Table of Contents
Welcome Letter2
Agenda6
Keynote Speakers8
Featured Speakers11
Exhibitors18
Event Partners21
Sponsors22
Steering Committee34
Members & Partners35
Governing Council and Management Team
37
About MEMS Industry Group38
Upcoming Events40
CELLULAR PHONES AND ALARMS
As a courtesy to our speakers and other attendees, please
turn off any cellular phones and alarms during our sessions.
TWITTER: @MEMSGROUP
Use #migshanghai when tweeting about the conference!
PRESENTATIONS
Conference presentations will be available to attendees
starting on the afternoon of September 12, 2014. Please visit
shanghai.memsindustrygroup.org/presentations and use
the email you used at registration for access.
ANTITRUST POLICY
Please refer to MIG’s antitrust policy:
www.memsindustrygroup.org/antitrust
PRESS ROOM
Sponsored by ST
Located in VIP Room
1
Welcome
Welcome to MEMS Industry Group
Conference Shanghai 2014!
On behalf of the MEMS Industry Group (MIG) I would like to welcome you to
the inaugural MIG Conference Shanghai! This brand new international business
conference was designed around the business of MEMS and sensors, with a
focus on discussing critical global MEMS and sensors supply chain challenges.
The goal of MIG Conference Shanghai is to share knowledge and solutions, to
network and to discuss the current and future global landscape in MEMS and
sensors manufacturing as well as the emerging opportunities being presented
by the Internet of Things (IoT).
Present at this conference are executives and high level decision makers
from a vast spectrum of industries in and around the MEMS and sensors
industry – from MEMS and sensors end-users/OEMs to device manufacturers
and foundries to equipment manufacturers, consultants, analysts and material
suppliers. The entire commercial MEMS and sensors supply chain is present!
We have a full day scheduled of content and networking time planned, detailed
here in this program. Additionally, I am truly excited for the events happening on
Friday, September 12; I hope that you will join us as we embark on a fascinating
discovery of the up and coming IoT City of Jiading and scenic evening dinner
cruise aboard the Yaouhao.
I am especially grateful to our sponsors, who without their support we would
not have been able to host this historic conference. I also want to thank the MIG
Governing Council whose support and vision has enabled us to be here today.
We are also indebted to our partners at the Shanghai Institute of Microsystem
and Information Technology (SIMIT) and the Shanghai Industrial Technology
Research Institute (SITRI) and in particular, Director Xi Wang, Mr. Charles Yang
and Mr. Kevin Zhu.
Lastly, I would like to thank each of you for attending MIG Conference
Shanghai 2014. You, as organization leaders, have the vision, the knowledge,
the wherewithal and the experience to help the MEMS and sensors ecosystem pave its way into the future. You are truly our greatest asset today and
tomorrow, and we could not accomplish what we do without your support and
leadership. Throughout this conference, I ask you to stay engaged, keep us
proactive and help us shape the future of MEMS and sensors.
SOLUTIONS FOR
MEMS PROCESSES
Spin and spray coating, developing
and stripping of photoresist
Hot embossing, micro contact printing
and nano imprint lithography
Face to face, backside, transparent
and infrared bond alignment
Wafer bonding for 3D integration
and wafer level packaging
Karen Lightman
EXECUTIVE DIRECTOR, MEMS INDUSTRY GROUP
2
EV Group China Ltd.
益巍电子科技(上海)有限公司
中国上海市浦东新区, 张江高科技园区，
郭守敬路498号3号楼3316室
Phone: 0086-21-3899-4800
FAX: 0086-21-3899-4801
E-mail: info@EVGroup.com
EVG®GEMINI® Automated Production Wafer Bonding System
3
PVD, CVD, Etch & Thermal Technologies
for MEMS Applications
Etch
• HighrateSiDRIEwithunique
ClaritasTMendpoint
• DryreleaseetchusingHForXeF2
Deposition
• PVDforBAW/SAWapplications
• Lowtemperature,stress-controlled
PECVDforSiO/SiN
Thermal
• LowCoOthickdopedandun-doped
polysilicon
• Highlyproductivestress-controlledSiN
enquiries@spts.com
4
www.spts.com
5
Agenda
2:00pm – 2:30pm
Featured Speaker Presentation
David Horsley, Vice Chair Graduate Studies,UC California Davis
2:30pm – 3:30pm
Coffee Break & Expo Booth Exhibit
Sponsored by Fries Research & Technology - FRT
Ballroom Foyer
Breakfast & Registration
Sponsored by Silex Microsystems
Ballroom Foyer
3:30pm – 4:00pm
Featured Speaker Presentation
Angelo Assimakopoulos, Director of New Business
Welcome to MIG Conference Shanghai
Ballroom A
4:00pm – 4:45pm
Closing Keynote Speaker
Introduction by Gold Sponsor – SPTS
Joseph Xie, CEO, QST
4:45pm – 5:00pm
Closing Remarks
Stephen Whalley, Chief Strategy Officer, MEMS Industry Group
5:00pm – 7:30pm
Closing Dinner Party Co-Hosted with SIMIT/SITRI
Ballroom A
SEPTEMBER 11, 2014
7:00am – 8:15am
8:15am – 8:40am
Development, Knowles Corporation
Stephen Whalley, Chief Strategy Officer, MEMS Industry Group
8:40am – 8:50am
Welcome from Local Government Official
Introduction by Local Sponsor NMC
8:50am – 9:00am
Welcome from China Semiconductor Association
Xiao Tian Xu, Vice President, China Semiconductor Association
9:00am – 9:30am
SIMIT/SITRI Welcome Presentation
Xi Wang, Director General of SIMIT, Academician of CAS
9:30am – 10:15am
Opening Keynote Speaker
Introduction by Platinum Sponsor – EV Group
Herb Huang, Director of Semiconductor Manufacturing, SMIC
10:15am – 10:45am
Coffee / Tea Break – Sponsored by Plan Optik
Ballroom Foyer
10:45am
Featured Speaker Introductions
Introduction by Gold Sponsor – Freescale
8:00am – 9:30am
9:30am – 10:30am
10:30am – 12:45pm
10:45am – 11:15am
Featured Speaker Presentation
Jérémie Bouchaud, Director and Senior Principal Analyst
12:45pm – 1:45pm
1:45pm – 2:45pm
Benedetto Vigna, Executive Vice President, General Manager of
the Analog, MEMS & Sensors Group, ST Microelectronics
SEPTEMBER 12, 2014
9:00am – 3:30pm
MEMS & Sensors – Industrial Electronics, IHS Inc.
