Nuclear Instruments and Methods in Physics Research B 164±165 (2000) 979±985 www.elsevier.nl/locate/nimb 2D Monte Carlo simulation of proton implantation of superconducting YBa2 Cu3 O7ÿd thin ®lms through high aspect ratio Nb masks Nianhua Peng a a,* , Ivan Chakarov b, Chris Jeynes a, Roger Webb a, Wilfred Booij c, Mark Blamire c, Michael Kelly a Surrey Centre for Research in Ion Beam Applications, School of Electronic Engineering, Information Technology and Mathematics, University of Surrey, Guildford GU2 5XH, UK b SILVACO International, Santa Clara, CA 95054, USA c Department of Materials Science and Metallurgy, University of Cambridge, Pembroke Street, Cambridge CB2 3QZ, UK Abstract Perturbation of proton beam damage pro®le due to sidewall interactions in very high aspect ratio implant masks has been studied using Monte Carlo simulations. The model structure is composed of amorphous Nb metal mask, crystalline high temperature superconducting YBa2 Cu3 O7ÿd (YBCO) thin ®lm, and amorphous LaAlO3 substrate. The simulation results reveal the existence of enhanced proton beam penetration in target materials due to sidewall interactions. Ó 2000 Elsevier Science B.V. All rights reserved. 1. Introduction The discovery of cuprate superconductors in the late 1980s [1,2] stimulated worldwide studies on high temperature superconductivity. With the superconducting transition temperature Tc well above liquid nitrogen temperature in many new superconductors, it is possible that applications of superconductivity based on high temperature superconductors can work at a more feasible temperature and cost for wider applications. Fabrication of superconducting/normal/supercon- * Corresponding author. E-mail address: ees1np@ee.surrey.ac.uk (N. Peng). ducting (SNS) sandwiched Josephson junction devices with high Tc superconductor thin ®lms, as the core of any superconducting electronics applications, has been demonstrated successfully in many laboratories [3±6], though the manufacturing yield has poor throughput. The diculty in making high quality high Tc Josephson junction devices is closely related to the intrinsic short coherence length, at about nanometer scale for YBa2 Cu3 O7ÿd (YBCO), and large penetration depth of all high Tc superconductors. Consequently, workable SNS Josephson junctions have to be made with a thin normal state region on a nanometer scale. This is in sharp contrast to the size of conventional Nb based Josephson junctions [7]. 0168-583X/00/$ - see front matter Ó 2000 Elsevier Science B.V. All rights reserved. PII: S 0 1 6 8 - 5 8 3 X ( 9 9 ) 0 1 1 9 4 - 5 980 N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 It is well known that high temperature superconductivity in cuprates is sensitive to crystal defects and chemical non-stoichiometries. For example, creation of oxygen vacancies in YBCO can lead to superconducting±non-superconducting±insulating phase transitions. Elemental substitutions, such as 3d transition metal elements for Cu, depress the superconducting phase transition temperature Tc in general, though the solubility of such elemental substitutions is limited [8]. This opens a new approach for the fabrication of superconducting devices, such as Josephson junctions, if the suppression of superconductivity can be controlled up to a scale comparable with the dimension of the coherence length. Appropriate implantation of superconductors causes suppression of the superconducting transition temperature Tc through radiation damage eects, so a SNS junction can be made by implantation using a suitable mask structure or using focused electron and ion beams. Further investigations are underway in many laboratories worldwide using masked ion implantation damage processes, allowing faster manufacturing of device batches, due to the recent developments of lithography technology for the fabrication of implantation masks in the nanometer range [9±16]. It is very clear that the radiation damage distribution of high temperature superconductors, such as YBCO, is important for the performance of devices fabricated under energetic ion beam bombardment. Considering the small physical size of the mask structure (down to nanometer range) involved here, the damage behavior is very interesting but not fully understood. To con®ne the lateral distribution of the damaged area within a small area, and with high homogeneity, a high energy proton beam, and thin (50 nm) superconducting YBCO ®lms are proposed for the Josephson junction fabrication to avoid the lateral spreading of ion beam scattering and to maintain high spatial de®nition of the damaged region. The purpose of this paper is to report on the development of a simulation program to investigate the eects of implantation on Nb masked YBCO thin ®lms, and to report on a problem found by the simulator of a mechanism for ion to penetrate the mask, and consequently the need to make the mask much thicker than expected. 