NJG1684ME2
HIGH POWER SP4T SWITCH GaAs MMIC
I GENERAL DESCRIPTION
The NJG1684ME2 is a GaAs SP4T switch MMIC suitable for
LTE/UMTS/CDMA/GSM applications.
The NJG1684ME2 features very low insertion loss, high isolation
and excellent linearity performance down to 1.8V control voltage at
high frequency up to 2.7GHz. In addition, this switch is able to handle
high power signals.
The NJG1684ME2 has ESD protection devices to achieve excellent
ESD performances. No DC Blocking capacitors are required for all RF
ports unless DC is biased externally. And the ultra small & ultra thin
EQFN12-E2 package is adopted.
I PACKAGE OUTLINE
NJG1684ME2
I APPLICATIONS
LTE, UMTS, CDMA, GSM applications
Post PA Switching, Antenna Switching and Bands Switching applications
General Purpose Switching applications
I FEATURES
G Low voltage logic control
G Low voltage operation
G Low distortion
VCTL(H)=1.8V typ.
VDD=2.7V typ.
IIP3=+70dBm typ. @f=829+849MHz, PIN=24dBm
IIP3=+69dBm typ. @f=1870+1910MHz, PIN=24dBm
2nd harmonics=-80dBc typ. @f=0.9GHz, PIN=35dBm
3rd harmonics=-77dBc typ. @f=0.9GHz, PIN=35dBm
G Low insertion loss
0.25dB typ. @f=0.9GHz, PIN=35dBm, VDD=2.7V
0.30dB typ. @f=1.9GHz, PIN=33dBm, VDD=2.7V
0.35dB typ. @f=2.7GHz, PIN=27dBm, VDD=2.7V
G P-0.1dB
36dBm min.
G Ultra small & ultra thin package
EQFN12-E2 (Package size: 1.8 x 1.8 x 0.397mm)
G RoHS compliant and Halogen Free, MSL1
I PIN CONFIGURATION
(TOP VIEW)
VCT
VCT
6
5
VDD
4
DECODER
3
GND
P4 8
2
P2
P3 9
1
P1
GND
7
10
GND
11
12
PC
GND
Pin connection
1. P1
7. GND
2. P2
8. P4
3. GND
9. P3
4. VDD
10. GND
5. VCTL2
11. PC
6. VCTL1
12. GND
Exposed PAD: GND
I TRUTH TABLE
VCTL1
L
H
L
H
“H”=VCTL(H), “L”=VCTL(L)
VCTL2
L
L
H
H
Path
PC-P1
PC-P2
PC-P3
PC-P4
NOTE: Please note that any information on this catalog will be subject to change.
Ver.2013-12-25
-1-
NJG1684ME2
I ABSOLUTE MAXIMUM RATINGS
Ta=+25°C, Z s=Zl=50ohm
PARAMETER
SYMBOL
CONDITIONS
RATINGS
UNITS
RF Input Power
PIN
VDD =2.7V, VCTL=0/1.8V
37
dBm
Supply Voltage
VDD
VDD terminal
5.0
V
Control Voltage
VCTL
VCTL1, VCTL2 terminal
5.0
V
1200
mW
Four-layer FR4 PCB with through-hole
(101.5x114.5mm), Tj=150°C
Power Dissipation
PD
Operating Temp.
Topr
-40~+85
°C
Storage Temp.
