Trends in automotive power semiconductors Andreas Mühlberger June, 8th, 2016 Contact details Mühlberger Andreas Director product development PTS Graz (1.7.16) Andreas.Muehlberger@infineon.com +43 5 1777 18326 Kraaijeveld Rick Head of product development PTS Villach (1.7.16) JanRichard.Kraaijeveld@infineon.com +43 5 1777 6356 Wachter Franz Manager Mixed Signal Design PTS Villach Franz.Wachter@infineon.com +43 5 1777 6783 Proell Manfred Manager Product Technology PTS Villach Manfred.Proell@infineon.com +43 5 1777 6566 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 2 Table of contents 1 About Infineon 2 Automotive product development 3 Career Possibilities 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 3 Table of contents 1 About Infineon 2 Automotive product development 3 Career Possibilities 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 4 Infineon at a glance Portfolio Employees Semiconductors for About 35,400 employees worldwide (as of Sep. 2015) › › › › Automotive Industrial Power Control Europe 14,533 employees Americas 3,682 employees Power Management & Multimarket Chip Card & Security Asia/Pacific 17,209 employees Strong technology portfolio with more than 25,000 patents and patent applications (as of Sep. 2015) Financials Market Position [EUR m] 3904 13.5% 527 FY 12 Revenue 2016-06-08 32 R&D locations 20 manufacturing locations 5795 3843 4320 14.4% 15.5% 377 620 897 FY 13 FY 14 FY 15 9.8% Segment Result Margin Automotive Power Smart card ICs #2 #1 #2 Strategy Analytics April 2015 IHS Inc. September 2015 Copyright © Infineon Technologies AG 2016. All rights reserved. IHS Inc. July 2015 5 Revenue Split by Segment FY 2015 Revenue: € 5,795m* Automotive € 971m € 2,351m Industrial Power Control Power Management & Multimarket Chip Card & Security € 666m € 1,794m OOS+C&E** € 13m * Including International Rectifier from 13 January 2015 to 30 September 2015 ** Other Operating Segments; Corporate & Eliminations 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 6 Tight customer relationships are based on system know-how and app understanding ATV IPC PMM CCS EMS partners Distribution partners 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 7 Product range Automotive (ATV) Industrial Power Control (IPC) Power Management & Multimarket (PMM) Chip Card & Security (CCS) › 32-bit automotive › › › › › Control ICs › Customized chips › Contact-based security microcontrollers for powertrain, safety and driver assistance systems › Discrete power semiconductors › IGBT modules › Industrial microcontrollers › Magnetic and pressure Bare die business Discrete IGBTs Driver ICs IGBT modules (highpower, medium-power, low-power) › IGBT module solutions incl. IGBT stacks sensors (ASICs) › Discrete low-voltage and high-voltage power transistors › GPS low-noise amplifier › Low-voltage and high- controllers › Contactless security controllers › Dual-interface security controllers (contactbased and contactless) voltage driver ICs › MEMS and ASICs for › Power ICs › Radar › Transceiver (CAN, LIN, silicon microphones › RF antenna switches › RF power transistors › TVS (transient voltage Ethernet, Flex RayTM* ) › Voltage regulators suppressor) diode *FlexRay is a trademark licensed by FlexRay Consortium GbR 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 8 Product range Automotive (ATV) Industrial Power Control (IPC) Power Management & Multimarket (PMM) Chip Card & Security (CCS) › 32-bit automotive › › › › › Control ICs › Customized chips › Contact-based security microcontrollers for powertrain, safety and driver assistance systems › Discrete power semiconductors › IGBT modules › Industrial microcontrollers › Magnetic and pressure Bare die business Discrete IGBTs Driver ICs IGBT modules (highpower, mediumpower, low-power) › IGBT module solutions incl. IGBT stacks sensors (ASICs) › Discrete low-voltage and high-voltage power transistors › GPS low-noise amplifier › Low-voltage and controllers › Contactless security controllers › Dual-interface security controllers (contactbased and contactless) high-voltage driver ICs › MEMS and ASICs for › Power ICs › Radar › Transceiver (CAN, LIN, silicon microphones › RF antenna switches › RF power transistors › TVS (transient voltage Ethernet, Flex RayTM* ) › Voltage regulators Developed in Villach suppressor) diode *FlexRay is a trademark licensed by FlexRay Consortium GbR 