2. The Monte Carlo simulator: CRYSTAL The Monte Carlo simulation program CRYSTAL was written to meet the requirements for modelling of damage accumulation and channelling implantation in crystal silicon. The program is highly parallelized and vectorized, which results a signi®cant reduction in computation times. It has been adapted in order to take account of the complex crystal structure of YBCO. The detailed description of CRYSTAL has been reported elsewhere [17]. The schematic structure model is illustrated in Fig. 1. To simplify the calculation, the LaAlO3 substrate is approximated by an amorphous structure in®nitely thick. The assumption of an amorphous substrate is arbitrary, but its eect on the damage distribution in YBCO thin ®lm is expected to be small. On top of the LaAlO3 substrate is 50 nm YBCO with orthorhombic crystal structure. The ion beam can be tilted by an angle h relative to the sample normal. Then the normal and the beam direction lie in the ``implantation plane''. The ac plane of the YBCO is also normal to the surface, and the angle between the implantation plane and projection plane is /. The ac Fig. 1. A model structure for Monte Carlo simulation. The layered structure is composed of 400 nm Nb mask with 50 nm opening slot in the middle, 50 nm YBCO thin ®lm and LaAlO3 substrate. N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 plane is chosen in this work as the projection plane, with h 15° and / 90°. No divergence of the incident ion beam is assumed. All simulations are carried out at room temperature with 105 trajectories recorded for each simulation normalized to 1016 ions/cm2 implant dose, except those speci®ed otherwise. Self-annealing eect of damage created by irradiation is excluded. 3. Simulation results It is well established that the defect concentration created by a radiation damage process is proportional to its energy deposition, particularly in the low dose range [18]. For superconducting phase transition temperature Tc , to a good approximation, it is this damage level that aects Tc rather than the speci®c ion beam energy or implant dose. A series of YBCO thin ®lms have been subjected to 50 keV proton irradiation with doses from 1015 up to 4 1016 ions/cm2 , and the superconducting phase transition temperature Tc has been determined by standard 4 terminal AC electrical resistance measurements. Energy depositions have been derived from Monte Carlo simulations. A plot of energy deposition against Tc is shown in Fig. 2. It is clear that for an energy deposition less Fig. 2. Correlation between superconducting phase transition temperature Tc and simulated energy deposition by 50 keV proton beam irradiation with various implant doses, for a 50 nm YBCO thin ®lm on LaAlO3 substrate without Nb mask. 981 than 1021 eV/cm3 the superconducting transition temperature Tc will be greater than 80 K, but Tc is sharply suppressed for energy depositions greater than 1021 eV/cm3 . An excellent linear correlation of implant dose and Tc suggests that the variation of self-annealing eect upon the implant dose can be ignored for the doses concerned here. Range calculations using SUSPRE 1 reveal that about 350 nm thick Nb ®lm should be enough to stop a 50 keV proton beam completely. Simulation results from CRYSTAL are consistent with this conclusion. For a 400 nm Nb mask on a 50 nm YBCO layer, all the proton beam has been stopped by Nb mask, Fig. 3(a), and no implant damage can be observed inside the YBCO layer, Fig. 4(a). This has also been con®rmed experimentally. However, gradual opening of a central slot on the Nb mask leads to a signi®cant ``leakage'' of incident beam into the YBCO thin ®lm and LaAlO3 substrate. A striking general feature is that a 400 nm Nb mask seems unable to stop the beam completely, with an extended damaged pro®le underneath the Nb mask being developed, as shown in Figs. 3 and 4. For a central opening width of 5 nm, Figs. 3(b) and 4(b), the lateral distribution of energy deposition greater than 1019 eV/cm3 extends up to 250 nm, the variation in energy deposition along the forward direction of ion beam is also obvious, though the badly damaged central area with signi®cant Tc suppression, that is, with energy deposition greater than 1021 eV/cm3 , as shown in Fig. 4(b), is still con®ned to a small area. Similar