Curriculum vitae
NAVDEEP SINGH DHILLON, PH.D.
77 Massachusetts Ave, 35-134, Cambridge, MA 02139 | (510) 229-7819 | ndhillon@mit.edu
67 Grove Street, Apt 34, Arlington, MA 02474 | dr.ndhillon@gmail.com
EDUCATION
Ph.D. in Mechanical Engineering
2012
University of California, Berkeley
Areas: Heat transfer, Fluid mechanics, MEMS & Nano, Minor in Physics
Dissertation Title: “Micro-Columnated Loop Heat Pipe: The Future of Electronic Substrates”
M.S. in Electrical Engineering & Computer Sciences
University of California, Berkeley
Thesis: “Coherent Porous Silicon Wick for a MEMS Loop Heat Pipe”
2012
M.S. in Mechanical Engineering
2006
Purdue University, West Lafayette, IN
Thesis: “Coupled Electro-Thermal-Phase Change Modeling of a Chalcogenide Switch”
B.Tech. in Ocean Engineering & Naval Architecture
Indian Institute of Technology, Kharagpur, India
2004
PROFES SIONAL APPOINTMENTS
Massachusetts Institute of Technology, Cambridge, MA
Mechanical Engineering
Postdoctoral Research Associate
Shapiro Postdoctoral Fellow
2013 – Present
2012 – 2013
PUB LICATIONS
Refereed Journal Articles
Navdeep S. Dhillon, Jacopo Buongiorno, Kripa K. Varanasi, “Critical heat flux maxima during
boiling crisis on textured surfaces", Nature Communications 6, 8247, September 2015.
Navdeep S. Dhillon, Albert P. Pisano, “Enabling two-phase microfluidic thermal transport
systems using a novel thermal-flux degassing and fluid charging approach", Journal of
Micromechanics and Microengineering, Volume 24, Issue 3, March 2014.
Manuscripts in Submission
Navdeep S. Dhillon, Albert P. Pisano, “Liquid evaporation and meniscus dynamics in a
microscale loop heat pipe”, Submitted to Journal of Applied Physics
Christopher J. Love, Navdeep S. Dhillon, Kripa K. Varanasi, “Laser-textured micro and nano
surface features for boiling heat transfer enhancement”, Submitted to Applied Materials &
Interfaces
NA VDEEP SINGH DHILLON, PH.D.
PA GE 2
Manuscripts in Preparation
Navdeep S. Dhillon, Jacopo Buongiorno, Kripa K. Varanasi, “Effect of texture on growth and
departure of bubbles”, Submitting to Physical Review Letters
Navdeep S. Dhillon, Jacopo Buongiorno, Kripa K. Varanasi, “Effect of surface texture on the
pool boiling heat transfer coefficient”, Submitting to Langmuir
Navdeep S. Dhillon, Albert P. Pisano, “Parasitic heat flow and other thermal considerations in a
microscale loop heat pipe”, Submitting to International Journal of Heat and Mass Transfer
Refereed Conference Papers
Navdeep S. Dhillon, Chris Hogue, Matthew W. Chan, Jim C. Cheng, Albert P. Pisano,
“Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a
Vertically Wicking Micro-Columnated Loop Heat Pipe", Proc. ASME IMECE 2011, Denver,
doi:10.1115/IMECE2011-64676, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano, “Minimizing the Wick Thickness in a
Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design", Proc. ASME
IMECE 2011, Denver, doi:10.1115/IMECE2011-64698, Oral presentation by Navdeep S.
Dhillon.
Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano, “Device Packaging Techniques for
Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar
Microscale Loop Heat Pipe", Proc. ASME IMECE 2011, Denver, doi:10.1115/IMECE201164944, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano, “Heat Transfer Due to Microscale Thin Film
Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro Columnated Wicking Structure", Proc. ASME IMECE 2011, Denver, doi:10.1115/IMECE201165057, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Christopher Hogue, Matthew A. Hopcroft, Albert P. Pisano, “MLHP - A
High Heat Flux Localized Cooling Technology for Electronic Substrates", Proc. ASME IMECE
2008, Boston, doi:10.1115/IMECE2008-66993, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Jayathi Y. Murthy, “Coupled Electro-Thermal-Phase Change Modeling of a
Chalcogenide Switch", Proc. ASME IMECE 2006, Chicago, doi:10.1115/IMECE2006-13950,
Oral presentation by Jayathi Y. Murthy.
