EV Group
Product Range
Commitment Without Borders
Corporate Headquarters
EVG Subsidiaries
EVG Japan
EVG Korea
EVG North America
EVG Taiwan
EVG China
Our highly qualified employees are part of a worldwide network.
Solutions for
LITHOGRAPHY
Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago,
EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing.
The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities
of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of
EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems,
and are complemented by its metrology tools for top-to-bottom side alignment verification.
Other important advancements by EV Group in the lithography space include the company's special resist coating technologies OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over
high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately,
they enable customers to realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for costeffective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UVnanoimprint lithography (UV-NIL) and hot-embossing systems.
Today, the company holds the dominant market share in these promising technologies.
EVG®150 Automated Resist Processing System up to 300 mm
IQ Aligner® Automated Mask Aligner System up to 300 mm
SUPPORTED LITHOGRAPHY PROCESS STEPS
• Top and bottom side mask alignment both
near-ultraviolet (NUV) or deep-ultraviolet (DUV)
in proximity and contact exposure mode
• Spin coating and resist development
•
•
•
•
•
Dry-film resist lamination
OmniSpray and NanoSpray coating
Top-to-bottom side alignment inspection
UV-NIL, hot embossing and Micro Contact Printing (µ-CP)
Metrology tasks like CD-, Box-in-Box- or Overlay measurement
Customer Support
We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits.
Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries.
We are always prepared for new challenges.
EVG Services
Key Benefits
Field Service On-Site Visits
• Preventive maintenance and repair carried out in
accordance with EV Group's high-quality standards
• Immediate assistance by factory trained, certified
field service engineers
• On call support
• Equipment relocation
• Worldwide service through our subsidiaries
and partners
• Certified engineers are taking care of all
equipment related issues
• Engineers' long-term experience and
technology expertise
• ISO certification ensures consistent
high quality
Technical Support
• Remote diagnostics and trouble shooting via secure
internet line, phone and e-mail
• Assistance with spare part number research
• Access to Best Known Methods (BKM's)
and trouble shooting advise
• Expert help from experienced
Senior Engineers
• Guaranteed fast response time
Spare Parts
• Recommended spare parts packages
• Guaranteed lead times
• Regional spare part stocks
• Parts repair and refurbishment servces
• Consignment stock options
• Cost optimization through parts repair,
refurbishment or new parts replacement
• Customized spare part packages
• Short lead times due to customized
spare part stocking options
Upgrades
• Off the shelf upgrades for additional features
and performance enhancement
• Tailored soft- and hardware upgrades
based on your requirements
• Performance enhancement based on
your actual production needs
• Customized solutions for new challenges
Product Training
• Worldwide distributed training locations
• Standardized modules for operation, maintenance &
process training from novice to expert level available
on-site and at EV Group training centers.
• Optimum uptime and tool performance
through EV Group certified operators and
maintenance personnel
Extended Equipment Warranty
• Includes spare parts and labor
• Set costs with priority support
Process Development
and Services
With state-of-the-art application labs
based at its headquarters in Austria,
as well as in the U.S. and Japan, EV Group
(EVG) is focused on delivering superior
process expertise to its growing
global customer base - from the initial
development until the final integration
at the customers' site.
Featuring state-of-the-art cleanrooms
and a highly experienced staff of process
and application engineers, the company's
process development business unit
works hand in hand with customers on a
number of areas.
These advanced process development
and application labs are designed to
accommodate independent research work
to explore and develop baseline processes
that will open up new market opportunities.
This includes working with key partners,
like material suppliers, to develop and
optimize new processes and capabilities.
Case in point, EV Group's ongoing
relationship with Brewer Science, who
by working closely together, have
demonstrated temporary wafer bonding
capabilities for a wide range of backside
processes.
The company's application labs provide
demonstrations of its various products for
potential customers looking to leverage
EV Group's
extensive line up of
advanced wafer processing solutions for
semiconductor, MEMS and nanotechnology
markets.
