Product Selector
EPON™ and EPI-REZ™ Epoxy Resins
Our Products for
America (North and South)
Qualifying a resin system that
offers the best balance of
performance and processability
can be a significant challenge. You
not only need quality products
from a reliable supplier, you need
a company that is willing to share
its technical expertise and that will
provide services to help satisfy your
unique requirements. That’s where
Momentive Specialty Chemicals
Inc. (Momentive) comes in.
We are the Epoxy Business of
Momentive, one of the world’s leading
suppliers of epoxy resins, curing agents,
modifiers and epoxy systems. We offer
a diverse line of epoxy resins that vary
in chemical structure, molecular weight,
viscosity and functionality—providing the
formulator with a multitude of options.
What’s more, our products have over
sixty years of innovation and success in
a wide variety of markets and end-use
applications.
At our world-class technology centers
in the U.S., Europe and Asia Pacific
we pursue advanced processing
technologies while creating new resin
products and systems with broad
performance ranges. We bring you
processing advantages such as easy
workability at room temperature with
variable cure rates, and help you create
products with special characteristics
such as flexibility, good chemical
and water resistance, and superior
performance in elevated temperature
service. By continually tackling
technical challenges in our application
laboratories, we are able to translate
real world requirements into high quality,
production-oriented materials.
optimizing processability and strength
retention at elevated temperatures.
Key Benefits
EPON resins, in thermoset systems
with our curing agents and modifiers,
offer advantages such as:
■■
Low room temperature viscosity
■■
Long working life
■■
Low moisture absorption
■■
Superior epoxy performance
■■
Flexibility
■■
Reactivity
■■
High elongation
■■
Adjustable cure times
■■
Good chemical and corrosion
resistance
■■
Heat resistance
■■
Fire retardance
The EPON™ and EPI-REZ™ families
of resins were developed to provide
superior overall performance in a variety
of end-use applications. These products
enable manufacturers to achieve nearly
any desired performance level, while
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At A Glance
EPON™ – Liquid Epoxy Resins and Blends
6 -7
This segment of our product line represents the most widely used
products in a number of industries. The most commonly used EPON
Resin/V. C. Heloxy™ Modifier blends are available in several types and
viscosity grades.
EPON – Epoxy Resin Solutions
8 - 10
These products are higher molecular weight standard or modified
epoxies which are dissolved in solvent to allow easier handling and
formulation because of lower viscosity.
EPON – Solid and Powder Grade Resins
10 - 11
These epoxy resins are in the molecular weight range most suitable for
use in epoxy solutions, powder coating, composite and electronic
applications. These products have a good balance of properties,
including appropriate epoxy functionality for proper curing, good
physical stability (sintering resistance), and good melt flow (low melt
viscosity).
EPON – Epoxy Novolac Resins
12
These products are specifically designed to provide increased levels of
thermal stability and chemical resistance, and are used in composites,
structural adhesives, electronics / electrical and coating applications.
EPON – Epoxy Polyacrylates
13
These are very low viscosity resins possessing excellent wetting
characteristics and rapid reaction rates with amine curatives over a
broad temperature range.
EPON – Elastomer Modified Epoxy Resins
13
These products offer improved adhesive properties, thermal shock
resistance and toughness, with good fatigue resistant properties.
EPONEX™ – Cycloaliphatic Resin
13
This segment offers a low viscosity liquid epoxy based on hydrogenated
Bisphenol A for applications requiring UV resistance.
EPON and EPONOL™ – Electrical Laminating Resins
14
These products can be used to obtain fire retardance in a base epoxy
resin formulation. The ultra-high molecular weight resin can be used to
improve flexibility and modify the flow properties of the system.
EPON and EPIKOTE™ – Epoxy Resins for Composites
14
Epoxy resins that provide the property retention, toughness and
corrosion protection required in composite applications.
■
EPI-REZ™ – Epoxy Waterborne Resins
15
These non-ionic aqueous dispersions of our epoxy resins provide
benefits such as lower VOC, extended pot life, high crosslink density,
high temperature performance, very good chemical resistance, B-stage
capability, low color, and complete water-reducibility. Many of the
Momentive EPIKURE™ Curing Agents can be used with these epoxy
dispersions. In addition, since dicyandiamide is water soluble, it may be
used to provide extended pot life formulations.