Tstg
-55~+150
°C
I ELECTRICAL CHARACTERISTICS 1 (DC)
(General conditions: Ta=+25°C, Z s=Zl=50ohm, VDD=2.7V, VCTL(H)=1.8V, VCTL(L)=0V, with application circuit)
PARAMETERS
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2.375
2.7
5.0
V
Supply Voltage
VDD
VDD Terminal
Operating Current
IDD
No RF input
-
180
400
µA
Control Voltage (LOW)
VCTL(L)
VCTL1, VCTL2 Terminal
0
-
0.45
V
Control Voltage (HIGH)
VCTL(H)
VCTL1, VCTL2 Terminal
1.35
1.8
5.0
V
-
4
10
µA
Control Current
-2-
ICTL
VCTL(H)=1.8V
NJG1684ME2
I ELECTRICAL CHARACTERISTICS 2 (RF)
(General conditions: Ta=+25°C, Z s=Zl=50ohm, VDD=2.7V, VCTL(H)=1.8V, VCTL(L)=0V, with application circuit)
PARAMETERS
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
Insertion Loss 1
LOSS1
f=0.9GHz, PIN=35dBm
-
0.25
0.40
dB
Insertion Loss 2
LOSS2
f=1.9GHz, PIN=33dBm
-
0.30
0.45
dB
Insertion Loss 3
LOSS3
f=2.7GHz, PIN=27dBm
-
0.35
0.50
dB
Isolation 1
ISL1
f=0.9GHz, PIN=35dBm
30
37
-
dB
Isolation 2
ISL2
f=1.9GHz, PIN=33dBm
25
29
-
dB
Isolation 3
ISL3
f=2.7GHz, PIN=27dBm
22
25
-
dB
Input Power at 0.1dB
Compression Point
P-0.1dB
f=0.9GHz, 1.9GHz, 2.7GHz
36
-
-
dBm
2nd Harmonics 1
2fo(1)
f=0.9GHz, PIN=35dBm
-
-80
-70
dBc
2nd Harmonics 2
2fo(2)
f=1.9GHz, PIN=33dBm
-
-80
-70
dBc
2nd Harmonics 3
2fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
3rd Harmonics 1
3fo(1)
f=0.9GHz, PIN=35dBm
-
-77
-70
dBc
3rd Harmonics 2
3fo(2)
f=1.9GHz, PIN=33dBm
-
-77
-70
dBc
3rd Harmonics 3
3fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
Input 3rd order
intercept point1
IIP3(1)
f=829+849MHz,
PIN=24dBm each *1
+65
+70
-
dBm
Input 3rd order
intercept point2
IIP3(2)
f=1870+1910MHz,
PIN=24dBm each *1
+63
+69
-
dBm
VSWR
VSWR
On-state ports, f=2.7GHz
-
1.2
1.4
TSW
50% VCTL to 10/90% RF
-
1.0
5.0
Switching time
µs
*1: IIP3 are defined by the following equations.
IIP3=(3 x Pout-IM3)/2+LOSS
-3-
NJG1684ME2
I TERMINAL INFORMATION
No.
SYMBOL
1
P1
RF transmitting/receiving port.
2
P2
RF transmitting/receiving port.
3
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
4
VDD
Positive voltage supply terminal. The positive voltage (+2.375~+5V) has to
be supplied. Please connect a bypass capacitor with GND terminal for
excellent RF performance.
5
VCTL2
Control signal input terminal. This terminal is set to High-Level
(+1.35~+5.0V) or Low-Level (0~+0.45V).
6
VCTL1
Control signal input terminal. This terminal is set to High-Level
(+1.35~+5.0V) or Low-Level (0~+0.45V).
7
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
8
P4
RF transmitting/receiving port.
9
P3
RF transmitting/receiving port.
10
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
11
PC
RF transmitting/receiving port. Please connect an inductor with GND
terminal for ESD protection.
12
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
Exposed
Pad
GND
Ground terminal.
