DDI Technology
PCB Laminate Materials
SMTA-Houston/GC Chapter
9Nov2010
Mark Orzech
morzech@ddiglobal.com
(512) 828-3030
1
DDi Technology
Notice
• Notification of Proprietary Information: This document
contains proprietary information of DDi Corp. and its
receipt or possession does not convey any rights to
reproduce or disclose its contents, or to manufacture,
use, or sell anything it may describe. Reproduction,
dissemination, disclosure, or use, in whole or in part,
without specific written authorization of DDi Corp. is
strictly forbidden. All data contained within this
document are subject to this restriction.
Use or disclosure of information contained on this page is
subject to the restriction on page 2 of this document
2
DDi Technology
Printed Circuit Materials Overview
Overview
What is FR-4 and how is it specified
• Laminate construction
• Basic electrical properties
• Controlled material stack-up
Advanced Materials
• Special purpose & low loss
• Industry specifications
• Relative cost
Hybrid Constructions
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3
DDi Technology
PCB Material Properties
Material properties are playing an increasingly important role in
advanced system designs as speed, power dissipation
and process temperatures increase
Factors that influence
material selection
Electrical Design:
Dielectric constant
Loss tangent
Reliability:
Lead free assembly
Long term life
Thermal Mechanical:
X,Y,Z CTE
Conduction cooling
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4
DDi Technology
What Is “FR-4” , Laminate Composition
Laminate Components
• Copper Foil
• Glass Fibers
• Woven Glass Fabrics
• Resin
C
Resin Stages
A Stage = Liquid Form
B Stage = Partially Cured Resin
C Stage = Fully Cured Resin
A
Glass Fabrics
B
Cu Foil
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DDi Technology
“FR-4” Standard Resin Systems
• Tetrafunctional Resin
• Lead Free Solder Compatible Resins
Tg =130° - 140° C
Tg = 170° - 185° C
εr = 4.4
εr = 4.1 – 4.4
Tan δ = 0.024
Tan δ = 0.015 0.02
• Multifunctional Resin
Td = > 350° C
Tg = 140° to 160° C
CTE (z) = 2.7% - 3.2%
εr = 4.3
Tan δ = 0.022
• High Temperature Multifunctional Resin
Tg 170° - 175° C
Εr = 4.1
Tan δ = 0.019
• Enhanced Multifunctional Resin (Low loss)
Tg 180° - 210° C
εr = 3.7
Tan δ = 0.010
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6
DDi Technology
“FR-4” Standard Resin Systems
Standard and High Performance Epoxy-Glass Laminates
Material
Tg
CTE
T260 T288
X-Y
Z
PPM/C PPM/C
Td
1 Ghz
εr
Tan δ
UL 94
10 Ghz 1 Ghz 10 Ghz
FR-4 and Modified
Isola FR406
Isola IS410
Isola IS415
Isola FR408 HR
170
180
200
200
13
11
13-14
13-14
3.50%
3.50%
2.80%
2.80%
10
60
60
60
>15
>20
30
300
350
370
360
3.95
3.90
3.83
3.69
3.92
3.87
3.8
3.65
0.016
0.018
0.012
0.009
0.017
0.23
0.012
0.0095
V-0
V-0
V-0
V-0
Nelco 4000-6 FC
Nelco 4000-11
Nelco 4000-29
Nelco 4000-13 EP
Nelco 4000-13 EP SI
Isola 370HR
175
175
185
210
210
180
12-15
12-14
15-17
10-14
9-13
13-14
