15), we can posture Figure (3.16) as the low frequency, small signal model of the diode-connected transistor in Figure (3.6a). All of the device capacitances in the model of Figure (3.15) are tacitly ignored because of the present exclusive interest on only low frequency diode characteristics. The desired small signal terminal resistance, rd, derives from the “ohmmeter” voltage to current ratio, Vx/Ix. An analysis of the structure at hand provides Vx = ( rbb + rπ ) I + re I x (E3-4) and (E3-5) Vx = rc ( I x − I ) + ro ⎡⎣ I x − ( βac + 1) I ⎤⎦ + re I x . Upon elimination of current I in these two relationships, the terminal resistance, rd, of the diode is readily shown to be rd = ( ro + rc ) ( rbb + rπ ) Vx = re + = 10.43 ohms . βac ro Ix 1+ ro + rc + rbb + rπ Ming Hsieh Department of Electrical Engineering - 378 - (E3-6) USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Since ro is a large resistance, (E3-6) can be approximated as V r +r rd = x ≈ re + bb π = 10.42 ohms , Ix βac + 1 which differs insignificantly from the “exact” result in (E3-6). (E3-7) COMMENTS: The computed small signal diode resistance of 10.43 ohms is comparable to the resistance presented to a circuit by a traditional PN junction diode. This resistance is small because of the large forward transconductance, and hence large AC beta, afforded by a BJT operated at reasonable biasing levels. In stark contrast, the resistance presented by a diode-connected, deep submicron technology MOSFET is ultimately shown to be considerably larger owing to the relatively small forward transconductance typically afforded by a MOS technology transistor. The approximate diode resistance stemming from the tacit neglect of the Early resistance is worthy of further exploration. To this end, the pertinent small signal model is offered in Figure (3.17), wherein the removal of resistance ro postures the controlled current source, βacI, as an ideal current generator that projects infinitely large resistance in the collector circuit of the transistor. The series interconnection of the internal collector resistance, rc, with this infinite resistance current source renders rc inconsequential, regardless of its value. Moreover, since the resistance, re, is in series with the port at which the mathematical ohmmeter is applied to evaluate the diode resistance, the resistance, (rbb + rπ) evidenced in the base circuit, is necessarily referred to the emitter. In turn, the emitter conducts a signal current that is larger than the signal current in the base by a factor of (βac + 1). Accordingly, it is reasonable to expect, as is confirmed by (E3-7), that the effective resistance seen in series with re is the resistance observed in the base, scaled by a factor of the base current -to- emitter current ratio, 1/(βac + 1). I rbb Ix V + Vx − Ix + − rπ I rc Ix − I βac I + Vx re Ix − Ix = (βac+1)I Figure (3.17). The equivalent circuit in Figure (3.16) with the Early resistance, ro, tacitly ignored. 3.3.1. UNITY GAIN FREQUENCY Sophisticated communication and data processing systems require significantly large signal bandwidths to process and transmit perpetually increasing amounts of audio, video, or digitized information. It is only natural that engineers tasked with the realization of these high performance systems insist on being provided with convenient circuit level metrics that quantify the high frequency capabilities of the active devices considered for deployment in circuit cells that can interact to establish the desirable system performance. The most common, but not Ming Hsieh Department of Electrical Engineering - 379 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma necessarily the most illuminating, of these metrics is the short circuit, unity gain frequency, fT, which is commonly referenced as simply the unity gain frequency. In order facilitate our understanding of the engineering implications of metric fT, we consider the test bipolar cell in Figure (3.18a). In this structure, the transistor, whose emitter is incident with electrical ground, is biased in its linear regime by the quiescent base current, IbQ, and the static voltage source, VceQ. In the interest of analytical simplicity, both the static current source and the static voltage source are treated as ideal sources of energy. In particular, neither an impedance is placed across IbQ, nor is a series impedance utilized in conjunction with voltage VceQ. Transistor operation in its forward active domain relies on selecting voltage VceQ to ensure that it exceeds the quiescent base-emitter voltage, VbeQ. In turn, VbeQ is presumably rendered sufficiently large by current IbQ to achieve turn on of the base-emitter diode intrinsic to the subject transistor. A small amplitude, sinusoidal, test signal current, Ibs, is applied in shunt with the aforementioned source of static base current. The combined action of IbQ and Ibs incurs a net collector current comprised of the superposition of a Q-point current component, IcQ, and a signal component, Ics, as we highlight in Figure (3.18a). Similarly, a Q-point current, IeQ, superimposes with a signal current, Ies, in the emitter lead of the transistor. rbb +VceQ IcQ + Ics rc Cμ V + − Ibs rπ Cπ gmV Vbe − IbQ Cs Ics + Ibs ro re IeQ + Ies Ies (a). (b). rbb Ibs Cμ V + − rπ I Cπ gmV Ics Ies (c). Figure (3.18). (a). Test circuit used in the measurement of the unity gain frequency, fT, of the transistor undergoing evaluation. (b). High frequency model of the test structure in (a). (c). The model in (b) simplified by ignoring the collector resistance, rc, and the emitter resistance, re. Using the model of Figure (3.14), the small signal equivalent circuit of the test structure in question is the network shown in Figure (3.18b). Since IbQ in Figure (3.18a) is a current source of constant (static) value, it does not appear in the small signal model. In effect, IbQ is replaced by an open circuit to reflect the fact that IbQ embraces no signal fluctuations and therefore offers zero signal current value. Similarly, the collector in the equivalent circuit is shown grounded to the emitter because VceQ is a constant, and therefore zero signal, voltage source. In short, the supply voltage, VceQ, is supplanted by a short circuit to mirror its zero signal status. Because IbQ and VceQ are necessarily set to zero for small signal analysis purposes, the only current flowing in the collector of the equivalent circuit is the signal constituent, Ics, of the net Ming Hsieh Department of Electrical Engineering - 380 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma collector current. Similarly, the signal emitter current, Ies, is the lone current flowing in the emitter lead of the model. If we ignore tacitly the series collector resistance, rc, and the series emitter resistance, re, we can collapse the model in Figure (3.18b) to the simplified topology we show in Figure (3.18c). Observe that setting rc to zero short circuits the substrate capacitance, Cs, while setting both rc and re to zero imposes a short circuit across the Early resistance, ro. Moreover, ignoring resistances rc and re allows the inherently three-pole structure in Figure (3.18b) to be emulated by the simple single pole, or single time constant, circuit in Figure (3.18c). To the latter end, note that the short circuit imposed at the collector port effectively connects capacitance Cμ in parallel with capacitance Cπ. Obviously, the frequency response of the I/O current transfer function, Ics/Ibs, can be extracted from the measurement test cell in Figure (3.18a). Indeed, this transfer function, which is denoted herewith as β(jω), can be determined straightforwardly from the simplified model given in Figure (3.18c). In particular, the model produces V I bs = + jω Cπ + C μ V rπ (3-60) , ( ) I cs = g mV − jωC μV whence ( ) ) βac 1 − jωC μ gm g m − jωC μ I cs = = , (3-61) 1 I bs + + 1 jωr C C π π μ + jω Cπ + C μ rπ where (3-59) has been used. This result confirms the anticipated low frequency, short circuit current gain of βac. It also projects a right half plane zero at a frequency of gm/Cμ, which is invariably extremely large owing to the relatively small base-collector depletion capacitance, Cμ, and the generally substantial forward transconductance, gm, of a small geometry BJT biased in its forward active domain. Indeed, the frequency, gm/Cμ, is so large as to cast aspersions on the validity of the simplified high frequency model we have used to generate (3-61). Consequently, we can successfully argue the validity of approximating the last result by the expression, I βac β(jω) cs ≈ , (3-62) I bs 1 + jω ωβ β(jω) ( ) where the so-called beta cutoff frequency, 1 ωβ = , rπ Cπ + C μ ( ( (3-63) ) is recognized as the resultant 3-dB bandwidth of the short circuit, small signal current gain, β(jω). The unity gain frequency can now be extrapolated as the gain-bandwidth product, βacωβ, as suggested by the asymptotic frequency response plot given in Figure (3.19). This assertion derives from the fact that at high test signal frequencies, (3-62) becomes βac ωβ β(jω) ω>> ω ≈ , (3-64) β jω from which it is apparent that the magnitude of the current gain degrades to one at a radial frequency, ωT, corresponding to frequency fT, of Ming Hsieh Department of Electrical Engineering - 381 - USC Viterbi School of Engineering Lecture Supplement #05 fT ≡ BJT Models & Biasing J. Choma βacωβ gm ωT ≈ = . 2π 2π 2π Cπ + C μ ( (3-65) ) β(jω) (in dB) βac (dB) op Sl 3 dB e= d 20 − d B/ ec 0 ωβ ωT ω Figure (3.19). Asymptotic approximation of the frequency response of the short circuit, grounded emitter, current gain of a bipolar junction transistor. EXAMPLE #3.4: At room temperature operating conditions, the high frequency silicon technology transistor in Figure (3.18a) is biased at a collector current, IcQ, of 800 μA and a collector-emitter voltage, VceQ, of 2 volts. The transistor has a maximum base resistance, rbb, of 360 Ω, a series collector resistance, rc, of 60 Ω, and a series emitter resistance, re, of 1.5 Ω. The short circuit current gain, βf, of the device is 140 amps/amp, the knee current, Ikf, is 10 mA, the Early voltage, Vaf, is 25 volts, and the saturation current, Is, is 6 fA. For the base-collector junction, the high frequency parameters are Cjco = 5 fF, mc = 1/3, and Vjc = 660 mV, while for the base-emitter junction, Cjeo = 1.5 fF, me = 1/2, and Vje = 920 mV. Moreover, the low current, short circuit transit time, τfo, for base region minority carriers is τfo = 2.5 pSEC. The base-emitter junction injection coefficient, nf, can be taken as nf = 1. Use these numerical data to compute the short circuit unity gain frequency, fT, at the specified operating point. SOLUTION #3.4: (1). Equation (E3-1) in the preceding example defines the quiescent transport current, IccQ, in terms of the Q-point collector current, IcQ. For IcQ = 800 μA and Ikf = 10 mA, this relationship provides ⎡ I cQ ⎛ 4I kf ⎞ ⎤ ⎜1 + 1 + ⎟ ⎥ = 1.06 mA . I ccQ = I cQ ⎢1 + (E4-1) 2I kf ⎜ I cQ ⎟ ⎥ ⎢⎣ ⎝ ⎠⎦ With nf = 1, Is = 6 fA, and, recalling (3-7), VT = 25.89 mV for a junction temperature of Tj = 300.16 °K, (3-5) gives a Q-point voltage, VeQ, developed across the intrinsic base-emitter junction of VeQ = 670.47 mV. (2). Since parameter βf, to which the static beta, hFE, is directly proportional is large, the quiescent base current, IbQ = IcQ/hFE, is correspondingly small. Thus, the Q-point emitter current, IeQ, is virtually identical to its collector counterpart, IcQ. Taking IeQ ≈ IcQ, it follows from Figure (3.11) that the internal collector-emitter voltage, VbQ, is, with VceQ = 2 volts, rc = 60 Ω, and re = 1.5 Ω, Ming Hsieh Department of Electrical Engineering - 382 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing VbQ ≈ VceQ − I cQ rc − I cQ re = 1.95 V . J. Choma (E4-2) In the interest of completeness, hFE can now be evaluated with the assistance of (3-37). In particular, for VbQ = 1.95 volts, and βf = 140, hFE = 113.85 amps/amp. (3). The forward transconductance, gm, computes from (3-41). For the given and calculated variables, ⎞⎛ I cQ ⎛ V ⎞ Ic ⎜1 − ⎟ ⎜ 1 + bQ ⎟ = 29.22 m . gm = (E4-3) n f VT ⎜ Vaf ⎟⎠ 2 I ccQ I kf ⎟ ⎜⎝ ⎝ ⎠ (4). Recalling (3-40), the effective value, τfe, of the minority carrier transit time is I cQ ⎞ ⎛ ⎜1+ ⎟ I kf ⎟ ⎜ τ fe = τ fo = 2.505 pSEC (E4-4) ⎜ VbQ ⎟ ⎜1 + ⎟ ⎜ ⎟ V af ⎝ ⎠ for τfo = 2.50 pSEC. It follows by (3-39) that the base-emitter diffusion capacitance, Cbe, is, for gm = 29.22 mS and τfe = 2.505 pSEC, Cbe = τ fe gm = 73.19 fF . (E4-5) (5). The remaining device capacitances derive from (3-43) and (3-45). In the former of these two relationships, the base-emitter junction threshold potential, Veon, can be taken as 700 mV, despite the fact that the computed value of the base-emitter junction voltage, VeQ, is about 30 mV smaller. Equation (3-43) is, after all, only an approximation of the deletion capacitance evidenced at the forward biased junction. Additionally, capacitance Cjeo is so small that the depletion component of the net base-emitter junction capacitance is doubtlessly inconsequential to the present exercise. Accordingly, with Cjeo = 1.5 fF, Vje = 920 mV, Veon = 700 mV, and me = 1/2, C jeo C je ≈ = 3.07 fF . (E4-6) me ⎛ ⎞ V ⎜ 1 − eon ⎟ ⎜ V je ⎟⎠ ⎝ For capacitance Cμ in (3-45), the intrinsic base-collector junction voltage, VcQ, must first be computed. Appealing to Figure (3.11), VcQ = VeQ − VbQ = − 1.28 volts . (E4-7) Thus, (3-45) yields C jco Cμ = = 3.49 fF , m ⎛ VcQ ⎞ c ⎜1 − ⎟ ⎜ ⎟ V jc ⎝ ⎠ where Cjco = 5 fF, Vjc = 660 mV, and mc = 1/3. (6). (E4-8) Recalling that capacitance Cπ is simply the sum of capacitances Cbe in (E4-5) and Cje in (E46), (3-65) finally delivers gm gm fT = = = 58.32 GHz . (E4-9) 2π Cπ + C μ 2π τ fe gm + C je + C μ ( ) ( ) Those who may be concerned by the tacit neglect of the right half plane zero in (3-61) can verify that for the stipulated operating point conditions, gm/Cμ ≈ 1,332 GHz, which is almost 23-times larger than fT in (E4-9). Ming Hsieh Department of Electrical Engineering - 383 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma COMMENTS: The procedure underlying the numerical evaluation of the unity gain frequency of a BJT is obviously computationally intensive. In order to allay any trepidation on your part that may ensue from this computational intensity, the procedure is documented herewith merely to demonstrate the utility of all of the modeling relationships derived to this point. In practice, and as the reader will be relieved to learn, operating point printouts accompanying SPICE simulations of BJT circuits include a numerical delineation of fT for user-defined transistor operating points. The critical issue at hand is the practical utility of the unity gain frequency metric. In brief, its principle value is to serve as a measure of comparison among devices proposed for utilization in broadband analog or high-speed digital circuit applications. The rationale surrounding this contention is that transistors exemplifying very large values of fT for a specified quiescent operating point can generally be expected to perform more admirably at high signal frequencies than can presumably competitive devices exuding smaller values of the unity gain metric. For example, a transistor projecting fT = 100 GHz is capable of processing more faithfully very high signal frequencies than can transistors having fT = 40 GHz. It is important for us to must appreciate that with the exception of very specialized circuit topologies, fT is an awful (meaning overly optimistic) measure of achievable circuit performance at high signal frequencies. It is even more vital that we comprehend the logic that underlies this negative viewpoint. In particular, fT is a frequency measure for only the short circuit current gain of a transistor cell whose emitter is grounded. It pertains to a circuit topology whose base is driven by an ideal signal current source, the response to which is a current delivered to a short circuited load termination. As such, the fT metric effectively derives from only the time required to transport charge carriers across the base region. Once these carriers are delivered to the collector, where the short circuited load is imposed, the fT metric inherently ignores the time required to charge the substrate capacitance and any other capacitances implicit to the actual load ultimately incident with the collector port of the BJT circuit. In other words, fT fails to account for the frequency response of the output voltage produced by the applied input current since in effect, the output voltage is clamped to zero by the short circuit imposed at the output port. Moreover, and especially for the case of a first stage in a high performance electronic system, fT is likewise oblivious to the time required to charge input port capacitances associated with the utilized transistor. The tacit neglect of capacitive charging times is significant in practical circuits. For example, in a circuit designed to deliver an output voltage response to an applied input signal, the achievable 3-dB bandwidth is rarely larger than about onefifth of the documented value of fT. Notable exceptions to the foregoing assertions are current mode circuits, which extract output responses as signal currents that are applied as currents to succeeding stages. Current mode signal processing is studied in detail later in this text. But for the moment, observe that in the case of the grounded emitter configuration, the collector is a relatively high impedance port owing to the invariably large Early resistance that prevails therein. Accordingly, the collector can be modeled viably as a Norton signal current source. If this output current is thence applied to a subsequent amplification stage featuring very low input impedance, a short circuit is Ming Hsieh Department of Electrical Engineering - 384 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma effectively approximated at the collector port of the predecessor stage. To the extent that the input port of the first stage boasts low input impedance so that large port voltages are precluded, fT becomes a meaningful barometer of high frequency circuit performance. Of course, short circuited input ports in either predecessor or follow on load stages are never exactly possible, with the result that the achievable bandwidths in prudently designed current mode configurations remain rarely larger than 70% to 80% of the published fT value. In summary, fT is arguably a viable, and indeed convenient, metric for comparative shopping of transistors earmarked for deployment in high performance, broadband electronic networks. But except for current mode configurations, which can be adopted only at circuit interstages (meaning stages that do not include the input first stage or the output last stage), it is a virtually useless circuit level figure of merit. Its demonstrable circuit impropriety as a high frequency performance measure stems from the fact that the fT measure is tacitly oblivious to the time required to charge device and circuit capacitances at both input and output ports. 60 Unity Gain Frequency, fT (GHz) f TM 50 40 30 20 10 0 0.01 I cM 1.00 0.10 10.00 Collector Current, I cQ (mA) Figure (3.20). The unity gain frequency, fT, plotted as a function of the quiescent collector current, IcQ, for the transistor studied in Example #3.4. The quiescent collector-emitter voltage of the subject transistor is held at 2 volts. Although transistor vendors and process foundries are anxious to quote impressive fTvalues to facilitate the comparative shopping to which the foregoing commentary alludes, they are reticent to underscore the fact that fT varies with collector current. Indeed, fT is a notably sensitive function of the quiescent collector current, IcQ, when IcQ is small, as is typical in circuits constrained to function at low power levels. In the true spirit of aggressive marketing, quoted unity gain frequency values invariably reflect maximum attainable values, which may unfortunately correspond to collector currents deemed inappropriate for specific applications. To wit, the transistor parameterized in the preceding example generates the fT -versus- IcQ characteristic Ming Hsieh Department of Electrical Engineering - 385 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma displayed in Figure (3.20). A careful examination of the data underpinning this curve reveals that the maximum value, say fTM, of the unity gain frequency is 58.3 GHz, which is achieved at a collector current of IcM = 831.8 μA. Fortunately, the curve at hand displays a rather broad maximum, thereby negating the need to set the quiescent collector current precisely to achieve a unity gain frequency that is within a few percent of its maximum value. Note, however, that it makes little sense to bias the transistor of interest to the right of current IcM in that similar fT-values are achievable at the lower circuit power dissipation associated with current biasing below IcM. An analytical determination of the optimal collector current associated with maximal unity gain frequency is a challenge owing to the dependence of numerous relevant modeling parameters on collector current. Nonetheless, we can arrive at an acceptable approximation. To this end, return to (3-65) and note that the net capacitance, say Cnet, in the denominator on the right hand side is (3-66) Cnet = Cπ + C je + C μ = τ fe g m + C j , where (3-39) and (3-44) have been used, and the sum total, Cj, of transistor depletion capacitances is (3-67) C j = C je + C μ . In the last expression, Cje and Cμ are given by (3-43) and (3-45), respectively. While capacitance Cje is a constant, Cμ is a function of the intrinsic base-collector junction reverse bias, Vc, which depends somewhat on the collector current owing to the presence of series resistances in the collector and emitter leads of the transistor. Because these series resistances are small, this collector current dependence can be ignored, thereby establishing Cj as a constant, independent of quiescent collector current. In particular, the tacit neglect of intrinsic series resistances implies that the intrinsic collector-emitter voltage is simply the externally applied collector-emitter voltage, VceQ, whence VcQ is set to the voltage difference, (Veon − VceQ). Moreover, voltage VbQ is presumed to be significantly smaller than the Early voltage, Vaf, so that τfe in (3-39) becomes I cQ ⎞ ⎛ ⎜1+ ⎟ ⎛ I kf ⎟ I cQ ⎞ ⎜ τ fe = τ fo ≈ τ fo ⎜ 1 + (3-68) ⎟. ⎜ ⎜ VbQ ⎟ I kf ⎟⎠ ⎝ ⎜⎜ 1 + ⎟⎟ V af ⎝ ⎠ At this juncture, the unity gain frequency in (3-65) approximates gm gm (3-69) fT = . ≈ ⎡ ⎛ ⎤ 2π Cπ + C μ I cQ ⎞ 2π ⎢ τ fo ⎜ 1 + ⎟ gm + C j ⎥ I kf ⎟⎠ ⎢⎣ ⎜⎝ ⎥⎦ ( ) At small collector currents, the transconductance parameter, gm in (3-54) collapses to ⎞⎛ I cQ ⎛ I cQ V ⎞ I cQ ⎜1 − ⎟ ⎜ 1 + bQ ⎟ ≈ gm = , (3-70) n f VT ⎜ Vaf ⎟⎠ n f VT 2 I ccQ I kf ⎟ ⎜⎝ ⎝ ⎠ where VbQ continues to be presumed much smaller than Vaf. Specifically, transconductance gm, which increases monotonically for all values of the quiescent collector current, IcQ, is seen as increasing linearly with small quiescent collector current IcQ. This reduced transconductance relationship, which allows expressing (3-69) as Ming Hsieh Department of Electrical Engineering - 386 - USC Viterbi School of Engineering Lecture Supplement #05 fT ≈ BJT Models & Biasing gm J. Choma I cQ ≈ , (3-71) ⎡ ⎛ ⎤ ⎡ τ fo ⎛ ⎤ I cQ ⎞ I cQ ⎞ 2π ⎢ τ fo ⎜ 1 + 2πn f VT ⎢ ⎟ gm + C j ⎥ ⎜1 + ⎟ I cQ + C j ⎥ I kf ⎟⎠ I kf ⎟⎠ ⎢⎣ ⎜⎝ ⎥⎦ ⎢⎣ n f VT ⎜⎝ ⎥⎦ is arguably valid through the immediate neighborhood of maximum fT in that Figure (3.20) suggests maximal fT is achieved at a collector current that is substantively smaller than the forward knee current of a BJT. Equation (3-71) affirms the original allegation of a current dependence ascribed to the unity gain frequency metric. Aside from such affirmation, it also highlights two additional issues. First, it validates the nominally linear rise of fT with current IcQ that is observed in Figure (3.20) for low collector currents. From (3-71), we note that the slope of this low current rise is 1/2πnfVTCj, which means that progressively larger depletion capacitances at either or both transistor junctions slows the current rate of fT ascent to its maximum value. Second, since (371) delivers positive fT for all considered values of IcQ and further yields fT = 0 at both IcQ = 0 and IcQ = ∞, it foretells the existence of an optimal current, say IcM, commensurate with securing maximal unity gain frequency. This optimal current derives from constraining to zero the derivative, dfT/dIcQ, in (3-71). The result of this somewhat tedious exercise is n f VT I kf C j I cM = . (3-72) τ fo Setting IcQ = IcM in (3-71) gives a maximum unity gain frequency of 1 2π τ fo fTM = , n f VT C j 1+ 2 τ fo I kf (3-73) which advances 1/2πτfo as the largest possible value of the maximum unity gain frequency. When (3-72) and (3-73) are applied to the transistor studied in Example #3.4, IcM = 823.3 μA, and fTM = 54.66 MHz. These computations differ from their simulated values by slightly more than 1% and about 6.7%, respectively, which is good enough for government work and stereotypically aggressive marketing practices. 