features have also been obtained for a model with a 2 nm slot width. A reasonably well de®ned central damaged region can be observed with a central opening width wider than 20 nm, as shown in Fig. 4(c), the dimension of the central region with energy deposition greater than 1021 eV/cm3 is con®ned to a 200 nm region. In contrast to the extended damage underneath the Nb masks in Fig. 4(b) and (c), the extension of damage range into the area 1 SUSPRE is a program based on energy deposition in the surface and is available from R.P. Webb, SCRIBA, SEEITM, University of Surrey, UK. 982 N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 Fig. 3. Simulated net doping distributions (in log scale) in YBCO thin ®lms with various 400 nm Nb mask structures: (a) without central opening; (b) 5 nm central opening; (c) 20 nm central opening; (d) semi-in®nite Nb mask. Fig. 4. Simulated implant damage distributions (in log scale) with various mask structures: (a) without central opening; (b) 5 nm central opening; (c) 20 nm central opening; (d) semi-in®nite Nb mask. Only energy depositions which are greater than 1021 eV/cm3 are presented here. N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 983 Fig. 5. Variations of implant damage distribution upon mask thickness and incident beam energy with 50 nm central slot: (a) 400 nm Nb mask, 50 keV proton beam, and 1016 ions/cm2 proton implant; (b) 1200 nm Nb mask, 50 keV proton beam, and 7:5 1016 ions/cm2 proton implant; (c) 400 nm Nb mask, 30 keV proton beam, and 1:75 1016 ions/cm2 proton implant. underneath a semi-in®nite Nb mask is still there, but is much weaker (<1021 eV/cm3 ) compared to other structures with a central opening slot, indicating an enhanced penetration of proton beam due to the sidewall interactions. In fact, a slot width of 5 nm or even 2 nm is dicult to make in practice with a 400 nm thick Nb mask. The simulation results described above also show that such a narrow slot has no advantage in achieving a well de®ned narrow and homogeneous damaged region. We now consider at a simple but dierent approach to reduce the extended damage by increasing the Nb mask thickness with a standard 50 nm central opening slot. The simulation results are shown in Fig. 5. As expected, the lateral beam damaged area decreases as the Nb mask thickness increases. As far as the proton beam implant eect is concerned, a minimum 1200 nm Nb mask layer seems necessary to stop nearly all the proton implant inside the Nb mask layers, Fig. 5(b). It is interesting to point out here that roughening of the Nb mask slot sides helps to stop the implant ions a little bit more eectively, obviously due to the eective damping of sidewall interaction cascade. So the simulation with smooth surfaces gives an upper limit to the implant damage spreading process. It is also easy to understand that the damage level is lower in the YBCO target with a thick Nb mask, as more proton ions have been stopped by the mask. Ignoring the self-annealing process, the reduction in damage level can be easily compensated by increasing the implant dose. In fact the nominal dose used for Fig. 5(b) is 7.5 times higher than that for the structure with only 400 nm Nb mask, Fig. 5(a), in order to give a comparable damage level in the central area con®ned by the mask opening width. Reduction in beam energy can also help to stop the beam penetration, and also to reduce the range of damage spreading. The results for a standard 400 nm Nb mask with 50 nm opening are shown in Fig. 5 with incident beam energies of 30 keV (Fig. 5(c)) and 50 keV (Fig. 5(a)). To compensate the small reduction in damage level just inside the central slot de®ned area with decrease in incident beam energy, the normalized implant dose has been increased by a factor of 1.75 for the 30 keV case compared to 50 keV implant. It is clear that 984 N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 the dimension of the central region with energy deposition higher than 1021 eV/cm3 has been decreased signi®cantly from about 250 nm for 50 keV down to about 200 nm for 30 keV beam irradiation. 