ALSO PUBLISHED ONLINE:
JULY2013
www.highfrequencyelectronics.com
EMC Simulation of Consumer
Electronic Devices
IN THIS ISSUE:
Choosing Circuit Materials for
Millimeter Wave Applications
Featured Products
New Products
Market Reports
Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · Lightwave
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ALSO PUBLISHED ONLINE AT: www.highfrequencyelectronics.com
22
Circuit Materials
Choosing Circuit
Materials for Millimeter
Wave Applications
By John Coonrod
32
EMC Simulation
JULY2013
Vol. 12 No. 7
40
New Products
EMC Simulation of
Consumer Electronic
Devices
By Andreas Barchanski
Including Anritsu
Company, RLC
Electronics, AVX Corp.,
Rohde & Schwarz, MECA
Electronics, SAGE
Millimeter, Relcomm
Technologies
16
12
6
Featured Products
In The News
Editorial
ALSO PUBLISHED ONLINE:
JULY2013
www.highfrequencyelectronics.com
EMC SIMULATION OF CONSUMER
ELECTRONIC DEVICES
Featuring Field
Components, Delta
Electronics, Times
Microwave, Microsemi,
Comtech PST, Molex,
Mini-Circuits.
4
IN THIS ISSUE:
Highlighting TrivecAvant Corp., BellBoeing, TCOM Limited
Partnership, Raytheon
Company, TECOM.
Choosing Circuit Materials for
Millimeter Wave Applications
Featured Products
New Products
Market Reports
Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · Lightwave
Commentary by Sr.
Tech Editor Tom
Perkins.
6 Editorial
12 In the News
16 Featured Products
8 Meetings & Events
40 New Products
64 Advertiser Index
High Frequency Electronics
EDITORIAL
Vol. 12 No. 7, July 2013
Publisher
Scott Spencer
scott@highfrequencyelectronics.com
Tel: 603-472-8261
Associate Publisher/Managing Editor
Tim Burkhard
tim@highfrequencyelectronics.com
Tel: 707-544-9977
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tom@highfrequencyelectronics.com
Tel: 603-472-8261
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Tel: 631-274-9530
Editorial Advisors:
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Copyright © 2013, Summit Technical Media, LLC
6
High Frequency Electronics
Sunny in Seattle
Tom Perkins
Sr. Technical Editor
Microwave Week, also known as the IEEE Microwave
Theory and Techniques Society International Microwave
Symposium, held during the first week of June, brought
unusually mild weather and clear skies to the beautiful
city of Seattle. Overall the symposium was a great success, with only a few “glitches” that would likely be more
apparent to someone like me who has served on past
Boston steering committees. Thanks to the volunteers
serving under Tom Raschko as well as the opportunity for
High Frequency Electronics to sponsor the well-attended Monday evening
Welcome Reception.
Opening with the RFIC Symposium, workshops and short courses on
Sunday, the conference had something for everyone. Consider, for example,
Self-Healing Mixed Signal Circuitry: Built-in Calibration and Compensation
Techniques. The Monday IMS Plenary Session, with speaker Dr. Patrick
Ennis, was useful for those wishing to know more about entrepreneurship
and inventing.
Congratulations to the new class of IEEE Fellows associated with MTTS. They were recognized by one of our own, Dr. Peter Staecker, 2013 IEEE
President and CEO.
A piece of technology that made a particular impression was a microwave oven by NXP using a solid-state source (instead of a magnetron) having significant agility, including beam-steering in the cavity. This could
revolutionize how a dinner is cooked to perfection with lower energy cost.
Localized Cell Networks
Another area of technology is localized (mini, micro, nano etc.) cellular
networks to minimize use of precious bandwidth. Workshops and papers on
RF and microwave-assisted medicine reflect rapidly emerging technology. Of
note, Doherty power amplifiers have become commonplace, and so have
GaN based amplifiers. The use of innovative circuit techniques to linearize
GaN amplifiers was described in talks at a workshop titled: Multi-Octave
High Efficiency, High Linearity High Power Amplifiers. Flexibility and
reconfigurability have become the mantra for Software Defined Radios
(SDRs). Terahertz frequency work is rapidly advancing and companies are
emerging—this is not just relegated to Universities anymore.
Connector companies are making products that could not be imagined a
few years ago. Tiny coax connectors that to the naked eye look like DC pins
(e.g. Southwest Microwave).
A strong thrust in CMOS, SiGe and silicon-on-insulator (SOI) is making
serious challenges to GaAs devices. This will be an area to watch closely.
Many companies made interesting presentations at MicroApps. Of note
were software simulation/modeling providers such as Agilent, Ansys, AWR
Corporation and Sonnet Software, Inc.
Fiber Optics
There were many social events
and opportunities for spouses/families
to have a memorable visit. I managed
to go on a tour of Seattle with my wife
on Monday morning, and got to
observe many interesting sights,
including the 18-foot-high Fremont
Troll. Look it up and see what happened to the VW!
Microwave
Test Equipment
Test equipment continues to
advance at rapid rates. I saw a number of noteworthy instruments including a Multi-Channel Phase Coherent
Vector Signal Generator produced by
XCOM, A Bird Technologies Company.
This device can simulate a realistic
dense signal environment. The message I got was that this 70+ year-old
family-owned company has come a
long way and does not just manufacture their traditional high quality RF
watt meters. I was also impressed
with the continuing growth of inexpensive measurement systems, e.g.
Mini-Circuits and Copper Mountain
Technologies. Anritsu demonstrated
some new equipment that is bound to
keep the test instrument marketplace
competitive. I recommend their booklet The Essentials of Vector Network
Analysis From a to Zo.
Wednesday was Wireless Industry
Day. Other significant activities
included
the
Student
Paper
Competition and the Graduate
Student Challenge. These are all great
activities which have the side benefit
of introducing students to the symposium at a young age. Thanks also to
the many students who volunteered
their time to assist in providing directions, signage, etc.
As a radio amateur, it was good to
see the ARRL with a booth there for
the first time. I’m a bit prejudiced as I
really believe ham radio is the reason
I became an electronic engineer with
particular emphasis on RF and microwaves.
The closing session speakers were
Dr. David Tennenhouse of Microsoft,
and Michael Thorburn of the Joint
ALMA Observatory Project (millimeter and submillimeter-wave array) in
Chile. Both speakers delivered very
interesting talks on diverse aspects of
our technology.
Finally, the week ended with more
workshops, short courses and the
ARFTG Conference.
Here’s looking forward to IMS
2014 in Tampa. Microwave Week next
year will also include Wamicon on
Friday June 6, a conference running
concurrently with ARFTG. There will
likely also be workshops and short
courses, so plan on staying over to
Friday.
HFE
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MITEQ Fiber Optic Application notes
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Est. in 1969
MEETINGS & EVENTS
Conferences
October 6 – 10, 2013
European Microwave Conference (EuMC)
Nuremberg, Germany
www.eumweek.com
October 15 – 18, 2013
IEEE International Symposium on Phased Array Systems
and Technology
Waltham, Mass.
www.array2013.org
October 21 – 23, 2013
IEEE International Conference on Microwaves,
Communications, Antennas, and Electronic Systems
Tel Aviv, Israel
www.comcas.org
November 18 – 21, 2013
ARFTG Microwave Measurement Conference
Columbus, Ohio
www.arftg.org
January 19 – 23, 2014
IEEE Radio and Wireless Symposium
Newport Beach, Calif.
www.radiowirelessweek.org
Short Courses
Besser Associates
besserassociates.com
Tel: 650-949-3300
Linear Technology
LTSpice IV
LTpowerCAD
LTpowerPlay
Amplifier Simulation & Design
Filter Simulation & Design
Timing Simulation & Design
Data Converter Evaluation Software
http://www.linear.com/designtools/software/
National Instruments
LabVIEW Core 1
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
LabVIEW Core 2
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Object-Oriented Design and Programming in LabVIEW
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Free, online LabVIEW training for students and teachers.
http://sine.ni.com/nievents/app/results/p/country/
us/type/webcasts/
Webcasts on demand.
http://search.ni.com/nisearch/app/main/p/bot/no/
ap/tech/lang/en/pg/1/sn/catnav:mm,n15:WebcastsOn
Demand,ssnav:dzn/
LabVIEW user groups.
https://decibel.ni.com/content/community/zone/labviewusergroups
Call for Papers
New Courses
Course 227: Wireless LANs
Course 226: Wireless/Computer/Telecom Network
Security
Course 228: GaN Power Amplifier Design
Course 223: Fundamentals of LTE, HSPA, & WCDMA
Course 221: B
ER, EVM, & Digital Modulation Testing
for Test & Product Engineers
November 18 – 21, 2013
ARFTG Microwave Measurement Conference
Columbus, Ohio
Abstract deadline: October 7, 2013
Final submission deadline: November 10, 2013
www.arftg.org
Company-Sponsored
Training & Tools
December 9 – 11, 2013
IEEE International RF and Microwave Conference
Penang, Malaysia
Abstract deadline: June 1, 2013
Final submission deadline: November 1, 2013
rfm2013.myapmttemc.org
Analog Devices
Training, tutorials and seminars.
http://www.analog.com/en/training-tutorials-seminars/resources/index.html
AWR
On-site and online training, and open training courses on
design software.
http://web.awrcorp.com/Usa/News--Events/Events/
Training/
8
High Frequency Electronics
April 22 – 26, 2014
IEEE International Wireless Symposium
X’ian, China
Abstract deadline: September 23, 2013
Final submission deadline: October 28, 2013
iws-ieee.org
Size Does Matter
The MLTO and MLTM-Series TO-8 YIG-Tuned oscillators
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If PC board space is a premium, then these miniature
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MARKET REPORTS
Electrical Grid Woefully Prepared for
Cyber Security Threats
The use of ICTs within the electrical grid means an
evolution from isolated structures into open and networked
environments where the subversion of power control systems has become a reality. The restructuring of the power
sector and the emergence of the smart grid has largely
ignored the issue of cyber security. Industrial control systems have poor methods of authentication, little encryption, and are not often capable of detecting intrusions. By
failing to address cyber security, and focusing on the costsavings and gained efficiencies of a market-oriented model,
the susceptibility to cyber-attacks has grown.
ABI Research estimates the spending on cyber security
solutions to secure the infrastructure will total $2.9 billion
globally by the end of 2013. “Cyber-attacks that can cause
serious damage to electrical grids are a reality. Operators
need to view cyber security as a core, integrated requirement of their offering and not as a secondary add-on,” says
Michela Menting, ABI Research’s senior analyst for cyber
security. Efforts by governments and standardization bodies to tackle vulnerabilities within power control systems
are raising the level of awareness. This is in turn driving a
dedicated market in cyber security for critical infrastructure, targeting the security of industrial control systems,
substations and advanced metering capabilities.
Manufacturers such as GE, Siemens, and Honeywell
offer dedicated cyber security services to accompany their
ICS product offerings. Other larger niche vendors such as
Advantech, AGT International, AlertEnterprise, Maxim
Integrated offer specialized SCADA security solutions and
companies like 4Secure, OwlComputing Technologies, and
DNV KEMA propose expert consulting services.
—ABI Research
abiresearch.com
Lasers Shine for Directed Energy
Systems
Technology limitations currently limit laser power output, but work in the US and Europe is progressing to the
point where laser-based weapons have demonstrated their
viability as the underpinnings of directed energy systems.
The Strategy Analytics Advanced Defense Systems (ADS)
service report, "Lasers Building Momentum as Viable
Directed Energy Systems; High Power RF Holds Promise
in Non-Lethals," details some examples of laser-based systems being developed for air defense systems, as alternative or in addition to conventional systems.