2
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The Formulator’s Choice
All of our products are manufactured to high standards of quality and have very
specific property ranges. To help you assess the many production and performance
advantages of Momentive’s complete line of resins, we’ve summarized typical
properties and resin characteristics in this product bulletin. The data in this bulletin is
intended to give only basic product information for quick reference—individual product
technical data sheets with additional information are available for most of the products
listed in the following pages. For additional information about these products, or to
contact us, visit the Epoxy, Curing Agents and Modifiers section of the Momentive
website at www.momentive.com/epoxy
Resin Solution Coding System
Epoxy resins employ a simple three-part coding system for designating the
composition of resin solutions. The coding system consists of a number indicating
the epoxy resin used in the particular solution, followed by one or more letters that
describe the solvent or combination of solvents used to make up the solution. The last
two numbers indicate the percent solids (by weight) of the composition. For example:
EPON™ Resin 1001-H-75
In this example, the base resin used to make this solution is the EPON Resin 1001F
type. The solvent used is Propylene Glycol Monomethyl Ether (PM), as shown in the
next table, and the solids content is 75 percent by weight.
The coding system that is used to designate the solvents in resin solutions is shown
on the next table (pg 5):
3
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Solvent Coding System
Letter
Code
Solvent Name
A
Acetone
B
Methyl Ethyl Ketone
Abbr
Non HAPS 1
VOC Exempt 2
Yes
Yes
MEK
Yes
C
Methyl Isobutyl Ketone
MIBK
D
Diacetone Alcohol
DAA
Yes
E
Isopropyl Alcohol
IPA
Yes
F
n-Butyl Alcohol (Converting to Code "N")
NBA
Yes
G
n-Butyl Acetate
NBAC
Yes
H
Propylene Glycol Monomethyl Ether
PGMME / PM
Yes
I
iso-Butyl Alcohol
J
Ethyl 3-Ethoxy Propionate
Yes
EEP
K
t-Butyl Acetate
TBAC
Yes
L
Propylene Glycol Mono n-Butyl Ether
PGMnBE / PnB
Yes
M
Ethylene Glycol Monobutyl Ether
EGMBE / EB
Yes
N
n-Butyl Alcohol
NBA
Yes
O
Methyl n-Amyl Ketone
MNAK
Yes
P
n-Propyl Alcohol
NPA
Yes
Yes
Q
Propylene Glycol Monomethyl Ether Acetate
PGMMEA / PMA
R
Dimethyl Formamide
DMF
S
Cyclohexanone
Yes
Yes
T
Toluene
U
Aromatic 100
A 100
< 5% HAPS
V
Dipropylene Glycol Monomethyl Ether
DPGME
Yes
W
Water
X
Xylene
Yes
Y
Ethylene Glycol Monopropyl Ether
EGMPE / EP
1
2
Yes
HAP is the acronym for hazardous air pollutant as defined by the U.S. Clean Air Act Amendments of 1990.
VOC is the acronym for Volatile Organic Compound as defined by the U.S. 40 CFRS1.100 (s). VOC exempt solvents
are classified as such by the U.S. EPA, local state and regional air quality districts.
4
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Table 1: Typical Properties of EPON™ Unmodified Liquid Epoxy Resins
Product
Chemical Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 825
DGEBPA
50 – 65
175 –180
250
9.7
Ultra high purity, low viscosity liquid epoxy used for high solids
coatings and specialty composites.
EPON 826
DGEBPA
65 – 95
178 –186
250
9.7
Low viscosity liquid epoxy used in coatings and
composite applications.
EPON 827
DGEBPA
80 –100
179 –184
100
9.7
Medium viscosity liquid epoxy resin that falls between EPON 826
and EPON 828. It is used mainly in composite applications.
EPON 828
DGEBPA
110 –150
185 –192
250
9.7
Predominant liquid epoxy product, widely used in
multiple applications.
EPON 830
DGEBPA
170 – 225
190 –198
250
9.7
Higher molecular weight liquid epoxy.
EPON 834
DGEBPA
3.5 – 9 2
230 – 280
200
9.7
Highest molecular weight liquid epoxy used in adhesives
and as a modifier of liquid epoxy systems.
EPON 862
DGEBPF
25 – 45
165 –173
200
9.8
Low viscosity Bisphenol F liquid epoxy used alone
or in blends with other resins. Allows high solids formulations
with good chemical resistance. A high performance alternative
to diluted EPON 828 resins.
EPON 863
DGEBPF
25 – 45
165 –174
200
9.9
Comparable performance to EPON 862
with improved crystallization resistance.
1
2
Platinum-Cobalt Color Scale
70% by weight solution in Diethylene Glycol Monobutyl Ether
Table 2: Typical Properties of EPON Modified Liquid Epoxy Resins
Product
Chemical Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 824
Modified
DGEBPA
40 – 70
192 – 204
250
9.6
Liquid epoxy modified for low viscosity and may be used as
an alternative to diluted EPON 828 resins. Offers improved
crystal resistance.