Furthermore, our labs provide process
development support for custom
applications to address customer´s unique
and challenging requirements - at any
stage of the development process.
EV Group's process development team
works
with
customers
needing
"demonstrator" parts for their respective
customer-specific requirements.
As a result, EV Group's multiple application
labs are equipped to conduct smallvolume pilot line runs to simulate an
actual production line process, when
necessary. This is very advantageous,
especially for those customers with
extremely complex demands - ensuring
seamless process capability that suits
all parties ahead of time and ultimately puts
EV Group's customers a step ahead of the
competition.
In all, these advanced labs provide
customized tooling capabilities - enabling
EV Group's customers to effectively
compete in today's ever-changing,
fast-paced environment by enabling a
shorter time to market, easing integration
headaches and eliminating the risk to
schedule across multiple industries and
applications.
This is the passion and commitment that
makes EV Group a value-added partner
and why companies demanding nothing
less than the best continue to turn to
EV Group for its unparalleled worldclass process and technology expertise.
...etc.
EVG Process Expertise
RIE,
DRIE
Resist
Coating
Spin/Spray
Wafer &
Template
Fabrication
Substrate
Cleaning
Substrate
Bonding
for SOI
Nanoimprint
Lithography
Resist
Lift-Off
Metallization
Wafer
Dicing
Thinning,
CMP
Wafer
Bonding
CVD,
LPCVD,
PVD,...
Resist
Developing
Plasma
Activation
Temporary
Bonding/
Debonding
Stress
Relief
Etching
Chip-toWafer
Bonding
Oxidation
Wafer
Bumping &
Redistribution
EVG Processes
EVG Applications Lab
Electroplating
Wet
Etching
Proximity
Lithography
Alignment
Verification
Bond
Alignment
Quality Assurance
Process Recipe Setup on an
EVG GEMINI® System
Solutions for
PERMANENT WAFER BONDING
The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately
revolutionized the market.
Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process
standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing installed base of more than 800 bond chambers. Regarding systems applying low-contact forces under room temperature at outmost
clean conditions, EV Group is also leading the market.
EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as
a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI
Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond
Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers.
As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D
wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this
technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was
the first to market with 300 mm wafer bonding systems.
Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS
packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables
covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration
of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and
indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium
tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices.
EVG®500 Bond series chamber
EVG®560 Automated Wafer Bonding System up to 300 mm
Solutions for
TEMPORARY WAFER BONDING
Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to
address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers.
The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spinon polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal
design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a
highly reliable debonding step following complete front and backside processing.
SUPPORTED WAFER BONDING STEPS
• Permanent wafer bonding and chip-to-wafer bonding
• Thermal and UV cured bonding interfaces
• Anodic, glass-frit, metal-diffusion, eutectic,
silicon-direct, polymer bonding, and LowTemp™
plasma activated bonding
• Face-to-face SmartView®, backside, IR and
transparent bond alignment
• Temporary bonding to carrier substrates with
spin-on polymers or dry-film laminates
• Debonding of thin wafers from carrier substrates
• Void and alignment inspection
• ComBond technology: room temperature bonding,
oxide-free conductive interface
• High vacuum encapsulation
Application Examples
Advanced Lithography
EV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
2 µm
80 µm SU-8 resist features with
sidewall angles approaching 90°
Courtesy of DALSA Corporation
Through-silicon-via (TSV) structure
conformally coated utilizing
NanoSpray Technology
Source: EVG
100 µm
Sub-µm high-aspect ratio structures
created with DUV-Lithography
Courtesy of CEETAM
500 µm
Patterned, spray coated resist layer
in anisotropically etched cavity
Courtesy of TU-Delft DIMES
10 µm
High-Q-3D solenoid inductors
for RF ICs Courtesy of SIMIT
3 µm thick resist with 0.5 µm line/
space exposed using DUV setup
Source: EVG
SU-8 structures 470 µm high,
developed in PGMEA with
megasonic-enhanced development
Source: EVG
Nanoimprint Lithography (NIL)
Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures.
