Trends in automotive
power semiconductors
Andreas Mühlberger
June, 8th, 2016
Contact details
Mühlberger Andreas
Director product development PTS Graz (1.7.16)
Andreas.Muehlberger@infineon.com
+43 5 1777 18326
Kraaijeveld Rick
Head of product development PTS Villach (1.7.16)
JanRichard.Kraaijeveld@infineon.com
+43 5 1777 6356
Wachter Franz
Manager Mixed Signal Design PTS Villach
Franz.Wachter@infineon.com
+43 5 1777 6783
Proell Manfred
Manager Product Technology PTS Villach
Manfred.Proell@infineon.com
+43 5 1777 6566
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
2
Table of contents
1
About Infineon
2
Automotive product development
3
Career Possibilities
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
3
Table of contents
1
About Infineon
2
Automotive product development
3
Career Possibilities
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
4
Infineon at a glance
Portfolio
Employees
Semiconductors for
About 35,400 employees worldwide
(as of Sep. 2015)
›
›
›
›
Automotive
Industrial Power Control
Europe
14,533 employees
Americas
3,682 employees
Power Management & Multimarket
Chip Card & Security
Asia/Pacific
17,209 employees
Strong technology portfolio with more than 25,000
patents and patent applications (as of Sep. 2015)
Financials
Market Position
[EUR m]
3904
13.5%
527
FY 12
Revenue
2016-06-08
32 R&D locations
20 manufacturing locations
5795
3843
4320
14.4%
15.5%
377
620
897
FY 13
FY 14
FY 15
9.8%
Segment Result
Margin
Automotive
Power
Smart card
ICs
#2
#1
#2
Strategy Analytics
April 2015
IHS Inc.
September 2015
Copyright © Infineon Technologies AG 2016. All rights reserved.
IHS Inc.
July 2015
5
Revenue Split by Segment
FY 2015 Revenue: € 5,795m*
Automotive
€ 971m
€ 2,351m
Industrial
Power Control
Power
Management &
Multimarket
Chip Card
& Security
€ 666m
€ 1,794m
OOS+C&E**
€ 13m
* Including International Rectifier from 13 January 2015 to 30 September 2015
** Other Operating Segments; Corporate & Eliminations
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
6
Tight customer relationships are based on
system know-how and app understanding
ATV
IPC
PMM
CCS
EMS partners Distribution partners
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
7
Product range
Automotive
(ATV)
Industrial Power
Control (IPC)
Power Management &
Multimarket (PMM)
Chip Card & Security
(CCS)
› 32-bit automotive
›
›
›
›
› Control ICs
› Customized chips
› Contact-based security
microcontrollers for
powertrain, safety and
driver assistance systems
› Discrete power
semiconductors
› IGBT modules
› Industrial microcontrollers
› Magnetic and pressure
Bare die business
Discrete IGBTs
Driver ICs
IGBT modules (highpower, medium-power,
low-power)
› IGBT module solutions
incl. IGBT stacks
sensors
(ASICs)
› Discrete low-voltage
and high-voltage power
transistors
› GPS low-noise amplifier
› Low-voltage and high-
controllers
› Contactless security
controllers
› Dual-interface security
controllers (contactbased and contactless)
voltage driver ICs
› MEMS and ASICs for
› Power ICs
› Radar
› Transceiver (CAN, LIN,
silicon microphones
› RF antenna switches
› RF power transistors
› TVS (transient voltage
Ethernet, Flex RayTM* )
› Voltage regulators
suppressor) diode
*FlexRay is a trademark licensed by FlexRay Consortium GbR
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
8
Product range
Automotive
(ATV)
Industrial Power
Control (IPC)
Power Management &
Multimarket (PMM)
Chip Card & Security
(CCS)
› 32-bit automotive
›
›
›
›
› Control ICs
› Customized chips
› Contact-based security
microcontrollers for
powertrain, safety and
driver assistance
systems
› Discrete power
semiconductors
› IGBT modules
› Industrial microcontrollers
› Magnetic and pressure
Bare die business
Discrete IGBTs
Driver ICs
IGBT modules (highpower, mediumpower, low-power)
› IGBT module