EPON 829
Modified
DGEBPA
30 – 70
193 – 203
250
9.6
Liquid epoxy resin pre-catalyzed for subsequent
up-staging with BPA.
EPON 8280
Modified
DGEBPA
110 –150
185 –195
250
9.7
Anti-foaming and anti-settling modified liquid epoxy resin
for systems with fillers and pigments.
EPON 8281
Modified
DGEBPA
110 –140
182 –195
250
9.7
Anti-foaming and anti-settling modified liquid epoxy resin
for silica filled systems.
EPON 872
Modified
DGEBPA
15 – 38 2
625 – 725
10 3
9.0
Liquid epoxy modified for flexibility and toughness. Used
in applications where thermal shock or impact resistance
is important.
1
2
Platinum-Cobalt Color Scale
75% by weight solution in Xylene
3
Gardner Color Scale
5
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Table 3: Typical Properties of EPON™ Epoxy Resin Blends
Product
Chemical
Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 235
DGEBPA/
DGEBPF
60 – 80
177–182
200
9.8
Blend of BPA and BPF liquid epoxy resins.
It provides lower viscosity than standard LER
as well as improved crystallization resistance.
EPON 813
Modified
DGEBPA
5–7
180 –195
75
9.5
Liquid epoxy with HELOXY 62 –
Cresyl Glycidyl Ether, for good chemical
and crystallization resistance.
EPON 815C
Modified
DGEBPA
5–7
180 –195
250
9.4
Liquid epoxy with HELOXY 61 –
Butyl Glycidyl Ether, providing superior
wetting characteristics.
EPIKOTE™ 816
Modified
DGEBPA
1.5 – 2.1
189 – 200
200
9.4
Liquid epoxy with CARDURA E10P - glycidyl ester of
neodecanoic acid, for good pigment wetting and resistance
to filler settling. Offers good resistance to crystallization.
EPON 8112
Modified
DGEBPA
7–10
182 –190
250
9.4
Similar to EPON 815C with slightly higher viscosity.
EPON 8131
Modified
DGEBPA
11 –16
245 – 275
500
9.2
Liquid epoxy with HELOXY 505 –
Castor Oil Glycidyl Ether, for flexibility in flooring and
adhesive applications.
EPON 8132
Modified
DGEBPA
5–7
195 – 215
250
9.2
Liquid epoxy with HELOXY 8 –
Alkyl Glycidyl Ether, utilized in a broad range
of applications.
EPON CS 241
Modified
DGEBPA
22.5 – 27.5
190 – 200
250
9.6
Liquid epoxy with HELOXY 8 –
Alkyl Glycidyl Ether. A higher viscosity version
of EPON 8132.
EPON CS 242
Modified
DGEBPA
13.5 –18.5
195 – 205
50
9.4
Liquid epoxy modified with HELOXY 8 –
Alkyl Glycidyl Ether. A medium viscosity version
of EPON 8132 most often used in flooring systems.
EPON CS 243
Modified
DGEBPA
52 – 58
187–195
50
9.6
Liquid epoxy with HELOXY 8 –
Alkyl Glycidyl Ether that provides easier handling
with good overall performance.
EPON CS 377
Modified
DGEBPA
75 – 95
182 –196
200
9.6
Resin solution, 96% solids with HELOXY 65 –
p-tert-Butyl Phenyl Glycidyl Ether.
EPON 8201
Modified
DGEBPA
50 – 65
180 –195
250
9.7
Liquid epoxy with HELOXY 62 –
Cresyl Glycidyl Ether and modified for anti-settling and
anti-foaming, primarily used in highly filled systems.
1
Platinum-Cobalt Color Scale
6
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Table 4: Typical Properties of EPON™ Liquid Epoxy Solutions
Product
Chemical
Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 828-X-95
DGEBPA
Solution
15 – 45
193 – 204
2
9.5
Resin solution, 95% solids in Xylene.
EPON 834-F-90
DGEBPA
Solution
46 –148
225 – 265
3
9.3
Resin solution, 90% solids in n-Butanol.
EPON 834-X-80
DGEBPA
Solution
4.5 –18
230 – 280
3
9.2
Resin solution, 80% solids in Xylene.
EPON 834-X-90
DGEBPA
Solution
63 – 590
230 – 280
3
9.5
Resin solution, 90% solids in Xylene.
EPON 836-C-75
DGEBPA
Solution
3 – 6.5
280 – 335
3
8.9
Resin solution, 75% solids in MIBK.