The report summarizes developments at Boeing, MBDA
and Rheinmetall which are developing systems based on
commercial-off-the-shelf (COTS) fiber lasers typically used
in industrial applications such as welding. Most usage
cases look to using laser-based directed energy systems
that will be used for air defense systems, typically
10 High Frequency Electronics
supporting ranges up to around 3km, making the systems
suitable for Counter Rocket, Artillery, and Mortar (C-RAM),
counter-Unmanned Aerial Vehicles (UAV) and new threat
scenarios.
"After years of trying to develop futuristic systems with
unrealistic performance specifications, companies working
on the current batch of laser-based directed energy systems are taking a much more pragmatic approach,"
observed Asif Anwar, Director of the ADS service at
Strategy Analytics. "Using COTS-based fiber lasers in concert with coupling techniques is allowing practical power
levels that can be used for C-RAM and other air defense
applications."
—Strategy Analytics
strategyanalytics.com
DoD to Increasingly Rely on COTS
Aircraft
As DoD spending decreases, commercial off-the-shelf
(COTS) aircraft will become more important to future programs. While growth in the market will be limited, use of
COTS aircraft will allow for significant savings in the area
of research and development since they do not require the
development costs that would be required for completely
new aircraft designs.
Frost & Sullivan finds that U.S. DoD spending for
COTS aircraft totaled $4.71 billion in 2012. COTS aircraft
spending is forecast to spike as the P-8 Poseidon and
Boeing KC-46 reach full production between 2013 and
2016 and then decrease to $4.76 billion in 2017.
Since new or improved capabilities are often required
to react rapidly in dynamic war zone conditions, commanders are increasingly relying on the quick reaction capability (QRC) to develop new weapons systems. This allows for
delivery of requested capabilities without going through
the slow and long DoD program of record (POR) procurement process. COTS aircraft are widely counted on to conduct many specialized activities within intelligence, surveillance, and reconnaissance (ISR) missions to meet combatant commander requirements.
"Due to the quickly changing need of commanders in
different theaters of operation, COTS aircraft allow a
faster delivery time since they only need to be altered for
missions, rather than built from the ground up," said Frost
& Sullivan Senior Industry Analyst Michael Blades.
"Planned budget cuts will continue to force military service
leaders to consider COTS aircraft before committing to
significantly higher costs of new aircraft design and development."
Currently, a significant factor restraining the COTS
market is the fact that the DoD often does not have a set of
rules for defining requirements for new aircraft systems.
—Frost & Sullivan
frost.com
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IN THE NEWS
Trivec-Avant Corp.,
Huntington
Beach,
Calif.
(H9222213-D-0010),
and
Antenna
Research
Associates
Inc.,
Beltsville,
Md.
(H92222-13-D-001),
were awarded a maximum $10,000,000, indefinite-delivery/indefinite-quantity
contract for nine types of UHF SATCOM antennas to be
used in various configurations by special operations forces.
Both contracts have a period of performance not to exceed
five years. Type of appropriation is fiscal 2013 Operations
and Maintenance funds. This award was the result of a
competitive acquisition with seven bids received. The U.S.
Special Operations Command, MacDill Air Force Base,
Fla., is the contracting activity.
Bell-Boeing
Joint
Project Office, Amarillo,
Texas, is being awarded
a $4,894,124,381 modification to definitize
the
previously
awarded V-22 Lot 17
undefinitized contract action/Lot 18 advance acquisition
contract to a fixed-price-incentive-fee, multiyear contract
(N00019-12-C-2001). In addition, this modification provides for the manufacture and delivery of 92 MV-22 tiltrotor aircraft for the Marine Corps and 7 CV-22 tiltrotor
aircraft for the Air Force. Work will be performed in Fort
Worth, Texas, (23 percent); Ridley Park, Pa., (18 percent);
Amarillo, Texas (10 percent); Dallas, Texas (4 percent);
East Aurora, N.Y. (3 percent); Park City, Utah (2 percent);
El Segundo, Calif. (1 percent); Endicott, N.Y. (1 percent);
Tempe, Ariz. (1 percent); and other locations (37 percent),
and is expected to be completed in September 2019.
Lockheed
Martin
Mission Systems and
Training, Moorestown,
N.J., is being awarded a
$19,263,000 cost-plusfixed-fee,
cost-plusaward-fee modification
to previously awarded contract (N00024-09-C-5103) to
exercise options for fiscal 2013 Aegis Platform Systems
Engineering Agent activities and Aegis Modernization
Advanced Capability Build engineering. The Platform
Systems Engineering Agent manages the in-service combat systems configurations, as well as the integration of
new or upgraded capability into CG 47 and DDG 51 class
ships. Work will be performed in Moorestown, N.J., and is
expected to be completed by September 2013.
12 High Frequency Electronics
Northrop Grumman
Electronic
Business
Segment, Linthicum
Heights, Md., has been
awarded a maximum
$115,000,000
firmfixed-price contract to
provide 16 AN/APG-68
(V)9 radar systems
for the Royal Thai Air
Raytheon Image
Force and 22 AN/APG68 (V)9 radar systems
for the Republic of Iraq for a total of 38 radar systems. This
foreign military sale also includes spares for the Egyptian
Air Force, Royal Moroccan Air Force and Pakistan Air
Force. $51,449,989 will be obligated at time of award. This
is a sole-source acquisition.
Rockwell Collins Inc.,
Cedar Rapids, Iowa,
has been awarded a
$44,500,000 firm-fixedprice contract to install
the KC-135 Global Air
Traffic Management Block 40 Upgrade into three KC-135R
French Air Force aircraft. Work will be performed at Cedar
Rapids, Iowa, and is expected to be completed by Nov. 10,
2015. This contract is 100 percent funded foreign military
sales. Air Force Life Cycle Management Center/WKKPA,
Tinker Air Force Base, Okla., is the contracting activity
(FA8105-13-C-0001).
TCOM
Limited
Partnership – also
known
as
TCOM
L.P.*, Columbia, Md.,
is being awarded an
$11,800,672 firm-fixedprice delivery order
#0003 against a previously issued basic
Lockheed Martin Image
ordering
agreement
(N68335-13-G-0011) for 22M and 28M aerostat parts and
spares in support of the Army’s Persistent Ground
Surveillance System Program. Work will be performed
in Elizabeth City, N.C. (90 percent) and Columbia, Md. (10
percent), and is expected to be completed in October 2013.
Fiscal 2013 Operations and Maintenance, Army contract
funds in the amount of $11,800,672 are being obligated on
this award, all of which will expire at the end of the current
fiscal year. The Naval Air Warfare Center Aircraft Division,
Lakehurst, N.J., is the contracting activity.
The Boeing Co., Wichita, Kan., is being awarded a
$17,264,583 modification to previously awarded firm-fixed-
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IN THE NEWS
price, indefinite-delivery/indefinitequantity contract (N00019-10-D-0017)
to exercise an option for logistics support services for the Navy’s C-40A
aircraft fleet. Services to be provided
include commercial depot support and
site support at Naval Air Station (NAS)
Jacksonville, Fla.; NAS Joint Reserve
Base, Fort Worth, Texas; NAS North
Island, Calif.; and NAS Oceana, Va.
Work will be performed in Fort Worth,
Texas (25 percent); Jacksonville, Fla.
(25 percent); North Island, Calif. (25
percent); and Oceana, Va. (25 percent),
and will be completed in July 2015.
Raytheon Co., Tucson, Ariz., is being
awarded an $80,497,513 firm-fixedprice contract for the procurement of
200 full rate production Lot 9 AGM154C-1 Unitary Joint Stand-Off
Weapon missiles, including associated
support equipment. In addition, this
contract provides for one AGM-154C-1
for performance characterization test.
Get info at www.HFeLink.com
14
14 High
High Frequency
Frequency Electronics
Electronics
Huntington Ingalls Inc., Pascagoula,
Miss., is being awarded a $3,331,476,001
fixed-price incentive, multiyear contract for construction of five DDG 51
class ships, one in each of fiscal 20132017. This contract includes options for
engineering change proposals, design
budgeting requirements and post-delivery availabilities, which, if exercised,
would bring the cumulative value of
this contract to $3,386,092,948. Work
will be performed in Pascagoula, Miss.
(56.3 percent), Cincinnati, Ohio (6.9
percent), Walpole, Mass. (4.5 percent),
York, Pa. (1.9 percent), Camden, N.J.
(1.4 percent), Erie, Pa. (1.3 percent),
Charlottesville, Va. (1 percent), and
other locations below 1 percent (26.7
percent), and is expected to be completed by July 2023.
TECOM, a Smiths Microwave business, announced that the KuStream®
1000, a Ku band aeronautical SATCOM
antenna system, has achieved over 3
million flight hours of service. The
KuStream® 1000 enables transmission
and reception of RF communications
with Ku band satellites enabling WiFi
and other broadband high speed inflight services within the aircraft.
The Phoenix Company of Chicago
announced that ECM has been
appointed to distribute its product line
of RF/Microwave blindmate contacts
and connectors.
Mini-Circuits and Modelithics, Inc.
are collaborating to develop high-accuracy linear and non-linear models for
selected surface-mount products.
The latest offering includes three new
X-ParameterTM amplifier models for
Mini-Circuits PHA-1+, GVA-62+ and
GVA-63+ products. Modelithics developed these models based on careful
measurements made using an Agilent
Technologies’ PNA-X Series Nonlinear
Vector Network Analyzer. These new
high-frequency behavioral models provide for the first time for such a set of
products, both linear and non-linear
simulation capabilities including prediction of harmonics, non-linear distortion, compression and impedance
dependent non-linear behavior.
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current CMOS gate driver designed
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Attenuators
Field Components introduced their
new line of precision 6 GHz Attenuators. With a typical VSWR of 1.20:1,
the FC14MF-ATT6P-XX-2-5 are
plated with white bronze for LOW
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Field Components
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Coupler
RFMW
rfmw.com
alog details 167 part numbers that
span 37 different connector configurations in two series that operate
from: SMP: DC – 40 GHz/SMPM:
DC-65 GHz. These connector interfaces are developed for applications
in Phased Array Radar systems, Airborne Radar, Ground Radar, Shipboard Radar and Active Antennas.
Delta Electronics
deltarf.com
Mini-Circuits’ model ZGBDC3593HP+ is a 35 dB DC pass high
power bi-directional coupler featuring: wide frequency range, 900-9000
MHz; good coupling flatness, ±0.8 dB
typ.; high directivity, 25 dB typ.; good
VSWR, 1.10:1 typ.; high power, up to
250 W; DC current pass through input to output.
Mini-Circuits
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Attenuator
Renaissance Electronics announced
a low PIM attenuator perfect for
ATE applications which covers DC
to 3.0 GHz. Available in multiple
attenuation values and handling
100W CW, the attenuator exhibits
-145 dBc of PIM distortion, making
it ideal for test applications which
require extremely low PIM.
Connector Ring
TE Connectivity introduced the side
entry Tinel-Lock ring, a heat recoverable metal braid terminator, which
provides a method of joining a gross
cable or harness shield to a customer-built connector backshell or other
termination device without prepositioning the ring on the harness.
Delta Electronics Manufacturing
Corp.’s new SMP/SMPM series cat-
16 High Frequency Electronics
SPP-250-LLPL is a ¼” superflexible
type corrugated cable with low density PTFE dielectric and FEP jacket
that meets the requirements of UL
910 for plenum applications. These
are suitable for in-building jumpers
and interconnects up to 6.0 GHz.