-4-
DESCRIPTION
NJG1684ME2
I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded)
Loss, ISL vs Frequency
Loss, ISL vs Frequency
(PC-P1 ON, V =2.7V)
DD
0.0
-0.2
-5
-0.2
-0.4
-10
-0.4
-0.6
-15
-0.6
-15
-0.8
-20
-0.8
-20
-1.0
-25
-1.0
-25
-1.2
-30
-1.2
-30
-1.4
-35
-1.4
-35
-1.6
-40
-1.6
-40
-1.8
-45
PC-P2 ISL
PC-P3 ISL
PC-P4 ISL
-2.2
-2.4
0.0
0.5
1.0
1.5
2.0
-2.0
-55
-2.2
PC-P1 ISL
PC-P3 ISL
PC-P4 ISL
-2.4
0.0
0.5
1.0
Frequency (GHz)
2.5
-55
-60
3.0
(PC-P4 ON, V =2.7V)
DD
-0.2
0
0.0
-5
-0.2
DD
0
-5
-0.6
-15
-0.8
-20
-0.8
-20
-1.0
-25
-1.0
-25
-1.2
-30
-1.2
-30
-1.4
-35
-1.4
-35
-1.6
-40
-1.6
-40
-1.8
-45
PC-P1 ISL
PC-P2 ISL
PC-P4 ISL
-2.0
-2.2
-2.4
0.0
0.5
1.0
1.5
2.0
-2.0
-55
-2.2
-10
PC-P4 LOSS
-1.8
-50
-60
3.0
2.5
Insertion Loss (dB)
-0.4
-15
PC-P3 LOSS
Isolation (dB)
-10
-0.6
PC-P1 ISL
PC-P2 ISL
PC-P3 ISL
-2.4
0.0
0.5
1.0
Frequency (GHz)
1.5
2.0
2.5
-45
-50
-55
-60
3.0
Frequency (GHz)
Switching Time
VSWR vs Frequency
(V =2.7V)
(PC-P1/P2, V =2.7V, VCTL1=0/1.8V, VCTL2=0V)
DD
DD
2.0
VCTL1
1.8
Voltage (arb. unit)
PC-P1 ON
PC-P2 ON
PC-P3 ON
PC-P4 ON
1.9
VSWR :PC Port
Insertion Loss (dB)
2.0
-50
Loss, ISL vs Frequency
(PC-P3 ON, V =2.7V)
-0.4
1.5
-45
Frequency (GHz)
Loss, ISL vs Frequency
0.0
-10
PC-P2 LOSS
-1.8
-50
-60
3.0
2.5
-5
Isolation (dB)
-2.0
0
Isolation (dB)
PC-P1 LOSS
Insertion Loss (dB)
0
Isolation (dB)
Insertion Loss (dB)
(PC-P2 ON, V =2.7V)
DD
0.0
1.7
1.6
1.5
1.4
1.3
0.60us
0.96µ
µs
P1
1.2
1.1
1.0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
2.5
3.0
Time (1us/div)
-5-
NJG1684ME2
I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded)
Loss, ISL vs Input Power
vs Input Power
(P1-PC ON, f=0.9GHz)
(P1-PC ON, f=0.9GHz)
38
450
Output Power (dBm)
DDDD
34
V VDD=2.7V
=2.7V
32
V DD=5.0V
350
DD
=3.5V
V VDD=3.5V
DD
V
=5.0V
300
DD
30
250
28
200
26
150
24
100
22
50
20
Insertion Loss (dB)
400
DD
=2.375V
Operation Current I
DD
V
V VDD=2.5V
=2.5V
(µ
µ A)
V =2.375V
36
22
24
26
28
30
32
34
36
0
-0.2
-5
-0.4
-10
V =2.375V
-0.6
DD
-0.8
DD
DD
DD
DD
-1.0
VV =5.0V
=3.5V
-25
-1.2
V =5.0V
-30
DD
DD
DD
-1.4
-35
-1.6
-40
-1.8
-45
-50
20
38
22
24
26
vs Input Power
DD
DD
V =3.5V
V
DD =2.7V
350
V DD
=5.0V
VDD =3.5V
DD
300
V =5.0V
DD
30
250
28
200
26
150
24
100
22
Insertion Loss (dB)
DD
DD
400
V DD
=2.5V
V
=2.5V
V =2.7V
Operation Current I
V =2.375V
(µ
µ A)
VDD=2.375V
Output Power (dBm)
32
34
36
38
(P1-PC ON, f=1.9GHz)
450
32
30
Loss, ISL vs Input Power
(P1-PC ON, f=1.9GHz)
34
28
Input Power (dBm)
38
36
-20
DD
DD
V =2.7V
VV =3.5V
=2.7V
Input Power (dBm)
Output Power, I
-15
VDD
=2.375V
VV =2.5V
=2.5V
-2.0
0
20
0.0
PC-P2 Isolation (dB)
DD
0.0
0
-0.2
-5