EPON 8521-MX-60
Modified
DGEBPA
Solution
17.5 – 36
750 – 850
3
8.8
Modified resin solution, 60% solids in Ethylene Glycol
Monobutyl Ether/Xylene, for improved surface tension
characteristics.
EPON 872-X-75
Modified
DGEBPA
Solution
20 – 28
625 – 700
6
8.4
Modified resin solution, 75% solids in Xylene, for
applications needing flexibility and toughness.
EPON 873-CX-80
Modified
DGEBPA
Solution
4.5 – 23
380 – 420
5
8.6
Modified resin solution, 80% solids in MIBK/Xylene, for
applications needing flexibility, toughness and reduced
VOC levels.
EPON 874-B-90
Modified
DGEBPA
Solution
515 –1213
245 – 275
6
9.1
Modified resin solution, 80% solids in MEK, for
applications needing flexibility, toughness and reduced
VOC levels.
EPON 874-CX-90
Modified
DGEBPA
Solution
13 – 27
245 – 275
6
9.1
Modified resin solution, 90% solids in MIBK/Xylene, for
applications needing flexibility, toughness and reduced
VOC levels.
EPIKOTE™ 874L-X-90
Modified
DGEBPA
Solution
21 – 23
230 – 270
3
9.2
Modified resin solution, 90% solids in MIBK/Xylene, for
applications needing higher flexibiity, toughness, and
lower VOC levels
1
Gardner Color Scale
7
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Table 5: Typical Properties of EPON™ Solid Epoxy Solutions
Product
Chemical
Type
Viscosity at
25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 1001-A-80
DGEBPA
Solution
45 – 70
450 – 550
3
9.2
Resin solution, 80% solids in Acetone
(VOC Exempt).
EPON 1001-B-80
DGEBPA
Solution
27–148
450 – 550
3
9.1
Resin solution, 80% solids in MEK.
EPON 1001-CX-75
DGEBPA
Solution
27–148
450 – 550
3
9.0
Resin solution, 75% solids in MIBK/Xylene.
EPON 1001-DNT-75
DGEBPA
Solution
15 – 40
500 – 575
2
9.2
Resin solution, 75% solids in Diacetone Alcohol/
n-Butanol/Toluene
EPON 1001-FT-75
DGEBPA
Solution
27–148
450 – 600
3
9.1
Resin solution, 75% solids in n-Butanol/Toluene.
EPON 1001-G-70
DGEBPA
Solution
15 – 64
450 – 500
2
9.2
Resin solution, 75% solids in n-Butyl Acetate.
EPON 1001-H-75
DGEBPA
Solution
36 – 388
450 – 600
3
9.2
Resin solution, 75% solids in Propylene Glycol
Monomethyl Ether.
EPON 1001-K-65
DGEBPA
Solution
15 – 45
450 – 550
3
8.8
Resin solution, 65% solids in t-Butyl Acetate
(VOC-exempt).
EPON 1001-O-75
DGEBPA
Solution
27–148
450 – 550
3
9.0
Resin solution, 75% solids in MNAK.
EPON 1001-T-75
DGEBPA
Solution
36 – 388
450 – 550
3
9.1
Resin solution, 75% solids in Toluene.
EPON 1001-UY-70
DGEBPA
Solution
36 – 64
450 – 500
3
9.0
Resin solution, 70% solids in Aromatic
100/Ethylene Glycol Monopropyl Ether.
EPON 1001-X-75
DGEBPA
Solution
36 – 388
450 – 555
3
9.1
Resin solution, 75% solids in Xylene.
EPON 1004-O-65
DGEBPA
Solution
27 – 99
880 – 985
3
8.7
Resin solution, 65% solids in MNAK.
EPON 1007-CT-55
DGEBPA
Solution
23 – 64
1,600 – 2,300
3
8.4
Resin solution, 55% solids in MIBK/Toluene.
EPON 1007-FMU-50
DGEBPA
Solution
27 – 64
1,600 – 2,300
3
8.3
Resin solution, 50% solids in n-Butanol/Ethylene Glycol
Monobutyl Ether/Aromatic 100.
EPON 1007-HT-55
DGEBPA
Solution
27 – 64
1,600 –1,900
2
9.0
Resin solution, 55% solids in Propylene Glycol
Monomethyl Ether/Toluene.
EPON 1009-DU-40
DGEBPA
Solution
11 – 27
2,300 – 3,500
1
8.3
Resin solution, 40% solids in Diacetone Alcohol/
Aromatic 100.