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 9 Our global R&D network Reigate Leominster Warwick Tewksbury El Segundo Skovlunde Duisburg Warstein Regensburg Dresden Bristol Linz Augsburg Graz Beijing Bukarest Villach Seoul Shanghai San José Morgan Hill Pavia Neubiberg Torrance Le Puy Sainte Réparade Padua Bangalore Singapore Chandler Malacca Irvine Ipoh 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 10 Infineon Austria: Company Overview 79 EMP 277EMP 9 EMP Data FY 2015 (per 30.09.15) Revenue € 1427,1 million EBIT € 152,1 million Investment € 111,6 million Employees 3.493 R&D Expenditure 25 % Subsidiaries DICE, Linz total in % of Revenue Austrian IT Services, Klagenfurt KAI, Villach Pension fund 2968EMP 2016-06-08 160 EMP Copyright © Infineon Technologies AG 2016. All rights reserved. Subsidiaries Foreign Kulim, Malaysia Bukarest, Rumänien 11 Excellence in Research & Development Hochqualifizierte Jobs Research & Development › ~ 47 % AkademikerInnen ›› Largest unit for ~ 300 MAresearch in Headquarterfunktion › 21,5 % ausländische Strongest research company MitarbeiterInnen › › microelectronics in Austria 2015 (acc. Top 500 ranking 15,2 % Frauenanteil trend) › R&D expenditure in the past fiscal year: € 363m, which are 25 % MA vontotal Partnerunternehmen of the revenue •› Infineon Technologies Austria Additiv ~1.800 von externen Firmen employs 1.269 staff in R&D Höchster Mitarbeiterstand R&D expenditures in der Unternehmenshistorie! Infineon Technologies Austria 320 Mitarbeiterstand 270 240 All time high 219 2.548 16%* 2.477 20%* FY 11 FY 12 GJ09 GJ10 *in % of revenue 2.761 23%* 3.038 363 +6% 3.111 25%* 3.305 25%* FY 13 FY 14 FY 15 GJ11 GJ12 GJ13 GJ14 AkademikerInnen in % Employees in R&D 95030 26 45 43 43 44 1269 40 42 39 1205 37 1100 331050 47 › 260 reported inventions from Austria were filed as patents › Austrian PhD program extended: over 80 PhD candidates 2016-06-08 FY 11 FY 12 Copyright © Infineon Technologies AG 2016. All rights reserved. FY 13 FY 14 FY 15 12 Strengthening R&D excellence through cooperation Strategic partnership with the Austrian Institute of Technology (AIT) as a basis for joint research projects European Project PowerBase Greatest research project for microelectronics in Europe, coordinated in Austria Endowed professorship for power electronics over € 1,5 million with the University of Innsbruck FY 2015 About 120 research collaborations in Austria, Europe and beyond 2016-06-08 BMVIT: Endowed professorship for Industry 4.0 at the TU Wien and for Data Science at the TU Graz Copyright © Infineon Technologies AG 2016. All rights reserved. 13 Selection of important cooperation partners Teaching and Research Networks Educational partnerships Competence Centers / Research Centers Cluster 2016-06-08 Social Responsibility Copyright © Infineon Technologies AG 2016. All rights reserved. 14 Automotive Business Line Powertrain, Safety & ASICs POWERTRAIN ENGINE TRANSMISSION Engine Management May 2016 Hydraulic and electrical Transmission actuation SAFETY xEV Battery Management DRIVES High Voltage Drivers Alternator Regulator Starter Generator Motor Drives Control Brush & Brushless Copyright © Infineon Technologies AG 2016. All rights reserved. RESTRAINT Power Steering Control Restraint Control 15 The World of Smart Power › Smart power chips cover a very broad range of applications: – Sensor Interfaces – Signal Processing – Power Drivers – Protected Switches – Power Supply Systems e.g. DC/DC Converters – Safety Systems – Etc. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 16 Application Example New Generation Airbag Chipset Passenger Sensing KP106 Side Airbag KP106 Satellite Receiver Doors XC23XX Front Airbag MCU y g TLE8754 x Safing Engine g Safing Signals 4 Loop Buckle Switch Power Supply Battery ER Boost Buck Buck Buckle Switch VBOOST VBAT VSAT & VSYNC VLOGIC I/O g 8 Loop Curtains p p TLE8758 Firing SPI g Safing Switch LIN CAN Occupant DualStage Satellite Receiver Sensor SPI Left Doors Airbag ECU g Passenger DualStage p p Side Impact Right Doors High Speed CAN Front Impact Bonnet Pedestrian Protection Warning Lamp Airbag Off Application Example New Generation Airbag Chipset One of current Airbag ECUs on the market (front & back) Actual Airbag ECUs are multi chip solutions, consisting of e.g.: Squib Driver PSI5 Sensor Interface Power Supply Safing Engine LIN IFX solution reduces