3.3.2. UNITY POWER GAIN FREQUENCY The unity gain frequency discussed in the preceding subsection codifies the high frequency response capabilities of a grounded emitter transistor in terms of the frequency response of its short circuit, and therefore maximum, current gain. Although the small signal, frequency domain performance of electronic networks is commonly evaluated in terms of either current gain or voltage gain characteristics, it should be noted that the primary purpose of active circuits is to supply signal power gain between network input and output ports. Accordingly, an assessment of high frequency device response capabilities in terms of the maximum power gain afforded by a utilized transistor makes good engineering sense. To the foregoing end, consider the grounded emitter amplifier of Figure (3.21a) in which the static supply voltages, Vcc and Vbb, ensure that the utilized BJT operates in its forward active regime. The signal source, Vs, is applied to the amplifier input port through a complex series impedance, Zs(jω), which is understood to include the Thévenin impedance of the signal source itself. In response to Vs, which is a small amplitude sinusoid, a signal component, Vos, of Ming Hsieh Department of Electrical Engineering - 387 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma the net output port voltage, Vo, is generated, as is a signal component, Vis, to the net input port voltage, Vi. The amplifier, whose output port is terminated to signal ground in the complex load admittance, Yl(jω), can be represented as a voltage controlled current source, as suggested in Figure (3.21b). In this representation, Yfe(jω)Vis is the Norton, or short circuit, output signal current, while Yoe(jω) is the amplifier shunt output admittance facing load admittance Yl(jω). At the amplifier input port, it is convenient to separate the intrinsic base resistance, rbb, from the net input impedance or admittance. Accordingly, the admittance, Yie(jω), is the load presented to the signal source circuit by the net admittance associated with the effective load appearing across the intrinsic base-emitter junction. rbb Io Zs(jω) + Yie(jω) Vs − Vo Zs(jω) Vis + Yl(jω) +Vcc Vi Ios Yfe(jω)Vis Vbb Vos Yl(jω) − + Yoe(jω) Vs − (a). (b). Figure (3.21). (a). A simple grounded emitter amplifier. (b). Voltage controlled current source representation of the I/O ports of the amplifier in (a). Assuming that the transistor in Figure (3.21a) derives from a monolithic fabrication process, the transistor equivalent circuit shown in Figure (3.14) launches the small signal amplifier model depicted in Figure (3.22a). Since the Norton equivalent output current, Yfe(jω)Vis in Figure (3.21a), is the current conducted by a short circuited load, the model appropriate to determining Yfe(jω) is the structure given in Figure (3.22b). Observe that the only difference between the topologies of Figures (3.22a) and (3.22b) is that load admittance Yl(jω) in the former diagram is supplanted by a short circuit in the latter figure. From Figure (3.22b), the signal current, Ios, conducted by the short circuited load satisfies I os = gmV − jωC μV = gm − jωC μ V , (3-74) ( ) while signal voltage V relates to the signal component, Vis, of the net input port voltage, Vi, as rπ rπ 1 + jωrπ Cπ + C μ V rπ + rbb (3-75) = = . rπ Vis 1 + jω r r C + C ( ) π bb π μ + rbb 1 + jωrπ Cπ + C μ ( ( ) ( ) ) Using the last two expressions, we find a Norton transadmittance, Yfe(jω), of Ming Hsieh Department of Electrical Engineering - 388 - USC Viterbi School of Engineering BJT Models & Biasing J. Choma jωC μ ⎞ g m rπ ⎛ ⎜1 − ⎟ rπ + rbb ⎝ gm ⎠ I os Y fe (jω) = . = Vis 1 + jω ( rπ rbb ) Cπ + C μ rbb Cμ Vis Zs(jω) ( + Vs V − + − (3-76) ) rπ Cπ gmV ro Ios Vos Cs Yl(jω) Lecture Supplement #05 (a). Zs(jω) rbb Vis + V Cμ + − Vs rπ Cπ Ios gmV ro Cs − (b). Vis V + − rπ Cπ Vx gmV ro Cs Ix (c). Yie(jω) Cμ Vx Ix Yoe(jω) Cμ + V = Vx − rπ Cπ Vos gmV ro Cs Yl(jω) Zs(jω) rbb (d). Figure (3.22). (a). Small signal, high frequency equivalent circuit of the amplifier in Figure (3.21a). (b). Small signal model used in the evaluation of the forward transadmittance function, Yfe(jω). (c). Small signal model for evaluating the Norton admittance, Yoe(jω), established at the amplifier output port. (d). Small Ming Hsieh Department of Electrical Engineering - 389 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma signal model for evaluating the Norton admittance, Yie(jω), established at the intrinsic base-emitter junction of the utilized transistor. The right half plane zero at gm/Cμ is invariably so large as to lie outside the frequency range over which the transistor model in Figure (3.14) can be presumed valid and is therefore ignored henceforth. Thus, the high frequency transadmittance in (3-76) can be approximated as I gm ωT (3-77) Y fe (jω) = os ≈ = , Vis jωrbb jωrbb Cπ + C μ ( ) where ωT = gm Cπ + C μ (3-78) is the device unity gain frequency introduced in (3-65). It is interesting to note that the form of (3-77) implies that the high frequency transadmittance characteristics of a grounded emitter BJT amplifier reflect the response properties of an ideal integrator because of the presence of (jω), which corresponds to Laplace operator “s,” in the denominator. Figure (3.22c) diagrams the equivalent circuit appropriate to an evaluation of the shunt output admittance, Yoe(jω). This structure is the original model in Figure (3.22a) with two modifications. First, the independent signal source, Vs, is set to zero, as is mandated by an impedance computation at any network port. Second, the load admittance, Yl(jω), is supplanted by a mathematical ohmmeter simulated by the independent current source, Ix. This current forges a voltage, Vx, across, and in disassociated polarity with, current Ix so that the target output admittance, Yoe(jω), is simply Ix/Vx. Conventional circuit analysis reveals ⎡1 ⎤ (3-79) I x = ⎢ + jω Cs + C μ ⎥Vx + g m − jωC μ V , ⎣ ro ⎦ and ⎡ ⎤ 1 + jω Cπ + C μ ⎥V − jωC μVx = 0 . (3-80) ⎢ ⎢⎣ rπ ( rbb + Rs ) ⎥⎦ Inserting the solution for voltage V in (3-80) into (3-79) leads to jω ⎡⎣ rπ ( rbb + Rs ) ⎤⎦ C μ g m − jωC μ I 1 (3-81) Yoe (jω) = x = + jω Cs + C μ + . Vx ro 1 + jω ⎡⎣ rπ ( rbb + Rs ) ⎤⎦ Cπ + C μ For high frequency signal environments where transconductance gm can still be presumed to be substantively larger than the capacitive susceptance, ωCμ, (3-81) reduces to the reasonably compact relationship, 1 Yoe (jω) ≈ + ωT C μ + jω Cs + C μ . (3-81) ro Note that the base-collector depletion capacitance, Cμ, generates a conductance component, ωTCμ, to the net shunt output admittance. We may ultimately be able to exploit this observation when a specific circuit application warrants a lossless reduction in the amplifier output resistance. ( ) ( ( ) ) ( ( ) ( ( ) ) ) Figure (3.22d) is the small signal model for calculating the shunt admittance, Yie(jω) for the subject grounded emitter amplifier. Observe that the voltage, Vx, across the imposed Ming Hsieh Department of Electrical Engineering - 390 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma mathematical ohmmeter is identical to the signal voltage, V, appearing across the base-emitter junction. A conventional nodal circuit analysis delivers ⎡1 ⎤ I x = ⎢ + jω Cπ + C μ ⎥V − jωC μVos ⎣ rπ ⎦ , (3-82) ⎡ ⎤ 1 + jω Cs + C μ ⎥Vos + gm − jωC μ V = 0 ⎢ ⎣ ro Z l (jω) ⎦ ( ) ( ) ( ) where Zl(jω) is the impedance corresponding to the load admittance, Yl(jω). The elimination of voltage Vos in these two independent relationships leads directly to ⎧ ⎡ ⎤ ⎫⎪ gm ( ro Z l (jω)) I 1 ⎪ ⎥ Cμ ⎬ , (3-83) Yie (jω) = x ≈ + jω ⎨Cπ + ⎢1 + V rπ 1 + jω ( ro Z l (jω)) Cs + C μ ⎥ ⎪ ⎢⎣ ⎪⎩ ⎦ ⎭ where the indicated approximation exploits the presumption that for all signal frequencies of interest, gm >> ωCμ. At high signal frequencies, (3-83) collapses to ⎛ Cμ ⎞ I 1 (3-84) Yie (jω) = x ≈ + gm ⎜ ⎟ + jω Cπ + C μ . ⎜ Cs + C μ ⎟ V rπ ⎝ ⎠ ( ( Vis Zs(jω) ) ) rbb + Vs rπ − C s + Cμ gmCμ Cπ Cμ Yie(jω) Vos ωT Vis jωrbb ro 1 ωT Cμ Cμ Yl(jω) Ios Cs Yoe(jω) Figure (3.23). Approximate high frequency, Norton equivalent I/O port model for the grounded emitter amplifier in Figure (3.21a). As is the case with the shunt output admittance, the base-collector depletion capacitance, Cμ, spawns a shunt input conductance component (second term on the right hand side of the Yie(jω) relationship) to the net input admittance. Equation (3-84), along with (3-81) and (3-77), gives rise to the high frequency I/O port model offered in Figure (3.23), which clearly identifies the net shunt resistances and capacitances at both the input and output ports of the amplifier. In the interest of clarity, we observe that while Yoe(jω) is the net admittance facing the terminating load admittance, Yie(jω) is not the net input admittance faced by the signal source. Instead, the input impedance driven by the applied input signal is [rbb + 1/Yie(jω)]. The prerequisite for maximum power gain in an amplifier, such as the one addressed presently, is the successful realization of conjugate impedance/admittance matches at both the Ming Hsieh Department of Electrical Engineering - 391 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma input and the output ports. In particular, the source impedance, Zs(jω), must be the complex conjugate of the net input impedance it faces at signal frequency ω. Concurrently, the load admittance, Yl(jω), must be a conjugate match to the net output admittance that it effectively shunts. Achieving these conjugate matches, particularly over a broad range of signal frequencies, is hardly a casual walk in the proverbial park. The requisite engineering tasks entail the design and implementation of appropriate I/O filters that respectively interact with the source and load terminations to produce the desired matching. These filters must invariably be nominally lossless structures (meaning that their intrinsic topological elements are exclusively inductances and capacitances) so that they do not waste significant amounts of applied signal power that might otherwise be processed for delivery to the load termination. Another issue that we may need to address with the incorporation of I/O filters is that the impedance matching at both input and output ports for certain types of transistors and circuit architectures may result in a potentially unstable network in the sense that one or more network poles lie in the right half complex frequency plane. The conjugate admittance match at the output port implies two operational requirements. First, the shunt conductance component, say Gl, of the load admittance must equate to the real part, or conductance component, of Yoe(jω). In particular, 1 + ωT roC μ 1 1 (3-85) . Gl = Re [Yoe (jω)] = + ωT C μ = Roe ro ro Second, the susceptive component of load admittance Yl(jω) must be inductive to enable its resonance with the net shunt output capacitance, (Cμ + Cs), at the radial signal frequency, ω. The proper selection of a load that satisfies these two design requirements resultantly condenses the output port section shown in Figure (3.23) to the elegantly simple topology of Figure (3.24a), which projects an output signal voltage, Vos, of ω V ⎛R ⎞ (3-86) Vos = − T is ⎜ oe ⎟ . jωrbb ⎝ 2 ⎠ rbb rbb Vis Vos Ios ωT Vis jωrbb + Roe Roe (a). Vs − (b). Figure (3.24). (a). The high frequency output port model of the grounded emitter amplifier in Figure (3.21a) when the load admittance, Yl(jω), is selected to be a conjugate match to the Norton output admittance, Yoe(jω), in Figure (3.23). (b). High frequency input port model of the grounded emitter amplifier under the condition of a source impedance [Zs(jω)] conjugate match to the net input impedance, rbb + 1/Yie(jω) in Figure (3.23). The corresponding maximum signal power, say Pomax, delivered to the resistive component of the load that terminates the output port is Ming Hsieh Department of Electrical Engineering - 392 - USC Viterbi School of Engineering Lecture Supplement #05 Pomax = BJT Models & Biasing 2 Vos Roe J. Choma 2 ⎛ω V ⎞ = ⎜ T is ⎟ Roe . ⎝ 2ωrbb ⎠ (3-87) At the input port, the real part, say Rs, of the effective source impedance, Zs(jω), must be set to effect a conjugate match between the source impedance and amplifier input impedance, [rbb + 1/Yie(jω)]. With reference to Figure (3.23), ⎧ ⎫ 1 1 ⎪ 1 − jωRie Cπ + C μ ⎪ = = ⎨ R , (3-88) 2 ⎬ ie Yie (jω) ⎛ Cμ ⎞ 1 ⎪ 1 + ⎡ωRie Cπ + C μ ⎤ ⎪ + gm ⎜ + jω Cπ + C μ ⎣ ⎦ ⎭ ⎩ ⎜ Cs + C μ ⎟⎟ rπ ⎝ ⎠ where βac gm 1 Rie . (3-89) = ⎛ Cμ ⎞ ⎛ Cμ ⎞ 1 1 + βac ⎜ + gm ⎜ ⎟ ⎜ Cs + C μ ⎟⎟ ⎜ Cπ + C μ ⎟ rπ ⎠ ⎝ ⎠ ⎝ Interestingly, the impedance, 1/Yie(jω), is purely imaginary at very high signal frequencies. In particular, ( 1 ≈ Yie (jω) ω large ( ) 2 − ⎡ jωRie ( Cπ + C μ )⎤ ⎣ ⎦ − jωRie2 Cπ + C μ ( ) = ( 1 jω Cπ + C μ ) ( ) , ) (3-90) which is to say that the magnitude of the very high frequency current conducted by resistance rπ in Figure (3.23) pales in comparison to that of the current conducted by the net shunt capacitance, (Cπ + Cμ). This revelation hardly warrants a prize paper award in view of our understanding that capacitances in the sinusoidal steady state emulate short circuited elements when they are compelled to conduct high frequency currents. It follows that the real part of 1/Yie(jω) approaches zero at high frequencies, whence the source resistance, Rs, commensurate with input port impedance matching becomes ⎡ ⎡ 1 ⎤ 1 ⎤ (3-91) Rs = Re ⎢ rbb + ⎥ = rbb + Re ⎢ ⎥ ≈ rbb . Yie (jω) ⎦ ⎣ ⎣ Yie (jω) ⎦ Figure (3.24b) shows the immediate ramification of a high frequency input port impedance match, where it is to be understood that the reactive component of the original source impedance, Zs(jω), has been selected to resonate with the net shunt capacitance, (Cπ + Cμ). Such a design tack is tantamount to ensuring that the sum of the reactances associated with Zs(jω) and 1/Yie(jω) is zero at the signal frequency, ω, of interest. For the maximum power transfer condition implied by (3-91), the maximum signal power, Pimax, delivered to the input port of the grounded emitter amplifier is obviously Pimax = Vis 2 . rbb A combination of this result with (3-87) leads to a maximum power gain, Ap, of 2 Pomax ⎛ω ⎞ ⎛R ⎞ = ⎜ T ⎟ ⎜ oe ⎟ , Pimax ⎝ 2ω ⎠ ⎝ rbb ⎠ and recalling (3-85), Ap Ming Hsieh Department of Electrical Engineering (3-92) (3-93) - 393 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing 2 ωT ⎛ ωT ⎞ ⎛ Roe ⎞ Ap = ⎜ ⎟ = ⎟ ⎜ 2 ⎝ 2ω ⎠ ⎝ rbb ⎠ 4ω rbbC μ 1 + 1 ωT roC μ ( J. Choma ) . (3-94) Somewhat disconcertingly, (3-94) shows that the high frequency power gain of a grounded emitter amplifier degrades sharply with increasing signal frequency. This observation explains the debilitating pain we experience when we are tasked with the responsibility of achieving substantive signal power gain at extremely high frequencies. Indeed, power gain Ap is inversely proportional to the square of the radial frequency, ω, which means that the power gain frequency response rolls off with increasing frequency at a rate of 40 dB/decade. Since a maximum power gain of one effectively defines the practical utility of an amplifier in the sense of its ability to deliver greater than unity power gain, the frequency, say ωmax, at which Ap degrades to one, can be postured as an ostensibly reasonable figure of merit for broadband performance. From (3-94), ωT ωmax = , (3-95) ⎛ 1 ⎞ 4rbbC μ ⎜ 1 + ⎟ ⎜ ωT roC μ ⎟⎠ ⎝ or in units of hertz, ωmax fT fT f max = = ≈ , (3-96) 2π 8πr C ⎛ ⎞ 1 bb μ 8πrbbC μ ⎜ 1 + ⎟⎟ ⎜ 2πfT roC μ ⎠ ⎝ where the indicated approximation reflects the common circumstance, 2πfTroCμ >> 1. For the transistor examined in Example #3.4, which at the stipulated operating point has rbb = 360 Ω, Cμ = 3.49 fF, and fT = 58.32 GHz, the preceding equation delivers fmax = 42.86 GHz, which is more than 26% smaller than the fT rating of the device. When rbbCμ > 1/4ωT, which is a commonly satisfied inequality, particularly for silicongermanium heterostructure bipolar transistors, the unity power gain frequency, fmax, more conservatively brackets the high frequency performance ceiling of a transistor than does the unity current gain frequency, fT. Despite this arguably laudable conservatism, device selection decisions premised on fmax must nonetheless be tempered in light of the myriad of analytical approximations we invoked to arrive at (3-96). More importantly, the engineering implications implicit to the concept of the unity power gain frequency must be placed into proper perspective. In particular, fmax represents the approximate input signal frequency for which the maximum possible power gain of a grounded emitter amplifier degrades to unity. But maximum power gain is realized if and only if conjugate impedance or admittance matches prevail between terminating load and amplifier output impedances and between signal source and amplifier input impedances. Except for certain classes of narrowband, tuned amplifiers, such conjugate matches are rarely achievable in broadband configurations. Indeed, most broadband amplifiers, and particularly lowpass amplifiers, do not operate with conjugate impedance matches at I/O ports, which means that these amplifiers do not deliver maximum power gain. In fact, they may be designed expressly for the delivery of maximum voltage or current gains or perhaps specific values of these gains. Thus, just like the short circuit figure of merit, fT, does not reflect realistic operating conditions, fmax may likewise be somewhat impertinent to a broad range of amplifier topologies. In these cases, the actual achievable bandwidths are generally in the range of one-fourth to one-third of fmax. Ming Hsieh Department of Electrical Engineering - 394 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma An even more insidious problem is that all grounded emitter amplifiers cannot be designed to deliver match terminated maximum power gain. As we briefly mentioned above and as we discuss in a subsequent chapter, some amplifiers are potentially unstable, which is to say that there exists a range of passive load terminations for which self-sustaining oscillations are supported by the considered network under zero input signal conditions. Potential instability does not surface in the foregoing discourse because the high frequency models invoked are simplified to an extent that the realistic potential instability mechanisms of common emitter units are implicitly masked. More complicated high frequency models, which take due consideration of the response ramifications of time delays associated with the forward transconductance and the dynamics observed at junction sidewalls in the complicated two dimensional monolithic macromodel of Figure (3.12), may imply potential instability for selected quiescent operating points. It follows that grounded emitter amplifiers represented by these high level models may be incapable of delivering maximum power gain without a significant risk of instability. In these cases, the pertinence of fmax in (3-96) is dubious. 