EPON 1009-MX-40
DGEBPA
Solution
6 – 23
2,300 – 3,000
1
8.3
Resin solution, 40% solids in Ethylene Glycol
Monobutyl Ether/Xylene.
1
Gardner Color Scale
8
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Table 6: Typical Properties of EPON™ Solid Epoxy Custom Solutions
Product
Chemical
Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON CS 258
DGEBPA
Solution
40 – 65
2,250 – 2,455
1
8.9
Resin solution, 50% solids in Propylene Glycol Monomethyl Ether
Acetate.
EPON CS 267
Modified
DGEBPA
Solution
13 – 36
2,700 – 3,300
3
8.8
High molecular weight resin modified for high toughness, 65%
solids in Propylene Glycol Monomethyl Ether Acetate/Toluene.
1
Gardner Color Scale
Table 7: Typical Properties of EPON Solid Epoxy Resins – Fusion Grades
Product
Chemical
Type
Solution
Viscosity 1
at 25 °C (cP)
Weight per
Epoxide
Color2
(max)
Softening
Point °C
Melt
Viscosity
at 150 °C (P)
Comments
EPON 1001F
DGEBPA
7.0 – 9.6
525 – 550
200
79
4–5
Lowest molecular weight solid epoxy used
to provide improved toughness, flexibility, flow
control and tack. Standard resin for coatings
and pre-preg. Susceptible to sintering.
Density 1.20 g/ml.
EPON 1002F
DGEBPA
9.2 –13.6
600 – 700
200
85
12 – 25
Slightly higher molecular weight than
EPON 1001F. Better sintering resistance.
Density 1.20 g/ml.
EPON 1004F
DGEBPA
15 – 25
800 – 950
200
96
16 – 20
Medium molecular weight solid epoxy resin
containing hydroxyl groups. Often reacted
with vegetable oil acids to produce epoxy
ester resins. Can also add toughness, flexibility
and rheology control. Density 1.20 g/ml.
EPON 1007F
DGEBPA
50 –100
1,700 – 2,200
200
125
≈ 500
Moderately high molecular weight solid
epoxy resin used for industrial coatings cured
with urea-formaldehyde and phenolformaldehyde resins. Density 1.19 g/ml.
EPON 1009F
DGEBPA
100 – 250
2,300 – 3,800
200
135
> 500
High molecular weight solid epoxy resin for
baked industrial coatings cured with
urea-formaldehyde and phenol-formaldehyde
resins. Density 1.19 g/ml.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
9
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Table 8: Typical Properties of EPON™ Solid Epoxy Resins – Powder Coating and Molding Grades
Product
Chemical
Type
Solution
Viscosity 1
at 25 °C (cP)
Weight per
Epoxide
Color2
(max)
Softening
Point °C
Melt
Viscosity
at 150 °C (P)
Comments
EPON 2002
DGEBPA
10 –17
675 – 760
100
80 – 90
20 – 40
Medium low molecular weight solid epoxy resin
used primarily for thin film epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2003
DGEBPA
14 –18
725 – 825
100
90 – 95
30 – 50
Medium molecular weight solid epoxy resin used
primarily for thin or thick epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2004
DGEBPA
18 – 27
875 – 975
100
95 –105
70 –120
Medium molecular weight solid epoxy resin used
primarily for thin or thick film epoxy powder
coating applications. Density 1.19 g/ml.
EPON 2005
DGEBPA
25 – 55
1,200 –1,400
100
110 –120
> 300
Moderately high molecular weight
solid epoxy resin used primarily for intermediate
and thick film epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2014
Modified
DGEBPA
35 – 75
750 – 850
100
100 –120
200 – 600
Moderately high molecular weight solid epoxy
resin modified with epoxy phenol novolac used
primarily in high performance powder coating
applications to provide superior chemical and
corrosion resistance. Density 1.19 g/ml.
EPON 2024
Modified
DGEBPA
17 – 26
850 – 950
100
95 –105
60 –120
Medium molecular weight solid epoxy resin
modified with a flow control agent.
Density 1.2 g/ml.
EPON 2041
Modified
DGEBPA
8 –12
625 – 675
100
—
—
Medium low molecular weight solid epoxy resin
modified for improved flow.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
Table 9: Typical Properties of EPON Solid Epoxy Resins – Electrical Grade
Product
Chemical
Type
Solution
Viscosity 1
cP at 25 °C
Weight per
Epoxide
Color2
(max)
Softening
Point °C
Melt
Viscosity
at 150 °C (P)
Comments
EPON 3002
Modified
DGEBPA
7.4 – 9.5
520 – 590
500
75 – 80
6–8
Solid epoxy resin flake, modified for
low melt viscosity and high reactivity. Primarily
used for electrical encapsulation.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
10
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Table 10: Typical Properties of EPON™ and EPIKOTE™ Epoxy Novolac Resins
Product
Chemical
Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 1031
TGETPE
Flake
39 2
195 – 230
18
10.4
Tetraglycidyl Ether of Tetraphenol Ethane with a functionality
of 3.5. Used in applications requiring high temperatures and
chemical resistance.