The factory installable connectors
attach via soldering of the center pin
and induction soldering to the cable
outer conductor providing excellent
VSWR performance and reliable
PIM performance better than -155
dBc.
Times Microwave
timesmicrowave.com
TE Connectivity
te.com
GaN Transistor
Renaissance Electronics
rec-usa.com
Catalog
Cable Assemblies
Gate Driver
RFMW, Ltd. announced design and
sales support for The IXRFD630
from IXYS RF—a high speed, high-
Microsemi announced six sets of
transistors with peak output powers ranging from 20 to 1000 Watts,
all designed for 50 Volts drain bias
operation. The total of 24 transistors
are designed using the latest in GaN
on SiC HEMT proven high voltage
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High Frequency Products
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available. These new design solutions target demanding pulsed avionics and radar applications.
Microsemi
microsemi.com
geting the test and measurement
market, the PE42520 and PE42521
SPDT switches offer performance
to 13GHz at a 36dBm power rating. The resulting input IP3 (IIP3) is
66dBm while IIP2 is 115 dBm.
Upconverters
These GaAs MMIC I/Q variable gain
upconverters form a competitive microwave radio transmitter solution
for modern high capacity QAM microwave radios. HMC6787ALC5A
operates from 37 to 40 GHz and provides a small signal conversion gain
of 10 dB with 17 dBc of sideband
rejection, and 13 dB of gain control.
HMC6146BLC5A operates from 40
to 44 GHz and provides a small signal conversion gain of 12 dB with 25
dBc of sideband rejection, and 17 dB
of gain control.
Hittite Microwave Corp.
hittite.com
Limiter-Switch
Protect your receiver from broadband, high power, long-pulse threats.
This device has 4 antenna inputs
and 1 receiver output. A unique limiter circuit at each input handles all
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comtechpst.com
Switches
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18 High Frequency Electronics
RFMW, Ltd. announced design and
sales support for two new broadband, high-performance switches
from Peregrine Semiconductor. Tar-
RFMW
rfmw.com
Analyzers
Agilent Technologies announced
that its FieldFox handheld analyzers can now be remotely controlled
via an iOS device such as an iPad
or iPhone. Also new are a spectrum
analysis time-gating option and support for Agilent’s USB peak-power
sensors. These features provide engineers the precision and flexibility
they need to more easily and quickly
test their RF communications infrastructure.
Agilent Technologies
agilent.com
Connector System
Molex announced a high-performance connector system to enable
PCB developers in telecommunications to transfer multiple RF signals
across mated boards in a single assembly while taking into consideration space constraints. The RF DIN
1.0/2.3 Modular Backplane System
TECHNICALLY SPEAKING
THIS IS SOME SERIOUS PIM
The data says it all.
If you take PIM seriously, you know that typical PIM of -170 dBc for
loads/terminations and -155 dBc for unequal splitters is game-changing.
With PIM this low, receiver desensitization is a relative non-issue and
you can design with confidence that there’ll be no dropped calls due
to ghostly interference. Frequency performance for both products is
698-2700 MHz. Our terminations are available in 30, 50, 100, and
150W models and offer VSWR of 1.10:1 typical. Our unequal
splitters deliver 300W of power handling, a typical VSWR of 1.15:1,
and various output levels from -0.9 to -1.8 dB. To prevent field failures,
all models are designed to handle full rated power @ +85°C.
Ready to get serious about PIM? Start with a visit to www.e-MECA.com.
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High Frequency Products
FEATURED PRODUCTS
features a unique bracket housing
design, enabling an expansion capability of up to 10 ports for increased
orthogonal PCB mating flexibility.
Molex
molex.com
4 ppm/W typical, and tolerances to
±0.01%.
Vishay Precision Group
vishaypg.com
Coupler
Switch
Resistors
Vishay Precision Group released
new ultra-high-precision Z-Foil
power current sensing resistors for
applications where rapid ΔR stabilization and resistance stability
under transient power conditions
are required. Designed to provide
optimal performance when mounted on a chassis or cooled heat sink,
the series features low TCR of ±0.2
ppm/°C from -55°C to +125°C, +25°C
ref., PCR (ΔR due to self-heating) of
Microsemi’s GG-75431-64 single
pole, 36 throw (SP36T) ultra-broadband absorptive switch is targeted
at signal routing, simulation test
equipment, communications systems and test lab equipment. It
achieves low insertion loss, high isolation and fast switching over the
entire 100 MHz to 20 GHz frequency
range. It is controlled via an internal
6-bit TTL-compatible driver and operates from a single +5 V DC supply.
Microsemi
microsemi.com
Get info at www.HFeLink.com
20 High Frequency Electronics
Mini-Circuits’
model
ZX3014-972HP+ is a 8300 to 9700
MHz, 14 dB high power (20W)
directional coupler that can pass
up to 50mA DC from input to
output ports. Internally, low loss
dielectric material in a micro
strip configuration utilizing ADS
design software allow for low
insertion loss, 0.6 dB. Packaged in
a miniature Unibody case allows
for excellent grounding and heat
transfer.
Mini-Circuits
minicircuits.com
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High Frequency Design
Circuit Materials
Choosing Circuit Materials for
Millimeter Wave Applications
By John Coonrod
Millimeter-wave frequencies are attractive
for communications and
other applications for the
broad bandwidths available at these frequencies,
from 30 to 300 GHz. But finding printed-circuit-board (PCB) materials that provide high
performance levels for reasonable prices at
these frequencies can be challenging.
However, by understanding the key parameters and characteristics of concern for PCB
materials at millimeter-wave frequencies,
such as how different circuits behave for different types of PCB materials at millimeterwave frequencies, it is possible to choose
wisely when selecting PCB materials for use
at these higher frequencies.
Many of the concerns when designing
microwave circuits apply to higher-frequency
millimeter-wave circuits, where these
concerns can easily become more severe or
carry greater impact. These issues include
limiting spurious wave mode propagation
problems, minimizing conductor and
radiation losses, achieving effective signal
launch, minimizing unwanted resonances,
and controlling dispersion.
It is possible to choose
wisely when selecting
PCB materials for use at
these higher frequencies.
Guidelines
Numerous guidelines help minimize wave
propagation issues, such as using a circuit
laminate that is relatively thin. A general
rule is to use a laminate that is thinner than
one-quarter wavelength at an application’s
highest operating frequency. In practice, better results can be achieved by using a laminate that is thinner than one-eighth wavelength at the highest operating frequency, to
eliminate unwanted resonances between different circuit planes in a circuit assembly.
Such resonances can interfere with the
desired propagation for a circuit and also
generate surface waves that can disrupt the
desired wave propagation. The width of the
signal conductors is also related to the thickness of a circuit laminate, since a thinner
laminate will use a narrower conductor
width. To help eliminate mode issues, the
conductor width should be one-eighth wavelength or less at the highest operating frequency.
These rules for laminate thickness and
conductor width apply directly to high-frequency microstrip circuits; other types of circuit configurations may be more forgiving.
Figure 1a. • Microstrip transmission line circuit. Figure 1b. • Grounded coplanar waveguide
transmission line.
22 High Frequency Electronics
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ISO 14001 AS 9100
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661
The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
440 rev M
High Frequency Design
Circuit Materials
For grounded coplanar-waveguide (GCPW) circuits,
which are also known as conductor-backed coplanar
waveguide (CBCPW), thicker laminates have been
shown to exhibit minimal mode issues at millimeterwave frequencies.
In the microstrip diagram of Figure 1a, the microstrip
transmission line circuit has a set distance between the
signal layer and the ground plane. If that distance (substrate thickness) is one-quarter wavelength, resonance
can occur between the copper planes and this resonance
may interfere with the desired wave propagation.
Additionally, if the substrate is one-quarter wavelength
thick and the conductor width is narrower than onequarter wavelength, a resonance may not occur or be
marginalized. If both the substrate is thicker than onequarter wavelength, and the conductor width is onequarter wavelength or more, unwanted resonances and
wave propagation issues will likely occur. Figure 1b
illustrates a GCPW circuit. Even when the substrate
thickness and conductor width are equal to one-quarter
wavelength, a resonance may be avoided due to the close
coupling of the coplanar ground planes. The coplanar
ground planes are adjacent to the center signal conductor and are grounded by means of plated through holes
(PTHs). Of course, tradeoffs are part of any choice of
high-frequency circuit configuration, and GCPW will
suffer higher conductor loss than microstrip. However,
depending upon the operating frequencies, this may not
mean more overall insertion loss due to a GCPW circuit
possibly exhibiting less radiation loss than a microstrip
circuit.
For high-frequency transmission lines and transmission-line circuits, insertion loss is actually a total of
various component losses: dielectric loss, conductor loss,
radiation loss, and leakage loss. PCB materials for highfrequency applications typically have high volume resistivity, with resulting minimal RF leakage losses.
Dielectric losses are related to the tangent delta or dissipation factor of the circuit substrate material. These
losses are affected by any additional substrate materials, such a soldermask or prepreg/bonding layers.
Soldermask are typically not used at RF/microwave
frequencies and especially at millimeter-wave frequencies, since these are very high loss materials where a
dissipation factor of 0.02 is not uncommon. Soldermasks
are not typically characterized by well-controlled dielectric constant (Dk), and using soldermasks can lead to
impedance mismatches, and their impact on increasing
return loss and ultimately insertion loss.
Thickness Variations
Soldermasks are often guilty of thickness variations
when applied to one circuit to the next or even within
the same circuit, which can result in unwanted impedance variations. Soldermasks also typically have high
24 High Frequency Electronics
Table 1a. Copper surface roughness values are listed
for copper types typically used in RF/microwave PCBs.
Table 1b. Copper skins depths are shown versus frequency.
moisture absorption characteristics, which can seriously
degrade the performance of a PCB. Moisture, basically
water, has a Dk of about 70 and very high dissipation
factor, both values much higher than the circuit material, so that as water or moisture is absorbed, a circuit
material’s Dk will rise and its loss will increase. As a
result, soldermask should be used sparingly or not at all
at millimeter-wave frequencies.
As thinner substrates are used, as for millimeterwave circuits, conductor loss becomes more of a concern;
conductor loss also grows more significant with increasing frequency. Copper with a roughened surface is often
used for improved adhesion to the dielectric material in
a PCB. But this surface roughness can also result in
higher loss. As a rule of thumb, when the skin depth for
a frequency of interest is equal or less than the copper
surface roughness, the surface effects of the conductor
will be significant. At millimeter-wave frequencies, the
skin depth is commonly less than the copper surface
roughness.
Copper surface is measured by different methods
and in different units of measure. For RF/microwave
applications, the appropriate copper surface roughness
measurement is Rq or root mean square (RMS). Table 1a
lists copper roughness for several copper types used for
high-frequency PCBs. As Table 1b shows, the skin
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High Frequency Design
Circuit Materials
Figure 2 • Illustration from a study [1] regarding the
effects of copper surface roughness on the propagation
constant and insertion loss.
depth in copper is equivalent to the copper surface
roughness for even the smoothest copper at millimeterwave frequencies.
Looking at these values in Table 1, a designer working at 50 GHz may decide that the choice of copper may
not matter, since all of the copper types have a surface
rougher than the skin depth, but that is a wrong
assumption. The rougher surface will create more parasitic inductance and cause a change in the surface
impedance as well as increase in insertion loss [1].
Figure 2 offers the results of a study showing the effects
of copper surface roughness on propagation constant
and insertion loss.
