The Company
CISTELAIER was established in 1998 by merging two Italian companies operating in the
Printed Circuit Boards manufacturing, say:
Cistel, founded in 1976 in Genoa and Laier, founded in 1986 in Modena
Two Business Units: Genoa and Modena, where the Headquarters are located
The overall headcount is 135 people, more than 10% are employed in R&D and
Engineering Dept
On average, the 75% of the current production is made up of medium-high layer
count Multilayers and Rigid-Flex, with several standard and exotic materials
Cistelaier is part of “FinMasi”, a large industrial Italian group with an overall turnover of
270M , operating in different sectors, among the others:
Steel: first and secondary services
Electronics: PCBs; industrial sensors (standard and on demand)
Our Mission
Offering our service flexibility and engineering capability
Sharing our know-how in technology and manufacturing, as we
recognize the PCB as a strategic electronic component becoming
more and more an active and integrated element
Continually investing resources to assure the Customer the state of art
technology
Supporting our Customer with CO-DESIGN projects, to help him
manage the ever increasing complexity of electronic devices
Quality System Management
Cistelaier quality system is ISO 9001 recognised
Since 1998 Cistelaier has been recognized from Underwriters Laboratories with the UL94V-0 certification
and UL796 DSR extension for rigid boards (file number E73444)
UL 94V-0 for rigid-flex approval within December 2009.
Other standards which Cistelaier complies with:
MIL-P-55110 and MIL-P- 50884 (military standard for rigid and rigid-flex boards)
IPC 6012, IPC 6013, etc
All printed circuit boards are produced in compliance with IPC A600G standards, Class 2 or 3 according to
customer’s specifications. Additionally, Cistelaier is implementing a new “Integrated Quality Management
System” including four different standards, within July 2010:
•
Automotive: ISO/TS16949:2008
•
Railway: IRIS–International Railway Industry Standard
•
Aerospace: UNI EN 9100: 2008
•
Medical devices: UNI EN ISO 13485: 2004
Besides, Cistelaier plans to get NadCap accreditation by May 2011.
Product Portfolio
Cistelaier can offer the customer a broad portfolio of PCBs, manufactured with
either standard FR4 or high-tech materials (i.e. Polyimide, Teflon, Kapton,
Thermount, Rogers):
Rigid Multi-Layer boards and Rigid-Flex Multi-Layers with:
controlled impedance and press-fit holes
mixed materials (i.e. Thermount/Rogers/HTg FR4)
HDI technology (Blind/Buried Vias)
SBU technology (up to 3N3 type)
Heat Sink (internal and external)
32 layers (up to 40)
Special types:
Thick copper technology (up to 500 micron)
Double copper thickness on the same inner laminate
Aluminium-backed boards: SS, DS and Multilayer
Wide range of Base Materials for PCB
up to 1 metre long (rigid and rigid-flex)
From standard FR4 to some materials especially designed for High Speed and HDI:
•
FR4 standard ITEQ IT140; ISOLA Duraver ML104i - Tg 140 ˚C
•
High Tg epoxy (with and withour filler): ITEQ IT180; ISOLA IS420; ARLON 45N - Tg 180 ˚C
•
Epoxy for Lead-free process: ITEQ IT158; ISOLA DE104I - Tg 160 ˚C
•
High speed digital applications 10 GHz: ISOLA IS620; NELCO N4000-13; ITEQ IT200DK
•
Resin coated copper foil “RCC B-stage” Polyclad PCL-CF-400
•
BT resin – ISOLA
•
Gould TCR adn Shipley INSITE – Embedded resistor
•
3M Capacitor Laminates
High-performances materials for avionics/military application:
•
Polyimide Resin System: Arlon 33N, 35N, 85N; Hitachi MCL-I-671; Arlon EP; Arlon Kevlar 45NK (Tg 170 °C and 4.7 ppm/°C)
•
Epoxy and Polyimide Thermount®: ARLON 55NT/85RT. Arlon New Thermount 85XT
•
Copper/Invar/Copper : tipically 150 m thick - 17/120/17 m)
•
Thick copper: up to 500 microns, for BusBar application also
Substrates in Kapton for flexible circuits:
•
Flexible Laminates- Kapton®: DuPont PYRALUX LF; PYRALUX FR; PYRALUX AP: Pyralux APR ( for embedded componenst)
High Frequency materials Teflon® based and non-Teflon based:
•
Rogers: Duroid Copper/Brass supported; RO3003
•
Arlon: AR350; AR600; AR1000; DiClad 527
•
Rogers: RO4350; RO4003;TMM10
•
Arlon: 25N; 25FR
•
Taconic: RF25A2; TACLAM
•
Specialty materials for microwave applications: GORE Microlam and Speedboard
HDI PCB
“High Density Interconnect”
Characterization
Design Approach
Capability
Build up
Vias Formation
“High Density Interconnect”
Printed Circuit Board
HDI is used to reduce size and weight, as well as to enhance electrical performances.