EPON 1031-A-70
TGETPE
Solution
0.5 – 2.2
195 – 230
18
9.1
EPON 1031 solution, 70 % solids in Acetone.
EPON HPT 154-A-85
Epoxy
Phenolic
Novolac
Solution
5 –12
176 –181
2
9.0
EPON 154 solution, 85% solids in Acetone.
EPON 154
Epoxy
Phenolic
Novolac
310 – 400 3
176 –181
2
10.3
Epoxy phenolic novolac resin with a functionality of 3.6,
providing high chemical and temperature resistance, and
dimensional stability.
EPON SU-2.5
Epoxy BPA
Novolac
20 – 60 3
180 – 200
6
9.8
Epoxy Bisphenol A novolac with a functionality of 2.5,
providing good thermal stability and chemical resistance.
Used in electrical, adhesive and composite applications.
EPON SU-8
Epoxy BPA
Novolac
Flake
10 – 60 4
195 – 230
6
10.0
Epoxy Bisphenol A novolac with a functionality of 8,
providing rapid development of green strength, with good
high temperature performance. Used in electrical, adhesive
and composite applications.
EPON 160
Epoxy BPF
Novolac
345 – 485
168 –178
3
9.9
BPF epoxy novolac with a functionality of 2.6 – a low
viscosity version of EPON 154. High functionality with easy
processing, good thermal stability and chemical resistance.
EPON 161
Epoxy BPF
Novolac
180 – 280
169 –178
3
9.9
BPF epoxy novolac with a functionality of 2.5 – a lower
viscosity version of EPON 160. High functionality with easy
processing, good thermal stability and chemical resistance.
EPON 162
Epoxy BPF
Novolac
60 – 78
166 –178
3
9.9
BPF epoxy novolac with a functionality of 2.2 – the lowest
viscosity version of EPON 160. Adequate functionality with
easiest processing, yet with good thermal stability and
chemical resistance.
EPON 164
Epoxy
Cresol
Novolac
Flake
35 – 50 5
200 – 240
6
10.0
Solid epoxy cresol novolac resin with a functionality of 4.1
and is used in high performance laminates, molding
compounds, aerospace composites, special adhesives
and tooling systems.
EPON 165
Epoxy
Cresol
Novolac
Flake
100 – 200 4
200 – 230
6
10.0
Solid epoxy cresol novolac resin with a functionality of 5.5
and is used in very high performance laminates, molding
compounds, special adhesives, aerospace composites
and tooling systems.
1
Gardner Color Scale
at 120 °C
2
at 52 °C
3
4
5
at 130 °C
60% by weight solution in MEK
6
at 50 °C
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Table 11: Typical Properties of EPON™ Epoxy Polyacrylates
Product
Chemical Type
Viscosity
at 25 °C (cP)
Equivalent
Weight
Color1
(max)
Density
(lb/gal)
Comments
EPON 8021
Epoxy
Polyacrylate
85 –115
300 – 320
1
9.2
Very low viscosity epoxy diacrylate resin that imparts high
reactivity and superior wetting characteristics. 13 minute gel
time with TETA.
EPON 8111
Epoxy
Polyacrylate
800 –1,100
300 – 320
1
9.5
Low viscosity epoxy triacrylate resin that provides rapid
reaction rates. Uses include high-build sealers, wear-resistant
surfacing and low temperature cure applications. 2.5 minute
gel time with TETA.
EPON 8161
Epoxy
Polyacrylate
1,800 – 2,400
205 – 214
1
9.6
Moderate viscosity epoxy diacrylate resin with performance
similar to EPON 828. Applications include flooring, grouts,
adhesives, casting and encapsulation systems. 27 minute gel
time with TETA.
1 Gardner Color Scale
Table 12: Typical Properties of EPON Elastomer Modified Epoxy Resins
Product
Chemical Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 58005
CTBN Modified
DGEBPA
3,000 – 8,000
325 – 375
11
9.0
CTBN modified BPA epoxy resin with an elastomer content of
40%. Utilized in high performance adhesives for peel strength,
thermal shock resistance, toughness and fatigue resistance.