To further highlight the conductor roughness difference, Figure 3 shows insertion loss curves for one substrate with different copper types. Standard RO4350B™
laminate from Rogers Corp. was used with copper having an average roughness of 2.5 μm RMS, while RO4350B
LoPro™ laminate was used with copper having an average roughness of 0.6 μm RMS. Although some noise is
present in both curves at 50 GHz, the trend is clear, with
the smoother copper yielding lower loss. There is a slight
difference (0.7 mils) in thickness between the substrates, but the laminates are thin enough where the
conductor losses dominate.
The plated finish applied to copper on final circuit
production can also impact conductor loss, especially at
higher frequencies. Unfortunately, many of the metals
used as a finish for PCBs are less conductive than copper, and the addition of these finishes results in an
increase in conductor loss. For example, electrolessnickel-immersion-gold (ENIG) finish is commonly used
for PCBs, even though nickel is less conductive than
26 High Frequency Electronics
Figure 3 • Essentially the same substrate material shows
two different loss curves due to differences in copper
surface roughness for the substrates.
Figure 4 • These insertion loss curves were measured for
microstrip transmission-line circuits using the same
substrate material but with bare copper and with ENIG
finish.
copper and using an ENIG finish inevitably results in
an increase in conductor loss. A typical conductor stackup with an ENIG finish would start with the base copper for the circuit, then a barrier layer against copper
oxide migration, which is the nickel, and on top of the
nickel is the gold. In terms of thickness, immersion gold
is a self-limiting process that typically produces a gold
thickness of around 0.2 μm while the nickel has a thickness of 5.0 μm. For the skin depths at millimeter-wave
frequencies, the nickel will be used and some of the gold.
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Email: sales@pmi-rf.com | www.pmi-rf.com
ISO9001:2008 Certified
High Frequency Design
Circuit Materials
Figure 5 • Comparison of microstrip transmission line circuit models, using the same material at different thicknesses and illustrating the different components of insertion loss (total loss).
But at higher millimeter-wave frequencies, more of the
gold finish will be used. But gold is still less conductive
than copper, so using this finish will result in a penalty
in conductor loss.
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28 High Frequency Electronics
Figure 4 shows insertion loss curves for circuits
made on the same material, but comparing the insertion
loss for circuits with bare copper to circuits with the
ENIG finish. Figure 4 helps to illustrate several issues.
The material with ENIG finish shows a clear trend
towards higher loss than the material with bare copper.
But the loss characteristics are somewhat different at
lower frequencies. This is largely because the nickel is so
thick and the current density due to skin depth is using
more nickel than copper or gold at the lower frequencies.
At about 20 GHz, the skin depth is such that the gold is
being used more. As the frequency increases, more of the
gold is used and the insertion loss curve for the ENIG
material starts to parallel curve for the material with
bare copper.
Silver
Pure silver is more conductive than pure copper, but
the immersion silver process used to add silver as a PCB
finish actually employs silver alloy and not pure silver.
It is close to pure silver, so the conductivity of the silver
alloy is very good and close to that of copper. The immersion silver process is self-limiting, so that silver is added
in a thin coating, typically in the range of 0.2 μm.
Unfortunately, silver will oxidize over time, in contrast
to gold which does not oxidize. Still, even though oxidation of silver will change its appearance, it apparently
does not significantly impact the insertion-loss performance of a finished PCB. Studies by the author of circuits with silver oxides of more than 2.5 years in age did
not show significant difference in insertion loss.
It should be pointed out that signal launch was an
issue with the data shown in Figure 4. Those curves
were produced with the aid of a commercial vector network analyzer (VNA) capable of measurements to 50
GHz. But the curves were cutoff at 35 GHz due to poor
signal launch, as evidenced by the noise above 35 GHz.
With more effective signal launch, the ENIG curve in
Figure 4 could be expected to parallel the loss curve for
the material with bare copper from about 25 GHz to 50
GHz and possibly higher.
As noted, insertion loss has many loss components,
and understanding those components can be helpful to millimeterwave circuit designers. To help
gain this understanding, a personal computer (PC) software program, MWI-2010, available for
free download from the Rogers
Corp. website (www.rogerscorp.
com), can show the different components of insertion loss. The
program is based on work by
Hammerstad and Jenson [2] outlining computer routines for modeling microstrip transmission
lines for impedance and loss characteristics. The MWI-2010 software’s capability to predict
microstrip radiation loss, which
has been found to be relatively
accurate, is based on the work of
Wadell [3].
Figure 5 shows different loss
components of circuit insertion
loss for two different circuit-material thicknesses, using the modeling power of the MWI-2010 software. The circuit model assumed
the proper conductor width for a
50-Ω transmission line, using a
circuit material with Dk of 3.66
and 1-oz. copper. If radiation loss
is initially ignored, the relationship between dielectric loss and
conductor loss is apparent. At
lower microwave frequencies
(below 15 GHz), the thinner
10-mil-thick circuit reveals conductor loss to be the dominant
component of total insertion loss.
The thicker, 30-mil-thick circuit
has higher dielectric loss than
conductor loss. Within this range
of frequencies, a circuit designer’s
choice of materials based on copper (conductor loss) and dissipa-
tion factor (dielectric loss) will be based on the thickness
of the circuit. Within the range of frequencies shown in
Figure 5, radiation losses are not dominant, although
they are significant for the 30-mil-thick circuit at 15
GHz.
Radiation Losses
Radiation losses shown in Figure 5 are dependent on
both frequency and circuit thickness. At less than 15
Get info at www.HFeLink.com
29
High Frequency Design
Circuit Materials
GHz the radiation loss for the 10-mil-thick circuit is
nearly insignificant while the radiation loss for the
30-mil-thick circuit is significant. This is a general rule
that thinner circuits are better for minimizing radiation
loss. When millimeter-wave frequencies (above 30 GHz)
are considered, radiation loss can contribute a significant amount to total loss for a thicker circuit compared
to a thinner circuit.
In addition to PCB material thickness, radiation loss
is also dependent on a PCB material’s Dk value. Circuit
materials with higher Dk values tend to exhibit less
radiation losses than those with lower Dk values,
although typically at the cost of higher conductor loss.
Also, to achieve the same impedance, narrower signal
conductors are needed on a material with higher Dk
value than on one with lower Dk value, and narrower
conductors will suffer higher conductor loss than wider
conductors.
Circuit design will impact radiation loss, as any
impedance mismatch will typically have radiation loss
associated with it. Impedance mismatches are not
uncommon in RF/microwave circuits, and can depend on
circuit configuration. Stripline circuits, for example,
typically exhibit no radiation losses, while microstrip
circuits, such as the circuit of Figure 5, can be prone to
radiation loss, dependent on circuit thickness and other
issues. When radiation losses are a concern, a GCPW
circuit design can limit radiation losses at millimeterwave frequencies. This has been detailed in a study on
optimizing the signal launch at 50 GHz for GCPW as
well as other circuit approaches [4].
The signal launch, of course, is a key element to
achieving good performance at higher frequencies, such
as in millimeter-wave circuits. Signal launching and
radiation losses are related, since an effective signal
launch, in which energy makes a transition from one
wave propagation mode to another, will yield minimal
radiation loss. For example, a typical RF connector
operates in a transverse-electric (TE) mode while a planar PCB operates in a transverse-electromagnetic
(TEM) propagation mode. A GCPW or microstrip circuit
can operate in a quasi-TEM mode while stripline can
30 High Frequency Electronics
work in a true TEM mode. At any change in mode propagation, such as where the connector meets the circuit
board, a transition is made and any stray reactances or
impedance mismatches can lead to radiation losses.
Designers of millimeter-wave circuits for high-frequency applications should not hesitate to contact their
suppliers of high-frequency circuit materials to better
understand the tradeoffs presented by different materials at these higher frequencies and the options that are
available in different PCB materials for millimeter-wave
applications. Numerous dielectric substrates are available with different copper types and different measures
of surface roughness. There are often many choices of
circuit materials within a single product family, in terms
of Dk value and dissipation factor. Manufacturers of
high-frequency circuit materials are generally willing to
work closely to help circuit designers achieve optimum
performance goals on new and existing microwave and
millimeter-wave applications.
About the Author:
John Coonrod is Market Development Engineer for
the Advanced Circuit Materials Division of Rogers
Corporation, Chandler, AZ. He can be reached at john.
coonrod@rogerscorp.com.
References:
[1] Allen F. Horn, John W. Reynolds, and James C.
Rautio, “Conductor Profile Effects on the Propagation
Constant of Microstrip Transmission Lines,” IEEE
MTT-S International Microwave Symposium, 2010.
[2] E. Hammerstad and O. Jenson, “Accurate models
of microstrip computer aided design,” 1980 MTT-S
International Microwave Symposium Digest, May 1980,
pp. 407-409.
[3] Brian C. Wadell, “Transmission Line Design
Handbook,” Artech House, Norwood, MA, 1991, p. 99.
[4] Bill Rosas, “Optimizing Test Boards for 50 GHz
End Launch Connectors: Grounded Coplanar Launches
and Through Lines on 30-mil RO4350B with Comparison
to Microstrip,” Southwest Microwave, Inc., Tempe, AZ,
2007, www.southwestmicrowave.com.
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CERTIFIED
High Frequency Design
EMC Simulation
EMC Simulation of Consumer
Electronic Devices
By Andreas Barchanski
To ensure safe and
reliable operation, all
electronic devices must
meet EMC standards. By
including EMC compliant design at an early
stage, additional costly
design iterations can be
avoided later on down
the line. This article describes a workflow for
the EMC simulation of a wireless router,
using techniques that can be applied to a
wide range of consumer electronic devices. A
number of EMC considerations are shown
and discussed, including board-level EMC
analysis, the effect of the device’s enclosure,
cable entry susceptibility, and the use of segmentation to study how a component affects
the larger system.
Describing a workflow for
the EMC simulation of a
wireless router, using
techniques that can be
applied to a wide range
of consumer electronic
devices.
Introduction
The flow of currents within electronic
devices generates electromagnetic fields.
When multiple devices operate in a shared
environment, these fields can couple between
them, and this can affect their performance
or even lead to failures.
To reduce the risk of electromagnetic compatibility (EMC) problems, regulatory limits
restrict the emissions that devices can produce, and the design process must take these
specifications into account. However, the
effects that give rise to EMC problems, such
as resonances, couplings and field leakage,
are complicated and often hard to calculate,
and so traditionally EMC engineering was
associated with measurement.
This meant that EMC testing was carried
out late in the design process, after a prototype had been constructed. Constructing a
prototype represents a considerable investment in development, in terms of time, labor
32 High Frequency Electronics
and capital, and troubleshooting EMC problems at this late stage can require considerable effort. In a complex electronic system, it
was often prohibitively difficult to locate the
source of an EMC problem, and instead all
the engineer can do is fight the symptoms.
With simulation, the EMC properties of a
design can be checked at any stage of the
development cycle. In particular, the results
of simulation can influence the design, allowing multiple possible configurations – for
example, the alignment of a board or the
position of a component – to be tested comparatively quickly and cheaply.
The example used in this article is a wireless router, kindly provided by Cisco. This
router includes a number of components
which can be analyzed for EMC reasons during the design process, and which require a
variety of simulation methods for a complete
analysis.
PCB Rule-Checking and Simulation
One simple and widely used approach for
identifying possible EMC problems is to
apply design rules when laying out PCBs.
These rules are based on years’ worth of
experience of “best practice” gained by EMC
experts working in the field, and are intended to prevent engineers from designing
boards that radiate too much energy or introduce too much noise into the signals. A few
examples of such rules are:
• Critical Net Near Edge of Reference
Plane – A limit on how near signal lines
can be to the edge of the board or reference plane. Lines close to the edge can
generate larger radiated emissions and
couple to other components.