4.10%
3.20%
3.00%
3.40%
3.40%
2.80%
4-8
30
60
30+
30+
60
0
0
15
10+
10+
30
325
345
350
350
350
340
4.10
4.10
4.30
3.70
3.40
4.17
4.0
3.8
4.2
3.6
3.3
3.92
0.023
0.016
0.015
0.009
0.008
0.016
0.022
0.02
0.017
0.008
0.007
0.025
V-0
V-0
V-0
V-0
V-0
V-0
• High Tg multifunctional epoxy
• Lead Free compatible High Tg multifunctional epoxy (Design & Process limited)
• Advanced Lead Free compatible High Tg multifunctional epoxy
• Low Loss High Tg multifunctional epoxy
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DDi Technology
“FR-4” Standard Resin Systems
Standard and High Temperature FR4 Epoxy-Glass Laminates
Material
Tg
CTE
T260 T288
X-Y
Z
PPM/C PPM/C
FR-4
Isola FR406
Isola IS410
Isola IS415
170
180
200
13
11
13-14
3.50%
3.50%
2.80%
10
60
60
Nelco 4000-6 FC
Nelco 4000-11
Nelco 4000-29
Isola 370 HR
ITEQ IT-180
ITEQ IT-158
Nanya NP 170TL
Panasonic R1755V
175
175
185
180
180
155
170
170
12-15
12-14
15-17
13-14
15-17
15-17
15-18
15-17
4.10%
3.20%
3.00%
2.80%
3%
3.3%
3.8
2.80%
Td
1 Ghz
εr
Tan δ
10 Ghz 1 Ghz 10 Ghz
>15
>20
300
350
370
3.95
3.90
3.83
3.92
3.87
3.8
0.016
0.018
0.012
0.017
0.023
0.012
4-8
30
60
60
>60
>60
0
0
15
30
>20
>20
325
345
350
340
350
345
4.0
3.8
4.2
3.92
3.8
3.8
16
350
0.023
0.016
0.015
0.016
0.016
0.016
0.014
0.015
0.022
0.02
0.017
0.025
65
4.10
4.10
4.30
4.17
4.1
4.1
3.9
4.3
4.16
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0.022
8
DDi Technology
“FR-4” Standard Resin Systems
High Performance FR4 Epoxy-Glass Laminates
Material
FR-4
Isola FR408 HR
Nelco 4000-13 EP
Nelco 4000-13 EP SI
Tg
CTE
T260 T288
X-Y
Z
PPM/C PPM/C
1 Ghz
εr
Tan δ
10 Ghz 1 Ghz 10 Ghz
DSC
200
210
210
13-14
10-14
9-13
2.80%
3.40%
3.40%
60
30+
30+
DMA
Panasonic Megtron 6
Td
210
30
10+
10+
360
350
350
3.69
3.70
3.40
3.65
3.6
3.3
2 GHz
>60
3.60
0.009
0.009
0.008
0.0095
0.008
0.007
2 GHz
3.4
0.002
0.004
Megtron 6 - PPE Blend = PolyPhenylene Ether
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9
DDi Technology
“Lead Free” Materials (RoHS Compatible)
Preferred Materials “lead Free” Solder Cycles
(DSC)
Material
Resin System
Nelco N4000-29
Multifunctional
Isola 370 HR
Tg
High Performance Epoxy
(1 GHz)
Dk
Df
185°C
4.3
0.015
180 °C
4.17
0.016
Nelco N4000-11
Multifunctional
175°C
4.1
0.016
Nelco N4000-13EP
Enhanced Epoxy
210°C
3.7
0.009
ITEQ IT-180
Multifunctional Epoxy
180°C
4.3
0.018
Panasonic 1755V
Multifunctional Epoxy
170°C
4.3
0.015
210°C
3.60
0.002
Panasonic Megtron 6
PPE Blend
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10
DDi Technology
Offshore Laminate Compatibility
Proto/Ramp Quantities Can Be Produced By DDi North America
• Range of FR4:
Type
Tg
• IT158
155C
• S1141
140C
• IT180A
175C
• S1000-2
180C
Halogen-Free
• NPG-170TL 170C
• NPGN-150R 140C
Td
Dk
Df
340C
310C
340C
340C
4.1
4.1
4.2
4.0
0.016
0.020
0.018
0.020
4.5
4.2
0.013
0.013
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DDi Technology
• Shengyi Sci.Tech.
– S-1000-2
• Available for lead-free process, meet IPC4101B/126 requirement .