11:15am – 11:45pm
Featured Speaker Presentation
Michael Young, Director Electronic Sensing AP, Honeywell
11:45pm – 1:00pm
Lunch – Sponsored by Okmetic
Celadon Restaurant - 26th Floor
1:00pm – 1:30pm
Featured Speaker Presentation
Yang Zhao, President, MEMSIC
1:30pm – 2:00pm
6
Featured Speaker Presentation
Thomas Gessner, Director, Fraunhofer ENAS
Jiading IoT City Tour*
Meet in hotel lobby at 7:45am; Bus departs at 8am
2:45pm – 3:45pm
5:00pm – 9:00pm
Travel to Jiading IoT City
Visit SAIC Motor R&D center
IoT city visiting and Meeting & Panel
Discussion with local companies
Lunch in IoT city
Opening ceremony of ‘MtM’
association
Return to hotel
MIG Dinner Cruise*
Meet in hotel lobby at 5:15pm; Bus departs at 5:30pm.
Bus will return to hotel at approximately 9pm.
* Registration is required for these events.
If you have not registered and would like to attend,
please see a MIG staff member for more information.
7
Keynote Speakers
Herb Huang
Senior Director of 3D IC and Sensors Technology
Development, Semiconductor Manufacturing
International Corporation
Dr. Huang is currently a Senior Director of technology
development at the Corporate R&D Center of
Semiconductor Manufacturing International Corp.
Since joining SMIC in 2002, he has managed technology
development programs in various “More than Moore”
areas including ROM, HV and power CMOS, and CMOS
micro-display. Currently he is directing development
program in CMOS image sensors, MEMS, TSV and 3D-IC,
CMOS RF front-end and Silicon photonics technologies.
Prior to joining SMIC, he had worked for Seagate
Technology on micro electro-mechanical-magnetic system
development for hard disk recording heads. Dr. Huang
has more than 19 year R&D experience in many “More
than Moore” Silicon devices and other micro electrical,
magnetic, mechanical optical systems.
Mr. Huang received Ph.D. in Materials Sciences and
Engineering in 1994 and EMBA in 2000 both from the
University of Minnesota in the US. He obtained B.S. in
Applied Mechanics from Hunan University in 1983 and MS
in Geotechnical Engineering from the Chinese Academy of
Sciences in 1986. He has more than 36 issued US patents
and over 25 authored/co-authored technical papers in
related areas. He is also a guest professor at the Xi’an
Institute of Optics and Precision Mechanics at the Chinese
Academy of Sciences.
8
Joseph Xie, Ph.D.
CEO, QST Corporation
Joseph Xie is the founder and CEO of QST Corporation.
He received his Ph.D. degree from Rensselaer Polytechnic
Institute in 1988. He worked in IC process and device
technology at Portland Technology Development Center
(PTD) of Intel from 1988 to 1995. In 1990, he received Intel
Corporate Achievement Award for his excellent R&D work.
From 1995 to 2001, he worked in technology development
and sales marketing departments in Chartered
Semiconductor and Institute of Microelectronic (IME) in
Singapore. He also served as fellow and visiting professor
in Singapore MIT Alliance (SMA) program from 1998 to
2001. In 2001, he joined Semiconductor Manufacturing
International Corporation (SMIC) and served various
positions in technology development, sales and marketing,
business development, and public relations. Dr. Xie has
been visiting professor in microelectronics at Fudan
University since 2001.
9
Featured Speakers
Angelo Assimakopoulos
Senior Director of New Business Development, Mobile
Consumer Electronics, Knowles Corporation
Angelo Assimakopoulos is currently the Senior Director
of New Business Development for Knowles’ Mobile
Consumer Electronics division. He leads the investigation
of business opportunities for the business unit and the
development of business and marketing plans for new
products. Prior to this position, he held several strategic
positions and was at the forefront of new MEMS product
research and development at Knowles, directing the
engineering team along the development path.
Mr. Assimakopoulos played a major role in Knowles’
entrance into the mobile consumer electronics industry,
led the development of Knowles’ low cost, high
performance patented receivers (SIRENS) for high-end
headphones, and the development of the company’s
microphone operations in northern China.
He has been with Knowles Corporation since 2001 and
has been Knowles representative to the MEMS Industry
Group since 2006. Before joining Knowles Corporation, he
held business development positions in the automotive,
telecommunications, and cycling and fitness industries.
Mr. Assimakopoulos has a Bachelor of Science degree
in Mechanical Engineering from the Illinois Institute of
Technology in Chicago.
Bosch ‒ the MEMS
enabler for the
Internet of Things
and Services
Sensing our World
MEMS for the automotive world
Automotive Electronics
Acceleration, angular rate, pressure,
and far infrared sensors
www.bosch-sensors.com
Automotive
Electronics
MEMS for the consumer world
Bosch Sensortec
Inertial, geomagnetic, environmental
sensors including software
www.bosch-sensortec.com
Akustica
Microphones
Bosch
Sensortec
www.akustica.com
Jérémie Bouchaud
Director and Senior Principal Analyst, MEMS & Sensors
Industrial Electronics, IHS Inc.
Akustica
MEMS_Ex_Cong_Ad_2014_final.indd 1
10
15.08.2014 14:57:00
Jérémie Bouchaud is unique to the MEMS industry –
his breadth of MEMS, sensor devices and application
knowledge is unmatched, particularly in terms of
automotive, consumer markets, industrial, and medical
applications. Formerly, he was a founder and the head of
MEMS research for Wicht Technologie Consulting. In his
current position at IHS, Bouchaud is responsible for the
MEMS service area. In the course of his career, he has led
more than 100 MEMS-related market research endeavors.
Prior to WTC, he oversaw technology transfer for sensors
and MEMS at the German office of CEA-LETI. Bouchaud is
a graduate of the Munich University of Applied Sciences
and of Ecole Supérieur de Commerce of Grenoble. He
speaks German, English and French.
11
Thomas Gessner
Karen Lightman
Thomas Gessner studied physics and received the
degree in physics in 1979, the PhD degree in 1983 from
the Technische Universitaet Dresden and the Dr.-Ing.
habil. degree from the Technische Universitaet Chemnitz
in 1989.