3.4.0. BJT BIASING As noted earlier, the primary purpose of biasing electronic circuits is to enable nominally linear responses to suitably small input voltage or current signals that are applied to these circuits. In the case of bipolar junction transistors earmarked for circuit architectures developed to satisfy I/O performance specifications, the biasing problem is a two-step task. The first of these tasks is the selection of a quiescent collector current, IcQ, which is deemed appropriate to the target I/O specifications of the proposed circuit. Such selection is necessarily mindful of the fact that nominally linear BJT operation requires biasing in the linear domain. Recall that in this operating domain, the base-emitter voltage, Vbe, of each BJT must be sufficiently large to ensure an intrinsic junction voltage, Ve, which is at least as large as the threshold voltage, Veon, of the base-emitter junction for all relevant values of applied signal levels. Moreover, we must embrace an assurance that the intrinsic base-collector junction voltage, Vc, is negative or at most zero for all pertinent signal levels. The latter voltage constraint is satisfied automatically in NPN devices if collector-emitter voltages, Vce, are at least as large as base-emitter voltages, Vbe. Analogous constraints apply to PNP units whose emitter-collector voltages, Vec, must exceed or at least equal emitter-base voltages, Veb, which support desired quiescent collector currents. The selection of suitable quiescent collector currents is hardly a visceral engineering exercise. These currents are typically premised on desired circuit gains, since gain is a function of device forward transconductance, which has been witnessed as a current-dependent small signal metric. The quiescent collector current supported by the biasing design might also be chosen in light of network bandwidth, noise, distortion, power dissipation, or other circuit performance barometers deemed by the circuit designer as critical to the acceptable realization of system performance specifications. In addition to the voltage constraints underlying linear domain operation of a BJT, an important practical issue must be appreciated and addressed by the circuit designer during the collector current selection process. In particular, it makes little sense to bias a BJT at a collector current that exceeds the device knee current. One problem associated with high current biasing is needlessly high power dissipation. Another problem implicit to biasing at or beyond the transistor knee current is that the DC beta, hFE, decreases monotonically with high collector current levels, thereby compromising the current gain of the network into which the subject transistor is connected. While transconductance, which is indeed a measure of achievable small signal circuit gain, increases monotonically with collector Q-point current, the unity Ming Hsieh Department of Electrical Engineering - 395 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma gain frequency, fT, which liberally limits circuit bandwidth, peaks at a current that is generally far smaller than the device knee current. The immediate implication of this fact is that biasing the collector to the right of the fT peak produces an fT value that is identical to that forged slightly to the left of the fT peak. Thus, power dissipation budgets, thermal concerns, and even electrical noise considerations render high current biasing foolish when suitably lower current biasing nets similar and presumably meaningful and acceptable device and circuit performance. While design generalities in electronics are fraught with peril, the portability culture that is a signature of modern electronics renders one assertion autonomous. In particular, the quiescent collector current of each active device within an electronic network should be chosen as the smallest current level commensurate with nominally linear device operation and both predictable and reliable satisfaction of all stipulated circuit operating specifications. The second of the two-step biasing design task derives from the previously espoused fact that the quiescent collector current conducted by a BJT determines the numerical values of several branch elements implicit to the small signal models of Figures (3.14) and (3.15). It follows that the biasing structure must reliably establish each device collector current as a robustly rigid and predictable constant. Suppose, for example, that device biasing currents fluctuate as a function of noise coupled parasitically to the static voltage supply line of a circuit or of signal levels manifested between base and emitter or collector and emitter. The resultant contamination of such small signal parameters as rπ, Cπ, gm, and ro produce a time varying model for which the implicit challenges associated with closed form small signal circuit analyses all but preclude the generation of predictable and reproducible results. In effect, the biasing problem is therefore seen as entailing the implementation of collector currents whose available current levels are ideally constant, independent of operating temperature and signal levels. Implicit to the requirement of a constant and predictable biasing current is that the current in question be rendered relatively insensitive to the impact exerted on device characterization metrics by the inherently vagarious nature of semiconductor device processing and manufacturing. Stated quite simply, the quiescent collector current, IcQ, of each BJT must be reliably predictable in terms of designable circuit elements. It must also be adequately desensitized to temperature phenomena, signal voltages and currents, and the parametric uncertainties that comprise implicit baggage of active monolithic devices. 3.4.1. PASSIVE BIASING NETWORKS The most straightforward of biasing structures engaged for use in linear signal processing networks employ only passive elements to realize a desired quiescent collector current. In the subsections that follow, two passive networks are examined from four distinct perspectives. The first of these design-oriented perspectives is the penchant of the proposed network to achieve and sustain predictable quiescent operating current. Second, the sensitivity of the quiescent current to key device parameters is illuminated. Third, the degree to which the quiescent collector current is affected by increases in the junction operating temperature of the subject bipolar devices is examined. Finally, the dependence of Q-point collector current on signal swings manifested at the collector port is investigated. The last investigation is tantamount to examining the small signal impedance established at the collector port. Since sources of constant current are characterized by infinitely large terminal impedances, we desire an aforementioned small signal impedance that is ideally infinitely large. Ming Hsieh Department of Electrical Engineering - 396 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma 3.4.1.1. World’s Worst BJT Biasing Circuit The task of developing biasing strategies begins by acquiring an insightful understanding of the two major issues that accompany pragmatic bias circuit design. These issues, which embrace quiescent collector current dependence on the static gain parameter, hFE, and the inherently positive temperature coefficient of collector current, are highlighted by the simple biasing cell offered in Figure (3.25a). The circuit at hand uses the voltage divider formed of resistances R1 and R2 to prescribe the quiescent base-emitter voltage, VbeQ, which is required to support the desired quiescent collector current, IcQ. Since IcQ is largely determined by the base-emitter junction bias when the transistor operates in its linear domain, it is nominally independent of the collector load resistance, Rl, which is selected to satisfy small signal gain or other requirements. However, Rl sets the quiescent collector-emitter voltage, VceQ in accordance with +Vcc R1 +Vcc Rl Rl IcQ IcQ /hFE VbeQ − + IcQ /hFE VceQ + R2 IcQ + VceQ + − R1||R2 ( hh +1 ) I VbeQ − − ( hh +1 ) I FE FE cQ FE ( R R+R )V + cQ FE 2 1 (a). 2 cc − (b). Figure (3.25). (a). Simple biasing circuit for a bipolar junction transistor. (b). An equivalent representation of the topological structure of (a). (3-97) Vcc = Rl I cQ + VceQ . For a given power supply voltage, Vcc, and a desired quiescent collector current, IcQ, this simple KVL relationship shows that in view of the fact that VceQ must be at least as large as VbeQ to promote BJT operation in its linear regime, large values of Rl are precluded. In concert with the linear domain requirement, observe that the base current is delineated in Figure (3.25a) as IcQ/hFE, whence an emitter current that is (hFE +1)-times larger than the base current. The application of Thévenin’s theorem to the circuit in Figure (3.25a) results in the equivalent representation what we offer in (3.25b). In the latter diagram, ⎛ I cQ ⎞ ⎛ R2 ⎞ (3-98) ⎟ + VbeQ , ⎜ ⎟Vcc = ( R1 R2 ) ⎜ ⎝ R1 + R2 ⎠ ⎝ hFE ⎠ which delivers ⎤ ⎛ h ⎡ R ⎞ I cQ = FE ⎢Vcc − ⎜ 1 + 1 ⎟VbeQ ⎥ . (3-99) R1 ⎣ R2 ⎠ ⎝ ⎦ Prior to using this result to assess the quality of the subject biasing circuit, it is important for the reader to understand the reason underlying the decision to apply KVL to the base-emitter loop of Ming Hsieh Department of Electrical Engineering - 397 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma the circuit, as opposed to using (3-97), which is the fruit of KVL applied to the collector-emitter loop. In particular, (3-97) delivers the irrefutably simpler collector current expression, Vcc − VceQ I cQ = . (3-100) Rl While this equilibrium relationship is assuredly valid, it conveys the impression that the quiescent collector-emitter voltage, VceQ, is an independent voltage variable on which the quiescent collector current, IcQ, depends. But (3-33) and (3-36) demonstrate that the collector current of a BJT is only weakly dependent on the internal collector-emitter voltage, Vb, and thus its extrinsic counterpart, since the Early voltage, Vaf, is a reasonably large number. Indeed, the collector current is independent of Vb if the idealized case of infinitely large Early voltage is adopted. In contrast, (3-33) and (3-36) show a pronounced, exponential dependence of collector current on internal base-emitter voltage, Ve, which relates intimately to the base-emitter terminal quiescent voltage, VbeQ. Accordingly, (3-99) propounds a design-oriented, and thus far more relevant, expression for Q-point collector current than does (3-100). Equation (3-99) offers two reasons for nominating the biasing circuit of Figure (3.25a) as the worst in the world. The first of these reasons is the direct dependence of quiescent collector current on the gain metric, hFE. We recall that hFE is directly proportional to the Ebers-Moll parameter, βf, which, because of its inverse dependence on the extremely narrow base width of a bipolar junction transistor, can be controlled typically to within only factors ranging from 2:1 to 4:1. Thus, the precise value of hFE for a given transistor is unknown, which renders an accurate prediction of IcQ dubious. The upshot of the matter is that conventional monolithic processing, which promulgates a vagarious nature to hFE, renders impossible the accurate numerical delineation of IcQ in Figure (3.25a). A second reason motivating an engineering veto of the biasing circuit at hand is unacceptably large temperature sensitivity of the quiescent collector current. Recall from the discussion in Section (3.2.0) and the temperature sensitivity disclosures in the preceding chapter on PN junction diodes that in order to sustain constant collector current in the face of junction temperature increases, the internal base-emitter voltage must decrease at a nominally constant temperature rate. This requisite decrease in intrinsic base-emitter junction voltage can be translated to a decrease in terminal base-emitter voltage, VbeQ, as (3-101) ΔVbeQ ≈ − Sbe ΔT j , where Sbe is an empirical constant of the order of 2 mV/°C, and ΔTj is the change incurred in the operating temperature, Tj, of the base-emitter junction. Accordingly, (3-98) provides a collector current temperature coefficient, say σi, of ΔI cQ h S (3-102) σi ≈ FE be , ΔT j R1 R2 which shows that the temperature sensitivity factor, Sbe, is effectively amplified by hFE, which while precisely unpredictable, is nonetheless an assuredly large number. The actual temperature coefficient of the quiescent collector current can be expected to be somewhat larger than σi in (3102) owing to the slight dependence on temperature of parameter hFE and the nonzero temperature coefficients associated with the circuit resistors. Ming Hsieh Department of Electrical Engineering - 398 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma EXAMPLE #3.5: The silicon transistor in the biasing circuit of Figure (3.25a) has a minimum hFE of 100. Using a 3 volt power supply, design the circuit so that it dissipates no more than 8 mW of power, while delivering a quiescent collector current of 2 mA at a collector-emitter voltage of 1 volt at room temperature. Assume that the transistor delivers hFE = 100 and that the required quiescent base-emitter voltage is 720 mV. For this design, estimate the resultant change in quiescent collector current when the base-emitter junction temperature rises by 30 °C. To the latter end, take Sbe = 1.8 mV/°C. SOLUTION #3.5: (1). The simplest calculation pertains to the collector load resistance, Rl. From either Figure (3.25a) or (3-100), IcQ = 2 mA, Vcc = 3 volts, and VceQ = 1 volt yields Vcc − VceQ Rl = = 1 KΩ . (E5-1) I cQ (2). The current, say IR1, conducted by resistance R1 in Figure (3.25a) is VbeQ I cQ I R1 = + . (E5-2) R2 hFE The subject figure also confirms that the power supply must deliver a current of IcQ + IR1 to the biasing circuit. It follows that the power delivered to the circuit by voltage source Vcc, which is the power, Pdis, dissipated by the biasing circuit, is VbeQ ⎤ ⎡⎛ h + 1 ⎞ Pdis = Vcc I cQ + I R1 = Vcc ⎢⎜ FE (E5-3) ⎥ . ⎟ I cQ + R2 ⎦ ⎣⎝ hFE ⎠ Note that the bracketed quantity on the right hand side of this expression is the net current flowing to ground, since the first term in the bracketed quantity is the transistor emitter current, while the second term is the current flowing through resistance R2. For Vcc = 3 volts, hFE = 100, IcQ = 2 mA, and VbeQ = 720 mV, Pdis = 8 mW stipulates R2 = 1.11 KΩ. ( ) (3). Equation (3-99) can now be exploited to determine the value of resistance R2. For Vcc = 3 volts, hFE = 100, R1 = 1.11 kΩ, IcQ = 2 mA, and VbeQ = 720 mV, R2 = 355.1 Ω. This required value of resistance R2 means that the 8 mW power dissipation specification cannot be met in light of all other stipulated operating requirements. (4). With Sbe = 1.8 mV/°C, hFE = 100, R1 = 1.11KΩ, and R2 = 355.1 Ω, the temperature coefficient, σi, of the Q-point collector current is found, using (3-102), to be σi = 668.6 μA/°C. Given ΔTj = 30 °C, the computed change in collector current is ΔIcQ = σiΔTj = 20.1 mA. In truth, the collector current cannot be perturbed by this amount for at best, the transistor saturates as the collector circuit in Figure (3.25a) rises toward its maximum possible value of Vcc/Rl = 3 mA. Even this maximum cannot be precisely achieved in that the collector-emitter voltage can be reduced to only its small, but assuredly nonzero, saturation value. COMMENTS: Two lessons are learned by this simple example. The first is that all calculations executed on an active network must be carefully scrutinized in light of the assumptions on which cognate analyses are premised. In the case at hand, it is tacitly presumed at the outset that the transistor operates in its linear domain. For linear operation of the circuit at hand, the collector current must remain smaller than about 3 mA, which is the collector current that theoretically flows if the collector-emitter voltage can be reMing Hsieh Department of Electrical Engineering - 399 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma duced to zero. Accordingly, the calculated, temperature-induced change in quiescent collector current of better than 20 mA is a meaningless computation, except to suggest that the transistor in question indeed saturates merely because of an increase in the operating temperature of the base-emitter junction. The second lesson articulated by this example, is that the circuit in Figure (3.25a) is a terrible biasing topology. Aside from the unpredictability of collector current due to the inherent uncertainty in the gain parameter, hFE, it is difficult to sustain linear domain operation over routinely encountered temperature excursions. For example, routine self-heating of a junction readily results in a 10 °C increase in junction operating temperature. But even for this modest 10 °C increment, the calculated change in quiescent collector current is almost 6.7 mA, which is more than sufficiently large to incur device saturation. 3.4.1.2. Current Controlled Voltage Feedback Biasing The shortfalls of the simple biasing circuit in Figure (3.25a) are circumvented if an emitter degeneration resistance, Ree, is inserted into the emitter lead, as depicted in Figure (3.26a). This resistance incorporates voltage feedback into the base-emitter loop to allow for an automatic adjustment in the base-emitter voltage when the quiescent collector current, IcQ, departs from its design target. We note that this automatic adjustment capability of base-emitter voltage VbeQ contrasts sharply with the previously considered biasing configuration. In particular, we note in (3-98) that to the extent that hFE is very large (which is virtually guaranteed in monolithic BJTS), VbeQ is essentially a constant determined by resistance ratio R2/R1 and power supply voltage Vcc. Thus as the quiescent collector current rises in response to increases in the junction operating temperature, no provision to mitigate these current increases through suitable decreases in VbeQ is afforded by the preceding circuit. We can glean a qualitative appreciation of the effectiveness of resistance Ree in Figure (3.26a) by assuming that initially, the quiescent collector current meets its design goal. Subsequent to establishing the correct collector current in the steady state, let IcQ increase because of self-heating, the deployment of a transistor whose relevant parameters differ slightly from those invoked in the actual design process, or any other commonly encountered engineering nuance. The increase in IcQ is sensed directly as an increase in the voltage, Vre, dropped across resistance Ree. Assume that the voltage, Vbx, established at the base node of the transistor approximates a constant. From the equivalent circuit in Figure (3.26b), a current invariant Vbx materializes if the Thévenin resistance, (R1||R2), is small and/or the minimum anticipated value of hFE is large. The latter parametric condition forces the base current conducted by the transistor to be very small, thereby constraining the voltage drop across the aforementioned Thévenin resistance small. Since Vbe = Vbx − Vre, an increase in voltage Vre, which manifests negative feedback with respect to the presumably invariant voltage, Vbx, is met by a decrease in the base-emitter voltage, Vbe. In turn, diminished Vbe serves to reduce the collector current, thereby offsetting, albeit partially, the parasitic increase in quiescent collector current. Of course, this self-correction mechanism also functions for a decreasing IcQ in that diminished IcQ produces a reduced Vre, which induces an increased Vbe that presumably compensates for the original current reduction. By inspection of the equivalent circuit in Figure (3.26b), Ming Hsieh Department of Electrical Engineering - 400 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma ⎛ I cQ ⎞ ⎛ R2 ⎞ ⎛ hFE + 1 ⎞ (3-103) ⎟ + VbeQ + ⎜ ⎜ ⎟Vcc = ( R1 R2 ) ⎜ ⎟ Ree I cQ , ⎝ R1 + R2 ⎠ ⎝ hFE ⎠ ⎝ hFE ⎠ whence ⎡ ⎤ ⎛ R1 ⎞ ⎢ Vcc − ⎜ 1 + ⎟VbeQ ⎥ R2 ⎠ ⎛ R2 ⎞ ⎢ ⎝ ⎥. I cQ = hFE ⎜ (3-104) ⎟⎢ R + R R R + h + 1 R ( ) 2 ⎠ ( 1 2) FE ee ⎥ ⎝ 1 ⎢ ⎥ ⎣ ⎦ The dependence of IcQ on the poorly controlled gain parameter, hFE, is substantively reduced if design care is exercised to ensure (R1||R2) << (hFE + 1)Ree. The quantification of the extent to which the parallel combination of resistances R1 and R2 is smaller than the net resistance, (hFE + 1)Ree depends on the desired degree of accuracy ascribed to setting the actual collector current. For example, if IcQ is to be controlled to within ±10% of its design target, (R1||R2) ≤ (hFE + 1)Ree/10 constitutes an appropriate design tack. If, on the other hand, ±1% control is required, (R1||R2) should be of the order of 100-times smaller than (hFE + 1)Ree. Degree of accuracy notwithstanding, (R1||R2) << (hFE + 1)Ree collapses (3-104) to the approximate result, +Vcc R1 +Vcc Rl Rl Zx Zx IcQ Vbx + IcQ /hFE VceQ + VbeQ R2 IcQ − + Vre Vbx − R1||R2 Ree − ( hh +1 ) I FE cQ ( R2 V R1+R2 cc ) + − + IcQ /hFE VceQ + VbeQ − − + Vre Ree − ( hh +1 ) I FE FE cQ FE (a). (b). Figure (3.26). (a). BJT biasing circuit incorporating emitter degeneration as a feedback vehicle for the stabilization of the quiescent collector current. (b). Equivalent circuit of the network of (a). ⎤ ⎛ α ⎞⎛ R2 ⎞ ⎡ ⎛ R1 ⎞ I cQ ≈ ⎜ FE ⎟⎜ (3-105) ⎟ ⎢Vcc − ⎜ 1 + ⎟VbeQ ⎥ , R2 ⎠ ⎝ ⎝ Ree ⎠ ⎝ R1 + R2 ⎠ ⎣ ⎦ where αFE is given by (3-48). If the minimum anticipated value of hFE is substantially larger than one, as it inevitably is, αFE approaches unity, and IcQ in (3-105) is rendered virtually independent of hFE. Accordingly, the inclusion of emitter degeneration serves to mitigate the undesirably pronounced sensitivity of quiescent collector current on hFE, which is a signature of the terrible network in Figure (3.25a). Ming Hsieh Department of Electrical Engineering - 401 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Apart from virtually eliminating the problem of IcQ sensitivity to hFE, emitter degeneration proves laudable from the standpoint of temperature sensitivity. Using (3-101), ΔI cQ α S (3-106) σi ≈ FE be , ΔT j Ree which demonstrates that unlike the collector current temperature sensitivity in the circuit of Figure (3.25a), the base-emitter junction temperature sensitivity coefficient, Sbe, is not amplified by the large current gain parameter, hFE. Equation (3-106) presumes that (1) the temperature coefficient of resistance Ree is small and can be ignored, (2) the dependence of Vcc on temperature is negligibly small, and (3) the minutely small temperature sensitivity of parameter αFE is inconsequential. Note that the temperature coefficients of resistances R1 and R2 are likely to prove immaterial in that these resistances appear only as resistive ratios in the quiescent collector current expression. In particular, if R1 and R2 are laid out proximately on the integrated circuit chip as comparably sized diffused or implanted geometric forms, and if their individual values are within an order of magnitude or so of one another, the temperature dependence of either R1/R2 or R2/R1 is unlikely to comprise a design issue in most applications. Equation (3-106) establishes a convenient basis for selecting an appropriate emitter degeneration resistance. The degree to which current IcQ modulates in response to signals appearing at the collector port of the network in Figure (3.26a) can be discerned through an analytical quantification of the indicated output impedance, Zx, established at the collector terminal. To this end, the subject transistor can be replaced by the transistor small signal model developed in Figure (3.15). The high frequency nature of impedance Zx is invariably dominated by the shunting substrate capacitance, Cs, which is a relatively large capacitance in conventional monolithic processes. Accepting this contention without proof, attention presently focuses on uncovering only the low frequency component, say Rx, of impedance Zx. Accordingly, all capacitances in the transistor model at hand can be set to zero. Additionally, the ohmic resistances, re, and rc, are tacitly ignored without fear of significant accuracy impairment, so that the resultant low frequency, small signal equivalent circuit is the topology delineated in Figure (3.27). In this representation, it should be noted that voltage Vcc is supplanted by a short circuit since the small signal value of this ideally constant voltage is obviously zero. An additional noteworthy point is that output resistance Rx does not include the collector load resistance, Rl. Such neglect does not comprise engineering oversight since the analytical objective herewith is to discern the sensitivity of quiescent collector current to signal changes at the collector terminal