• Critical Differential Net Length
Matching and Spacing – This ensures
that pairs of lines carrying differential-
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504 Rev B
High Frequency Design
EMC Simulation
Figure 1 • Radiated fields around a microstrip.
mode signals have similar lengths. Too great a difference between the two causes common-mode
noise, which leads to both EMC and signal integrity (SI) problems.
• Critical Net Near I/O Net – High-speed signals can
couple into input and output nets, such as USB
controller nets. As these nets leave the PCB and
often run along long cables, they pose a significant
risk of re-radiation.
To demonstrate the importance of careful net placement, a 5 cm long microstrip line was modeled on the
edge of an FR4 substrate with a relative permittivity of
Figure 2 • Resonances for a source located in the corner of the enclosure.
34 High Frequency Electronics
4.2, as shown in Figure 1. The line was terminated on
one side by a 50 ohm resistor and fed by a broadband 1
volt source on the other side. The position of the line
was parameterized: an offset of 0 mm corresponds to the
line being located at the edge of the substrate, while at
an offset of 9 mm the line is located in the center. A
simulation was run using the time domain finite integration technique (FIT) solver in CST MICROWAVE
STUDIO®, with horizontal electric field at a distance of
3 meter being recorded using a field probe. From the plot
on the right hand side, we can clearly see how the radiated field depends on the frequency and the position of
the microstrip. Moving the line from the center to the
edge of the substrate increased the radiated electric
field by more than 30 dB; potentially a huge increase in
emissions.
Once a potential problem has been identified, the
engineer needs to decide whether it is severe enough to
warrant a redesign of the board. Full-wave simulation is
a useful tool here – the design can be imported into a 3D
electromagnetic simulation to examine the fields generated when in use. If the position of a component or trace
can be parameterized, a parameter sweep can be used to
investigate whether the benefits of, for example, moving
a trace away from the edge of the board justify the extra
design work.
Designing a complex multi-layer high-speed board to
fulfill all of the design rules rigorously would be very
difficult, as well as being poor use of time and effort. For
many nets, rule violations will not always lead to EMC
problems, and different types of device need different
rule sets. Power electronics, for example, will not have
the same EMC problems that a high-frequency RF
device has.
The smartest way to apply design rules is to designate certain parts of the board, such as I/O nets, highspeed data lines and clock signals, as being especially
critical. Rule-checking software such as CST
Figure 3 • Resonances for a source located in the center.
BOARDCHECK™ can then examine these areas against
a set of design rules to highlight all violations, without
the risk of human error.
In a real device, however, the PCBs do not simply sit
in isolation. The environment around the board, such as
the other components, cables and the enclosure itself,
can give rise to further EMC problems.
For instance, many devices work in the range of hundreds of megahertz up to gigahertz. At these frequencies, the wavelength of the EM fields is comparable to
the size of cables and the enclosure, and when fields
couple to these they can produce resonances.
Because of their nature, resonances are slow to simulate with time domain methods – a high-Q resonance
will keep ringing for a long time. Frequency domain
simulation methods are a better fit for these sorts of
problems. As a first step in testing the EMC properties
of the router’s housing, a very simple model is constructed, driven by a discrete port.
A broadband frequency simulation shows multiple
resonant modes (Figure 2), each of which might contribute to the emissions of the device. If there is a noisy
component which is radiating at a resonant frequency, it
is often worth moving it to somewhere else on the board.
As shown in Figure 3, moving the source from the corner
of the enclosure to the edge produces very different resonances.
Once we have an idea about how the enclosure
behaves, we can then model the device in greater detail.
Due to their size and construction, heat-sinks are often
a major source of EMC problems on PCBs – they are
usually mounted over high-speed signal lines, and this
means that currents couple into them and produce fields
that are re-radiated.
Instead of using just a simple voltage source, we can
use a realistic model of the heat-sink (Figure 4) and
investigate what fields this produces. We can simply
place the heat-sink model in the full router model, but
then this mesh will extend throughout the simulation
domain, slowing down calculation time.
For detailed models – for example, an integrated circuit or a multilayer PCB – it is more efficient to model
the component separately using a hybrid approach with
two different solver technologies. The detailed model is
simulated using the time domain FIT method, suitable
for components, and a nearfield monitor captures the
field around it. This source is then imported into the
router model (Figure 5), and used to drive a simulation
Figure 4 • The heat-sink and a 3D simulation model.
Figure 5 • A nearfield source replacing a detailed
model.
35
High Frequency Design
EMC Simulation
Figure 6 • Detailed vent (top), compact vent model (bottom), and a comparison of the two.
with the transmission line matrix (TLM) solver, which is
well suited to enclosures.
With a detailed model, the engineer can try mitigation strategies such as adding grounding pins or changing the number of fins on the heat-sink. The dimensions
of the model can even be parameterized; the System
Assembly and Modeling (SAM) approach of CST STUDIO
SUITE® can carry out a parameter sweep and cascade
the changing nearfield into the full simulation – in this
case, to calculate the interaction between the heat-sink
and the radio frequency components in the bottom-left
hand corner of the router. With SAM, a series of simulations can be carried out automatically simply by defining tasks in CST DESIGN STUDIO™, using monitors
and ports to transfer data between different parts of the
simulation.
Designing the Enclosure
Fields can leak through seams, vents and panels, and
so it is very important to consider these in the calculation. However, the details of such features are usually
very small, which makes them time-consuming to simulate. The simulation can be sped up by applying compact
models. Compact models in the TLM solver replace these
fine structures with an efficient equivalent representation which nevertheless interacts with fields the same
way.
Figure 6 compares the detailed and compact model of
a hexagonal vent, with hole side-length 1.74 mm and a
depth of 1 mm. The compact model exhibits the same
behavior as the detailed model; the field strength results
are very similar across the entire frequency range. Not
only do the compact models solve faster (for the example
in Figure 6, simulation time was halved by compact
Figure 7 • Seam leakage (left) and vent leakage (right) at 1.3 GHz.
36 High Frequency Electronics
Figure 9 • A simplified model of the router, showing the
cable (blue) entering the device.
Figure 8 • Broadband results for the router, with the
unenclosed PCB as a reference.
models), they also require a less detailed mesh, which
leads to even larger time-savings for electrically large
models.
The simulation results for the complete device are
shown in Figure 7 and Figure 8. Compact models were
used for the cooling vents on the left and right sides of
the device, and for the seams where panels of the case
meet.
At 1.3 GHz, there is some leakage of fields through
the enclosure – however, this is still several orders of
magnitude lower than the fields seen around the unenclosed PCB. However, at around 1.95 GHz, there is a
sharp rise in the E-field around the router, and the radiated emissions are almost as high as those if no enclosure at all was present. This corresponds to leakage
through the power socket aperture – without this hole,
there is a 20 dBuV/m difference in emissions.
Susceptibility
As well as keeping emissions low, engineers also
have to ensure that external fields do not interfere with
the device. One common cause of interference problems
in devices is cabling. Long cables effectively act as
antennas to external fields, channeling waves into the
device.
However, traditional 3D simulation methods struggle with modeling cables, which can be several meters
long but only a few millimeters wide, with an often
complex internal structure. For these sorts of cables and
cable harnesses, a hybrid cable simulation can be very
efficient.
Cable simulation can be unidirectional or bidirectional, depending on which couplings are taken into
account. In a unidirectional simulation, the solver calculates either the fields generated by currents flowing
within the cable, or the currents induced in the cable by
external fields – this is effectively the same approach
used earlier to model the heat-sink separately from the
PCB.
In a bidirectional simulation, however, the cable is
simulated alongside the 3D model. This means that
both effects are taken into account, so that, for example,
fields can radiate from the cable, induce currents within
the device enclosure, and then the re-radiated fields
interact once more with the cable. Bidirectional simulation is not offered by all cable simulation tools, but it
produces a more physically accurate simulation.
The wireless router in question includes a USB port,
and we want to study how a USB cable could couple
energy into the device. USB cables are hybrid cables,
with one 5 V power wire, one ground wire and a twistedpair set of signal wires. Although this would be difficult
to build as a 3D model, we produce a hybrid model by
defining the cable route and cross-section in CST
CABLE STUDIO®. All the relevant properties of the
cable can be adjusted, including the twist-rate of the
twisted pair, the thickness and permittivity of the insulators and the material and design used for the shielding. In this case, we’re using braided shielding, but a
number of frequency-dependent shield models are available, and arbitrary shields can be simulated by importing transfer impedance measurements.
We define an USB cable entering the chassis, consisting of a long path of shielded cable outside of the
enclosure and a short path of unshielded cable inside,
illustrated in Figure 9. We then carry out two bidirectional simulations, varying the connection between the
cable shield and the chassis. In one, the path between
the shield and the chassis has a low resistance, representing a good connection, while in the other, there is a
very high resistance between the two. A broadband
plane wave is used to excite the structure, to model the
37
High Frequency Design
EMC Simulation
Figure 11 • E-field values in the center of the device.
Figure 10 • E-fields within the device for (top) the
connected chassis and (bottom) the disconnected
chassis.
irradiation of the structure by a powerful external electromagnetic pulse (EMP). Again, probes are used to
monitor the fields inside the enclosure.
As shown in Figure 10 and Figure 11, the connection
between the shield and the chassis has a major effect on
the susceptibility of the device to external radiation.
With the cable shield well connected, the peak E-field
measured was around 15 V/m. However, when the screen
was disconnected, E-fields reached almost 3000 V/m.
From these simulations, we can conclude that the
connection of the cable screen to the chassis is critical
from a susceptibility point of view. During the design
phase, care needs to be taken to make sure that this connection is well defined, and it is also important that this
connection should not deteriorate during the lifetime of
the device, as the reduced connectivity for example
caused by aging effects can drastically increase the susceptibility of the device.
38 High Frequency Electronics
Conclusion
With simulation, the engineer can investigate a wide
range of EMC characteristics of a design long before
going into the lab for measurement. From rule-checking
at the early stages of layout, to full system simulation
alongside traditional prototypes, simulation can be used
at any stage of the product design workflow.
Components can be tested not just in isolation, but
as part of a complex system – with SAM, different simulation techniques can be used on different parts of the
system as appropriate. Additional specialized hybrid
methods for modeling PCBs, cables and fine structures
allow these often-complicated elements to be simulated
in conjunction with the rest of the device.
This article has presented a simulation workflow for
analyzing the EMC of a wireless router, and shown how,
when problems are identified, simulation can also be
used to help find a solution: alternative designs to be
checked without the expense of constructing multiple
prototypes.
About the Author:
Andreas Barchanski is the EMC
Market Development Manager at CST
(www.cst.com). He holds an M.Sc.
degree in Physics and a PhD in
Numerical Electromagnetics from the
Technical University Darmstadt. He
joined CST as an Application Engineer
in 2007. Besides EMC, his main interest lies in the simulation of various
electronic systems ranging from high-speed digital to
power electronics.
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including LOW SMOKE/ZERO HALOGEN polyurethane jacketing and TUF-FLEX internal
armoring are available for applications requiring enhanced mechanical protection.
SMA, precision TNC and N Type connectors are standard for frequencies up to 18 GHz.
C, SC and 7-16 connectors are also offered.
Visit
Us At
IMs 2013
Booth
#946
specifications
Impedance:
time delay:
cut off frequency:
capacitance:
Weight:
rF leakage, min:
-100 dB to 18 GHz
temp range:
-65˚C to +165˚C
cable outer diameter:
0.31”
Velocity of propagation: 83%
ul flame retardant rating: VO
50 ohmΩ
1.2 ns/ft.