Thomas Gessner had several positions in the industry
(ZMD Dresden) in the development of metallization
systems for DRAM integrated circuits. He was head of
department layer deposition and ion implantation and
project manager in cooperation with the Technikum
Microelectronics of Technische Universitaet Chemnitz.
In 1991 he founded the Center for Microtechnologies
out of the Technikum Microelectronics. Since 1991
he is the Director of the Center for Microtechnologies
and since 1993 Professor for Microtechnology, both
at the Technische Universitaet Chemnitz. Moreover,
Prof. Gessner is the director of the Fraunhofer Institute
for Electronic Nano Systems ENAS since 2008. He is
author or co-author of more than 850 publications as
well as inventor of 102 patents in 38 patent families in
microelectronics, micro systems technologies and smart
systems.
Karen Lightman became MEMS Industry Group (MIG)
managing director in 2007 and promoted to Executive
Director in 2013. Formerly director of special projects,
Karen played a pivotal role in launching MIG in January
2001. She is active on the worldwide MEMS conference
circuit as a keynote speaker and panelist promoting MIG’s
role as the leading trade association advancing MEMS
and sensors across global markets. Karen manages the
operations of MIG; spearheads strategic growth and
oversees sales, public relations, marketing and outreach.
She plays a critical role in creating the content for all MIG
and MIG-partner conferences, events and programming
and is instrumental in establishing and maintaining
partnerships with other international organizations to
advance the MEMS industry.
Karen joined MIG from Carnegie Mellon University’s
Center for Economic Development, where she was
senior policy analyst. Prior to Carnegie Mellon, she
was senior associate at Cleveland Tomorrow, a publicprivate partnership, and before that, she was a program
associate with the Ford Foundation.
Karen has a BA from the University of Vermont
(UVM) and a MS in Public Policy from Carnegie Mellon
University. She is a board member and chair of the Board
Development Committee of the National Council of
Jewish Women (NCJW), Pittsburgh and in 2012 received
the NCJW National Award for Emerging Leaders. Karen
is secretary for her UVM alumni class, mentor at UVM’s
Honors College and volunteers at the Environmental
Charter School at Frick Park. She and her family reside in
Pittsburgh, PA.
Director, Fraunhofer ENAS
David Horsley
Co-Director, Berkeley Sensor & Actuator Center & Vice
Chair Graduate Studies, University of California Davis
Dr. David Horsley is a Professor in the Department of
Mechanical and Aerospace Engineering at the University
of California, Davis, USA, and has been a co-director of
the Berkeley Sensor and Actuator Center (BSAC) since
2005. He is CTO and Co-Founder of Chirp Microsystems,
a start-up commercializing micromachined ultrasonic
transducers. His research in micromechanical sensors is
currently focused on MEMS-based ultrasound, magnetic
and inertial sensors. Dr. Horsley received the Ph.D.
degree in Mechanical Engineering from the University of
California, Berkeley in 1998 for his thesis work pioneering
dual-stage microactuators in hard disk drives. Prior
to joining the faculty at UC Davis, he held positions at
Dicon Fiberoptics, Hewlett Packard Laboratories and was
involved in founding an optical components start-up,
Onix Microsystems. Prof. Horsley is a recipient of the NSF
CAREER Award and the UC Davis College of Engineering’s
Outstanding Junior Faculty Award.
12
Executive Director, MEMS Industry Group
13
Benedetto Vigna
Executive Vice President, General Manager of the
Analog, MEMS & Sensors Group, STMicroelectronics
Benedetto Vigna is Executive Vice President, General
Manager of the Analog, MEMS & Sensors Group, and has
held this position since September 2011. He is a member
of ST’s Corporate Strategic Committee.
In 1995, Vigna joined STMicroelectronics’ R&D Labs
and launched the Company’s efforts in MEMS. Under his
leadership, ST’s MEMS accelerometers and gyroscopes
found early success with large consumer equipment
manufacturers for motion-activated user interfaces and
more recently he has built on those wins piloting successful
moves into microphones, magnetic sensors, and touchscreen controller markets. In 2007, Vigna’s scope was
enlarged to include management of Sensors, RF, HighPerformance Analog and Mixed Signal, as well as Interface,
Audio for Portable, and General-Purpose Analog products.
Vigna has filed more than 170 patents on
micromachining to date, authored numerous publications,
and delivered many speeches at international conferences.
He sits on the industrial board of several EU-funded
programs. In 2013 Vigna won the prestigious European
SEMI Award for his contribution to the MEMS industry
and was acknowledged as the Executive of the Year by the
MEMS Industry Group.
Benedetto Vignawas born in Potenza, Italy, in 1969, and
graduated with a degree in Subnuclear Physics from the
University of Pisa, Italy.
Xi Wang
Director General of SIMIT, Academician of CAS
Prof. Wang Xi graduated in Tsinghua University in 1987,
and obtained master degree and PhD from Shanghai
Institute of Metallurgy, CAS in 1990 and 1993, respectively.
He worked as a visiting professor in Australia and Germany
in 1994 and 1996. Right now he serves as Director General
of Shanghai Institute of Microsystem and Information
Technology, CAS.
Prof. Wang Xi’ research interests cover advanced
microelectronic materials and novel IC processes, he has
published over 300 papers on academic journals and
scientific conferences. He was granted the first prize of the
National S & T Progress Award in 2006, and was elected as
Academician of Chinese Academy of Sciences in 2009.
14
Steve Whalley
Chief Strategy Officer, MEMS Industry Group
Steve Whalley, former MIG board member, 26-year
veteran at Intel, with 30+ years in the industry, joined
MEMS Industry Group in the role of Chief Strategy Officer
in June 2014. Steve’s decades of experience with MEMS,
sensors and cross-industry initiatives will help keep MIG
at the forefront of meeting the complex business and
technical needs of our member companies. Steve brings
technical and strategic acumen to propel MIG into more
meaningful and fruitful initiatives for the organization, for
MIG members and for the MEMS and sensors industries.
Xiao Tian Xu
Vice President, China Semiconductor Association
Mr. Xiao Tian Xu is currently the executive vice president
of the China Semiconductor Industry Association and
manages all of its daily activities.