• High Tg180℃(DSC) ,UV Blocking and AOI
compatible.
• High thermal performance,Td≥340℃, T288=20min
T300=7min .
• Low Z-axis CTE from ambient to 260℃.
• Excellent chemical resistance & lower water
absorption.
• Excellent CAF resistance.
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DDi Technology
• ITEQ Corporation
• IT-180
– · Multifunctional
Epoxy Resin
– · Tg ≥ 175℃ (DSC)
– · Low Z-axis Coefficient of Thermal Expansion
– · Excellent Dimensional Stability and Heat
Resistance
– · Low Water Absorption
– · Good Drilling Properties
– · UL 94 V-0
– · AOI and UV Blocking Characteristics
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DDi Technology
Dielectric Properties of “FR-4” Laminate
Controlled dielectric constructions are becoming increasingly important
as circuits push the limits of FR-4 through improved simulation
Factors that influence dielectric
constant and loss tangent:
Epoxy Resin
System
Resin/Glass Ratio
•
•
•
•
•
Glass Fabric
Composition
Signal frequency
Temperature
Moisture content
Glass composition
Ratio of epoxy resin to glass in the construction
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DDi Technology
Dielectric Constant of “FR-4” Laminate
Design Considerations:
• Standard “FR4” epoxy-glass laminates can maintain a dielectric
constant tolerance of less than +/- 0.2 based on a specific laminate
construction and resin content
• Standard tolerance on prepreg resin content is +/- 1.5%
as supplied by vendors, +/- 1.0% can be attained for critical
applications (special order)
• Resin content in prepreg varies for each style of prepreg
• Glass fabric style can have an impact on impedance control as trace
geometries continue to shrink
• Selection of glass styles can impact board warping
• Heavy glass fabric can lead to directional impedance control issues
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15
DDi Technology
Epoxy-Glass Laminate Construction
Copper Foil
Woven glass fabric
High dielectric constant (εr ~ 6)
Epoxy resin
Low dielectric constant (εr ~ 3.5)
• Dielectric constant of the composite
laminate is a function of the resin/glass ratio
• Composite laminates can have many
different resin/glass constructions
PWB Cross-Section
Photo Courtesy of Park Nelco
• Heavy glass fabric can have fiber bundles that
are Larger than the actual copper trace
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DDi Technology
Epoxy-Glass Laminate Construction
Glass Style: 106
Plain Weave
Count: 56x56 (ends/in)
Thickness: 0.0015”
Glass Style: 1080
Plain Weave
Count: 60x47 (ends/in)
Thickness: 0.0025”
Source: Isola
NOTE:
The plain weave yarn consists of yarns interlaced in an
alternating fashion one over and one under every yarn. Use or disclosure of information contained on this page is
subject to the restriction on page 2 of this document
17
DDi Technology