for any load resistance that sustains transistor operation in its forward active domain. Rx rbb Vx R1||R2 rπ βac I I Ix−βacI Ree ro Ix I+Ix Figure (3.27). Approximate low frequency model used to evaluate the small signal resistance, Rout, Ming Hsieh Department of Electrical Engineering - 402 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma presented at the collector port of the biasing network shown in Figure (3.26a). The desired resistance, Rx, is the voltage to current ratio, Vx/Ix, where Ix is postured as a current source emulation of a mathematical ohmmeter. For convenience, we have delineated the branch current responses to the ohmmeter excitation in Figure (3.27). By KVL, 0 = ( R1 R2 + rbb + rπ + Ree ) I + Ree I x (3-107) . Vx = ( ro + Ree ) I x − ( βac ro − Ree ) I Solving the first of these two equations for current I and inserting said solution into the second expression leads to ⎛ ⎞ V βac Ree Rx = x = Ree ( R1 R2 + rbb + rπ ) + ⎜ 1 + ⎟ ro . ⎜ Ix Ree + R1 R2 + rbb + rπ ⎟⎠ ⎝ (3-108) ⎛ ⎞ βac Ree ≈ ⎜1 + ⎟⎟ ro . ⎜ R R R r r + + + ee 1 2 bb π ⎝ ⎠ The indicated approximation is reflective of the fact that the Early resistance, ro, and the AC beta, βac, are typically large numbers. While Rx, is assuredly finite, it can be significantly larger than the Early resistance. Because of a potentially very large Rx, the biasing network in question appears to supply a quiescent collector current that is relatively unaffected by signal voltage swings at the collector node. EXAMPLE #3.6: The silicon NPN transistor in the biasing circuit of Figure (3.26a) has a minimum hFE of 100 and a nominal base-emitter voltage of 720 mV at room temperature. Using a 6 volt power supply, design the circuit to provide a quiescent collector current of 2 mA at a collector-emitter voltage of 1.5 volts at room temperature. The desired quiescent collector current is to be maintained to within ±5% for junction temperature increases as large as 50 °C. A base-emitter junction temperature coefficient of Sbe = 2.0 mV/°C can be presumed Using the HSPICE NPN BJT model parameters given in Table (3.1), simulate the design at 27°C, 50 °C, and 75 °C. Assuming rbb = 250 Ω, rπ = 1.4 KΩ, ro = 28 KΩ, and βac = 95 amps/amp at the quoted quiescent operating point, estimate the change in the collector Q-point current for a 500 mV signal swing at the collector terminal. SOLUTION #3.6: (1). Since the maximum allowable increase in quiescent collector current is 5% of its room temperature, 2 mA value, ΔIcQ ≤ (0.05) (2 mA) = 100 μA. Given ΔTj = 50 °C, σi = ΔIcQ /ΔTj ≤ 2 μA/°C. Using (3-106), in which Sbe = 2 mV/°C and αFE = hFE /(hFE + 1) = 100/101 = 0.9901, α S (E6-1) σi ≈ FE be ≤ 2 μA / °C , Ree which results in Ree ≥ 990.1 Ω. Rounding this resistance up to Ree = 1 KΩ is prudent engineering action in that a larger than minimally required emitter degeneration resistance provides for a small amount of proverbial breathing room with regard to the target temperature sensitivity of the biasing network. Ming Hsieh Department of Electrical Engineering - 403 - USC Viterbi School of Engineering Lecture Supplement #05 (2). BJT Models & Biasing J. Choma The circuit in Figure (3.26a) yields ⎛ h +1⎞ Vcc = Rl I cQ + VceQ + ⎜ FE ⎟ Re e I cQ . ⎝ hFE ⎠ (E6-2) With Vcc = 5 volts, VceQ = 1.5 volts, hFE = 100, IcQ = 2 mA, and Ree = 1 KΩ, the collector load resistance, Rl, computes as Rl = 1.24 KΩ. (3). The parallel resistance combination, (R1||R2) must be selected so that it is substantially smaller than the effective resistance, (hFE + 1)Ree. Since the target quiescent collector current is to be sustained to within ±5% over the quoted temperature excursion, (R1||R2) must be at most (hFE + 1)Ree/20, or 5.05 KΩ. It is therefore reasonable to stipulate (R1||R2) = 4 KΩ, thereby ensuring, with ostensibly adequate safety margin, the validity of tacitly neglecting the parallel resistance, (R1||R2), in (3-104). (4). Equation (3-105) can be recast as ⎡ ⎤ ⎛ R1 R2 ⎞ ⎡ ⎤ ⎛ R1 ⎞ hFE (E6-3) I cQ ≈ ⎢ ⎥⎜ ⎟⎟VbeQ ⎥ , ⎟ ⎢Vcc − ⎜⎜ ⎥⎦ ⎢⎣ ( R1 R2 ) + ( hFE + 1) Ree ⎥⎦ ⎝ R1 ⎠ ⎢⎣ ⎝ R1 R2 ⎠ in which the only unknown quantity is the resistance ratio, (R1||R2)/R1. Solving for this ratio results in the arguably sloppy, but nonetheless tractable, relationship, SPICE TEXT SYMBOL SYMBOL BF βf DESCRIPTION OF PARAMETER VALUE UNITS Forward Short Circuit Gain 120 amps/amp BR βr Reverse Short Circuit Gain 1.2 amps/amp CJC CJE CJS IKF IRB IS MJC MJE MJS NF NR RB Cjco Cjeo Cso Ikf Irb Is mc mje ms nf nr rbb Zero Bias B-C Depletion Capacitance fF fF fF mA mA fA – – – – – Zero Bias Base Resistance 1.1 3.8 10.2 11.5 4.5 3.2 0.333 0.5 0.5 1.05 1.0 270 RBM Rbm Minimum Base Resistance 35 Ω RC rc Series Collector Resistance 20 Ω RE re Series Emitter Resistance 1.5 TF τfo Zero Bias Minority Carrier Transit Time 4.2 Ω pSEC TNOM Tj Junction Reference Temperature 27 VAF VJC VJE Vaf Vjc Vje Forward Early Voltage 30 780 920 Zero Bias B-E Depletion Capacitance Zero Bias Substrate Depletion Capacitance Forward Knee Current Base Resistance Corner Current Saturation Current B-C Junction Grading Coefficient B-E Junction Grading Coefficient Substrate Junction Grading Coefficient B-E Junction Injection Coefficient B-C Junction Injection Coefficient Ming Hsieh Department of Electrical Engineering B-C Junction Built-In Potential B-E Junction Built-In Potential - 404 - Ω °C volts mvolts mvolts USC Viterbi School of Engineering Lecture Supplement #05 VJS XTI XTF XTB BJT Models & Biasing Vjs J. Choma Substrate-Collector Built-In Potential Temperature Exponent For IS Temperature Exponent For TF Temperature Exponent For BF 690 3 0.025 0.02 mvolts − − − Table (3.1). HSPICE model parameters for a representative NPN bipolar junction transistor having a maximum unity gain frequency of approximately 35 GHz. Although the transistor characterized herewith is fictitious, the parameters are typical of a moderately high speed BJT. ⎡ ( R1 R2 ) + ( hFE + 1) Ree ⎤ ⎢ ⎥ I cQ + VbeQ hFE R1 R2 ⎢ ⎣ ⎦⎥ = = 0.470 . R1 Vcc Since (R1||R2) = 4 KΩ, R1 = 8.51 KΩ, whence ( R1 R2 ) R1 = 7.55 KΩ . R2 = R1 − ( R1 R2 ) (5). (E6-4) (E6-5) For the computed biasing resistances and the quoted small signal transistor parameters, (3108) gives Rx = 428.8 KΩ. This means that for a collector terminal signal of 500 mV, the signal-induced change, ΔIcQ, in the quiescent collector current is ΔIcQ = 500 mV/428.8 KΩ = 1.17 μA, which is only 0.058% of the target quiescent current. +6 V 8.51 K 1.24 K 3.52 V 2.74 V 2.02 V 1K 7.55 K Figure (3.28). Biasing circuit designed in Example #3.6. The voltages shown in the boxes correspond to the estimated respective node voltages for a properly functioning circuit. The completed design is shown in Figure (3.28). To facilitate circuit debugging with measured or simulated results, we have explicitly indicated target nodal voltages in the diagram. COMMENTS: The simulated results track very favorably with design predictions. In particular, the simulated quiescent collector current at 27 °C is 1.98 mA, which is only 1% lower than the 2 mA design target. At 50 °C, the simulated Q-point collector current is 2.01 mA, while at 75 °C, the simulated value of IcQ is 2.05 mA, which is larger than the 27 °C value of 1.98 mA by only 3.54%. Moreover, at 27 °C, the simulated collector, base, and emit- Ming Hsieh Department of Electrical Engineering - 405 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma ter voltages, measured with respect to ground, are 3.55 volts, 2.75 volts, and 2.00 volts, respectively. The circuit at hand is an excellent biasing circuit from the admittedly limited perspective that both manual and computer-aided analyses confirm the predictability of the quiescent collector current. It also offers adequate desensitization of this collector current with respect to temperature changes, uncertainties in parameter hFE, and collector signal change, which at 500 mV is actually reasonably large by conventional small signal standards. However, it does exude at least a few shortcomings, whose respective significance is better appreciated in a subsequent chapter that addresses the gain and noise characteristics of the amplifier that derives from the considered biasing topology. In particular, it turns out that the maximum voltage gain afforded by the circuit at hand is the ratio of the collector load to emitter degeneration resistances. In the present case, this ratio is barely above one, but mitigation procedures are fortunately available. Moreover, the relatively large emitter degeneration resistance required for suitable temperature compensation increases the equivalent input noise voltage, which is the minimum signal strength that the amplifier can detect and process reliably. In many applications, this dilemma can likewise be addressed satisfactorily. 3.4.2. ACTIVE BIASING NETWORKS Although prudently designed passive biasing structures are effective in stabilizing the quiescent operating points of bipolar junction transistors over temperature, their ultimate effectiveness in monolithic circuit realizations is often limited. One commonly encountered problem is that the ratios of requisite resistance values in these compensation schemes are widely divergent. Two problems prevail with respect to resistance pairs whose values differ by large factors. The first is that controlling the accuracy of a resistance ratio becomes progressively more difficult with increasing ratio. The second is non-uniformity of temperature coefficients between broadly diverse resistance values. Yet another quandary is that the resistance values required for acceptable temperature stabilization are often not synergistic with the desired small signal performance that the network undergoing biasing must ultimately deliver. To this end, for example, it has been noted that the large emitter degeneration resistance in the design example of Figure (3.28) limits the achievable voltage gain of the cell. The foregoing dilemmas can be circumvented in integrated circuits by using companion transistors to control the operating point stability of a given transistor. The basic approach is to develop topological structures for which the quiescent variable of interest in a particular transistor is constrained to be directly proportional to the corresponding, and presumably easily stabilized, variable of a second, subsidiary transistor whose volt-ampere characteristics match those of the transistor upon which attention is focused. One advantage of this active stabilization approach is that judiciously laid out transistor pairs can be matched remarkably well so that their thermal properties accurately track one another over broad temperature ranges. As a result, design attention can largely focus on the relatively simple subsidiary subcircuit, with the assurance that the monolithic process is fully capable of delivering transistor responses that track exceptionally well with the variables prescribed in these units. The methods documented in the following subsections are far less effective in discrete, off the shelf component, circuit realizations since the relevant electrical characteristics of even ostensibly equivalent transistor types from the same device manufacturer are rarely matched well. Ming Hsieh Department of Electrical Engineering - 406 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma 3.4.2.1. Diode-Resistor Current Mirror Among the most popular of active biasing compensation structures is the circuit offered in Figure (3.29). A comparison of this circuit with the network in Figure (3.26a) shows that a diode-connected transistor, Q2, is inserted in series with the resistance R2 in the hope of stabilizing the quiescent collector current, IcQ, conducted by the focus transistor, Q1. It is extremely important that, save possibly for differences in base-emitter junction area, the two BJTs be matched devices that conduct nearly identical current densities. If Q1 and Q2 are indeed matched and conduct identical densities of static current, their base-emitter voltages, VbeQ, are necessarily equal. An equality of these two terminal voltages over all reasonable temperature excursions additionally requires that the subject two transistors be laid out proximately so that both experience nearly the same junction temperature changes. Accordingly, if the emitter current of transistor Q2 is designated as IdQ, ⎛ h + 1⎞ (3-109) VbeQ + R2 I dQ = VbeQ + ⎜ FE ⎟ Re e I cQ . ⎝ hFE ⎠ +Vcc R1 Rl Rx IdQ + IcQ /hFE IcQ /hFE + VbeQ Q2 + VbeQ IcQ + Q1 VceQ − − − R2 Ree ( hh +1 ) I IdQ FE cQ FE Figure (3.29). Active biasing compensation through the addition of diode-connected transistor Q2 to the basic passive structure of Figure (3.26a). Since hFE >> 1 (if hFE is not much larger than one, it is time to contract with an alternate processing foundry), ⎛ R ⎞ ⎛ h ⎞⎛ R ⎞ (3-110) I cQ = ⎜ FE ⎟⎜ 2 ⎟ I dQ ≈ ⎜ 2 ⎟ I dQ , ⎝ hFE + 1 ⎠⎝ Ree ⎠ ⎝ Ree ⎠ which contends that IcQ mirrors current IdQ through the proportionality constant, R2/Ree. The fact that the subject constant of proportionality is a simple resistance ratio is music to our ears. In particular, if R2 and Ree are of the same order of magnitude, ratio R2/Ree can be controlled precisely (to within a couple of percent or less) over broad ranges of temperature. In a word, stabilizing IdQ automatically renders current IcQ stable over temperature, despite the potential impact of other environmental factors. Ming Hsieh Department of Electrical Engineering - 407 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma The most straight forward design circumstance is R2 = Ree, whereupon, IcQ is literally the mirror image of IdQ. But note that if R2 is larger than Ree by a factor of k (k >1), IdQ, is a factor of k smaller than IcQ, which is advantageous from a circuit power dissipation perspective. In this case, the junction injection area of transistor Q1 must be made k-times larger than that of transistor Q2 to ensure that both transistors conduct the identical densities of current that sustain equivalence between their base-emitter terminal voltages. In actual design environments, integer or non-integer values of k that do not exceed six to eight prove practical and effective. KVL applied to the R1−R2−Q2 branch of the circuit in Figure (3.29) gives I cQ ⎞ ⎛ (3-111) Vcc = R1 ⎜ I dQ + ⎟ + VbeQ + R2 I dQ . hFE ⎠ ⎝ Appealing to (3-109) for the elimination of the current variable, IdQ, in (3-111) results in a quiescent collector current of ⎤ Vcc − VbeQ ⎛ R2 ⎞ ⎡ I cQ = hFE ⎜ (3-112) ⎥. ⎟⎢ ⎝ R1 + R2 ⎠ ⎢⎣ ( R1 R2 ) + ( hFE + 1) Ree ⎥⎦ As in the case of the passive compensation topology of Figure (3.26a), ensuring (R1||R2) << (hFE + 1)Ree all but eliminates a collector current dependence on hFE in that (3-112) reduces to ⎛ R2 ⎞ ⎛ Vcc − VbeQ ⎞ (3-113) I cQ ≈ αFE ⎜ ⎟. ⎟⎜ Ree ⎝ R1 + R2 ⎠⎝ ⎠ This result advances a collector current temperature coefficient of ΔI cQ α S ⎛ R2 ⎞ ≈ FE be ⎜ σi (3-114) ⎟. ΔT j Ree ⎝ R1 + R2 ⎠ Two interesting observations surface from this last relationship. The first, and most clarion of the two observations is that the active compensation scheme delivers a collector current temperature coefficient that is smaller than the coefficient associated with the passive compensator by the voltage divider factor, [R2/(R1 + R2]. The second point is that (3-114) combines with (3-113) to suggest ΔI cQ I cQ Sbe α S ⎛ R2 ⎞ ≈ FE be ⎜ σi ; (3-115) ⎟ = ΔT j Ree ⎝ R1 + R2 ⎠ Vcc − VbeQ that is, the temperature coefficient of interest is actually independent of circuit resistances in that it is set by the selected Q-point current, IcQ, the power supply voltage, Vcc, and, of course the transistor properties implied by VbeQ and its voltage sensitivity factor, Sbe. Whereas the passive compensation scheme prescribes its current temperature coefficient, σi, via the emitter degeneration resistance, Ree, the active scheme effectively preserves a design degree of freedom by relying on the supply voltage to establish the temperature coefficient of the circuit. The resistance, Rx, presented to the collector load resistance, Rl, in Figure (3.29) can be evaluated straightforwardly by substituting the low frequency, small signal equivalent circuit of a BJT for both of the devices in the network at hand. In the process of such substitution, care must be exercised to account for the fact that the potentially different junction injection areas of the two transistors foment different values among corresponding small signal parameters. But unless the reader is exhilarated by detailed circuit analyses, a strongly recommended alternative analytical tack entails a direct exploitation of the resistance result in (3-108), which derives from a small signal analysis of the biasing configuration of Figure (3.26a). Clearly, the only differ- Ming Hsieh Department of Electrical Engineering - 408 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma ence between the two circuits at hand is that a diode-connected transistor (Q2) is inserted in series with resistance R2 in Figure (3.26a). Since the diode-connected BJT is a two terminal element that is to be replaced by the low frequency version of the small signal model in Figure (3.15), its small signal electrical properties mimic those of a simple two terminal resistance, say Rd. The upshot of the matter is that (3-108) adapts to the circuit in Figure (3.29) merely by replacing resistance R2 by the resistance sum, (R2 + Rd). It follows, effectively by inspection, that Rx in Figure (3.29) is given by ⎛ ⎞ βac Ree Rx = Ree ⎣⎡ R1 ( R2 + Rd ) + rbb + rπ ⎦⎤ + ⎜ 1 + ⎟ ro ⎜ Ree + R1 ( R2 + Rd ) + rbb + rπ ⎟⎠ ⎝ (3-116) ⎛ ⎞ βac Ree ≈ ⎜1 + ⎟ ro . ⎜ Ree + R1 ( R2 + Rd ) + rbb + rπ ⎟⎠ ⎝ The only outstanding issue is the evaluation of resistance Rd in terms of transistor model parameters. To this end, the equivalent circuit of the Q2 interconnection is given in Figure (3.30), where as usual, the internal collector and emitter resistances of the transistor are ignored. As depicted, the use of our trusty mathematical ohmmeter delivers Rd rbb2 rπ2 Q2 Rd (βac2+1)I βac2 I ro2 + Ix Vx − I Figure (3.30). Low frequency, small signal equivalent circuit of the diode-connected transistor, Q2, in the biasing network of Figure (3.29). The model is configured to determine the resistance, Rd, established between the two terminals of the diode unit. Ix = Vx ro2 + ( βac2 + 1) I = Vx ro2 ⎛ ⎞ Vx + ( βac2 + 1) ⎜ ⎟, + r r π2 ⎠ ⎝ bb2 whereupon ⎛r Vx + rπ2 ⎞ rbb2 + rπ2 . = ro2 ⎜ bb2 (3-117) ⎟ ≈ βac2 + 1 Ix ⎝ βac2 + 1 ⎠ Owing to a large AC beta, resistance Rd is small and very likely, it is significantly smaller than the biasing resistance, R2, in the network of Figure (3.29). It therefore materializes that from a practical perspective, resistance Rx in Figure (3.29) is virtually indistinguishable from resistance Rx in Figure (3.26a). Rd = EXAMPLE #3.7: The silicon NPN transistors in the active biasing circuit of Figure (3.29) have a minimum hFE of 100 and a nominal base-emitter voltage of 720 mV at room temperature. Design the circuit so that with a collector load resistance to emitter degeneration resistance ratio of 10, a quiescent collector current of 2 mA flows through transistor Q1 when its collector-emitter voltage is 1.5 volts at room temperature. The desired quiescent collector current is to be maintained to within ±5% for junction temperature increases as Ming Hsieh Department of Electrical Engineering - 409 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma large as 50 °C. A base-emitter junction temperature coefficient of Sbe = 2.0 mV/°C can be presumed Using the HSPICE BJT model parameters given in Table (3.1), simulate the design at 27°C, 50 °C, and 75 °C. SOLUTION #3.7: (1). Since the maximum allowable increase in quiescent collector current is 5% of its room temperature, 2 mA value, ΔIcQ ≤ (0.05) (2 mA) = 100 μA. Given ΔTj = 50 °C, σi = ΔIcQ /ΔTj ≤ 2 μA/°C. Using (3-115), in which Sbe = 2 mV/°C and VbeQ = 720 mV, I cQ Sbe σi ≈ ≤ 2 μA / °C , (E7-1) Vcc − VbeQ which offers Vcc ≥ 2.72 volts. A power supply voltage of Vcc = 3 volts is appropriate, particularly since 1.5 volt battery cells are readily available commercially. (2). The circuit in Figure (3.29) shows that ⎛ h +1⎞ (E7-2) Vcc = Rl I cQ + VceQ + ⎜ FE ⎟ Re e I cQ . ⎝ hFE ⎠ With Vcc = 3 volts, VceQ = 1.5 volts, hFE = 100, IcQ = 2 mA, and Rl = 10Ree, the requisite emitter degeneration resistance is determined to be Ree = 68.1 Ω and hence, the collector load resistance follows as Rl = 10Ree = 681 Ω. (3). In Figure (3.29) and (3-109), let the emitter current conducted by transistor Q2 be equal to the emitter current flowing in transistor Q1, which means that both are required to have the same base-emitter junction injection areas. Accordingly, R2 = Ree = 68.1 Ω. Moreover, with R2 = Ree, (R1||R2) < Ree. It follows that the requisite inequality, (R1||R2) << (hFE +1)Ree, is satisfied by a factor of better than (hFE +1) = 101, which is more than sufficient in light of the ±5% tolerance constraint imposed on the desired quiescent collector current. (4). Setting R2 = Ree in (3-112) now leads to R1 = 1,061 Ω. The completed design is shown in Figure (3.31). As in the preceding design example, target nodal voltages are expressly delineated in the diagram. +3 V 1,061 681 1.64 V Q1 857.6 mV Q2 137.6 mV 68.1 137.6 mV 68.1 Figure (3.31). Biasing circuit designed in Example #3.7. All resistances are in units of ohms. The voltages shown in the boxes correspond to the estimated Ming Hsieh Department of Electrical Engineering - 410 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma respective node voltages for a properly functioning circuit. COMMENTS: Once again, the simulated results confirm the propriety of the design methodology. In particular, the simulated quiescent collector current at 27 °C is 1.97 mA, which is only 1.5% lower than the 2 mA design target. At 50 °C, the simulated Q-point collector current is 2.00 mA, while at 75 °C, the simulated value of IcQ is 2.03 mA, which is larger than the 27 °C value of 1.97 mA by only 3.05%. Moreover, at 27 °C, the simulated collector, base, and emitter voltages of transistor Q1, measured with respect to ground, are 1.66 volts, 884 mV, and 135.3 mV, respectively. While the active compensator postured herewith comprises a superb biasing network, it, like virtually all electronic networks, is nonetheless imperfect. In the case at hand, the desired match between transistor base-emitter voltages over temperatures is non-exact because of the finite Early voltages of the transistors and the simple fact that the collector-emitter voltages of the two transistors cannot possibly match. In particular, observe that the collector-emitter voltage of transistor Q2 is necessarily constrained to be its base-emitter terminal voltage, while the collector emitter voltage of Q1 is designed to be better than twice the base-emitter voltage. Accordingly, the collector current correction for the Early effect is not the same for each transistor. 