Prior to joining CSIA, Mr. Xu had more than 20 years of
experience in managerial positions in the semiconductor
industry. He has engaged in the management of business
and product quality of the enterprise; developed the
industry plan for the Chinese Semiconductor industry; set
policy for the semiconductor industry, and initiated and
managed work in various national major projects.
Mr. Xu worked as director of process development,
director of IC design, head of marketing team, and office
director after obtaining his B.S. from the Harbin Institute of
Military Engineering.
Michael Young
Director Electronic Sensing AP, Honeywell
Michael currently holds AP Director position of Electronic
Sensing business with Honeywell. Michael is one of the
pioneers in MEMS technology. He started his career with
Rosemount in 1984 and served different functional roles
throughout his career with Hughes Aircraft, Endevco,
Revere Transducers and Freescale before joining
Honeywell. In addition, he also founded three MEMS startups. Two of them are in USA engaging in Optical Telecom
and Sensor & wireless data acquisition system; one in
China for Automotive sensors. His footprint also can be
found behind several MEMS start-ups in China and Taiwan.
Michael possesses extensive experience in MEMS design,
packaging, production, and application. He has helped
15
many companies in their product development. Products
that he participated in development have enjoyed good
success in industrial, medical, automotive, consumer,
aerospace, and military. His career interest has evolved
from technology to entrepreneurship and later into
financial maneuver including M&A and reverse merger.
Michael has a BS degree from National Taiwan University
and a MS degree from Stanford University. He lives with his
wife and their 5 years old son in Beijing now. Baseball is his
favorite sport.
Yang Zhao
President, MEMSIC Inc.
In 1999 Dr. Zhao founded MEMSIC to bring to market
a novel form of heated-gas accelerometer and use of a
CMOS-compatible manufacturing process. Dr. Zhao led
the company from zero to IPO in 2007, making MEMSIC
the first MEMS start up successfully listed in NASDAQ in
the whole history of MEMS industry. In 2010, Dr. Zhao
completed the acquisition of Crossbow Technology, Inc.,
which brought MEMSIC into a worldwide leading-edge
inertial products and system solution company. Dr. Zhao
has named one of twelve shakers and movers in MEMS by
EE Times 2014.
Dr. Zhao has over 20 years of experience in MEMS
technology and related business development. Prior to
founding company in 1999 Dr. Zhao served in various
management positions at Analog Devices Inc. for seven
years where he was instrumental in developing ADIs
MEMS product line and forming industry wide strategic
relationship.
Dr. Zhao has been named as an inventor and has over
20 patents in IC circuit, processing, packaging and MEMS
technology. Dr. Zhao has a Ph.D. in electrical engineering
from Princeton University where he studied under
Professor Daniel Tsui, who won the 1998 Nobel Prize in
physics.
16
The best way
to predict the future is
to create it yourself
MEMS Sensor for Sensor Network
Absolute Pressure Sensor
Microphone
Accelerometer
Flow Sensor
Gauge Pressure sensor
Thermal Sensor
17
Exhibitors
as of August 21, 2014. Subject to change.
Plasma Etch & Deposition
Solutions for MEMS
Oxford Instruments Plasma Technology presents an evolution in deep
silicon etch technology. Our technologies enable the cost of ownership and
yield required to maximise the performance of your devices.
PlasmaPro® 100 Estrelas
Silicon etch solutions for the MEMS market
PVD, CVD, Etch & Thermal Technologies
for MEMS Applications
Etch
• HighrateSiDRIEwithunique
ClaritasTMendpoint
• DryreleaseetchusingHForXeF2
Offering the ultimate in process flexibility
Nano and micro structures can be realised as the
hardware has been designed with the ability to
run Bosch™ and Cryo etch technologies in the
same chamber.
25 years
supporting
MEMS
For more information please contact us:
Tel: +44 (0) 1934 837 000
Email: plasma@oxinst.com
www.oxford-instruments.com/plasma
Deposition
• PVDforBAW/SAWapplications
• Lowtemperature,stress-controlled
18
19
Event Partners
MEMS Industry Group® Conference Shanghai is brought to
you in partnership with Shanghai Institute of Microsystem
and Information Technology (SIMIT) and Shanghai
Industrial Technology Research Institute (SITRI).
X-FAB MEMS Foundry
The Fastest Growing MEMS Foundry in the World.
Quick & easy access to high quality MEMS production
Open-platform processes – qualified & ready to use
> 3-Axis inertial sensors – gyro & accelerometer
> Pressure sensors – absolute and relative
> Thermopiles – infrared sensors
Shanghai Institute of Microsystem and
Information Technology (SIMIT)
Shanghai Institute of Microsystem and
Information Technology (SIMIT), Chinese Academy
of Sciences (CAS), was founded in 1928. It’s
a multidisciplinary institute engaged in both
fundamental and applied researches aiming at
the demands of national economic and social
developments. SIMIT has established extensive international cooperation
and exchanges with a great number of overseas universities, research
institutions and enterprises of dozens of countries and regions.
http://sim.cas.cm
Best-in-class quality systems for automotive
> ISO TS16949 certified
> 20 years experience of automotive supply
High-volume capacity for consumer / mobile
> Over 1 billion MEMS devices shipped
Talk to our local team to discuss your MEMS requirements
www.xfab.com/MEMS
Shanghai Industrial Technology
Research Institute (SITRI)
SITRI was established by the Chinese
Academy of Sciences and Shanghai
government to focus on the development
and commercialization of ‘More than Moore’ technology. SITRI is an open
innovation platform that encompasses an 8′ MtM micro-fabrication line,
state-of-the-art R&D facilities, engineering services and market intelligence,
supply-chain partners and industry Association, as well as dedicated
investment funds. Leveraging China’s mature Semiconductor industry, fastgrowing domestic markets, and increasingly large talent pool, SITRI’s mission
is to become a world-class R&D Center that works with global partners to fuel
innovations in the next Information Technology revolution.
www.sitrigroup.com
20
21
Sponsors
PLATINUM SPONSOR
EV Group | www.evgroup.com
EV Group (EVG) is a leading supplier of equipment
and process solutions for the manufacture of
semiconductors, microelectromechanical systems
(MEMS), compound semiconductors, power devices,
and nanotechnology devices. Key products include
wafer bonding, thin-wafer processing, lithography/
nanoimprint lithography (NIL) and metrology
equipment, as well as photoresist coaters, cleaners and inspection systems.