solutions incl. IGBT
stacks
sensors
(ASICs)
› Discrete low-voltage
and high-voltage power
transistors
› GPS low-noise amplifier
› Low-voltage and
controllers
› Contactless security
controllers
› Dual-interface security
controllers (contactbased and contactless)
high-voltage driver
ICs
› MEMS and ASICs for
› Power ICs
› Radar
› Transceiver (CAN, LIN,
silicon microphones
› RF antenna switches
› RF power transistors
› TVS (transient voltage
Ethernet, Flex RayTM* )
› Voltage regulators
Developed in Villach
suppressor) diode
*FlexRay is a trademark licensed by FlexRay Consortium GbR
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
9
Our global R&D network
Reigate
Leominster
Warwick
Tewksbury
El Segundo
Skovlunde
Duisburg
Warstein
Regensburg
Dresden
Bristol
Linz
Augsburg
Graz
Beijing
Bukarest
Villach
Seoul
Shanghai
San José
Morgan Hill
Pavia
Neubiberg
Torrance
Le Puy Sainte
Réparade
Padua
Bangalore
Singapore
Chandler
Malacca
Irvine
Ipoh
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
10
Infineon Austria: Company Overview
79 EMP
277EMP
9 EMP
Data
FY 2015 (per 30.09.15)
Revenue
€ 1427,1 million
EBIT
€ 152,1 million
Investment
€ 111,6 million
Employees
3.493
R&D
Expenditure
25 %
Subsidiaries
DICE, Linz
total
in % of Revenue
Austrian
IT Services, Klagenfurt
KAI, Villach
Pension fund
2968EMP
2016-06-08
160 EMP
Copyright © Infineon Technologies AG 2016. All rights reserved.
Subsidiaries
Foreign
Kulim, Malaysia
Bukarest, Rumänien
11
Excellence in Research & Development
Hochqualifizierte
Jobs
Research
& Development
›
~ 47 % AkademikerInnen
››
Largest
unit for
~
300 MAresearch
in Headquarterfunktion
›
21,5 % ausländische
Strongest research company
MitarbeiterInnen
›
›
microelectronics in Austria
2015 (acc. Top 500 ranking
15,2
% Frauenanteil
trend)
› R&D expenditure in the past fiscal
year: € 363m, which are 25 %
MA
vontotal
Partnerunternehmen
of the
revenue
•›
Infineon
Technologies
Austria
Additiv
~1.800
von externen
Firmen
employs 1.269 staff in R&D
Höchster Mitarbeiterstand
R&D expenditures
in der Unternehmenshistorie!
Infineon Technologies Austria 320
Mitarbeiterstand
270
240
All time high
219
2.548
16%*
2.477
20%*
FY 11
FY 12
GJ09
GJ10
*in % of revenue
2.761
23%*
3.038
363
+6%
3.111
25%*
3.305
25%*
FY 13
FY 14
FY 15
GJ11
GJ12
GJ13 GJ14
AkademikerInnen
in %
Employees in R&D
95030
26
45
43 43 44 1269
40 42
39
1205
37
1100
331050
47
› 260 reported inventions from
Austria were filed as patents
› Austrian PhD program extended:
over 80 PhD candidates
2016-06-08
FY 11
FY 12
Copyright © Infineon Technologies AG 2016. All rights reserved.
FY 13
FY 14
FY 15
12
Strengthening R&D excellence through
cooperation
Strategic partnership with the Austrian
Institute of Technology (AIT) as a basis
for joint research
projects
European Project PowerBase
Greatest research project for
microelectronics in Europe,
coordinated in Austria
Endowed professorship for
power electronics
over € 1,5 million with the
University of Innsbruck
FY 2015
About 120 research
collaborations in Austria,
Europe and beyond
2016-06-08
BMVIT: Endowed professorship for
Industry 4.0 at the TU Wien and for Data Science
at the TU Graz
Copyright © Infineon Technologies AG 2016. All rights reserved.
13
Selection of important cooperation partners
Teaching and Research Networks
Educational partnerships
Competence Centers / Research Centers
Cluster
2016-06-08
Social Responsibility
Copyright © Infineon Technologies AG 2016. All rights reserved.
14
Automotive Business Line
Powertrain, Safety & ASICs
POWERTRAIN
ENGINE
TRANSMISSION
Engine
Management
May 2016
Hydraulic
and electrical
Transmission
actuation
SAFETY
xEV
Battery
Management
DRIVES
High
Voltage
Drivers
Alternator
Regulator
Starter
Generator
Motor
Drives
Control
Brush &
Brushless
Copyright © Infineon Technologies AG 2016. All rights reserved.