3.4.2.2. Diode Current Mirror The discovery that the collector current temperature coefficient of the diode-resistor current mirror of Figure (3.29) is independent of all circuit resistances and specifically, is independent of the emitter degeneration resistance, Ree, hints at the possibility of designing a suitable biasing network that is divorced of emitter degeneration. The advantages of abrogating emitter degeneration include decreased circuit power dissipation, the potential for increased small signal gain, and reduced thermal noise. To this end, consider the diode mirror shown in Figure (3.32), which uses, in addition to the collector load resistance, Rl, only a single resistance, R, to bias the circuit. KVL applied to the R−Q2 branches of the circuit gives +Vcc Rl R Rx IdQ + IcQ /hFE IcQ /hFE + + VbeQ Q2 VbeQ IcQ + Q1 VceQ − − ( hh +1 ) I − IdQ FE cQ FE Figure (3.32). Diode current mirror BJT biasing circuit. The base-emitter junction area of transistor Q1 can be k-times larger than that of transistor Q2. Ming Hsieh Department of Electrical Engineering - 411 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma I cQ ⎞ ⎛ (3-118) Vcc = R ⎜ I dQ + ⎟ + VbeQ . hFE ⎠ ⎝ In the interest of analytical generality, select transistor Q1 to be identical to transistor Q2, save for the fact that the base-emitter junction area of Q1 is larger than that of Q2 by a factor of k. Then, since the indicated circuit interconnections force equality between the base-emitter terminal voltages of both active devices, the emitter current, IdQ, flowing through Q2 is k-times smaller than the emitter current of Q1; that is, ⎛ h + 1 ⎞⎛ I cQ ⎞ (3-119) I dQ = ⎜ FE ⎟. ⎟⎜ ⎝ hFE ⎠⎝ k ⎠ We note that in accordance with the fundamental premise of an actively compensated biasing network, the desired Q-point collector current is merely proportional (by a factor of roughly k herewith) to the current, IdQ, conducted by the subsidiary network, which in this case is comprised of resistance R and diode-connected transistor Q2. The substitution of (3-119) into (3118) resultantly accrues hFE Vcc − VbeQ I cQ = . (3-120) hFE + 1 ⎞ ⎛ R ⎜1 + ⎟ k ⎝ ⎠ The virtual elimination of a collector current dependence on parameter hFE mandates satisfaction of the inequality, (hFE + 1) >> k, which is easy enough to achieve. Accordingly, αFE k Vcc − VbeQ I cQ ≈ , (3-121) R which infers a Q1 quiescent collector current that is simply k-times the current conducted by the R−Q2 network branch. It is a simple matter to confirm a collector current temperature coefficient of ΔI cQ I cQ Sbe α kS (3-122) σi ≈ FE be = , ΔT j R Vcc − VbeQ ( ) ( ) whose final form is identical to the temperature factor associated with the diode-resistor mirror. 3.4.2.3. Vbe Multiplier Biasing In the bipolar biasing circuits considered to this point, the quiescent collector current is consistently cast as a function of two transistor variables; namely, the DC beta, hFE, and the quiescent base-emitter voltage, VbeQ. The dependence of quiescent collector current on hFE is reduced to insignificant proportions through a sufficiently large hFE, coupled perhaps with an appropriate choice of relevant circuit resistances. On the other hand, the current dependence on Vbe, which is tantamount to a collector current sensitivity to junction operating temperature, is mitigated with a prudently selected emitter degeneration resistance and/or the use of a large enough power supply voltage. If it were possible to eliminate, as opposed to merely reducing, the collector current sensitivity to base-emitter voltage, practical circuits offering the engineer enhanced degrees of design freedom and possessed of phenomenally small temperature sensitivities become reality. To the foregoing end, the circuit appearing in Figure (3.33) is theoretically capable of realizing the somewhat idealized goal of a quiescent collector current, IcQ, which is independent of base-emitter voltage VbeQ. The core subcircuit underpinning this enticing performance Ming Hsieh Department of Electrical Engineering - 412 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma characteristic is the so-called Vbe multiplier, which consists of transistor Q2 and the two resistances, Rx and Ry. An analytical inspection of the Vbe multiplier cell itself, which is redrawn in Figure (3.34a), facilitates the task of discerning the volt-ampere properties of the biasing network in Figure (3.33). In Figure (3.33a), KCL relates the current, Im, conducted by the voltage multiplier cell to the static collector current, Ic2, flowing in transistor Q2 as ⎛h V I + 1⎞ Vbe2 (3-123) I m = I c2 + be2 + c2 = ⎜ FE2 . ⎟ I c2 + Rx hFE2 h R x ⎝ FE2 ⎠ In addition, the voltage, Vm, sustained across the cell in response to the flow of current, Im, is ⎛V I ⎞ (3-124) Vm = R y ⎜ be2 + c2 ⎟ + Vbe2 . hFE2 ⎠ ⎝ Rx If we solve (3-123) for the transistor current, Ic2, and substitute the result into the last expression, voltage Vm is found to relate to base-emitter voltage Vbe2 and cell current Im as +Vcc R1 Rl Rx Im + IcQ /hFE IcQ /hFE + Im − − FE + + + Q1 VceQ ( hh +1 ) I Ic Ry Rx VbeQ IcQ cQ FE Q2 Vm Vbe2 − − R2 Ree Figure (3.33). BJT biasing circuit using active compensation in the form of the Vbe multiplier comprised of transistor Q2 and resistances Rx and Ry. αFE2 R y ⎞ ⎛ ⎛ Ry ⎞ (3-125) Vm = ⎜ 1 + ⎟Vbe2 + ⎜ ⎟ I m kmVbe2 + Rm I m . R h 1 + x ⎝ ⎠ ⎝ FE2 ⎠ This result fosters the multiplier equivalent circuit proposed in Figure (3.34b), where model parameters km and Rm are given by Ming Hsieh Department of Electrical Engineering - 413 - USC Viterbi School of Engineering Lecture Supplement #05 km 1 + Rm BJT Models & Biasing J. Choma αFE2 R y Rx Ry . (3-126) hFE2 + 1 The model at hand suggests that the multiplier cell emulates a voltage source whose voltage is Vbe2, multiplied by the larger than unity factor, km, and whose effective static series resistance is Rm. Observe that if Ry = 0, km = 1 and Rm = 0, which renders voltage Vm identical to the baseemitter voltage, Vbe2, of transistor Q2. This result reflects our expectations since Ry = 0 short circuits the base terminal of transistor Q2 to its collector terminal, which in turn reduces the Q2−Rx−Ry subcircuit to a simple diode-connected transistor whose terminal voltage is Vbe2. For large hFE2, the multiplier approximates an ideal voltage source whose voltage value is αFE2 R y ⎞ Ry ⎞ ⎛ ⎛ kmVbe2 = ⎜ 1 + ⎟Vbe2 ≈ ⎜ 1 + ⎟Vbe2 . R R x x⎠ ⎝ ⎠ ⎝ Vbe2 /Rx + Ic2 /hFE2 Im Im + + Ic2 Ry Ic2 /hFE2 + Rx Vbe2 Q2 − Rm Vm kmVbe2 − Vm + − − Vbe2 /Rx (a). (b). Figure (3.34). (a). The Vbe multiplier used in the biasing scheme depicted in Figure (3.31). (b). The Thévenin equivalent static circuit of the cell in (a). Armed with the subcircuit model of Figure (3.34b), the biasing circuit in Figure (3.33) can be represented electrically as the structure given in Figure (3.35). The latter configuration exploits the design-oriented presumption that transistors Q1 and Q2 are identical devices that conduct identical collector current densities. Accordingly, the voltages developed across both base-emitter terminals are identical, as are the values of DC beta for the two transistors. It is instructive to observe that the structure in Figure (3.35) collapses to the diode-resistor biasing scheme offered in Figure (3.29) for the special case of km = 1 (or Ry = 0). In Figure (3.35), I cQ ⎞ ⎛ (3-127) Vcc = R1 ⎜ I m + ⎟ + ( R2 + Rm ) I m + kmVbeQ h FE ⎠ ⎝ and ⎛ h + 1⎞ (3-128) ( R2 + Rm ) I m + kmVbeQ = Ree ⎜ FE ⎟ I cQ + VbeQ . ⎝ hFE ⎠ Upon inserting the solution for current Im in (3-128) into (3-127), the solution for the quiescent collector current, IcQ, conducted by transistor Q1 is found to be Ming Hsieh Department of Electrical Engineering - 414 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma +Vcc R1 Rl Im + IcQ /hFE IcQ /hFE + Im Ic Ry + + Rx +Vcc VbeQ R1 IcQ Rl Im + IcQ /hFE + IcQ /hFE Q1 VceQ − IcQ + + − Im ( hh +1 ) I FE Q1 VceQ VbeQ − − ( hh +1 ) I FE cQ Rm FE cQ FE Q2 Vm Vbe2 − − kmVbeQ + − R2 Ree R2 Ree Figure (3.35). Equivalent electrical representation of the biasing network in Figure (3.31), wherein the Vbe multiplier comprised of Q2−Rx−Ry is supplanted by its equivalent circuit of Figure (3.32b). Transistors Q1 and Q2 are presumed to be identical devices that are biased to conduct the same collector current densities, thereby implying that Vbe2 = VbeQ and hFE2 = hFE. ⎧ ⎡ ( km − 1) R1 ⎤V ⎫ ⎪ Vcc − ⎢1 − ⎥ beQ ⎪ R2 + Rm ⎦ ⎛ R2 + Rm ⎞ ⎪ ⎪ ⎣ I cQ = hFE ⎜ (3-129) ⎬. ⎟⎨ ⎝ R1 + R2 + Rm ⎠ ⎪ R1 ( R2 + Rm ) + ( hFE + 1) Ree ⎪ ⎪ ⎪ ⎩ ⎭ Confidence in the accuracy of this disclosure is bolstered by the observation that for km = 1 (thereby constraining Rm to zero), (3-129) reduces to (3-112), which defines the Q-point collector current appropriate to the diode-resistor compensation scheme in Figure (3.29). Moreover, if km and resistance Rm are artificially set to zero, the network in Figure (3.35) collapses to the passive compensation scheme in Figure (3.26a) and reassuringly, (3-129) reduces to (3-104), which is the applicable collector current expression. In order to desensitize the Q-point collector current in (3-129) to uncertainties in the DC beta, hFE, it is necessary to enforce R1||(R2 + Rm) << (hFE + 1)Ree. As such, (3-129) can be approximated as ⎧ ⎡ ( km − 1) R1 ⎤V ⎫ ⎪Vcc − ⎢1 − ⎥ beQ ⎪ R2 + Rm ⎦ ⎛ R2 + Rm ⎞ ⎪ ⎪ ⎣ I cQ ≈ αFE ⎜ (3-130) ⎬. ⎟⎨ Ree ⎝ R1 + R2 + Rm ⎠ ⎪ ⎪ ⎪ ⎪ ⎩ ⎭ But in addition, if the constant, km, is selected such that Ming Hsieh Department of Electrical Engineering - 415 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma R2 + Rm , (3-131) R1 the resultant quiescent collector current, which becomes, ⎛ R2 + Rm ⎞⎛ αFE Vcc ⎞ (3-132) I cQ ≈ ⎜ ⎟, ⎟⎜ ⎝ R1 + R2 + Rm ⎠⎝ Ree ⎠ is rendered independent of voltage VbeQ. At a minimum, (3-131) removes the ostensibly dominant source of collector current instability with respect to operating temperature. W observe further that for large hFE, which implies αFE ≈ 1 and encourages R2 >> Rm = Ry/(hFE + 1), (3-131), becomes, with the aid of (3-126), Ry R (3-133) = 2 . Rx R1 Two interesting sidebars accompany this simple design requirement. First, if Ry/Rx < R2/R1, (km − 1) < R2/R1, and the coefficient of voltage VbeQ in the numerator on the right hand side of (3130) is resultantly a positive number. Accordingly, IcQ displays its stereotypically positive temperature coefficient in view of the fact that VbeQ must decrease with temperature to preserve constant collector current. But if Ry/Rx > R2/R1, (km − 1) > R2/R1, and the VbeQ coefficient in question is a negative number, thereby implying that IcQ decreases with operating temperature; that is, the circuit projects an atypical negative temperature coefficient. km = 1 + RV RV Ix−βac2I Ry Ry + rbb2 Q2 βac2 I rπ2 Rx Ix Vx Rx Ix−(βac2+1)I − I (a). (b). Figure (3.36). (a). The Vbe multiplier cell embedded in the biasing network of Figure (3.33). The resistance, Rv, is the net small signal resistance established across the collector-emitter terminals of the circuit. (b). The small signal equivalent circuit pertinent to the evaluation of resistance Rv. As usual, the model ignores the series resistances in the collector and the emitter leads of transistor Q2. Also ignored is the relatively large Q2 Early resistance, which appears as a simple shunting branch element across the terminals at which resistance Rv is established. As in the case of the diode-connected transistor, Q2, in the active biasing scheme postured in Figure (3.29), the Vbe multiplier cell in the network of Figure (3.33) functions as a two terminal resistance under small signal circumstances. As such, its net small signal terminal resistance, say Rv, as highlighted in the diagram of Figure (3.36a), derives as the voltage to current ratio, Vx/Ix, in the low frequency equivalent circuit depicted in Figure (3.36b). The equivalent circuit ignores the internal collector and emitter resistances of transistor Q2 and additionally, it ignores the routinely large Early resistance, ro, of Q2. The latter resistance appears in shunt with the current controlled current source, βacI, which implies that the effective resistance across the Ming Hsieh Department of Electrical Engineering - 416 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma collector and emitter terminals of the Vbe multiplier cell is actually (ro||Rv). For the indicated branch currents in Figure (3.36b), ( rbb2 + rπ2 ) I = Rx ⎡⎣ I x − ( βac2 + 1) I ⎤⎦ (3-134) . Vx = R y ( I x − βac2 I ) + ( rbb2 + rπ2 ) I Substituting current I from the first expression into the second produces ⎛ V α R ⎞ (3-135) Rv = x = ⎜ 1 − ac2 x ⎟ R y + Rx Rd , + Ix R R x d ⎠ ⎝ where βac2 αac2 (3-136) βac2 + 1 is known as the small signal, short circuit, common base current gain (more about this definition later in the text), and Rd is the diode-connected transistor resistance introduced in (3-117). In particular, observe in Figure (3.36a) that Ry = 0 and infinitely large Rx reduce the Vbe multiplier cell to a conventional diode-connected transistor. Reassuringly, Rv in (3-135) collapses to Rd for this topological circumstance. Since βac2 >> 1, αac2 in (3-136) approaches one, thereby simplifying the expression for resistance Rv to ⎛ Rd ⎞ (3-137) Rv ≈ ⎜ ⎟ Rx + R y . ⎝ Rd + Rx ⎠ which is only slightly larger than Rd if Ry > Rx. ( ) Like the diode-connected transistor in the active biasing scheme of Figure (3.29), the Vbe multiplier subcircuit in Figure (3.33) appears in series with biasing resistance R2. Otherwise, the two subject circuits are identical. It follows that the resistance, Rx, presented to the collector load in Figure (3.33) derives directly from (3-116), subject to the caveat that Rd is replaced by Rv; that is ⎛ ⎞ βac Ree Rx = Ree ⎡⎣ R1 ( R2 + Rv ) + rbb + rπ ⎤⎦ + ⎜ 1 + ⎟ ro ⎜ ⎟ + + + + R R R R r r ( ) ee 1 2 v bb π ⎝ ⎠ (3-138) ⎛ ⎞ βac Ree ≈ ⎜1 + ⎟ ro . ⎜ ⎟ R + R R + R + r + r ( ) ee 1 2 v bb π ⎝ ⎠ EXAMPLE #3.8: The silicon NPN transistors in the active biasing circuit of Figure (3.33) have a minimum hFE of 100 and a nominal base-emitter voltage of 720 mV at room temperature. Design the circuit so that with a power supply voltage of Vcc = 6 volts, transistor Q1 conducts a quiescent collector current of IcQ = 2 mA when the collector-emitter voltage, VceQ, of Q1 is 1.5 volts. The circuit is to be designed so that IcQ is nominally invariant with temperature and is maintained at its design target to with ±3%. Use the HSPICE BJT model parameters itemized in Table (3.1) to simulate the finalized design at 27°C, 50 °C, 75 °C, and 100 °C. Ming Hsieh Department of Electrical Engineering - 417 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma SOLUTION #3.8: (1). In order to optimize thermal tracking between the identical transistors, Q1 and Q2, the collector current densities of these two transistors must be the same. Additionally, implementing nominally identical collector-emitter voltages between the two devices is recommended. Thus, voltage Vm in Figure (3.33) should equate to voltage VceQ, which is stipulated to be 1.5 volts. Ignoring current Ic2/hFE2 in comparison with current Vbe2/Rx in the companion subcircuit diagram of Figure (3.34a) results in Ry ⎞ ⎛ Vm ≈ ⎜ 1 + (E8-1) ⎟Vbe2 = VceQ = 1.5 volts . Rx ⎠ ⎝ Given identical collector current densities in the two transistors, Vbe2 = VbeQ ≈ 720 mV, whence Ry/Rx = 1.083. Recalling (3-133), which is the condition underpinning the nominal thermal independence of current IcQ, R2/R1 = Ry/Rx = 1.083. (2). In an attempt to conserve standby power, let Q2 conduct one-half the current of transistor Q1, which is to say that the base-emitter junction area of Q1 must be twice that of Q2. Thus, Ic2 in Figure (3.34a) is 1 mA. Moreover, arbitrarily allow resistance Rx to conduct 1 mA of current, which makes current Im = IcQ ≈ 2 mA. Thus, Vbe2/Rx = VbeQ/Rx = 1 mA, or Rx = 720 Ω. Since Ry/Rx = 1.083, Ry = 780 Ω. Note that Ic2/hFE2 = 1 mA/100 = 10 μA, which is 100times smaller than the current, Vbe2/Rx, thereby supporting (E8-1) to within an error of roughly 1%, which is within the 3% error tolerance assigned to current IcQ. (3). If IcQ/hFE << Im, which has been set to 2 mA, Figure (3.33) confirms Vcc = ( R1 + R2 ) I m + Vm . (E8-2) With Vcc = 6 volts, Im = 2 mA, and Vm = 1.5 volts, (R1 + R2) is 2,250 Ω. Recalling that R2/R1 = 1.083, this computation produces R1 = 1,080 Ω and R2 = 1,170 Ω. It is important to check the propriety of the invoked approximations. In the present case, IcQ/hFE << Im has been presumed. Since IcQ/hFE = 2 mA/100 = 20 μA and Im = 2 mA, Im exceeds IcQ/hFE by a factor of 100, which amounts to a computational error of around only 1%. (4). Equation (3-132) can now be used to determine the resistance, Ree. Although resistance Rm, as defined by (3-122) can be ignored because of its inverse dependence on (hFE + 1), it is a trivial matter to include Rm in the calculations. To this end Rm = 7.72 Ω in that Ry = 780 Ω and hFE = 100. Then, with R1 = 1,080 Ω, R2 = 1,170 Ω, αFE = 100/101, and Vcc = 6 volts, Ree = 1,549 Ω. Since (3-132) presumes (R1||R2) = 561.6 Ω << (hFE + 1)Ree = 156.5 KΩ, the approximation is satisfied by a factor of 156.5 KΩ/561.6 Ω = 278.7, which is tantamount to a computational error of 1/278.7 = 0.359%. This small error means that the computed value of Ree is high by nominally (0.00359)(1,549 Ω) = 5.6 Ω. Given the other approximations invoked in the course of this design procedure, it may be prudent to reduce Ree by very slightly more than 5.6 Ω. To this end, allow Ree = 1,540 Ω. (5). The only remaining resistance to be computed is the collector load resistance, Rl. From Figure (3.33), ⎛ h +1⎞ (E8-3) Vcc = Rl I cQ + VceQ + ⎜ FE ⎟ Ree I cQ , ⎝ hFE ⎠ which straightforwardly precipitates Rl = 694.6 Ω. Ming Hsieh Department of Electrical Engineering - 418 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma +6 V 1080 694.6 x2 4.61 V Q1 3.83 V 780 Q2 3.06 V 720 2.34 V 3.11 V 1540 1170 Figure (3.37). Biasing circuit designed in Example #3.8. All resistances are in units of ohms. The voltages shown in the boxes correspond to the estimated respective node voltages for a properly functioning circuit. Transistor Q2 has twice the base-emitter junction area of transistor Q1. Figure (3.37) delineates the completed design. As in the preceding design examples, the estimated static node voltages are provided in the schematic diagram. COMMENTS: The simulated results confirm the propriety of the design methodology. In particular, the simulated quiescent collector current of transistor Q1 at 27 °C is 2.00 mA, at 50 °C, the simulated Q-point collector current is 2.01 mA, at 75 °C, the simulated value of IcQ is 2.01 mA, and at 100 °C, IcQ = 2.01 mA. Moreover, at 27 °C, the simulated collector, base, and emitter voltages of transistor Q1, measured with respect to ground, are 4.61 volts, 3.84 V, and 3.11 V, respectively. For Q2, the corresponding voltages are 3.84 V, 3.05 V, and 2.32 V. Design solutions are rarely unique. In the present example, different disclosures accrue if a current other than 1 mA is arbitrarily chosen to flow through resistance Rx. From a thermal sensitivity perspective, the circuit at hand is clearly excellent. Nonetheless, it is assuredly not the panacea for BJT biasing for at least two reasons. First, a large number of resistances are required, and it is extremely important that the resistance pairs, R1−R2 and Rx−Ry, track one another well over temperature extremes. Second, note as in the first biasing example, that resistance Ree exceeds the value of the collector load resistance, thereby limiting the available voltage gain in the absence of additional design heroics applied to the circuit at hand. 3.4.2.4. N-Stage Current Mirror The satisfactory performance of many analog networks relies on the reliable and predictable implementation of several current sources (or sinks) that act as high impedance active loads for amplifier cells or provide static paths to ground for currents used in the biasing of other subcircuits deployed in these networks. Rather than implement this multiplicity of current Ming Hsieh Department of Electrical Engineering - 419 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma sinks individually, it is expedient to derive them from a single reference cell. To this end, a common embodiment is the network shown in Figure (3.38). The reference circuit is comprised of the resistance, R, and the diode-connected device, transistor Q0, whose emitter current is Io. The collectors of identical transistors Q1, Q2, · · · QN establish the requisite current sinking paths, where the base-emitter junction injection area of the kth transistor is k-times that of the reference device, Q0. Assuming that the transistors are otherwise identical, the obvious equivalence of base-emitter terminal voltages among the (N+1) cascaded transistors in Figure (3.38) implies in general that the emitter current flowing in the kth transistor is kIo. This current supports corresponding collector and base currents of αFEkIo and αFEkIo/(hFE+1) = (1−αFE)kIo, where parameter αFE is related to the DC beta, hFE, by (3-48). The last statement requires that each transistor operate in its forward active regime, which constrains the collector-emitter voltage, Vk, implicit to the kth transistor to be at least as large as the base-emitter terminal potential, Vbe, observed for all transistors. The tacit assumption of equal hFE among all transistors stems from the area scaling invoked and the presumption that either the forward Early voltages are large and/or that no significant differences prevail among the individual collector-emitter voltages. The reference current, Ir, conducted by resistance R in the circuit of Figure (3.38) must be large enough to accommodate the emitter current, Io, flowing in reference transistor Q0 and each of the base currents conducted by transistors Q1 through QN. Thus, +Vcc V1 R V2 Rx1 Ir Rx2 αFEk1I o Q1 VN RxN αFEk2I o αFEkNIo Q2 QN Q0 x k1 Io k1Io x k2 x kN k2Io kNIo Figure (3.38). An N-stage current mirror. All transistors are fundamentally identical, save for the fact that the kth transistor has a base-emitter junction injection area that is k-times larger than that of the diode-connected transistor, Q0. I r = I o + (1 − αFE ) I o N ∑ ki , (3-139) i =1 which implies that the current, Ick, conducted by the collector of the kth device is αFE kk (Vcc − Vbe ) αFE kk I r = I ck = . (3-140) N N ⎡ ⎤ 1 + (1 − αFE ) ki ⎢1 + (1 − αFE ) ki ⎥ R i =1 i =1 ⎦⎥ ⎣⎢ Clearly, the relative insensitivity to the DC beta, hFE, of any collector current flowing in Q1 through QN mandates ∑ N ∑ ki i =1 << ∑ 1 = ( hFE + 1) , 1 − αFE Ming Hsieh Department of Electrical Engineering (3-141) - 420 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma whose satisfaction is progressively more challenging if one or more of the area scaling factors is large and/or the number of current sinking stages is large. In addition to compromising collector current sensitivity to hFE, large area scaling factors also limit the small signal collector output resistance, Rxk, achievable in the kth current stage. It should be