Non-refereed Conference Papers
Navdeep S. Dhillon, Matthew W. Chan, Jim C. Cheng, Albert P. Pisano, “Noninvasive Hermetic
Sealing of Degassed Liquid Inside a Microfluidic Device Based on Induction Heating", Proc.
PowerMEMS 2011 Conference, Seoul, South Korea, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Christopher Hogue, Jim C. Cheng, Albert P. Pisano, “Experimental
Investigation of Thin-Film Evaporation in an Open-Loop Columnated Micro-Evaporator", Proc.
PowerMEMS 2011 Conference, Seoul, South Korea, Oral presentation by Navdeep S. Dhillon.
Navdeep S. Dhillon, Christopher Hogue, Matthew A. Hopcroft, Albert P. Pisano, “Geometric
Control of the Fluid-Transport Meniscus in a Passive Phase-Change Microfluidic Electronics
Cooling Device", Proc. PowerMEMS 2011 Conference, Leuven, Belgium, Oral presentation by
Navdeep S. Dhillon.
Patents
NA VDEEP SINGH DHILLON, PH.D.
PA GE 3
Navdeep S. Dhillon, Jacopo Buongiorno, Kripa K. Varanasi, “Surface textures and methods for
enhancing and controlling critical heat flux in boiling on surfaces", Provisional filed on July 01
2015.
AWARDS AND HONORS
Shapiro Postdoctoral Fellowship, Massachusetts Institute of Technology
Best Presentation, Microfluidic 2011 symposium, ASME IMECE
Fellowship, Summer Institute for Preparing Future Faculty, UC Berkeley
Ross Fellowship, Purdue University, West Lafayette
Institute Silver medal, Indian Institute of Technology, Kharagpur
2012
2011
2011
2004
2004
ADDITIONAL CONFERENCE TALKS
“Observation of bubble dynamics and the mechanism of the boiling crisis on textured hydrophilic
surfaces”, InterPACK & ICNMM conference, San Francisco, Jul 2015
“Evaporation and liquid-vapor interface dynamics in an ultra-thin MEMS loop heat pipe”,
InterPACK & ICNMM conference, San Francisco, Jul 2015
“Effect of surface micro-texture on bubble dynamics and boiling critical heat flux”, APS 67th
Annual DFD Meeting, San Francisco, Nov 2014
“Surface wetting and bubble dynamics of dielectric fluids boiling in high electric fields”, APS
67th Annual DFD Meeting, San Francisco, Nov 2014
“An Experimental Study Determining the Effects of Surface Texturing on Different Aspects of
Pool Boiling Heat Transfer”, MRS Fall Meeting & Exhibit, Boston, Dec 2013
TEACHING EXPERIENCE
Recitation Instructor – Massachusetts Institute of Technology
Thermal Fluids Engineering I
Spring 2012, Fall 2012
Graduate Student Instructor – University of California, Berkeley
Electronic Techniques for Engineering
Spring 2010, Summer 2010
Parametric and Optimal Design of MEMS
Spring 2010
Introductory Physics
Summer 2010
Experimentation and Measurement
Fall 2007
Teaching Assistant – Purdue University
Fluid Mechanics
Heat and Mass Transfer
Fall 2004
Spring 2005
RES EARCH EXPERIENCE
Postdoctoral Researcher – Massachusetts Institute of Technology
2012 – Present
Developed micro and nano surface textures for boiling applications using cleanroom
microfabrication and laser rastering techniques.
Executed boiling experiments to investigate critical heat flux (CHF) and heat transfer coefficient
(HTC) enhancement on textured surfaces and formulated predictive theoretical models.
NA VDEEP SINGH DHILLON, PH.D.
PA GE 4
Designed and constructed a sophisticated pool boiling facility for high-speed optical and thermal
visualization of boiling processes.
Graduate Research Assistant – University of California, Berkeley
2006 – 2012
Conceived and constructed microscale loop heat pipes (µLHP) using MEMS microfabrication
techniques for high-heat-flux electronics cooling applications.
Developed a novel degassing technique for µLHP operation and investigated device evaporation
and thermal/flow characteristics using experiments and theoretical/numerical modeling.
