LED Lighting Engineering
Competence Support
Compiled & prepared by,
Nick SAE SG for IADC 2014
IFX LED Lighting Competence Support
 Accelerating towards first-time right design for LED lighting electronics
 Requirements and specifications gathering
set date
 Selecting the right topology
 Dimensioning components
 Electrical simulation to validate design
 Evaluate PCB thermal performance
Evaluation
Demo Board
App Board
Demonstrator
Simulation
Pspice Simulation
Thermal Simulation
Design
App Note: Theory & Design Guide
Quick Excel Calculator
Easy-Ape
Quick hardware guides
in EMC improvement
LED Lighting Competence Support Package
Start
Copyright © Infineon Technologies AG 2013. All rights reserved.
 Quick evaluation with easy
component adaptation
to ready-to-use board
End
Page 2
Design App Note for TLD509x DCDC Multitopology Controller
 From theory to practice
 Comprehensive 10-steps design guide to
components selection and dimensioning
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 3
Design App Note for Basic LED drivers and
LIN LED Drivers
Request for availability
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Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 4
Quick Excel Design Calculator
Output calculated ideal
components dimensioning
Generate
set date
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Page 5
Pspice simulation for design verification
Pspice models for Infineon products –
Power LED Controller and *Basic LEDs
Drivers are AVAILABLE ONLINE.
Website: http://www.infineon.com/cms/en/product/power/led-driver-ic-and-lighting-ic/auto-led-driver/power-leddriver/channel.html?channel=db3a30432239cccd0122efd10ba721ed&tab=2
*For new release product, please request the Pspice models from your respective FAE.
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 6
Benefitting from Thermal
Simulation
Infineon Thermal Tools and Capabilities (1)
 Thermal Device (Package) FE-Simulation
o Steady-state thermal simulation
o Transient thermal simulation
 Used for
o New package design evaluation
o On Customer board assessment
o Package thermal performance optimization
 Thermal System Simulation with FloTHERM
o Steady-state thermal simulation
o Limited transient thermal simulation
 Used for
o Board and system temperature profile evaluation.
130°C
o Customer requirement support and consultation.
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 8
Infineon Thermal Tools and Capabilities (2)
 PCB Flotherm Thermal Simulation
o Steady-state thermal simulation ONLY
 Used for
o PCB board thermal performance optimization
TLD1120 Thermal
Model
Device No. Pdiss(W)
U1
1.06
U2
1.07
U3
1.08
U4
1.09
U5
0.55
U6
0.25
Condition:
Ambient Temperature = 85degC
Environment: Still Air
FR4, 4 layers -> 2S2P, Cu 2oz (top/bottom), Cu 0.5oz(mid)
Copper 2oz
Heatsink
set date
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Page 9
Infineon Thermal Tools and Capabilities (3)
 Transient Thermal Multisource Simulator TTM
Linear Response Theory:
Once the unit power step response (Zth-curve) is
known, we can compute the temperature for any
power profile P(t)  implemented in TTM.
t
T (t )   P( )  Z th (t   ) d
0
Use Detailed Component Models When Possible
Problem:
Block Model not accurate enough to correctly
simulate device junction temperature!
Solution:
Use detailed device models when possible!
We can provide FloTHERM models for
Infineon products.
IFX
IFX
Summary
 PCB thermal performance is very critical in LED lighting – usually
dictates the amount of heatsink required and lifetime of products
 Information on the Rthja in datasheet may not be applicable in most
applications due to thermal coupling from adjacent heat sources and
difference in board size and cooling areas implemented.
 Thermal simulation enables first time RIGHT designs in LED lighting in
pcb board development
 IFX is able to provide detailed IFX LED drivers thermal models to
customers for more accurate junction temperature prediction
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
Page 12
Improving the EM emission
through hardware
modifications
EMC Standards
IEC 6100 - x - x
EN 550xx (CISPRxx)
radiated immunity
conducted immunity
radiated emission
Device
conducted emission
Critical for switching
Power supply
2013-03-05
for internal use
Copyright © Infineon Technologies AG 2013. All rights reserved.
- DRAFT -
Page 14
What does Class I to Class V mean?
 Class I to Class V are test severities

Class V: lowest noise emission test limits

Class I: highest noise emission test limits
 The end user (OEM) determines which test level he needs

Depending on the usage and location of the application

Module near the radio  low noise emissions needed (Class V)
 The Tier1 usually requires Class V
 Sometimes the same controller for different vehicles and different
locations will be developed, so the highest test level is necessary.
2013-03-05
for internal use
Copyright © Infineon Technologies AG 2013. All rights reserved.
- DRAFT -
Page 15
Challenges in EME
 Fulfill the CISPR25 Class V limits for the entire application
(Application board, wiring, load)
Class I: Highest level noise emission
test limits
Why Class V required ?
Class V: Lowest level noise emission
test limits
2013-03-05
for internal use
Copyright © Infineon Technologies AG 2013. All rights reserved.
• Module near radio
• Requirement for most Tier 1
• Similar controller developed
@ different vehicle location
- DRAFT -
Page 16
Exploring hardware opportunities to improve
Electromagnetic Emission: CISPR-25
 Guide for improvement in EME
Input Filter:
22µH + 10µF
Output Filter:
10µH + 470pF
Gate Resistor:
39Ω
Snubber Network: 2Ω + 680pF
Commutation Capacitor:
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
1µF
Page 17
EME evaluation: With and without external
filter performance
 Without Input/Output filter
Class I
Class V
 With snubber network,gate resistance,
output filter
set date
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Page 18
Layout Opportunities to EME improvement
 PCB layout reference
and guide to reduce
EME
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Page 19
Layout Opportunities to EME improvement (In
summary)
1
Keep the inductance of the commutation loop as small as possible.
2
Reduced area with high dv/dt
 Parts with high dv/dt will cause radiated emission.
3
Page 20
Place a solid GND plane below active parts
April 14th 2011
EMC Test Report
set date
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Page 21
Summary
 Class V EME based on CISPR-25 is desired
 Improvement of EME can be done through step-by-step guides by
adding external filters
 Layout is equally important in EME
 EMC test report can be provided upon request to customer
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
Page 22
Demoboards and Appboard
Quickstart Evaluation Board Available
Demoboards are designed for lab measurements including connectors
 Demoboard for TLD509x family
 Demoboard for Basic LED family
 AppBoard for TLD509x family ( SEPIC, B2G, B2B)
Appboard are application
optimized with smallest possible
size.
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 24
IFX LED Lighting Competence Support
LED Lighting Competence Support Package
Simulation
Pspice Simulation (online)
Thermal Simulation**
Evaluation
Demo Board **
App Board **
Design
App Note: Theory & Design Guide (online)
Quick Excel Calculator **
Easy-Ape **
Quick hardware guides **
in EMC improvement
EMC guides and report **
** Available upon request
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 25
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 26