3-Helen-Finch-Infineon-Presentation_June-2010

Collaborative R&D Funding
Infineon UK
Electric Vehicle FP7 Funding Information Meeting
SMMT 28th June 2010
Helen Finch
helen.finch@infineon.com
First Collaborative Projects – The Story So Far....
 Infineon Background
 The Challenge:
 Why?
 What?
 How?
 Timeline
 Future plans
 2 Collaborative Projects now running
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Infineon at a Glance
The Company
 Infineon provides semiconductor and system solutions,
focusing on three central needs of our modern society:
Energy Efficiency, Communications and Security
 Revenue in FY 2009: 3.027 billion EUR
 Some 25,216 employees worldwide (as of March 2010)
 Strong technology portfolio with about 22,900 patents
and patent applications
 More than 28 R&D locations
 Germany‘s largest semiconductor company
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Automotive Trends
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Infineon Automotive – Business Areas
Compute
Actuate
Sense
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Infineon UK - Background
 Setup in 1999 to specialise in the design of 32 bit MicroControllers and related subsystems
 Drawing on local skill set in Bristol region of the UK
 Registered Office for IFX UK Ltd
 R&D Engineers ~50
 Sales (Field based) ~15
 Since 2006 focus has been solely on developing IP for
Automotive silicon chips assembled in Germany and Asia;
 Key site for development of the TriCore processor
 Key site for 32bit system peripherals
 Strong R&D focus with clear route to market
 By 2012 1/3 of new cars world wide will contain IP developed
by IFX UK
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Infineon UK - Strategic Challenges
 The challenges:
 R&D work in UK all funded by IFX AG, need to drive cost
competitiveness
 -> EU Funding provides an opportunity
 Contacts and potential collaborators Automotive orientated
 -> Expand our own network
 IFX UK operations not widely recognised inside UK
 -> Raise our profile
 We face internal pressure from low cost sites – driving economic
efficiency and maintaining technical excellence is key to survival!
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Collaborative R&D Funding: Benefits
 Funding Income
 Reduced engineering rate compared with other sites ->
increased possibility for:
 Job retention
 Recruitment opportunities
 Expansion of R&D base
 Political impact within organisation
 Collaboration
 Extends field of Impact & Influence
 Expands context for R&D activity – better overall knowledge
 Raises profile
 Staff retention – more interesting and varied work
 Fosters links into other parts of supply chain at technical level
(e.g. S/W and tools providers in our case)
 Generates future business development opportunities
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Collaborative R&D Funding:
Getting Started
 Investment in full-time person to make it happen!
 Review of Opportunities
 Funding Schemes and Calls
 EU
 UK
 Local RDA
 Match areas of interest and activity
 Interview main innovators internally -> ideas
 Stick to core areas – no big diversions!
 E.g. Multi-core + Environment & Safety
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Collaborative R&D Funding:
Finding Opportunities
 Networking
 New contacts
 External
 Internal
 Publicise wish to „get involved‟
 Personal contact essential
 Brokerage Events
 Find interesting & compatible projects
 Stay informed
 Join consortia
 Information Gathering
 Mailing lists
 NCPs
 CORDIS
 Network
 Training & Workshops
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Infineon UK
EU Collaborative Funding – ARTEMIS
 Decision to focus on joint EU/national ARTEMIS programme
 Near-market embedded systems
 Large projects aimed at improving overall EU competitiveness
in embedded systems across all sectors
 UK funds 33.3%, EU funds 16.7% -> 50% funding overall
 Participant in 3 proposals submitted to ARTEMIS 2009 call in
Sept:
 RECOMP
 POLLUX
 SAFARI
 RECOMP and POLLUX selected
 Project kickoffs in March and April 2010
 IFX UK funding of €1.7M through ARTEMIS 2009 call
 3 years duration
 ~10% Bristol Design Centre running costs on average
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Infineon UK ARTEMIS Projects
The Road to Funding – Timeline
 2008/2009:
 Ramp up learning curve (several months)
 Understand available funding opportunities and how we might fit
 Network, network, network!