RESTRAINT
Power
Steering
Control
Restraint
Control
15
The World of Smart Power
› Smart power chips cover a very broad range of applications:
– Sensor Interfaces
– Signal Processing
– Power Drivers
– Protected Switches
– Power Supply Systems e.g. DC/DC Converters
– Safety Systems
– Etc.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
16
Application Example
New Generation Airbag Chipset Passenger
Sensing
KP106
Side Airbag
KP106
Satellite
Receiver
Doors
XC23XX
Front Airbag
MCU
y
g
TLE8754
x
Safing
Engine
g
Safing Signals
4 Loop
Buckle Switch
Power Supply
Battery
ER
Boost
Buck
Buck
Buckle Switch
VBOOST
VBAT
VSAT & VSYNC
VLOGIC
I/O
g
8 Loop
Curtains
p
p
TLE8758
Firing SPI
g
Safing
Switch
LIN
CAN
Occupant
DualStage
Satellite
Receiver
Sensor SPI
Left Doors
Airbag ECU
g
Passenger
DualStage
p
p
Side Impact
Right Doors
High Speed CAN
Front Impact
Bonnet
Pedestrian
Protection
Warning Lamp
Airbag Off
Application Example
New Generation Airbag Chipset
One of current
Airbag ECUs on
the market
(front & back)
Actual Airbag ECUs are multi chip solutions,
consisting of e.g.:
Squib Driver
PSI5 Sensor Interface
Power Supply
Safing Engine
LIN
IFX solution
reduces number
of external
components and
bill of material
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
18
Table of contents
1
About Infineon
2
Automotive product development
3
Career Possibilities
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
19
Infineon ASIC Development Process
5 phases
Idea
M1
M2
M3
M4
Project
Release
Market
Requirement
Release
Product
Feasibility
Release
2016-06-08
Realization /
Implementation
Definition
M5
Verification &
Validation
M6
Circuit
Development
Release
Concept
Release
M7
Engineering
Sample
Release
Tape out
Copyright © Infineon Technologies AG 2016. All rights reserved.
Maintenance
M8
M9
M
10
Delivery
Release
Production
Release
Ramp Up
completed
20
Infineon ASIC Development Process
Phase 1: The Product Idea
Idea
Realization /
Implementation
Definition
Verification &
Validation
Maintenance
› Involved teams
M1
– Marketing, Project Management, Development group managers, technical
experts
› Target
Market
Requirement
– Release
Define rough
product concept
– Estimate business case
– Plan needed development team and costs
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
21
Infineon ASIC Development Process
Phase 2: Define the product
Idea
Realization /
Implementation
Definition
› Involved teams
M1
M2
Verification &
Validation
Maintenance
M3
– Project Management
– Engineers: Concept, Analog Design, Digital Design, Verification & Test,
Physical
Design, Functional
Safety
Project
Market
Release
Requirement
› Target
Release
Product
– Define detailed
product development concept
Feasibility
Release
– Define verification and test concept
– Define functional safety concept
– Create Project Plan
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
22
Example: PhD program for Battery
Management
›
›
Definition of the Power Line Communication
›
Reduce the components and assembly costs by minimizing the number of wires and
connectors required for communication
›
Provide robust communication in harsh environment – integrity of the electric signals,
availability if a module is not available anymore
›
Provide scalability in the communication with respect to number of participants new option
of communication that uses existing connections
›
›
›
›
›
How will we proceed?
Develop smart data transmission techniques for lithium-ion batteries, capable of efficiently
controlling and monitoring each of the up to 400 cells
Feasibility of realization of the Concept, System and Protocol Simulations
Characterization of the of the data channel
Measurements with Signal Generator and Analyzer
Demonstrator to prove the function of the new concept
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
23
Infineon ASIC Development Process
Phase 3: Design the product
Idea
Realization /
Implementation
Definition
› Involved teams
M3
M4
M5
Verification &
Validation
Maintenance
M6
– Project Management
– Engineers: Concept, Analog Design, Digital Design, Physical Design,
Verification & TestProject
Circuit
› Target
Release
Development
Release
Concept
– Implement design (analog,
digital, firmware)
Tape out
Release
– Verify design against requirements before Tape Out (FPGA, Simulation)
– Prepare first verification test bench and test program
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
24
BCD Technologies
› BCD (Bipolar-CMOS-DMOS) technologies allow coexistence of
device types which allow realization of control chips:
– Bipolar components allow creation of bandgap references for
supply/temperature insensitive biasing and ADC reference
voltage generation.