4. Discussion and conclusions The damage pro®les of energetic ion irradiation under varied mask structures have been studied before both experimentally and theoretically for semiconducting materials [19±21]. It is obvious that the contribution of mask structure is getting more important as the size of mask structure goes down to the nanometre scale. We carried out Monte Carlo simulation study on the sidewall interaction process, using superconducting YBCO thin ®lm covered with varied Nb masks as an example, but the physics clearly applies to other material systems. Simulation results described above establish clearly that sidewall interaction for high aspect ratio mask structure is signi®cant. This interaction is intrinsic for the structure model discussed here, and its contribution towards the damage and dopant distributions can be modi®ed with changing initial incident beam energy, aspect ratio and surface ®nishing of the mask structure. Previous studies on the eect of mask edges is more or less similar to the semi-in®nite mask structure described above. It is natural to anticipate that such a eect will be less important as the width of opening goes up, i.e., the aspect ratio goes down. Similar interaction should be expected for other systems, as the eect is basically dominated by the geometrical factor of the mask structure. The main consequence of this sidewall eect is that the lateral damage range in the target material underneath the mask structure is far larger than the masked area. Provided the beam energy is high and target ®lm thickness is not very thick, the most prominent eect of sidewall interaction will be the inhomogeneous distribution of both damage level and net doping concentration along the lateral direction. This may be a serious problem for nanometer scale electronics device fabrication where homogeneous distribution of doping is important. However, for YBCO sample considered here, the entire damaged YBCO track can be better described as a series of stripes with varied superconducting transition temperatures; it is still likely to form a well de®ned central damaged area with suppressed superconducting transition temperatures or non-superconducting at all, and thus leave a narrow working temperature and normal state resistance window for the formation of Josephson weak links. This has been con®rmed by our in-situ implant experiments, which with the detailed description of Josephson junction fabrication and characterization, have been reported elsewhere [22]. Simulations of the optimal combinations of beam energy and mask structures are still underway, as well as the incorporation of self-annealing processes at high implant dose ranges. Acknowledgements This work is fully supported by EPSRC research grants, GR/L66199, GR/L65963, GR/ M85210, GR/M84756, and GR/L78512. References [1] J.G. Benorz, K.A. Muller, Z. Phys. B 64 (1986) 189. [2] M.K. Wu, J.R. Ashburn, C.J. Torng, P.H. Hor, R.L. Meng, L. Gao, Z.J. Huang, Y.Q. Wang, C.W. Chu, Phys. Rev. Lett. 58 (1987) 908. [3] D. Dimos, P. Chaudhari, J. Mannhart, F.K. LeGoues, Phys. Rev. B 41 (1990) 4038. [4] J. Gao, Y. Boguslavskij, B.B.G. Klopman, G.J. Gerritsma, H. Rogalla, Appl. Phys. Lett. 59 (1991) 2754. [5] G. Koren, et al., Appl. Phys. Lett. 64 (1994) 247. [6] T. Satoh, J. Fujita, T. Yoshitake, H. Tsuge, Appl. Phys. Lett. 62 (1993) 1685. [7] T.P. Orlando, K.A. Delin, Foundations of Applied Superconductivity, Addison-Wesley, Reading, MA, 1991. [8] N.H. Peng, Ph.D. thesis, University of Cambridge, UK, 1992, and references therein. [9] G.J. Clark, F.K. LeGouse, A.D. Marwick, R.V. Laibowitz, R. Koch, Appl. Phys. Lett. 51 (1987) 1462. [10] R. Barth, A.H. Hamidi, B. Hadam, J. Hollkott, D. Dunkmann, J. Auge, H. Kurz, Microelectron. Eng. 30 (1996) 407. [11] C.H. Chen, I. Jin, S.P. Pai, Z.W. Dong, R.P. Sharma, C.J. Lobb, T. Venkatesan, K. Edinger, J. Orto, J. Melngailis, Z. Zhang, W.K. Chu, J. Vac. Sci. Technol. B 16 (1998) 2898. N. Peng et al. / Nucl. Instr. and Meth. in Phys. Res. B 164±165 (2000) 979±985 [12] W.Y. Liang, J. Yuan, Y. Yan, A.J. Pauza, Mater. Sci. Eng. B 41 (1996) 5. [13] B.A. Davidson, B. Hinaus, M. Rzchowski, K. Siangchaew, M. Libera, J.E. Nordman, IEEE Trans. Appl. Superconductivity 27 (1997) 2518. [14] W.E. Booij, A.J. Pauza, E.J. Tarte, D.F. Moore, M.G. Blamire, Phys. Rev. B 55 (1997) 14600. [15] S. Morohashi, T. Utagawa, Y. Enomoto, IEEE Trans. Appl. Superconductivity 27 (1997) 2522. [16] G.B. Assayag, J. Gierack, S. Flament, C. Dolabdjian, F. Gire, E. Lesquey, C. Gunther, J.F. Hamet, C. Prouteau, D. Robbes, Rev. Sci. Instr. 67 (1996) 446. 985 [17] I. Chakarov, R. Webb, Radiat. E. Def. Solids 33 (1994) 447. [18] B.D. Weaver, E.M. Jackson, G.P. Summers, E.A. Burke, Phys. Rev. B 46 (1992) 1134. [19] M.M. Faye, J. Beauvillain, Ph. Salles, L. Laana, A. Yahia Messaoud, A. Martines, J. Appl. Phys. 72 (1992) 5117. [20] G. Hobler, Nucl. Instr. and Meth. B 96 (1995) 155. [21] V. Privitera, V. Raineri, M. Saggio, F. Priolo, E. Rimini, Nucl. Instr. and Meth. B 96 (1995) 144. [22] W.E. Booji, N.H. Peng, F. Kahlmann, R. Webb, E.J. Tarte, D.F. Moore, C. Jeynes, M.G. Blamire, Proceedings of EUCAS, 1999, Spain.