Founded in 1980, EV Group services and supports an elaborate network of
global customers and partners all over the world.
GOLD SPONSORS
Freescale Semiconductor | www.freescale.com/xtrinsic
Freescale Semiconductor is a global leader
in embedded processing solutions, providing
industry leading products that are advancing
the automotive, consumer, industrial and
networking markets. From microprocessors
and microcontrollers to sensors, analog integrated circuits and connectivity –
our technologies are the foundation for the innovations that make our world
greener, safer, healthier and more connected. Some of our key applications
and end-markets include automotive safety, hybrid and all-electric vehicles,
next generation wireless infrastructure, smart energy management, portable
medical devices, consumer appliances and smart mobile devices. The
company is based in Austin, Texas, and has design, research and development,
manufacturing and sales operations around the world.
Expanding on more than 30 years of sensor innovation, Freescale
Xtrinsic sensing solutions are designed with the right combination of highperformance sensing capability, processing capacity and customizable
software to help deliver smart, differentiated sensing applications. With
Xtrinsic sensing solutions, our vision is to offer a diverse and differentiated
product portfolio to meet the expanding needs of the automotive, consumer
and industrial segments. Xtrinsic solutions offer ideal blends of functionality
and intelligence designed to help to our customers differentiate and win in
highly competitive market.
22
SPTS Technologies | www.spts.com
SPTS Technologies designs, manufactures,
sells, and supports etch, PVD, CVD and thermal
capital equipment and process technologies
for the global semiconductor and micro-device
industries, with focus on the MEMS, advanced
packaging, LED, high speed RF device and
power
management
markets.
PVD,
CVD,
Etch & Thermal
Technolog
The solutions offered by SPTS include market-leading silicon etch, dielectric
forbatch
MEMS
Applications
etch, dry-release etch, PVD, PECVD, APCVD and large
vertical
furnaces,
available with a range of wafer-handling options applicable to R&D, pilot
Etchand spare parts
production, or volume production. Comprehensive service
• HighrateSiDRIEwithunique
support are offered through a worldwide network of service
centres and
ClaritasTMendpoint
qualified local agents.
• DryreleaseetchusingHForXe
LOCAL SPONSOR
Deposition
North Microelectronics (NMC) | www.bj-nmc.cn
• PVDforBAW/SAWapplications
• Lowtemperature,stress-controlled
NMC, as the domestic leading high-end
PECVDforSiO/SiN
semiconductor equipment enterprise, has
developed ETCH, CVD, PVD equipments, which
are applied in IC, LED, MEMS, Power IC, Advanced
Thermal
Packaging, Optical Communication and Compound Semi. After ten years
• LowCoOthickdopedandun-do
of development, NMC has possessed core advantages in etching, filming,
polysilicon
plasma, precision mechanics, automation software, and ultra-high vacuum,
• Highlyproductivestress-contro
and we contribute reliable products and services for the fast development
of microelectronics industry. Adhering to technological innovation and user
first, NMC focuses on becoming a high-end equipment and process solution
enquiries@spts.com
www.sp
provider with international influences.
23
SILVER SPONSORS
IMT | www.imtmems.com
Bosch Sensortec | www.bosch-sensortec.com
IMT, a US based custom MEMS development
and production service provider, offers 10+ years
of experience in the biomedical and biotechnology
industry. Applications include: implantable devices,
microfluidics, pumps, valves, gene sequencing,
filters, and cell purifiers. We offer collaborative development to enable
shortest time to market and greatest overall value.
Bosch Sensortec GmbH is a fully owned
subsidiary of Robert Bosch GmbH, dedicated
to the consumer electronics world offering a
complete portfolio of micro-electro mechanical
systems (MEMS) sensors and solutions that
enable mobile devices to feel and sense the world around them. Bosch
Sensortec develops and markets a wide portfolio of MEMS sensors and
solutions for smart phones, tablets, wearable devices and IoTS (Internet of
Things & Services) applications.
The product portfolio includes 3-axis acceleration, gyroscope and
geomagnetic sensors, integrated 6- and 9-axis as well as environmental
sensors and a comprehensive software portfolio. Since its foundation in
2005 Bosch Sensortec emerged as the technology leader in the addressed
markets. The Bosch Group has been the global market leader for MEMS
sensors since 1998 and has to date sold more than 4 billion MEMS sensors.
Teledyne DALSA Semiconductor | www.teledynedalsa.com
Teledyne DALSA Semiconductor
is a leading pure-play MEMS
Foundry with extensive experience
on fabrication and materials
science that make manufacturing of MEMS product possible on 150mm
/200mm wafers. Teledyne DALSA Semiconductor also offers industry-leading
manufacturing capability, design support and custom design services for
high voltage CMOS ICs and MEMS micro-mirrors applications.
BRONZE SPONSORS
Broadcom | www.broadcom.com
Broadcom Corporation (NASDAQ: BRCM), a
FORTUNE 500® company, is a global leader and
innovator in semiconductor solutions for wired
and wireless communications. Broadcom®
products seamlessly deliver voice, video, data and
multimedia connectivity in the home, office and
mobile environments. With the industry’s broadest portfolio of state-ofthe-art system-on-a-chip and embedded software solutions, Broadcom is
changing the world by Connecting everything®.
24
OMRON | www.omron.com
Headquartered in Kyoto, Japan, OMRON
Corporation is a global leader in the field of
automation. Established in 1933. OMRON
has more than 36,000 employees in over 35 countries working to provide
products and services to customers in a variety of fields including industrial
automation, electronic components, MEMS, semiconductors, social systems,
and healthcare. The company has five regional head offices in Kyoto (Japan),
Singapore (Asia Pacific), Shanghai (Greater China), Amsterdam (Europe,
Africa, and the Middle East), and Chicago (the Americas).
The best way
to predict the future is
to create it yourself
Oxford Instruments | www.oxford-instruments.com
MEMS Sensor for Sensor Network
Oxford Instruments offers flexible, configurable
process tools and leading-edge processes
for the precise, controllable and repeatable
etching, deposition and growth of micro- and
nano-structures. Our systems provide process
solutions for the micro- and nanometre engineering of materials for MEMS,
Absolute
Pressure
Sensor
semiconductor,
optoelectronics, HBLED, PV, & microfluidics,
high
quality optical
Microphone
coating and many other applications in micro- and nanotechnology.