– CMOS suited for integration of complex digital logic and small
signal analog circuitry (ADCs, DACs, switched cap, etc.).
– DMOS are used to handle higher voltages and currents ->
enable power control/regulation/switch.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
25
The Art of …
Mixed Signal Design
›
Circuit concept & transistor level
design of new circuits with the
latest generation of design tools
like Cadence AMS Designer,
Cadence Spectre, Titan, VHDL-AMS
and Fast MOS Simulators.
›
Characterization and debug of the
previously designed circuit blocks in
the laboratory environment.
›
Close cooperation with chip
architects, physical design
engineers (matching, parasitic,
crosstalk...), test engineers (design
for test, support of the test
concept) and product engineers
(ramp up support).
›
Technically support the application
engineering team (customer
interface).
›
Develop and share knowledge with
other analog/digital design experts
at Infineon.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
26
Challenges in Power Control
› State of the art power drivers/switches provide diagnostic
functions:
– Detection of open & shorted load.
– Overload protection (i.e. resettable fuse).
– Over temperature protection.
– Freewheeling with inductive loads.
– Voltages below GND on power outputs in case of e.g. failure
(short) condition.
– ESD & EMI requirements.
– Accurate sensing of the load current.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
27
Current Sensing Techniques in Integrated
Low Side Switches
› Shunt Resistor Sensing
Load
–
Temperature dependence caused by self heating of
power DMOS.
–
Limits the achievable on-resistance.
–
Requires broad trimming range due to process
variations.
Gate
Driver
Power
DMOS
Vsense
› “Rdson” Sensing
–
Similar to shunt resistor, but additional complications due
to uneven current distribution across DMOS cells.
› Sense FET Techniques
–
Down-scaled replica of the load current (similar to a
current mirror).
–
The low voltage headroom makes accurate current sensing
difficult.
Load
Gate
Driver
Power
DMOS
Vsense
› Hall Effect Sensing
–
Difficult integration.
–
Sensitivity at low load currents.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
28
Diploma Thesis Proposal (Mixed Signal Design):
Advanced Current Sensing Method
in Automotive Smart Power Technologies
Target:
Development of an accurate current sensing solution for integrated low-side drivers/switches.
Design Targets:
›
Accuracy: +/- 5%
›
Current Range: 100 mA – 10 A
Main tasks:
-
Refine the application requirement.
-
Analyze the state of the art solutions.
-
Develop a good understanding of the BCD technology possibilities and limitations and choose the best
sensing concept.
-
Circuit concept and design of an integrated current sensing solution for a low side switch in smart power
technology.
-
Lab characterization of the prototype (optional, based on test chip time window).
IFX Interface:
DI Franz Wachter
franz.wachter@infineon.com
I am happy to answer to your questions !!
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
29
Example: Physical Design
Job description
We are strengthening our Physical Design and layout team for automotive power
semiconductors in Villach.
Therefore we are looking for a student eager to learn how to create physical
designs using state of the art chip layout tools, to verify them to ensure correct
functionality and to optimize the layout to create highly efficient integrated circuits
with minimum chip sizes. In this role you will be integrated into the existing expert
team and will build up competence in actual running Projects.
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
30
Infineon ASIC Development Process
Phase 4: Verify functionality acc. requirements
Idea
Realization /
Implementation
Definition
› Involved teams
Verification &
Validation
M6
M7
Maintenance
M8
M9
– Project Management
– Engineers: Concept, Design, Verification, Product Engineering & Test
› Target
Delivery
Release
Engineering
Sample
Release
– Verify functionality and parameters of silicon design against requirements
Production
Tape out
– Debug and prepare test program for volume
test (production)
Release
– Product qualification
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
31
Component verification – the main tasks
›
Generate verification setup
– Lab equipment, evaluation board, verification tools
›
Verify specified requirements on silicon
– As similar as in customer application
– As many parameter variations as possible
– As automated as possible
– On a reduced number of components
›
Robustness and root cause analysis
– Evaluate product margins and safe operating area
– Identify design and technology weaknesses
›
Improve verification methodology
– done: e.g. SPI tool, SPI commander, B2B switch, MUX
– ongoing: dynamic low current sensing solution
– todo: multi channel programmable resistor
May 2016
Copyright © Infineon Technologies AG 2016. All rights reserved.