High density interconnects (HDI) are defined as substrates or boards with a higher wiring
density per unit area than conventional printed circuit boards (PCB); they have finer lines and
spaces (<100µm), smaller vias (<150µm) and capture pads (<400µm), and higher connection
pad density (>20 pads/cm2) than employed in conventional PCB technology.
In addition to HDI, terms such as "build-up board" in Japan and "sequential build-up (SBU)"
or "microvia technology" in the U.S. can be used interchangeably
How to approach
“HDI Printed Circuit Board”?
Cistelaier Co-Design and DFM Validation …..
Co-Design and DFM analysis in the early stages of PCB design in order to check the manufacturability aspects of
the design
•
DFM validation is part of every PCB layout process and ensures that the designs will smoothly pass PCB
manufacturing, assembly and testing (boundary scan technology)
•
The design validation includes: checks on tracks/spacings, unterminated traces, copper features, route cleanup,
fiducials, drill features, soldermask/solderpaste openings, impedance/stack requirements and many other
constraints which influence manufacturability.
•
….. Cistelaier R&D Vision: providing best
technology for future interconnection needs!
Cistelaier Research & Development is the driving force to identify new technology options and create new
interconnection solutions.
We do this by continuously scanning and developing potential novel technologies, and monitoring closely the
application scenarios offered by the advancements in avionics/military, telecom, automotive and other business
sectors.
Our goal is to provide insight into new technologies, reduce the cycle time to introduction of new technologies into the
production and thereby enable the continued support of our customers.
Wide range of Base Materials for PCB
up to 1 metre long (rigid and rigid-flex)
From the standard FR4 to some High Speed Digital and HDI special designed:
•
FR4 standard ITEQ IT140; ISOLA Duraver ML104i - Tg 140 ˚C
•
High Tg epoxy (with and withour filler): ITEQ IT180; ISOLA IS420; ARLON 45N - Tg 180 ˚C
•
Epoxy for Lead-free process: ITEQ IT158; ISOLA DE104I - Tg 160 ˚C
•
High speed digital applications 10 GHz: ISOLA IS620; NELCO N4000-13; ITEQ IT200DK
•
Resin coated copper foil “RCC B-stage” Polyclad PCL-CF-400
•
BT resin – ISOLA
•
Gould TCR adn Shipley INSITE – Embedded resistor
•
3M Capacitor Laminates
High-performances materials for avionic/military application:
•
Polyimide Resin System: Arlon 33N, 35N, 85N; Hitachi MCL-I-671; Arlon EP; Arlon Kevlar 45NK (Tg 170 °C and 4.7 ppm/°C)
•
Epoxy and Polyimide Thermount®: ARLON 55NT/85RT. Arlon New Thermount 85XT
•
Copper/Invar/Copper : tipically 150 m thick - 17/120/17 m)
•
Thick copper: up to 500 microns, for BusBar application also
Substrates covering Kapton for flexible circuits:
•
Flexible Laminates- Kapton®: DuPont PYRALUX LF; PYRALUX FR; PYRALUX AP: Pyralux APR ( for embedded componenst)
High Frequency materials Teflon® based and non-Teflon based:
•
Rogers: Duroid Copper/Brass supported; RO3003
•
Arlon: AR350; AR600; AR1000; DiClad 527
•
Rogers: RO4350; RO4003;TMM10
•
Arlon: 25N; 25FR
•
Taconic: RF25A2; TACLAM
•
Specialty materials for microwave applications: GORE Microlam and Speedboard
Technical Capability
Cistelaier spa
UNITS = m
Standard
Track & Gap
Ring Rigid pcb
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Ring ML Flex & Flex-Rigid Flex layers ( for rest = 0 ) should be 50 m bigger then on rigid layers
IAR+75
IAR+50
250
70
80
IAR+75
IAR+50
200
50
75
125
110
1
IAR+75
IAR+50
200
40
75
60
100
10
12
10
16
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Enginnering
R&D
Advanced
Classification
9
87
75
100
125
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10
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11
10
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87
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12
60
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87
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125
14
100
16
150
0.5
125
0.55
100
100
200
1
IAR+75
IAR+50
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25
75
60
100
125
0.6
100
0.65
75
75
175
1
IAR+75
IAR+50
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20
60
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90
10
20
10
22
100
0.7
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0.75
60
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150
2
IAR+75
IAR+50
150
20
60
40
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>3.20
8
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0.8
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0.85
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IAR+68
IAR+50
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15
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>3.20
