EV Group Product Range Commitment Without Borders Corporate Headquarters EVG Subsidiaries EVG Japan EVG Korea EVG North America EVG Taiwan EVG China Our highly qualified employees are part of a worldwide network. Solutions for LITHOGRAPHY Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing. The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification. Other important advancements by EV Group in the lithography space include the company's special resist coating technologies OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs. Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for costeffective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UVnanoimprint lithography (UV-NIL) and hot-embossing systems. Today, the company holds the dominant market share in these promising technologies. EVG®150 Automated Resist Processing System up to 300 mm IQ Aligner® Automated Mask Aligner System up to 300 mm SUPPORTED LITHOGRAPHY PROCESS STEPS • Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode • Spin coating and resist development • • • • • Dry-film resist lamination OmniSpray and NanoSpray coating Top-to-bottom side alignment inspection UV-NIL, hot embossing and Micro Contact Printing (µ-CP) Metrology tasks like CD-, Box-in-Box- or Overlay measurement Customer Support We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries. We are always prepared for new challenges. EVG Services Key Benefits Field Service On-Site Visits • Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards • Immediate assistance by factory trained, certified field service engineers • On call support • Equipment relocation • Worldwide service through our subsidiaries and partners • Certified engineers are taking care of all equipment related issues • Engineers' long-term experience and technology expertise • ISO certification ensures consistent high quality Technical Support • Remote diagnostics and trouble shooting via secure internet line, phone and e-mail • Assistance with spare part number research • Access to Best Known Methods (BKM's) and trouble shooting advise • Expert help from experienced Senior Engineers • Guaranteed fast response time Spare Parts • Recommended spare parts packages • Guaranteed lead times • Regional spare part stocks • Parts repair and refurbishment servces • Consignment stock options • Cost optimization through parts repair, refurbishment or new parts replacement • Customized spare part packages • Short lead times due to customized spare part stocking options Upgrades • Off the shelf upgrades for additional features and performance enhancement • Tailored soft- and hardware upgrades based on your requirements • Performance enhancement based on your actual production needs • Customized solutions for new challenges Product Training • Worldwide distributed training locations • Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers. • Optimum uptime and tool performance through EV Group certified operators and maintenance personnel Extended Equipment Warranty • Includes spare parts and labor • Set costs with priority support Process Development and Services With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initial development until the final integration at the customers' site. Featuring state-of-the-art cleanrooms and a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas. These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes. The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer´s unique and challenging requirements - at any stage of the development process. EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct smallvolume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition. In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing, fast-paced environment by enabling a shorter time to market, easing integration headaches and eliminating the risk to schedule across multiple industries and applications. This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled worldclass process and technology expertise. ...etc. EVG Process Expertise RIE, DRIE Resist Coating Spin/Spray Wafer & Template Fabrication Substrate Cleaning Substrate Bonding for SOI Nanoimprint Lithography Resist Lift-Off Metallization Wafer Dicing Thinning, CMP Wafer Bonding CVD, LPCVD, PVD,... Resist Developing Plasma Activation Temporary Bonding/ Debonding Stress Relief Etching Chip-toWafer Bonding Oxidation Wafer Bumping & Redistribution EVG Processes EVG Applications Lab Electroplating Wet Etching Proximity Lithography Alignment Verification Bond Alignment Quality Assurance Process Recipe Setup on an EVG GEMINI® System Solutions for PERMANENT WAFER BONDING The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing installed base of more than 800 bond chambers. Regarding systems applying low-contact forces under room temperature at outmost clean conditions, EV Group is also leading the market. EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers. As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems. Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices. EVG®500 Bond series chamber EVG®560 Automated Wafer Bonding System up to 300 mm Solutions for TEMPORARY WAFER BONDING Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers. The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spinon polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing. SUPPORTED WAFER BONDING STEPS • Permanent wafer bonding and chip-to-wafer bonding • Thermal and UV cured bonding interfaces • Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp™ plasma activated bonding • Face-to-face SmartView®, backside, IR and transparent bond alignment • Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates • Debonding of thin wafers from carrier substrates • Void and alignment inspection • ComBond technology: room temperature bonding, oxide-free conductive interface • High vacuum encapsulation Application Examples Advanced Lithography EV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products. 2 µm 80 µm SU-8 resist features with sidewall angles approaching 90° Courtesy of DALSA Corporation Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG 100 µm Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM 500 µm Patterned, spray coated resist layer in anisotropically etched cavity Courtesy of TU-Delft DIMES 10 µm High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT 3 µm thick resist with 0.5 µm line/ space exposed using DUV setup Source: EVG SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced development Source: EVG Nanoimprint Lithography (NIL) Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes. 200 µm 50 nm resolution pattern utilizing UV-NIL Courtesy of Quantiscript Inc. 1 mm 20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymers Source: EVG Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG 20 µm 3-D honeycomb anti-reflective layer imprinted using SmartNILTM Courtesy of FHG ISE 10 µm Biological sample interacting with directly imprinted functional array Courtesy of FH Wels 20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO 2 µm 100 nm resolution lines replicated using SmartNILTM Source: EVG Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG MASK ALIGNMENT SYSTEMS EVG®610 Semi-Automated Mask Alignment System up to 200 mm EVG®620NT Automated Mask Alignment System up to 150 mm EVG®620 Semi-Automated Mask Alignment System up to 150 mm EVG®6200∞ Automated Mask Alignment System up to 200 mm EVG®620HBL Automated Mask Alignment System up to 150 mm LITHOGRAPHY TRACK SYSTEMS EVG®6200NT Semi-Automated Mask Alignment System up to 200 mm IQ Aligner® Automated Mask Alignment System up to 300 mm HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm HERCULES®L Lithography Track System resist processing & expose configuration up to 300 mm EVG®120 Automated Resist Processing System up to 200 mm EVG®150 Automated Resist Processing System up to 200 mm RESIST PROCESSING SYSTEMS EVG®101 Advanced Resist Processing System up to 300 mm EVG®150 Automated Resist Processing System up to 300 mm EVG®105 Bake Module up to 300 mm EVG®101LA Large Area Coating System for > 300 mm EVG®150N Automated NanoSpray Coating System up to 300 mm EVG®150LA Large Area Resist Processing System > 300 mm EVG®150XT Automated Resist Processing System up to 300 mm NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNILTM, µ-CP, HE) EVG®610 Semi-Automated EVG®620 Semi-Automated UV-NIL, µ-CP System UV-NIL, µ-CP System up to 150 mm up to 150 mm HERCULES®NIL Integrated UV-NIL Track System up to 200 mm EVG®620(0)NT Semi-Automated UV-NIL, µ-CP System up to 150/200 mm EVG®770 Automated NIL Stepper up to 300 mm EVG®6200∞ Semi-Automated UV-NIL, µ-CP System up to 200 mm EVG®510HE Semi-automated Hot Embossing System up to 200 mm IQ Aligner® Automated UV-NIL, µ-CP System up to 300 mm EVG®520HE Semi-automated Hot Embossing System up to 200 mm EVG®720(0) Automated UV-NIL System up to 150/200 mm EVG®750 Automated Hot Embossing System up to 200 mm EVG®7200 LA Semi-Automated Large-Area SmartNILTM System up to 370 x 470 mm (Gen 2) EVG®750R2R Automated Roll-to-Roll Hot Embossing System INSPECTION SYSTEMS EVG®40 Semi-automated Top-to-Bottom Side Measurement System up to 200 mm EVG®40NT Automated Measurement System up to 200 mm EVG®40NT Semi-Automated Measurement System up to 300 mm EVG®40NT Automated Measurement System up to 300 mm WAFER BONDING SYSTEMS EVG®501 Wafer Bonding System up to 200 mm EVG®510 Semi-automated Wafer Bonding System up to 200 mm EVG®520IS Semi-automated Wafer Bonding System up to 200 mm EVG®540 Automated Wafer Bonding System up to 300 mm EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm EVG®560 Automated Wafer Bonding System up to 200 mm EVG®560 Automated Wafer Bonding System up to 300 mm ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm EVG®6200∞ Semi-Automated Bond Alignment System up to 200 mm SmartView®NT Automated Bond Alignment System for Universal Alignment up to 300 mm GEMINI®FB Automated Production Fusion Bonding System up to 200 mm GEMINI®FB Automated Production Fusion Bonding System up to 300 mm BOND ALIGNMENT SYSTEMS EVG®610 Semi-automated Bond Alignment System up to 200 mm EVG®620 Semi-Automated Bond Alignment System up to 150 mm INTEGRATED BONDING SYSTEMS GEMINI® Automated Production Wafer Bonding System up to 200 mm GEMINI® Automated Production Wafer Bonding System up to 300 mm SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS EVG®301 Semi-automated Single Wafer Cleaning System up to 300 mm EVG®320 Automated Single Wafer Cleaning System up to 300 mm EVG®810LT LowTemp™ Plasma Activation System up to 300 mm EVG®850LT Automated Production Bonding System for SOI and Direct Wafer Bonding up to 200 mm EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bonding up to 300 mm TEMPORARY BONDING and DEBONDING SYSTEMS EVG®805 Semiautomated Debonding System up to 300 mm EVG®820 Lamination System up to 300 mm EVG®850TB Automated Temporary Bonding System up to 300 mm EVG®850TBL Automated Temporary Bonding System with integrated Lamination System up to 300 mm EVG®850DB Automated Debonding System up to 300 mm EVG®850TB XT Frame Automated Bonding System EVG®850DB XT Frame Automated Debonding System up to 300 mm INSPECTION SYSTEMS EVG®20 IR Inspection Station up to 200 mm EVG®50 Automated Metrology System up to 300 mm Application Examples The different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate. Product Wafer Adhesive Carrier Wafer Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG 8-layer direct bond cross-section Courtesy of MIT SOI wafers produced utilizing SmartCut® technology Courtesy of Soitec Glass-frit bond interface Courtesy of ST Microelectronics Ziptronix direct bond Interconnect Courtesy of Ziptronix Metal/Adhesive via first 3D bonding Interface Courtesy of RPI 200 mm chip-to-wafer bond Courtesy of Datacon Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED) Si Amorphous layer Bond Interface Si Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG Markets The key below denotes each systems' market applicability. MEMS Advanced Packaging & 3D Interconnect SOI & Engineered Substrates Compound Semiconductor Nanotechnology EVG ComBond : Particle- and void-free bond Source: EVG ® ® EVG ComBond : Oxide-free, conductive interface silicon/silicon Source: EVG ® ® Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St.Florian am Inn Austria Phone: +43 7712 5311 0 Fax: +43 7712 5311 4600 E-Mail: Sales@EVGroup.com Germany EV Group E. Thallner GmbH Hartham 13 94152 Neuhaus Germany Phone: +49 8503 923 852 Fax: +49 8503 923 852 E-Mail: Sales@EVGroup.com Europe Tech Support Phone: +43 7712 5311 3000 E-Mail: TechSupportEU@EVGroup.com Japan EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa, 240-0005 Phone: +81 45 348 0665 Fax: +81 45 348 0666 E-Mail: Sales@EVGroup.jp Japan Tech Support Phone: +81 45 348 1237 (Yokohama) Phone: +81 92 292 2100 (Fukuoka) E-Mail: TechSupportJP@EVGroup.com Korea EV Group Korea Ltd. Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-400, South Korea Phone: +82 2 3218 4400 Fax: +82 2 3218 4401 E-Mail: Sales@EVGroup.co.kr North America EV Group Inc. 7700 South River Parkway Tempe, AZ 85284 Phone: +1 480 305 2400 Fax: +1 480 305 2401 E-Mail: SalesUS@EVGroup.com EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY 12203 E-Mail: SalesUS@EVGroup.com North America Tech Support Phone: +1 800 384 8794 E-Mail: TechSupportUS@EVGroup.com Taiwan Sales EVG-JOINTECH CORP. No. 400, Hwang-Pei Road Chung-Li City, 32070 Phone: +886 3 280 5680 Fax: +886 3 280 5689 E-Mail: Sales@EVG-Jointech.com.tw Taiwan Customer Support EV Group Taiwan Ltd. North Office: No. 400, Hwang-Pei Road Chung-Li City, 32070 South Office: Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, 74147 Phone: +886 3 426 7900 Fax: +886 3 426 7920 (North Office) Fax: +886 3 426 7917 (South Office) E-Mail: CustomerSupportTW@EVGroup.com China EV Group China Ltd. Room 3312 - 3316, Building No. 3, No. 498 Guo Shou Jing Road, Zhangjiang High-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai 201203 Phone: +86 21 3899 4800 Fax: +86 21 3899 4801 E-Mail: Sales@EVGroup.cn E-Mail: ServiceCN@EVGroup.com Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words “EVG” or “EV Group” or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpin™, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®, HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™, NanoSpray™, NIL-COM®, NILPhotonics™, OmniSpray®, SmartEdge®, SmartNIL™, SmartView®, The Triple “i” Company Invent-Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners. Printed on paper from sustainable sources © EV Group (EVG). All rights reserved. V03/16 Global Locations