number of external components and bill of material 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 18 Table of contents 1 About Infineon 2 Automotive product development 3 Career Possibilities 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 19 Infineon ASIC Development Process 5 phases Idea M1 M2 M3 M4 Project Release Market Requirement Release Product Feasibility Release 2016-06-08 Realization / Implementation Definition M5 Verification & Validation M6 Circuit Development Release Concept Release M7 Engineering Sample Release Tape out Copyright © Infineon Technologies AG 2016. All rights reserved. Maintenance M8 M9 M 10 Delivery Release Production Release Ramp Up completed 20 Infineon ASIC Development Process Phase 1: The Product Idea Idea Realization / Implementation Definition Verification & Validation Maintenance › Involved teams M1 – Marketing, Project Management, Development group managers, technical experts › Target Market Requirement – Release Define rough product concept – Estimate business case – Plan needed development team and costs 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 21 Infineon ASIC Development Process Phase 2: Define the product Idea Realization / Implementation Definition › Involved teams M1 M2 Verification & Validation Maintenance M3 – Project Management – Engineers: Concept, Analog Design, Digital Design, Verification & Test, Physical Design, Functional Safety Project Market Release Requirement › Target Release Product – Define detailed product development concept Feasibility Release – Define verification and test concept – Define functional safety concept – Create Project Plan 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 22 Example: PhD program for Battery Management › › Definition of the Power Line Communication › Reduce the components and assembly costs by minimizing the number of wires and connectors required for communication › Provide robust communication in harsh environment – integrity of the electric signals, availability if a module is not available anymore › Provide scalability in the communication with respect to number of participants new option of communication that uses existing connections › › › › › How will we proceed? Develop smart data transmission techniques for lithium-ion batteries, capable of efficiently controlling and monitoring each of the up to 400 cells Feasibility of realization of the Concept, System and Protocol Simulations Characterization of the of the data channel Measurements with Signal Generator and Analyzer Demonstrator to prove the function of the new concept 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 23 Infineon ASIC Development Process Phase 3: Design the product Idea Realization / Implementation Definition › Involved teams M3 M4 M5 Verification & Validation Maintenance M6 – Project Management – Engineers: Concept, Analog Design, Digital Design, Physical Design, Verification & TestProject Circuit › Target Release Development Release Concept – Implement design (analog, digital, firmware) Tape out Release – Verify design against requirements before Tape Out (FPGA, Simulation) – Prepare first verification test bench and test program 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 24 BCD Technologies › BCD (Bipolar-CMOS-DMOS) technologies allow coexistence of device types which allow realization of control chips: – Bipolar components allow creation of bandgap references for supply/temperature insensitive biasing and ADC reference voltage generation. – CMOS suited for integration of complex digital logic and small signal analog circuitry (ADCs, DACs, switched cap, etc.). – DMOS are used to handle higher voltages and currents -> enable power control/regulation/switch. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 25 The Art of … Mixed Signal Design › Circuit concept & transistor level design of new circuits with the latest generation of design tools like Cadence AMS Designer, Cadence Spectre, Titan, VHDL-AMS and Fast MOS Simulators. › Characterization and debug of the previously designed circuit blocks in the laboratory environment. › Close cooperation with chip architects, physical design engineers (matching, parasitic, crosstalk...), test engineers (design for test, support of the test concept) and product engineers (ramp up support). › Technically support the application engineering team (customer interface). › Develop and share knowledge with other analog/digital design experts at Infineon. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 26 Challenges in Power Control › State of the art power drivers/switches provide diagnostic functions: – Detection of open & shorted load. – Overload protection (i.e. resettable fuse). – Over temperature protection. – Freewheeling with inductive loads. – Voltages below GND on power outputs in case of e.g. failure (short) condition. – ESD & EMI requirements. – Accurate sensing of the load current. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 27 Current Sensing Techniques in Integrated Low Side Switches › Shunt Resistor Sensing Load – Temperature dependence caused by self heating of power DMOS. – Limits the achievable on-resistance. – Requires broad trimming range due to process variations. Gate Driver Power DMOS Vsense › “Rdson” Sensing – Similar to shunt resistor, but additional complications due to uneven current distribution across DMOS cells. › Sense FET Techniques – Down-scaled replica of the load current (similar to a current mirror). – The low voltage headroom makes accurate current sensing difficult. Load Gate Driver Power DMOS Vsense › Hall Effect Sensing – Difficult integration. – Sensitivity at low load currents. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 28 Diploma Thesis Proposal (Mixed Signal Design): Advanced Current Sensing Method in Automotive Smart Power Technologies Target: Development of an accurate current sensing solution for integrated low-side drivers/switches. Design Targets: › Accuracy: +/- 5% › Current Range: 100 mA – 10 A Main tasks: - Refine the application requirement. - Analyze the state of the art solutions. - Develop a good understanding of the BCD technology possibilities and limitations and choose the best sensing concept. - Circuit concept and design of an integrated current sensing solution for a low side switch in smart power technology. - Lab characterization of the prototype (optional, based on test chip time window). IFX Interface: DI Franz Wachter franz.wachter@infineon.com I am happy to answer to your questions !! 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 29 Example: Physical Design Job description We are strengthening our Physical Design and layout team for automotive power semiconductors in Villach. Therefore we are looking for a student eager to learn how to create physical designs using state of the art chip layout tools, to verify them to ensure correct functionality and to optimize the layout to create highly efficient integrated circuits with minimum chip sizes. In this role you will be integrated into the existing expert team and will build up competence in actual running Projects. 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 30 Infineon ASIC Development Process Phase 4: Verify functionality acc. requirements Idea Realization / Implementation Definition › Involved teams Verification & Validation M6 M7 Maintenance M8 M9 – Project Management – Engineers: Concept, Design, Verification, Product Engineering & Test › Target Delivery Release Engineering Sample Release – Verify functionality and parameters of silicon design against requirements Production Tape out – Debug and prepare test program for volume test (production) Release – Product qualification 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 31 Component verification – the main tasks › Generate verification setup – Lab equipment, evaluation board, verification tools › Verify specified requirements on silicon – As similar as in customer application – As many parameter variations as possible – As automated as possible – On a reduced number of components › Robustness and root cause analysis – Evaluate product margins and safe operating area – Identify design and technology weaknesses › Improve verification methodology – done: e.g. SPI tool, SPI commander, B2B switch, MUX – ongoing: dynamic low current sensing solution – todo: multi channel programmable resistor May 2016 Copyright © Infineon Technologies AG 2016. All rights reserved. 32 Verification methodology – complex example Main µC SoC ECU Thesis 1 Thesis 2 set date Copyright © Infineon Technologies AG 2015. All rights reserved. 