18 GHz
24 pf/ft.
7.8 lb./100 ft.
Max RF Power in Watts
20˚C at Sea Level
Attenuation in dB/100 ft
Insulated WIre, Inc.
203.791.1999
www.iw-microwave.com
sales@iw-microwave.com
Attenuation in dB/100 ft
Max RF Power at 20˚C & Sea Level
30
2000
28
1800
26
24
1600
22
1400
20
1200
18
Watts 1000
dB 16
800
12
14
10
600
8
400
6
4
200
2
0
0
2
4
6
8
10
Frequency (GHz)
12
14
16
18
2
4
6
8
10
12
14
16
Frequency (GHz)
Call us today with your project specs and we’ll show you the most reliable way to
get connected in the industry.
We’re how the microwave industry gets connected!
18
Scan code to find
out how you can
get connected
High Frequency Products
NEW PRODUCTS
  
  
Q
 
     
   
   
Low ESR/ESL
Case Size: 0505, 1111 & EIA sizes
conductor SP5T switches targeting
T/R and filter-band switching in
Land Mobile Radio and Military radio applications where high power
handling (17 W) is required. The
PE42850 and PE42851 feature low
power consumption of 130 microamperes which helps to extend battery life in mobile applications.
three orders of magnitude less than
Brass/Nickel connectors (10-2)—resulting in an extremely low distortion of magnetic field.
VidaRF
vidarf.com
RFMW
rfmw.com
NEW  
0201BB: 16kHz - 50GHz
• Insertion Loss: < 1db
• Value: 100nF
• 16 WVDC
Generators
0402BB: 16kHz - 35GHz
• Insertion Loss: < 1db
• Value: 100nF
• 16 WVDC
 
Relay
Series / Parallel combinations
   
      
   

• Unmatched customer service
• Online store for immediate
availability
• Design kits in stock
• Inventory programs
Call us today at 631-425-0938
or email us at
sales@passiveplus.com
www.PassivePlus.com
Get info at www.HFeLink.com
44 High Frequency Electronics
RelComm Technologies, Inc. offers
a low cost high performance 1P12T
relay configured with 'SMA' type
connectors providing exceptional
RF performance to 18 GHz. It measures 2.25" square, is less than 2"
tall, and is fitted with standard
DA15P header for ease of installation. The relay is available in both
latching and failsafe configurations
with 12 & 24 volts DC operation.
Options include TTL control input.
B&K Precision added three direct
digital synthesis sweep function
generator models: 4014B, 4040B,
and 4045B. All generate stable and
precise sine, square, and triangle
waveforms, and provide output
voltages from 0 to 10 Vpp into 50
ohms or 20 Vpp into open circuit.
The 4014B is a new 12 MHz function generator with sweep and AM/
FM modulation functions, while the
4040B and 4045B replace previous
20 MHz models.
B&K Precision
bkprecision.com
RelComm Technologies
relcommtech.com
Non-Magnetic Connectors
VidaRF offers a non-magnetic version in the SMA, SMB, SSMB, SMC,
MCX AND MMCX coaxial connectors for medical and other applications requiring low magnetic
susceptibility. They use low permittivity materials to achieve a magnetic susceptibility of (10-5), about
Switches
A new suite of SPST through SP6T
switches are designed to meet
high power-handling requirements
from 50 to 200 Watts. They are
available in QFN-style packages
and thermally conductive flange-
High Frequency Products
NEW PRODUCTS
mount packages. Designed and
manufactured with PIN diode
technology, they are 100 percent
RF tested (small signal), have
robust carrier construction, and
are manufactured with thick
deposition thin film traces.
KCB Solutions
kcbsolutions.com
Capacitor Kits
Passive Plus, Inc. has new low ESR
capacitor sample design kits available. Offered in magnetic termination, kits contain 10 pieces per value, and range from 13 – 19 values
per kit (depending on case size and
capacitance). Kits are available for:
0201N = .020” x .010” values range
from 0.2pF – 100pF; 0402N = .040”
x .020” values range from 0.1pF –
33pF; 0603N = .060” x .030” values
range from 0.1pF – 100pF; 0805N
= .080” x .050” values range from
0.1pF – 220F; 1111N = .110” x .110”
values range from 0.2pF – 1000pF.
Passive Plus
passiveplus.com
Attenuators
RFMW, Ltd. provides access to a video overview of the Telemakus LLC
series of USB Controlled Digital Attenuators. Using the TEA4000-7 as
an example, the video steps through
the functionality of the device by using its built-in GUI. The TEA4000-7
is a laboratory-quality, 7-bit Digital
Attenuator with 31.75 dB range in
0.25 dB steps.
RFMW
rfmw.com
Times microwave sysTems (Tms)
manufactures high performance,
flexible low loss 50 ohm cables for
wireless applications. Known best
for their LMR® series of cables,
TMS cables are found in a variety
of applications, such as 2-way land
mobile, cellular, telemetry and
other wireless products. Times
Microwave LMR® Cables can be
used in base stations as antenna
jumpers, cell towers for pole
feeder runs and even air handling
plenums. Times Microwave
LMR® Cables have performance
comparable to copper cables,
but are non-kinking, extremely
flexible and offer easy connector
installation. LMR® cables are only
manufactured by Times Microwave
Systems. Insist on genuine Times
Microwave LMR® Cables.
Contact CDM Electronics for pricing and availability:
856-740-1200
sales@CdmElectronics.com
www.CdmElectronics.com
Get info at www.HFeLink.com
46 High Frequency Electronics
Resistors
Vishay Intertechnology launched a
series of QPL MIL-PRF-55342-qualified surface-mount chip resistors
that provides established reliability with an "R" level failure rate of
0.01 % per 1,000 hours. Built using
a moisture-resistant tantalum nitride resistive film technology, the
resistors offer enhanced specifications for military and aerospace applications, including tolerances to
0.1 % and TCR of 25 ppm/°C.
Vishay Intertechnology
vishay.com
DISTRIBUTOR AND MANUFACTURER’S REPRESENTATIVES
C. W. SWIFT & Associates, Inc.
Featuring Coaxial Connectors, Adapters, and Interface Gages from SRI Connector Gage
1.85 mm · 2.4 mm · 2.9 mm · 3.5 mm · N · SMA · TNC · ZMA
Connectors for low-loss cable · Interface gages · Custom designs
We stock RF, microwave and millimeter wave connectors, adapters, and interface gages from
SRI Connector Gage and other fine manufacturers. Call today for a quote.
C. W. SWIFT & Associates, Inc.
15216 Burbank Blvd.
Van Nuys, CA 91411
Tel: 800-642-7692 or 818-989-1133
Fax: 818-989-4784
sales@cwswift.com
www.cwswift.com
CLOSED EVERY ST. PATRICK’S DAY !
High Frequency Products
NEW PRODUCTS
CS capacitors have low equivalent
series resistance making them an
excellent choice for switching power
supplies, DC to DC converters and
other high ripple current applications.
Cornell Dubilier
cde.com
Limiter
PMI Model No. LM-0518-10-1WSHS-2-M-1218 is a high power limiter that operates from 12.0 to 18.0
GHz. It handles 100 Watts Peak
Power with a pulse width of 1usec.
Insertion loss is only 1.5 dB typically and has a VSWR of 2.0:1 maximum. This limiter is supplied in a
small housing measuring only 1.0"
x 1.0" x 0.4".
equipment, base stations, switching
hubs, router and line filters.
AVX Corp.
avx.com
Planar Monolithics Industries
pmi-rf.com
Connector Catalog
Digitizer
Synthesizer
Phase Matrix's newest addition to
the QuickSyn® line of microwave
frequency synthesizers is a 10 GHz
synthesizer housed in a very compact package: 4 x 4 x 0.8 inches.
Model FSL-0010 employs the phaserefining QuickSyn® technology,
which allows this line to perform
with remarkably low phase noise,
switch between frequencies quickly,
and consume power efficiently.
Agilent Technologies introduced the
U5303A, a compact dual-channel
PCIe digitizer with 12-bit resolution, sampling up to 3.2 GS/s, and
on-board real-time processing. It delivers unprecedented analog fidelity, high effective number of bits and
very low noise. The U5303A is an
ideal 12-bit high-speed digitizer for
systems in commercial, industrial,
aerospace and defense applications.
SGMC Microwave’s new 2013 product catalog includes the company’s
latest coaxial connector offerings
including cable connectors, receptacles and adapters. SGMC Microwave serves the Defense, Test
& Measurement, Telecommunications, Satellite, and Aerospace industries with high-performance
microwave and millimeter-wave
connectors, and has built a reputation for premier quality, reliability
and performance.
SGMC Microwave
sgmcmicrowave.com
Agilent Technologies
agilent.com
Phase Matrix
phasematrix.com
Capacitors
AVX Corp. introduced the TCJ 100V
and 125V tantalum polymer capacitors. As the highest rated voltage
tantalum capacitors on the market,
they provide excellent capacitance
and ultra-low ESR in a compact
case size. They can be used for a
wide array of high-voltage applications including telecommunications
48 High Frequency Electronics
Amplifier
Capacitors
Cornell Dubilier announced its Type
CS multilayered polymer capacitors
for 125 °C applications with 6/6
ROHS compliance. Terminated
with multiple pin connections, Type
RFMW, Ltd. announced design
and sales support for a 2-stage,
high gain, low noise amplifier
from Skyworks Solutions. The
SKY67161-306LF provides 3545dB of gain with a noise figure of
only 0.3 dB. Operating from 600 to
1100MHz, the Skyworks SKY67161-
www.highfrequencyelectronics.com
High Frequency Electronics magazine
An effective advertising medium to reach design engineers
· Respected technical content
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· Subscriber services — subscriptions & renewals
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tutorials, editorials
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Special Services
Use our expertise in print and electronic media
· Article reprints, catalogs, brochures
· Mail list rental
· Trade show promotions & literature distribution
· Newsletter and promotional e-mails
· Other needs? Just ask!
Publisher
U.K and Europe
ADVERTISING SALES — CENTRAL
ADVERTISING
SALES — EAST COAST ADVERTISING SALES—WEST—NEW
Scott Spencer
ACCOUNTS
Sam Baird
Keith Neighbour
Gary Rhodes
Tel: 603-472-8261
• Fax: 603-471-0716
Jeff Victor
Tel: +44 1883 715 697
Tel:
773-275-4020,
Fax:
773-275-3438
Tel: 631-274-9530, Fax: 631-667-2871 Tel: 224-436-8044 • Fax: 509-472-1888
scott@highfrequencyelectronics.com
Fax: +44 1883 715 697
keith@highfrequencyelectronics.com
sam@highfrequencyelectronics.com
grhodes@highfrequencyelectronics.com jeff@highfrequencyelectronics.com
Advertising Sales — East
Gary Rhodes
Advertising SalesPUBLISHER
— central— OTHER REGIONS
U.K
Europe
& and
INTERNATIONAL
ADVERTISING
SALES — WEST
Vice President, Sales
Keith Neighbour
Zena Coupé
Scott
Spencer
Tim Burkhard
Tel: 631-274-9530
• Fax: 631-667-2871
Tel: 773-275-4020 • Fax: 773-275-3438
Tel: +44 1923 852 537
Tel: 603-472-8261, Fax: 603-471-0716
Tel: 707-544-9977, Fax: 707-544-9375 keith@highfrequencyelectronics.com
grhodes@highfrequencyelectronics.com
Fax: +44 1923 852 261
zena@highfrequencyelectronics.com
scott@highfrequencyelectronics.com
tim@highfrequencyelectronics.com
Advertising Sales — west
Product Showcase
Tim Burkhard
Joanne Frangides
Associate Publisher
Tel: 201-666-6698 • Fax: 201-666-6698
Tel: 707-544-9977 • Fax: 707-544-9375
joanne@highfrequencyelectronics.com
tim@highfrequencyelectronics.com
High Frequency Products
NEW PRODUCTS
306LF’s active bias design enables
high
linearity
coupled
with
unconditional stability for cellular
infrastructure, repeaters and small
cell applications.