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IAR+60
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Technology Parameters
Symbol
I max
I min
q
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e
s
f
t
h max
Parame te r
M ax thickness
M in t hickness ( kapton adhesivelessfilm)
M in. innerlayer thick ness
M in. insu lat ion th ickness - prepreg
M in. line d imens io n base on 9um CU
M in. line d imens io n base on 17um CU
M in. line d imens io n base on 9um CU
M in. line d imens io n base on 17um CU
M ax. P lated Trough H ole
Value
5.2 mm
0.025 m m
0.05 mm
0.05 mm
75um
75um
75um
75um
unlim ited
Symbo l
h min
b
j/n
m
g/p
c/d
r
z
y
Parame te r
M in. P alted Trough H ole (depend ing “I” Th.ss)
M in. V ias laser
M in. Cop per in the thou gh and burr ied ho le
M in. Cop per in b lind v ias
M inimu m anu lar ring on trough ho le
M inimu m anu lar ring on laservias
M inimu m copper thick ness innerlayer
M inimu m copper thick ness outlayer
M inimu m openin g obn solder mask on v ias
Value
0.10m m
75um
> 20um
> 12um
> +150 um
> +100 um
12um
9um
100u m
Standard Build up
This construction describes an HDI board in which there are both blind vias and through vias used for
interconnection. Type 1 constructions describe the fabrication of a single blind via layer on either one or
both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole
technology. The substrate can have as few as one circuit layer or may be as complex as any number of
inner layers.
Sequential Build up 1+N+1
Type II constructions have the same number of HDI layers as Type I: has two buried vias in the core
substrate formed prior to applying the HDI dielectric layers. Both vias connect layer 2 to layer n-1; the
buried via on the left is filled with HDI dielectric resin: completed filling is guarantee with vacuum press; the
right one is filled with different resin, this operation can be made using resin from Peters or Taiyo. This way
it is possible to laser drill over the pad that is plated and reduce space during the design.
Sequential Build up X+N+X
Type III constructions describe an HDI in which there are plated microvias,
paste/resin filled holes and through vias used for interconnection. Type III
constructions are distinguished by having at least two microvia layers on at
least one side of a substrate core. The sub-strate core is usually
manufactured using conventional PCB techniques, may be rigid or flexible,
and have as few as one or as many as any number of layers with buried vias.
Other Build-up options for HDI!
Examples of multilayers with double construction for Avionic application on EFA Project.
Multilayer board with double blind vias, 20 layer:
• Lay up board with 4 Copper/Invar/copper layer;
• 2 stack up board with capped vias on both side;
• Polyimide construction for avionic application;
ultilayer board 12 layer, High TG material :
2 stack up board with capped vias on one side;
Drilled blind vias;
Iteq IT180 construction for Military application;
Multilayer board with double blind vias, 22 layer:
• 2 stack up board with capped vias on both side;
• all Nelco N4000-13 construction for Telecom application;
Microvias: different technologies with advantages
and disadvantages
µ
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$ µ
Nelco N4000-13
ITEQ IT180
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Copper filling, do you really need it?
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Blind µVias laser 100µm on High TG
Material, copper filled: SBU 3+N+3
Stacked Blind µVias laser 75µm
on RCC Foil, copper filled
Blind µVias laser 100µm on
High TG 75µm, copper filled
……. Some solutions from our R&D
department!
.
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….. playing around a hole!
Sequential build-up 4 layer Rigid Flex:
Laser vias from layer 1 to layer 2: 75µm;
Laser vias from layer 1 to layer 3: 125µm;
Insulation Layer: Rigid 60um-Kapton 75µm;
Sequential build-up 2+n+2; Laser vias
from layer 1 to layer 3:125µm;
Insulation layers 2x60µm;
Sequential build-up 14 layer Rigid Flex:
Blind Vias mechanically made on mixed Layup
Boards: Ro4350+High TG material
1 µ
/
4
Some technology snapshots…..
Sequential build-up 3+n+3;
Laser via 75µm; Insulation layers 50 µm
Multilayer all with Rogers 4350 and High TG materials;
16 layer for High speed board with blind viad filled with
prepreg resin: reverse Layup all with inner layer
Multilayer 8 layer: Arlon 35N+CIC+RO4003
Sequential build-up with burried and blind vias and cavityFor
package heat dissipation
Burried vias filled with resin
….. And different thermal dissipation
pad design!
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“High Density Interconnect”
Printed Circuit Board
Flex and Rigid Flex
examples of HDI application
Flex and Rigid Flex HDI application
Why Flex and Flex-Rigid Technology?
