IMAGING GROUP
PI-MAX ®4: 1024 EMB
The PI-MAX4: 1024 EMB from Princeton Instruments is the ultimate in ICCD technology. This innovative intensified EMCCD camera
(emICCD) features back-illuminated 1024 x 1024 frame transfer EMCCD fiberoptically coupled to a variety of Gen II and Gen III filmless
intensifiers. The advantages of intensifiers and the benefits of EMCCD packed in one camera delivers single-photon sensitivity and
quantitative performance for scientific imaging and spectroscopy research. The higest linearity, high sensitivity, ultrafast subnanosecond
gating, dual gain control, programmable timing generator as well as other built in features makes these emICCD cameras ideal for the
most demanding research!
FEATURES
BENEFITS
Dual Gain Mechanism allows single photon sensitivity and improves linearity
NEW! Intensified EMCCD (emICCD)
with Dual Gain mechanism
1024 x 1024 FT (frame transfer)
Imaging Array
Allows higher frame rates with 100% duty cycle
10 MHz / 16-bit digitization
Video frame rates and higher to efficiently synchronize with high repetition rate lasers
Thermoelectric cooling
Delivers low dark current and maintenance-free operation
Kinetics Mode
Allows high speed burst mode sub-frame (ROI) imaging and spectroscopy based on the window size
A selection of
Intensifiers
Best sensitivity and gate speed in the desired wavelength range;
Best combination of UV-Blue sensitivity and fast gating (SB); RB provides wide spectral coverage
Offers highest sensitivity and fastest gate speed
Gen II
Gen III filmless
Fiberoptic coupling
Highest optical throughput; No vignetting
Sub-nanosecond gating
Provides <500 ps gate width with standard fast gate intensifiers while preserving QE for high
temporal resolution; For effective background discrimination, kinetics imaging and spectroscopy
Super HV - Built-in high voltage
pulser
Rugged design for high rep rate gating and minimal insertion delay
SuperSYNCHRO - Built-in
programmable timing generator
Built-in, fully software controlled gate timing; Controls gate widths and delays in linear, or
exponential increments; Low insertion delay (~27 ns). See page 3 for more info.
GigE interface
Industry standard for fast data transfer over long distances
Optional: LightField (for Windows
7/8, 64-bit) or WinSpec (for
Windows XP/7/8, 32-bit)
Flexible software packages for data acquisition, display and analysis;
LightField offers intuitive, cutting edge user interface, IntelliCal® and more
PICAM* (64-bit)/PVCAM (32-bit)
software development kits (SDKs)
Compatible with Windows 7*/XP, Vista and Linux;
Universal programming interfaces for easy custom programming;
LabVIEW Scientific Imaging
Tool Kit (SITK®)
Pre-defined LabView vis provide easy integration of the camera into complex experiment setup
®
Applications:
Fluorescence Lifetime Imaging Microscopy (FLIM),
Time Resolved Imaging & Spectroscopy, Combustion,
Planar Laser Induced Fluorescence (PLIF), Photon Counting
Page 1 of 8
PI-MAX4:1024EMB N1.1
SPECIFICATIONS
IMAGING GROUP
PI-MAX4:1024 EMB
CCD
CCD Image Sensor
e2v CCD 201; scientific grade; back-illuminated, frame transfer CCD
CCD Format
1024 x 1024 imaging pixels; 13.0 x 13.0 μm pixels
Effective image size: 1024 x 1024 pixels, 13.0 x 13.0 (17.5 mm diagonal)
EM mode
System read noise (typical)
Normal CCD mode
< 55 e- @ 5 MHz
< 90 e- @ 10 MHz
Read noise effectively reduced to <1 e- rms
with on-chip multiplication gain used
Full well (typical)
400 ke- (output node)
Dark current @ -20° C (typical)
<= 2.5 e-/p/sec
Deepest cooling temperature
@ 20° C ambient
-20° C (Air)
-30° C (Water assist)
Vertical Shift Rate*
3.4 µs/row
Kinetics mode*
1.0 µs/row time resolution
< 9 e- @ 500 KHz
< 15 e- @ 1 MHz
< 20 e- @ 5 MHz
> 80 ke- (single pixel)
INTENSIFIER
Intensifiers available
Method of coupling to the CCD
18 mm - Gen II, Gen III filmless
1:1 fiber optic
Intensifier type
Gen II
SB
RB
See QE curves
Wavelength Range
Gen III Filmless
SR
UV
HRf
HBf
Min. Gate Width (Optical FWHM) **
Sub-nanosecond Gate
Fast Gate
Repetition Rate: Sustained
Resolution limit
EBI
Photo e-/pixel/sec @ room temp
(with photocathode cooling)
Phosphor
Operating Environment
Storage Environment
Certification
< 500 ps (for Fast Gate tubes only)
~ 2.5 nsec (Typ), 3 nsec (Guar)
< 500 ps (for Fast Gate tubes only)
~ 2 nsec (Typ), 3 nsec (Guar)
1 MHz
40 to 64 lp/mm
57 to 64 lp/mm
0.05 - 0.2
0.02
(0.005 - 0.02)
(0.002)
P43 (P46 and P47 optional)
+5° C to +30° C non-condensing
-25° C to +55° C
CE
All specifications subject to change. Contact your local sales representative for more information.
