Under Development
Organic
Air Cavity
Open Semiconductor
QFN Packages
Fabless
Prototype
Quick Turn
Pre- Production
RF
MEMS
Sensor
Semiconductor
Panel Array Version
Bottom View
Singulated
Cavity View
Singulated
17595 Harvard Ave, Suite 509
Irvine, Ca 92614 USA
Tel +1-866-404-8800
info@MirrorSemi.com
www.Mirrorsemi.com
Under Development
Table of Contents
Series
Quick View
Page
Singulated Air Cavity (Open Cavity):
A-QFN
A-TQFN
A-DFN
A-TDFN
Quad Standard 0.90mm
Quad Thin 0.65mm
Dual Sides 0.90mm
Dual Sides Thin 0.65mm
4~5
Panel Array:
50x50mm Array. Partially sawn.
AH-QFN
Singulate by hand using razor blade tool.
Panel Array:
AW-QFN
60x60mm Array. Singulate by wafer dicing saw
Options, Custom Version and Materials
Multi-chip versions, custom sizes, metals, etc
info@MirrorSemi.com
2
6~7
6~7
8
www.MirrorSemi.com
Under Development
Introduction
About Mirror Semiconductor:
Mirror Semiconductor’s A-QFN series offers quick-to-market solutions for low cost, open cavity
(air cavity) organic semiconductor packages for pre-production, fabless prototype, probing, RF,
MEMS and sensor applications. Our open cavity A-QFN packages are excellent for R&D and
laboratory projects where low volume, low cost is required.
Quick Delivery:
Mirror Semiconductor can deliver open (air) cavity A-QFN wire-bondable organic packages in days
using copper clad organic substrates such as BT and NL-Core. For RF and special applications
Rogers, Arlon, LCP, polyimide and other composites are available.
Applications:
A-QFN wire-bondable open cavity packages are used for fabless prototyping, probing and preproduction for semiconductors, RF, MEMS and sensors. Contact Mirror Semiconductor to discuss
your special needs.
Advantages and Strong Points:
A-QFN organic open cavity packages soft tooled. Quicker than developing LTCC ceramic packages
or plastic injection molded packages from scratch. Organic substrates are made using PC board
fabrication techniques. Build-up needle dispensing liquid encapsulation creates the cavity. A-QFN
air-cavity packages are recommended for fabless prototyping and pre-production requirements.
Customized versions are available.
Distributors and Representatives:
Germany
France
Sweden and Finland
office@factronix.com
peri-cles@orange.fr
info@mirrorsemi.com
India
Korea
Japan
contact@emstonline.com
standardsk@korea.com
customer@ADY-jp.com
Jens Hoefer
Factronix
Tel +49 (0) 8141 5348890
L. Sampath
EMST Marketing PVT
Tel +91 (020) 3250 1000
Gérard PAPOUGNOT
Peri Cles
Tel +33 (0) 3.87.36.50.19
S.K. Kang
Standard Systems
Tel +82 - 02-404-1512
USA/Canada
Kenneth Hedman
Mirror Semi Nordic
Tel +46 - 70 53 54 203
Yoshida Koji
ADY Co. Ltd
Tel +81 - 06-6397-0412
Israel
TopLine
Tel +1-800-776-9888
Shai Kadary
Supertec
Tel +972 - 54-4282-290
sales@topline.tv
shai@supertec.co.il
.
info@MirrorSemi.com
3
www.MirrorSemi.com
Under Development
A- QFN
Air Cavity (Open Cavity)
Singulated Package
Die Cavity
Top
Bottom
Filled vias in pad (all places)
Cut-Away Side View
50µ-inch Gold Plating
Wire Bondable in Cavity
A
A = Air Cavity
(Singulated)
AH =
50mm Array
Hand Singulate
AW =
60mm Array
Part Number System
QFN
28
Model
Pins
Standard 0.9mm
8 ~ 80
-
Cavity
QFN=Quad
DFN=Dual
W
.8
-
-
Packaging
Pitch
Substrate
Version
W = 2” Waffle
P = 4” Waffle
T = JEDEC Tray
Thin 0.65mm
TQFN = Quad
TDFN = Dual
Saw/Dicing
info@MirrorSemi.com
5µ-inch Gold on Bottom
RoHS SMT Mounting
4
.4
.5
.65
.8
‘1.0
‘1.27
Standard:
Blank = BT
NL=NL Core
Blank = Standard
Special = 1~9
Special RF Grade:
R = Rogers R04003
A = Arlon
T = Taconic
X = Special
www.MirrorSemi.com
Under Development
A-QFN Dimension Table
Dimension in mm
N
P
D/E
D1/E1
D2/E2
D3/E3
Leads
Pitch
Size
Die Pad
Bond Pad
Cavity
8
12
12
12
16
16
16
20
20
20
24
24
24