clear that if the kth transistor in Figure (3.38) is replaced by its low frequency, small signal BJT equivalent circuit, Rxk, as indicated in the subject diagram, is merely the Early resistance, rok, of the kth device. Ignoring internal collector and emitter series resistances, a reference to (3-56) spawns, in terms of the forward Early voltage, Vaf, Vk + Vaf Vk + Vaf ⎡ ⎤ Rxk ≈ rok ≈ ≈ ⎢ (3-142) ⎥R , I ck ⎣ αFE kk (Vcc − Vbe ) ⎦ where the validity of (3-141) is presumed. We note in this last expression that the current sink output resistance is inversely dependent on the area scaling factor for the base-emitter junction of the kth transistor. An improved version to the N-stage current mirror, offered in Figure (3.39), addresses the potential area scaling shortfall to which the circuit in Figure (3-48) succumbs. Transistor Q0 in this revised circuit diagram no longer functions as a diode. Nonetheless, its emitter is still depicted as supporting a static current of Io, as in the original diagram of Figure (3.38). The insertion of transistor QP in the form of the topological interconnection shown in Figure (3.39) forces its emitter to conduct the sum of the base currents flowing in transistors Q0 through QN, as well as the current, Ip, conducted by the resistance, Rp. In principle, resistance Rp, is not required. But without Rp, the emitter of transistor QP necessarily conducts only the small base currents of transistors Q0 through QN, thereby risking a significant reduction in the DC beta of QP. In contrast, if Rp is selected to conduct a current that is nominally equal to the emitter current of transistor Q0, hFE for transistor QP approximates the DC beta of transistor Q0 and hence, the DC beta values of all other transistors. +Vcc V1 R V2 Rx1 αFEk1I o Ir QP Q1 VN Rx2 RxN αFEk2I o αFEkNIo Q2 Q0 QN Rp Io x k1 x k2 k1Io x kN kNIo k2Io Ip Figure (3.39). An improved version of the N-stage current mirror of Figure (3.38). The insertion of transistor QP diminishes the dependence of the kth collector current on both the number of stages deployed and the area scaling factors of these individual stages. An inspection of the circuit in Figure (3.39) reveals N ⎡ ⎤ I r = αFE I o + ( 1 − αFE ) ⎢ I p + ( 1 − αFE ) I o + (1 − αFE ) I o ki ⎥ . ⎢⎣ i =1 ⎥⎦ ∑ Ming Hsieh Department of Electrical Engineering - 421 - (3-143) USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma In addition to ensuring nominally identical hFE values among all devices, it is analytically convenient to set Ip = Io. In this case, N ⎞ 2 ⎛ (3-144) I r = I o + ( 1 − αFE ) I o ⎜ 1 + ki ⎟ , ⎜ ⎟ i =1 ⎠ ⎝ which implies that the current flowing through resistance R in Figure (3.39) is essentially invulnerable to the number of current sink stages and the area scaling factors invoked in the circuit architecture. This observation contrasts sharply with (3-139), which depicts current Ir in the diagram of Figure (3.38) as potentially sensitive to relevant loading effects. It is additionally interesting to note that the subject current is nominally equivalent to the emitter current conducted by transistor Q0. Since Ir ≈ Io, the collector current of the kth transistor is α k (V − 2Vbe ) I ck ≈ αFE kk I o ≈ FE k cc . (3-145) R The result at hand suggests that the price paid for the incorporation of transistor QP into the cascaded current mirror is a doubling of the temperature sensitivity in that current Io is now functionally dependent on twice the base-emitter junction potential, as opposed to the single Vbe dependence projected by (3-140). ∑ 3.4.2.5. Wilson Current Mirror The Wilson current mirror mitigates the port impedance limitations pervasive of the Nstage mirror considered in the preceding subsection by exploiting shunt-series feedback to boost the available impedance level above the Early resistance of the output port transistor[8]. Its basic schematic diagram is given in Figure (3.40). In this diagram, the grounded emitter transistor, Q2, and the diode-connected device, transistor Q3, implement feedback that is in shunt with the base terminal of output transistor Q1 and in series with the Q1 emitter lead. The three transistors are similar, but transistors Q1 and Q3 have a base-emitter junction injection area that is k-times larger than the corresponding injection area of transistor Q2. Accordingly, we can presume that the DC beta values and applied base-emitter terminal voltages of all active devices are nominally the same, especially if each transistor exudes large forward Early voltages. All devices operate in their forward active regimes. In the case of transistor Q1, such operation requires that the output port voltage, V1, be at least as large as 2Vbe, while for transistor Q2, the reference current, Ir, flowing into the junction of resistance R with the base of Q1 and the collector of Q2 satisfies V − 2Vbe I r = cc . (3-146) R If the emitter of transistor Q2 conducts a current of I2, as shown in Figure (3.40), the emitter of transistor Q3 necessarily conducts kI2 since the base-emitter terminal voltages of these two devices are the same. Accordingly, the collector of Q2 conducts αFEI2, while a current of (1 −αFE)I2 flows into the base of Q2. In order to keep Kirchhoff happy, the emitter of transistor Q1 supports a current, Ie1, of (3-147) I e1 = kI 2 + (1 − αFE ) I 2 , whence an output port current, I1, flowing into the collector of transistor Q1 of 1 − αFE ⎞ ⎛ I1 = αFE kI 2 ⎜ 1 + ⎟. k ⎝ ⎠ It follows that the base current, Ib1, pertinent to transistor Q1 is Ming Hsieh Department of Electrical Engineering - 422 - (3-148) USC Viterbi School of Engineering Lecture Supplement #05 I b1 = BJT Models & Biasing J. Choma I1 1 − αFE ⎞ ⎛ = ( 1 − αFE ) kI 2 ⎜ 1 + ⎟, hFE k ⎝ ⎠ (3-149) V1 +Vcc Rx R Ir I1 Ib1 Q1 xk αFE I2 (1−αFE )I2 Ie1 Q2 x1 Q3 xk I2 kI2 Figure (3.40). Basic schematic diagram of the Wilson current mirror. which produces a resistance current, Ir, of ⎡ ⎛ k ⎞⎛ 1 − αFE ⎞ ⎤ I r = I b1 + αFE I 2 = αFE I 2 ⎢1 + ⎜ (3-150) ⎟⎜ 1 + ⎟⎥ . h k ⎝ ⎠ ⎝ FE ⎠ ⎣ ⎦ Observe that for large hFE, the output current mirrors, by a factor of k, the current conducted by resistance R, which in turn closely approximates the collector current conducted by transistor Q2. Specifically, (3-148), (3-150), and (3-146) combine to deliver k (Vcc − 2Vbe ) I1 ≈ αFE kI 2 ≈ kI r = . (3-151) R Recalling that Vbe decreases with junction temperature Tj in accordance with the empiricism, ΔVbe ≈ −SbeΔTj, the temperature-induced perturbation, ΔI1, in current I1 derives as 2k Sbe 2I1Sbe ΔI1 ≈ = , (3-152) ΔT j R Vcc − 2Vbe which in turn stipulates the temperature-induced per-unit change in current I1 as 2Sbe ΔT j 2ΔVbe ΔI1 ≈ = − . (3-153) I1 Vcc − 2Vbe Vcc − 2Vbe As is generally the prerequisite implicit to a design scenario premised on a high degree of temperature stability, an appropriately large supply voltage (Vcc in this case) is recommended. Figure (3.41a) depicts the approximate low frequency, small signal model pertinent to an examination of the output resistance that we highlight as Rx. In this equivalent circuit, resistance Rd3 derives from (3-117) in that it represents the small signal terminal resistance of diodeconnected transistor Q3. The circuit analysis, which is sufficiently sloppy to warrant the company of a large glass of a nice merlot, can more easily be interpreted if the given junction injection ratios are judiciously exploited. To this end, assume that all transistors are characterized by reasonably large forward knee and Early voltages. Then, since Q1 and Q3 conduct roughly the Ming Hsieh Department of Electrical Engineering - 423 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma same collector current, their base, base-emitter diffusion, and Early resistances are nominally the same; that is rbb1 ≈ rbb3 rbb rπ1 ≈ rπ3 rπ ro1 ≈ ro3 ro . (3-154) In view of the fact that the small signal beta of each device is the product of forward transconductance, which nominally varies directly with quiescent collector current, and baseemitter diffusion resistance, which varies as an inverse function of collector current, βac1 ≈ βac2 ≈ βac3 βac . (3-155) From (3-117), ⎛ r + rπ3 ⎞ ⎛ rbb + rπ ⎞ rbb + rπ Rd 3 = ro3 ⎜ bb3 . (3-156) ⎟ ≈ ro ⎜ ⎟ ≈ βac + 1 ⎝ βac3 + 1 ⎠ ⎝ βac + 1 ⎠ Since the base-emitter geometry of transistor Q2 is smaller than that of either Q1 or Q3 by a factor of k and since this device conducts a current that is correspondingly k-times smaller than the current supported by transistors Q1 and Q3, rbb2 ≈ krbb3 = k rbb (3-157) rπ2 ≈ krπ3 = k rπ . ro2 ≈ kro3 = k ro The immediate modeling ramifications of (3-154) through (3-157) is the equivalent circuit offered in Figure (3.41b). In this diagram, resistance Rss is given by (3-158) Rss ( kro ) R , which invariably is adequately approximated by merely the circuit resistance, R. A conventional analysis of the circuit in Figure (3.41b) generates the following equilibrium equations: Rd3 I x + Rd3 I a = ⎡⎣ k ( rbb + rπ ) + Rd3 ⎤⎦ I b Rss ( I a + βac I b ) + ( rbb + rπ ) I a + k ( rbb + rπ ) I b = 0 . (3-159) Vx = ro ( I x − βac I a ) + k ( rbb + rπ ) I b Unfortunately, these equations must be solved simultaneously to arrive at the desired expression for the resistance, Rx = Vx/Ix, of interest. A second glass of the aforementioned merlot mitigates the inclination toward profanity and results in ⎡ ⎤ ⎛r +r ⎞ αac βac Rss + k ⎜ bb π ⎟ ⎢ ⎥ βac + 1 ⎠ Vx ⎝ ⎢ ⎥r Rx = = 1+ o ⎢ Ix ⎛ rbb + rπ ⎞ ⎥ k 1 R 1 k β 2 + + + + ⎡ ⎤ ( ) ( ) ⎢ ss ac ⎣ ⎦⎜ β + 1 ⎟⎥ ⎢⎣ ⎝ ac ⎠ ⎥⎦ (3-160) ⎡ ⎤ ⎛ rbb + rπ ⎞ k ( Rss + rbb + rπ ) ⎜ ⎢ ⎥ ⎟ βac + 1 ⎠ ⎝ ⎢ ⎥, + ⎢ ⎛ rbb + rπ ⎞ ⎥ ⎢ ( k + 1) Rss + ⎡⎣1 + k ( βac + 2 ) ⎤⎦ ⎜ ⎟⎥ ⎢⎣ ⎝ βac + 1 ⎠ ⎥⎦ Ming Hsieh Department of Electrical Engineering - 424 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Rx rbb1 Vx rπ1 Ia rbb2 Ia+βac2 Ib ro2 R βac2 Ib rπ2 βac1 Ia ro1 Ix−βac1 Ia Ix+Ia Ix Rd3 Ix+Ia−Ib Ib (a). Rx rbb Vx rπ Ia krbb Ia+βac Ib Rss β ac Ib krπ βac Ia ro Ix−βac Ia Ix+Ia Ix Rd3 Ix+Ia−Ib Ib (b). Figure (3.41). (a). Low frequency, small signal equivalent circuit of the Wilson current mirror shown in Figure (3.40). The small signal output resistance, Rx, is the voltage to current ratio, Vx/Ix. (b). The model of (a) redrawn to account explicitly for the fact that the base-emitter junction injection areas of transistors Q1 and Q3 in Figure (3.40) are a factor of k larger than the junction injection area of transistor Q2. where (3-156) is used and βac αac = . (3-161) βac + 1 For large AC beta and the invariably large Early resistance of a bipolar junction transistor, the formidable form of the resistance expression in (3-160) collapses to ⎡ ⎤ βac Rss Rx ≈ ⎢1 + (3-162) ⎥ ro , + + + k 1 R k r r ( ) ( ) ss bb π ⎦ ⎣ which can be substantially larger than the Early resistance, ro. Ming Hsieh Department of Electrical Engineering - 425 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma EXAMPLE #3.9: The SPICE parameters of the silicon technology transistors utilized in the Wilson current mirror of Figure (3.40) are itemized in Table (3.1). Design the circuit so that the current, I1, conducted by transistor Q1 is 4 mA at room temperature. Assuming a baseemitter voltage temperature sensitivity of Sbe = 2 mV/°C, this current is to be sustained to within ±5% up to operating temperatures of 75 °C. Use the HSPICE BJT model parameters in Table (3.1) to simulate the finalized design at 27°C, 50 °C, and 75 °C. Additionally, simulate the room temperature frequency response of the output impedance presented at the collector of Q1. SOLUTION #3.9: +6 V 2V Zx 4.2 KΩ 4 mA Q1 1.45 V x4 Q2 727 mV x1 Q3 x4 Figure (3.42). Schematic portrayal of the Wilson circuit designed in Example #3.9. The voltages shown in the boxes correspond to the estimated respective node voltages for a properly functioning circuit. The indicated 4 mA collector current of transistor Q1 is a design target. (1). Given that silicon transistors are deployed in the subject Wilson mirror, there is nothing immoral about presuming that the base-emitter terminal potentials of all active devices are nominally 700 mV. But a slightly more satisfying approach entails deducing these potentials by using the values of saturation current Is, junction injection coefficient nf, and forward knee current Ikf given in Table (3.1). To this end, Ikf = 11.5 mA yields a forward transport current, Icc, in (E3-1) of 1.342 mA for a collector current of 1 mA. Then, with Icc = 1.342 mA, Is = AeJs = 3.2 fA and nf = 1.05. Additionally, the approximate room temperature value of base-emitter terminal potential, Vbe, derives from (3-5) as Vbe ≈ 727.1 mV. It follows that voltage V1 must satisfy V1 ≥ 2Vbe = 1.454 V. (2). In an attempt to conserve standby power, let transistor Q2 conduct one-fourth the current flowing in both transistors Q1 and Q3, which effectively stipulates a requisite junction injection area ratio of k = 4. (3). In (3-153), ΔI1/I1 = 0.05, ΔTj = (75 °C − 27 °C) = 48 °C, Sbe = 2 mV/°C, and Vbe = 727.1 mV. Then, since Ming Hsieh Department of Electrical Engineering - 426 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma 2Sbe ΔT j ΔI1 = ≤ 0.05, (E9-1) I1 Vcc − 2Vbe Vcc ≥ Vbe + (2SbeΔTj /0.05) = 5.294 V. Select Vcc = 6 V to provide at least token design headroom to compensate for parametric uncertainties and analytical approximations. (4). For a reference current, Ir, of about 1 mA, (3-151) produces R = 4.546 KΩ. Once again, a consideration of design-oriented uncertainties motivates the selection of resistance R as R = 4.3 KΩ. (5). Figure (3.42) is the schematic diagram of the completed design, where V1 has been selected as 2 V to satisfy the requirement of V1 ≥ 1.454 V. As usual, estimated static node voltages are provided in the diagram. COMMENTS: As in previous examples, the simulated results confirm the propriety of the design methodology. In particular, the simulated quiescent collector current, I1, of transistor Q1 at 27 °C is 4.008 mA, at 50 °C, the simulated Qpoint current is 4.075 mA, and at 75 °C, the simulated value of I1 is 4.149 mA. Thus, the largest temperature-induced change in current I1, which not surprisingly is observed at 75 °C, is only 3.52% larger (well within the target 5% deviation target) than the subject current value at room temperature. The simulated output impedance magnitude is displayed in Figure (3.43). At the quiescent operating point established by Vcc = 6 volts and V1 = 2 volts, SPICE discloses the operating point parametric detail itemized below. Several noteworthy observations surface from this itemization and the subject frequency response plot. MODEL IB IC VBE VBC VCE BETADC GM RPI RX RMU RO CPI CMU CBX CCS BETAAC FT Q1 NT 3.5627E-05 4.0080E-03 0.7245 -0.5505 1.2750 112.5001 1.3667E-01 7.6227E+02 6.7224E+01 1.1718E+12 7.6179E+03 6.1650E-13 3.6996E-15 0.0000E+00 2.0741E-14 1.0418E+02 3.5071E+10 Q3 NT 3.6239E-05 3.9984E-03 0.7250 0.0000 0.7250 110.3338 1.3619E-01 7.4940E+02 6.7220E+01 6.0739E+11 7.4986E+03 6.1446E-13 4.4335E-15 0.0000E+00 2.8694E-14 1.0206E+02 3.5022E+10 Q2 NT 9.0492E-06 1.0226E-03 0.7250 -0.7245 1.4495 113.0081 3.4835E-02 3.0011E+03 2.6888E+02 1.1946E+12 3.0027E+04 1.5701E-13 8.8742E-16 0.0000E+00 5.8204E-15 1.0454E+02 3.5113E+10 (a). The low frequency value of the simulated magnitude of the output impedance is 144.85 KΩ, which is almost 19-times larger than the simulated value of the Early resistance (shown above as R0 = 7.6179 KΩ) for transistor Q1. Accordingly, our prediction of an output resistance that is substantially larger than the Early resistance is apparently appropriate. Ming Hsieh Department of Electrical Engineering - 427 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma (b). Despite the fact that SPICE predicts a unity current gain frequency (FT) of about 35 GHz for all three transistors, the 144.85 KΩ resistance level attenuates by a factor of root two at about 29 MHz. This observation corroborates with earlier disclosures to the effect that there is depressingly little correlation between fT and achievable frequency domain performance in most bipolar circuits. (c). As presumed in the course of the analysis of the Wilson mirror, the DC beta (BETADC) and the AC beta (BETAAC) are approximately the same for all transistors. Recall that the smallest geometry transistor, which carries a collector current that is 4-times smaller than the other two devices is Q3. Note that the values of rπ (RPI), ro, and rbb (RX) for transistor Q3 are nominally 4-times larger than the corresponding parameters for transistors Q1 and Q2. On the other hand, Cπ (CPI) for the higher current transistors is roughly 4-times the Cπ value of Q3, which is as expected owing to the almost direct dependence of baseemitter diffusion capacitance on quiescent collector current. In contrast, the base-collector transition capacitances, Cμ (CMU) are relatively independent of current level, as expected, but they do scale with junction area. A similar statement prevails for the substrate capacitances (CCS), which dominantly limit the attainable frequency response of impedance Zx. Recall that substrate capacitances do not factor into the enumeration of the unity gain frequency, fT, of the transistors. Magnitude Of Output Impedance, Zx, (KΩ) 160 120 80 40 0 1 10 100 1000 Signal Frequency (MHz) Figure (3.43). Simulated frequency response of the magnitude of the output impedance, Zx, for the Wilson current mirror in Figure (3.42). 3.4.2.6. Supply-Independent Biasing Each of the biasing networks presented thus far is capable of mitigating the deleterious effects of junction temperature rises. Unfortunately, however, all deliver quiescent current reMing Hsieh Department of Electrical Engineering - 428 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma sponses that are sensitive functions of the applied supply voltage. As a result, fluctuations in the supply voltage, such as those incurred by aging batteries or the interaction of nonzero Thévenin supply resistances with large transient fluctuations in the currents delivered by these supplies, translate directly to a corresponding perturbation in quiescent collector currents. In applications where these voltage-induced current fluctuations are intolerable, biasing networks that deliver reduced sensitivity to supply line variations are required. One of the numerous examples of networks delivering biasing currents that are nominally independent of supply line voltages is the configuration offered in Figure (3.44). NPN transistors Q1 and Q2 are identical, save for the fact that the base-emitter junction injection area of Q2 is kn-times larger than that of Q1. If a quiescent current, IQ, is presumed to flow in the emitter of transistor Q2, nominally the same current is conducted by the emitter of the PNP diode-connected transistor, Q3. This statement assumes that all devices have large DC beta (which permits the tacit neglect of all transistor base currents), large forward knee current, and large forward Early voltage. Since transistors Q3 and Q4 have identical injection areas and utilize identical emitter degeneration resistances, Ree, current IQ in Q3 is mirrored in the emitter of transistor Q4 and hence, in the emitter of transistor Q1. With the help of the Ebers-Moll model, it follows that +Vcc Ree Ree Ree /kp Q3 Q4 x1 Q1 x1 Q5 x1 x kp Q2 Vo x kn R IQ IQ Rx Rl Io Figure (3.44). Schematic diagram of a biasing network delivering quiescent currents IQ and Io that are, to first order, independent of the applied supply voltage, Vcc. V n V V n V IQ = I s ⎡ e be1 f T − 1⎤ = kn I s ⎡ e be2 f T − 1⎤ . (3-163) ⎢⎣ ⎥⎦ ⎢⎣ ⎥⎦ Upon neglecting the unity terms within the bracketed quantities, this relationship produces Vbe1 − Vbe2 ≈ n f VT ln ( kn ) . (3-164) By using the Q3-Q4-Ree mirror to force equality between the emitter currents of transistors Q1 and Q2, the difference in base-emitter junction injection areas of Q1 and Q2 fosters an offset between the corresponding base-emitter terminal voltages, Vbe1 and Vbe2. This nonzero offset is crucial in that it establishes a nominal independence of current IQ on the supply line voltage, Vcc. In particular, (3-165) Vbe1 = Vbe2 + RI Q , Ming Hsieh Department of Electrical Engineering - 429 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing whence, by (3-164), n f VT ln ( kn ) V − Vbe2 ≈ IQ = be1 , R R which is independent of voltage Vcc. J. Choma (3-166) Before celebrating the supply-independent result of (3-166), at least five important engineering points warrant careful engineering consideration. First, (3-163) and the current mirroring action between transistors Q3 and Q4 requires that transistors Q4 and Q2 function in their forward active regimes. Such operation for transistor Q4 requires Vec4 ≥ Veb4, where Vec4 and Veb4 respectively denote the emitter to collector and the emitter to base voltages developed on Q4. In turn, Vec4 ≥ Veb4 demands a supply voltage that is large enough to satisfy, (3-167) Vcc ≥ Ree IQ + Vbe1 + Veb4 . Assuming both Vbe1 and Veb4 are of the order of 700 mV, we see that Vcc in excess of approximately 1.4 volts is compulsory if the desired operation of the circuit is to be sustained. For transistor Q2, linear domain operation mandates Vce2 = Vcc − Veb3 − ( Ree + R ) IQ ≥ Vbe2 , (3-168) which in turn commands Vcc ≥ Ree IQ + Vbe2 + Veb3 + n f VT ln ( kn ) (3-169) You are encouraged to verify that the satisfaction of (3-169) guarantees the satisfaction of (3167). The second important point relevant to (3-166) is that while the indicated current is ostensibly independent of Vcc, subject to the constraint imposed by (3-169), it is variant with temperature. In fact, IQ in (3-166) is PTAT in that Boltzmann voltage VT is directly proportional to absolute junction temperature. But the subject temperature dependence is not entirely bad news in that the forward transconductance of transistor Q2 (and indeed Q1, Q3, and Q4, as well) is rendered relatively insensitive to temperature. In particular, (3-54) confirms that the forward transconductance is inversely dependent on the effective Boltzmann voltage, nfVT. To wit, if the effects of knee current and Early voltage can be ignored (as we have done at the outset of this study), (3-54) suggests IQ ln ( kn ) (3-170) g m2 = g m1 = g m3 = g m4 ≈ ≈ . n f VT R This disclosure is notable because if the circuit at hand is operated as an amplifier, the gain and particularly the open loop gain in a feedback configuration, which is often proportional to forward transconductance, is rendered temperature stable. The third noteworthy point is that the current conducted by transistor Q5, whose baseemitter junction injection area is kp-times that of transistors Q3 and Q4, is, like current IQ, nominally invariant with supply voltage. This contention follows from the fact that the emitter degeneration resistance of transistor Q5 is a factor of kp smaller than that of Q3, which implies k p n f VT ln ( kn ) I o = k p IQ = , (3-171) R since ⎛R ⎞ Ree IQ + Veb = ⎜ ee ⎟ I o + Veb . (3-172) ⎜ kp ⎟ ⎝ ⎠ Ming Hsieh Department of Electrical Engineering - 430 