These solutions are based on core technologies in:
- Plasma Etch & Deposition
Accelerometer
- Atomic Layer Deposition (ALD)
- Ion Beam Etch & Deposition
- Deep
Silicon
Etch Systems
Flow
Sensor
Products range from compact stand-alone systems for R&D, through
to batch tools and up to cassette-to-cassette and clustered
Gauge platforms
Pressure for
sensor
production processing. Thermal Sensor
25
X-FAB MEMS Foundry | www.xfab.com
X-FAB MEMS Foundry offers unsurpassed
experience, expertise and execution with its highvolume MEMS manufacturing service. The first
pure-play MEMS foundry, X-FAB draws on more than
15 years MEMS manufacturing. Operating from five
fabs for MEMS and CMOS processes and an ecosystem of manufacturing and
design partners, X-FAB is the proven choice for process development and
installation, process capability, design support and long-term manufacturing
stability. As well as customer specific process installation, X-FAB offers a
range of qualified, open-platform processes and designs for key MEMS
device types, enabling customers to have the fastest time to market in the
foundry industry.
* MEMS and semiconductor equipment brokerage
* market research and intelligence
We were founded in 2003, currently have 34,800+ subscribers worldwide
and attract top-level executives, engineers and researchers who are active
participants in the MEMS community. For inquiries, please email us at
info@memsjournal.com.
BREAKFAST SPONSOR
Silex Microsystems | www.silexmicrosystems.com
MEDIA/PRESS SPONSOR
SILEX MICROSYSTEMS AB is the world’s largest
pure-play MEMS foundry. We service the advanced
MEMS and heterogenous packaging needs of
the world’s leading companies. With production
operations totaling 25,000 square feet with dedicated
lines for both 6″ and 8″ wafers, Silex has successfully completed over 350
MEMS projects with over 100 corporate customers. Silex’ Sil-Via(r) has
provided advanced TSV solutions in production for over 9 years. Silex’ core
technologies enable some of the world’s brightest innovations.
STMicroelectronics | www.st.com
LUNCH SPONSOR
ST is a global leader in the semiconductor market
serving customers across the spectrum of sense
and power and automotive products and embedded
processing solutions. From energy management and
savings to trust and data security, from healthcare and
wellness to smart consumer devices, in the home, car
and office, at work and at play, ST is found everywhere
microelectronics make a positive and innovative contribution to people’s
life. By getting more from technology to get more from life, ST–the leader in
MEMS and Sensors–stands for life augmented.
Okmetic | www.okmetic.com
ADDITIONAL SPONSORS
PROGRAM SPONSOR
MEMS Journal | www.memsjournal.com
We are the largest MEMS publication
worldwide. We cover the most notable
MEMS news and developments to ensure
that our subscribers explore and take
advantage of the latest business development, commercialization and
partnership opportunities.
We provide the following services:
* executive and engineering recruiting
* marketing and advertising
* intellectual property brokerage
26
Okmetic supplies advanced silicon wafers for
sensor and semiconductor applications and sells
its technological expertise. Okmetic is the global
market leader in demanding MEMS-based sensor wafers, with 30 years’
experience in MEMS business. The company provides a wide range of 100200mm silicon wafers for surface and bulk micromachining, encapsulation
and MEMS-IC-integration designs including double-side polished (DSP),
single-side polished (SSP), epitaxial, and bonded silicon-on-insulator (SOI)
wafers.
DINNER CRUISE SPONSOR
Kionix, Inc. | www.kionix.com
Kionix, Inc. is a global MEMS inertial sensor
manufacturer based in Ithaca, NY, USA. Kionix
offers high-performance, low-power accelerometers,
gyroscopes, and 6-axis combination sensors plus
comprehensive software libraries that support a full
range of sensor combinations, operating systems and hardware platforms.
Leading consumer, automotive, health and fitness and industrial companies
worldwide use Kionix sensors and total system solutions to enable motionbased functionality in their products.
27
THURSDAY DINNER SPONSOR
Broadcom | www.broadcom.com
Broadcom Corporation (NASDAQ: BRCM), a
FORTUNE 500® company, is a global leader and
innovator in semiconductor solutions for wired and
wireless communications. Broadcom® products
seamlessly deliver voice, video, data and multimedia
connectivity in the home, office and mobile
environments. With the industry’s broadest portfolio of state-of-the-art systemon-a-chip and embedded software solutions, Broadcom is changing the world by
Connecting everything®.
COFFEE/TEA BREAK SPONSORS
Fries Research & Technology GmbH (FRT) | www.frt-gmbh.de
Fries Research & Technology GmbH (FRT)
offers a comprehensive range of metrological
surface measuring systems for the non-destructive
investigation of topography, profile, film thickness,
roughness, abrasion and many other properties.
More than 400 reputable international companies from the automotive,
semiconductor, MEMS, optical, photovoltaic and many other industries equip
their R&D and production departments with FRT metrology systems.
FRT operates from Bergisch Gladbach, Germany and maintains
subsidiaries in China, Switzerland and the United States. Additionally, FRT
provides a distribution and service network in the USA, Asia and Europe.
Plan Optik AG | www.planoptik.com
Plan Optik AG, a sophisticated glass, quartz and
silicon processor, existing since 1962 and based in
Germany, is focusing on MEMS and semiconductor
related products (mainly wafers used for wafer level
packaging of MEMS and carriers used for temporary
bonding of device wafers). The quality of Plan Optik’s
wafers sets the standard in the industry since many
years.
This success is driven by the development of own manufacturing methods
e.g. for the polishing of glass wafers. So called MDF (micro damaging
free) polished wafers show an impressive surface quality (no sub surface
damaging) and are suitable for safety relevant devices such as tyre pressure
sensors. No sub-surface-damaging means a dramatically increased yield
during etching processes. Additionally the surface roughness is much below
5 Ångstrom (0.5 nm) – this makes them suitable for direct bonding.
28
The chips manufactured based on Plan Optik’s wafers are implemented in
more than 100 million sensors and micro fluidic systems per year.
Plan Optik’s structured wafers are used in active components of micro
fluidic and lab-on-chip devices. This includes Nano-Dispensing-Systems and
Nano-Vaporizers for medicament administration.