It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
200 µm
50 nm resolution pattern utilizing
UV-NIL
Courtesy of Quantiscript Inc.
1 mm
20 µm Topas hot embossed micro
fluidic structures utilizing soft
working stamp polymers
Source: EVG
Wafer-level micro-lens arrays
created utilizing UV-NIL
Source: EVG
20 µm
3-D honeycomb anti-reflective layer
imprinted using SmartNILTM
Courtesy of FHG ISE
10 µm
Biological sample interacting with
directly imprinted functional array
Courtesy of FH Wels
20 nm wide 3D structure produced
utilizing Soft UV-NIL
Courtesy of AMO
2 µm
100 nm resolution lines replicated
using SmartNILTM
Source: EVG
Fully populated 6” Si substrate
imprinted on EVG®720
Source: EVG
MASK ALIGNMENT SYSTEMS
EVG®610 Semi-Automated
Mask Alignment System
up to 200 mm
EVG®620NT Automated
Mask Alignment System
up to 150 mm
EVG®620 Semi-Automated
Mask Alignment System
up to 150 mm
EVG®6200∞ Automated
Mask Alignment System
up to 200 mm
EVG®620HBL Automated
Mask Alignment System up
to 150 mm
LITHOGRAPHY TRACK SYSTEMS
EVG®6200NT Semi-Automated
Mask Alignment System
up to 200 mm
IQ Aligner® Automated
Mask Alignment System
up to 300 mm
HERCULES® Lithography Track System
coat, UV-exposure and develop modules
up to 300 mm
HERCULES®L Lithography Track System
resist processing & expose configuration
up to 300 mm
EVG®120 Automated Resist
Processing System
up to 200 mm
EVG®150 Automated
Resist Processing System
up to 200 mm
RESIST PROCESSING SYSTEMS
EVG®101 Advanced
Resist Processing
System up to 300 mm
EVG®150 Automated
Resist Processing System
up to 300 mm
EVG®105 Bake
Module
up to 300 mm
EVG®101LA Large Area Coating System
for > 300 mm
EVG®150N Automated
NanoSpray Coating System
up to 300 mm
EVG®150LA Large Area Resist
Processing System
> 300 mm
EVG®150XT Automated
Resist Processing System
up to 300 mm
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNILTM, µ-CP, HE)
EVG®610 Semi-Automated EVG®620 Semi-Automated
UV-NIL, µ-CP System
UV-NIL, µ-CP System
up to 150 mm
up to 150 mm
HERCULES®NIL Integrated
UV-NIL Track System
up to 200 mm
EVG®620(0)NT Semi-Automated
UV-NIL, µ-CP System
up to 150/200 mm
EVG®770 Automated
NIL Stepper
up to 300 mm
EVG®6200∞ Semi-Automated
UV-NIL, µ-CP System
up to 200 mm
EVG®510HE Semi-automated
Hot Embossing System
up to 200 mm
IQ Aligner® Automated
UV-NIL, µ-CP System
up to 300 mm
EVG®520HE Semi-automated
Hot Embossing System
up to 200 mm
EVG®720(0) Automated
UV-NIL System
up to 150/200 mm
EVG®750 Automated
Hot Embossing System
up to 200 mm
EVG®7200 LA Semi-Automated
Large-Area SmartNILTM System
up to 370 x 470 mm (Gen 2)
EVG®750R2R Automated
Roll-to-Roll Hot Embossing System
INSPECTION SYSTEMS
EVG®40 Semi-automated
Top-to-Bottom Side Measurement
System up to 200 mm
EVG®40NT Automated
Measurement System
up to 200 mm
EVG®40NT Semi-Automated
Measurement System
up to 300 mm
EVG®40NT Automated
Measurement System
up to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer
Bonding System
up to 200 mm