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma If transistor Q5 operates in its linear regime where Vec5 ≥ Veb5, its transconductance is k p IQ k p ln ( kn ) Io gm5 ≈ = ≈ , n f VT n f VT R (3-173) which, like the transconductances of the other transistors in the subject network, is essentially independent of junction operating temperature. In practice, the area ratio, kp, should be kept under two or three in that large kp sustains proportionately larger collector current in Q5. In turn, large current levels in Q5 diminish its Early resistance, which compromises the attainable output resistance, Rx, of the current source. The fourth noteworthy point is that resistance Ree can be set to zero without affecting the current solution in (3-166). In fact, it is desirable to set Ree to zero in some low voltage applications, since zero emitter degeneration in the PNP devices in Figure (3.44) lowers the requisite minimum supply voltage, Vcc, in (3-169). It is included herewith to increase the output resistance, Rx, so that the Q5-Ree/kp subcircuit emulates a current source whose output current is rendered progressively more independent of supply voltage. The final, and arguably most important, point to be offered is that while (3-166) defines the desired current solution for the biasing network in Figure (3.44), it is unfortunately not the only solution. In particular, Vbe1 = Vbe2 = 0 sets IQ = 0 as a plausible current solution. In other words, it is possible that at power supply turn on, transistors Q1 and Q2, and thus all other transistors in the network, lock to a nonconductive state. Slight parametric differences among the current mirroring devices are likely to preclude this obviously undesirable null state, but given the luck of the traditional circuit design engineer, gambling that the desired solution voiced by (3-166) is realized is imprudent. Accordingly, a startup circuit −preferably a subcircuit that consumes no or negligible steady state power− is a worthwhile investment in design time and chip area. To the foregoing end, a relatively simple startup addendum to the network of Figure (3.44) is submitted in Figure (3.45). The startup cell comprised of capacitance C and transistors Q6 and Q7 conduct current only under circuit startup conditions. Startup in the present sense corresponds to closure of switch SW. If switch closure occurs at time t = 0, the indicated line voltage, Vp(t), approximates an ideal voltage step; that is Vp(t) = Vccu(t). Assuming capacitance C is initially uncharged, the idealized instantaneous jump in the power line voltage, Vp(t), is transmitted instantly to the base-emitter terminals of transistor Q7. With the base-emitter junction of Q7 strongly forward biased, a potentially large collector current is allowed to flow through Q7, where we understand that this current can derive only from transistor Q3. The current conducted by Q3 is mirrored to transistor Q4. In response to this mirroring action, the current forced through transistor Q1 by Q4 is accompanied by an increase in base-emitter terminal voltage Vbe1 from its zero value that prevails prior to switch closure. Note, however, that voltage Vbe2 remains nominally zero as Vbe1 commences its increase. This contention derives from the fact that the large forward bias imposed across the base-emitter junction of Q7 immediately after switch closure forces the current conducted by Q3 to flow through Q7. In effect, Q7 bypasses the Q2-R subcircuit in the immediate neighborhood of time t = 0. But as voltage Vbe1 increases, transistor Q6 ultimately starts to conduct. Its collector current can be supplied only by the capacitive branch of the startup cell. This branch continues to supply current until capacitor C is fully charged, which occurs when the indicated capacitor voltage, Vc, is Vcc. As Vc approaches Vcc to within a base-emitter junction threshold, or turn on, voltage, the base-emitter voltage of transistor Q7 drops below threshold potential, whereupon transistor Q7 enters its cutoff regime. Ming Hsieh Department of Electrical Engineering - 431 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma With C almost fully charged, Q6, like Q7, is starved of current, and the startup cell is effectively disconnected from the rest of the circuit. As such, the biasing network achieves steady state in that the current induced to flow in Q3 necessarily flows through Q2, as presumed in the analysis leading to (3-166). Vp(t) Ree Ree t= Ree /kp SW + Q3 Q4 x1 Vcc Q5 Vc + − x1 C 0 − x kp Q7 x kc Q1 x1 x kc Startup Cell Q6 Rx Q2 Vo x kn R IQ IQ Rl Io Figure (3.45). The supply-independent biasing network of Figure (3.44) with a startup cell incorporated to preclude a null current solution at network startup. EXAMPLE #3.10: Design the supply-independent biasing network of Figure (3.45) so that at room temperature operating conditions, current IQ is nominally 1 mA and current Io is nominally 2 mA for supply voltages, Vcc, in the range of 1.8 volts to 6 volts. Verify the design through SPICE simulation. Specifically, simulate the static describing functions from Vcc to both IQ and Io at operating temperatures of 27 °C, 50 °C, and 75 °C. Additionally, simulate the time domain responses of currents IQ and Io to a 6 volt battery switched into the circuit at time t = 0 with a 500 nSEC rise time. The HSPICE parameters for the NPN devices appear in Table (3.1), while Table (3.2) lists the parameters for PNP transistors that are reasonably complementary to the NPN units. SOLUTION #3.10: (1). Current IQ is nonzero if and only if transistors Q1 and Q2 possess differences in their baseemitter junction injection areas. Arbitrarily choose kn = 10, meaning that the base-emitter junction area of transistor Q2 is ten-fold that of Q1. There is little point in making kn much larger than ten or so since IQ in (3-166) is seen as dependent, not on kn, but on the natural logarithm of kn. From Table (3.1) the junction injection coefficient, nf, of all NPN devices is Ming Hsieh Department of Electrical Engineering - 432 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma seen to be nf = 1.05. Thus, with a junction temperature of Tj = 27 °C = 300 °K, nf = 1.05, kn =10, and IQ = 1 mA, resistance R in the network of Figure (3.45) derives from (3-166) as n f VT ln ( kn ) = 62.6 Ω . R = (E10-1) IQ In view of the empirical nature of parameter nf, the unavoidable uncertainties associated with the internal junction temperature, and the relatively small size of the requisite circuit resistance, we should allow for trimming resistance R to the precise value that yields the target IQ = 1 mA current. (2). The next step in the design scenario determines the appropriate emitter degeneration resistance, Ree, commensurate with satisfactory circuit operation at Vcc =1.8 volts. Equation (3169) is the applicable relationship, but prior to its use, the emitter-base voltage, Veb3, for SPICE TEXT SYMBOL SYMBOL BF βf DESCRIPTION OF PARAMETER VALUE UNITS Forward Short Circuit Gain 100 amps/amp BR βr Reverse Short Circuit Gain 1.3 amps/amp CJC CJE CJS IKF IRB IS MJC MJE MJS NF NR RB Cjco Cjeo Cso Ikf Irb Is mc mje ms nf nr rbb Zero Bias B-C Depletion Capacitance fF fF fF mA mA fA – – – – – Zero Bias Base Resistance 2.4 4.7 12.2 9.4 3.3 4.3 0.333 0.5 0.5 1.02 1.0 310 RBM Rbm Minimum Base Resistance 43 Ω RC rc Series Collector Resistance 22 Ω RE re Series Emitter Resistance 1.7 TF τfo Zero Bias Minority Carrier Transit Time 6.2 Ω pSEC TNOM Tj Junction Reference Temperature 27 VAF VJC VJE VJS XTI XTF XTB Vaf Vjc Vje Vjs Forward Early Voltage 24 780 920 690 3 0.025 0.03 Zero Bias B-E Depletion Capacitance Zero Bias Substrate Depletion Capacitance Forward Knee Current Base Resistance Corner Current Saturation Current B-C Junction Grading Coefficient B-E Junction Grading Coefficient Substrate Junction Grading Coefficient B-E Junction Injection Coefficient B-C Junction Injection Coefficient B-C Junction Built-In Potential B-E Junction Built-In Potential Substrate-Collector Built-In Potential Ming Hsieh Department of Electrical Engineering Temperature Exponent For IS Temperature Exponent For TF Temperature Exponent For BF - 433 - Ω °C volts mvolts mvolts mvolts − − − USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Table (3.2). HSPICE model parameters for a representative PNP bipolar junction transistor. Although the transistor characterized herewith is fictitious, the parameters are typical of a moderately high speed BJT. transistor Q3 and the base-emitter voltage, Vbe2, for transistor Q2 must be estimated. To this end, precise calculations are not required and therefore, knee currents and Early voltages are ignored to enable the use of the simple Ebers-Moll relationship for the forward transport current in (3-5) for both NPN and PNP transistors. In particular, ( Vbe n f VT I c ≈ I cc = I s e ) Vbe n f VT − 1 ≈ I se , (E10-2) which applies to NPN devices with minimal junction injection areas. In the case of PNP transistors, the only required change entails the replacement of base-emitter voltage Vbe by emitter-base voltage Veb. For transistor Q2, Table (3.1) gives Is = 3.2 fA and, of course, nf = 1.05. Since Q2 has a ten-fold increase in base-emitter junction area, Is in (E10-2) must be multiplied by 10. Then with Ic ≈ IQ = 1 mA, Is = (10)(3.2 fA), nf = 1.05, and Tj = 300 °K, Vbe2 = 656.5 mV. On the other hand, the PNP transistor, Q3, which has minimal junction area, offers from Table (3.2), Is = 4.3 fA and nf = 1.02. Accordingly, Ic = IQ = 1 mA in (E102) produces Veb3 = 690.8 mV. Recalling (3-169), Vcc ≥ 1.8 volts requires resistance Ree to satisfy 1.8 − Vbe2 − Veb3 − n f VT ln ( kn ) Ree ≤ = 390.1 Ω . (E10-3) IQ Design conservatism on the part of the integrated circuit designer is almost always laudable and thus, select Ree = 300 Ω. (3). If current Io is to be 2 mA, which is twice the value of current IQ, transistor Q5 in Figure (3.45) should boast twice the base-emitter junction injection area of transistor Q3. Moreover, the desired current mirroring between transistors Q3 and Q5 requires that the emitter degeneration resistance for Q5 be one-half that of transistor Q3. Note in Figure (3.45) that the emitter degeneration resistance of Q5 is delineated as Ree/kp, where kp, the junction area factor of Q5, is kp = 2. (4). When the supply line battery switch is closed at time t = 0, capacitor C begins to charge, such that the indicated capacitor voltage, Vc, ultimately rises to 6 volts. To crude first order, the rate of capacitor voltage charging matches the slew rate of the supply line, which is 6 volts/500 nSEC = 12 volts/μSEC. The current conducted by capacitance C in the circuit of Figure (3.45) closely approximates the collector current, say Ic6(t) flowing in transistor Q6. Accordingly, dV (t) ΔVc (E10-4) ≈ C ≈ C ( 12 volts/μSEC ) . I c6 (t) ≈ C c dt Δt Most transistors in the subject network conduct steady state currents in the range of 1 mA. In order to forestall excessive junction heating in the startup cell devices, it is prudent to limit the maximum current in transistor Q6 to approximately 1 mA, especially if the indicated area factor, kc, is set to one. With Ic6(t) =1 mA, (E10-4) delivers C = 83.3 pF. Set C = 85 pF, which requires an off chip realization of this element. In addition to concerns about junction heating, care must be exercised to preclude voltage overstress in transistors Q6 and Q7. Specifically, note that if switch SW in Figure (3.45) were ideal, the entire 6 volts of supply line energy is developed across the base-emitter junction of transistor Q6 immediately after switch closure. Depending on the process actually adopted for the monolithic realization of the network under consideration, high voltage options may need to be exploited for transistors Q6 and Q7. Ming Hsieh Department of Electrical Engineering - 434 - USC Viterbi School of Engineering Lecture Supplement #05 (5). BJT Models & Biasing J. Choma The variable awaiting computation is the resistance, Rl, in Figure (3.45). The current, Io, flowing through resistance Rl is 2IQ, and this same current approximates the emitter current of transistor Q5. Thus, the emitter-collector voltage, Vec5, supported by transistor Q5 is Vec5 = Vcc − ( Ree + 2Rl ) IQ . (E10-5) In order for Q5 to sustain operation in its forward active domain, Vec5 must be at least as large as Veb5 even when Vcc lies at its minimum, 1.8-volt level. The Q5 emitter-base voltage, Veb5, effectively matches Veb3, which has been calculated to be 690.8 mV. It follows that 6V 300 300 5.70 V 5.70 V Q4 x1 0V Q6 + Q5 x1 85 Q7 0 SW 5.70 V Q3 5.01 V t= 150 − x2 6 5.01 V x1 x1 719 mV 800 mV x 10 Q1 Q2 Vo x1 65.0 mV 65 IQ IQ 400 Io Figure (3.46). The supply-independent biasing network, complete with startup compensation, designed in Example #3.10. All resistances are in units of ohms, the capacitor is in picofarads, and the voltage supply is in units of volts. The indicated node voltage estimates apply in the steady state subsequent to closure of switch SW. Rl ≤ Vcc − Ree IQ − Veb5 2IQ = 404.6 Ω . (E10-6) Choose Rl = 400 Ω. (6). A schematic diagram of the completed design is shown in Figure (3.46). A first simulation of the network reveals a simulated current, IQ, which is about 4.8% larger than its target factor. Accordingly, resistance R in Figure (3.45) is increased from its originally computed 62.6 Ω to (1.048)(62.6 Ω) = 65.6 Ω. Subsequent to running a few static simulations to confirm the propriety of relevant design modifications, we converge to R = 65 Ω. Several SPICE simulations were executed to confirm the propriety of the design submitted as the schematic diagram in Figure (3.46) (a). Figure (3.47) displays room temperature, simulated static sweeps of currents IQ and Io versus the supply line voltage, Vcc. At Vcc = 6 volts, IQ = 1.01 mA, which is a scant 1% larger than the target design value. Even if Vcc drops from its steady state 6-volt value Ming Hsieh Department of Electrical Engineering - 435 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma by 75% to 1.5 volts, IQ is maintained at 924.9 μA, which represents a degradation of only 8.04%. On the other hand, the output current, Io, is 1.97 mA at Vcc = 6 volts and 1.77 mA at Vcc = 1.5 volts, which computes as a 10.12% decrease with respect to the current value at Vcc = 6 volts. The observed nonzero slopes in the current curves can largely be attributed to finite Early voltages. Said slope is more pronounced in the output current characteristic because the Early voltage of the PNP transistor, Q5, is smaller than that of any of the NPN devices. Below nominally 1.5 volts, transistors that are not connected as diode elements operate in saturation to produce current characteristics that are strongly sensitive to supply line voltage variations. 2.5 Io Current (mA) 2.0 1.5 IQ 1.0 0.5 0 0 2 4 6 8 10 Power Supply Voltage, Vcc (volts) Figure (3.47). Simulated static describing functions for the room temperature currents, IQ and Io, in the circuit of Figure (3.46). (b). Figure (3.48) offers the foregoing static sweeps at 50 °C and 75 °C, as well as at 27 °C. Temperature sensitivity is apparent, which is as expected because of the current solutions in (3-166) and (3-171). In particular, if the junction injection coefficient, nf, and circuit resistance, R, are temperature invariant, (3-166) and (3-7) deliver ΔIQ n f k ln ( kn ) = = 3.21 μA / °C . (E10-7) ΔT j qR Equation (3-171) demonstrates that the temperature sensitivity of the output current, Io, is larger than the foregoing sensitivity by a factor of kp. Thus, ΔIQ k p n f k ln ( kn ) ΔI o = kp = = 6.42 μA / °C . (E10-8) ΔT j ΔT j qR The increase in the temperature sensitivity of current Io by a factor of kp over the sensitivity of current IQ rebukes the use of high junction injection area factors in the PNP units deployed in the circuit at hand. An examination of the data from which Figure (3.48) derive indicates that IQ = 1.006 mA at T = 27 °C, while at 50 °C and 75 °C, the subject current is 1.086 mA and 1.173 mA, respectively. Comparing the 75 °C simulated result to its 27 °C counterpart, Ming Hsieh Department of Electrical Engineering - 436 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing ΔI Q = ΔT j (1.173 − 1.006 ) (10 -3 ) 75 − 27 J. Choma = 3.48 μA / °C , (E10-9) which is 8.4% higher than the computed sensitivity in (E10-7). This error can be attributed to the temperature dependence of other transistor parameters (such as the Early voltage), which are tacitly ignored in (3-166). For output current Io, Io = 1.969 mA, 2.125 mA, and 2.295 mA at 27 °C, 50 °C, and 75 °C, respectively. It follows that 2.5 Current (mA) 2.0 Io 1.5 Tj = 75 °C Tj = 50 °C Tj = 27 °C 1.0 IQ 0.5 0 0 2 4 6 8 10 Power Supply Voltage, Vcc (volts) Figure (3.48). Simulated static describing functions at 27 °C, 50 °C, and 75 °C for the currents, IQ and Io, in the circuit of Figure (3.46). ΔI o = ΔT j (c). ( 2.295 − 1.969 ) (10 -3 ) 75 − 27 = 6.79 μA / °C , (E10-10) which is only 5.8% larger than the calculated temperature sensitivity in (E10-8). Finally, Figure (3.49) offers the transient responses of currents IQ and Io to switch closure at time t = 0, subject to the condition that the switch in question induces a supply line voltage rise time of 500 nSEC. Superimposed on this plot are the currents conducted by the startup transistors, Q6 and Q7. The latter curves confirm that the startup devices are effectively disconnected from the biasing network, well within 1 μSEC of switch closure, in that the collector currents of these transistors are seen to reduce to zero. The currents, IQ and Io, are seen to settle to their respective steady state values at 584.75 nSEC. Since the supply line does not reach 6 volts until 500 nSEC, the circuit can be said to settle within 84.75 nSEC subsequent to the time at which the supply line is fully charged. Observe a significant amount of peaking in the current outputs, IQ and Io, while the currents conducted by the startup devices always remain below IQ and Io. Ming Hsieh Department of Electrical Engineering - 437 - USC Viterbi School of Engineering Current (mA) Line Voltage, Vp(t) (volts) Lecture Supplement #05 BJT Models & Biasing J. Choma 6 4 2 0 3 Io 2 IQ 1 Ic7 Ic6 0 0 0.2 0.4 0.6 0.8 1.0 1.2 Time (microseconds) Figure (3.49). Transient current responses to switch closure in the circuit of Figure (3.46). The current, Ic6, is the collector current conducted by transistor Q6, while Ic7 denotes the collector current of transistor Q7. COMMENTS: As suggested earlier, the circuit addressed in this example is one of many whose operation is premised on formulating a subcircuit that establishes an offset between base-emitter terminal voltages of key transistors. All are capable of delivering static current responses that, while not strictly independent of power supply voltage, are significantly desensitized with respect to supply line voltage variations. Most of these networks are able to limit current variations about nominal design targets to 5%-10%, despite upwards of 50% degradation in line voltage. The prices paid for these supply-independent topologies are potentially significant temperature sensitivities, a recurring need for resistor trimming, and the inevitable requirement of startup cells that preclude null current states. Three additional biasing circuits are reserved for your own edification in Problems #3.28 through #3.30. Arguably the best of the supply-independent biasing schemes is the bandgap reference circuit[9]. In addition to offering laudable voltage desensitization, these schemes also deliver superior performance over wide extremes of operating temperature[10]. An analytical consideration of the bandgap reference supply is reserved for a later chapter that addresses high performance analog CMOS signal processing. 