Flex& Flex-Rigid PCB’s have been widely used in a variety of applications and markets for many years where space
and size is critical to its function as an interconnect either between connectors or to other rigid PCB’s.
At Cistelaier, we are seeing more and more customers migrate to Flex& Flex-Rigids due to the benefits of its
construction also on commercial use, some examples as follows:
• 3D Interconnect
• 1 part component (as apposed to multiple rigid PCB’s and wiring looms)
• Increased reliability - Space saver
• Reduced labour costs at assembling - Fully tested as one pc component - 1 part inventory
Product realisation utilises the same controlled and audited manufacturing processes as used for conventional MultiLayer technologies; Cistelaier have approached technologies manufactured range:
• Very simple double-sided Flex for Commercial applications
• Multi-Layer Flex-Rigids for Formula 1, Military Flight
• Complex Blind and Micro Vias for Medical, Aerospace and Semiconductor applications.
Rigid Flex in HDI application
This Rigid flex, for Semiconductor application, is a 6
layer board with laser via in pad µBGA 0,5 mm
component.
Line 75 µm
Space 75 µm
Laser Vias 100 µm
kapton Ap8525
High TG material. TG 180°
Rigid Flex in HDI application
This Rigid flex, for Medical application, is a 6 layer board with
double sequenze of laser via and buried vias on flex material:
Line 75 µm
Space 75 µm
Laser Vias 100 µm
kapton Ap8525-17Cu/50K/17Cu
High TG material. TG 180°
This Rigid flex, for Motorsport application, is a 8 layer
board with laser via
and buried vias:
Line 75 µm
Space 75 µm
Laser Vias 100 µm
2 x kapton Ap8525-17Cu/50K/17Cu
Polyimmide base material TG 250°
Rigid Flex in HDI application…
….not a synonym of small!
This Rigid flex is a 9 layer board with buried and blind vias for Military Radar application; this boards is
long 865mm and has 4 layer on flex material, impedance line with 10% of tolerance; there is also an
integrated 500µm Copper BusBar for power distribution.
Only copper lines come out from pcb border for a
direct connection and soldering.
Rigid Flex in HDI application…
….not a synonym of small!
Main Characteristics:
9 Layer Rigid Flex
Kapton Adhesiveless+ High TG Laminates;
Burried vias 150µm on inner layer;
Blind Vias on BusBar 200oµm;
Impedance controlled track: 6 Mils;
Dimension: 865 mm long;
Only copper traces ( BusBar) come out from pcb border
for a direct connection and soldering.
“High Density Interconnect”
Printed Circuit Board
When “power” meets the HDI
concept
High Frequency and High Power
All modern power supply, DCDC converters are now the best
example for HDI application in power modules.
To maximize the power fully buried vias layup is usually used, both
for planar and inductors planar design need, to minimize the space
using via in pad
Multilayer board, 16 layer for DC-DC Converter :
• Heavy copper:3 and 6 Oz;
• High TG material
• Burried vias
Multilayer board, 14 layer for Planar
transformer application :
•2 Heavy copper layer 5 and 6 Oz;
•High TG material
“High Density Interconnect”
Printed Circuit Board
What we see in the near
future…….
Line forming technology and trends
With current Direct Laser Imaging technology, 1
and 2 mils line space are not a limit; the
problem will be the etching, and for this reason
production cycle is going in the direction of
additive process.
We will metallize special base material
uncladded specially designed with a minimum
1-3um of chemical copper, then after imaging ,
we will make plating of 5 – 10um to form the
line.
……for the future!
Our R&D department is hardly working on reduction of line/space and mixed layup structure with
inside low thickness prepreg to minimize aspect ratio for total sequential build up.
Outerlayers
Plated Lines 1.5mils on
Low Dielectric
Thickness 30µm
Outerlayers Plated Lines/Space
40µm
Outerlayers
On Fully SBU
Plated Lines/Space 1.5mils
Component
Footprint 50µm
…….embedded components
+
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Contacts
For any additional needs, please contact us:
Cistelaier S.p.A.
Via Gandhi 1
41100 – Modena – Italy
Tel +39 (0)59 269711
Fax +39 (0)59 250165
Or visit our web site: www.cistelaier.com
Export Sales Manager: Mr Andrea QUEIROLO a.queirolo@cistelaier-prod.com
Italy Sales Manager: Mr Fernando CAVANI f.cavani@cistelaier-prod.com
Product Manager: Mr Luca PAGNANI l.pagnani@cistelaier-prod.com
Area Manager for Germany/Austria: Mr Ernst WINKLER winkler-e@t-online.de
Area Manager for France: M. Michel BUIA buia@wanadoo.fr