-0.4
-10
-0.6
-15
-0.8
-20
-1.0
-25
-1.2
-30
-1.4
-35
=2.375V
V V =2.375V
-1.6
DD
DD
V =5.0V
DD
DD
-1.8
DD
-40
DD
V =2.5V
DD
V =2.7V
V =2.5V
50
V =3.5V
V =3.5V
DD
PC-P2 Isolation (dB)
Output Power, I
V =5.0V
-45
V =2.7V
DD
DD
20
-2.0
0
22
24
26
28
30
32
34
36
-50
20
38
22
24
26
DD
vs Input Power
DD
Output Power (dBm)
DD
V
=2.7V
V =5.0V
350
32
V =3.5V
300
V =3.5V
DD
DD
DD
DD
V =5.0V
DD
250
28
200
26
150
24
100
22
20
22
24
26
28
30
32
34
Input Power (dBm)
-6-
36
38
Insertion Loss (dB)
V
=2.5V
V =2.7V
34
(µ
µ A)
DD
DD
400
DD
V DD
=2.5V
Operation Current I
V =2.375V
V
=2.375V
20
34
36
38
(P1-PC ON, f=2.7GHz)
450
30
32
Loss, ISL vs Input Power
(P1-PC ON, f=2.7GHz)
38
36
30
Input Power (dBm)
Input Power (dBm)
Output Power, I
28
0.0
0
-0.2
-5
-0.4
-10
-0.6
-15
-0.8
-20
-1.0
-25
-1.2
-30
V =2.375V
DD
VV =2.375V
=2.5V
-1.4
-35
DD
DD
VV =2.5V
=2.7V
DD
VDD
=2.7V
-1.6
-40
DD
VV =3.5V
=3.5V
DD
DD
50
-1.8
0
-2.0
-45
V =5.0V
V =5.0V
DD
DD
-50
20
22
24
26
28
30
32
34
Input Power (dBm)
36
38
PC-P2 Isolation (dB)
20
NJG1684ME2
I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded)
Loss, ISL vs Temperature
Loss, ISL vs Temperature
(f=1.9GHz, P =33dBm, PC-P1 ON)
IN
-0.2
-5
-0.2
-5
-0.4
-10
-0.4
-10
-0.6
-15
-0.8
-20
-1.0
-25
-1.2
-30
-0.6
-15
V =2.375V
DD
V =2.375V
V
=2.5V
-0.8
-20
DD
V DD
=2.5V
V
=2.7V
V =2.7V
DD
DD
DD
-1.0
V
=3.5V
V =5.0V
-25
V =5.0V
-30
V =3.5V
DD
DD
DD
-1.2
DD
-1.4
-35
-1.6
-40
Insertion Loss (dB)
0.0
PC-P2 Isolation (dB)
Insertion Loss (dB)
IN
0
0.0
-1.4
-35
V =2.375V
-1.6
V =3.5V
DD
V =2.375V
DD
DD
=2.5V
V V=2.5V
-2.0
-50
0
50
-2.0
-50
50
-50
100
o
Ambient Temperature ( C)
VSWR vs Temperature
(f=2.7GHz, P =27dBm, PC-P1 ON)
-0.2
-45
0
Loss, ISL vs Temperature
IN
DD
V =2.7V
Ambient Temperature ( C)
0.0
DD
DD
DD
-50
100
o
V =5.0V
V =5.0V
V =2.7V
-1.8
-45
-40
DD
V =3.5V
DDDD
-1.8
0
PC-P2 Isolation (dB)
(f=0.9GHz, P =35dBm, PC-P1 ON)
(f=2.7GHz, P1-PC ON)
0
2.0
-5
1.9
V =2.375V
DD
-10
-0.6
-15
-0.8
-20
-1.0
-25
-1.2
-30
V =2.375V
DD
-1.4
-1.6
V V =2.5V
=2.375V
-35
DDDD
=2.5V
V V =2.7V
DD
-40
DD
V =2.7V
V V =3.5V
=3.5V
V =2.7V
DD
V =3.5V
1.7
DD
V =5.0V
DD
1.6
1.5
1.4
1.3
1.2
DD
DDDD
-1.8
DD
1.8
VSWR:PC Port
-0.4
PC-P2 Isolation (dB)
Insertion Loss (dB)
V =2.5V
1.1
-45
=5.0V
V V =5.0V
DD
DD
-2.0
-50
0
1.0
-50
-50
100
50
I ,I
DD
CTL
(P2-PC ON, V
300
(PC-P1, VCTL1=H/L, VCTL2=L)
=1.8V, No RF signal input)
3.0
12
VV =2.375V
=2.375V
8
V =5.0V
DD
150
6
100
I
CTL
50
4
2
2.5
Switching Time (µ
µ s)
DD
(µ
µ A)
DD
V =3.5V
CTL
10
DD
Control Current I
(µ
µ A)
V =2.5V
V =2.5V
V =2.7V
DD
Operationg Current I
DD
DD
DD
200
100
Switching Time vs Temperature