RFMW
rfmw.com
Power Sensor App
Module
PMI Model No. PFEM-9D4G-CD-1
is a multi-function module that provides amplification, switching and
filtering within the frequency band
of 9410 MHz. This module provides
two input channels and is switchable to a common output. It is designed to offer multiple gain level
selection, high channel to channel
isolation and fast switching speeds.
The new Power Viewer Mobile app
from Rohde & Schwarz transforms
AndroidTM smartphones and tablets into high-precision base units
for power measurements. USBcompatible R&S NRP power sensors can now display the measured
average power value directly on
mobile devices with the Android 4
operating system. The app can be
downloaded for free at the Google
PlayTM Store.
Rohde & Schwarz
rohde-schwarz.com
Planar Monolithics Industries
pmi-rf.com
Synthesizers
Termination
Mini-Circuits’ model TERM-500W14D+ is a high-power, 7/16 Din
Termination featuring: wideband
coverage, 0.7 to 7.5 GHz; useable
from 0.5 to 10 GHz (return loss,
20 dB typ. at 4 GHz); and rugged
construction. Applications: cellular
communications; satellite communications; defense communications;
test set-up.
Mini-Circuits
minicircuits.com
50 High Frequency Electronics
Micro Lambda Wireless has completed development of three, YIG
based synthesizer product lines.
These small size (2.5” x 2.5” x 1.0”)
and low power consumption (< 8
Watts) are specifically designed for
high data rate (>100 Mbps) QAM
digital radios. Telecom and satcom
applications and wide band low
noise synthesizers for test and measurement. Small Size, low noise,
and wide band (3.0” x 5.0” x 1.0”) for
PXI and compact PCI chassis.
Micro Lambda Wireless
microlambdawireless.com
HFE’s
Product
Showcase
Classified
Advertising
Your ad will
stand out
when it’s
displayed in
our Product
Showcase!
For more
information, or
to place your
ad, please
contact:
Joanne Frangides
Tel : 201-666-6698
Fax: 201-666-6698
joanne@
highfrequencyelectronics
.com
Product Showcase
Advanced
Switch
Technology
754 Fortune Cr, Kingston, ON
K7P 2T3, Canada.
613 384 3939
info@astswitch.com
Our line of Waveguide, Coaxial and Dual Switches are the most
reliable in the industry, but don’t just take our word for it. Join
the hundreds of satisfied customers who use our switches every
day.
30
Years
When only the best will do
www.highfrequencyelectronics.com
Product Highlights
ADCs
Texas Instruments Inc. introduced a family of 12-bit,
500- to 900-MSPS analog-to-digital converters (ADCs) that
reduce board space by 80 percent while providing industryleading signal-to-noise ratio (SNR) and spurious-free
dynamic range (SFDR). The ADS5409 family provides
best-in-class performance in a significantly smaller footprint for T&M equipment, wideband LTE and LTEadvanced communications base stations, millimeter wave
backhaul (v-band and e-band), and defense electronics.
Connector Search Tool
Coaxial Components Corp. has developed a search tool
for cross referencing the company’s extensive database of
RF components. The database encompasses product lines
from more than a dozen manufacturers and dates back to
the early 1970s. Now, Coaxicom has incorporated the
comprehensive cross-referencing tool into the company’s
new website, launched earlier this year.
Coaxicom
coaxicom.com
Texas Instruments
ti.com
Connector Wrench
The “Swift Wrench” is handy for anyone who works
around microwave connectors. While not a substitute for
a calibrated torque wrench, it fits a standard 5/16 inch
coupling nut and is designed to approximate the correct
mating torque (7-10 in-lbs.) for SMA, 2.92 mm, and 3.5
52 High Frequency Electronics
mm connectors. Made of nearly indestructible polycarbonate, these do well in the field and in tight spaces where a
conventional wrench just won’t fit.
C.W. Swift & Associates
cwswift.com
Product Highlights
VNAs
Rohde & Schwarz presents the new midrange R&S
ZNB20 and R&S ZNB40 vector network analyzers for
frequency ranges from 100 kHz to 20 GHz and from 10
MHz to 40 GHz. These powerful analyzers are equipped
with two test ports and offer outstanding measurement
characteristics that are on a similar level as high-end
instruments. A dynamic range of up to 135 dB makes the
new instruments perfect for tasks such as performing
measurements on high-blocking DUTs such as filters.
Cable Assembly Configurator
Molex launched an online RF Assembly Builder for
distributors, customers and prospective customers.
Available now at www.molex.com/molex/family/RF_
Configurator.jsp, the free configurator tool simplifies the
design process and allows the user to build a complete
assembly and instantly submit an RFQ, without downloading any application or software.
Molex Inc.
molex.com
Rohde & Schwarz
rohde-schwarz.com
Power Amplifier
Microsemi’s MSC2931P3540 is a power amplifier supplying a minimum of 10 W of output power at P1dB over
a base plate temperature range of -55 °C to + 70 °C for use
in Ka Band SATCOM uplink applications. It operates
from 29.5 to 31.0 GHz with a nominal gain of 38 dB and
operates from a single +5V supply. The unit is equipped
with current limiting for input overdrive conditions, thermal shutdown protection, and a transmit-enable function,
which are monitored or controlled via a 13-pin connector.
Microsemi
microsemi.com
53
Product Highlights
Design Tools
The Global Navigation Satellite System baseband
verification and Digital Modem libraries allow system
designers and algorithmic researchers to bring instrument-grade standards references into design simulation
early in the R&D process. Satellite and communications
systems can now be verified under a variety of realistic
impaired conditions, before baseband or RF hardware is
available, enabling faster deployment of high-performance systems.
LNAs
MITEQ’s SAFSW Series of K-Band Waveguide
Amplifiers offer very low noise figure [1.25 dB @+25°C
from 18 to 21 GHz] operation in extreme airborne environments. An integral transmit band filter can also supply 60
dB minimum of rejection at 30 GHz. MITEQ’s design can
be powered by either +12 to +15 VDC or +5 VDC for minimum power dissipation. DC power can also be supplied
over the RF coaxial outdoor connector for use in high signal
strength environments where EMI is a concern.
Agilent Technologies
agilent.com
MITEQ
miteq.com
GaAs MMIC
Northrop Grumman Corp. has developed new gallium
arsenide (GaAs) Monolithic Microwave Integrated Circuit
(MMIC) high-power amplifiers operating in the E-Band
communication frequency spectrum. The APH667 and the
APH668 are GaAs-based broadband, three-stage amplifi-
54 High Frequency Electronics
er devices that operate from 81 – 86 GHz and 71 – 76 GHz
respectively.
Northrop Grumman
northropgrumman.com
Product Highlights
Connectors
SV Microwave released its SMPS connector series,
which is the next generation in miniature blindmate connectors. The line is directly compatible with the G3PO
interface and is 45% smaller than the SMP and 30%
smaller than the SMPM. The SMPS utilizes SV’s threadless design of push-on and blindmate connectors and is
capable of frequencies exceeding 100 GHz.
VNA Cable
HASCO introduced the HVNA 26® Series Low Loss
– Phase Stable Cable for Vector Network Analyzers.
Features: Phase Stability vs. Flexure: ±2.5° @ 26.5 GHz
(when wrapped 90° around a 2” mandrel). Cable insertion
loss: 0.79 dB per ft @ 26.5 GHz. Standard lengths in stock.
HASCO
hasco-inc.com
SV Microwave
svmicro.com
Tunable Load
Model SWL-2827-T1 and SWS-28-T1 are Ka Band
Instrumentation Grade tunable load and tunable short
covering the frequency range of 26 to 40 GHz. Both products are constructed with linear bearing and high precision Mitutoyo micrometer tuning configuration to guar-
antee smooth, no turning and long term repeatable
mechanical movements. The electric performance of both
products is realized through a non-contacting structure.
SAGE Millimeter
sagemillimeter.com
55
Product Highlights
pHEMT FET
RFMW, Ltd. announced design and sales support for
TriQuint Semiconductor’s TGF2120, a discrete
1200-Micron GaAs pHEMT FET. Available in a 0.41 x
0.54 x 0.10 mm chip suitable for eutectic die attach, it is
constructed without via holes, allowing for self-biasing
and eliminating the need for a negative supply voltage. It
was designed using TriQuint’s 0.25um pHEMT process
which optimizes power and efficiency at high drain bias
operating conditions.
RFMW
rfmw.com
Digital Multimeters
The new Agilent DMMs can help students and engineers see their measurement data in new ways, get
actionable information faster and document their results
more easily. Exclusive Truevolt technology reduces extra-
56 High Frequency Electronics
TCXO
Fox Electronics now offers its XpressO TCXO with
tighter stabilities in custom frequencies up to 250 MHz.
Available with ±1.5 ppm from -40°C to +85°C as well as
down to ±1 ppm from 0°C to +70°C, the new oscillators are
an expansion to Fox’s FXTC-HE73 series that meets the
humidity, shock and vibration requirements of MILSTD-202. They are ideal for applications including telecommunications, networking, and military communications.
Fox Electronics
foxonline.com
neous factors such as noise, injected current and input
bias current for increased measurement confidence.
Agilent Technologies
agilent.com
Product Highlights
Gate Driver
RFMW, Ltd. announced design and sales support for
IXYS RF model IXRFD631, a high-current CMOS gate
driver designed to drive MOSFETs in Class D and E HF
RF applications and other applications requiring ultrafast rise and fall times or short minimum pulse widths.
The IXYS RF IXRFD631 employs a Kelvin ground connection on the input allowing the use of a common mode
choke to avoid ground bounce problems.
RFMW
rfmw.com
LabVIEW App
National Instruments announced NI LabVIEW software- and NI hardware-compatible mobile apps for
iPhone, iPad and Android devices, helping engineers integrate the latest mobile technology into their applications.
By combining the portability, ease of use, faster start-up
time and longer battery longevity of mobile devices with
Power Sensor Demo Videos
LadyBug Technologies announced a series of demonstration and installation videos for its USB power sensors. The videos show how fast, accurate measurements of
average, peak, and pulse power can be made with
LadyBug’s GUI and sensors. The pulse profiling demos
provide examples of basic signal examination of the RF
power profile using the sensor and application. Basic features such as zoom, gates and markers are shown, assisting the user in getting up and running quickly.
LadyBug Technologies
ladybug-tech.com
the power of LabVIEW, engineers can more productively
access measurement data from data acquisition and
embedded monitoring systems.
National Instruments
ni.com
57
Product Highlights
LNA
The TQP3M9039 is a high linearity, ultra-low noise
figure dual device amplifier in a 4 x 4 mm package. At 830
MHz in a balanced configuration, the LNA provides 18 dB
gain, 20.7 dBm IIP3 and 0.6 dB noise figure. The part
does not require a negative supply for operation and is
bias adjustable for both drain current and voltage. The
device is housed in a green/RoHS-compliant industry
standard QFN package.