Epoxy-Glass Laminate Construction
Glass Style: 2113
Plain Weave
Count: 60x56 (ends/in)
Thickness: 0.0029”
Glass Style: 2116
Plain Weave
Count: 60x58 (ends/in)
Thickness: 0.0038”
Source: Isola
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DDi Technology
Epoxy-Glass Laminate Construction
Glass Style: 1652
Plain Weave
Count: 52x52 (ends/in)
Thickness: 0.004”
Glass Style: 7628
Plain Weave
Count: 44x32 (ends/in)
Thickness: 0.0068 (in)
Source: Isola
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19
DDi Technology
Epoxy Glass Laminate Properties IS370HR
Dielectric properties based on construction & frequency
Data Source: Isola
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DDi Technology
Dielectric properties & frequency (N4000-13 EP)
Thickness
0.0020
0.0025
0.0030
0.0030
0.0035
0.0035
0.0040
0.0040
0.0042
0.0045
0.0045
0.0047
0.0050
0.0050
0.0050
0.0051
0.0053
0.0055
0.0060
0.0060
0.0060
0.0060
0.0060
0.0070
0.0075
0.0080
0.0080
0.0090
0.0095
0.0100
0.0100
Tolerance
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.0005
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.00075
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
Data Source: Park Nelco
Construction
1x 106
1x 108
1x 2113
1x 1080
2x 106
1x 2113
1x 1080 1x 106
1x 2113
1x 1080 1x 106
2x 1080
1x 1080 1x 106
1x 1080 1x 1080
1x 1080 1x 1080
1x 2116
1x 2113 1x 106
1x 1080 1x 1080
2x 1080
2x 1080
2x 2113
1x 1652
1x 2116 1x 106
1x 1080 1x 2113
1x 106 1x 2116
2x 2113
1x 7628
2x 2116
1x 2116 1x 2113
1x 2116 1x 2116
1x 2116 1x 2116
2x 2116
1x 7628 1x 1080
RC%
68.3
55.2
42.7
61.2
64.6
48.8
56.9
53.8
58.6
51.4
60.8
53.0
55.2
51.0
52.0
55.9
57.2
58.4
42.7
47.5
50.0
51.4
50.0
48.8
41.0
42.3
47.8
47.0
49.1
51.0
44.3
1MHz
3.43
3.77
4.09
3.61
3.52
3.93
3.72
3.80
3.68
3.86
3.62
3.82
3.77
3.87
3.85
3.75
3.72
3.68
4.09
3.96
3.90
3.86
3.90
3.93
4.13
4.10
3.96
3.98
3.92
3.87
4.05
Dielectric Constant
Tol.
1GHz
Tol.
0.14
3.33
0.14
0.16
3.67
0.16
0.16
3.99
0.16
0.12
3.51
0.12
0.10
3.42
0.10
0.13
3.83
0.13
0.10
3.62
0.10
0.10
3.70
0.10
0.09
3.58
0.09
0.10
3.76
0.10
0.08
3.52
0.08
0.09
3.72
0.09
0.12
3.67
0.12
0.13
3.77
0.13
0.13
3.75
0.13
0.12
3.65
0.12
0.11
3.61
0.11
0.10
3.58
0.10
0.12
3.99
0.12
0.11
3.86
0.11
0.11
3.80
0.11
0.11
3.76
0.11
0.11
3.80
0.11
0.13
3.83
0.13
0.13
4.03
0.13
0.12
4.00
0.12
0.11
3.86
0.11
0.10
3.88
0.10
0.10
3.82
0.10
0.09
3.77
0.09
0.10
3.95
0.10
2.5 GHz
3.24
3.57
3.88
3.42
3.33
3.73
3.53
3.61
3.49
3.66
3.43
3.62
3.57
3.67
3.65
3.55
3.52
3.49
3.88
3.76
3.70
3.66
3.70
3.73
3.93
3.89
3.75
3.77
3.72
3.67
3.84
Tol.
0.14
0.15
0.15
0.12
0.09
0.12
0.10
0.10
0.09
0.09
0.08
0.09
0.12
0.13
0.12
0.11
0.11
0.10
0.12
0.11
0.11
0.11
0.11
0.12
0.13
0.12
0.11
0.10
0.09
0.09
0.09
10 GHz
3.21
3.54
3.84
3.39
3.30
3.69
3.49
3.57
3.45
3.63
3.40
3.59
3.54
3.64
3.62
3.52
3.49
3.46
3.84
3.72
3.66
3.63
3.66
3.69
3.89
3.85
3.72
3.74
3.69
3.64
3.80
Tol.