EVG®510 Semi-automated
Wafer Bonding System
up to 200 mm
EVG®520IS Semi-automated
Wafer Bonding System
up to 200 mm
EVG®540 Automated
Wafer Bonding System
up to 300 mm
EVG®540C2W Automated
Wafer & Chip-to-Wafer Bonding
System up to 300 mm
EVG®560 Automated
Wafer Bonding System
up to 200 mm
EVG®560 Automated
Wafer Bonding System
up to 300 mm
ComBond® Automated High-Vacuum
Wafer Bonding System
up to 200 mm
EVG®6200∞ Semi-Automated
Bond Alignment System
up to 200 mm
SmartView®NT Automated Bond
Alignment System for Universal
Alignment up to 300 mm
GEMINI®FB Automated Production
Fusion Bonding System
up to 200 mm
GEMINI®FB Automated Production
Fusion Bonding System
up to 300 mm
BOND ALIGNMENT SYSTEMS
EVG®610 Semi-automated
Bond Alignment System
up to 200 mm
EVG®620 Semi-Automated
Bond Alignment System
up to 150 mm
INTEGRATED BONDING SYSTEMS
GEMINI® Automated Production Wafer
Bonding System
up to 200 mm
GEMINI® Automated Production
Wafer Bonding System
up to 300 mm
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
EVG®301 Semi-automated
Single Wafer Cleaning System
up to 300 mm
EVG®320 Automated Single
Wafer Cleaning System
up to 300 mm
EVG®810LT LowTemp™
Plasma Activation System
up to 300 mm
EVG®850LT Automated Production Bonding
System for SOI and Direct Wafer Bonding
up to 200 mm
EVG®850 Automated Production Bonding
System for SOI and Direct Wafer Bonding
up to 300 mm
TEMPORARY BONDING and DEBONDING SYSTEMS
EVG®805 Semiautomated
Debonding System
up to 300 mm
EVG®820
Lamination System
up to 300 mm
EVG®850TB Automated Temporary
Bonding System
up to 300 mm
EVG®850TBL Automated Temporary Bonding
System with integrated Lamination System
up to 300 mm
EVG®850DB Automated
Debonding System
up to 300 mm
EVG®850TB XT Frame Automated Bonding System
EVG®850DB XT Frame Automated Debonding System
up to 300 mm
INSPECTION SYSTEMS
EVG®20
IR Inspection Station
up to 200 mm
EVG®50 Automated
Metrology System
up to 300 mm
Application Examples
The different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as
diversified as the markets from which these applications originate.
Product Wafer
Adhesive
Carrier Wafer
Cross-section of temporary bond
utilizing Brewer Science®'s HT
series adhesive Source: EVG
8-layer direct bond cross-section
Courtesy of MIT
SOI wafers produced utilizing
SmartCut® technology
Courtesy of Soitec
Glass-frit bond interface
Courtesy of ST Microelectronics
Ziptronix direct bond Interconnect
Courtesy of Ziptronix
Metal/Adhesive via first 3D bonding
Interface Courtesy of RPI
200 mm chip-to-wafer bond
Courtesy of Datacon
Sub 0.5 µm aligned, bonded color
filter Courtesy of MicroEmissive
Displays (MED)
Si
Amorphous
layer
Bond Interface
Si
Cross-section SEM image of an
InP/GaAs wafer pair bonded using
a Au:Sn eutectic wafer bonding
process Source: EVG
Scanning Acoustic Microscope
(SAM) image of an InP/GaAs wafer
pair bonded using a Au:Sn eutectic
wafer bonding process
Source: EVG
Markets
The key below denotes each systems' market applicability.