YIG Bandpass Filters
Micro Lambda Wireless has the world’s largest selection of YIG Bandpass Filters. Products include PCB
Mount, VXIVME, Cube, Millimeter Wave, Wide Bandwidth
and Dual Channel. Frequency coverage is .5-50 GHz, with
3 dB bandwidths from 15 MHz to 500 MHz.
Micro Lambda Wireless
microlambdawireless.com
TriQuint Semiconductor
triquint.com
Variable Gain Amp
The MAAM-011100 is designed for customers who
need a versatile, broadband, low cost and ultra-small
variable gain amplifier solution for WiFi, WiMax, IMS,
Point to Point, Test & Measurement, Electronic Warfare
and Aerospace and Defense applications. It is packaged in
58 High Frequency Electronics
a convenient plastic 1.5x1.2 TDFN while still providing
superior broadband performance over competing alternatives.
M/A-COM Technology Solutions
macomtech.com
Product Highlights
High Power Amp
The BBS3G6QHM is suitable for ultra broadband
high power linear applications, laboratory, and RFI/EMC
susceptibility testing. This dual band amplifier utilizes an
LDMOS Amp for 20-1000 MHz band and a GaAsFET
Amp for high band frequency response. Employing
advanced broadband RF matching networks and combining techniques, EMI/RFI filters, and all qualified components achieve exceptional performance, and high efficiency.
Low PIM Switches
Dow-Key Low PIM switches offer the solution required
to minimize intermodulation. Now SPDT, DPDT and
SP6T with SMA or N-type connectors are available, which
are specifically designed and guaranteed to meet 3rd
order IM requirements below -160 dBc; at 1870 MHz and
at approximately +43 dBm with carrier frequencies 1930
MHz and 1990 MHz.
Dow-Key Microwave
dowkey.com
Empower RF Systems
empowerrf.com
Power Sensor
Boonton’s 55 Series Wideband USB power sensors
enable high performance, real-time testing of wideband
signals up to 40 GHz. Boonton’s innovative Real-Time
Power ProcessingTM eliminates the acquisition latency
associated with traditional peak power meters and sen-
sors, yielding lightning-fast performance in a brand new
USB platform. It is ideal for laboratory or field use, for
wireless and telecom signals or radar work.
Boonton
boonton.com
59
Product Highlights
Antenna Analysis Software
With Optenni Lab 2.0 simultaneous multiport matching becomes significantly easier and faster than before.
The multiport matching is available in two operation
modes: for antenna applications the efficiency of each
antenna port is maximized, taken into account the losses
in the matching components and the coupling between
the antenna ports; for other RF applications, such as filters or amplifiers, suitable S parameters, such as S21, are
maximized over given frequency ranges.
FEKO
feko.info
Phase Noise Analyzer
With Holzworth’s phase noise analysis products there
is no guess work as to whether results are valid to the
DUT or if there are unwanted variations or contributions
coming from the measurement system itself. Holzworth
analyzers are capable of reaching theoretical measurement limits for the highest performing DUTs. Holzworth
60 High Frequency Electronics
Power Divider
The DMS-648-ES is a compact, airborne moisture
sealed six-way power divider covering the frequency
range of 6 to 20 GHz and is used in airborne radar and
surveillance systems. This rugged broadband power
divider provides low insertion loss of 8.7 dB with high
isolation of 15 dB and an input/output return loss of 17.7
dB. Maximum amplitude and phase balances are 1.2 and
10 degrees respectively.
TRM Microwave
trmmicrowave.com
applies an ANSI z540 calibration to every analyzer built,
creating data traceability to the industry standards set
forth by NIST.
Holzworth Instrumentation
holzworth.com
Product Highlights
Diplexer
Reactel part number 2DP-PCS-75 is a diplexer with
passbands of 1850 - 1910 and 1930 - 1990 MHz. Passband
insertion loss comes in at less than 1.0 dB, with a passband
Return Loss of less than 16 dB, minimum channel to channel isolation of 75 dB, and is rated for input power of up to
250 W. It has a stellar IMD performance of less than -120
dBc. This unit can come with most any RF connector and is
sized at only 1.35” high x 6.5” wide x 8.7” long.
8-Way Combiner
Werlatone’s 20 - 500 MHz family of products in highlighted by the Model D5829. This 8-Way Combiner/
Divider covers the full 20 - 500 MHz band, and is rated at
400 W CW. The unit is also designed for 50 Watts/Input in
a Non-Coherent Combining application.
Werlatone
werlatone.com
Reactel Inc.
reactel.com
Broadband Signal Analyzer
The CS9000 and low-cost BSAs monitor, record, and
analyze RF signals and signal environments. The input
RF signal is down converted to baseband and digitized
into very deep RAM of up to 32 GB. The data in RAM can
be stored to disk for later analysis or for playback with an
Aeroflex Broadband Signal Generator. BSA analysis soft-
ware allows the operator a multidimensional view of the
data, including time domain, spectrum/spectragram and
modulation domain.
Aeroflex
aeroflex.com
61
GVA
-81
+
10 d
B
GVA
GVA -83+
-63
+
GVA
GVA -82+
-62
+
20 d
B
15 d
B
GVA
-84
+
24 d
B
+20 dBm Power Amplifiers with a choice of gain
DC to 7 GHz
PLIFIERS
*
w
2 Neels!
d
Mo
The GVA-62+ and -63+ add ultra-flat gain to our GVA lineup,
as low as ±0.7 dB across the entire 100 MHz-6 GHz band!
All of our GVA models are extremely broadband, with a wide
dynamic range and the right gain to fit your application.
Based on high-performance InGaP HBT technology, these
patented amplifiers cover DC* to 7 GHz, with a gain
selection of 10, 15, 20 or 24 dB (at 1 GHz). They all provide
better than +20 dBm typical output power, with typical IP3
*Low frequency cut-off determined by coupling cap,
except for GVA-62+ and GVA-63+ low cutoff at 10 MHz.
US patent 6,943,629
94 ¢
from
ea. (qty.1000 )
performance as high as +41 dBm at 1 GHz. Supplied in
RoHS-compliant, SOT-89 housings, low-cost GVA amplifiers
feature excellent input/output return loss and high reverse
isolation. With built-in ESD protection, GVA amplifiers are
unconditionally stable and designed for a single 5V supply.
Just go to minicircuits.com for technical specifications,
performance data, export info, pricing, and everything you
need to choose your GVA today!
Mini-Circuits…we’re redefining what VALUE is all about!
®
ISO 9001
®
ISO 14001 AS 9100
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661
The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
458 rev J
I
V
A
L
VERY LOW DISTORTION
MIXERS
+36 dBm IP3 2 to 3100 MHz
9
$
from
95 ea.
qty. 1000
Mini-Circuits shielded LAVI frequency mixers deliver the breakthrough combination of very high
IP3 and IP2, ultra-wideband operation, and outstanding electrical performance. By combining our
advanced ceramic, core & wire, and semi-conductor technologies, we’ve created these evolutionary
patented broadband mixers that are specially designed to help improve overall dynamic range.
With a wide selection of models, you’ll find a LAVI mixer optimized for your down converter and
up converter requirements. Visit the Mini-Circuits website at www.minicircuits.com for comprehensive
performance data, circuit layouts, and environmental specifications. Price & availability for on-line
ordering is provided for your convenience.
Check these LAVI Mixer outstanding features!
• Very wide band, 2 to 3100 MHz
• Ultra high IP2 (+60 dBm) and IP3 (+36 dBm)
• -73 dBc harmonic rejection 2LO-2RF, 2RF-LO
• Super high isolation, up to 52 dB
• High 1dB compression, up to +23 dBm
• Extremely low conversion loss, from 6.3 dB
RoHS compliant U.S. Patent Number 6,807,407
o S
COMPLIANT
Mini-Circuits…we’re redefining what VALUE is all about!
®
ISO 9001
®
ISO 14001 AS 9100
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661
The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
451 Rev J
Advertiser Index
CompanyPage
Advanced Switch Technology.....................................51
Aethercomm..................................................................25
AR RF/Microwave Instrumentation..............................39
CDM Electronics.............................................................46
Cernex.............................................................................18
Coilcraft...........................................................................11
CST...................................................................................15
C.W. Swift & Associates.................................................C2
C.W. Swift/SRI Connector Gage...................................47
CTS...................................................................................29
Damaskos........................................................................51
Delta Electronics............................................................45
Emerson Network Power...............................................13
Emerson Network Power..............................................C4
Herotek............................................................................14
IW Microwave.................................................................43
MECA Electronics...........................................................19
Micro Lambda Wireless...................................................9
Microwave Components..............................................31
Mini-Circuits................................................................... 2, 3
Mini-Circuits.....................................................................17
Mini-Circuits.....................................................................23
Mini-Circuits.....................................................................33
Mini-Circuits.....................................................................41
Mini-Circuits............................................................... 62, 63
Miteq.................................................................................7
Molex..............................................................................C3
National Instruments........................................................5
Passive Plus......................................................................44
Planar Monolithic Industries..........................................27
Pulsar Microwave...........................................................20
RF Bay..............................................................................51
SAGE Millimeter..............................................................28
Satellink...........................................................................51
Sector Microwave..........................................................51
SGMC Microwave..........................................................21
SignalCore......................................................................42
Teledyne Microwave Solutions.......................................1
Wenteq Microwave Corp..............................................50
Wilmanco........................................................................51
The ad index is provided as an additional service by the publisher,
who assumes no responsibility for errors or omissions.
n Find Our Advertisers’ Web Sites using HFeLink™
1. G
o to our company information Web site:
www.HFeLink.com, or
2. F rom www.highfrequencyelectronics.com, click on the HFeLink
reminder on the home page
3. C
ompanies in our current issue are listed, or you can choose one
of our recent issues
4. F ind the company you want ... and just click!
5. Or ... view our Online Edition and simply click on any ad!
Publisher
Scott Spencer
Tel: 603-472-8261
Fax: 603-471-0716
scott@highfrequencyelectronics.com
Advertising Sales — East
Gary Rhodes
Vice President, Sales
Tel: 631-274-9530
Fax: 631-667-2871
grhodes@highfrequencyelectronics.com
Advertising Sales — west
Tim Burkhard
Associate Publisher
Tel: 707-544-9977
Fax: 707-544-9375
tim@highfrequencyelectronics.com
ADVERTISING SALES—WEST—NEW ACCOUNTS
Jeff Victor
Tel: 224-436-8044
Fax: 509-472-1888
jeff@highfrequencyelectronics.com
Advertising Sales — central
Keith Neighbour
Tel: 773-275-4020
Fax: 773-275-3438
keith@highfrequencyelectronics.com
Product Showcase
Joanne Frangides
Tel: 201-666-6698
Fax: 201-666-6698
joanne@highfrequencyelectronics.com
U.K and Europe
Sam Baird
Tel: +44 1883 715 697
Fax: +44 1883 715 697
sam@highfrequencyelectronics.com
U.K and Europe
Zena Coupé
Tel: +44 1923 852 537
Fax: +44 1923 852 261
zena@highfrequencyelectronics.com
High Frequency Electronics (USPS 024-316) is published monthly by Summit Technical Media, LLC, 3 Hawk Dr., Bedford, NH 03110.
Vol. 12 No. 7 July 2013. Periodicals Postage Paid at Manchester, NH and at additional mailing offices.
POSTMASTER: Send address corrections to High Frequency Electronics, PO Box 10621, Bedford, NH 03110-0621.
Subscriptions are free to qualified technical and management personnel involved in the design, manufacture and distribution of electronic equipment and systems at high frequencies. Copyright © 2013 Summit Technical Media, LLC
64 High Frequency Electronics
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