0.14
0.15
0.15
0.11
0.09
0.12
0.09
0.10
0.09
0.09
0.08
0.09
0.12
0.12
0.12
0.11
0.11
0.10
0.12
0.11
0.11
0.10
0.11
0.12
0.13
0.12
0.11
0.10
0.09
0.08
0.09
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21
DDi Technology
Dielectric Properties of “FR-4” Laminate
Frequency dependant properties vary with different resin systems
Dielectric constant with respect to frequency
4.4
4.3
4.2
εr
N4000-6
N4000-11
FR406
370HR
4.1
4
3.9
3.8
3.7
3.6
1 Mhz
1 Ghz
2.5 Ghz
Frequency
Data based on available data for 50% resin content
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22
DDi Technology
Dielectric Properties of “FR-4” Laminate
0.022
Dissipation Factor with
respect to
FR-4
temperature @ 1.0 GHz
0.017
Df
0.012
0.007
0.002
Dielectric Constant
20C
40C
60C
80C
Temperature
4.6
4.5
4.4
4.3
4.2
4.1
4
3.9 FR-406 44.6 % epoxy resin
3.8
0.4
0.6
0.05
0.2
Dielectric Constant with
respect to moisture &
Frequency
0.05% MC
0.45% MC
0.75% MC
0.8
Frequency in
1
1.2
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GHz
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23
DDi Technology
“FR-4” Thickness vs Dielectric Constant
Glass fabric and resin content vary with different laminate constructions
as a result the dielectric constant is a variable that is construction dependant
Based on N4000-6 at 1.0 Ghz
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DDi Technology
Controlled Material Stack-up
• By pre-engineering PCB stack-up’s in
the design phase of a project material
properties and line geometries can be
confirmed
• On critical designs both prepreg plies
and core constructions can be assigned
• Stack-ups should be saved as a control
document
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DDi Technology
Halogen Free/Lead Free Materials
Halogen Free (EU WEEE Directive)
What is a Halogen?
Bromine
What is Halogen Free Material?
Bromine-Free Flame Retardant
Is Halogen Free Material considered Green?
Yes
Lead Free (EU RoHS Directive)
Does NOT contain Lead (also Cadmium, etc)
TBBA (Bromine) as Flame Retardant
Higher Assembly Temp/Dwell for Lead-Free Solders
Laminates need to be more Temperature “Robust”
>345deg C Td
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DDi Technology
Halogen Free & Lead Free Solutions
Halogen Free “FR-4” Solutions (“Green”)
(TMA)
Material
Resin System
Hitachi MCL-BE-67G(H)
Halogen-Free FR4
NAN YA NPG-170TL
Halogen-Free FR4
(1 GHz)
Tg
Dk
Df
150°C
4.4
.010
170°C (DSC)
4.5
.013
(1 MHz)
NAN YA NPGN-150R
Halogen-Free FR4
140°C (TMA)
4.2
.013
Surface Finish = OSP, Immersion Gold, or Immersion Silver
Solder Mask = Taiyo PSR4000 HFX Green (Halogen-Free)
Taiyo PSR4000 HFX Black (Halogen-Free)
Taiyo PSR4000 HFX Blue (Halogen-Free)
Taiyo PSR4000 HFX White (Halogen-Free)
Taiyo PSR4000 HFX Clear (Halogen-Free)
Taiyo PSR4000 HFX Red (Halogen-Free)
Legend = Taiyo PSR4100 WLHD (white)
Enthone 10 Series (105 white)
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DDi Technology
Printed Circuit Materials Overview
Overview
What is FR-4 and how is it specified
• Laminate construction
• Basic electrical properties
• Controlled material stack-up
Advanced Materials
• Special purpose & low loss
• Industry specifications
• Relative cost
Hybrid Constructions
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www.ddiglobal.com
28
DDi Technology
Special Purpose Laminate Materials
Often times unique design requirements dictate the use of special purpose laminate:
Factors:
• Coefficient of thermal expansion
• Moisture absorption
• Operating temperature
• Dielectric constant
• Loss tangent
Polyimide
Isola P96
Nelco N7000-1
BT
Isola G200
Nelco 5000
Hydrocarbon
Ceramics
Rogers 4000 series
Rogers TMM series
PTFE
Rogers 3000 series
Rogers 5000 series
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DDi Technology
Polyimide Laminates
Polyimide resin reinforced with
woven E-glass, Typical properties
• Tg
• Td
• ZCTE
• T260
• T-288
• Dk @ 2.0GHz
• Dk @ 10 GHz
• Df @ 2.0 GHz
• Df @ 10 GHz
• Moisture Abs.