3.5.0. REFERENCES [1]. J. J. Ebers and J. L. Moll, “Large-Signal Behavior of Junction Transistors,” Proceedings of the IRE, vol. 42, pp. 1761-1772, Dec. 1954. Ming Hsieh Department of Electrical Engineering - 438 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma [2]. H. K. Gummel and H. C. Poon, “An Integral Charge-Control Model of Bipolar Transistors,” Bell System Technical Journal, vol. 49, pp. 115-120, May-June 1970. [3]. C. T. Kirk, “A Theory of Transistor Cutoff Frequency (fT) at High Current Densities,” IEEE Transactions on Electron Devices, vol. ED-9, pp. 164-174, Mar. 1962. [4]. S. Dimitrijev, Understanding Semiconductor Devices. New York: Oxford University Press, 2000, pp. 334-341. [5]. J. M. Early, “Effects of Space-Charge Layer Widening in Junction Transistors,” Proceedings of the IRE, vol. 46, pp. 1141-1152, Nov. 1958. [6]. H. N. Ghosh, “A Distributed Model of the Junction Transistor and its Application in the Prediction of the Emitter-Base Diode Characteristic, Base Impedance, and Pulse Response of the Device,” IEEE Transactions on Electron Devices, vol. ED-12, pp. 513-531, Oct. 1965. [7]. J. R. Hauser, “The Effects of Distributed Base Potential on Emitter Current Injection Density and Effective Base Resistance for Stripe Transistor Geometries,” IEEE Transactions on Electron Devices, vol. ED-11, pp. 238-242, May 1965. [8]. G. R. Wilson, “A Monolithic Junction FET-NPN Operational Amplifier,” IEEE Journal of Solid-State Circuits, vol. SC-3, pp. 341-348, Dec. 1968. [9]. P. Brokaw, “A Simple Three-Terminal IC Bandgap Reference,” IEEE Journal of Solid-State Circuits, vol. SC-9, pp. 388-393, Dec. 1974. [10]. Y. Tsividis, “Accurate Analysis of Temperature Effects in Ic-Vbe Characteristics with Application to Bandgap Reference Sources,” IEEE Journal of Solid-State Circuits, vol. SC-14, pp. 655657, June 1979. Ming Hsieh Department of Electrical Engineering - 439 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma EXERCISES Problem #3.1 Each of three bipolar junction transistor interconnections depicted in Figure (P3.1) is functional as an effective PN junction diode. For each of these connections, derive an expression for the volt-ampere characteristic, Id -versus- Vd, and stipulate the effective saturation current, say Io, associated with each diode emulation. Id − − − + Id Vd Vd Vd + Id (a). + (b). (c). Figure (P3.1) Problem #3.2 In the composite transistor structure of Figure (P3.2), both transistors are identical, and the indicated supply voltage, Vcc, is large enough to reverse bias the base-collector junctions of both devices. Moreover, the battery voltage, Vbb, is sufficiently large to forward bias the base-emitter junctions of both transistors. Use the Ebers-Moll model to derive expressions for the current ratios, I2/I1, I3/I1, and I4/I1. I2 +Vcc I3 I1 + Vbb I4 − Figure (P3.2) Problem #3.3 Consider a bipolar junction transistor that is operated in such a manner as to ensure a strongly reverse biased base-collector junction. Using the simple Ebers-Moll model, show that the base-emitter voltage, Ve, commensurate with zero emitter current is negative and given by Ve = − n f VT ln β f + 1 . ( ) Problem #3.4 A bipolar junction transistor is operated with forward bias applied to its base-emitter junction. Use the simple Ebers-Moll model to show that the resultant collector current to base current transfer ratio, Ic/Ib, is necessarily smaller than the gain parameter, βf, whenever the base-collector junction of the subject transistor is forward biased. Ming Hsieh Department of Electrical Engineering - 440 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Problem #3.5 Repeat Example #3.3 for the diode interconnections of Figures (3.6b) and (3.6c). Problem #3.6 Use the Ebers-Moll model of a bipolar junction transistor to show that the ratio, Ibe/Ibc, of forward to reverse recombination currents can be cast in terms of the BJT emitter and collector currents, Ie and Ic, respectively, in accordance with ⎛ I e − α r I c ⎞ ⎡ 1 + 1 − α f βr ⎤ I be ⎥. = ⎜ ⎟⎢ ⎜ α f I e − I c ⎟ ⎢ 1 + ( 1 − αr ) β f ⎥ I bc ⎝ ⎠⎣ ⎦ ( ) (a). Explain the engineering significance of a zero value to this ratio when Ie = αrIc. (b). Explain the engineering significance of an infinite value to this ratio when Ic = αfIe. Problem #3.7 Repeat Example #3.4 for the case in which the collector-emitter biasing voltage is only one volt. Problem #3.8 Repeat Example #3.4 for the stipulated biasing point, but for a transistor having three-times the base-emitter junction area. Additionally, plot the unity gain frequency, fT, as a function of the quiescent collector current, IcQ. Evaluate an approximate collector current commensurate with maximum achievable fT, and compute this maximum unity gain frequency. Problem #3.9 An occasionally invoked metric for high frequency performance capabilities of transistors is the transverse cutoff frequency, say fb. This metric is the 3-dB frequency of the small signal, short circuit forward transadmittance, yfe(jω), evidenced in a grounded emitter topology. The “short circuit” refers to a collector-emitter port that supports zero signal. Use the model in Figure (3.14) to derive analytical expressions for both yfe(jω) and fb. For simplicity, take rc = re = 0 in the BJT model. Problem #3.10 The BJT in the grounded base amplifier in Figure (P3.10) operates in its forward active regime because of the constant voltage supply, Vcc, and the static current sink, IQ. The input signal is applied as the current, Is, whose Norton resistance is Rs. The response to this input current is extracted as the signal component, Ios, of the net current, Io, which flows through the collector load resistance, Rl. Use the model of Figure (3.14), with resistances rc and re tacitly ignored, to respond to the following directives. (a). Evaluate the current transfer function, Ai = Ios/Is, at low signal frequencies. Give an upper limit to this current gain. (b). For a sinusoidal input signal, Is, infinitely large Rs and a short circuit load resistance, Rl, evaluate the current transfer function, Ai = Ios/Is, as a function of frequency ω. (c). Derive an expression for the 3-dB bandwidth of the current gain determined in Part (b). Suitable approximations can be invoked as long as these approximations are clearly rationalized from an engineering perspective. (d). Compare the gain-bandwidth product of the grounded base amplifier with the short circuit, unity gain frequency, fT, of the grounded emitter configuration. Ming Hsieh Department of Electrical Engineering - 441 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma +Vcc Rl Io Is Rs IQ Figure (P3.10) Problem #3.11 The BJT in the grounded collector amplifier in Figure (P3.11) operates in its forward active regime because of the constant voltage supplies, Vcc and Vbb. The input signal is applied as the voltage, Vs, whose Thévenin resistance is Rs. The response to this input signal voltage is extracted as the signal component, Vos, of the net voltage, Vo, which is established across the indicated load resistance, Rl. Use the model of Figure (3.14), with resistances rc and re ignored, to respond to the following directives. +Vcc Rs + Vbb Vo − + Rl Vs − Figure (P3.11) (a). Explain why the configuration in Figure (P3.11) is commonly referenced as a grounded collector amplifier, despite the fact that the collector is not actually grounded and instead is incident with the positive terminal of a constant voltage source. (b). Evaluate the voltage transfer function, Av = Vos/Vs, at low signal frequencies. Give an upper limit to this voltage gain. (c). For a sinusoidal input signal, Vs, zero Rs, and an infinitely large load resistance, Rl, evaluate the voltage transfer function, Av = Vos/Vs, as a function of frequency ω. (d). Derive an expression for the 3-dB bandwidth of the voltage gain determined in Part (c). Suitable approximations can be invoked as long as these approximations are clearly rationalized from an engineering perspective. (e). Compare the gain-bandwidth product of the grounded collector amplifier with the short circuit, unity gain frequency, fT, of the grounded emitter configuration. Ming Hsieh Department of Electrical Engineering - 442 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Problem #3.12 Develop a design-oriented expression for the quiescent collector current, IcQ, in the PNP transistor cell of Figure (P3.12). Assess the shortfalls of the biasing configuration. +Vee R2 + VebQ − + VecQ − Rl R1 IcQ Figure (P3.12) Problem #3.13 The silicon transistor in the biasing configuration of Figure (P3.13) operates in its linear regime where it has a static beta of hFE, a base-emitter junction temperature coefficient of −Sbe, and a nominal base-emitter turn on voltage of Vbe. (a). Derive a general expression for the quiescent collector current, IcQ. (b). Stipulate the inequality that the circuit must satisfy if current IcQ is to be rendered nominally insensitive to gain parameter hFE. (c). Under the condition deduced in Part (b), what is the temperature sensitivity, ΔIcQ/ΔTj, of the circuit? (d). What small signal resistance, say Rx, is presented to load resistance Rl at the collector node of the subject biasing network? Use reasonable approximations to simplify the expression for this resistance and comment on the ability of the circuit to sustain nominally constant Q-point collector current in the face of signal changes presented at the collector node. +Vcc Rl Rx R1 IcQ R2 Ree Figure (P3.13) Ming Hsieh Department of Electrical Engineering - 443 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Problem #3.14 Using a 6 volt power supply, design the circuit in Figure (P3.13) for IcQ = 1 mA and VceQ = 1 volt at room temperature. The collector current is to be held constant to within ±2% over a temperature range extending to 75 °C. Assume that the transistor is identical to that exploited in Example #3.6 and parameterized in Table (3.1). Use HSPICE or similar circuit simulation software to determine the quiescent collector current at 27 °C, 50 °C, and 75 °C. Problem #3.15 The silicon transistor in the circuit of Figure (P3.15) operates in its linear regime where it has a static beta of hFE, a base-emitter junction temperature coefficient of −Seb, and a nominal base-emitter turn on voltage of Veb. (a). Derive a general expression for the quiescent collector current, IcQ. (b). Stipulate the inequality that the circuit must satisfy if current IcQ is to be rendered nominally insensitive to gain parameter hFE. (c). Under the condition deduced in Part (b), what is the temperature sensitivity, ΔIcQ/ΔTj, of the circuit? IcQ − Vee Ree R1 + R2 Figure (P3.15) Problem #3.16 The two identical silicon transistors in the low noise biasing circuit of Figure (P3.16) operate in their linear regimes where they display a static beta of hFE, a base-emitter junction temperature coefficient of −Sbe, and a nominal base-emitter turn on voltage of Vbe. (a). Derive general expressions for the quiescent collector currents, IcQ1 and IcQ2, conducted by transistors Q1 and Q2. (b). Stipulate the inequalities that the circuit must satisfy if the two quiescent collector currents are to be rendered nominally insensitive to gain parameter hFE. (c). Under the condition deduced in Part (b), what are the temperature sensitivity coefficients, σi1 and σi2, of the two quiescent collector currents? (d). The circuit exploits feedback, which is implemented by resistance R3 and the inductive coil. Explain qualitatively the operation of this feedback loop. Ming Hsieh Department of Electrical Engineering - 444 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma R5 R2 Q2 +Vcc Q1 R4 R1 R3 Figure (P3.16) Problem #3.17 The power supply voltage, Vcc, in the biasing network of Figure (P3.17) is 9 volts, and the two transistors are identical to the devices embraced by Example #3.6 and Table (3.1). Design the circuit so that each bipolar junction transistor conducts a quiescent collector current of 2 mA ± 5% at a collector-emitter voltage of 1.5 volts over a temperature range extending from 27 °C to 75 °C. Use HSPICE or equivalent computer-aided analysis software to confirm the propriety of the finalized design at 27 °C, 50 °C, and 75 °C. +Vcc R Rl Rl Q1 R Q2 Rk Figure (P3.17) Problem #3.18 Table (3.2) itemizes the HSPICE parameters for a representative, high-speed PNP bipolar junction transistor. Use this device to address the following directives. Unless specified otherwise, assume a junction operating temperature of 27 °C. (a). Set up a computer-aided simulation that sweeps, for an emitter-collector voltage, Vec, of 1.5 volts, the static collector current as a function of the applied emitter-base voltage, Veb, for 0 ≤ Veb ≤ 800 mV. Plot these curves. (b). Set up a computer-aided simulation that sweeps, for an emitter-collector voltage, Vec, of 1.5 volts, the static base current as a function of the applied emitter-base voltage, Veb, for 0 ≤ Veb ≤ 800 mV. Plot these curves. (c). Use the plots garnered from the execution of the preceding two parts of this problem to generate a plot of the DC beta, hFE, as a function of collector current for Vec = 1.5 Ming Hsieh Department of Electrical Engineering - 445 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma volts. (d). Use the foregoing simulated results to deduce the value of emitter-base junction voltage, Veb, commensurate with a collector current of 2 mA. What is the DC beta of the transistor at this collector current? (e). Repeat Part (a) for a junction temperature of 75 °C. Recall that the temperature induced change, ΔVeb, in static emitter-base terminal voltage can be represented as ΔVeb ≈ −SebΔTj, where ΔVeb is the voltage change required to preserve constant collector current over the temperature excursion, ΔTj, which can be taken as the temperature difference between 27°C and 75 °C. Deduce the value of coefficient Seb, using the simulations already executed. Problem #3.19 The power supply voltage, Vcc, in the biasing network of Figure (P3.19) is 3 volts, and the two transistors are identical to the device parameterized in Table (3.2). Use the simulation results garnered in the preceding problem to design the circuit so that transistor Q1 conducts a quiescent collector current of 2 mA ± 5% at an emitter-collector voltage of 1.5 volts over a temperature range extending from 27 °C to 75 °C. Use HSPICE or appropriate other computer-aided analysis software to confirm the propriety of the finalized design at 27 °C, 50 °C, and 75 °C. Q2 Q1 IcQ R Rl −Vcc Figure (P3.19) Problem #3.20 Redesign the circuit addressed in Example #3.8 under the constraint that the current conducted by resistance Rx is to be nominally one-fourth of the collector current conducted by transistor Q2. Submit a finalized schematic diagram, and simulate the design at 27 °C, 50 °C, 75 °C, and 100 °C. Problem #3.21 Redesign the circuit addressed in Example #3.8 under the constraints that the collector load resistance imposed on transistor Q1 is at least 5-times larger than the emitter degeneration resistance, Ree. In this approach, it is likely impossible to achieve equal collector-emitter voltages between transistors Q1 and Q2. Submit a finalized schematic diagram, and simulate the design at 27 °C, 50 °C, 75 °C, and 100 °C. Problem #3.22 Derive a general expression for the static collector current, Ic, conducted by transistor Q2 in the network of Figure (3.33). Deduce the resultant temperature coefficient of this collector current. Ming Hsieh Department of Electrical Engineering - 446 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Problem #3.23 Using (3-116), develop by inspection an expression for the resistance, Rx, indicated as presented at the collector terminal of transistor Q1. In comparison with the biasing configuration shown in Figure (3.29), what is the effectiveness of this circuit to cope with signal fluctuations at the collector port? Problem #3.24 In the cascode current mirror shown in Figure (P3.24), all four transistors are identical, save for the fact that transistors Q3 and Q4 each have base-emitter junction injection areas that are k-times larger than those of transistors Q1 or Q2. All transistors operate in their forward active regimes where they support identical base-emitter terminal potentials and identical values of the DC beta, hFE. +Vcc V R Rx Ir IQ Q1 Q3 x1 xk Q2 Q4 x1 xk Figure (P3.24) What is the static collector-base operating voltage of transistor Q4? What is the minimum allowable collector to ground potential, V, of transistor Q3? Derive the equation that relates current IQ to the current, Ir, conducted by resistance R. Derive the equation that relates current IQ to the supply voltage, Vcc, the circuit resistance, R, and the base-emitter terminal potential, Vbe, of all transistors. (e). What condition must be satisfied to render current IQ nominally independent of hFE? (f). Derive an expression for the temperature sensitivity, ΔIQ/ΔTj, of current IQ. Assume ΔVbe = −SbeΔTj, where Sbe is an empirical constant and Tj represents junction operating temperature of all devices. (g). Derive an expression for the indicated small signal resistance, Rx, established at the collector of transistor Q3. As usual, assume low frequency conditions and ignore the internal series resistances implicit to the collectors and emitters of all devices. Make sure to account for the fact that while the current densities of transistors are likely to be identical, the actual collector currents flowing in all devices are not necessarily the same. (a). (b). (c). (d). Problem #3.25 In the two stage Wilson current sink of Figure (P3.25), the four transistors are identical except for the fact that transistors Q1 and Q2 have twice the base-emitter junction injection area of transistors Q3 and Q4. Ming Hsieh Department of Electrical Engineering - 447 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma V3 +Vcc V4 Rx3 Rx4 R I3 I4 Q3 Ir Q4 x1 x1 Q1 x2 Q2 x2 Figure (P3.25) (a). What are the minimum allowable collector to ground potentials, V3 and V4, of transistors Q3 and Q4, respectively? (b). Derive the equations that relate currents I3 and I4 to the reference current, Ir, conducted by resistance R. (c). Derive the equations that relate currents I3 and I4 to the supply voltage, Vcc, the circuit resistance, R, and the base-emitter terminal potential, Vbe, of all transistors. (d). What condition must be satisfied to render currents I3 and I4 nominally independent of hFE? (e). Derive an expression for the temperature sensitivities, ΔI3/ΔTj and ΔI4/ΔTj, of currents I3 and I4. Assume ΔVbe = −SbeΔTj, where Sbe is an empirical constant and Tj represents junction operating temperature of all devices. (f). Derive expressions for the indicated small signal resistances, Rx3 and Rx4, established at the collectors of transistors Q3 and Q4. As usual, assume low frequency conditions and ignore the internal series resistances evidenced in the collector and emitter leads of all devices. Make sure to account for the fact that while the current densities of all transistors are likely to be nearly identical, the actual collector currents flowing in all devices are not necessarily the same. Problem #3.26 In the Wilson current mirror of Figure (P3.26), the transistors are identical except for the indicated differences in base-emitter junction injection ratios. (a). Derive an expression for the low frequency, small signal resistance, Ry, presented to the junction formed of resistance R, base terminal of transistor Q1, and collector terminal of Q2. Ignore internal series resistances in the collectors and emitters of all transistors and additionally, ignore all forward Early resistances. Provide an engineering justification for the tacit neglect of the Early resistance in each transistor. (b). Reduce the expression gleaned in (a) for the case of very large βac. Discuss the size of the resultant resistance in terms of the injection area ratio, k. Ming Hsieh Department of Electrical Engineering - 448 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma V1 +Vcc Rx R I1 Ir Q1 xk Ry Q2 x1 Q3 xk Figure (P3.26) Problem #3.27 Using the low frequency, small signal model of a bipolar junction transistor, develop an analytical expression for the small signal resistance, Rx, in the supply-independent biasing configuration in Figure (3.45). Ignore the internal collector and emitter resistances of all transistors. Furthermore, assume that the two startup transistors, Q6 and Q7, are large geometry devices so that the substrate capacitance of transistor Q6 emulates a short circuit for the signal frequencies of immediate interest. Problem #3.28 +Vcc Rk Ree Ree Ree /kp Q3 Q4 x1 Q1 x1 Q5 x1 x kp Q2 Vo x kn R IQ IQ Rl Io Figure (P3.28) A clear advantage of the startup cell in the supply-independent biasing scheme of Figure (3.45) is that it consumes no power in the steady state. A disadvantage is that it utilizes a capacitor whose required value is generally sufficiently large to preclude its on chip circuit implementation. The circuit in Figure (P3.28) supplants the subject startup cell with a simple resistance, Rk, which is chosen large enough to ensure that it exerts minimal impact on Ming Hsieh Department of Electrical Engineering - 449 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma the overall standby power dissipation of the network. Prove that a small current flowing through resistance Rk prevents a null startup state. Problem #3.29 The circuit in Figure (P3.29) provides an output current, Io, which is not independent of the supply voltage, Vcc, but instead, is a function of a natural logarithmic function of Vcc. It therefore shows a voltage sensitivity that is smaller than the current sensitivities of biasing networks whose currents of interest are linearly related to the supply line voltage. All three transistors in the circuit are identical and are characterized by the parameters in Table (3.1). +Vcc Io R1 Rl Vo Q1 x1 Q2 x1 R2 Q3 x1 Figure (P3.29) (a). Assuming large static beta, hFE, in transistor Q1, show that the output current, Io, is given by ⎛ V − 2Vbe ⎞ V I o = T ln ⎜ cc ⎟, R2 ⎝ R1 I s ⎠ where VT is the familiar Boltzmann voltage, and Is is the saturation current of the NPN transistors. It is to be understood that while Vbe is the base-emitter terminal voltage of each of the transistors, it can be supplanted by the junction threshold voltage for most design purposes. (b). Is current Io PTAT? Explain briefly. (c). Using a nominal 5-volt supply, design the circuit so that Io = 5 mA at room temperature. Select resistance Rl so that the collector-emitter potential supported by transistor Q1 is 2Vbe, even if the supply voltage degrades to 2.5 volts. (d). Use SPICE to simulate the room temperature static describing function, Io versus Vcc, for the design effected in the preceding part of this problem, over a Vcc range spanning 0 ≤ Vcc ≤ 10 volts. Does the simulated current sensitivity to supply voltage corroborate with theoretical expectations. (e). Repeat Part (d) for junction operating temperatures of 50 °C and 75 °C. Does the simulated current dependence on temperature track with analytical expectations? Explain briefly. Problem #3.30 Figure (P3.30) proposes a supply-independent biasing scheme that can function as either a current source (via the current, Io1, conducted by PNP transistor Q6) or a current sink (via the current, Io2, flowing in the collector of NPN transistor Q3) or both, simultaneously. Ming Hsieh Department of Electrical Engineering - 450 - USC Viterbi School of Engineering Lecture Supplement #05 BJT Models & Biasing J. Choma Current Io1 derives from current IQ as a result of the current mirror formed of transistors Q5 and Q4, while current Io2 is likewise directly dependent on IQ because of the effective mirror established by transistors Q1 and Q3. To the extent that the Early voltages of all active devices are large, currents Io1 and Io2 are consequently independent, to first order, of the supply voltage, Vcc. All NPN transistors are identical, save for the indicated junction area factors, and have the parameters itemized in Table (3.1). Similarly, all PNP devices are identical, except for delineated area factors, and have the parameters listed in Table (3.2). +Vcc Q5 Q4 x1 Q6 x1 IQ x kp IQ Io1 Vo1 Q2 Vo2 x1 Io2 Q3 Q1 x1 R x kn Figure (P3.30) (a). Assuming all transistor base currents can be ignored and all transistor Early voltages and knee currents are large, derive expressions for the output currents, Io1 and Io2. (b). What is the minimum value, say Vmin, of supply voltage Vcc that is commensurate with the linear active operation of transistors Q1, Q2, Q4, and Q5? (c). Are null current states at startup an issue? If they are, mitigate the problem with a suitably connected resistance. Show the modified circuit schematic diagram. (d). Using a nominal 6-volt supply, design the circuit so that IQ = 1 mA, Io1 = 2 mA, and Io2 = 3 mA at room temperature. Select voltage Vo1 as the maximum voltage permissible with linear active mode operation of transistor Q6 when Vcc = Vmin. Additionally, select voltage Vo as the minimum voltage that ensures linear active regime operation of transistor Q3 when Vcc = Vmin. (e). Use SPICE to simulate the room temperature static describing functions, Io1 versus Vcc and Io2 versus Vcc, for the design executed in the preceding part of this problem, over a Vcc range spanning 0 ≤ Vcc ≤ 10 volts. What perturbations in currents Io1 and Io2 are observed when Vcc degrades by 50%? (f). Repeat Part (d) for junction operating temperatures of 50 °C and 75 °C. Do the simulated current dependencies on temperature track with analytical expectations? Explain briefly. (g). Assuming a startup resistance is required, select its value such that the increased power dissipation of the entire circuit is less than 2% of the dissipation observed for the circuit with no startup provision. Simulate the transient responses of currents Io1 and Io2 when Vcc is a 6-volt pulse waveform exuding 500 nSEC rise and fall times. What is the simulated settling time of the entire circuit? Ming Hsieh Department of Electrical Engineering - 451 - USC Viterbi School of Engineering