32
Verification methodology – complex example
Main
µC
SoC
ECU
Thesis 1
Thesis 2
set date
Copyright © Infineon Technologies AG 2015. All rights reserved.
33
Diploma Thesis Proposal (SW Design):
Automatic Setup Generation for Documentation
Contact:
Manfred Proell
manfred.proell@infineon.com
›
Problem: complex schematic documentation when using automated setups
– Limited equipment resources are connected via relays to component (DUT) pins
– Automated relay configuration, but complex schematic when all relays shown
›
Main objective: simplify the board schematic depending on relay state for documentation
– Applicable for lab bench and tester
– Schematic shows only relevant connections for each test
– Easy re-configuration for other projects
›
Main tasks:
-
Understand the documentation process
-
Analyze the state of the art methods for automated schematic generation
-
Understanding the possibilities and limitations and choose the best method
-
Develop a software environment for test individual setup schematics generation
depending on the relay state
set date
Copyright © Infineon Technologies AG 2015. All rights reserved.
34
Test engineering – the main tasks
› Generate productive test setup for wafer and component
– Probe cards for wafer test, multi site component test
› Define Test features on silicon for efficient testing
– To save test time, to contact chip internal nodes
– To trim relevant parameters, to improve chip reliability
› Productive test program development
– Implement and verify specified test coverage
– Provide tested samples to lab and customer
– Analyse statistical test data and stabilize test program
– Interface to world-wide production test sites
– Optimize test program for volume production
– Support product qualification and customer returns
› Improve test engineering methodology
– ongoing: automated signal spike checker
May 2016
Copyright © Infineon Technologies AG 2016. All rights reserved.
35
We are looking for Work Students
› For Component Verification
Contact:
Manfred Proell
manfred.proell@infineon.com
– Supporting the post silicon verification of the latest Airbag products in the
Automotive verification lab.
– Automation of verification setups using VB and Matlab
› For Test Engineering
– Support test development, developing and debugging test hard and
software
› You might profit from
– a team with experience in dealing with students and diploma thesis
– your work experience and contacts within Infineon
› You are best equipped for this tasks if you
– are studying Electrical Engineering
– are interest in measurement technique
– have programming skills e.g. VBA, C / C++
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
36
Infineon ASIC Development Process
Phase 5: ramp up mass production
Idea
Realization /
Implementation
Definition
Verification &
Validation
› Involved teams
Maintenance
M9
– Project Management
M
10
– Engineers: Design, Verification, Product Engineering & Test
Delivery
Release
› Target
– Optimize test program to volume ramp up (test time, marginal tests)
Ramp Up
completed
– Production monitoring and Customer return support
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
37
Table of contents
1
About Infineon
2
Automotive product development
3
Career Possibilities
2016-06-08
Copyright © Infineon Technologies AG 2016. All rights reserved.
38
Opportunities for students
Industrial placements, mandatory and
holiday work placements
–
full-time during the (half-term) holidays
–
part-time during term time
Diploma/Bachelor‘s/Master‘s thesis, PhD
–
throughout the year
–
Infineon provides resources, knowledge, and
support
Benefits
2016-06-08
–
gain experience in an international company
–
experience daily business
–
opportunity to gain an insight into interesting projects
–
first step towards a career at Infineon
Copyright © Infineon Technologies AG 2016. All rights reserved.
39
What we offer - career opportunities at
Infineon
Management
Technical Ladder Project Management
Employees
with
experience
career
PhD, Trainee Program
temporary contract
Start direct!
permanent contract
Bachelor‘s, Diploma or Master‘s thesis at Infineon
internships
2016-06-08
Graduates
Students
part-time work at Infineon
Copyright © Infineon Technologies AG 2016. All rights reserved.
40
Great Passion, Amazing Ideas, First-Class Skills
YOU!
Electrical
Engineering,
Microelectronics
Physics
Electrical
Engineering
Power
Electronics
Mechanical
Engineering
Mechatronics
›
›
›
Chemistry
Material
Science
Bachelor
Master
Ph.D.
Business
Administration
Law
Mathematics
2016-06-08
Industrial
Engineering
Computer
Science
Software
Engineering
Copyright © Infineon Technologies AG 2016. All rights reserved.
41