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
Nanotechnology
EVG ComBond :
Particle- and void-free bond
Source: EVG
®
®
EVG ComBond : Oxide-free,
conductive interface silicon/silicon
Source: EVG
®
®
Headquarters
Worldwide Sales and Customer Support
EV Group Europe & Asia/Pacific GmbH
DI Erich Thallner Strasse 1
4782 St.Florian am Inn
Austria
Phone:
+43 7712 5311 0
Fax:
+43 7712 5311 4600
E-Mail:
Sales@EVGroup.com
Germany
EV Group
E. Thallner GmbH
Hartham 13
94152 Neuhaus
Germany
Phone:
+49 8503 923 852
Fax:
+49 8503 923 852
E-Mail:
Sales@EVGroup.com
Europe Tech Support
Phone:
+43 7712 5311 3000
E-Mail:
TechSupportEU@EVGroup.com
Japan
EV Group Japan KK
Yokohama Business Park East Tower 1F
134, Godo-cho, Hodogaya-ku,
Yokohama-shi, Kanagawa, 240-0005
Phone:
+81 45 348 0665
Fax:
+81 45 348 0666
E-Mail:
Sales@EVGroup.jp
Japan Tech Support
Phone:
+81 45 348 1237 (Yokohama)
Phone:
+81 92 292 2100 (Fukuoka)
E-Mail:
TechSupportJP@EVGroup.com
Korea
EV Group Korea Ltd.
Room 503, Seokun Tower, 178, Pangyoyeok-ro,
Bundang-gu, Seongnam-si, Gyeonggi-do,
463-400, South Korea
Phone:
+82 2 3218 4400
Fax:
+82 2 3218 4401
E-Mail:
Sales@EVGroup.co.kr
North America
EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284
Phone:
+1 480 305 2400
Fax:
+1 480 305 2401
E-Mail:
SalesUS@EVGroup.com
EV Group Inc.
100 Great Oaks Blvd; Suite #119
Albany, NY 12203
E-Mail:
SalesUS@EVGroup.com
North America Tech Support
Phone:
+1 800 384 8794
E-Mail:
TechSupportUS@EVGroup.com
Taiwan Sales
EVG-JOINTECH CORP.
No. 400, Hwang-Pei Road
Chung-Li City, 32070
Phone:
+886 3 280 5680
Fax:
+886 3 280 5689
E-Mail:
Sales@EVG-Jointech.com.tw
Taiwan Customer Support
EV Group Taiwan Ltd.
North Office:
No. 400, Hwang-Pei Road
Chung-Li City, 32070
South Office:
Rm203, NO.12, Nanke 2nd RD, Xinshi Dist.,
Tainan City, 74147
Phone:
+886 3 426 7900
Fax:
+886 3 426 7920 (North Office)
Fax:
+886 3 426 7917 (South Office)
E-Mail:
CustomerSupportTW@EVGroup.com
China
EV Group China Ltd.
Room 3312 - 3316, Building No. 3,
No. 498 Guo Shou Jing Road, Zhangjiang
High-Tech Park, Pudong New Area,
Shanghai, PR China, Shanghai 201203
Phone:
+86 21 3899 4800
Fax:
+86 21 3899 4801
E-Mail:
Sales@EVGroup.cn
E-Mail:
ServiceCN@EVGroup.com
Data, design and specifications may not simultaneously apply; or depend on individual
equipment configuration, process conditions and materials and may vary accordingly.
EVG reserves the right to change data, design and specifications without prior notice.
All trademarks, logos, website addresses or equipment names that contain the letters or
words “EVG” or “EV Group” or any combination thereof, as well as the following names and
acronyms are registered trademarks and/or the property of EV Group: ComBond®,
CoverSpin™, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®,
HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™,
NanoSpray™, NIL-COM®, NILPhotonics™, OmniSpray®, SmartEdge®, SmartNIL™,
SmartView®, The Triple “i” Company Invent-Innovate-Implement®, Triple i®. Other
product and company names may be registered trademarks of their respective owners.
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