NANYA ROAD,MUGANG ZHAOQING
CITY GUANGDONG CHINA.
LEDTECH ELECTRONICS CORP.
TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LT0324-41
3.0mm ROUND LED LAMP
Approved by
Checked by
Prepared by
Tung
Yang
Min Bao
3.0mm ROUND
LED LAMP
LT0324-41
Description
This green lamp is made with GaP/GaP chip and green clear epoxy resin.
4.1
Package Dimensions
A
K
Notes:
1. All dimensions are in mm.
2. Tolerance is±0.25mm unless otherwise noted
Description
LED Chip
Part
No.
LT0324-41
Material
Emitting Color
GaP/GaP
Green
VER.: 01
Lens Color
Green clear
Date: 2007/04/14
Page: 1/5
3.0mm ROUND
LED LAMP
LT0324-41
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
78
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
Reverse (Leakage) Current
Ir
100
μA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-25 to +85
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=20mA
25.0
40.0
Forward Voltage
Vf
If=20mA
2.1
Peak Wavelength
λp
If=20mA
567
nm
Dominant Wavelength
λd
If=20mA
572
nm
Reverse (Leakage) Current
Ir
Vr=5V
2θ1/2
If=20mA
36
deg
∆λ
If=20mA
30
nm
Viewing Angle
Spectrum Line Halfwidth
Max.
Unit
mcd
2.6
50
V
µA
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01
Date: 2007/04/14
Page: 2/5
3.0mm ROUND
LED LAMP
LT0324-41
Typical Electrical / Optical Characteristics Curves :
50
Relative Luminous Intensity
100.0
Forward Current IF(mA)
40
30
20
10
1.2
1.6
2.0
2.4
2.8
80.0
60.0
40.0
20.0
0
3.2
30.0
Forward Current (mA)
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
50
Forward Current IF(mA)
20.0
10.0
0.0
20°
10°
30°
40
40°
30
1.0
50°
0.9
20
60°
0.8
70°
10
80°
90°
0.7
0
20
40
60
Temperature(。C)
80
100
0.5
FORWARD CURRENT VS. AMBIENT TEMPERATURE
0.3
0.1
0.2
0.4
0.6
RADIATION DIAGRAM
VER.: 01
Date: 2007/04/14
Page: 3/5
3.0mm ROUND
LED LAMP
LT0324-41
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Dip soldering :
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3)
Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds.
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2007/04/14
Page: 4/5
3.0mm ROUND
LED LAMP
LT0324-41
ENCASED TYPE
PLASTIC PACKAGE
QUANTITY: 1000 PCS
LEDTECH ELECTRONICS CORP.
PART NO :LTXXXX-XX
Q'TY : PCS
LOT NO :XXXXXXXXX
DATE :
BIN CODE:
LEDTECH ELECTRONICS CORP.
PART NO :LTXXXX-XX
Q'TY
: PCS
LOT NO :XXXXXXXXX
DATE
:
BIN CODE:
INNER BOX
QUANTITY: 20 PACKETS
TOTAL: 20,000 PCS
PART NO.
LXXXXX-XX-XX
LOT NO.
XXXXXXXXXX
C
OQ .XX.XX
XX
XX
L
TA
TO
X
BIN CODE
QUANTITY
Xx X
PCS
Xx X
PCS
Xx X
PCS
Xx X
PCS
TOTAL
S
PC
S
PC
S
PC
S
PC , XX
, XX
XX
XX
.
TY
DE
NO NO.
TI
TE
CO AN
T
RT
DA
N
LO
PA
BI
QU
PCS
PART NO.
DATE
X
X
S
PC
X
X
XX
-X
XX
XX
XXX
X XX XXXX X
LX
X
LXXXXX-XX-XX
XXXXXXXXXX
LOT NO.
XXXX , XX , XX
BIN CODE
Xx X
PCS
QUANTITY
Xx X
PCS
Xx X
PCS
Xx X
PCS
TOTAL
PCS
XXXX , XX , XX
DATE
OUTER CARTON
QUANTITY: 4 BOX
TOTAL: 80,000 PCS
C/T NO.
箱 號
XX
PART NO.
料 號
LXXXXX-XX-XX
QUANTITY
數 量
PCS
N.W.
凈 重
KGS
毛
重
C
OQ .XX.XX
XX
XX
X
X
KGS
REMARK
備 註
X
C/T NO.
箱 號
PART NO.
料
號
XX
XX
LXXXXX-XX-XX
QUANTITY
數 量
PCS
N.W.
凈 重
KGS
G.W.
毛 重
X
XX
X
XX
X
XX
KGS
REMARK
備 註
VER.: 01
Date: 2007/04/14
Page: 5/5