EPON 58006
CTBN Modified
DGEBPA
1,500 – 3,000
330 – 360
11
8.9
CTBN modified BPA epoxy resin with an elastomer content of
40%, but a slightly lower acrylonitrile level than EPON 58005.
For flexibility and fatigue resistance in adhesives and
composites.
EPON 58034
CTBN Modified
DGENPG
40 – 80
275 – 305
10
8.4
CTBN modified HELOXY 68 with an elastomer content of
50%. Used as a low viscosity and high toughness modifier
for adhesives and sealants.
EPON 58120
CTBN Modified
DGEBPA
50 – 200 2
850 –1,050
3
—
CTBN modified solid epoxy resin with an elastomer content of
20%. Used for adhesion, thermal shock, fatigue and impact
resistance in functional pipe and thick film powder coatings as
well as for electrical powders.
EPON 58901
CTBN Modified
DGEBPA
1,000 – 5,000
195 – 210
5
9.6
CTBN modified BPA epoxy resin with an elastomer content
of 5%. Provides flexibility and tack for early green strength,
and also provides flow control for adhesives, prepregs
and sealants.
1
Gardner Color Scale
2
at 150 °C
Table 13: Typical Properties of EPONEX™ Cycloaliphatic Resin
Product
Chemical Type
Viscosity
at 25 °C (cP)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPONEX 1510
Hydrogenated
DGEBPA
1,800 – 2,500
210 – 220
80
9.1
Low viscosity Cycloaliphatic Glycidyl Ether. Used to obtain
epoxy performance in coatings, electronics and specialty
composites where improved UV resistance is a requirement.
1
Platinum-Cobalt Color Scale
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Table 14: Typical Properties of EPON™ Electrical Laminating Resins
Product
Chemical
Type
Viscosity
at 25 °C (cP)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 1124-A-80
DGETBBPA
1,200 – 2,000
425 – 445
2
10.2
Acetone solution of brominated resin for flame
retardant electrical laminates. Bromine content –
19.5% by weight.
EPON 1163
DGETBBPA
100 –1,200 2
380 – 410
200 3
15.4
Low melting solid epoxy with 48% by weight bromine.
Softening point at 64 °C. Imparts fire retardancy
in laminating, casting and molding applications.
EPON CS 373
Modified
Brominated
Epoxy
100 – 600
350 – 400
3
10.0
One-pack, DICY-free, brominated epoxy resin and
curing agent solution supplied as 70% by weight
solids in a blend of Methyl Ethyl Ketone (MEK) and
Propylene Glycol Monomethyl Ether (PGME). Used
for high Tg applications at 180 °C. Bromine content –
13.5 % by weight.
1
Gardner Color Scale
2
3
at 120 °C
Platinum-Cobalt Color Scale
Table 15: Typical Properties of EPONOL™ Ultra High Molecular Weight Resin
Product
Chemical
Type
Viscosity
at 25 °C (cP)
Viscosity at
25 °C
(Gardner)
Color1
(max)
Density
(lb/gal)
Comments
EPONOL 53-BH-35
DGEBPA
600 – 3,600
U - Z2
6
7.8
Ultra high molecular weight epoxy resin used for
adhesives and prepreg laminates to impart flexibility
and to modify flow properties of the system.
1
Gardner Color Scale
Table 16: Typical Properties of EPON and EPIKOTE™ Epoxy Resins for Composites
Product
Chemical
Type
Viscosity
at 25 °C (cP)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPON 9215
DGEBPA
3,000 – 5,000
187 – 207
1
9.6
For CIPP (Cured In Place Pipe) applications where
long term physical integrity, durability and resistance
to chemical attack is needed. Typically used with
EPIKURE 9270.
1
Gardner Color Scale
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Table 17: Typical Properties of EPI-REZ™ Waterborne Epoxy Resin Dispersions
Product
Chemical
Type
Viscosity
at 25 °C (cP)
Weight per
Epoxide
pH
Density
(lb/gal)
Comments
EPI-REZ 3510-W-60
DGEBPA
Dispersion
500 – 5,000
185 – 215
2–5
9.0
Waterborne dispersion of a low molecular weight
liquid Bisphenol A epoxy resin (EPON Resin 828
type).
EPI-REZ 3515-W-60
DGEBPA
Dispersion
4,000 –15,000
225 – 275
3–6
9.2
Waterborne dispersion of a semi-solid Bisphenol A
epoxy resin.