33 Diploma Thesis Proposal (SW Design): Automatic Setup Generation for Documentation Contact: Manfred Proell manfred.proell@infineon.com › Problem: complex schematic documentation when using automated setups – Limited equipment resources are connected via relays to component (DUT) pins – Automated relay configuration, but complex schematic when all relays shown › Main objective: simplify the board schematic depending on relay state for documentation – Applicable for lab bench and tester – Schematic shows only relevant connections for each test – Easy re-configuration for other projects › Main tasks: - Understand the documentation process - Analyze the state of the art methods for automated schematic generation - Understanding the possibilities and limitations and choose the best method - Develop a software environment for test individual setup schematics generation depending on the relay state set date Copyright © Infineon Technologies AG 2015. All rights reserved. 34 Test engineering – the main tasks › Generate productive test setup for wafer and component – Probe cards for wafer test, multi site component test › Define Test features on silicon for efficient testing – To save test time, to contact chip internal nodes – To trim relevant parameters, to improve chip reliability › Productive test program development – Implement and verify specified test coverage – Provide tested samples to lab and customer – Analyse statistical test data and stabilize test program – Interface to world-wide production test sites – Optimize test program for volume production – Support product qualification and customer returns › Improve test engineering methodology – ongoing: automated signal spike checker May 2016 Copyright © Infineon Technologies AG 2016. All rights reserved. 35 We are looking for Work Students › For Component Verification Contact: Manfred Proell manfred.proell@infineon.com – Supporting the post silicon verification of the latest Airbag products in the Automotive verification lab. – Automation of verification setups using VB and Matlab › For Test Engineering – Support test development, developing and debugging test hard and software › You might profit from – a team with experience in dealing with students and diploma thesis – your work experience and contacts within Infineon › You are best equipped for this tasks if you – are studying Electrical Engineering – are interest in measurement technique – have programming skills e.g. VBA, C / C++ 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 36 Infineon ASIC Development Process Phase 5: ramp up mass production Idea Realization / Implementation Definition Verification & Validation › Involved teams Maintenance M9 – Project Management M 10 – Engineers: Design, Verification, Product Engineering & Test Delivery Release › Target – Optimize test program to volume ramp up (test time, marginal tests) Ramp Up completed – Production monitoring and Customer return support 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 37 Table of contents 1 About Infineon 2 Automotive product development 3 Career Possibilities 2016-06-08 Copyright © Infineon Technologies AG 2016. All rights reserved. 38 Opportunities for students Industrial placements, mandatory and holiday work placements – full-time during the (half-term) holidays – part-time during term time Diploma/Bachelor‘s/Master‘s thesis, PhD – throughout the year – Infineon provides resources, knowledge, and support Benefits 2016-06-08 – gain experience in an international company – experience daily business – opportunity to gain an insight into interesting projects – first step towards a career at Infineon Copyright © Infineon Technologies AG 2016. All rights reserved. 39 What we offer - career opportunities at Infineon Management Technical Ladder Project Management Employees with experience career PhD, Trainee Program temporary contract Start direct! permanent contract Bachelor‘s, Diploma or Master‘s thesis at Infineon internships 2016-06-08 Graduates Students part-time work at Infineon Copyright © Infineon Technologies AG 2016. All rights reserved. 40 Great Passion, Amazing Ideas, First-Class Skills YOU! Electrical Engineering, Microelectronics Physics Electrical Engineering Power Electronics Mechanical Engineering Mechatronics › › › Chemistry Material Science Bachelor Master Ph.D. Business Administration Law Mathematics 2016-06-08 Industrial Engineering Computer Science Software Engineering Copyright © Infineon Technologies AG 2016. All rights reserved. 41