V =2.375V
250
50
Ambient Temperature ( C)
vs Temperature
CTL(H)
0
o
o
Ambient Temperature ( C)
VV =2.7V
=2.5V
DD
DD
DD
V =3.5V
V =2.7V
DD
VDD
=5.0V
DD
2.0
V =3.5V
DD
V =5.0V
DD
1.5
rise
1.0
0.5
fall
0
-50
0
0
100
50
o
Ambient Temperature ( C)
0.0
-50
0
50
100
o
Ambient Temperature ( C)
-7-
NJG1684ME2
I APPLICATION CIRCUIT
(TOP VIEW)
C1
VCTL1 VCTL2
VDD
6
8
P3
9
4
DECODER
7
P4
5
3
2
P2
1
P1
C1
10
11
12
L1
PC
PRECAUTIONS
[1] The Inductor L1 is required for enhancing ESD protection level.
[2] All RF terminals are biased DC GND level.
[3] No DC block capacitors are required for RF ports unless DC is biased externally.
I PARTS LIST
-8-
No.
Parameters
C1
1000pF
L1
68nH
Note
MURATA (GRM15)
TAIYO-YUDEN (HK1005)
NJG1684ME2
I PCB LAYOUT
(TOP VIEW)
GND
VCTL2
GND
VCTL1 VDD
P2
P4
PCB:
Capacitor Size:
Strip Line Width:
PCB Size:
FR-4, t=0.2mm
1005
0.4mm
26 x 26mm
C1
Losses of PCB and connectors, Ta=+25°C
P1
P3
1pin mark
Frequency (GHz)
Loss (dB)
0.9
0.27
1.9
0.50
2.7
0.61
PC
<PCB LAYOUT GUIDELINE>
(TOP VEIW)
PCB
PKG Terminal
PKG Outline
GND Via Hole
Diameter: φ= 0.2mm
I PRECAUTIONS
[1] No DC block capacitors are required for RF ports unless DC is biased externally. When the other device is
biased at certain voltage and connected to the NJG1684ME2, a DC block capacitor is required between
the device and the switch IC. This is because the each RF port of NJG1684ME2 is biased at 0 V (GND).
[2] For good RF performance, all GND terminals must be connected to PCB ground plane of substrate, and
via-holes for GND should be placed near the IC.
[3] For good RF performance, through-holes for GND should be placed close to the GND pin 6 and pin 13.
One of the ways to do this is to place a via-hole at the TAB pad under this IC.
-9-
NJG1684ME2
I RECOMMENDED FOOTPRINT PATTERN (EQFN12-E2 PACKAGE Reference)
: Land
: Mask (Open area) *Metal mask thickness : 100um
PKG : 1.8mm x 1.8mm
Pin pitch : 0.4mm
: Resist(Open area)
Detail A
- 10 -
NJG1684ME2
I PACKAGE OUTLINE (EQFN12-E2)
Terminal Treat
Board
Molding Material
Weight
: SnBi
: Copper
: Epoxy resin
: 3.7mg
Unit
: mm
Exposed PAD
Ground connection is required.
Cautions on using this product
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
• Do NOT eat or put into mouth.
• Do NOT dispose in fire or break up this product.
• Do NOT chemically make gas or powder with this product.
• To waste this product, please obey the relating law of your country.
[CAUTION]
The specifications on this databook are only
given for information, without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle
with care to avoid these damages.
- 11 -