• Max temp
• UL Max temp
260C
382C
1.5%
60 Min.
60 Min.
3.85
3.83
0.018
0.024
0.4%
210C
140C
Applications
• High temperature applications
• IC Burn-in boards
• Engine controls
• Down hole instruments
• Extreme chemical resistance
• Severe assembly applications
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DDi Technology
Bismaleimide-Triazine (BT) Laminates
BT resin reinforced with woven
E-glass, Typical properties
• Tg
• Td
• ZCTE
• T260
• Dk @ 2.0GHz
• Dk @ 10 GHz
• Df @ 2.0 GHz
• Df @ 10 GHz
• Moisture Abs.
• Max temp
• UL Max temp
180C
325C
3.3%
12 Min.
3.70
3.65
0.013
0.015
0.2%
150C
140C
Applications
• Multiple thermal excursions
• Low moisture absorption
• IC substrates
• High voltage applications
• Chemical and thermal resistance
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DDi Technology
Hydrocarbon Ceramic Laminates
Applications
Rogers 4003 4350B: Hydrocarbon resin
with ceramic filler reinforced woven glass
• Precise dielectric constant
• Low loss tangent
• RF Microstrip circuits
• RF Multilayer Stripline
• RF filters and power dividers
Applications
Rogers TMM 3, 6, 10: Hydrocarbon resin
with ceramic filler
• Precise dielectric constant
• Homogeneous dielectric
• Electrical properties stable over temperature
• Low loss tangent
• Microwave Microstrip circuits
• Microwave power circuits
• Microwave filters & power dividers
• Antenna applications
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32
DDi Technology
PTFE Based Laminates
Applications
Rogers 3003, 3006, 3010: PTFE
ceramic filler
• Precise dielectric constant
• Low loss tangent
• Homogeneous dielectric
• Stable mechanical properties
allowing mixed dielectric constants
• Microwave Microstrip circuits
• Microwave Multilayer Stripline
• Microwave filters & power dividers
• Antenna applications
Applications
Rogers 5880: PTFE with glass random glass
• Microwave Microstrip circuits
microfiber reinforcement
• Microwave power circuits
• Precise dielectric constant
• Microwave filters & power dividers
• Very low dielectric constant
• Antenna applications
• Homogeneous dielectric
• Electrical properties stable over temperature
• Low loss tangent into the Ku band
(12 to 18 GHz)
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DDi Technology
Specifying Laminate Materials
There are three methods to specify laminate materials:
Thermal-mechanical
& electrical properties
Dk Df Tg CTE
Issues: Difficult to interpret
and trade-offs are almost
always encountered in
engineering and planning
•IPC 4101 Slash Sheet
•number
/24 /29 /41
Issues: IPC slash numbers
are generic categories and
on critical designs, properties
may vary too much within a
given slash sheet number
Resin brand and
construction
Isola 370HR
Two ply 1080
or equivalent
Issues: The best method to
specify laminates however,
when using multiple vendors
they may not all support the
specific materials
All laminates are not created equal !