March/April „09: join consortia
May: Initial Proposal submitted
June: confirm buy-in from IFX senior management
August: Full Project Proposal
November: Projects selected
 2010:
 Jan: Invitation to start Negotiations
 Feb: Detailed budget info -> TSB
 Feb: start of Consortium Agreement discussions
 Mar/April: Project Kickoff meetings
 May/June: Individual work package kickoffs -> start work!
 June: National Grant Agreement letter
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Infineon UK ARTEMIS Projects
The Road to Funding - Ongoing
 Still in progress:
 Consortium Agreements (dozens of legal departments)

Defines how partners will work together (Management structure, IP ownership,
dispute resolution....)
 ARTEMIS GA
 3-year programme of activities for each project
 Collaborative working
 Milestones & Deliverables
 Reporting
 Quarterly claims against grant – UK and EU portions
 Audit
 Develop trust & identify opportunities
 Further collaborations
 Academic relationships
 Extend level of participation for future projects:
 Project coordination?
 Aim to influence direction of future WPs (ARTEMISIA)
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POLLUX
“Process Oriented Electrical Control Unit”
 Summary
 Architecture, component design & prototyping of electric/hybrid vehicle
embedded systems architecture.
 Complementary to the ENIAC (1st call) “E3CAR” project.
 Project initiated by Infineon Munich
 Budget
 Total project budget: €36M
 Total IFX-UK budget: €1.8M, 154MM
 Total IFX-UK funding requested 50%: €900K


National contribution - €600K
EU contribution - €300K
 Total UK National funding requested (3 partners): €1M
 Consortium
 35 participants from 12 countries;
 Includes Fiat, ST, NXP, ON Semi, Continental, Valeo, PSA Peugeot Citroen,
Thales, QinetiQ (UK) & University of Sheffield (UK), Infineon Austria
 IFX UK main Work Packages:
 Multi-core microcontroller architecture: specifications, design and
development, including FPGA
 Subsystems integration and demonstration
Website: www.artemis-pollux.eu
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Pollux in a nutshell
the consortium
SME
OEM
Tier1,
Engineering
system
specification
Demonstration
verification
validation
ARTEMIS POLLUX Project
Tier,
Embedded systems
sub-system
specification
hardware
software
Research
R&D
system
integration
sub-system
integration
embedded
systems
Title Presentation - 15
RECOMP
“Reduced certification costs using trusted multi-core
platforms”
 Summary
 Isolation of safety-critical parts of systems using multi-core
technology, allowing S/W updates without need for re-certification.
 Budget
 Total project budget: €26M
 Total IFX-UK budget: €1.95M, 152MM
 Total IFX-UK funding requested ~40%: €815K
 National contribution - €490K
 EU contribution - €325K
 Total UK National funding requested (3 partners): €835K
 Consortium
 41 participants from 8 countries
 Includes Kone, Delphi, TUV SUD, EADS, Intel, PSA, Thales (UK),
Wittenstein (UK)
 IFX UK main Work Packages:
 Dual Core, FPGA & Platform Development
 Coordination of Platform-based Project Demonstrators
 UK coordination (with TSB - national funding authority).
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Future Challenges – Next year and Beyond
 Changes in usage and programming models for microcontrollers in
Embedded Systems:
 Increasing S/W complexity & diversity -> Hardware cost
 Automatic (model-based) code development
 Serial code unsuited to multicore architectures – sub-optimal.
 Model-based control strategies e.g. For automotive powertrain
 Increased computational load
 Looking to define specific challenges over next year
 Faster vs. Smarter: paradigm shift needed?
 Optimise and configure so that inherent parallelism in real-world
environment is maintained through S/W development & mapping to
H/W
 Task encapsulation to address safety requirements for ES e.g. In EV
applications.
 View to forming our next microcontroller development phase, starting
around 2012....
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