SUPPORTING SPONSORS
Berkeley Sensor & Actuator Center | bsac.eecs.berkeley.edu
Berkeley Sensor & Actuator Center is the National Science Foundation
Industry/University Cooperative Research Center for MEMS and NEMS. BSAC
was founded in 1986 to conduct commercially relevant
interdisciplinary engineering research on micro and
nano-scale sensors, moving mechanical elements,
microfluidics, materials, processes, and systems. Our
membership-based organization of 150+ graduate
student and postdoctoral researchers inspired by two
dozen faculty from 8 departments and 3 campuses
of the University of California, report regularly on over 100 projects, on
a prepublication basis, to our 30+ member companies. BSAC welcomes
inquiries from technology-leveraged companies and top students seeking
advanced degrees in our specialties.
Fraunhofer ENAS | www.enas.fraunhofer.de
The Fraunhofer Institute for Electronic Nano Systems ENAS focuses
on research and development in the field of smart systems integration.
We accompany your project from specification
and design to technology development and to
product prototyping. The research and service
portfolio of Fraunhofer ENAS covers:
• High-precision sensors
• silicon-based and polymer-based MEMS/NEMS
• Sensor and actuator systems with control units and evaluation
electronics
• Printed functionalities like antennas and batteries
• Wafer level packaging of MEMS/NEMS,
• System Integration, 3D integration
• Reliability of systems and components
• Application areas are semiconductor industry, medical engineering,
mechanical engineering, automotive industry, logistics as well as
aeronautics.
29
IVAM | www.ivam.de
Yole Développement | www.yole.fr
Being an international association of companies
and institutes in the field of microtechnology,
nanotechnology, advanced materials and optics &
photonics, IVAM makes every possible effort to create
competitive advantages for its members. Companies
from all over the world open up new markets and
set new standards support of IVAM. IVAM is the
communicative bridge between suppliers and user of high-tech products and
services. The major task is to create synergies and to support the members in
exchanging knowledge, in collaborative projects and in establishing contacts
with each other and with potential customers. Through business platforms at
exhibitions, conferences, networking events and public relations IVAM creates
visibility for its members.
Beginning in 1998 with Yole Développement, we
have expanded to a group of companies providing
market research, technology analysis, strategy
consulting, media, and financial services.
Yole Développement group has grown to
more than 50 associates worldwide covering
emerging and disruptive silicon and micro manufacturing markets including
MEMS, medical technologies (including Microfluidics and BioMEMS),
advanced packaging, compound semiconductors, power electronics, LEDs,
and photovoltaics. The group supports companies, investors and R&D
organizations worldwide in understanding markets and following technology
trends to grow their businesses.
Micromachine Center (MMC) | www.mmc.or.jp
Micromachine Center (MMC) is a foundation dedicated
to support establishment of technological basis of
future MEMS/ Micromachine, as well as to support
development of MEMS / Micromachine industries
in Japan.In cooperation with Japanese government,
academy and industry, MMC leads activities to accelerate
industrialization such as national R&D projects, various
global & domestic networking, education & training, and
Exhibition Micromachine/MEMS.
Semico Research | www.semico.com
Semico Research is a semiconductor
marketing & consulting research company
located in Phoenix, Arizona. Semico was
founded in 1994 by a group of semiconductor
industry experts. We have improved the validity of semiconductor product
forecasts via technology roadmaps in end-use markets. Semico offers
custom consulting, portfolio packages, individual market research studies, a
monthly report featuring the 1 year forward looking Inflection Point Indicator
(IPI) and premier industry conferences. Key areas of focus include MEMS,
semiconductor manufacturing, IP, design starts, SOC, memory, logic, analog,
and an on-line end use market database offering 24/7 access.
30
31
★
公司网址：www.bj-nmc.cn
32
销售邮箱：sales@bj-nmc.cn
联系电话：010-57846896/97
33
Steering Committee
Members & Partners
MIG extends a special thank you to everyone on the MIG Conference
Shanghai 2014 steering committee. Without their great ideas and
hard work, MIG Conference Shanghai would not be possible.
Members
Bill Bader, iNemi
Harrison Beasley, GSA
Leopold Beer, Bosch
Roc Blumenthal, Wisdom-IC
Lisa Bradley, Freescale
Gene Burk, IMT
Jason Chaffey, BlueChiip
Kevin Chau, MEMStaff
Ian Chen, Freescale
Jean-Christophe Eloy, Yole
Yie He, Intellisense
Sumio Horiike, OMRON
Christine Kaindlsdorfer, EV Group
Sofia LV, Freescale
Jessica Meng, Freescale
Peter Merz, X-Fab MEMS Foundry
Petteri Piirinen, Okmetic
Ranjan Rajoo, GLOBALFOUNDRIES
Mike Rosa, Applied Materials
Yukiko Sakaguchi, OMRON
Kenny Salky, Kionix
Clemens Schütte, EV Group
Yoshio Sekiguchi, OMRON
Zhu Wanjiao, Bosch
Ian Wright, SPTS
Bin Wu, Qualcomm
Charles Yang, SITRI/SIMIT
Katsuyuki Yugami, OMRON
Kevin Zhu, SITRI/SIMIT
Yang Zou, Teledyne Dalsa
34
Acuity Incorporated
ACUTRONIC
AEPI Grenoble-Isere France
Economic Development Agency
Akrion Systems
AM Fitzgerald & Associates
Amkor Technology Euroservices
Akustica
AnaCatum
Analog Devices
Applied Materials
Applied Microstructures
ARM
ASE Group
Asia Pacific Microsystems
Audience
Axetris
bluechiip
Bosch
Brewer Science
Broadcom
Bruco Integrated Circuits
Bullen Ultrasonics
C2MI
Cambridge Software
camLine
CareSpan
CEA-Leti
Charles Stark Draper Laboratory
Cinder Solutions
ClassOne Equipment, Inc.