28
28
28
32
32
32
36
40
40
44
44
48
52
56
64
68
72
80
0.65
0.5
0.65
0.8
0.5
0.65
0.8
0.5
0.65
0.8
0.5
0.65
0.8
0.5
0.65
0.8
0.5
0.65
0.8
0.5
0.5
0.65
0.5
0.65
0.5
0.5
0.5
0.5
0.5
0.5
0.5
3
3
4
4
3
4
5
4
5
5
4
5
6
5
6
7
5
7
8
6
6
8
7
8
7
8
8
9
10
10
12
1
1
2
2
1
2
3
2
3
3
2
3
4
2
4
5
3
5
6
4
4
6
5
6
5
6
6
7
8
8
10
1.3
1.3
2.3
2.3
1.3
2.3
3.3
2.3
3.3
3.3
2.3
3.3
4.3
2.3
4.3
5.3
3.3
5.3
6.3
4.3
4.3
6.3
5.3
6.3
5.3
6.3
6.3
7.3
8.3
8.3
10.3
2
2
3
3
2
3
4
3
4
4
3
4
5
4
5
6
4
6
7
5
5
7
6
7
6
7
7
8
9
9
11
D4
E4
0.65
1.0
1.6
1.6
1.5
1.95
2.4
2.0
2.6
3.2
2.5
3.25
4.0
3.0
3.9
4.8
3.5
4.55
5.6
4.0
4.5
5.85
5.0
6.5
5.5
6.0
6.5
7.5
8.0
8.5
9.5
L
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
L1
W
Ld Length
Ld Width
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.325
0.25
0.325
0.40
0.25
0.325
0.40
0.25
0.325
0.40
0.25
0.325
0.40
0.25
0.325
0.40
0.25
0.325
0.40
0.25
0.25
0.325
0.25
0.325
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Packaging Codes:
QFN
D/E
Size
3mm
4mm
5mm
6mm
7mm
8mm
9mm
10mm
12mm
Singulated Device
T
P
W
JEDEC Tray
4” Waffle
2” Waffle
Quantity
Quantity
Quantity
490
225
100
490
225
64
490
100
36
490
81
25
260
81
25
260
64
16
260
49
16
168
49
9
189
36
9
info@MirrorSemi.com
Outline
Dwg
460810
451210
461210
481210
451610
461610
481610
452010
462010
482010
452410
462410
482410
452810
462810
482810
453210
463210
483210
453610
454010
464010
454410
464410
454810
455210
455610
456410
456810
457210
458010
Height Table
Panel Array
T JEDEC Tray
P 4” Waffle
Quantity each Array
256
144
81
64
49
36
25
25
16
5
C1
C2
A
Standard
0.63
0.27
0.90
Low Profile
0.38
0.27
0.65
Tolerance
+/- 0.10
+/- 0.05
+/- 0.15
Check availability of other sizes.
See page 6~7 for panel array.
www.MirrorSemi.com
Under Development
AW-QFN
Air Cavity (Open Cavity)
Panel Array Type
Array Process and Applications
AH-QFN
Description
Snap Apart
By Hand
Panel Array Dimensions
AW-QFN
D
n
QFN per
D6
E
matrix
Array
E6
3mm
16x16
256
52.56mm
4mm
12x12
144
51.34mm
5mm
9x9
81
47.43mm
6mm
8x8
64
50.13mm
7mm
7x7
49
50.82mm
8mm
6x6
36
49.52mm
9mm
5x5
25
46.22mm
10mm
5x5
25
51.22mm
12mm
4x4
16
48.91mm
Saw width dicing blade 0.304mm (12mil)
Use Wafer
Dicing Saw
QFN, TQFN, DFN, TQFN, LCC
Wire Bonding – Step & Repeat
Saw with 12mil dicing blade
-
Hand singulate using razor blade
-
Outline bur after singulation
Perimeter saw targets & fiducials
Arrays in 4” waffle pack
Arrays in JEDEC tray
info@MirrorSemi.com
1
10
1
8
6
www.MirrorSemi.com
Under Development
AW-QFN
60x60mm Panel Array
Saw/Dicing
D/E = 3x3mm
D/E = 4x4mm
D/E = 5x5mm
D/E = 6x6mm
D/E = 7x7mm
D/E = 8x8mm
D/E = 9x9mm
D/E = 10x10mm
D/E = 12x12mm
Other sizes available
info@MirrorSemi.com
7
www.MirrorSemi.com
Under Development
Options and Custom Designs
Die Pad and Heat Spreader:
Standard Version 1:
Cu/Ni/Au
Cu/Ni/Au
Die
Via in Pad
Die Cavity (Side View)
Optional Version 3:
Optional Version 2:
Die
Bare
Cu/Ni/Au
Die
Bare
Cu/Ni/Au
Die isolated from ground
Without ground pad
Optional Version 0:
Bare
Die
Bare
Non-magnetic die pad.
Multiple Chip Cavity (Multi Chip Module):
1-Die (Standard)
2-Die (Optional)
4-Die (Optional)
6-Die (Optional)
Substrate Materials:
Standard Version: BT
Semiconductor Grade
Optional Version: NL-Core
Semiconductor Grade
Optional Version: Rogers
RF Grade: RO4003C
Other types available
Optional Version:
Customer Choice
Other Custom Options
•
•
•
•
•
Large sizes up to 25mm x 25mm (23mm die).
Sensor open cavity package with encapsulated bonding wires.
RF optimization molding using CST or Ansoft.
DFN – Pads on Dual Side for Dual in line applications.
Substrates without cavities are also available.
17595 Harvard Ave, Suite 509
Irvine, Ca 92614 USA
Tel +1-866-404-8800
info@MirrorSemi.com
www.Mirrorsemi.com
Rev Nov 24, 2008