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34
DDi Technology
IPC 4101 Slash Sheet Matrix: Isola Materials
Source: Isola
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35
DDi Technology
Advanced Low Loss Dielectric Laminates
Relative Laminate Cost Per Square Foot vs Loss Tangent
Based on 0.020” Laminate
Source: Rogers
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36
DDi Technology
Laminate Cost Factors Based on Resin System
Material Group/ Resin System
Vendor Specific
Estimated Cost Factor
170 Tg FR4 (Baseline sqft. Price)
Nelco N4000-6FC
1
High Tg/Reliability-No Filler
Nelco 4000-11
1
High Tg/Reliability-Filled
Nelco 4000-29, Isola 370 HR
1.1
High Speed/Loss
Nelco 4000-13 EP, Isola FR408 HR
1.8
High Speed/ Very Low Loss
Nelco 4000-13 EP SI
2.6
Polyimide
Nelco N7000-2, Isola P96, Arlon 35N
3.1
High Frequency
Isola IS 680, Arlon 25N
4
Rogers 4350B, RO4003
8.5
Assuming 170 Tg FR4 Resin
15
Rogers 3000 5000 6000 series
20-40
Buried Resistance
Microwave Laminates
Note: Based on average square foot pricing normalized
To 170 Tg FR4
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DDi Technology
Printed Circuit Materials Overview
Overview
What is FR-4 and how is it specified
• Laminate construction
• Basic electrical properties
• Controlled material stack-up
Advanced Materials
• Special purpose & low loss
• Industry specifications
• Relative cost
Hybrid Constructions
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DDi Technology
Mixed Dielectric Substrates
•
Mixed dielectric constructions reduce cost by only using more expensive low loss
materials where needed
•
FR-4 Epoxy-Glass Sub-Cores provide structural support when using PTFE based
laminates
Layer 1
Low loss Dielectric
(4350, 3003 ect.)
Layer 2
FR-4 Prepreg
Layer 3
Layer 4
FR-4 Substrate
(4 Layer)
Layer 5
Layer 6
Typical mixed dielectric construction
with low loss cap layer
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39
DDi Technology
Mixed Dielectric Circuit Constructions
Cross-Section
Mixed Dielectric: Rogers 4350/FR-4
Roger 4350
FR-4
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40
3/8 oz Vcc
3/8 oz Gnd
DDi Technology
.0035” Ref. 370 HR
.0035” Ref. 370 HR
.0045” Ref.
.004” Ref.
.0045” Ref.
.004” Ref.
.0045” Ref.
.004” Ref.
.0045” Ref.
.002” Ref. BC
.0045” Ref.
.004” Ref.
.0045” Ref.
.002” Ref. BC
.0045” Ref.
.004” Ref.
.0045” Ref.
.004” Ref.
.0045” Ref.
.004” Ref.
.0045” Ref.
.0035” Ref. 370 HR
.0035” Ref. 370 HR
3/8 oz Signal
Hybrid HDI
½ oz Signal
½ oz Gnd
½ oz Signal
½ oz Gnd
½ oz Signal
½ oz Gnd
1 oz Vcc
1 oz Gnd
Stacked MicroVias
Layer 1 – 2, 2-3 &
3-4
Layers 24-23, 22-21
& 21-20
.012” pad
.006” laser drill
solid copper plate
½ oz Signal
½ oz Signal
1 oz Gnd
1 oz Vcc
½ oz Gnd
½ oz Signal
½ oz Gnd
½ oz Signal
½ oz Gnd
½ oz Signal
3/8 oz Signal
3/8 oz Vcc
3/8 oz Gnd
Solder Mask
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
Layer 11
Layer 12
Layer 13
Layer 14
Layer 15
Layer 16
Layer 17
Layer 18
Layer 19
Layer 20
Layer 21
Layer 22
Layer 23
Layer 24
Solder Mask
IPC Class 2
Layer 3 - 22 = Buried Vias
.020” pad & .010” drill
Finish Thickness = .120” +/- .012”
Material = N4000-13 EP & Isola 370 HR
Layer 1 - 24 = Through Vias
.024” pad & .012” drill
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41
DDi Technology
Summary
Laminate materials play an important role in PCB performance:
• Laminates consist of a resin system and reinforcement material, depending upon
the laminate they are woven glass, ceramic or glass microfibers
• Dielectric properties are highly dependant on the ratio of resin to the reinforcing
material
• Specialty laminates are often required when thermal-mechanical or high
frequency requirements exceed the properties of standard multifunctional epoxy
based laminates
• Care should be taken when specifying laminate materials so boards can be
produced consistently from lot to lot
• Specialty or “exotic” laminates come at a significant cost premium and hybrid
constructions can offer significant cost reduction
• Engage your FAE/DDi-Asia team when discussions include possible transfer to
offshore partners…many Asian laminates are NOT “drop-in” replacements
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42
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