* Please refer to user‘s manual for more
accurate timing calculations.
** Measured with 18 mm intensifier
Page 2 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
SuperSYNCHRO
Timing Generator
The PI-MAX4’s integrated SuperSYNCHRO Timing Generator lets researchers set gate pulse widths and delays
under GUI software control. The closed coupled SuperSYNCHRO significantly reduces the system delay inherent
in the timing generator of emICCD cameras. The integrated timing generator means there is no need for an
additional external timing generator, and a built-in Super HV high voltage pulser eliminates the requirement for an
external high-voltage supply, making the PI-MAX4 camera one of the most advanced ICCD cameras on the market.
FEATURE
Closed Coupled Design
On-board memory
Internal oscillator *
SyncMASTER Pulses
Configurable Trigger inputs
Full Software Control
BENEFITS
Short signal paths for minimum insertion delays
Store and execute complex gate width/delay sequences with no software overhead
Drive an external event and initiate repetitive experiments.
Independent continuous TTL outputs to trigger pulsed external devices, e.g. laser and Q-switch;
Minimum experiment jitter
Synchronizes camera to a wide variety of standard and non-standard trigger sources.
Easy setup and execution of complex gate width/delay sequences
SuperSYNCHRO Specifications
Internal Timing Generator
Gate Delay + Width Range*
0.05 Hz - 1 MHz
~ 10 ns (~ 20 ns with MCP bracket pulsing) to 21 sec (from T0)
Timing resolution/ Timing jitter
Insertion delay
TRIGGER INPUTS
External Sync
(Trigger In)
TRIGGER OUTPUTS
SyncMASTER1
10 ps / 35 ps rms
~ 27 ns (trigger in to intensifier opening), ~ 35 ns (with picosecond gating option)
SyncMASTER2
T0
Monitor**
Ready
Aux
Logic
-5 v to +5 v (including TTL); AC/DC coupling: 50 ohm / High Z
Variable Threshold; +ve or -ve edge
Programmable continuous frequency output to synchronize external devices with PI-MAX4, e.g. Laser
Programmable continuous frequency output (delay from SyncMASTER1- 100 ns - 6.55 msec)
synchronize external devices with PI-MAX4, e.g. Q-switch
TTL Signal: T0 indicates start of timing sequence
TTL signal to monitor gate timing
TTL signal. Represents camera status. It changes state when ready just before the exposure.
DC coupled programmable delay (Delay from T0 > 2ns - 1 sec) trigger output to synchronize
external devices with PI-MAX4
Software programmable: Select one of the following signals: Acquiring, Image Shift, Logic 1,
Readout, Shutter or Wait for trigger. See users’ manual for detailed signal descriptions.
* Software programmable
** Please refer to user‘s manual for more
accurate timing calculations.
Page 3 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
Quantum Efficiency Curves
25
Gen II Intensifiers
Quantum Efficiency (%)
20
15
10
5
0
100
200
300
400
500
600
700
800
900
1000
Wavelength (nm)
RB Fast Gate
SB Fast Gate
UV
SR
Page 4 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
Quantum Efficiency Curves
60
Gen III intensifiers
55
50
Quantum Efficiency - %
45
40
35
30
25
20
15
10
5
0
100
200
300
400
500
600
700
800
900
1000
Wavelength - nm
HBf
Frame Rate (fps)
HRf
ROI/Bin
1024 x 1024
512 x 512
256 x 256
128 x 128
64 x 64
32 x 32
1x1
8.69
16.94
32.36
59.17
102
157.73
2x2
16.94
32.36
59.17
102
157.73
218.34
4x4
32.36
59.17
102
157.73
218.34
270.27
8x8
59.17
102
157.73
218.34
270.27
306.74
NOTE: Frame rate measured at 10 MHz digitization.