EPI-REZ 3520-WY-55
DGEBPA
Dispersion
7,000 –17,000
485 – 555
7–9
9.1
Waterborne dispersion of a semi-solid Bisphenol A
epoxy resin (EPON 1001 type) with an organic
co-solvent. Primarily used in coatings systems
EPI-REZ 3522-W-60
DGEBPA
Dispersion
8,000 –18,000
615 – 715
7–9
9.2
Waterborne dispersion of a solid Bisphenol A epoxy
resin (EPON 1002 type). Typically used in film and
fiber adhesives and finishes, FRP, and electrical
dip coatings.
EPI-REZ 3540-WY-55
DGEBPA
Dispersion
7,000 –17,000
1,600 – 2,000
7–10
9.0
Waterborne dispersion of a solid Bisphenol A epoxy
resin (EPON 1007 type) with an organic co-solvent.
Generally used in baked industrial finishes, fiber
finishes/binders, and as a modifier for ambient cure
systems.
EPI-REZ 3546-WH-53
DGEBPA
Dispersion
1,000 –15,000
1,900 – 2,200
7–10
9.0
Waterborne dispersion of a solid Bisphenol A
epoxy resin (EPON 1007 type) similar to
EPI-REZ 3540-WY-55 with a non HAPS co-solvent.
EPI-REZ 5003-W-55
BPA Novolac
Dispersion
2,000 –15,000
195 – 215
3–5
9.2
Waterborne dispersion of an epoxidized Bisphenol
A novolac modified epoxy resin with an average
functionality of 3 (EPON SU-3 type). Promotes
wetting and adhesion to a variety of fibers and
enhances chemical resistance in coatings.
EPI-REZ 5520-W-60
DGEBPA
Dispersion
2,000 –15,000
480 – 560
3–5
9.2
Waterborne dispersion of a urethane-modified
Bisphenol A epoxy resin. Provides improved
chemical resistance and thermal performance for
fiber finishes and industrial textile applications.
EPI-REZ 5522-WY-55
DGEBPA
Dispersion
8,000 –19,000
550 – 700
7–9
9.0
Waterborne dispersion of a novolac modified
Bisphenol A epoxy resin (EPON 1002 type) with an
organic co-solvent. Used for high performance
coatings where higher chemical resistance and
corrosion protection are required.
EPI-REZ 6006-W-68
OCN Novolac
Dispersion
500 – 2,000
230 – 270
8.5 – 9.5
9.0
Waterborne dispersion of an epoxidized o-cresylic
novolac resin with an average functionality of 6.
Provides high temperature stability, abrasion and
chemical resistance in coatings, composites,
adhesive and electronic applications.
EPI-REZ 6520-WH-53
DGEBPA
Dispersion
1,000 – 6,000
500 – 600
7–9
8.9
New Gen™ Waterborne dispersion of a solid
Bisphenol A epoxy resin (EPON 1001 type) with
a non HAPS co-solvent. Provides exceptional
corrosion protection for metal substrates as
primers, DTM and topcoats.
Table 18: Typical Properties of EPI-REZ Water Reducible Epoxy Resins
Product
Chemical
Type
Viscosity
at 25 °C (P)
Weight per
Epoxide
Color1
(max)
Density
(lb/gal)
Comments
EPI-REZ WD-510
Water Red.
DGEBPA
80 –120
190 – 205
2
9.6
Water dispersible Bisphenol A epoxy resin.
EPI-REZ WD-512
Water Red.
DGEBPA
150 – 600
195 – 210
2
9.7
Water dispersible Bisphenol A epoxy resin.
1
Gardner Color Scale
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Safety, Storage and Handling
Please refer to the Material Safety Data Sheet (MSDS) for
the most current Safety and Handling information. Please refer
to the Momentive website for shelf life and recommended
storage information.
Exposure to these materials should be minimized and avoided,
if feasible, through the observance of proper precautions,
use of appropriate engineering controls and proper personal
protective clothing and equipment, and adherence to proper
handling procedures. None of these materials should
be used, stored or transported until the handling
precautions and recommendations as stated in the
MSDS for these and all other products being used are
understood by all persons who will work with them.
Questions and requests for information on Momentive products
should be directed to your Momentive sales representative, or
the nearest Momentive sales office. Information and MSDSs
about non-Momentive products should be obtained from the
respective manufacturer.
Packaging
Available in bulk and drum quantities.
Contact Information
For product prices, availability or order placement, call
our toll-free customer service number at +1 866 443 9466.
For literature and technical assistance, visit our website at
www.momentive.com/epoxy
15
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Momentive: The Science Behind What Lies Ahead
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Please refer to the literature code MSC-152 when contacting us.
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MSC-152 8/13
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