Coto Technology
Coventor
CSEM
DelfMEMS
DiPaola Consulting, LLC
Dynaloy Division | Eastman Chemical
Company
Empower Materials
Energizer Personal Care
Epson Electronics America
European Sensor Systems
EV Group
Expertech
Fairchild Semiconductor
Fraunhofer ENAS
Fraunhofer IPMS
as of August 22, 2014
Fraunhofer ISIT
Freescale Semiconductor
FRT - Fries Research & Technology
General Electric
GLOBALFOUNDRIES
Hewlett-Packard Company (HP)
Hillcrest Labs
Honeywell
Infineon
Innovative Micro Technology (IMT)
Intel
Intellisense Software
Interlink Electronics
Invenios
InvenSense
Jawbone
KBSO - Kaplan Breyer Schwarz &
Ottesen, LLP
Kionix
Knowles Electronics
Lam Research Corporation
LG Electronics
Ling Star Technology
Maradin Technologies
Maxim Integrated
Meggitt Sensing Systems
MEMSIC
MEMSRight
memsstar
MEMStaff
Merit Sensor Systems
Micralyne
Micrel
MicroGen Systems
Micronit Microfluidics
MicroVision
Midwest MicroDevices
Movea
Murata Electonics
NADAtech
NIST
OEM Group
Okmetic
OMRON Corporation
Optical Associates (OAI)
Oxford Instruments
Palios Corporation
Panorama Synergy
Picosun
Plan Optik
35
Plasma-Therm
PNI Sensor Corporation
Polytec
Qualcomm
Qualtré
QuickLogic
Rogue Valley Microdevices
Sand 9
s-cubed
Sensonor
Sensor Platforms
Shanghai Industrial Technology
Research (SITRI)
Siargo
Silex Microsystems
SilverBlip
SiWare
SmallTech Consulting
SMART Commercialization Center for
Microsystems
Smart System Technology &
Commercialization Center
SoftMEMS
Solidus Technologies
SolMateS
Sony
SPEC Sensors, LLC
SPP Technologies Co., Ltd. (SPT)
SPTS Technologies
SSEC
STMicroelectronics
SunEdison
SUSS Microtec
Tekton Consulting
Teledyne DALSA
Texas Instruments
Tronics Microsystems
Trusted Positioning
TSMC
UBOTIC
ULVAC
Unisem
Valuetek
VirtualBeam
VTT Technical Research Centre of
Finland
Wafer World
Wisdom IC
Wispry
Xaarjet
X-FAB MEMS foundry
Xsens
ZMDI
Partners
BSAC
CMU ICES
Continua Healthcare
DGFEZ
Extension Media
GSA
IEEE
I.H.S
iNEMI
IVAM
Juniper Research
MEMS and Nanotechnology
Exchange
MEMS Journal
MEMS Park Consortium
MEPTEC
Micromachine Center
MIPI Alliance
MST-BW
QuantaEd
Questex
Roger Grace Associates
SEMI
Semico
SIMIT
Solid State Technology
WIMS2
X PRIZE Foundation
Yole Développement
MEMS Industry Group
GOVERNING COUNCIL
Kevin Crofton (Chairman)
SPTS Technologies
Jim Knutti, Ph.D.
Acuity, Inc.
Steven Dwyer
Eastman Chemical
Dave Monk, Ph.D.
Freescale Semiconductor
Alissa Fitzgerald, Ph.D.
A.M. Fitzgerald & Associates
Magnus Rimskog
Silex Microsystems
Evgeni Gousev, Ph.D.
Qualcomm Technologies, Inc.
Yoshio Sekiguchi
OMRON Corporation
Bryan Hoadley
SunEdison
Jason W. Weigold, Ph.D.
MEMStaff, Inc.
David Kirsch
EV Group, Inc.
Harvey C. Nathanson, Ph.D.,
Emeritus
Northrop Grumman, Retired
(Permanent Seat)
MANAGEMENT TEAM
Karen Lightman
Executive Director
Monica L. Takacs
Director of Membership
mtakacs@memsindustrygroup.org
Chivonne Hyppolite
Program & Event Manager
Ellen Saksen
Director of Marketing
esaksen@memsindustrygroup.org
Kara Laux-Bell
Office Assistant
Steve Whalley
Chief Strategy Officer
swhalley@memsindustrygroup.org
klightman@memsindustrygroup.org
chyppolite@memsindustrygroup.org
klaux-bell@memsindustrygroup.org
View our member list and get more information on each member at
www.memsindustrygroup.org/members
36
Shelley Petro
Business Manager
spetro@memsindustrygroup.org
37
MEMS Industry Group is the trade
association advancing MEMS &
Sensors across global markets.
As the “go-to” resource for globally linking the MEMS and sensors supply
chain to strategic markets, MIG helps companies in and around the MEMS
and sensors industry to make meaningful business connections. Device
manufacturers, software designers, materials and equipment suppliers,
foundry partners, market analysts, and OEM integrators all plug into the MIG
network to form alliances that will move their businesses forward.
MIG membership features a number of exclusive benefits:
The go-to resource for the
MEMS & Sensors industry.
Visit our website for membership information
and a full list of upcoming events:
www.memsindustrygroup.org
MEMS Industry Group
1620 Murray Avenue, Pittsburgh, Pennsylvania, USA
001-412-390-1644 (Phone)
•
MIG offers members a seat in the MEMS and sensor ecosystem - from
upstream supplier to downstream customer
•
At our flagship and partner events, MIG provides myriad opportunities to
interface clearly and easily between each link of the MEMS and sensors
supply chain
•
MIG provides exclusive market data to inform business decisions
•
MIG provides exclusive market data to inform business decisions
•
MIG and MIG members drive standardization activities
•
MIG’s strong links to other industry groups and key research
organizations allows for easy engagement in adjacent fields
•
MIG provides neutral, experienced forum for problem-solving
•
MIG offers unparalleled visibility and promotion; we tap members first
for speaking engagements, press opportunities, digital content,
posters, etc.
•
MIG webinars and other educational materials provided by practitioners
with real experience and knowledge to share with members
Visit www.memsindustrygroup.org/events
or scan the QR code to the right for a
complete listing of upcoming events!
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39
Upcoming Events
For a full list of upcoming events, visit our website at
www.memsindustrygroup.org/events
NOVEMBER 5-7, 2014
MEMS Executive Congress® US
Scottsdale, Arizona, USA
www.memscongress.com
JANUARY 6-9, 2015
2015 International CES®
Las Vegas, Nevada, USA
Exhibit and sponsorship opportunities
available for MIG members.
MARCH 4-5, 2015
MEMS Executive Congress® Europe
Munich, Germany
Sofitel Hotel Bayerpost
2
SPRING 2015
Member-to-Member (M2M) Forum
The annual members meeting of MEMS
Industry Group.
40