Page 5 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
PI-MAX4: 1024EM Drawing
8.85±0.03 224.7±0.8
0.724 18.39
INTENSIFIER
DEPENDANT
0.395 10.03
1.26 32.0
1.94 49.3
MOUNTING FACE
SEE NOTE 3.
19.3mm
0.52
M6x1.0
REMOVABLE EXTENDER BRACKET
6.5mm
2.00
1.969 50.00
1.00"-32 THREAD
("C" MOUNT STANDARD)
SEE NOTE 3.
AIR INTAKE VENTS
AIR EXHAUST VENTS
AIR INTAKE VENTS
1/4-20 THREAD
2.80 71.1
CATHODE COOLING INPUT
1.000 25.40
4.50 114.3
4.50 114.3
2.00 50.8
3.50 88.9
With “C” Mount
0.25
1/4-20 THREAD
2X
0.129 3.26
0.25[6.4]
0.25
225.0mm
0.20 5.1
NOTES:
1. ALL DIMENSIONS SHOWN IN INCHES [MM]
2. WEIGHT: CAMERA
POWER SUPPLY
9.00
6.86 lbs [3.12 kg]
4.1 lbs [1.87 kg]
3. MOUNTING FACE TO IMAGE PLANE IS FACTORY PRESET
TO OPTICAL DISTANCE OF 0.690 0.010 [17.53 0.25]
Page 6 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
PI-MAX4: 1024EMB Drawing
8.85±0.03 224.7±0.8
1.26 32.0
1.865 47.38
1.536 39.02 INTENSIFIER DEPENDANT
1.94 49.3
MOUNTING FACE
SEE NOTE 3.
NIKON "F" MOUNT ADAPTER
SEE NOTES 3 AND 4.
AIR INTAKE VENTS
AIR INTAKE VENTS
AIR EXHAUST VENTS
M6x1.0
REMOVABLE EXTENDER BRACKET
6.5mm
2.00
50.0mm
19.3mm
0.52
1/4-20 THREAD
2X
0.129 3.26
1/4-20 THREAD
0.25
0.25[6.4]
2.80 71.1
CATHODE COOLING INPUT
1.00 25.4
4.50 114.3
4.50 114.3
2.30 58.4
3.50 88.9
With “F” Mount
0.25
225.0mm
0.20 5.1
9.00
NOTES:
1. ALL DIMENSIONS SHOWN IN INCHES [MM]
2. WEIGHT: CAMERA
POWER SUPPLY
6.95 lbs [3.16 kg]
4.1 lbs [1.87 kg]
3. MOUNTING FACE TO IMAGE PLANE IS FACTORY PRESET
TO OPTICAL DISTANCE OF 1.831 0.010 [46.50 0.25]
4. LENS RELEASE TRIGGER ORIENTATION CAN BE
ROTATED IN 180 INCREMENTS
Page 7 of 8
PI-MAX4:1024EMB N1.1
IMAGING GROUP
PI-MAX4: 1024EMB Drawing
With Spectrometer
Mount
3X 0.20[5.2] RADIAL SLOT
ON 3.60 BOLT CIRCLE
SEE NOTE 4.
0.928 23.57
0.599 15.21 INTENSIFIER DEPENDANT
8.85±0.03 224.7±0.8
4.50 114.3
1.26 32.0
0.15 3.8
2.60 66.0
CATHODE COOLING INPUT
AIR INTAKE VENTS
AIR INTAKE VENTS
AIR EXHAUST VENTS
19.3mm
0.52
M6x1.0
REMOVEABLE EXTENDER BRACKET
6.5mm
2.00
1.969 50.00
3X #10-32 THREAD
ON 3.88 BOLT CIRCLE
SEE NOTE 4.
1.000 25.40
MOUNTING FACE
SEE NOTE 3.
1/4-20 THREAD
2X
0.129 3.26
2.80 71.1
4.25 108.0
1.94 49.3
4.50 114.3
0.06 1.5
0.25
225.0mm
0.25[6.4]
1/4-20 THREAD
0.25
0.20 5.1
NOTES:
1. ALL DIMENSIONS SHOWN IN INCHES [MM]
2. WEIGHT: CAMERA
POWER SUPPLY
9.00
7 lbs [3.2 kg]
4.1 lbs [1.87 kg]
3. MOUNTING FACE TO IMAGE PLANE IS FACTORY PRESET
TO OPTICAL DISTANCE OF 0.894 0.010 [22.71 0.25]
4. MOUNTING FLANGE ORIENTATION CAN BE ROTATED
IN 180 INCREMENTS
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Page 8 of 8
PI-MAX4:1024EMB N1.1