Graduate Research Assistant – Purdue University
2004 – 2006
Developed a numerical code to model the coupled heat transfer, charge transport, and phase
change inside a Nanoscale chalcogenide alloy switch for non-volatile memory applications.
S ERVICE TO PROFESSION
Reviewed two articles submitted to the journal Scientific Reports (Oct 2015, Feb 2015)
Reviewed an article submitted to International Journal of Heat and Mass Transfer (Apr 2015)
Reviewed three papers submitted to the InterPACK/ICNMM 2015 conference (Mar 2015)
Reviewed two papers submitted to the ASME IMECE 2011 conference (Nov 2011)
Co-organized the session ‘Embedded cooling for 3D ICs’ (Session 5-8) at the
InterPACK/ICNMM 2015 conference (Jul 2015)
Organized Faculty seminar series at UC Berkeley Mechanical Engineering (Fall 2009)
MEDIA COVERAGE
“Better boiling”, MIT Spotlight, Sep 10, 2015.
“Bubble, bubble … boiling on the double”, MIT News, Sep 8, 2015.
“MIT study heals dangerous hotspots”, The Chemical Engineer, Sep 10, 2015.
“Breakthrough in plant efficiency”, The Engineer, Sep 10, 2015.
“New analysis of textured surfaces to improve safety and efficiency of power plants”, World
Industrial Reporter, Sep 10, 2015.
“Nucléaire : Des chercheurs du MIT réapprennent à faire bouillir de l'eau”, Industrie and
Technologies, Sep 10, 2015.
“Réinventer l’eau bouillante pour améliorer le rendement des centrales électriques”, Lenergeek,
Sep 15, 2015.
RELATED PROFES SIONAL SKILLS
Extensive experience in leading individual and group research projects and writin g funding
proposals and reports:
- Assisted Dr. Kripa K. Varanasi (PI) in writing multiple yearly proposals and project reports
for Chevron Corp. grant titled “Nano-engineered Surface and Coating Technologies for
Enhanced Boiling Heat Transfer in Oil & Gas Operations”, 2013-2014
NA VDEEP SINGH DHILLON, PH.D.
PA GE 5
-
Assisted Dr. Albert P. Pisano (PI) in writing the original grant proposal and yearly project
reports for DARPA grant titled “The MicroColumnated Loop Heat Pipe (mLHP): The future
of electronic substrates”, 2007-2011
Extensive experience and in-depth knowledge of cleanroom microfabrication techniques such as
photolithography, film deposition, etching, packaging, and characterization.
Experienced in building sophisticated experimental setups employing mechanical, electrical, and
instrument control components. Proficient in the use of optical, infrared, and SEM imaging
techniques.
Knowledge and experience in the use of scientific numerical and CFD packages such as Matlab,
Igor Pro, ImageJ, Comsol, OpenFOAM, etc.
LANGUAGES
English
Hindi
Punjabi
German/French
Fluent speaker, Excellent reading and writing skills
Fluent speaker, Good reading and writing skills
Native speaker, Excellent reading and writing skills
Can read with dictionary
MEMB ERS HIPS
American Society of Mechanical Engineers (ASME)
American Physical Society (APS)
Materials Research Society (MRS)
GRADUATE COURS EWORK
Thermal: Advanced Thermodynamics, Intermediate Heat Transfer, Convection of Heat and
Mass, Micro-Nano Scale Energy Transfer Processes, Nano scale Thermal Transport, Heat
Transfer in Electronic Systems, Laser Processing and Diagnostics. Fluids: Introduction to
Continuum Mechanics, Intermediate Fluid Mechanics, Advanced Fluid Mechanics, Microscale
Fluid Mechanics, Numerical Methods in Heat, Mass and Momentum Transfer, Electrodynamics
in Continuous Media. Physics: Advanced Math for Engineers and Physicists, Electromagnetism
and Optics, Statistical Thermal Physics, Solid State Physics, Quantum Mechanics. MEMS/Nano:
Introduction to MEMS, Microfabrication Technology, Introduction to MEMS Design, MicroElectro-Mechanical systems, Introduction to Nano Science and Engineering, Nano Fabrication.
Electronics: Microelectronic Devices and Circuits, Solid State Devices, Charge Transport in
Semiconductors